JP4896250B2 - Metal base circuit board chain forming method and metal base circuit board chain product - Google Patents

Metal base circuit board chain forming method and metal base circuit board chain product Download PDF

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JP4896250B2
JP4896250B2 JP2010115805A JP2010115805A JP4896250B2 JP 4896250 B2 JP4896250 B2 JP 4896250B2 JP 2010115805 A JP2010115805 A JP 2010115805A JP 2010115805 A JP2010115805 A JP 2010115805A JP 4896250 B2 JP4896250 B2 JP 4896250B2
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forming
notch
circuit board
metal
chain product
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JP2011243813A (en
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達也 斎藤
太郎 行政
栄輝 長岡
康伸 大東
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NHK Spring Co Ltd
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NHK Spring Co Ltd
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Priority to JP2010115805A priority Critical patent/JP4896250B2/en
Priority to PCT/JP2011/002745 priority patent/WO2011145336A1/en
Priority to CN201180004766.1A priority patent/CN102726128B/en
Priority to KR1020117031450A priority patent/KR101297296B1/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/44Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/0909Preformed cutting or breaking line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0178Projectile, e.g. for perforating substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

本発明は、LED照明用などの金属ベース回路基板に供される金属ベース回路基板の連鎖品形成方法及び金属ベース回路基板の連鎖品に関する。   The present invention relates to a method for forming a chain product of metal base circuit boards and a chain product of metal base circuit boards used for metal base circuit boards for LED lighting or the like.


従来の金属ベース回路基板の連鎖品として、例えば特許文献1に記載の金属基板材がある。この金属基板材は、特に第4図のように、切断線に沿ってスリットを設けて基部を形成し、この基部に折割り溝を設けたものである。

As a conventional chained product of metal base circuit boards, for example, there is a metal substrate material described in Patent Document 1. In particular, as shown in FIG. 4, this metal substrate material is provided with a slit along the cutting line to form a base, and this base is provided with a split groove.

したがって、折割り溝により各素子基板を手作業により簡単に折割り分離することができる。   Therefore, each element substrate can be easily split and separated manually by the split groove.

この場合、折割り溝を、プレス加工により形成することができる。   In this case, the split groove can be formed by pressing.

しかし、プレスによる折割り溝の形成で余った肉が面方向に移動し、各素子基板間が面方向に伸びることになる。   However, surplus meat moves in the surface direction due to the formation of the split grooves by pressing, and the space between the element substrates extends in the surface direction.

このため、各素子基板にそれぞれ回路パターンが先に形成されている場合は、各回路パターン間の位置寸法がずれることになり、素子の自動的な実装の位置障害等を招くという問題があった。   For this reason, when the circuit pattern is formed on each element substrate in advance, the position dimension between the circuit patterns is shifted, and there is a problem that the position of the automatic mounting of the element is hindered. .

特公平7−77292号公報Japanese Examined Patent Publication No. 7-77292

解決しようとする問題点は、折割り用の構造をプレス加工すると各回路パターン間の位置寸法がずれるといった点である。   The problem to be solved is that if the structure for folding is pressed, the position dimension between the circuit patterns is shifted.

本発明は、折割り用の構造をプレス加工しても、各回路パターン間の位置寸法を維持することを可能とするため、金属基板に絶縁層を介して回路パターンを設定間隔で形成してそれぞれ前記回路パターンを備えた回路基板の連鎖品を形成する連鎖品形成工程と、前記連鎖品を折割り分離することが予定されているライン上にプレス加工により部分的に折割り分離用のノッチを形成するノッチ形成工程と、前記ライン上で前記ノッチを残してスリットを貫通形成するスリット形成工程とを備えたことを金属ベース回路基板の連鎖品形成方法の特徴とする。   In the present invention, even when the structure for folding is pressed, the position dimensions between the circuit patterns can be maintained. A chain product forming step for forming a chain product of circuit boards each having the circuit pattern, and a notch for partial split separation by pressing on a line on which the chain product is scheduled to be split and separated And a slit forming step of forming a slit through the slit while leaving the notch on the line.

また、金属基板に絶縁層を介して回路パターンを設定間隔で形成してそれぞれ前記回路パターンを備えた回路基板を複数連設し、前記金属ベース回路基板を分離することが予定されているライン上にプレス加工により部分的に折割り用のノッチを形成し、前記ライン上に前記ノッチを残して貫通形成したスリットとを備え、前記ノッチの端部に前記スリット形成によるバリ除去部が形成されたことを金属ベース回路基板の連鎖品の特徴とする。   In addition, on a line on which a circuit pattern is formed on a metal substrate through an insulating layer at a set interval, a plurality of circuit substrates each having the circuit pattern are connected, and the metal base circuit substrate is separated. A notch for partly folding is formed by pressing, and a slit formed through the line leaving the notch is formed on the line, and a burr removing portion is formed at the end of the notch by forming the slit. This is a feature of a chain product of metal base circuit boards.

本発明の金属ベース回路基板の連鎖品形成方法は、金属基板に絶縁層を介して回路パターンを設定間隔で形成してそれぞれ前記回路パターンを備えた回路基板の連鎖品を形成する連鎖品形成工程と、前記回路基板を折割り分離することが予定されているライン上にプレス加工により部分的に折割り分離用のノッチを形成するノッチ形成工程と、前記ライン上で前記ノッチを残してスリットを貫通形成するスリット形成工程とを備えた。   In the method for forming a chain product of metal base circuit boards according to the present invention, a chain product forming step of forming a circuit pattern on a metal substrate at a set interval via an insulating layer and forming a chain product of the circuit boards each having the circuit pattern. A notch forming step of partially forming a notch for split separation by press working on a line on which the circuit board is scheduled to be split-separated, and a slit leaving the notch on the line And a slit forming step for penetrating formation.

このため、折割り用のノッチをプレス加工により形成しても、ノッチが部分的であるためノッチ形成により余った肉は、ノッチを囲む一般部に規制されて面方向への移動が抑制され、ノッチの縁部から基板面上へ突出するように盛り上がることになる。   For this reason, even if the notch for splitting is formed by pressing, the notch is partial, so that the surplus meat by the notch formation is restricted to the general part surrounding the notch and the movement in the surface direction is suppressed, It rises so as to protrude from the edge of the notch onto the substrate surface.

したがって、各回路基板間が面方向に伸びることが抑制され、各回路パターン間の位置寸法が維持され、素子の自動的な実装の精度を保持させることができる。   Therefore, it is possible to prevent the circuit boards from extending in the plane direction, maintain the positional dimensions between the circuit patterns, and maintain the accuracy of automatic mounting of the elements.

本発明の金属ベース回路基板の連鎖品は、金属基板に絶縁層を介して回路パターンを設定間隔で形成してそれぞれ前記回路パターンを備えた回路基板を複数連設し、前記回路基板を分離することが予定されているライン上にプレス加工により部分的に折割り用のノッチを形成し、前記ライン上に前記ノッチを残して貫通形成したスリットとを備え、前記ノッチの端部に前記スリット形成によるバリ除去部が形成された。   In the metal base circuit board chain product according to the present invention, a circuit pattern is formed on a metal board through an insulating layer at a set interval, and a plurality of circuit boards each having the circuit pattern are connected in series to separate the circuit boards. Forming a notch for partly splitting by press working on a line that is scheduled to be formed, and a slit formed through the line leaving the notch, and forming the slit at the end of the notch The burr removal part by this was formed.

このため、ノッチのプレス加工によりノッチの端部に出現するバリをスリットの形成を利用して除去しバリ除去部を形成することができる。   For this reason, it is possible to remove the burrs that appear at the end of the notch by press forming the notch by using the formation of the slits, thereby forming the burr removing portion.

したがって、別加工を必要とせずにバリ取りを行わせることができる。   Therefore, deburring can be performed without requiring separate processing.

金属ベース回路基板の連鎖品の平面図である。(実施例1)It is a top view of the chain product of a metal base circuit board. Example 1 図1のII-II線矢視断面図である。(実施例1)FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1. Example 1 ノッチを示す拡大断面図である。(実施例1)It is an expanded sectional view showing a notch. Example 1 図1のIV-IV線矢視断面図である。(実施例1)FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1. Example 1 バリ除去部の断面図である。(実施例1)It is sectional drawing of a burr | flash removal part. Example 1 本発明実施例に係る金属ベース回路基板の連鎖品形成方法の工程図である。(実施例1)It is process drawing of the chain article formation method of the metal base circuit board based on an Example of this invention. Example 1 ノッチ形成工程のプレス加工を示す概略断面図である。(実施例1)It is a schematic sectional drawing which shows the press work of a notch formation process. Example 1 ノッチ形成工程を示す連鎖品の平面図である。(実施例1)It is a top view of the chain article which shows a notch formation process. Example 1 スリット形成工程を示す連鎖品の平面図である。(実施例1)It is a top view of the chain article which shows a slit formation process. Example 1

折割り用の構造をプレス加工しても、各回路パターン間の位置寸法を維持することを可能とするという目的を、折割り用のノッチを先に形成し、その後ノッチを残してスリットを貫通形成することで実現した。   Even if the structure for splitting is pressed, the notch for splitting is formed first, and then the slit is penetrated leaving the notch for the purpose of maintaining the positional dimension between each circuit pattern. Realized by forming.

[金属ベース回路基板の連鎖品]
図1は、金属ベース回路基板の連鎖品の平面図、図2は、図1のII-II線矢視断面図、図3は、ノッチを示す拡大断面図、図4は、図1のIV-IV線矢視断面図、図5は、バリ除去部の断面図である。
[Metal-based circuit board chain]
1 is a plan view of a chained product of metal base circuit boards, FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1, FIG. 3 is an enlarged cross-sectional view showing a notch, and FIG. FIG. 5 is a cross-sectional view of the burr removing portion.

図1、図2のように、金属ベース回路基板の連鎖品1は、金属基板3に絶縁層5を介して回路パターン7が設定間隔で形成され、それぞれ前記回路パターン7を備えた回路基板9が複数、図面では2個連設されている。   As shown in FIG. 1 and FIG. 2, in a chain product 1 of metal base circuit boards, circuit patterns 7 are formed on a metal board 3 with an insulating layer 5 at set intervals, and each circuit board 9 includes the circuit patterns 7. There are a plurality of two in the drawing.

金属基板3は、例えばSECC或いはケイ素鋼板などの鉄製であり、厚みは、0.8mm程度に形成されている。金属基板3は、アルミニウムなどで形成することもできる。   The metal substrate 3 is made of iron such as SECC or silicon steel plate, and has a thickness of about 0.8 mm. The metal substrate 3 can also be formed of aluminum or the like.

絶縁層5は、金属基板3が鉄製の場合、いわゆるガラスエポキシ樹脂であり、強度を保持するガラスクロスにエポキシ樹脂を浸み込ませた形態のものである。絶縁層5は、金属基板3がアルミニウム製の場合、例えばエポキシ樹脂に無機フィラーを混入させたものが用いられる。   When the metal substrate 3 is made of iron, the insulating layer 5 is a so-called glass epoxy resin, and has a form in which an epoxy resin is immersed in a glass cloth that maintains strength. When the metal substrate 3 is made of aluminum, for example, an insulating layer 5 in which an inorganic filler is mixed in an epoxy resin is used.

回路基板9,9を折割り分離することが予定されているライン上には、プレス加工により部分的に折割り用のノッチ11,13が金属基板3の両面に形成されている。ノッチ11,13は、断面がV字形状に形成されたVノッチである。   On the line where the circuit boards 9 and 9 are planned to be split and separated, notches 11 and 13 for splitting are partially formed on both surfaces of the metal board 3 by press working. The notches 11 and 13 are V notches having a V-shaped cross section.

図2、図3のように、ノッチ11,13は、部分的であるためノッチ11,13形成により余った肉は、ノッチ11,13を囲む一般部3aに規制されて面方向への移動が抑制され、ノッチ11,13の縁部から基板3面上へ突出するように盛り上がる。   As shown in FIGS. 2 and 3, the notches 11 and 13 are partial, so that the surplus meat due to the formation of the notches 11 and 13 is restricted by the general portion 3 a surrounding the notches 11 and 13 and moves in the surface direction. Suppressed and raised so as to protrude from the edge of the notches 11 and 13 onto the surface of the substrate 3.

図1、図4のように前記ライン上に前記ノッチ11,13を残して貫通形成したスリット15,17,19が備えられている。ノッチ11,13の前記ライン方向の端部には、前記スリット15,17,19形成によるバリ除去部11a,11b、13a,13bが形成されている。   As shown in FIGS. 1 and 4, slits 15, 17, and 19 are formed on the line so as to pass through the notches 11 and 13. At the end portions of the notches 11 and 13 in the line direction, burr removing portions 11a, 11b, 13a, and 13b are formed by forming the slits 15, 17, and 19.

図5は、バリ除去部を示す断面図であり、図5は、バリ除去部11aを代表して示し、他のバリ除去部11b、13a,13bはバリ除去部11aと同一形状である。この図5のように、バリ除去部11a,11b、13a,13bは、肉の盛り上がり等がスリット15,17,19により除去され、平面からみてアール形状に形成されている。   FIG. 5 is a cross-sectional view showing the burr removing unit. FIG. 5 shows the burr removing unit 11a as a representative, and the other burr removing units 11b, 13a, and 13b have the same shape as the burr removing unit 11a. As shown in FIG. 5, the burr removing portions 11a, 11b, 13a, and 13b are formed in a round shape as viewed from the plane, with the bulge of the meat removed by the slits 15, 17, and 19.

ここで、ノッチ11,13の長さL、厚みtは、折割り可能であれば、その設定は自由である。本実施例において、折り割り易さを考慮すると、金属の剪断強度により決定され、金属基板3が鉄製の場合、ノッチ11,13の長さLの合計は折割り部全体の長さBの10%程度、厚みtは、金属基板3の板厚Tの40%程度、金属基板3がアルミニウムの場合、ノッチ11,13の長さLの合計は折割り部全体の長さBの30%程度、厚みtは、金属基板3の板厚Tの40%程度がよい。   Here, the length L and the thickness t of the notches 11 and 13 can be freely set as long as they can be folded. In this embodiment, considering the ease of folding, it is determined by the shear strength of the metal, and when the metal substrate 3 is made of iron, the total length L of the notches 11 and 13 is 10 of the length B of the entire folded portion. %, The thickness t is about 40% of the thickness T of the metal substrate 3, and when the metal substrate 3 is aluminum, the total length L of the notches 11 and 13 is about 30% of the total length B of the split portion. The thickness t is preferably about 40% of the plate thickness T of the metal substrate 3.

本実施例では、D=22.5mm、L=2.5mm、T=0・8mm、t=0.3mmとしている。その他、ノッチ11,13の開き角αは、特に限定はされないが、本実施例においてα=45度に設定されている。スリット15,17,19の幅Wは、W=3mm、連鎖品1のたて横の寸法Bは、B=50mmとしている。   In this embodiment, D = 22.5 mm, L = 2.5 mm, T = 0.8 mm, and t = 0.3 mm. In addition, the opening angle α of the notches 11 and 13 is not particularly limited, but is set to α = 45 degrees in the present embodiment. The width W of the slits 15, 17, and 19 is W = 3 mm, and the vertical dimension B of the chain product 1 is B = 50 mm.

連鎖品1の回路パターン7,7には、ノッチ11,13を形成した後、自動で素子が実装され、例えばLED照明用の回路として用いることができる。   After the notches 11 and 13 are formed in the circuit patterns 7 and 7 of the chain product 1, elements are automatically mounted and can be used as, for example, a circuit for LED illumination.

各回路基板9の分離は、手作業によりノッチ11,13を折割ることで行うことができる。
[金属ベース回路基板の連鎖品形成方法]
図6は、本発明実施例に係る金属ベース回路基板の連鎖品形成方法の工程図である。
The circuit boards 9 can be separated by manually breaking the notches 11 and 13.
[Metal base circuit board chain product forming method]
FIG. 6 is a process diagram of a method for forming a chain product of metal base circuit boards according to an embodiment of the present invention.

図6のように、金属ベース回路基板の連鎖品形成方法は、連鎖品形成工程S1、ノッチ形成工程S2、スリット形成工程S3を備えている。   As shown in FIG. 6, the metal-based circuit board chain product forming method includes a chain product forming step S1, a notch forming step S2, and a slit forming step S3.

連鎖品形成工程S1は、金属基板3に絶縁層5を介して回路パターン7を設定間隔で連設形成してそれぞれ前記回路パターン7を備えた回路基板9,9の連鎖品1を形成する。   In the chain product forming step S1, circuit patterns 7 are continuously formed on the metal substrate 3 via the insulating layer 5 at set intervals to form the chain products 1 of the circuit boards 9 and 9 each having the circuit pattern 7.

ノッチ形成工程S2は、連鎖品形成工程S1後、回路基板9,9を折割り分離することが予定されているライン上にプレス加工により部分的に折割り用のノッチ11,13を形成する。   In the notch forming step S2, after the chained product forming step S1, the notches 11 and 13 for splitting are partially formed by pressing on a line where the circuit boards 9 and 9 are scheduled to be split and separated.

スリット形成工程S3は、ノッチ形成工程S2後、前記ライン上で前記ノッチ11,13を残してスリット15,17,19を貫通形成する。   In the slit forming step S3, after the notch forming step S2, the slits 15, 17, and 19 are formed through the lines leaving the notches 11 and 13 on the line.

図7は、ノッチ形成工程のプレス加工を示す概略断面図である。   FIG. 7 is a schematic cross-sectional view showing the press working in the notch forming process.

図7のように、プレス加工機21は、一般的なものであり、上金型23及び下金型25からなっている。上金型23は、上ダイセット23a、上ノッチパンチ23b、上プッシュバック23cからなり、下金型25は、下ダイセット25a、下ノッチパンチ25b、下プッシュバック25cからなっている。   As shown in FIG. 7, the press machine 21 is a general machine and includes an upper mold 23 and a lower mold 25. The upper mold 23 includes an upper die set 23a, an upper notch punch 23b, and an upper pushback 23c, and the lower mold 25 includes a lower die set 25a, a lower notch punch 25b, and a lower pushback 25c.

プレス加工に際しては、下金型25に図のように連鎖品1をセットし、上金型23を油圧等で下降させ、上下ノッチパンチ23b、25bにより前記ノッチ11,13を形成する。   In the press working, the chain product 1 is set in the lower die 25 as shown in the figure, the upper die 23 is lowered by hydraulic pressure or the like, and the notches 11 and 13 are formed by the upper and lower notch punches 23b and 25b.

図8は、ノッチ形成工程を示す連鎖品の平面図、図9は、スリット形成工程を示す連鎖品の平面図である。   FIG. 8 is a plan view of the chained product showing the notch forming step, and FIG. 9 is a plan view of the chained product showing the slit forming step.

図8のように、本実施例では、回路基板9,9の連鎖品1が金属基板3に対して3組形成された連鎖品27となっている。   As shown in FIG. 8, in this embodiment, the chain product 1 of the circuit boards 9 and 9 is a chain product 27 formed in three sets on the metal substrate 3.

この連鎖品27に対し、前記ノッチ形成工程S2において図8のノッチ11,13を連鎖品1ごとに順次形成する。   For the chain product 27, the notches 11 and 13 shown in FIG.

その後、スリット形成工程S3により、図9のように、外形29を打ち抜くと同時に前記スリット15,17,19を形成する。   Thereafter, in the slit forming step S3, the slits 15, 17, and 19 are formed at the same time as the outer shape 29 is punched as shown in FIG.

図8、図9において6個の回路基板9を連鎖品とし、6個の回路基板9間にノッチ11,13を形成することもできる。
[実施例の効果]
本発明実施例の金属ベース回路基板の連鎖品形成方法は、金属基板3に絶縁層5を介して回路パターン7を設定間隔で形成してそれぞれ前記回路パターン7を備えた回路基板9の連鎖品1を形成する連鎖品形成工程S1と、前記回路基板9を折割り分離することが予定されているライン上にプレス加工により部分的に折割り分離用のノッチ11,13を形成するノッチ形成工程S2と、前記ライン上で前記ノッチ11,13を残してスリット15,17,19を貫通形成するスリット形成工程S3とを備えた。
In FIG. 8 and FIG. 9, six circuit boards 9 can be a chain product, and notches 11 and 13 can be formed between the six circuit boards 9.
[Effect of Example]
In the method for forming a chained product of metal base circuit boards according to an embodiment of the present invention, a circuit pattern 9 is formed on a metal board 3 through an insulating layer 5 at a set interval, and a chained product of circuit boards 9 each having the circuit pattern 7 is formed. 1 is formed, and a notch forming step for partially forming notches 11 and 13 for split separation on a line where the circuit board 9 is scheduled to be split and separated by press working. S2 and a slit forming step S3 in which slits 15, 17 and 19 are formed through the lines leaving the notches 11 and 13 on the line.

このため、折割り用のノッチ11,13をプレス加工により形成しても、ノッチ11,13が部分的であるためノッチ形成により余った肉は、ノッチ11,13を囲む一般部3aに規制されて面方向への移動が抑制され、ノッチ11,13の縁部から基板3面上へ突出するように盛り上がることになる。   For this reason, even if the notches 11 and 13 for splitting are formed by press working, the notches 11 and 13 are partial, so that the surplus meat due to the notch formation is restricted to the general portion 3a surrounding the notches 11 and 13. Therefore, the movement in the surface direction is suppressed, and the protrusions rise from the edges of the notches 11 and 13 so as to protrude onto the surface of the substrate 3.

したがって、各回路基板9,9間が面方向に伸びることが抑制され、各回路パターン7,7間の位置寸法が維持され、素子の自動的な実装の精度を保持させることができる。   Accordingly, it is possible to suppress the space between the circuit boards 9 and 9 from extending in the plane direction, maintain the position dimension between the circuit patterns 7 and 7, and maintain the accuracy of automatic mounting of the elements.

金属基板3が鉄製であるとき、アルミニウム製等の金属基板と異なり素材に硬度があるため、専用機であるV溝カッターを用いても折割り用の溝をカットするのは容易ではなく、ほとんど形成することができない。金属基板をボルト固定し潤滑油を供給しながらV溝カッターによりV溝を形成すれば加工は可能であるものの、時間とコストがかかり、加工機としても高価な専用機であり、現実的ではない。   When the metal substrate 3 is made of iron, the material has hardness unlike a metal substrate made of aluminum or the like, so it is not easy to cut the groove for splitting even with a V-groove cutter which is a dedicated machine. Cannot be formed. Although it is possible to process by forming a V groove with a V groove cutter while fixing the metal substrate with bolts and supplying lubricating oil, it takes time and cost, and it is an expensive dedicated machine as a processing machine, which is not realistic .

これに対し、ノッチ11,13をプレス加工すれば、金属基板3が鉄製であるときでも、折割り用のVノッチ11,13を簡単に形成することができ、プレス加工機、材料のコストも含めて回路基板9のコスト低減に寄与することができる。   On the other hand, if the notches 11 and 13 are pressed, the V-notches 11 and 13 for folding can be easily formed even when the metal substrate 3 is made of iron. In addition, the cost of the circuit board 9 can be reduced.

本発明実施例の金属ベース回路基板の連鎖品1は、金属基板3に絶縁層5を介して回路パターン7を設定間隔で形成してそれぞれ前記回路パターン7を備えた回路基板9を複数連設し、前記回路基板9を分離することが予定されているライン上にプレス加工により部分的に折割り用のノッチ11,13を形成し、前記ライン上に前記ノッチ11,13を残して貫通形成したスリット15,17,19とを備え、前記ノッチ11,13の端部に前記スリット15,17,19形成によるバリ除去部11a,11b,13a,13bが形成された。   The metal base circuit board chain product 1 according to the embodiment of the present invention has a circuit pattern 7 formed on a metal board 3 through an insulating layer 5 at a set interval, and a plurality of circuit boards 9 each having the circuit pattern 7 are connected in series. Then, the notches 11 and 13 for folding are partially formed by pressing on the line on which the circuit board 9 is scheduled to be separated, and the notches 11 and 13 are left on the line to form a through-hole. The slits 15, 17, and 19 are provided, and burr removal portions 11 a, 11 b, 13 a, and 13 b are formed at the ends of the notches 11 and 13 by forming the slits 15, 17, and 19.

このため、ノッチ11,13のプレス加工によりノッチ11,13の端部に出現するバリをスリット15,17,19の形成を利用して除去しバリ除去部11a,11b,13a,13bを形成することができる。   For this reason, burrs appearing at the ends of the notches 11 and 13 are removed by forming the slits 15, 17, and 19 by pressing the notches 11 and 13 to form burrs removing portions 11 a, 11 b, 13 a, and 13 b. be able to.

したがって、別加工を必要とせずにバリ取りを行わせることができる。   Therefore, deburring can be performed without requiring separate processing.

1 連鎖品
3 金属基板
5 絶縁層
7 回路パターン
9 回路基板
11,13 ノッチ
11a,11b,13a,13b バリ除去部
15,17,19 スリット
S1 連鎖品形成工程
S2 ノッチ形成工程
S3 スリット形成工程
DESCRIPTION OF SYMBOLS 1 Chain product 3 Metal substrate 5 Insulating layer 7 Circuit pattern 9 Circuit board 11, 13 Notch 11a, 11b, 13a, 13b Deburring part 15, 17, 19 Slit S1 Chain product formation process S2 Notch formation process S3 Slit formation process

Claims (4)

金属基板に絶縁層を介して回路パターンを設定間隔で形成してそれぞれ前記回路パターンを備えた回路基板の連鎖品を形成する連鎖品形成工程と、
前記回路基板を折割り分離することが予定されているライン上にプレス加工により部分的に折割り用のノッチを形成するノッチ形成工程と、
前記ライン上で前記ノッチを残してスリットを貫通形成するスリット形成工程と、
を備えたことを特徴とする金属ベース回路基板の連鎖品形成方法。
A chain product forming step of forming a circuit pattern on the metal substrate at a set interval via an insulating layer to form a chain product of circuit boards each having the circuit pattern;
A notch forming step of partially forming a notch for splitting by pressing on a line on which the circuit board is scheduled to be split and separated;
A slit forming step of forming a slit penetrating leaving the notch on the line;
A method for forming a chain product of metal-based circuit boards, comprising:
請求項1記載の金属ベース回路基板の連鎖品形成方法であって、
前記金属基板は、鉄製である、
ことを特徴とする金属ベース回路基板の連鎖品形成方法。
A method for forming a chain product of a metal base circuit board according to claim 1,
The metal substrate is made of iron.
A method for forming a chained product of metal-based circuit boards.
金属基板に絶縁層を介して回路パターンを設定間隔で形成してそれぞれ前記回路パターンを備えた回路基板を複数連設し、
前記回路基板を折割り分離することが予定されているライン上にプレス加工により部分的に折割り用のノッチを形成し、
前記ライン上に前記ノッチを残して貫通形成したスリットとを備え、
前記ノッチの端部に前記スリット形成によるバリ除去部が形成された、
ことを特徴とする金属ベース回路基板の連鎖品。
Forming a circuit pattern at a set interval via an insulating layer on a metal substrate, and providing a plurality of circuit boards each having the circuit pattern,
Forming a notch for partly by pressing on a line on which the circuit board is scheduled to be split and separated,
A slit formed through the line leaving the notch,
The burr removal part by the said slit formation was formed in the edge part of the said notch,
A metal-based circuit board chain product.
請求項3記載の金属ベース回路基板の連鎖品であって、
前記金属基板は、鉄製である、
ことを特徴とする金属ベース回路基板の連鎖品。
A chain product of metal base circuit boards according to claim 3,
The metal substrate is made of iron.
A metal-based circuit board chain product.
JP2010115805A 2010-05-19 2010-05-19 Metal base circuit board chain forming method and metal base circuit board chain product Active JP4896250B2 (en)

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PCT/JP2011/002745 WO2011145336A1 (en) 2010-05-19 2011-05-17 Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards
CN201180004766.1A CN102726128B (en) 2010-05-19 2011-05-17 Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards
KR1020117031450A KR101297296B1 (en) 2010-05-19 2011-05-17 Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards

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