JP4876906B2 - Three-dimensional inter-substrate connection structure and three-dimensional circuit device using the same - Google Patents

Description

  The present invention relates to a three-dimensional inter-substrate connection structure that connects a plurality of circuit boards on which electronic components are mounted, a manufacturing method thereof, and a three-dimensional circuit device using the same.

  Conventionally, as a substrate bonding member (hereinafter referred to as a “three-dimensional inter-substrate connection structure”) for connecting circuit boards on which electronic components such as IC chips and chip components are mounted, there are many plugs and sockets. A pole connection type connector or a pin connector in which a plurality of connection pins are fixed to a resin substrate is used.

  In recent years, with the progress of miniaturization and high functionality of mobile devices and the like, a method for three-dimensional connection between circuit boards has been proposed in order to cope with an increase in the number of connection terminals between circuit boards and a reduction in thickness.

  As an example, it is disclosed that a connection terminal of a circuit board on which electronic components are mounted and a relay circuit board having through holes and having copper foil lands formed at both ends thereof are connected and fixed by soldering ( For example, see Patent Document 1). As a result, a high-density mounting three-dimensional circuit board device can be obtained at low cost.

  Further, it is disclosed that circuit boards are electrically connected via a connection board, and a circuit pattern or an electronic component is mounted on the connection board itself (see, for example, Patent Document 2). According to Patent Document 2, wiring boards parallel to each other are connected via a rectangular plate-like connection board. The connection board has a configuration in which a half-divided end face through hole provided at the position of two opposing end faces connected to the wiring board and a circuit pattern formed on the side face of the connection board connecting between the end face through holes are provided. Have.

On the other hand, in portable information devices and the like, with the increase in the speed and frequency of devices, the requirements for EMC (Electromagnetic Compatibility) such as malfunction due to external electromagnetic waves and interference with other devices due to radiated electromagnetic waves become severe. ing. Therefore, there is a high demand for circuit board mounting technology that can reliably perform electromagnetic shielding. Therefore, even in a three-dimensional board-to-board connection structure that connects multiple circuit boards on which high-frequency components such as control IC chips are mounted, electromagnetic waves from outside and electromagnetic waves radiated from the inside by high-frequency parts are reliably shielded. It is required to do.
JP 2002-76561 A JP 2005-268544 A

  According to Patent Document 1, it is described that circuit boards are connected by solder via a relay circuit board having through holes and copper foil lands formed on both sides. However, there is no disclosure regarding the arrangement and configuration of the connection terminals on the relay circuit board corresponding to improvement in connection strength and high-density mounting.

  Further, according to Patent Document 2, since the connection boards are arranged vertically and the circuit boards are connected via the circuit patterns provided on the side surfaces thereof, circuit formation by circuit patterns and electronic components are arranged on the side surfaces of the connection boards. Implementation is possible. However, since the connection substrate is arranged vertically, it is difficult to thin the three-dimensional circuit device.

  Neither Patent Document 1 nor Patent Document 2 discloses a means for obtaining a good connection state between a circuit board having mechanical deformation such as warpage caused by joining, a relay circuit board, and a connection board. . In addition, no shields against noise and electromagnetic waves are disclosed.

  The present invention has been made in order to solve the above-described problems. A thin three-dimensional inter-substrate connection structure having an electromagnetic shielding function, a manufacturing method thereof, and a three-dimensional object using the same, while reliably connecting circuit boards. An object is to provide a circuit device.

  In order to achieve the above-described object, the three-dimensional inter-substrate connection structure of the present invention includes an outer peripheral portion that connects the first circuit board and the second circuit board, and an inner peripheral portion provided with a recess. A three-dimensional inter-substrate connection structure comprising a frame-shaped housing having a first terminal comprising a through hole penetrating the upper and lower surfaces of the housing and a land connected to a through hole provided on the upper and lower surfaces of the housing An electrode; a second terminal electrode provided in the recess; a shield electrode provided on a side surface of the outer peripheral portion; and a ground electrode formed on the upper and lower surfaces of the housing and connected to the shield electrode.

  Furthermore, the first terminal electrode and the second terminal electrode may be arranged in a staggered pattern on the upper and lower surfaces of the frame-shaped housing. Further, the area of the land is larger than the area of the second terminal electrode on the upper and lower surfaces of the frame-shaped housing. Further, the land area may be larger than the connection terminal area of the first circuit board or the second circuit board.

  According to such a configuration, a narrow pitch can be realized by the first terminal electrode having a through hole and the second terminal electrode provided in the recess. Further, with respect to mechanical deformation such as warping of the circuit board, a high connection strength can be obtained with a land having a large area of the first terminal electrode provided in the vicinity of the outer periphery. In addition, by forming the second terminal electrode in the recess, the electrode area can be increased and the decrease in wiring resistance can be avoided. In addition, it is possible to realize a three-dimensional inter-substrate connection structure excellent in reliability, such as high-speed transmission and prevention of malfunction, by shielding noise from each terminal electrode and radiation of electromagnetic waves to the outside and noise and electromagnetic waves from the outside.

  Furthermore, the area of the second terminal electrode on the upper and lower surfaces of the frame-shaped housing may be smaller than the area of the connection terminal of the first circuit board or the second circuit board.

  According to such a configuration, the connection terminal of the circuit board and the recess of the second terminal electrode form a fillet portion having a large area, and the three-dimensional inter-substrate connection structure and the circuit board can be connected with high connection strength.

  Furthermore, the housing is made of a material having a low coefficient of thermal expansion. The material may be made of a liquid crystal polymer.

  According to such a configuration, it is possible to realize a stable three-dimensional inter-substrate connection structure that is unlikely to be deformed with respect to changes in the manufacturing process and environmental temperature.

  The method for manufacturing a three-dimensional inter-substrate connection structure according to the present invention includes a molding step of molding a frame-shaped housing having an outer peripheral portion and an inner peripheral portion including a recess, and a through-hole penetrating the upper and lower surfaces of the housing. And a first terminal electrode comprising lands connected to through holes provided in the upper and lower surfaces of the housing, a second terminal electrode provided in the recess, a shield electrode provided on the side surface of the outer peripheral portion, and formed on the upper and lower surfaces of the housing. And an electrode forming step of forming a ground electrode connected to the shield electrode. Furthermore, you may form a through-hole in a housing at a shaping | molding process. Furthermore, the electrode forming step may further include a step of forming a through hole in the housing.

  Further, the electrode forming step includes a step of forming a plating layer on the housing, a step of forming a resist pattern of the first terminal electrode, the second terminal electrode, the shield electrode, and the ground electrode on the plating layer, and other than the resist pattern. You may include the process of etching a plating layer, and the process of removing a resist pattern.

  According to such a method, the first terminal electrode having a through hole and the second terminal electrode provided in the concave portion realize a narrow pitch, and in the vicinity of the outer periphery against mechanical deformation such as warping of the circuit board. A three-dimensional inter-substrate connection structure having a high connection strength can be easily produced with a land having a large area of the first terminal electrode provided on the substrate.

  The three-dimensional circuit device of the present invention has a configuration in which at least a first circuit board and a second circuit board are connected via the three-dimensional inter-substrate connection structure. Further, an electronic component may be mounted in a region surrounded by the three-dimensional inter-substrate connection structure on at least one of the first circuit board and the second circuit board.

  According to such a configuration, a plurality of circuit boards can be connected with high connection strength against mechanical deformation such as warpage, and the three-dimensional mounted on each terminal electrode or circuit board. A three-dimensional circuit device capable of electromagnetically shielding electronic components arranged in the inner periphery of the inter-substrate connection structure is obtained.

  According to the present invention, a thin three-dimensional inter-substrate connection structure having a shielding effect and a three-dimensional circuit device using the same is realized while connecting circuit boards with a stable and high connection strength. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1A is a plan view showing the configuration of the three-dimensional inter-substrate connection structure according to the first embodiment of the present invention, and FIG. 1B, FIG. 1C, and FIG. It is the sectional view on the AA line in 1 (A), the BB sectional view, and the CC sectional view.

  As shown in FIG. 1, the three-dimensional inter-substrate connection structure 2 includes a housing 8 made of a frame-shaped liquid crystal polymer having, for example, a rectangular outer peripheral portion 4 and an inner peripheral portion 6. Then, on the side surface of the inner peripheral portion 6 of the frame-shaped housing 8, a concave portion 9 having a semicircular cross section, for example, reaching the upper and lower surfaces and a through hole 22 penetrating the upper and lower surfaces are formed. The second terminal electrode 11 and the through hole 22 are provided with a through hole 21 constituting a part of the first terminal electrode 24.

  Here, the first terminal electrode 24 is formed on the upper surface 14 and the lower surface 16 of the housing 8 with a land 18 made of, for example, a pentagonal upper surface land 18a and a lower surface land 18b. The through hole 21 is formed in the through hole 22 connecting them. The second terminal electrode 11 is formed in a recess 9 formed in the inner peripheral portion 6 of the housing 8 with a plating layer such as copper, and the upper end portion 20 a and the lower end portion 20 b thereof are the upper surface 14 of the housing 8. And exposed on the lower surface 16. At this time, the area of the upper surface land 18 a and the lower surface land 18 b of the first terminal electrode 24 is formed to be larger than the areas of the upper end portion 20 a and the lower end portion 20 b of the second terminal electrode 11. Furthermore, the first terminal electrode 24 and the second terminal electrode 11 are provided on the upper surface 14 and the lower surface 16 of the housing 8 so as to be arranged in a staggered pattern, for example.

  That is, when the upper surface land 18a and the lower surface land 18b having a large connection area are arranged on the outer peripheral portion of the housing 8 where stress is concentrated when the circuit board is deformed, dropped or impacted, the connection strength can be greatly improved. it can. As a result, the three-dimensional inter-substrate connection structure 2 that achieves stable and reliable connection can be obtained. In addition, since the second terminal electrode 11 is formed by the concave portion 9, even if it is formed at a narrow pitch, the width of the electrode can be increased and the wiring resistance can be reduced. For example, if the recess 9 has a semicircular shape, the electrode width can be increased by about 1.57 times the planar width, and as a result, the wiring resistance can be reduced to about 1 / 1.57 (except for the width is the same) Can be reduced. Further, by arranging the first terminal electrode 24 and the second terminal electrode 11 in a staggered pattern on the upper and lower surfaces of the housing 8, a narrow pitch arrangement can be realized, and high-density mounting can be easily handled.

  In addition, a shield electrode 10 is provided on the entire side surface of the outer peripheral portion 4 of the housing 8, and ground electrodes 12 a and 12 b formed at, for example, four corner positions on the upper surface 14 and the lower surface 16 of the housing 8. Connected with. The shield electrode 10 and the ground electrodes 12a and 12b emit radiation such as noise and electromagnetic waves accompanying high-speed signal transmission of the first terminal electrode 24 and the second terminal electrode 11 that connect between circuit boards described below. Can be shielded. Furthermore, malfunctions due to external noise such as electronic components mounted on the circuit board in the region surrounded by the three-dimensional inter-substrate connection structure 2 can be prevented.

  FIG. 2 shows the connection state when connecting to the circuit board via the first terminal electrode 24 and the second terminal electrode 11 of the three-dimensional inter-substrate connection structure 2 in the first embodiment of the present invention. It explains using.

  FIG. 2A shows a state in which the first circuit board 26 and the second circuit board 28 are connected via the three-dimensional inter-substrate connection structure 2 in the first embodiment of the present invention. 2A is a cross-sectional view taken along line EE in FIG. 2A, and FIG. 2B is a cross-sectional view taken along line FF in FIG.

  That is, FIG. 2A shows the connection surface 30 of the first circuit board 26 and the connection terminal 32 of the second circuit board 28, and the upper surface 14 of the first terminal electrode 24 of the three-dimensional inter-substrate connection structure 2. The upper surface land 18a and the lower surface land 18b of the lower surface 16 are aligned and connected using solder. At this time, the area of the upper surface land 18a of the first terminal electrode 24 is formed to be larger than the area of the connection terminal 30 of the first circuit board 26 to form a solder fillet 34, and the connection is made in a wider area. . Similarly, the area of the lower surface land 18b of the first terminal electrode 24 is also made larger than the area of the connection terminal 32 of the second circuit board 28 to form a solder fillet portion 34, which is connected in a wider area. . Further, a fillet portion 36 is formed on the inner surface of the through hole 21 and connected.

  Thereby, the connection strength between the connection terminal 30 of the first circuit board 26 and the upper surface land 18a and the connection strength between the connection terminal 32 of the second circuit board 28 and the lower surface land 18b can be greatly improved.

  2B shows the connection terminal 40 of the first circuit board 26 and the connection terminal 42 of the second circuit board 28, and the upper end portion 20a of the second terminal electrode 11 of the three-dimensional inter-substrate connection structure 2. And the lower end 20b are aligned and connected using solder. At this time, the connection area of the upper end portion 20a and the lower end portion 20b of the second terminal electrode 11 (corresponding to the cross-sectional area of the plating layer here) is smaller than the area of the connection terminals 40 and 42 of each circuit board. However, the solder forms a fillet portion 38 that connects the second terminal electrode 11 formed in the recess 9 of the housing 8 and each connection terminal with a large area.

  Thus, even if the connection area of the second terminal electrode 11 is small, the solder fillet between the connection terminal 40 of the first circuit board 26 and the connection terminal 42 of the second circuit board 28 and the second terminal electrode 11 is achieved. The formation of 38 makes it possible to connect firmly.

  In the above embodiment, the example in which the plated layer is formed in the through hole 21 or the second terminal electrode 11 has been described. However, the present invention is not limited to this. For example, a conductive material such as a conductive resin may be embedded in the through hole 21 or the recess 9.

  In the above embodiment, the connection terminal of the circuit board has been described as being smaller than the area (width in the drawing) of the first terminal electrode 24. However, the present invention is not limited to this. For example, the connection terminal of the circuit board may be larger than the area of the first terminal electrode. Furthermore, the size of the connection terminals formed on the circuit board is not necessarily the same, and is provided in different sizes corresponding to the first terminal electrode 24 and the second terminal electrode 11 of the three-dimensional inter-substrate connection structure 2. May be.

  According to the first embodiment of the present invention, even if stress is applied to the connection part between the three-dimensional inter-board connection structure and the circuit board due to mechanical deformation such as warping, dropping or impact, the circuit board is Connection strength is improved by the first terminal electrode having a large area provided in the vicinity of the outer peripheral portion of the original inter-substrate connection structure, and stable and highly reliable connection is obtained. Further, by forming the second terminal electrode in the recess and further arranging it in a staggered pattern, it is possible to suppress an increase in wiring resistance due to a narrow pitch and realize high-density mounting.

  Here, as the material of the housing 8 of the three-dimensional inter-substrate connection structure 2, it is preferable to use a material that has a small coefficient of thermal expansion and is stable with respect to temperature change, such as a liquid crystal polymer. Further, depending on the environment to be used, for example, an insulating resin such as glass epoxy resin, polyphenylene sulfide, polybutylene terephthalate may be used. Furthermore, when shape accuracy, high heat conductivity, and the like are required, an insulating substrate such as a ceramic substrate may be used.

  The first terminal electrode, the second terminal electrode, the shield electrode, and the ground electrode may be formed of a metal material having a high conductivity such as copper (Cu), silver (Ag), or aluminum (Al). preferable. Furthermore, it is desirable to form a film made of, for example, gold (Au) on these materials. As a result, the stability of the connection and deterioration over time can be prevented, and the reliability can be further improved.

  Hereinafter, a method for manufacturing the three-dimensional inter-substrate connection structure 2 according to the first embodiment of the present invention will be described.

  FIG. 3 is a main process diagram of the method for manufacturing the three-dimensional inter-substrate connection structure 2 according to the first embodiment of the present invention. 3A, 3D, 3G, and 3J are plan views in each manufacturing process of the three-dimensional inter-substrate connection structure 2. FIG. 3B, FIG. 3E, FIG. 3H, and FIG. 3K are cross-sectional views taken along line B-B in each plan view, FIG. 3C, and FIG. 3F. 3 (I) and FIG. 3 (L) are cross-sectional views taken along the line CC. The BB line is the same as the line passing on the upper surface land 18a of the plurality of first terminal electrodes 24 shown in FIG. 1A, and the position of the CC line is the position of one side surface of the inner peripheral portion. Is shown.

  First, as shown in FIGS. 3 (A), 3 (B), and 3 (C), for example, a liquid crystal polymer is molded to form an outer periphery 4 and a plurality of recesses 9 in the thickness direction. A frame-shaped insulating substrate (housing) 44 having the portion 6 is prepared. Further, the plurality of through holes 22 are formed at predetermined positions by, for example, a laser method or a drilling method. The through hole 22 may be formed in the insulating substrate 44 at the same time by molding. Thereby, a process can be further simplified and it can form in a short time.

  Next, as shown in FIGS. 3D, 3E, and 3F, the upper surface, the lower surface, the outer peripheral side surface, the inner peripheral side surface including the concave portion, and the through hole of the insulating substrate 44. Is roughened, and a plating catalyst such as a palladium salt is applied to the whole. Then, a copper plating layer 46 having a predetermined thickness is formed on the insulating substrate 44 using, for example, an electroless copper plating method. Specifically, for example, the insulating substrate 44 is immersed in the following electroless copper plating solution for 2 hours to deposit about 10 μm thick copper, and a copper plating layer 46 is formed on the entire surface. Here, as the electroless copper plating solution, for example, a solution in which a mixed solution of copper sulfate pentahydrate / ethylenediaminetetraacetic acid / polyethylene glycol / l2.2-dibilidyl / formaldehyde is adjusted to PH12.5 with sodium hydroxide is used. Used at a liquid temperature of 70 ° C. It is also effective to combine electroless plating and electrolytic plating, and the copper plating layer 46 can be formed in a short time.

Next, as shown in FIGS. 3 (G), 3 (H), and 3 (I), a resist for etching is applied to the entire surface of the formed copper plating layer 46, and ultraviolet rays are irradiated to give a predetermined value. The exposure process is performed with the pattern. At this time, as a resist for etching, for example, an electrodeposition resist (for example, “Photo EDP-1000” manufactured by Nippon Paint Co., Ltd.) is used, and electrodeposition is performed at 25 ° C. and 50 mA / dm ² for 3 minutes, and approximately 8 μm. Apply to a thickness of. Then, a photomask was attached, and ultraviolet rays (scattered light) were irradiated at about 400 mj / cm ² to expose a predetermined pattern. Thereafter, 1% sodium metasilicate at 32 ° C. is sprayed for 120 seconds using a spray device to develop the resist. As a result, a resist pattern 48 that finally covers the first terminal electrode, the second terminal electrode, the ground electrode, and the shield electrode is obtained.

  Next, as shown in FIG. 3 (J), FIG. 3 (K), and FIG. 3 (L), after forming a resist pattern 48, it is immersed in a 36% solution of ferric chloride at 40 ° C. for 2 to 3 minutes. Then, the copper plating layer 46 is etched. Thereafter, 5% sodium metasilicate at 50 ° C. is sprayed for 120 seconds to remove the resist, thereby forming predetermined first terminal electrode 24, second terminal electrode 11, shield electrode 10, and ground electrodes 12a and 12b.

  By the above process, for example, the housing 8 has a three-dimensional inter-substrate connection structure 2 having a very thin thickness of 10.6 mm, a width of 9 mm, and a thickness of 0.45 mm. Furthermore, for example, the maximum diameter (diameter of a semicircle) of the second terminal electrode 11 is about 75 μm, and the space between the upper surface lands 18a to 18a of the first terminal electrode 24 is about 0.3 mm. The inter-connection structure 2 is produced.

  In the present embodiment, the sectional shape (the upper end portion 20a and the lower end portion 20b) of the concave portion 9 viewed on the plan view is described as an example of a semicircular shape, but is not limited thereto. For example, an arbitrary shape such as a polygon such as a square or a triangle may be used. Further, although the pentagonal shape has been described as an example of the shape of the upper surface land 18a and the lower surface land 18b, it is not limited thereto. For example, as long as it can be arranged in a staggered pattern with the second terminal electrode 11, the shape is not particularly limited and can be an arbitrary shape.

  In the present embodiment, the example in which the first terminal electrode 24, the second terminal electrode 11, the ground electrodes 12a and 12b, the shield electrode 10 and the like are formed at the same time has been described. However, the present invention is not limited to this. May be formed.

  In the present embodiment, an adhesion promoting layer combining, for example, an epoxy resin and a synthetic rubber, a crosslinking agent, a curing agent, and a filler is formed over the entire surface of the insulating substrate 44 and the surface is roughened, and then the plating treatment is performed. May be. Thereby, the adhesion strength of the plating to the surface of the insulating substrate 44 can be improved.

  The surfaces of the first terminal electrode 24, the second terminal electrode 11, the shield electrode 10, and the ground electrodes 12a and 12b are preferably plated with gold (Au). Thereby, the reliability with respect to environmental resistance, such as connection stability and moisture resistance, can be improved.

  In the present embodiment, the first terminal electrode 24, the second terminal electrode 11, the shield electrode 10, and the ground electrodes 12a and 12b are formed using an electroless plating method, a photolithography technique, and an etching technique. However, this is not a limitation. For example, any method that can form a pattern with a predetermined film thickness, such as laser processing, can be applied without particular limitation.

  In addition, although the said manufacturing method demonstrated by the example which forms each electrode with a resist pattern after forming a plating layer, it is not restricted to this. For example, after forming a resist pattern, a plating layer may be formed, and each electrode may be formed by a lift-off method or the like. In this case, the position of the resist pattern is formed so as to cover a region other than each electrode finally obtained.

(Second Embodiment)
The three-dimensional circuit device according to the second embodiment of the present invention will be described below.

  FIG. 4A is a perspective view showing the configuration of the three-dimensional circuit device 50 according to the second embodiment of the present invention, and FIG. 4B is a partially enlarged sectional view of FIG. In the following description, the three-dimensional inter-substrate connection structure 2 described in the first embodiment is used, and the same reference numerals are given to the same elements as those in the first embodiment. Further, in FIG. 4A, for easy understanding, a part of the wiring pattern of the circuit board is omitted, and the three-dimensional inter-substrate connecting structure 2 sandwiched between the circuit boards is shown in a perspective view. ing.

  As shown in FIG. 4, the three-dimensional circuit device 50 has a configuration in which a first circuit board 26 and a second circuit board 28 are connected to face each other with the three-dimensional inter-substrate connection structure 2 interposed therebetween.

  Here, an electronic component 52 made of an IC chip such as a high-frequency circuit is placed on the first circuit board 26 so that the first circuit board 26 fits in the inner peripheral portion 6 of the three-dimensional inter-substrate connection structure 2. The connection terminals (not shown) of the wiring pattern 54 formed in the above are connected with, for example, solder and mounted at predetermined positions.

  And the connection terminal (not shown) of the predetermined | prescribed wiring pattern 56 of the upper surface land 18a of the 1st terminal electrode 24 of the three-dimensional board | substrate connection structure 2, the upper end part 20a of the 2nd terminal electrode 11, and the 2nd circuit board 28. ) Is connected with solder. Similarly, the lower surface land 18b of the first terminal electrode 24 and the lower end portion 20b of the second terminal electrode 11 and the connection terminals (not shown) of the predetermined wiring pattern 54 of the first circuit board 26 are connected by solder or the like. Yes.

  The ground electrodes 12a and 12b provided on the three-dimensional inter-substrate connection structure 2 are connected between the ground wiring patterns 58 and 60 provided on the first circuit board 26 and the second circuit board 28, respectively, and ground potential. Is grounded.

  Furthermore, the ground electrodes 12 a and 12 b are connected to the shield electrode 10 provided in the three-dimensional inter-substrate connection structure 2. This shields each electrode such as the electronic component 52, the first terminal electrode 24, and the second terminal electrode 11 mounted on the circuit board in the region surrounded by the three-dimensional inter-substrate connection structure 2, Noise and radiation of internal noise generated in each electrode and electronic component 52 are efficiently shielded.

  According to the present embodiment, a plurality of circuit boards can be connected via the three-dimensional board-connecting structure 2 with a high connection strength that is unlikely to cause peeling due to mechanical deformation such as warping. Furthermore, it is possible to realize a thin three-dimensional circuit device 50 excellent in reliability that does not cause malfunction due to noise or the like.

  In the present embodiment, the example in which the electronic component 52 is mounted on the first circuit board 26 has been described. However, the present invention is not limited to this. For example, electronic components may be mounted on the second circuit board 28 or both the first circuit board 26 and the second circuit board 28. As a result, a large number of electronic components that require shielding can be mounted.

  In the present embodiment, an example in which two first circuit boards 26 and two second circuit boards 28 are connected via the three-dimensional inter-substrate connection structure 2 has been described. However, the present invention is not limited to this. For example, a plurality of three or more sheets may be connected in multiple stages via the three-dimensional inter-substrate connection structure 2. Thereby, since the electronic component which needs a shield can be shielded independently, electromagnetic wave interference can be prevented beforehand. Further, since a plurality of circuit boards can be separately relayed and connected, it is possible to easily cope with complicated circuit board arrangements. Further, the plurality of three-dimensional inter-substrate connection structures 2 can make the structure of the three-dimensional circuit device 50 easy to improve and handle.

  In each of the above embodiments, the first terminal electrode 24 and the second terminal electrode 11 have been described as being provided over the entire circumference of the housing 8, but the present invention is not limited thereto. For example, when the housing shape is a quadrangle, it may be partially provided such as one side, opposite sides, or three sides.

  The three-dimensional inter-substrate connection structure according to the present invention, the manufacturing method thereof, and the three-dimensional circuit device using the same are useful in technical fields such as portable information devices that are becoming lighter and thinner.

(A) Plan view showing the configuration of the three-dimensional inter-substrate connection structure in the first embodiment of the present invention (B) Cross-sectional view taken along the line A-A in FIG. 1 (A) (C) in FIG. BB sectional view (D) CC sectional view of FIG. 1 (A) (A) EE sectional view taken on the line EE of FIG. 1 (A) which shows the state which connected the 1st circuit board and 2nd circuit board in the same embodiment via the three-dimensional board | substrate connection structure (B) ) Cross-sectional view taken along line FF in FIG. The main process drawing of the manufacturing method of the connection structure between three-dimensional boards in the embodiment (A) Perspective view showing the configuration of the three-dimensional circuit device according to the second embodiment of the present invention (B) Partial enlarged sectional view of FIG. 4 (A)

Explanation of symbols

2 3D inter-substrate connection structure 4 Outer periphery 6 Inner periphery 8 Housing 9 Recess 10 Shield electrode 11 Second terminal electrode 12a, 12b Ground electrode 14 Upper surface 16 Lower surface 18 Land 18a Upper surface land 18b Lower surface land 20a Upper end 20b Lower end portion 21 Through hole 22 Through hole 24 First terminal electrode 26 First circuit substrate 28 Second circuit substrate 30, 32, 40, 42 Connection terminal 34, 36, 38 Fillet portion 44 Insulating substrate 46 Plating layer 48 Resist Pattern 50 Three-dimensional circuit device 52 Electronic component 54, 56 Wiring pattern 58, 60 Ground wiring pattern

Claims (8)

A three-dimensional inter-substrate connection structure comprising a frame-shaped housing having an outer peripheral portion for connecting a first circuit board and a second circuit board and an inner peripheral portion provided with a recess,
The housing is
A first terminal electrode comprising a through hole penetrating the upper and lower surfaces of the housing and a land connected to the through hole provided on the upper and lower surfaces of the housing;
A second terminal electrode provided in the recess;
Also has the least a ground electrode formed on the upper and lower surfaces of the shield electrode provided on a side surface of the outer peripheral portion housing connected to the shield electrode,
The three-dimensional inter-substrate connection structure according to claim 1, wherein an area of the land is larger than an area of the second terminal electrode on the upper and lower surfaces of the frame-shaped housing. A three-dimensional inter-substrate connection structure comprising a frame-shaped housing having an outer peripheral portion for connecting a first circuit board and a second circuit board and an inner peripheral portion provided with a recess,
The housing is
A first terminal electrode comprising a through hole penetrating the upper and lower surfaces of the housing and a land connected to the through hole provided on the upper and lower surfaces of the housing;
A second terminal electrode provided in the recess;
At least a shield electrode provided on a side surface of the outer peripheral portion and a ground electrode formed on the upper and lower surfaces of the housing and connected to the shield electrode ,
3. The three-dimensional inter-substrate connection structure according to claim 1, wherein an area of the land is larger than an area of connection terminals of the first circuit board or the second circuit board. The three-dimensional inter-substrate connection structure according to claim 1 or 2 , wherein the first terminal electrode and the second terminal electrode are arranged in a staggered pattern on the upper and lower surfaces of the frame-shaped housing. Claims 1 to 3, characterized in that the area of the second terminal electrodes on the upper and lower surfaces of the frame-like housing is smaller than the area of the connection terminals of the first circuit board or said second circuit board The three-dimensional inter-substrate connection structure according to any one of the above. The three-dimensional inter-substrate connection structure according to any one of claims 1 to 4 , wherein the housing is made of a material having a low coefficient of thermal expansion. The three-dimensional inter-substrate connection structure according to claim 5 , wherein the material is made of a liquid crystal polymer. A three-dimensional circuit device comprising at least a first circuit board and a second circuit board connected via the three-dimensional inter-substrate connection structure according to any one of claims 1 to 6. . 8. The three-dimensional circuit according to claim 7 , wherein an electronic component is mounted in a region surrounded by the three-dimensional inter-substrate connection structure of at least one of the first circuit board and the second circuit board. apparatus.

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