JP4904737B2 - Ic一体型薄膜振動片の製造方法。 - Google Patents

Ic一体型薄膜振動片の製造方法。 Download PDF

Info

Publication number
JP4904737B2
JP4904737B2 JP2005216876A JP2005216876A JP4904737B2 JP 4904737 B2 JP4904737 B2 JP 4904737B2 JP 2005216876 A JP2005216876 A JP 2005216876A JP 2005216876 A JP2005216876 A JP 2005216876A JP 4904737 B2 JP4904737 B2 JP 4904737B2
Authority
JP
Japan
Prior art keywords
thin film
electrode
zno
sio
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005216876A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007036656A (ja
JP2007036656A5 (enrdf_load_stackoverflow
Inventor
誠 古畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2005216876A priority Critical patent/JP4904737B2/ja
Publication of JP2007036656A publication Critical patent/JP2007036656A/ja
Publication of JP2007036656A5 publication Critical patent/JP2007036656A5/ja
Application granted granted Critical
Publication of JP4904737B2 publication Critical patent/JP4904737B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2005216876A 2005-07-27 2005-07-27 Ic一体型薄膜振動片の製造方法。 Expired - Fee Related JP4904737B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005216876A JP4904737B2 (ja) 2005-07-27 2005-07-27 Ic一体型薄膜振動片の製造方法。

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005216876A JP4904737B2 (ja) 2005-07-27 2005-07-27 Ic一体型薄膜振動片の製造方法。

Publications (3)

Publication Number Publication Date
JP2007036656A JP2007036656A (ja) 2007-02-08
JP2007036656A5 JP2007036656A5 (enrdf_load_stackoverflow) 2008-08-21
JP4904737B2 true JP4904737B2 (ja) 2012-03-28

Family

ID=37795365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005216876A Expired - Fee Related JP4904737B2 (ja) 2005-07-27 2005-07-27 Ic一体型薄膜振動片の製造方法。

Country Status (1)

Country Link
JP (1) JP4904737B2 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105794107B (zh) 2013-12-27 2018-12-25 株式会社村田制作所 弹性波装置以及其制造方法
DE112016002835B4 (de) * 2015-06-25 2023-02-02 Murata Manufacturing Co., Ltd. Vorrichtung für elastische Wellen
DE112016002901B4 (de) 2015-06-25 2021-09-23 Murata Manufacturing Co., Ltd. Vorrichtung für elastische Wellen
JP6432558B2 (ja) * 2015-06-25 2018-12-05 株式会社村田製作所 弾性波装置
JP6468357B2 (ja) * 2015-06-25 2019-02-13 株式会社村田製作所 弾性波装置
CN106841383B (zh) * 2016-12-27 2019-06-18 华中科技大学 一种集成式阻抗负载声表面波气体传感器
CN111066244B (zh) 2017-08-29 2023-03-24 株式会社村田制作所 弹性波装置、高频前端电路以及通信装置
JP7364196B2 (ja) * 2021-09-24 2023-10-18 三安ジャパンテクノロジー株式会社 弾性波デバイス、モジュール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2836375B2 (ja) * 1992-04-28 1998-12-14 日本電気株式会社 半導体弾性表面波複合装置
US5838089A (en) * 1997-02-18 1998-11-17 Kobe Steel Usa Inc. Acoustic wave devices on diamond with an interlayer
KR100316383B1 (ko) * 1998-10-30 2002-02-19 윤덕용 모노리딕직접회로위에박막또는후막단결정압전소자를집적한단일칩라디오구조및그제조방법
JP4385607B2 (ja) * 2003-01-29 2009-12-16 セイコーエプソン株式会社 表面弾性波素子、周波数フィルタ、発振器、電子回路並びに電子機器
JP2004297359A (ja) * 2003-03-26 2004-10-21 Seiko Epson Corp 表面弾性波素子、周波数フィルタ、発振器、電子回路、及び電子機器
JP2004312309A (ja) * 2003-04-04 2004-11-04 Seiko Epson Corp 半導体振動子複合装置、電子デバイスおよび電子機器
JP4428064B2 (ja) * 2004-01-21 2010-03-10 セイコーエプソン株式会社 薄膜弾性表面波デバイス

Also Published As

Publication number Publication date
JP2007036656A (ja) 2007-02-08

Similar Documents

Publication Publication Date Title
US11595019B2 (en) Acoustic wave resonator, filter, and multiplexer
US11677378B2 (en) Elastic wave device
US7331092B2 (en) Method and manufacturing surface acoustic wave device
KR102140089B1 (ko) 탄성파 공진기, 필터 및 멀티플렉서
US6239536B1 (en) Encapsulated thin-film resonator and fabrication method
US9166554B2 (en) Flexural resonator element, resonator, oscillator, and electronic device
EP1249932A2 (en) Method of producing thin-film bulk acoustic wave devices
JP4904737B2 (ja) Ic一体型薄膜振動片の製造方法。
WO2000005812A1 (fr) Oscillateur piezoelectrique et son procede de production
JP2018537888A5 (enrdf_load_stackoverflow)
US11108375B2 (en) Acoustic wave device, method of fabricating the same, filter, and multiplexer
CN119448974A (zh) 一种声表面波谐振器及其制造方法
JP2005117151A (ja) 弾性表面波装置の製造方法及び弾性表面波装置
EP3878097A1 (en) Surface acoustic wave device with phononic crystal
US9159902B2 (en) Resonator
JP2005318366A (ja) 圧電薄膜共振子、フィルタ及び圧電薄膜共振子の製造方法
JP2001144581A (ja) 圧電振動子およびその製造方法
JP7709807B2 (ja) 弾性波共振器、フィルタ、およびマルチプレクサ
CN113615082B (zh) Saw器件及其制造方法
JP7401200B2 (ja) 電子デバイスの製造方法
JPH08181564A (ja) 弾性表面波装置及びその製造方法
JP2020129726A (ja) 弾性波共振器およびその製造方法、フィルタ並びにマルチプレクサ
JP7530149B2 (ja) 弾性波デバイスの製造方法
JP2005020547A (ja) 弾性表面波装置
JP2010183137A (ja) 水晶振動片及びその製造方法、振動子、発振器、電子機器

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20070404

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080707

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080707

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110411

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110419

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110616

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110927

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111124

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111213

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111226

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150120

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees