JP4867821B2 - Flexible substrate holder and method for manufacturing organic electroluminescence panel - Google Patents

Description

  The present invention relates to a rectangular flexible substrate holder and an organic electroluminescence panel (hereinafter also referred to as an organic EL panel) using the holder.

  An organic EL panel is a typical product in which a sheet-like flexible substrate is used and functional layers are sequentially laminated on the flexible substrate.

  The organic EL panel includes an anode layer (cathode layer) including a first electrode (anode or cathode) formed on a substrate, and an organic compound layer (single layer portion or multilayer) containing an organic light emitting material laminated thereon. Part), that is, an organic electroluminescent element (hereinafter also referred to as an organic EL element) having a light emitting layer and a cathode layer (anode layer) including a second electrode (cathode or anode) laminated on the light emitting layer. It has a thin film type structure sealed with a sealing member that seals at least the surface of the organic EL element via a layer. Conventionally, a glass substrate is mainly used as a substrate of an organic EL panel, but a thin and flexible film substrate has been used in order to reduce weight, thickness and cost. Yes.

  The manufacturing process of the organic EL panel includes various processing steps such as substrate cleaning, coating, patterning, and drying, and the substrate is sequentially transported through these steps, and various processing is performed, so that each functional layer is formed on the substrate. A laminated organic EL panel is manufactured.

  In the case of a glass substrate, since the rigidity is large, even if the glass substrate alone is transported and processed, the glass substrate itself can maintain a flat state with the rigidity of the glass substrate, so that the anode layer and the organic compound are stably on the glass substrate. It is possible to stably form a layer and various functional layers such as a cathode layer. However, since the rigidity of the film substrate is low, it is difficult to maintain a flat state due to the rigidity of the film substrate itself. In particular, it becomes difficult to maintain a planar state as the size increases.

  For this reason, if the film substrate alone is transported and processed, bending, bending or wrinkling is likely to occur, and the anode layer, the organic compound layer, and the various functional layers such as the cathode layer are stably stabilized on the film substrate. This makes it difficult to form and contributes to a decrease in production efficiency of stable products.

  As a countermeasure for these, a method for holding a film substrate that prevents the occurrence of bending, bending, wrinkling, or the like has been studied. For example, locking pins are erected on the inner four corners of the holder body formed in the shape of a rectangular frame, while mounting holes are formed in the four corners of the film substrate, and the locking pins are inserted into the mounting holes. A film substrate transporting / holding fixture for fixing a substrate is known (for example, see Patent Document 1).

  However, since the film substrate transport / carrying holder described in Patent Document 1 is a method of locking by the locking pin and the mounting hole of the film substrate, it can be fixed and held relatively easily. There is a risk that the film substrate comes off from the locking pin. In addition, there is a concern about damage to the film substrate due to thermal expansion accompanying the processing.

  As a film substrate transporting / carrying holder, locking pins are erected at the inner four corners of a holder body formed in a rectangular frame shape, while one attachment hole is formed on the film substrate by forming attachment holes at the four corners. Is a reference mounting hole that fits snugly against the locking pin, the reference mounting hole and the diagonal mounting hole are large-diameter mounting holes, and the remaining two mounting holes are oblong mounting holes. There is known a film substrate transporting / holding tool in which a locking pin is inserted into the stopper and is prevented from coming off with a washer (for example, see Patent Document 2).

  However, since the film substrate transport / carrying holder described in Patent Document 2 is a method of locking by the locking pin and the mounting hole of the film substrate, it can be fixed and held relatively easily, but is fixed without looseness. It is difficult. Moreover, the method of fixing using a washer has a concern that the work is complicated and the film substrate is damaged due to the fixing work.

  A film substrate flexure prevention member during cleaning and locking pins are erected at the four corners inside the holder body formed in a rectangular frame shape, while mounting holes are formed at the four corners of the film substrate. 2. Description of the Related Art A film substrate transporting / holding tool that inserts a locking pin into a hole and fixes a film substrate is known (for example, see Patent Document 3).

  However, since the film substrate transport / carrying holder described in Patent Document 3 is a method of locking by the locking pin and the mounting hole of the film substrate, it can be fixed and held relatively easily. There is a risk that the film substrate comes off from the locking pin. In addition, there is a concern about damage due to contact between the film substrate and the deflection preventing member during the cleaning process.

Under such circumstances, the development of a flexible substrate holder that can easily fix and prevent the occurrence of bending, bending or wrinkling of a sheet-like flexible substrate without falling off during processing, and this flexibility Development of the manufacturing method of the organic electroluminescent panel using a board | substrate holder is desired.
JP 2002-11736 A Japanese Patent Laid-Open No. 2002-14310 JP 2002-15983 A

  The present invention has been made in view of the above circumstances, and its purpose is to flexibly prevent the occurrence of bending, bending or wrinkling of a sheet-like flexible substrate without falling off during processing, and to easily fix it. The present invention provides a substrate holder and a method for producing an organic EL panel using the flexible substrate holder.

  The above object of the present invention has been achieved by the following constitutions.

  1. A flexible substrate holder for holding a rectangular flexible substrate in a planar state, the flexible substrate having a mounting hole for the flexible substrate holder, and holding the flexible substrate The tool has a rectangular frame-shaped frame body and a beam portion of a beam structure formed integrally with the frame body in a cantilever manner via a mounting member, and the side of the frame body facing the mounting member A flexible substrate holder having first locking pins inserted into the mounting holes at two corners and second locking pins respectively inserted into the mounting holes at both ends of the beam portion.

  2. 2. The flexible substrate holder according to 1, wherein at least one of the first locking pins is a fixed locking pin.

  3. The second locking pin is a locking pin disposed at both ends of the beam portion. When the beam portion is horizontally pressed toward the both ends in the frame body direction, the beam is bent in the frame body direction and the pressing 3. The flexible substrate holder according to 1 or 2 above, wherein the original shape is restored by releasing the.

  4). 4. The flexible substrate holder according to any one of 1 to 3, wherein the frame is provided with at least one positioning hole.

  5. The first locking pin has an upper diameter larger than a lower diameter, a side wall from the attachment surface toward the upper portion has at least an inclined portion, and an angle formed by the inclined portion and the attachment surface is 45 ° to 45 °. 5. The flexible substrate holder according to any one of 1 to 4, which is 85 °.

  6). When the mounting hole of the flexible substrate is inserted through the first locking pin and the second locking pin and the flexible substrate is fixed to the flexible substrate holder, the tension applied to the flexible substrate is The flexible substrate holder according to any one of 1 to 5 above, which is 10 N / m to 100 N / m.

  7). A manufacturing apparatus having a substrate cleaning step, a first electrode forming step, an organic compound layer forming step, a second electrode forming step, and a sealing layer forming step, wherein at least a first electrode is formed on a sheet-like flexible substrate In the method of manufacturing an organic electroluminescence panel in which an organic compound layer including a light emitting layer, a second electrode, and a sealing layer are sequentially formed, the substrate cleaning step, the first electrode forming step, and the organic compound layer forming step The flexible substrate holder according to any one of 1 to 6 above is used to hold the flexible substrate in at least one step of the second electrode forming step and the sealing layer forming step. And manufacturing the organic electroluminescence panel.

  A flexible substrate holder capable of preventing the occurrence of bending, bending, wrinkling, etc. without dropping a sheet-like flexible substrate during processing, and an organic EL using the flexible substrate holder A panel manufacturing method can be provided, a large-sized sheet-like flexible substrate can be stably held, and a large image display apparatus can be supported.

  Embodiments of the present invention will be described with reference to FIGS. 1 to 14, but the present invention is not limited thereto.

  FIG. 1 is a schematic view showing a state in which a sheet-like flexible substrate is fixed to the flexible substrate holder of the present invention. Fig.1 (a) is a schematic perspective view which shows the state which fixed the sheet-like flexible board | substrate to the flexible board | substrate holder of this invention. FIG. 1B is an enlarged schematic cross-sectional view along AA ′ of FIG.

  In the figure, 1 indicates a flexible substrate holder. The flexible substrate holder 1 includes a rectangular frame body 101 having frame constituent members 101 a to 101 d and a beam portion 102. Reference numeral 2 denotes a sheet-like flexible substrate. The flexible substrate 2 is flexible by inserting attachment holes 2a to 2d opened at four corners into locking pins 104a1, 104a2, 104b1, and 104b2 disposed at the four corners of the flexible substrate holder. The surface of the substrate holder 1 is biased and fixed in a state where tension is applied in the direction of the beam portion 102 (in the direction of the arrow in the figure). Reference numeral 103 denotes a member for attaching the beam portion 102 to the frame body 101.

  Reference numeral 101e denotes a positioning hole disposed in the frame constituent member 101c. Reference numeral 101f denotes a positioning hole disposed in the frame constituent member 101d. There is no particular limitation on the position where the positioning hole is disposed, and for example, the hole may be disposed on the beam portion 102 and the frame constituent member 101b. However, it is preferable to arrange two at positions facing each other from the viewpoint of stability. The positioning hole may be penetrated, or a similar hole may be provided on the opposite surface provided with the positioning hole. This figure has shown the case where it has penetrated.

  For example, the positioning hole 101e (101f) has a supply process 401, a fixing process 402, a cleaning process 403, a first reversing process 404, and a first electrode forming process 405 shown in the manufacturing apparatus 4 shown in FIG. A hole transport layer forming step 406, a light emitting layer forming step 407, an electron injection layer forming step 408, a second electrode forming step 409, a second inversion step 410, a sealant coating step 411, When the flexible substrate holder 1 is mounted on a mounting table, a receiving table or the like and processed on the flexible substrate in the flexible sealing member bonding step 412 and the detaching step 413, the mounting table and the receiving table are received. It is used to fix the flexible substrate holder 1 by inserting positioning pins arranged on a table or the like.

  FIG. 2 is a schematic view of the flexible substrate holder shown in FIG. FIG. 2A is a schematic perspective view of the flexible substrate holder shown in FIG. FIG. 2B is a schematic plan view of the flexible substrate holder shown in FIG.

  In the figure, 1 indicates a flexible substrate holder. The flexible substrate holder 1 includes a rectangular frame body 101 having frame constituent members 101 a to 101 d and a beam portion 102. The beam portion 102 is integrally attached to the central portion of the frame constituting member 101 a via an attachment member 103 attached to the central portion of the beam portion 102.

  The beam part 102 is bent in the direction of the frame body 101 by pressing both ends in the direction of the frame body 101 (the state shown by the dotted line in the figure), and the original state ( The state returns to the state indicated by the solid line in the figure. When the flexible substrate is attached by bending the beam portion 102 as shown in this figure, the beam portions 102 are pressed at both ends in accordance with the positions of the mounting holes provided in the flexible substrate. The position of the second locking pin 104b moves when the beam portion 102 returns to its original position by releasing the pressure after bending and attaching the second locking pin 104b (the first locking pin 104a and the second locking pin). As a result, the flexible substrate is tensioned and fixed to the flexible substrate holder. Further, after the processing is completed, the position of the second locking pin 104b is moved by applying pressure and bending the beam portion 102 (the distance between the first locking pin 104a and the second locking pin 104b is reduced). Thus, since the tension on the flexible substrate is released, the flexible substrate can be easily detached from the flexible substrate holder 1.

  First locking pins 104a are arranged at both ends of the frame constituent member 101b. The first locking pin 104a has a locking pin 104a1 provided at the end of the frame constituent member 101b and a locking pin 104a2 provided at the other end. The first locking pins 104a (the locking pins 104a1 and the locking pins 104a2) are integrally fixed to the frame constituent member 101b.

  Second locking pins 104b are arranged at both ends of the beam portion 102. The second locking pin 104b has a locking pin 104b1 provided at the end of the beam portion 102 and a locking pin 104b2 provided at the other end. The locking pin 104b1 is in a position facing the locking pin 104a1, and the centers of the locking pin 104b1 and the locking pin 104a1 are arranged on the same line. The locking pin 104b2 is at a position facing the locking pin 104a2, and the centers of the locking pin 104b2 and the locking pin 104a2 are arranged on the same line. The second locking pins 104b (the locking pins 104b1 and the locking pins 104b2) are disposed integrally with the beam portion 102, and relatively move as the beam portion 102 moves.

  Reference numeral 105 denotes an opening surrounded by the frame constituent members 101a to 101d. By providing the opening 105, the back surface of the flexible substrate can be easily cleaned, and when the flexible substrate is washed with water, it is effective to accelerate the drying of the back surface side of the flexible substrate.

  The melting point of the frame constituting member constituting the frame 101 is preferably 200 ° C. or higher in consideration of thermal stability and the like in each step.

  The 24-hour water absorption measured according to ASTM D570 of the frame constituent members constituting the frame body 101 is 1% or less in consideration of the influence on the flexible substrate, the suppression of moisture introduction into each process, the suppression of outgas, etc. Preferably there is.

  As for the beam portion, the tension when the flexible substrate is fixed to the flexible substrate holder is 10 N / in consideration of flatness, the retention property of the flexible substrate, damage to the mounting hole of the flexible substrate, etc. It is preferable that it is m-100N / m. A tension | tensile_strength shows the value measured using the Imada Co., Ltd. push pull gauge (digital force gauge ZP series).

  The material used for the flexible substrate holder 1 is not particularly limited as long as it is a material that is not deformed by heat, moisture, or the like, and examples thereof include general-purpose engineering plastics, special engineering plastics, and metals. General-purpose engineering plastics include, for example, polyamide (PA), polyoxymethylene (POM), polycarbonate (PC), modified polyphenylene ether (modified PPE), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), and ultrahigh molecular weight polyethylene. (UHMPE) and the like. Special engineering plastics include polyphenylene sulfide (PPS), polysulfone (PSU), polyethersulfone (PES), polyetheretherketone (PEEK), polyarylate (PAR), olefin vinyl alcohol copolymer (E / V), Polyamideimide (PAI), polyetherimide (PEI), polytetrafluoroethylene (PTFE), etc. are mentioned. Among these materials, a particularly preferable material is polytetrafluoroethylene (PTFE).

  Further, the frame 101, the mounting member 103, the beam portion 102, the first locking pin 104a, and the second locking pin 104b may be made of the same material or different. For example, the frame body 101 and the attachment member 103 may be made of metal such as iron, aluminum, and stainless steel, and the beam portion 102 may be made of general-purpose engineering plastic.

  The flexible substrate holder 1 shown in the figure can be manufactured by a normal injection molding method when the material is general-purpose engineering plastic or special engineering plastic. In the case of metal, it can be manufactured by cutting.

  H indicates the width of the flexible substrate holder 1. The width H is determined in consideration of handleability, protection of a sheet-like flexible substrate, placement of positioning holes, scratches due to back contact of the leaf-like flexible substrate, and the like. The length is preferably 100% to 120% of the length (see FIG. 1).

  I indicates the length of the rectangular frame 101. The length I takes into consideration handling, positioning of positioning holes, protection of a sheet-like flexible substrate, positioning of positioning holes, scratches due to back contact of the leaf-like flexible substrate, etc. The width is preferably 100% to 120% of the width of the sheet-like flexible substrate 2 (see FIG. 1).

  J indicates the width of the rectangular frame 101. The width J takes into account the disposition of the first locking pin 104a, the retention property of the flexible substrate, the damage due to the back surface contact of the sheet-like flexible substrate, the drying property of the sheet-like flexible substrate, The width is preferably 50% to 90% with respect to the width H of the flexible substrate holder 1.

  K indicates the width of the attachment member 103. The width K is preferably as small as possible in consideration of the deformation amount of the beam portion.

  L indicates the length of the attachment member 103. The length L is preferably 100% to 1000% with respect to the length M of the beam portion 102 in consideration of deformation caused by the bending load (tension) of the beam portion.

  M indicates the length of the beam portion 102. The length M is preferably 2% to 10% of the length of the sheet-like flexible substrate 2 (see FIG. 1) in consideration of handleability, bending load of the beam portion, and the like.

  N indicates the width of the beam portion 102. The width N is preferably 10% to 80% with respect to the width H of the flexible substrate holder 1 in consideration of the arrangement of the second locking pins 104b, the bending load of the beam portion, and the like.

  O indicates the length of the opening 105. The length O is 50% to 95% with respect to the width I of the rectangular frame 101 in consideration of damage due to the back surface contact of the sheet-like flexible substrate, drying characteristics of the sheet-like flexible substrate, and the like. It is preferable that

  P indicates the width of the opening 105. The width P is 50% to 90% with respect to the length J of the rectangular frame 101 in consideration of damage due to the back surface contact of the sheet-like flexible substrate, drying of the sheet-like flexible substrate, and the like. It is preferable that

  Q indicates the distance between the center of the locking pin 104a1 and the center of the locking pin 104a2. The distance Q can be appropriately changed depending on the size of the rectangular frame 101. The distance between the center of the locking pin 104b1 and the center of the locking pin 104b2 is also the same as the distance Q.

  R is the intersection of the line connecting the center of the locking pin 104a1 and the center of the locking pin 104b1, the outside of the mounting surface of the locking pin 104a1 to the frame constituent member 101c, and the beam portion 102 of the locking pin 104b1. The distance to the intersection with the outside of the mounting surface is shown. The distance R is the outside of the attachment hole 2a (see FIG. 6) that is a line connecting the center of the attachment hole 2a (see FIG. 6) disposed on the flexible substrate to be attached and the center of the attachment hole 2c (see FIG. 6). Tension to the flexible substrate, damage to the attachment hole of the flexible substrate, and flexibility with respect to the distance Y (see FIG. 6) between the intersection of the substrate and the outside of the attachment hole 2c (see FIG. 6) In consideration of the mounting property of the substrate, the locking stability, etc., it is preferably 100% to 120%. Other reference numerals are the same as those in FIG.

  FIG. 3 is a schematic cross-sectional view along the line BB ′ shown in FIG.

  In the figure, T indicates the height of the beam portion 102. The height T is preferably 1 mm to 20 mm in consideration of bending of the beam portion, rigidity of the holder, deformation due to the bending load (tension) of the beam portion, space saving in each step, positioning in each step, and the like. The heights of the frame constituent members 101a to 101d and the attachment member 103 constituting the frame 101 are also the same as the height T, and the surfaces of the frame constituent members 101a to 101d, the attachment member 103, and the beam portion 102 are the same surface. ing. Other symbols are the same as those in FIG.

  FIG. 4 is an enlarged schematic view of a portion indicated by S in FIG. FIG. 4A is an enlarged schematic perspective view of a portion indicated by S in FIG. FIG. 4B is a schematic cross-sectional view along CC ′ of FIG.

  In the figure, U indicates the diameter of the upper portion 104a11 of the locking pin 104a1, and V indicates the diameter of the lower portion 104a12 attached to the frame body 101. As shown in the figure, the locking pin 104a1 has a diameter of the upper part 104a11 larger than that of the lower part 104a12, and the cross-sectional shape having the side wall 104a13 has the shape of an inverted truncated cone. Since the diameter of the upper part 104a11 and the diameter of the lower part 104a12 of the locking pin 104a1 are appropriately changed depending on the size of the frame body 101, it is difficult to determine uniquely. θ represents an angle formed between the side wall 104a13 of the locking pin 104a1 and the attachment surface of the frame constituent member 101c. The angle θ is preferably 45 ° to 85 ° in consideration of the fixing stability of the flexible substrate, the strength of the locking pins, and the like. An angle shows the value measured using Mitutoyo Corporation projector PJ-A3000.

  W indicates the height of the locking pin 104a1 from the mounting surface of the frame body 101. The height W is preferably 100% to 3000% with respect to the thickness of the flexible substrate 2 (see FIG. 1) in consideration of handleability, locking stability, and the like. Other symbols are the same as those in FIG.

  The other locking pin 104a2, locking pin 104b1, and locking pin 104b2 shown in FIG. 2 have the same shape and dimensions as the locking pin 104a1 shown in this figure.

  FIG. 5 is an enlarged schematic view of another shape of the locking pin shown in FIG. FIG. 5A is an enlarged schematic perspective view of another shape of the locking pin shown in FIG. FIG.5 (b) is a schematic sectional drawing in alignment with DD 'of Fig.5 (a).

  In the figure, U ′ indicates the diameter of the upper part 104 a ′ 11 of the locking pin 104 a ′ 1, and V ′ indicates the diameter of the lower part 104 a ′ 12 attached to the frame body 101. As shown in the figure, the locking pin 104a'1 has a diameter of the upper part 104a'11 larger than that of the lower part 104a'12, the same diameter as that of the upper part 104a'11, and a diameter of the upper part 104a'11. It has the shape which has the inclined side wall 104a'14 in which a diameter becomes smaller gradually than.

  Since the diameter of the upper part 104a′11 and the diameter of the lower part 104a′12 of the locking pin 104a′1 are appropriately changed according to the size of the frame body 101, it is difficult to determine uniquely. θ ′ represents an angle formed between the side wall 104a′14 of the locking pin 104a′1 and the mounting surface of the frame constituent member 101c. The angle θ ′ is preferably 45 ° to 85 ° in consideration of the fixing stability of the flexible substrate, the strength of the locking pins, and the like.

  X ′ indicates the height of the side wall 104a′13. The height X ′ is preferably 5% to 30% with respect to the height W ′ of the locking pin 104a′1 in consideration of the strength of the locking pin.

  W ′ indicates the height of the locking pin 104a′1 from the mounting surface of the frame body 101. The height W ′ is preferably 100% to 3000% with respect to the thickness of the flexible substrate 2 (see FIG. 1) in consideration of handleability, locking stability, and the like.

  The other locking pin 104a2, locking pin 104b1, and locking pin 104b2 shown in FIG. 2 also have the same shape and size as the locking pin 104a′1 shown in this figure. Other symbols are the same as those in FIG.

  4 and 5 show a typical shape of the locking pin according to the present invention. The shape of the locking pin according to the present invention is the same as that of the mounting hole disposed on the flexible substrate shown in FIG. If the side wall of the locking pin that comes into contact has R, there is no particular limitation.

  FIG. 6 is an enlarged schematic view of the flexible substrate shown in FIG. FIG. 6A is an enlarged schematic perspective view of the flexible substrate shown in FIG. FIG. 6B is a schematic plan view of the flexible substrate shown in FIG.

  In the figure, X indicates the diameter of the mounting hole 2b of the flexible substrate 2. The diameter X is equal to the diameter U of the locking pin shown in FIG. 4 and the diameter U ′ of the locking pin shown in FIG. 5. Considering the fixing stability, the cost of the flexible substrate, etc., 110% to 200% is preferable. The other mounting holes 2a, 2c and 2d all have the same diameter as the mounting hole 2b.

  Y indicates the distance between the intersection of the line connecting the center of the attachment hole 2a and the center of the attachment hole 2c with the outside of the attachment hole 2a and the intersection of the outside of the attachment hole 2c.

  The distance Y is the intersection of the line connecting the center of the locking pin 104a1 and the center of the locking pin 104b1 shown in FIG. 2 and the outside of the mounting surface of the locking pin 104a1 on the frame constituent member 101c. With respect to the distance R (see FIG. 2) with the intersection of the mounting surface 104b1 to the beam portion 102 and the outside of the mounting surface, the insertion property of the mounting hole of the flexible substrate, workability, and fixing stability of the flexible substrate In view of the above, it is preferably 80% to 100%. The distance between the center of the other mounting hole 2b and the center of the mounting hole 2d is also the same as the distance Y.

  Z indicates the distance between the center of the mounting hole 2c and the center of the mounting hole 2d. The distance Z is the same as the distance Q (see FIG. 2) between the center of the locking pin 104a1 and the center of the locking pin 104a2 shown in FIG. The distance between the center of the mounting hole 2a and the center of the mounting hole 2b is also the same as the distance Z.

  FIG. 7 is a schematic flow diagram showing the process until the flexible substrate shown in FIG. 6 is attached to the flexible substrate holder shown in FIG.

  In Step 1, the flexible substrate holder 1 having the structure and dimensions shown in FIGS. 1 to 4 and the flexible holes having the attachment holes 2a to 2d arranged at the four corners at the dimensions and attachment positions shown in FIG. A substrate 2 is prepared.

  In Step 2, both ends of the beam 102 are directed toward the frame 101 by pressing both ends of the beam 102 of the flexible substrate holder 1 toward the frame 101 (in the direction of the arrow in the drawing). Will be bent.

  In Step 3, the attachment hole 2a of the flexible substrate 2 is inserted into the engagement pin 104a1 of the frame 101 in the state shown in Step 2, and the attachment hole 2b of the flexible substrate 2 is inserted into the engagement pin 104a2. At this time, since the diameters of the mounting holes 2a and 2b are larger than the diameter of the upper portion of the locking pin, it can be easily inserted. Thereafter, the attachment hole 2c of the flexible substrate 2 is inserted into the locking pin 104b1 of the frame 101, and the attachment hole 2d of the flexible substrate is inserted into the engagement pin 104b2. At this time, since the beam portion 102 is bent, the distance between the first locking pin 104a and the second locking pin 104b is reduced, and the diameters of the mounting holes 2c and 2d are locked. Since it is larger than the diameter of the upper part of the pin, it can be easily inserted.

  In Step 4, the beam part 102 returns to the original position shown in Step 1 by releasing the pressure applied to both ends of the beam part 102 toward the frame body 101 (in the arrow direction in the figure). When the beam portion 102 returns to the original position shown in Step 1, the locking pin 104b1 and the locking pin 104b2 also move so as to return to the original position. At this time, the intersection of the line connecting the center of the locking pin 104a1 and the center of the locking pin 104b1, the outside of the mounting surface of the locking pin 104a1 to the frame constituting member 101c, and the beam portion 102 of the locking pin 104b1. The distance R (see FIG. 2) between the intersection with the outside of the attachment surface to the outside and the outside of the attachment hole 2a of the line connecting the center of the attachment hole 2a of the flexible substrate 2 and the center of the attachment hole 2c Due to the relationship with the distance Y between the intersection and the intersection of the outside of the attachment hole 2c, it is flexible via the attachment hole 2c inserted into the locking pin 104b1 and the attachment hole 2d inserted into the locking pin 104b2. A tension is applied to the substrate. At the same time, the flexible substrate holder 1 as shown in FIG. 1 is biased toward the surface of the frame body 101 by the side walls of the locking pins 104b1, 104b2, 104b1, 104b2. Fixing to is made.

  When the processing is completed and the flexible substrate 2 is removed from the flexible substrate holder 1, as shown in Step 2, the both ends of the beam portion 102 of the flexible substrate holder 1 are directed toward the frame body 101. (In the direction of the arrow in the figure) By applying the pressure, both end portions of the beam portion 102 are bent toward the frame body 101, and the first locking pin 104 a disposed on the frame body 101 and the second portion disposed on the beam portion 102. Since the distance between the locking pins 104b is shortened and the tension applied to the flexible substrate is released, the flexible substrate 2 can be easily detached from the flexible substrate holder 1.

  FIG. 8 is a schematic flowchart showing the steps until the flexible substrate of Step 4 shown in FIG. 7 is fixed to the flexible substrate holder.

  The state shown in (a) will be described. (A) shows that the locking pins 104 a 1 (104 a 2) are inserted into the mounting holes 2 a (2 b) of the flexible substrate 2 in a state where the beam portions are bent by pushing both ends of the beam portion 102. A state where the locking pin 104b1 (104b2) is inserted into the mounting hole 2c (2d) is shown. Since the attachment hole 2a (2b) is larger than the diameter of the upper portion of the locking pin 104a1 (104a2), the attachment hole 2a (2b) is not in contact with the side wall 104a13. Further, since the mounting hole 2c (2d) is also larger than the diameter of the upper portion of the locking pin 104b1 (104b2), it does not come into contact with the side wall 104b13.

  The state shown in (b) will be described. (B) shows an initial state in which the pressure applied to the beam portion 102 is released. By releasing the pressure, the beam portion 102 moves (in the direction of the arrow in the figure) so as to return to the original state. As the beam portion 102 moves, the locking pin 104b1 (104b2) fixed to the beam portion 102 also moves (in the direction of the arrow in the figure). When the locking pin 104b1 (104b2) moves, the outer side of the attachment hole 2c (2d) of the flexible substrate 2 and the outer side wall 104b13 of the locking pin 104b1 (104b2) come into contact with each other. By moving 104b1 (104b2), the flexible substrate 2 also moves (in the direction of the arrow in the figure).

  The state shown in (c) will be described. (C) shows that the flexible substrate 2 is further moved by the movement of the beam portion 102 from the state shown in (b), and the outside of the attachment hole 2a (2b) and the outside of the locking pin 104a1 (104a2). The side wall comes into contact, the movement of the beam portion 102 returning to the original position is stopped, and the flexible substrate 2 is flexible in a state in which tension is applied by the beam portion 102 trying to return to the original position. Fixed to the substrate holder. At this time, since the side walls of the locking pins 104a1 (104a2) and the locking pins 104b1 (104b2) are inclined, the frame 101 is biased along the side walls of the locking pins (see FIG. 1). State shown).

  The movement shown in (a) to (c) is the intersection of the line connecting the center of the locking pin 104a1 and the center of the locking pin 104b1 and the outside of the attachment surface of the locking pin 104a1 to the frame constituent member 101c. And the distance R (see FIG. 2) between the intersection of the locking pin 104b1 and the outside of the attachment surface to the beam portion 102, the center of the attachment hole 2a of the flexible substrate 2, and the center of the attachment hole 2c. This is based on the relationship of the distance Y (see FIG. 6) between the intersection of the connecting line with the outside of the attachment hole 2a and the intersection of the attachment hole 2c with the outside.

  The flexible substrate according to the present invention is not particularly limited, and examples thereof include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane, cellulose diacetate, cellulose triacetate, and cellulose acetate butyrate. , Cellulose acetates such as cellulose acetate propionate (CAP), cellulose acetate phthalate (TAC), cellulose nitrate or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate, norbornene resin , Polymethylpentene, Polyetherketone, Polyimide, Polyethersulfone (PES), Polyphenylene Rufide, polysulfones, polyether imide, polyether ketone imide, polyamide, fluororesin, nylon, polymethyl methacrylate, acrylic or polyarylates, Arton (trade name, manufactured by JSR) or Appel (trade name, manufactured by Mitsui Chemicals) A resin film made of a cycloolefin-based resin or the like can be given.

By using the flexible substrate holder shown in FIGS. 1 to 5 and fixing the sheet-like flexible substrate having the attachment holes shown in FIG. 6, the following effects can be obtained.
1. The sheet-like flexible substrate can be easily attached to and detached from the flexible substrate holder, and stable attachment is possible without the occurrence of bending, bending or wrinkling.
2. The sheet-like flexible substrate can be stably processed without dropping out during the processing.
3. Since the water absorption rate of the frame body is low, there is no influence on the attached flexible substrate even if water treatment is performed, and stable product processing is possible.
4). Since the melting point of the frame body is high, there is no deformation of the frame body due to temperature change or heat treatment in each step, so that the occurrence of bending, bending or wrinkle is prevented, and stable product processing is possible.

  FIG. 9 is a schematic view showing an example of an organic EL panel. FIG. 9A is a schematic perspective view showing an example of the organic EL panel. FIG. 9B is a schematic cross-sectional view taken along the line EE ′ of FIG. FIG. 9C is a schematic cross-sectional view taken along line FF ′ in FIG.

  In the figure, 3 indicates an organic EL panel. The organic EL panel 3 includes an anode (first electrode) 302, a hole transport layer 303, a light emitting layer 304, a cathode buffer layer (electron injection layer) 305, and a cathode (first electrode) in order on a flexible substrate 301. 2 electrodes) 306, an adhesive layer 307, and a sealing member 308. A close-sealing structure is formed by sealing with an adhesive layer 307 except for the ends of the extraction electrode 302a of the anode (first electrode) 302 and the extraction electrode 306a of the cathode (second electrode) 306. A gas barrier film (not shown) may be provided between the anode (first electrode) 302 and the flexible substrate 301.

  The layer configuration of the organic EL panel shown in this figure is an example, but as another typical organic EL panel between the anode (first electrode) and the cathode (second electrode), The following configurations are listed.

(1) Anode (first electrode) / organic layer (light emitting layer) / cathode (second electrode)
(2) Anode (first electrode) / organic layer (light emitting layer) / electron transport layer / cathode (second electrode)
(3) Anode (first electrode) / hole transport layer / organic layer (light emitting layer) / hole blocking layer / electron transport layer / cathode (second electrode)
(4) Anode (first electrode) / hole transport layer (hole injection layer) / organic layer (light emitting layer) / hole blocking layer / electron transport layer / cathode buffer layer (electron injection layer) / cathode (second electrode)
(5) Anode (first electrode) / anode buffer layer (hole injection layer) / hole transport layer / organic layer (light emitting layer) / hole blocking layer / electron transport layer / cathode buffer layer (electron injection layer) / Cathode (second electrode)
Each layer constituting the organic EL panel will be described later.

  FIG. 10 is a schematic diagram of a method for manufacturing the organic EL panel shown in FIG.

  In the figure, 4 indicates a manufacturing apparatus. The manufacturing apparatus 4 includes a supply process 401, a fixing process 402, a cleaning process 403, a first inversion process 404, a first electrode forming process 405, a hole transport layer forming process 406, and a light emitting layer forming process 407. , Electron injection layer forming step 408, second electrode forming step 409, second inversion step 410, sealing agent coating step 411, flexible sealing member bonding step 412, desorption step 413, It has a punching / cutting / collecting step 414, a first transfer robot 5a, and a second transfer robot 5b.

  In the supplying process 401, the sheet-like flexible substrate 301 (see FIG. 9) is supplied to the process. In the fixing step 402, the sheet-like flexible substrate 301 is fixed to the flexible substrate holder 1 (see FIG. 2) in the state shown in FIG. The cleaning step 403 includes a water-washing step 403a, a drying step 403b, and a surface treatment step 403c. The sheet-like flexible substrate 301 is fixed to the flexible substrate holder 1 (see FIG. 2). Cleaning for facilitating formation of the first electrode phase on the surface is performed. In the first inversion step 404, the flexible substrate holder 1 (see FIG. 2) to which the sheet-like flexible substrate 301 is attached is inverted to turn the sheet-like flexible substrate 301 downward. . In the first electrode forming step 405, the first electrode is formed on the sheet-like flexible substrate 301 fixed to the flexible substrate holder 1 (see FIG. 2). In the hole transport layer forming step 406, a hole transport layer is formed on the first electrode. In the light emitting layer forming step 407, a light emitting layer is formed on the hole transport layer. In the electron injection layer forming step 408, an electron injection layer is formed on the light emitting layer. In the second electrode formation step 409, the second electrode is formed on the electron injection layer. In the second reversing step 410, the flexible substrate holder to which the sheet-like flexible substrate on which the second electrode is formed is attached is reversed so that the second electrode surface side faces upward.

  In the sealing agent coating step 411, the sealing agent is applied to the single-wafer flexible substrate on which the second electrode is formed. In the flexible sealing member bonding step 412, the flexible sealing member is bonded to the region where the sealing agent is applied. As the flexible sealing member, a sheet-like flexible sealing member is used according to the size of the sheet-like flexible substrate 301 (see FIG. 9). In the detaching step 413, the organic EL panel to which the flexible sealing member is bonded is removed from the flexible substrate holder. In the punching / cutting / recovering step 414, unnecessary portions of the bonded flexible sealing member are punched / cut / removed, and the organic EL panel is recovered.

  The first transfer robot 5a includes a main body 501, an arm 502 having a shaft 502a that moves back and forth (in the direction of the arrow in the drawing), and a receiver 502b that has two claws attached to the tip of the shaft 502a. Have. The main body 501 is arranged to be rotatable in the clockwise direction (the arrow direction in the figure), and can move the material between the steps. The second transfer robot 5b has the same configuration and the same function as the first transfer robot 5a.

  In the supply process 401, a sheet-like flexible substrate is prepared so that it can be taken out, and is taken out one by one by the first transport robot 5a and transported to the fixing process 402 of the next process.

  The fixing step 402 includes a flexible substrate holder 1 (see FIG. 2) and a fixing device (not shown) to the flexible substrate holder 1 (see FIG. 2). The sheet-like flexible substrate sent from the supply process 401 by the first transfer robot 5a is attached and fixed to the flexible substrate holder 1 (see FIG. 2) according to Step 1 to Step 4 shown in FIG. . The sheet-like flexible substrate 301 may be fixed to the flexible substrate holder 1 (see FIG. 2) manually or by a mounting device (not shown). After the sheet-like flexible substrate 301 is fixed to the flexible substrate holder 1 (see FIG. 2), the sheet-like flexible substrate 301 is taken out by the first transfer robot 5a with the sheet-like flexible substrate facing upward. Then, it is conveyed to the water washing step 403a of the washing step 403.

  The rinsing process 403 a includes a rinsing apparatus 403 a 1 for rinsing the surface of the sheet-like flexible substrate 301 supplied from the fixing process 402. The washing device 403a1 may be a shower or a washing tank having an ultrasonic device. After the water washing process is completed, the sheet is taken out by the first transfer robot 5a with the sheet-like flexible substrate facing upward and transferred to the drying step 403b. The drying step 403b includes a drying air blowing device 403b1, and the sheet-like flexible substrate 301 fixed to the flexible substrate holder 1 (see FIG. 2) is dried. After the drying is finished, the sheet is taken out by the first transfer robot 5a with the sheet-like flexible substrate facing up and transferred to the surface treatment step 403c. In the surface treatment process 403c, before the first electrode is deposited on the surface of the sheet-like flexible substrate 301 conveyed from the drying process 403b, the surface of the sheet-like flexible substrate 301 is improved in order to improve the deposition property. Has a surface treatment device 403c1 for cleaning.

Examples of the surface treatment apparatus 403c1 include a low-pressure mercury lamp, an excimer lamp, and a plasma cleaning apparatus. As conditions for the cleaning surface modification treatment using a low-pressure mercury lamp, for example, a cleaning surface modification treatment is performed by irradiating a low-pressure mercury lamp with a wavelength of 184.2 nm at an irradiation intensity of 5 to ²⁰ mW / cm ² and a distance of 5 to 15 mm. Conditions are mentioned. For example, atmospheric pressure plasma is preferably used as the condition for the cleaning surface modification treatment by the plasma cleaning apparatus. Examples of the cleaning condition include conditions in which a gas containing oxygen of 1 to 5% by volume is used for argon gas, and the cleaning surface modification treatment is performed at a frequency of 100 kHz to 150 MHz, a voltage of 10 V to 10 kV, and an irradiation distance of 5 to 20 mm. Of the washing process 403 shown in this figure, the water washing process 403a and the drying process 403b may be omitted in some cases.

  After the cleaning of the sheet-like flexible substrate 301 is completed, the sheet-like flexible substrate 301 is taken out by the first transfer robot 5a with the sheet-like flexible substrate 301 facing upward, and is transferred to the first reversing step 404.

  In the first reversing step 404, the reversing device 6 (see FIG. 12) is temporarily received from the first transfer robot 5a with the sheet-like flexible substrate facing upward, and the reversing device 6 (see FIG. 11). The flexible substrate holder 1 to which the sheet-like flexible substrate is fixed is fixed so as not to drop off. Thereafter, the reversing device 6 (see FIG. 12) is rotated 180 ° so that the sheet-like flexible substrate faces downward. After the reversal operation is completed, the sheet is taken out by the first transfer robot 5a with the sheet-like flexible substrate facing down and transferred to the first electrode forming step 405. The removal by the first transfer robot 5a is performed in a state where the two claws of the receiving member 502b are not in contact with the sheet-like flexible substrate.

  The first electrode forming step 405 includes a vapor deposition apparatus 405a having an evaporation source container 405b, and forms a first electrode on a sheet-like flexible substrate 301 under a reduced pressure condition. A flexible substrate which is received by the receiving device (see FIG. 13) in the vapor deposition apparatus 405a from the first transfer robot 5a with the sheet-like flexible substrate facing down, and the sheet-like flexible substrate is fixed. Fix the holder 1 so that it does not fall off. Then, it moves to a vapor deposition position and vapor deposition is performed. After the first electrode is formed, the receiving device (see FIG. 13) is moved, the fixation is released, and the sheet is taken out by the first transfer robot 5a with the sheet-like flexible substrate facing downward. It is conveyed to the hole transport layer forming step 406. The removal by the first transfer robot 5a is performed in a state where the two claws of the receiving member 502b are not in contact with the sheet-like flexible substrate.

  The hole transport layer forming step 406 includes a vapor deposition apparatus 406a having an evaporation source container 406b, and is a part of an external electrode of the first electrode formed on the sheet-like flexible substrate 301 under reduced pressure conditions. A hole transport layer is formed in the region of the first electrode except for. A flexible substrate which is received by the receiving device (see FIG. 13) in the vapor deposition apparatus 406a from the first transfer robot 5a with the sheet-like flexible substrate facing down, and the sheet-like flexible substrate is fixed. Fix the holder 1 so that it does not fall off. Then, it moves to a vapor deposition position and vapor deposition is performed. After the hole transport layer is formed, the receiving device (see FIG. 13) is moved, the fixation is released, and the single wafer robot 5a is taken out by the first transfer robot 5a with the sheet-like flexible substrate facing down, It is conveyed to the light emitting layer forming step 407. The removal by the first transfer robot 5a is performed in a state where the two claws of the receiving member 502b are not in contact with the sheet-like flexible substrate.

  The light emitting layer forming step 407 includes a vapor deposition device 407a having an evaporation source container 407b, and forms a light emitting layer on the hole transport layer formed on the sheet-like flexible substrate 301 under reduced pressure conditions. It has become. A flexible substrate which is received by the receiving device (see FIG. 13) in the vapor deposition apparatus 407a from the first transfer robot 5a with the sheet-like flexible substrate facing down, and the sheet-like flexible substrate is fixed. Fix the holder 1 so that it does not fall off. Then, it moves to a vapor deposition position and vapor deposition is performed. After the light emitting layer is formed, the receiving device (see FIG. 13) is moved, the fixation is released, and it is taken out by the first transfer robot 5a with the sheet-like flexible substrate facing downward, and the electron injection It is conveyed to the layer forming step 408. The removal by the first transfer robot 5a is performed in a state where the two claws of the receiving member 502b are not in contact with the sheet-like flexible substrate.

  The electron injection layer forming step 408 includes a vapor deposition device 408a having an evaporation source container 408b, and forms an electron injection layer on the light emitting layer formed on the sheet-like flexible substrate 301 under reduced pressure conditions. It has become. The sheet-like flexible substrate may be received by the receiving device (see FIG. 13) in the vapor deposition apparatus (not shown) from the first transfer robot 5a with the sheet-like flexible substrate facing down. The flexible substrate holder 1 is fixed so as not to drop off. Then, it moves to a vapor deposition position and vapor deposition is performed. After the electron injection layer is formed, the receiving device (see FIG. 13) is moved, the fixation is released, and the sheet is taken out by the first transfer robot 5a with the sheet-like flexible substrate facing downward. It is conveyed to the two-electrode forming step 409. The removal by the first transfer robot 5a is performed in a state where the two claws of the receiving member 502b are not in contact with the sheet-like flexible substrate.

  The second electrode forming step 409 includes a vapor deposition apparatus 409a having an evaporation source container 409b, and is orthogonal to the first electrode on the electron injection layer formed on the single wafer-like flexible substrate 301 under reduced pressure conditions. In this manner, the second electrode is formed. A flexible substrate in which the sheet-like flexible substrate is received by the receiving device (see FIG. 13) in the vapor deposition apparatus 409a from the first transfer robot 5a with the sheet-like flexible substrate facing down. Fix the holder 1 so that it does not fall off. Then, it moves to a vapor deposition position and vapor deposition is performed. After the second electrode is formed, the receiving device (see FIG. 13) is moved, the fixation is released, and the sheet is taken out by the first transfer robot 5a with the sheet-like flexible substrate facing downward. It is conveyed to the 2 inversion process 410. The removal by the first transfer robot 5a is performed in a state where the two claws of the receiving member 502b are not in contact with the sheet-like flexible substrate.

  In the second reversing step 410, the sheet-like flexible substrate is received by the reversing device (see FIG. 12) from the first transfer robot 5a with the sheet-like flexible substrate facing down, and the reversing device (see FIG. 12) receives the sheet. The flexible substrate holder 1 to which the leaf-like flexible substrate is fixed is fixed so as not to drop off. Thereafter, the reversing device (see FIG. 12) is rotated by 180 ° so that the sheet-like flexible substrate faces upward. After the reversal operation is completed, the sheet is taken out by the second transfer robot 5b with the sheet-like flexible substrate facing upward and transferred to the sealant coating step 411. The removal by the second transfer robot 5b is performed in a state where the two claws of the receiving member 502b do not contact the sheet-like flexible substrate.

  The sealing agent coating step 411 is a sealing agent on the light emitting region of the at least one organic EL element formed by sequentially laminating the first electrode to the second electrode on the sheet-like flexible substrate 301 or around the light emitting region. And a mounting table 411b on which a flexible substrate holder 1 (see FIG. 2) on which a sheet-like flexible substrate 301 is fixed is mounted. The sheet-like flexible substrate is received on the mounting table 411b from the second transfer robot 5b with the sheet-like flexible substrate facing upward, and the flexible substrate holder 1 to which the sheet-like flexible substrate is fixed is fixed so as not to drop off. To do. The flexible substrate holder 1 is fixed by a positioning hole provided in a frame component of the flexible substrate holder 1 and a fixing pin (not shown) provided on the mounting table 411b. It is done by combining.

  Thereafter, after the sealant is applied by the sealant application device 411a, the sheet is taken out by the second transfer robot 5b with the sheet-like flexible substrate facing upward, and the flexible sealing member bonding step 412 is performed. It is conveyed to. The removal by the second transfer robot 5b is performed in a state where the flexible substrate holder 1 is placed on the two claws of the receiver 502b.

  The flexible sealing member bonding step 412 is a stacking device (not shown) that stacks the sheet-like flexible sealing member supplied from a supply device (not shown) on the surface on which the sealing agent is applied. ) And a flexible sealing member laminating device 412a for laminating stacked sheet-like flexible sealing members. Moreover, it is preferable to have a curing processing apparatus (not shown) for curing the sealant, and it is preferable to arrange a curing processing unit (not shown) before the cutting process or after the cutting process as necessary. The curing method of the curing treatment unit can be appropriately selected according to the type of sealant used (for example, a thermosetting sealant, an ultraviolet curable sealant, etc.). An organic EL panel having the layer configuration shown in FIG. 8 is completed by laminating the sheet-like flexible sealing member.

  The sheet-like flexible substrate is received on the stacking device (not shown) from the second transfer robot 5b with the sheet-like flexible substrate facing upward, and the flexible substrate holder 1 to which the sheet-like flexible substrate is fixed is dropped. Fix it so that it does not. The flexible substrate holder 1 is fixed by a positioning hole provided in a frame constituting member of the flexible substrate holder 1 and a fixing pin provided on a stacking device (not shown). (Not shown). The laminating method can be made by using various generally known methods such as a wet laminating method, a dry laminating method, a hot melt laminating method, an extrusion laminating method, and a thermal laminating method.

  Then, a flexible sealing member is bonded by the flexible sealing member bonding apparatus 412a. Thereafter, the sheet is taken out by the second transfer robot 5b with the sheet-like flexible substrate facing upward and transferred to the detaching step 413. The removal by the second transfer robot 5b is performed in a state where the flexible substrate holder 1 is placed on the two claws of the receiver 502b.

  The detaching step 413 is a step of detaching the organic EL panel held by the flexible substrate holder from the flexible substrate holder. The detachment is performed by positioning the flexible substrate holder 1 on the frame constituting member of the flexible substrate holder 1 and a fixing pin disposed on a mounting table (not shown). After fixing by combining (not shown), the beam portion of the flexible substrate holder can be easily pressed and bent in the direction of the frame. Desorption may be performed manually or by a desorption device (not shown). The detached organic EL panel is taken out by the second transfer robot 5 b and transferred to the punching / cutting / collecting step 414. The flexible substrate holder from which the organic EL panel is detached is taken out by the second transfer robot 5b and temporarily stored in a storage location.

  In the punching / cutting / collecting step 414, an unnecessary portion of the bonded sheet-like flexible sealing member is removed by the punching / cutting device 414a, and the organic EL panel is recovered.

  The organic EL panel is fixed (for example, suction method) from the second transfer robot 5b with the flexible sealing member side up, and punched into the cut 414a. Thereafter, unnecessary portions of the flexible sealing member are punched out by the punching and cutting device 414a, and the organic EL panel is recovered. The transport by the second transport robot 5b is performed in a state where the flexible substrate side is held by the two claws of the receiver 502b.

  The vapor deposition apparatus shown in the figure is not particularly limited, for example, sputtering method, reactive sputtering method, molecular beam epitaxy method, cluster ion beam method, ion plating method, plasma polymerization method, atmospheric pressure plasma polymerization method, A plasma CVD method, a laser CVD method, a thermal CVD method, a coating method, or the like can be used, and can be selected and used as necessary.

  FIG. 11 is a schematic perspective view of the supplying step shown in FIG.

  In the figure, reference numeral 401a denotes a supply box for the sheet-like flexible substrate 301. The inside of the supply box 401a is divided by a plurality of shelves, and the flexible substrate 301 is stored for each stage. The arm 502 of the first transfer robot 5a can move in the front-rear direction (arrow direction in the figure) and in the vertical direction (arrow direction in the figure). The flexible substrate 301 is taken out by inserting a holder 502b having two claws attached to the tip of the shaft 502a of the arm 502 of the first transfer robot 5a between the shelves and then moving the arm 502 upward. By moving, the flexible substrate 301 is placed on the receiving member 502b. Thereafter, the removal of the flexible substrate 301 from the supply box 401a is completed by moving the arm 502 to the main body 501 side. Thereafter, the main body 501 is rotated, and the flexible substrate 301 can be transferred to the fixing step 402 (see FIG. 10) by operating the arm 502.

  FIG. 12 is a schematic perspective view of the reversing device in the first reversing step shown in FIG.

  In the figure, reference numeral 6 denotes a reversing device of the first reversing step 404 shown in FIG. The reversing device 6 has a fixed part 601 and a drive part 602. The fixed portion 601 includes a fixed member 601a having a moving plate 601a1 and a receiving plate 601a2, and a fixing member 601b having a moving plate 601b1 and a receiving plate 601b2. Reference numeral 601a3 denotes a cylinder that moves the moving plate 601a1 in the vertical direction (the arrow direction in the drawing). Reference numeral 601b3 denotes a cylinder for moving the moving plate 601b1 in the vertical direction (the arrow direction in the figure). The cylinder 601a3 (601b3) is disposed in the reversing device by the attachment member 601c, and the cylinder 601a3 (601b3) is driven to move the moving plate 601a1 (601b1) downward (in the direction of the arrow in the figure). The flexible substrate holder 1 placed on the plate 601a2 (601b2) is fixed. Reference numeral 602a denotes a motor, which is connected to a fixed portion 601 via a rotation shaft 602b, and can rotate the fixed portion 601 (in the direction of the arrow in the figure).

  Reference numeral 601a4 denotes a positioning pin disposed on the receiving plate 601a2. Reference numeral 601b4 denotes a positioning pin disposed on the receiving plate 601b2. When the flexible substrate holder 1 is placed on the receiving plate 601a2 and the receiving plate 601b2, the positioning hole 101f (see FIG. 1) disposed in the frame component of the flexible substrate holder 1 is positioned. The position of the positioning pin 601a4 can be determined by combining the positioning hole 101e (see FIG. 1) and the positioning pin 601a4. The operation using the reversing device 6 shown in this figure is as follows.

  In Step 1, the flexible material that is transported from the cleaning step 403 (see FIG. 10) while being placed on the receiver 502 b of the first transport robot 5 a (see FIG. 10, the main body is omitted in this figure). The flexible substrate 301 fixed to the flexible substrate holder 1 is placed on the receiving plate 601a2 and the receiving plate 601b2 by operating the arm 502 of the first transfer robot 5a (see FIG. 10). The positioning hole 101f (see FIG. 1) and the positioning pin 601a4 disposed on the frame component member are combined with the positioning hole 101e (see FIG. 1) and the positioning pin 601a4. Placed. After mounting, the arm 502 moves backward (in the direction of the arrow in the figure) and stands by.

  In Step 2, the movable plate 601a1 (601b1) is moved downward (in the direction of the arrow in the figure) by driving the cylinder 601a3 (601b3), and the flexible substrate holder 1 placed on the receiving plate 601a2 (601b2) is moved. Hold and fix. In this state, the flexible substrate 301 is in an upward state.

  In Step 3, the motor 602a is driven to rotate the fixing portion 601 by 180 degrees so that the flexible substrate 301 is in a downward state. Thereafter, the clamping is released by driving the cylinder 601a3 (601b3). In this state, the flexible substrate holder 1 is placed on the movable plate 601a1 (601b1) with the flexible substrate 301 facing downward.

  In Step 4, by operating the arm 502 of the first transfer robot 5a (see FIG. 10), the flexible substrate holder 1 with the flexible substrate 301 facing down is placed on the receiving member 502b and taken out from the reversing device. Thereafter, the flexible substrate holder 1 is transported to the first electrode forming step 405 by the first transport robot 5a (see FIG. 10). Note that the second reversing step 410 shown in FIG.

  FIG. 13 is a schematic perspective view of the receiving device of the vapor deposition apparatus in the first electrode forming step shown in FIG. In addition, since this figure shows a receiving device, all other members used for vapor deposition, such as a vacuum device of a vapor deposition device, a heating container, and a vapor deposition mask, are omitted.

  In the figure, reference numeral 7 denotes a receiving device disposed in the vapor deposition device 405a in the first electrode forming step 405 shown in FIG. The receiving device 7 includes a placement plate 701a, a position restriction plate 701b, and a drive device 701c.

  The mounting plate 701 a includes a first mounting plate 701 a 1 and a second mounting plate 701 a 2 in order to avoid contact with the flexible substrate 301 fixed to the flexible substrate holder 1. Reference numeral 701a3 denotes a positioning pin disposed on the second mounting plate 701a2. Positioning pins 701a4 (see FIG. 14) are also arranged on the first placement plate 701a1 at positions facing the positioning pins 701a3. The flexible substrate holder 1 with the flexible substrate 301 fixed on the mounting plate 701a is placed on the frame constituent member of the flexible substrate holder 1 with the flexible substrate 301 side facing downward. The positioning hole 101f and the positioning pin 701a3 are placed together with the positioning hole 101e and the positioning pin 601a4 (see FIG. 14).

  The position restricting plate 701b is aligned with the first placement plate 701a1, and is aligned with the first position restricting plate 701b1 fixed to the upper portion inside the vapor deposition apparatus 405a and the second placement plate 701a2, and is disposed at the upper portion inside the vapor deposition apparatus 405a. The second position restriction plate 701b2 is fixed, and the deposition position can be determined by the height of the position restriction plate 701b.

  The driving device 701c moves the first mounting plate 701a1 in the vertical direction (arrow direction in the drawing) and the second driving plate 701a2 in the vertical direction (arrow direction in the drawing). A second driving device 701c2 for causing the second driving device 701c2.

  From the first reversing step 404 (see FIG. 10), the flexible substrate holder 1 with the flexible substrate 301 transported by the first transport robot 5a (see FIG. 10) facing downward is placed. 701a. After mounting, the mounting plate 701a is moved upward by the driving device 701c until the flexible substrate holder comes into contact with the position regulating plate 701b. By contacting, the flexible substrate holder 1 is fixed at the deposition position with the flexible substrate holder 1 being sandwiched between the position regulating plate 701b and the placement plate 701a.

  The receiving device 7 shown in this figure is used in the hole transport layer forming step 406, the light emitting layer forming step 407, the electron injection layer forming step 408, and the second electrode forming step 409 shown in FIG. .

  FIG. 14 is a schematic flowchart of the fixing operation of the flexible substrate holder using the receiving apparatus shown in FIG.

  In Step 1, the state of the receiving device 7 before placing the flexible substrate holder is shown, and the receiving plate 701a is lowered. Reference numeral 701a4 denotes a positioning pin disposed on the first receiving plate 701a1.

  In Step 2, the flexible substrate holder 1 with the flexible substrate 301 transported in a state of being placed on the receiver 502 b of the first transport robot 5 a (see FIG. 10) is the first transport robot. The positioning hole 101f and the positioning pin 701a3 disposed in the frame constituting member of the flexible substrate holder 1 by the operation of the arm 502 of 5a (see FIG. 10), the positioning hole 101e, Positioning pins 601a4 (see FIG. 14) are aligned and placed on the receiving plate 701a. After the placement, the arm 502 of the first transfer robot 5a (see FIG. 10) moves backward to the standby position. After the placement, the driving device 701c is driven to move upward (in the direction of the arrow in the figure) until the flexible substrate holder 1 comes into contact with the position regulating plate 701b.

  In Step 3, the driving of the driving device 701c is stopped at a position where the flexible substrate holder 1 contacts the position regulating plate 701b. By contacting, the flexible substrate holder 1 is fixed between the position regulating plate 701b and the receiving plate 701a, and vapor deposition is started. Further, the contact position is a vapor deposition position, and the vapor deposition position can be adjusted by the height of the position regulating plate 701b.

  After the vapor deposition is completed, the driving device 701c is driven, the receiving plate 701a is lowered to the lower part of the vapor deposition device, and the arm 502 of the first transfer robot 5a (see FIG. 10) is operated so that the flexible substrate is attached to the receiving tool 502b. The flexible substrate holder 1 with 301 facing downward is placed and taken out from the vapor deposition apparatus. Thereafter, the flexible substrate holder 1 is transported to the light emitting layer forming step 407 by the first transport robot 5a (see FIG. 10). The flow shown in this figure is performed in each of the vapor deposition apparatuses of the hole transport layer forming step 406, the light emitting layer forming step 407, the electron injection layer forming step 408, and the second electrode forming step 409 shown in FIG. Other symbols are the same as those in FIG.

The following effects can be obtained by using the flexible substrate holder shown in FIGS. 1 to 5 and manufacturing the organic EL panel shown in FIG. 9 using the manufacturing apparatus shown in FIGS.
1. The sheet-like flexible substrate can be stably held without the occurrence of bending, bending or wrinkling, and the organic EL panel having stable performance can be manufactured.
2. Along with the production of a sheet-like flexible substrate organic EL panel, it has become possible to reduce weight, thickness and cost.
3. Since the sheet-like flexible substrate can be transferred between the steps with the flexible substrate holder attached to the flexible substrate holder, the movable rate of the steps is improved and the production efficiency can be improved.

  Hereinafter, the flexible substrate, the gas barrier layer, the first electrode, the hole transport layer, the light emitting layer, the electron transport layer, and the second electrode constituting the organic EL panel according to the present invention will be described.

(Flexible substrate)
When a transparent resin film is used as the flexible substrate, a gas barrier film is preferably formed on the surface of the resin film as necessary. Examples of the gas barrier film include an inorganic film, an organic film, or a hybrid film of both. As a characteristic of the gas barrier film, it is preferable that the water vapor permeability is 0.01 g / m ² / day or less. Furthermore, a high barrier film having an oxygen permeability of 10 ⁻³ ml / m ² / day or less and a water vapor permeability of 10 ⁻⁵ g / m ² / day or less is preferable.

  As a material for forming the barrier film, any material may be used as long as it has a function of suppressing intrusion of elements that cause deterioration of elements such as moisture and oxygen. For example, silicon oxide, silicon dioxide, silicon nitride, or the like can be used. Further, in order to improve the brittleness of the film, it is more preferable to have a laminated structure of these inorganic layers and layers made of organic materials. Although there is no restriction | limiting in particular about the lamination | stacking order of an inorganic layer and an organic layer, It is preferable to laminate | stack both alternately several times. The method for forming the barrier film is not particularly limited. For example, the vacuum deposition method, the sputtering method, the reactive sputtering method, the molecular beam epitaxy method, the cluster ion beam method, the ion plating method, the plasma polymerization method, the atmospheric pressure plasma weighting. A combination method, a plasma CVD method, a laser CVD method, a thermal CVD method, a coating method, and the like can be used, but an atmospheric pressure plasma polymerization method as described in JP-A-2004-68143 is particularly preferable.

(First electrode)
As the first electrode, an electrode material made of a metal, an alloy, an electrically conductive compound, or a mixture thereof having a high work function (4 eV or more) is preferably used. Specific examples of such an electrode substance include metals such as Au, and conductive transparent materials such as CuI, indium tin oxide (ITO), SnO ₂ , and ZnO. Alternatively, an amorphous material such as IDIXO (In ₂ O ₃ .ZnO) capable of forming a transparent conductive film may be used. For the anode, these electrode materials may be formed into a thin film by a method such as vapor deposition or sputtering, and a pattern having a desired shape may be formed by a photolithography method, or when the pattern accuracy is not required (about 100 μm or more) ), A pattern may be formed through a mask having a desired shape when the electrode material is deposited or sputtered. When light emission is taken out from the anode, it is desirable that the transmittance is greater than 10%, and the sheet resistance as the anode is preferably several hundred Ω / □ or less. Further, although the film thickness depends on the material, it is usually selected in the range of 10 to 1000 nm, preferably 10 to 200 nm.

(Hole injection layer (anode buffer layer))
A hole injection layer (anode buffer layer) may be present between the first electrode and the light emitting layer or the hole transport layer. The hole injection layer is a layer provided between the electrode and the organic layer in order to lower the driving voltage and improve the luminance of light emission. “The organic EL element and the forefront of industrialization (November 30, 1998, NTS) The details are described in the second volume, Chapter 2, “Electrode Materials” (pages 123 to 166) of “The Company”. Examples of the material used for the anode buffer layer (hole injection layer) include materials described in JP-A No. 2000-160328.

  The hole transport layer is made of a hole transport material having a function of transporting holes, and in a broad sense, a hole injection layer and an electron blocking layer are also included in the hole transport layer. The hole transport layer can be provided as a single layer or a plurality of layers. The hole transport material has any one of hole injection or transport and electron barrier properties, and may be either organic or inorganic. For example, triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives and pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amino-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, Examples include stilbene derivatives, silazane derivatives, aniline copolymers, and conductive polymer oligomers, particularly thiophene oligomers.

  The above-mentioned materials can be used as the hole transport material, but it is preferable to use a porphyrin compound, an aromatic tertiary amine compound and a styrylamine compound, particularly an aromatic tertiary amine compound. Representative examples of aromatic tertiary amine compounds and styrylamine compounds include N, N, N ', N'-tetraphenyl-4,4'-diaminophenyl; N, N'-diphenyl-N, N'- Bis (3-methylphenyl)-[1,1′-biphenyl] -4,4′-diamine (TPD); 2,2-bis (4-di-p-tolylaminophenyl) propane; 1,1-bis (4-di-p-tolylaminophenyl) cyclohexane; N, N, N ′, N′-tetra-p-tolyl-4,4′-diaminobiphenyl; 1,1-bis (4-di-p-tolyl) Aminophenyl) -4-phenylcyclohexane; bis (4-dimethylamino-2-methylphenyl) phenylmethane; bis (4-di-p-tolylaminophenyl) phenylmethane; N, N'-diphenyl-N, N ' − (4-methoxyphenyl) -4,4'-diaminobiphenyl; N, N, N ', N'-tetraphenyl-4,4'-diaminodiphenyl ether; 4,4'-bis (diphenylamino) quadriphenyl; N, N, N-tri (p-tolyl) amine; 4- (di-p-tolylamino) -4 '-[4- (di-p-tolylamino) styryl] stilbene; 4-N, N-diphenylamino- (2-diphenylvinyl) benzene; 3-methoxy-4′-N, N-diphenylaminostilbenzene; N-phenylcarbazole, and also two of those described in US Pat. No. 5,061,569. Having a condensed aromatic ring in the molecule, for example, 4,4'-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (NPD), JP-A-4-3086 4,4 ', 4 "-tris [N- (3-methylphenyl) -N-phenylamino] triphenylamine in which three triphenylamine units described in Japanese Patent No. 8 are linked in a starburst type ( MTDATA) and the like.

  Furthermore, a polymer material in which these materials are introduced into a polymer chain or these materials are used as a polymer main chain can also be used. In addition, inorganic compounds such as p-type-Si and p-type-SiC can also be used as the hole injection material and the hole transport material.

  JP-A-11-251067, J. Org. Huang et. al. A so-called p-type hole transport material described in a book (Applied Physics Letters 80 (2002), p. 139) can also be used. In the present invention, it is preferable to use these materials because a light-emitting element with higher efficiency can be obtained.

  Although there is no restriction | limiting in particular about the film thickness of a positive hole transport layer, Usually, 5 nm-about 5 micrometers, Preferably it is 5-200 nm. This hole transport layer may have a single layer structure composed of one or more of the above materials. A hole transport layer having a high p property doped with impurities can also be used. Examples thereof include JP-A-4-297076, JP-A-2000-196140, JP-A-2001-102175, J.A. Appl. Phys. 95, 5773 (2004), and the like. It is preferable to use such a hole transport layer having a high p property because an organic EL element with lower power consumption can be produced.

(Light emitting layer)
In the present invention, the light emitting layer refers to a blue light emitting layer, a green light emitting layer, and a red light emitting layer. There is no restriction | limiting in particular as a lamination order in the case of laminating | stacking a light emitting layer, You may have a nonluminous intermediate | middle layer between each light emitting layer. In the present invention, it is preferable that at least one blue light emitting layer is provided at a position closest to the anode among all the light emitting layers. Also, when four or more light emitting layers are provided, for example, blue light emitting layer / green light emitting layer / red light emitting layer / blue light emitting layer, blue light emitting layer / green light emitting layer / red light emitting layer / blue light emitting from the order close to the anode. Layered / green light emitting layer, blue light emitting layer / green light emitting layer / red light emitting layer / blue light emitting layer / green light emitting layer / red light emitting layer, etc. It is preferable for improving luminance stability. A white element can be manufactured by forming a light emitting layer in multiple layers.

  The total thickness of the light emitting layer is not particularly limited, but is usually selected in the range of 2 nm to 5 μm, preferably 2 to 200 nm in consideration of the uniformity of the film and the voltage required for light emission. Furthermore, it is preferable that it exists in the range of 10-20 nm. A film thickness of 20 nm or less is preferable because it has the effect of improving the stability of the emission color with respect to the driving current as well as the voltage surface. The film thickness of each light emitting layer is preferably selected in the range of 2 to 100 nm, and more preferably in the range of 2 to 20 nm. Although there is no restriction | limiting in particular about the film thickness relationship of each light emitting layer of blue, green, and red, It is preferable that the blue light emitting layer (the sum total when there are two or more layers) is the thickest among three light emitting layers.

  The light emitting layer includes at least three layers having different emission spectra, each having an emission maximum wavelength in the range of 430 to 480 nm, 510 to 550 nm, and 600 to 640 nm. If it is three or more layers, there will be no restriction | limiting in particular. When there are more than four layers, there may be a plurality of layers having the same emission spectrum. A layer having an emission maximum wavelength in the range of 430 to 480 nm is referred to as a blue light emitting layer, a layer in the range of 510 to 550 nm is referred to as a green light emitting layer, and a layer in the range of 600 to 640 nm is referred to as a red light emitting layer. Moreover, in the range which maintains the said maximum wavelength, you may mix a several luminescent compound in each light emitting layer. For example, the blue light emitting layer may be used by mixing a blue light emitting compound having a maximum wavelength of 430 to 480 nm and a green light emitting compound having the same wavelength of 510 to 550 nm.

  The organic light emitting material used as the material of the light emitting layer is (a) charge injection function, that is, holes can be injected from the anode or hole injection layer when an electric field is applied, and electrons are injected from the cathode or electron injection layer. (B) a transport function, that is, a function that moves injected holes and electrons by the force of an electric field, and (c) a light emission function, that is, a recombination field of electrons and holes. However, there is no particular limitation as long as it has the three functions of connecting these to light emission. For example, fluorescent whitening agents such as benzothiazole, benzimidazole, and benzoxazole, and styrylbenzene compounds can be used. Specific examples of the above-mentioned optical brightener include 2,5-bis (5,7-di-t-pentyl-2-benzoxazolyl) -1,3,4-thiadiazole in the benzoxazole series, 4 , 4'-bis (5,7-t-pentyl-2-benzoxazolyl) stilbene, 4,4'-bis [5,7-di- (2-methyl-2-butyl) -2-benzoxa Zoolyl] stilbene, 2,5-bis (5,7-di-t-pentyl-2-benzoxazolyl) thiophene, 2,5-bis [5-α, α-dimethylbenzyl-2-benzoxazoli Ru] thiophene, 2,5-bis [5,7-di- (2-methyl-2-butyl) -2-benzoxazolyl] -3,4-diphenylthiophene, 2,5-bis (5-methyl) -2-benzoxazolyl) thiophene, 4,4'-bis (2 -Benzoxazolyl) biphenyl, 5-methyl-2- [2- [4- (5-methyl-2-benzoxazolyl) phenyl] vinyl] benzoxazole, 2- [2- (4-chlorophenyl) vinyl Naphtho [1,2-d] oxazole and the like. Examples of the benzothiazole type include 2,2 '-(p-phenylenedivinylene) -bisbenzothiazole, and examples of the benzimidazole type include 2- [2- [4- (2-benzimidazolyl) phenyl] vinyl] benzimidazole. 2- [2- (4-carboxyphenyl) vinyl] benzimidazole and the like. In addition, other useful compounds are listed in Chemistry of Synthetic Soybean (1971), pages 628-637 and 640.

  Specific examples of the styrylbenzene compound include 1,4-bis (2-methylstyryl) benzene, 1,4-bis (3-methylstyryl) benzene, 1,4-bis (4-methylstyryl). ) Benzene, distyrylbenzene, 1,4-bis (2-ethylstyryl) benzene, 1,4-bis (3-methylstyryl) benzene, 1,4-bis (2-methylstyryl) -2-methylbenzene, 1,4-bis (2-methylstyryl) -2-ethylbenzene and the like can be mentioned.

  Further, in addition to the above-described optical brightener and styrylbenzene compound, for example, 12-phthaloperinone, 1,4-diphenyl-1,3-butadiene, 1,1,4,4-tetraphenyl-1,3- Butadiene, naphthalimide derivatives, perylene derivatives, oxadiazole derivatives, aldazine derivatives, pyrazirine derivatives, cyclopentadiene derivatives, pyrrolopyrrole derivatives, styrylamine derivatives, coumarin compounds, international publications WO 90/13148 and Appl. Phys. Lett. , Vol 58, 18, P1982 (1991), and aromatic dimethylidin compounds. Specific examples of the aromatic dimethylidin compounds include 1,4-phenylene dimethylidin, 4,4'-phenylene dimethylidin, 2,5-xylylene dimethylidin, 2,6-naphthylene dimethylidin, 1,4-biphenylenedimethylidin, 1,4-p-terephenylenedimethylidin, 4,4'-bis (2,2-di-t-butylphenylvinyl) biphenyl, 4,4'-bis (2 , 2-diphenylvinyl) biphenyl and the like, and derivatives thereof. Specific examples of the compound represented by the general formula (I) include bis (2-methyl-8-quinolinolato) (p-phenylphenolate) aluminum (III), bis (2-methyl-8-quinolinolato). ) (1-naphtholate) aluminum (III) and the like.

  In addition, a compound in which the above-described organic light-emitting material is used as a host and the host is doped with a strong fluorescent dye from blue to green, for example, coumarin-based or the same fluorescent dye as the host, is also suitable as the organic light-emitting material. When the above-described compound is used as the organic light-emitting material, blue to green light emission (the emission color varies depending on the type of dopant) can be obtained with high efficiency. Specific examples of the host that is the material of the compound include organic light-emitting materials having a distyrylarylene skeleton (particularly preferably, for example, 4,4′-bis (2,2-diphenylvinyl) biphenyl). Specific examples of the dopant which is a material of diphenylaminovinylarylene (particularly preferably, for example, N, N-diphenylaminobiphenylbenzene and 4,4′-bis [2- [4- (N, N-di- -P-tolyl) phenyl] vinyl] biphenyl).

  The light emitting layer preferably contains a known host compound and a known phosphorescent compound (also referred to as a phosphorescent compound) in order to increase the light emission efficiency of the light emitting layer. The host compound is a compound contained in the light-emitting layer, the mass ratio in the layer is 20% or more, and the phosphorescence quantum yield of phosphorescence emission is 0.1 at room temperature (25 ° C.). Is defined as less than a compound. The phosphorescence quantum yield is preferably less than 0.01. A plurality of host compounds may be used in combination. By using a plurality of types of host compounds, it is possible to adjust the movement of charges, and the organic EL element can be made highly efficient. In addition, by using a plurality of phosphorescent compounds, it is possible to mix different light emission, thereby obtaining an arbitrary emission color. White light emission is possible by adjusting the kind of phosphorescent compound and the amount of doping, and can also be applied to illumination and backlight.

  As these host compounds, compounds having a hole transporting ability and an electron transporting ability, preventing emission light from being increased in wavelength, and having a high Tg (glass transition temperature) are preferable. Known host compounds include, for example, JP-A Nos. 2001-257076, 2002-308855, 2001-313179, 2002-319491, 2001-357777, and 2002-334786. Gazette, 2002-8860, 2002-334787, 2002-15871, 2002-334788, 2002-43056, 2002-334789, 2002-75645 2002-338579, 2002-105445, 2002-343568, 2002-141173, 2002-352957, 2002-203683, 2002-363227 2002-231453, 2003-3165, 2002-234888, 2003-27048, 2002-255934, 2002-260861, 2002-280183, Examples thereof include compounds described in 2002-299060, 2002-302516, 2002-305083, 2002-305084, 2002-308837 and the like.

  In the case of having a plurality of light emitting layers, it is preferable that 50% by mass or more of the host compound in each layer is the same compound because it is easy to obtain a uniform film property over the entire organic layer. It is more preferable that the light emission energy is 2.9 eV or more because it is advantageous in efficiently suppressing energy transfer from the dopant and obtaining high luminance. Phosphorescence emission energy means the peak energy of the 0-0 band of phosphorescence emission when the photoluminescence of a deposited film of 100 nm is measured on a substrate with a host compound.

  The host compound has a phosphorescence emission energy of 2.9 eV or more and a Tg of 90 ° C. or more in consideration of deterioration of the organic EL device over time (decrease in luminance and film properties), market needs as a light source, and the like. Preferably there is. That is, in order to satisfy both luminance and durability, it is preferable that phosphorescence emission energy is 2.9 eV or more and Tg is 90 ° C. or more. Tg is more preferably 100 ° C. or higher.

  A phosphorescent compound (phosphorescent compound) is a compound in which light emission from an excited triplet is observed, is a compound that emits phosphorescence at room temperature (25 ° C.), and has a phosphorescence quantum yield of 25. The compound is 0.01 or more at ° C. When used in combination with the host compound described above, an organic EL device with higher luminous efficiency can be obtained.

  The phosphorescent compound according to the present invention preferably has a phosphorescence quantum yield of 0.1 or more. The phosphorescent quantum yield can be measured by the method described in Spectroscopic II, page 398 (1992 version, Maruzen) of Experimental Chemistry Course 4 of the 4th edition. Although the phosphorescence quantum yield in a solution can be measured using various solvents, the phosphorescence quantum yield used in the present invention only needs to achieve the phosphorescence quantum yield in any solvent.

  There are two types of light emission of the phosphorescent compound in principle. One is the recombination of the carrier on the host compound to which the carrier is transported to generate an excited state of the host compound, and this energy is transferred to the phosphorescent compound. The energy transfer type is to obtain light emission from the phosphorescent compound by moving to the phosphor, and the other is that the phosphorescent compound becomes a carrier trap, and carrier recombination occurs on the phosphorescent compound and the phosphorescent compound emits light. Although it is a carrier trap type in which light emission can be obtained, in any case, it is a condition that the excited state energy of the phosphorescent compound is lower than the excited state energy of the host compound.

  The phosphorescent compound can be appropriately selected from known compounds used for the light emitting layer of the organic EL device. The phosphorescent compound is preferably a complex compound containing a group 8-10 metal in the periodic table of elements, more preferably an iridium compound, an osmium compound, or a platinum compound (platinum complex compound), rare earth Of these, iridium compounds are the most preferred.

  In the present invention, the phosphorescence emission maximum wavelength of the phosphorescent compound is not particularly limited, and can be obtained in principle by selecting a central metal, a ligand, a ligand substituent, and the like. The emission wavelength can be changed.

  The light emission color of the organic EL device of the present invention and the compound according to the present invention is shown in FIG. 4.16 on page 108 of “New Color Science Handbook” (edited by the Japan Color Society, University of Tokyo Press, 1985). It is determined by the color when the result measured with the total CS-1000 (manufactured by Konica Minolta Sensing) is applied to the CIE chromaticity coordinates.

The white element referred to in the present invention means that when the front luminance at 2 ° viewing angle is measured by the above method, the chromaticity in the CIE1931 color system at 1000 cd / m ² is X = 0.33 ± 0.07, It is in the region of Y = 0.33 ± 0.07.

(Electron injection layer)
The electron injection layer is made of a material having a function of transporting electrons and is included in the electron transport layer in a broad sense. The electron injection layer is a layer provided between the electrode and the organic layer for lowering the driving voltage and improving the luminance of the light emission. “Organic EL element and its forefront of industrialization (NST 30, November 30, 1998) Issue) ”, Chapter 2, Chapter 2,“ Electrode Materials ”(pages 123-166). Details of the electron injection layer (cathode buffer layer) are described in JP-A-6-325871, JP-A-9-17574, JP-A-10-74586, and the like. Specifically, strontium, aluminum, etc. A metal buffer layer typified by lithium fluoride, an alkali metal compound buffer layer typified by lithium fluoride, an alkaline earth metal compound buffer layer typified by magnesium fluoride, an oxide buffer layer typified by aluminum oxide, etc. . The buffer layer (injection layer) is preferably a very thin film, and the film thickness is preferably in the range of 0.1 nm to 5 μm although it depends on the material.

  In addition, as an electron transport material (also serving as a hole blocking material) used for the electron transport layer adjacent to the light emitting layer side, it is sufficient if it has a function of transmitting electrons injected from the cathode to the light emitting layer. As a material, any one of conventionally known compounds can be selected and used. For example, nitro-substituted fluorene derivatives, diphenylquinone derivatives, thiopyran dioxide derivatives, carbodiimides, fluorenylidenemethane derivatives, anthraquinodisides. Examples include methane and anthrone derivatives, oxadiazole derivatives and the like. Furthermore, in the above oxadiazole derivatives, thiadiazole derivatives in which the oxygen atom of the oxadiazole ring is substituted with a sulfur atom, and quinoxaline derivatives having a quinoxaline ring known as an electron-withdrawing group can also be used as the electron transport material. Furthermore, a polymer material in which these materials are introduced into a polymer chain or these materials are used as a polymer main chain can also be used.

  Also, metal complexes of 8-quinolinol derivatives such as tris (8-quinolinol) aluminum (Alq), tris (5,7-dichloro-8-quinolinol) aluminum, tris (5,7-dibromo-8-quinolinol) aluminum. Tris (2-methyl-8-quinolinol) aluminum, tris (5-methyl-8-quinolinol) aluminum, bis (8-quinolinol) zinc (Znq), and the like, and the central metals of these metal complexes are In, Mg, Metal complexes replaced with Cu, Ca, Sn, Ga or Pb can also be used as the electron transport material. In addition, metal-free or metal phthalocyanine, or those having terminal ends substituted with an alkyl group or a sulfonic acid group can be preferably used as the electron transporting material. Distyrylpyrazine derivatives can also be used as electron transport materials, and inorganic semiconductors such as n-type-Si and n-type-SiC are also used as electron transport materials in the same manner as the hole injection layer and hole transport layer. I can do it. Although there is no restriction | limiting in particular about the film thickness of an electron carrying layer, Usually, 5 nm-about 5 micrometers, Preferably it is 5-200 nm. The electron transport layer may have a single layer structure composed of one or more of the above materials.

  An electron transport layer having a high n property doped with impurities can also be used. Examples thereof include JP-A-4-297076, JP-A-10-270172, JP-A-2000-196140, JP-A-2001-102175, J. Pat. Appl. Phys. 95, 5773 (2004), and the like. It is preferable to use such an electron transport layer having a high n property because an element with lower power consumption can be manufactured.

(Second electrode)
As the second electrode, a material having a work function (4 eV or less) metal (referred to as an electron injecting metal), an alloy, an electrically conductive compound, and a mixture thereof as an electrode material is used. Specific examples of such electrode materials include sodium, sodium-potassium alloy, magnesium, lithium, magnesium / copper mixture, magnesium / silver mixture, magnesium / aluminum mixture, magnesium / indium mixture, aluminum / aluminum oxide (Al ₂ O ₃ ) Mixtures, indium, lithium / aluminum mixtures, rare earth metals and the like. Among these, from the point of durability against electron injection and oxidation, etc., a mixture of an electron injecting metal and a second metal which is a stable metal having a larger work function than this, for example, a magnesium / silver mixture, Suitable are a magnesium / aluminum mixture, a magnesium / indium mixture, an aluminum / aluminum oxide (Al ₂ O ₃ ) mixture, a lithium / aluminum mixture, aluminum and the like. The cathode can be produced by forming a thin film of these electrode materials by a method such as vapor deposition or sputtering. The sheet resistance as the cathode is preferably several hundred Ω / □ or less, and the film thickness is usually selected in the range of 10 nm to 5 μm, preferably 50 to 200 nm. In order to transmit the emitted light, if either one of the first electrode (anode) or the second electrode (cathode) of the organic EL element is transparent or translucent, the emission luminance is advantageously improved.

  Moreover, after producing the metal with a thickness of 1 to 20 nm on the second electrode, the conductive transparent material mentioned in the description of the first electrode is produced thereon, so that a transparent or translucent second electrode ( A cathode) can be manufactured, and by applying this, an element in which both the first electrode (anode) and the second electrode (cathode) are transmissive can be manufactured.

(Sealant)
The liquid sealing agent and thermoplastic resin concerning this invention are mentioned. Examples of liquid sealants include photo-curing and thermosetting sealing agents having reactive vinyl groups of acrylic acid oligomers and methacrylic acid oligomers, moisture-curing sealing agents such as 2-cyanoacrylic acid esters, epoxy-based, etc. And a heat- and chemical-curing type (two-component mixed) sealing agent, a cationic curing type ultraviolet curing epoxy resin sealing agent, and the like. It is preferable to add a filler to the liquid sealant as necessary. The addition amount of the filler is preferably 5 to 70% by volume in consideration of adhesive strength. In addition, the size of the filler to be added is preferably 1 μm to 100 μm in consideration of the adhesive strength, the thickness of the sealant after bonding and bonding, and the like. The kind of filler to be added is not particularly limited, and examples thereof include soda glass, non-alkali glass, or silica, titanium dioxide, antimony oxide, titania, alumina, zirconia, tungsten oxide, and other metal oxides.

  As the thermoplastic resin, a thermoplastic resin having a melt flow rate of JIS K 7210 specified in a range of 5 to 20 g / 10 min is preferable, and a thermoplastic resin of 6 to 15 g / 10 min or less is more preferably used. This is because if a resin having a melt flow rate of 5 (g / 10 min) or less is used, the gap caused by the step of the lead electrode of each electrode cannot be completely filled, and a resin of 20 (g / 10 min) or more cannot be filled. This is because if used, the tensile strength, stress cracking resistance, workability and the like are lowered. These thermoplastic resins are preferably formed into a film and bonded to a flexible sealing member (a strip-shaped flexible sealing member or a single-sheet flexible sealing member). The laminating method can be made by using various generally known methods such as a wet laminating method, a dry laminating method, a hot melt laminating method, an extrusion laminating method, and a thermal laminating method.

  The thermoplastic resin is not particularly limited as long as it satisfies the above numerical values. For example, low density polyethylene (LDPE) which is a polymer film described in the new development of functional packaging materials (Toray Research Center, Inc.). ), HDPE, linear low density polyethylene (LLDPE), medium density polyethylene, unstretched polypropylene (CPP), OPP, ONy, PET, cellophane, polyvinyl alcohol (PVA), stretched vinylon (OV), ethylene-vinyl acetate copolymer A combination (EVOH), ethylene-propylene copolymer, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, vinylidene chloride (PVDC), or the like can be used. Among these thermoplastic resins, LDPE, LLDPE produced using LDPE, LLDPE and a metallocene catalyst, or a thermoplastic resin using a mixture of LDPE, LLDPE and HDPE films is preferably used.

(Flexible sealing member)
Examples of the flexible sealing member include a material in which a barrier layer is formed on a support made of a flexible resin film such as polyethylene terephthalate or nylon by a vapor deposition method or a coating method, or a material using a metal foil as the barrier layer. Examples of the barrier layer include metals such as In, Sn, Pb, Au, Cu, Ag, Al, Ti, and Ni, MgO, SiO, SiO ₂ , Al ₂ O ₃ , GeO, NiO, CaO, BaO, and Fe ₂ O _3. , Y ₂ O ₃ , TiO _{2, and} other metal oxide vapor deposited materials. Moreover, as a material of the metal foil, for example, a metal material such as aluminum, copper, or nickel, or an alloy material such as stainless steel or an aluminum alloy can be used, but aluminum is preferable in terms of workability and cost. The film thickness is about 1 to 100 μm, preferably about 10 to 50 μm. In order to facilitate handling during production, a film such as polyethylene terephthalate or nylon may be laminated in advance. When a resin film is used for the flexible sealing member, it is preferable to have a thermoplastic adhesive resin layer on the side in contact with the liquid sealing agent.

The water vapor permeability of the flexible sealing member is preferably 0.01 g / m ² · day or less, and the oxygen permeability is preferably 0.01 ml / m ² · day · atm or less. The water vapor permeability is a value measured mainly by the MOCON method by a method based on JIS K7129B method (1992), and the oxygen permeability is a value measured mainly by the MOCON method by a method based on JIS K7126B method (1987). is there. The Young's modulus of the flexible sealing member is 1 × 10 ⁻³ GPa in consideration of adhesion between the flexible sealing member, the first pressure-bonding member, and the second pressure-bonding member and prevention of spreading of the sealing agent. It is 80 GPa and the thickness is preferably 10 μm to 500 μm.

  The external extraction efficiency at room temperature of light emission of the organic EL device of the present invention is preferably 1% or more, more preferably 5% or more. Here, the external extraction quantum efficiency (%) = the number of photons emitted to the outside of the organic EL element / the number of electrons sent to the organic EL element × 100.

  In addition, a hue improvement filter such as a color filter may be used in combination, or a color conversion filter that converts the emission color from the organic EL element into multiple colors using a phosphor may be used in combination. In the case of using a color conversion filter, the λmax of light emission of the organic EL element is preferably 480 nm or less.

  The organic EL device of the present invention preferably uses the following method in combination in order to efficiently extract light generated in the light emitting layer. The organic EL element emits light inside a layer having a refractive index higher than that of air (refractive index is about 1.7 to 2.1), and only about 15% to 20% of the light generated in the light emitting layer can be extracted. It is generally said that there is no. This is because the light incident on the interface (interface between the transparent substrate and air) at an angle θ greater than the critical angle causes total reflection and cannot be taken out of the element, or the transparent electrode or light emitting layer and the transparent substrate This is because the light undergoes total reflection between them, the light is guided through the transparent electrode or the light emitting layer, and as a result, the light escapes in the direction of the side surface of the device.

  As a technique for improving the light extraction efficiency, for example, a method of forming irregularities on the surface of the transparent substrate to prevent total reflection at the interface between the transparent substrate and the air (US Pat. No. 4,774,435). A method for improving efficiency by providing a substrate with a light condensing property (JP-A-63-314795). A method of forming a reflective surface on the side surface of an element (Japanese Patent Laid-Open No. 1-220394). A method of forming an antireflection film by introducing a flat layer having an intermediate refractive index between a substrate and a light emitter (Japanese Patent Laid-Open No. 62-172691). A method of introducing a flat layer having a lower refractive index than the substrate between the substrate and the light emitter (Japanese Patent Laid-Open No. 2001-202827). There is a method of forming a diffraction grating between any one of the substrate, the transparent electrode layer, and the light emitting layer (including between the substrate and the outside) (Japanese Patent Laid-Open No. 11-283951).

  In the present invention, these methods can be used in combination with an organic EL element. However, a method of introducing a flat layer having a lower refractive index than the substrate between the substrate and the light emitter, or a substrate, a transparent electrode layer, A method of forming a diffraction grating between any layers of the light emitting layer (including between the substrate and the outside) can be suitably used. In the present invention, by combining these means, it is possible to obtain an element having higher luminance or durability.

  When a low refractive index medium is formed between the transparent electrode and the transparent substrate with a thickness longer than the wavelength of light, the light extracted from the transparent electrode has a higher extraction efficiency to the outside as the refractive index of the medium is lower. . Examples of the low refractive index layer include aerogel, porous silica, magnesium fluoride, and a fluorine-based polymer. Since the refractive index of the transparent substrate is generally about 1.5 to 1.7, the low refractive index layer preferably has a refractive index of about 1.5 or less. Further, it is preferably 1.35 or less. The thickness of the low refractive index medium is preferably at least twice the wavelength in the medium. This is because the effect of the low refractive index layer is diminished when the thickness of the low refractive index medium is about the wavelength of light and the electromagnetic wave that has exuded by evanescent enters the substrate. The method of introducing a diffraction grating into an interface or any medium that causes total reflection is characterized by a high effect of improving light extraction efficiency. This method is generated from the light emitting layer by utilizing the property that the diffraction grating can change the direction of light to a specific direction different from refraction by so-called Bragg diffraction such as first-order diffraction and second-order diffraction. Of the light, the light that cannot go out due to total reflection between layers, etc. is diffracted by introducing a diffraction grating into any layer or medium (inside a transparent substrate or transparent electrode) , Trying to extract light out. The introduced diffraction grating desirably has a two-dimensional periodic refractive index. This is because light emitted from the light-emitting layer is randomly generated in all directions, so in a general one-dimensional diffraction grating having a periodic refractive index distribution only in a certain direction, only light traveling in a specific direction is diffracted. The light extraction efficiency does not increase so much. However, by making the refractive index distribution a two-dimensional distribution, light traveling in all directions is diffracted, and light extraction efficiency is increased.

  As described above, the position where the diffraction grating is introduced may be in any of the layers or in the medium (in the transparent substrate or the transparent electrode), but is preferably in the vicinity of the organic light emitting layer where light is generated. At this time, the period of the diffraction grating is preferably about 1/2 to 3 times the wavelength of light in the medium. The arrangement of the diffraction grating is preferably two-dimensionally repeated, such as a square lattice, a triangular lattice, or a honeycomb lattice.

  Furthermore, the organic EL device of the present invention is processed so as to provide, for example, a structure on the microlens array on the light extraction side of the substrate in order to efficiently extract light generated in the light emitting layer, or so-called condensing. By combining with the sheet, the luminance in the specific direction can be increased by collecting light in a specific direction, for example, in the front direction with respect to the element light emitting surface. As an example of the microlens array, quadrangular pyramids having a side of 30 μm and an apex angle of 90 degrees are two-dimensionally arranged on the light extraction side of the substrate. One side is preferably 10 μm to 100 μm. If it becomes smaller than this, the effect of diffraction will generate | occur | produce and color, and if too large, thickness will become thick and is not preferable.

  As the condensing sheet, for example, a sheet that is put into practical use in an LED backlight of a liquid crystal display device can be used. As such a sheet, for example, a brightness enhancement film (BEF) manufactured by Sumitomo 3M Limited can be used. As the shape of the prism sheet, for example, the substrate may be formed with a triangle stripe having a vertex angle of 90 degrees and a pitch of 50 μm, or the vertex angle is rounded, and the pitch is randomly changed. The shape may be other shapes. Moreover, in order to control the light emission angle from a light emitting element, you may use a light-diffusion plate and a film together with a condensing sheet. For example, a diffusion film (light-up) manufactured by Kimoto Co., Ltd. can be used.

  Hereinafter, although an example is given and the concrete effect of the present invention is shown, the mode of the present invention is not limited to this.

Example 1
Using the manufacturing apparatus shown in FIG. 9, the structure shown in FIG. 8 (flexible substrate / anode (first electrode) / hole transport layer / light emitting layer / cathode buffer layer (electron injection layer) / cathode (second electrode) ) / Sealing agent layer / sealing material layer structure) was produced.

(Preparation of flexible substrate holder)
The flexible substrate holding shown in FIG. 2 having the following dimensions, having a rectangular frame having the frame constituting member shown in FIG. 2 and a beam portion provided on the frame via an attachment member The tool was prepared and prepared by injection molding using PTFE. The locking pin has the shape shown in FIG.

  The length of the flexible substrate holder was 105% of the length of the sheet-like flexible substrate. The width of the rectangular frame was 110% of the width of the sheet-like flexible substrate. The length of the rectangular frame was 80% with respect to the length of the flexible substrate holder. The length of the attachment member was 5% with respect to the length of the flexible substrate holder. The width of the attachment member was 300% with respect to the width of the beam portion. The length of the beam portion was 30% with respect to the length of the flexible substrate holder. The width of the beam portion was 5% of the width of the sheet-like flexible substrate. The width of the opening was 80% with respect to the width of the frame. The length of the opening was 60% with respect to the length of the frame. The distance between the centers of the two locking pins arranged on the frame was 50 mm. The distance between the centers of the two locking pins arranged in the beam portion was 50 mm. A line connecting the center of the two locking pins disposed on the frame body and the center of the two locking pins disposed on the beam portion, and two lines disposed on the frame body Distance R between the intersection of the locking pin with the outside of the attachment surface to the frame component and the intersection of the two engagement pins disposed on the beam with the outside of the attachment surface of the beam 102 (See FIG. 2) was 70 mm. The frame body, the beam portion, and the mounting member had the same height and were 4 mm. The diameter of the upper part of the locking pin was 4 mm, the diameter of the attachment portion with the frame was 3 mm, and the angle θ between the attachment surface and the side wall was 75 °. An angle shows the value measured using Mitutoyo Corporation projector PJ-A3000. The height of the locking pin from the attachment surface of the frame was 1000% with respect to the thickness of the flexible substrate. The water supply rate was 0.02%. A water supply rate shows the value for 24 hours measured according to ASTM A570.

(Preparation of flexible substrate)
A polyethersulfone film (manufactured by Sumitomo Bakelite, hereinafter abbreviated as PES) having a thickness of 200 μm, a width of 60 mm, and a length of 80 mm was prepared, and mounting holes were provided at four corners. The diameter of the mounting hole was 125% with respect to the diameter of the upper part of the locking pin. The distance between the centers of the mounting holes in the width direction was 50 mm. The distance Y (see FIG. 6) between the intersection of the line connecting the centers of the two attachment holes in the length direction with the outside of the attachment hole on the frame body side and the outside of the attachment hole on the beam side is 71 mm. It was.

(Attaching the flexible substrate to the flexible substrate holder)
The prepared flexible substrate is prepared in the supply process, taken out by the first transport robot, transported to the fixing process, and the flexible substrate is attached to the flexible substrate holder manually by the method shown in FIG. After the attachment is completed, the first transfer robot transports the cleaning process. The tension applied to the sheet-like flexible substrate was 42 N / m. A tension | tensile_strength shows the value measured by the method shown below using the push pull gauge (digital force gauge ZP series) by an Imada corporation.

Tension measurement method With a single-wafer flexible substrate fixed to the flexible substrate holder, push both ends of the beam part toward the frame at the same time with a push-pull gauge. Reads the value of the pull gauge and indicates the value converted to the unit width.

(Cleaning the flexible substrate)
The 1st electrode formation surface of the flexible substrate of the state fixed to the flexible substrate holder was performed on the conditions shown below with an atmospheric pressure plasma cleaning apparatus. After the cleaning of the flexible substrate is completed, the flexible substrate is transferred to the first reversing step by the first transfer robot.

Atmospheric pressure plasma cleaning conditions A gas containing 1 to 5% by volume of oxygen was used as argon gas, the frequency was 100 kHz to 150 MHz, the voltage was 10 V to 10 kV, the irradiation distance was 5 to 20 mm, and the time was 1 minute.

(Inversion in the first inversion process)
The flexible substrate holder (the flexible substrate in a fixed state is on the upper side) conveyed by the first transfer robot is fixed to the flexible substrate holder by the reversing device shown in FIG. The bent flexible substrate is turned 180 ° so as to be on the lower side, and then taken out by the first transfer robot and transferred to the first electrode forming step.

(Formation of anode (first electrode))
The flexible substrate holder that has been transferred to the sputtering film forming apparatus by the first transfer robot with the flexible substrate fixed to the flexible substrate holder in the lower side is shown in FIG. After receiving and fixing, it is moved and fixed to the sputtering film forming apparatus. Thereafter, ITO (indium tin oxide) having a thickness of 1 nm under reduced pressure of 1 Pa and a temperature of 80 ° C. is formed on the flexible substrate by sputtering to have a width of 2 mm, a length of 50 mm, an interval of 2 mm, a thickness of 150 nm, and a pattern of 10 rows. The formed anode (first electrode) was formed by forming a mask. After forming the anode (first electrode), it is taken out by the first transfer robot and transferred to the hole transport layer forming step.

(Formation of hole transport layer)
In the same manner as the formation method of the anode (first electrode), it is received and fixed to the receiving device, then moved to the deposition position and fixed, and the anode (first electrode) is removed except for the extraction electrode portion of the formed anode (first electrode). NPD was formed by vapor deposition at a reduced pressure of 1 × 10 ⁻⁴ Pa, a flexible substrate temperature of 60 ° C. and a thickness of 30 nm. After forming the hole transport layer, it is taken out by the first transport robot and transported to the light emitting layer forming step.

(Formation of light emitting layer)
After receiving and fixing to the receiving device in the same manner as the formation method of the anode (first electrode), it is moved to the deposition position and fixed, and the pressure is reduced to 1 × 10 ⁻⁴ Pa and the flexible substrate temperature on the hole transport layer. Alq ₃ was formed by vapor deposition at 60 ° C. and a thickness of 30 nm. After forming the light emitting layer, it is taken out by the first transfer robot and transferred to the electron injection layer forming step.

(Formation of electron injection layer)
After receiving and fixing to the receiving device in the same manner as the formation method of the anode (first electrode), it is moved to the deposition position and fixed, and a 0.5 nm thick LiF layer (cathode buffer layer (electron injection) is formed on the light emitting layer. Layer)) is deposited under a vacuum condition of 5 × 10 ⁻⁴ Pa to form an electron injection layer, which is then taken out by the first transport robot and transported to the second electrode forming step.

(Formation of cathode (second electrode))
In the same way as the formation method of the anode (first electrode), it is received and fixed to the receiving device, then moved to the deposition position and fixed, and Al was deposited on the electron injection layer under a vacuum condition of 5 × 10 ⁻⁴ Pa. Thus, a cathode (second electrode) having a thickness of 100 nm was formed. The formed second electrode had a width of 2 mm, a length of 35 mm, an interval of 2 mm, a thickness of 150 nm, and a 7-row pattern. After forming the cathode (second electrode), it is taken out by the first transfer robot and transferred to the second reversing step.

(Inversion in the second inversion process)
The flexible substrate holder carried by the first transfer robot (the fixed flexible substrate is on the lower side) is fixed to the flexible substrate holder by the reversing device shown in FIG. The flexible substrate in such a state is inverted 180 ° so as to be on the upper side, and then taken out by the second transfer robot and transferred to the sealant coating step.

(Coating with sealant)
A flexible substrate holder to which a flexible substrate on which the cathode (second electrode) taken out by the second transfer robot is formed is mounted on the mounting table with the flexible substrate facing upward. After this, a screen printing method using a thermosetting liquid adhesive (epoxy resin system) as a sealant except for the extraction electrode part of the anode (first electrode) and the cathode (second electrode) with a sealant coating device. Was applied to the light emitting region with a thickness of 30 μm. After apply | coating a sealing compound, it takes out with a 2nd conveyance robot and conveys to a flexible sealing member bonding process.

(Lamination of flexible sealing member)
Flexibility in which a flexible sealing member is stacked on a flexible substrate coated with up to a sealing agent, and then a flexible substrate on which a flexible sealing member is stacked is attached by a two-transport robot. The substrate holder is placed on the flexible sealing member laminating apparatus with the flexible substrate facing upward, and is pressure-bonded with a pressing force of 0.1 MPa in a 1 Pa vacuum environment, so that the atmospheric pressure is 80 ° C. For 3 hours to fix. After fixing the flexible sealing member, the organic EL panel is manufactured by taking out the sample with the second transport robot, and the sample No. 101. The organic EL panel was manufactured under the same conditions except that a glass plate was used for the flexible substrate holder and the flexible substrate was fixed with a tape. 102.

Evaluation The produced sample No. Table 1 shows the results obtained by testing the light emitting state and the substrate holding state on 101 and 102 by the method shown below and evaluating according to the evaluation rank shown below.

Test method of light emission state Using a low-voltage power supply, a voltage of 5 V was applied, and the light emission was visually observed. The measurement was performed for all 70 dots (light emitting portions), and the ratio of the light emitting dots (light emitting portions) was tabulated.

Evaluation rank of light emission evaluation ◎: All dots emit light ○: 90% or more and less than 10% emit light △: 50% or more and less than 90% emit light ×: Less than 50% emit light Substrate holding state Test method of The organic EL panel held by the flexible substrate holder was visually observed.

Evaluation rank of substrate holding state ○: The organic EL panel is held by the flexible substrate holding jig. Δ: A part of the organic EL panel is dropped from the flexible substrate holding jig. The organic EL panel dropped out of the flexible substrate holding jig

  The effectiveness of the present invention was confirmed.

Example 2 (corresponding to claim 5)
Using the manufacturing apparatus shown in FIG. 10, the structure shown in FIG. 9 (flexible substrate / anode (first electrode) / hole transport layer / light emitting layer / cathode buffer layer (electron injection layer) / cathode (second electrode) ) / Sealing agent layer / sealing material layer structure) was produced.

(Preparation of flexible substrate holder)
As shown in Table 2, the angle θ (see FIG. 4) between the mounting surface of the locking pin having the shape shown in FIG. 4 disposed on the flexible substrate holder shown in FIG. Except for the change, a flexible substrate holder having the same shape and dimensions as in Example 1 was prepared. 2-1 to 2-6. The angle indicates a value measured by the same method as in Example 1.

(Production of organic EL panel)
The prepared flexible substrate holder No. An organic EL panel was prepared under the same conditions as in Example 1 except that samples 2-1 to 2-6 were used. 201-206.

Evaluation Each sample No. Table 3 shows the results obtained by testing the light emitting state and the substrate holding state by the same method as in Example 1 and evaluating with the same evaluation rank as in Example 1.

  The effectiveness of the present invention was confirmed.

Example 3 (corresponding to claim 6)
Using the manufacturing apparatus shown in FIG. 10, the structure shown in FIG. 9 (flexible substrate / anode (first electrode) / hole transport layer / light emitting layer / cathode buffer layer (electron injection layer) / cathode (second electrode) ) / Sealing agent layer / sealing material layer structure) was produced.

(Preparation of flexible substrate holder)
A flexible substrate holder having the same shape and size as in Example 1 was produced.

(Preparation of flexible substrate)
When a polyethersulfone film (manufactured by Sumitomo Bakelite, hereinafter abbreviated as PES) having a thickness of 200 μm, a width of 200 mm, and a length of 350 mm was prepared and the flexible substrate was attached to the flexible substrate holder Table 4 The flexible board | substrate which changed the tension | tensile_strength applied to a flexible board | substrate as shown in FIG. The change in tension is determined by the distance Y () between the intersection of the line connecting the centers of the two attachment holes in the length direction with the outside of the attachment hole on the frame side and the outside of the attachment hole on the beam side. The distance was adjusted by changing the distance (see FIG. 6). A tension | tensile_strength shows the value measured by the same method as Example 1. FIG.

(Production of organic EL panel)
The prepared flexible substrate holder No. An organic EL panel was prepared under the same conditions as in Example 1 except that samples 3-1 to 3-5 were used. 301 to 305.

Evaluation Each sample No. Table 5 shows the results of the tests 301 to 305, the light emitting state and the substrate holding state being tested by the same method as in Example 1, and evaluated with the same evaluation rank as in Example 1.

  The effectiveness of the present invention was confirmed.

It is the schematic which shows the state which fixed the sheet-like flexible board | substrate to the flexible board | substrate holder of this invention. It is the schematic of the flexible substrate holder shown in FIG. It is a schematic sectional drawing in alignment with BB 'shown to Fig.2 (a). It is the expansion schematic of the part shown by S of Fig.2 (a). FIG. 5 is an enlarged schematic view of another shape of the locking pin shown in FIG. 4. FIG. 2 is an enlarged schematic view of the flexible substrate shown in FIG. FIG. 7 is a schematic flow diagram showing the process until the flexible base shown in FIG. 6 is attached to the flexible substrate holder shown in FIG. 2. It is a schematic flowchart which shows until the flexible substrate of Step4 shown in FIG. 7 is fixed to a flexible substrate holder. It is the schematic which shows an example of an organic electroluminescent panel. It is a schematic diagram of the manufacturing method of the organic electroluminescent panel shown by FIG. It is a schematic perspective view of the supply process shown by FIG. It is a schematic perspective view of the inversion apparatus of the 1st inversion process shown by FIG. It is a schematic perspective view of the receiver of the vapor deposition apparatus of the 1st electrode formation process shown by FIG. FIG. 14 is a schematic flowchart of a fixing operation of the flexible substrate holder using the receiving device shown in FIG. 13.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flexible board | substrate holder 101 Frame body 101a-101d Frame structural member 102 Beam part 103 Attachment member 104a 1st locking pin 104b 2nd locking pin 104a1, 104a2, 104b1, 104b2 Locking pin 105 Opening part 2,301 Flexible substrate 2a to 2d Mounting hole 3 Organic EL panel 4 Manufacturing apparatus 401 Supply process 402 Fixing process 403 Cleaning process 404 First inversion process 405 First electrode forming process 406 Hole transport layer forming process 407 Light emitting layer forming process 408 Electron Injection layer forming step 409 Second electrode forming step 410 Second inversion step 411 Sealing agent coating step 412 Flexible sealing member bonding step 413 Desorption step 414 Punch cutting / recovering step 5a First transfer robot 5b Second transfer Robot 6 Reverse device 601 Fixed part 602 Drive part

Claims (7)

A flexible substrate holder for holding a rectangular flexible substrate in a planar state,
The flexible substrate has an attachment hole to the flexible substrate holder,
The flexible substrate holder includes a rectangular frame-shaped frame body and a beam portion of a beam structure integrally formed in a cantilever state via an attachment member on the frame body,
First locking pins respectively inserted into the mounting holes at two corners of the side of the frame opposite to the mounting member;
A flexible substrate holder having second locking pins respectively inserted into the mounting holes at both ends of the beam portion. The flexible substrate holder according to claim 1, wherein at least one of the first locking pins is a fixed locking pin. The second locking pin is a locking pin disposed at both ends of the beam portion. When the beam portion is horizontally pressed toward the both ends in the frame body direction, the beam is bent in the frame body direction and the pressing The flexible substrate holder according to claim 1, wherein the flexible substrate holder is returned to its original shape by releasing. The flexible substrate holder according to any one of claims 1 to 3, wherein the frame is provided with at least one positioning hole. The first locking pin has an upper diameter larger than a lower diameter, a side wall from the attachment surface toward the upper portion has at least an inclined portion, and an angle formed by the inclined portion and the attachment surface is 45 ° to 45 °. It is 85 degrees, The flexible substrate holder of any one of Claims 1-4 characterized by the above-mentioned. When the mounting hole of the flexible substrate is inserted through the first locking pin and the second locking pin and the flexible substrate is fixed to the flexible substrate holder, the tension applied to the flexible substrate is It is 10N / m-100N / m, The flexible substrate holder of any one of Claims 1-5 characterized by the above-mentioned. A manufacturing apparatus having a substrate cleaning step, a first electrode forming step, an organic compound layer forming step, a second electrode forming step, and a sealing layer forming step, wherein at least a first electrode is formed on a sheet-like flexible substrate In the method of manufacturing an organic electroluminescence panel in which an organic compound layer including a light emitting layer, a second electrode, and a sealing layer are sequentially formed,
7. The method according to claim 1, wherein at least one of the substrate cleaning step, the first electrode forming step, the organic compound layer forming step, the second electrode forming step, and the sealing layer forming step. A method for producing an organic electroluminescence panel, comprising using the flexible substrate holder described above, and holding and processing the flexible substrate.

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