JP4857185B2 - LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF - Google Patents

Description

  The present invention relates to an illuminating device having a plurality of light emitting diodes (LEDs) mounted on one surface of a substrate (wiring substrate) and a manufacturing method thereof, and more particularly to a technique effective when applied to an illuminating device for a backlight.

  The light emitting diode can emit a desired color depending on the difference in the compound semiconductor used. As a method of obtaining white light using a light emitting diode, a method of obtaining white light by arranging each light emitting diode chip of B (blue), G (green), and R (red), which are the three primary colors of light, in a balanced manner, A method of obtaining white light by combining a light emitting diode chip (blue chip) emitting blue light or a light emitting diode chip (purple chip) emitting purple light and a phosphor material is known (for example, Non-Patent Document 1). .

  Also, a structure in which a large number of LEDs are mounted on a single wiring board is known for illumination (for example, Non-Patent Document 2). This document discloses a module having a thickness of 3 mm in which LEDs are flip-chip mounted on a metal-based composite multilayer substrate. This module has a structure in which 64 LEDs are flip-chip mounted on a 2 cm × 2 cm substrate. A reflector is bonded to the upper surface of the substrate. The reflector is provided with 64 inverted frustoconical holes, and an LED is mounted on the substrate exposed at the bottom of each hole. Each LED chip in each hole is covered with a resin containing a phosphor. A lens is formed of resin in each hole portion. The inner peripheral surface of the inverted frustoconical hole forms an inclined reflecting surface. As a result, the light emitted from the LED is efficiently guided forward by the effect of the reflecting surface and the lens.

  On the other hand, in the case of using LEDs for the backlight of LCD (liquid crystal) -TV (television) and LCD monitor, a large number of high-power LEDs are arranged on one substrate, so that the backlight illumination device becomes large ( For example, Non-Patent Document 3). The high-power LED is also described in Non-Patent Document 1, but has an element structure in which leads are projected outside the package.

Issued by Nikkei BP "Nikkei Electronics" April 25, 2005, pages 80-93 Published by Sogiken Co., Ltd. “Current Status and Future Prospects of White LEDs in 2004” Published January 29, 2004, pages 77 and 78 Published by Electronic Journal Co., Ltd. “2005 High-Brightness LED Guidebook” June 3, 2005, pages 46 and 51

  As the screen of a liquid crystal television becomes larger, the substrate of the backlight illumination device tends to be larger and the manufacturing cost tends to increase. In the structure in which the high-power LED is mounted on the substrate, the high-power LED is manufactured in such a manner that the lead protrudes to the outside of the package, so that the mounting area is increased and the downsizing of the backlight illumination device is hindered. Moreover, since the high-power LED has a high manufacturing cost, the cost of the backlight illumination device also increases.

  In the structure in which the reflecting plate is bonded to the substrate, the reflecting surface is formed by forming the hole of the inverted truncated cone in the reflecting plate, and the reflecting surface forming cost is high. The reflector is formed of a polyimide resin or a polyamide resin excellent in heat resistance in order to improve reliability, but the cost of the polyimide resin and the polyamide resin is high. In addition, a polyolefin film is used as an adhesive for adhering the reflector to the substrate. This polyolefin film has excellent heat resistance but is expensive. As a result, the manufacturing cost is high for the structure in which the reflector is bonded to the substrate.

  Therefore, the present applicant has proposed a lighting device that emits white light and a method for manufacturing the same that can achieve a reduction in manufacturing cost (Japanese Patent Application No. 2006-210480). 25 and 26 are diagrams related to the lighting device 70 proposed by the present applicant. FIG. 25 is a schematic perspective view showing the illumination device 70, and FIG. 26 is a schematic enlarged sectional view showing a part of the illumination device 70.

  As shown in FIG. 25, the lighting device 70 has a plurality of LED light emitting portions 72 arranged and arranged on the first surface 71 a of the wiring board 71. As shown in FIG. 26, the LED light emitting unit 72 is arranged to be located at the center of the reflector 73 made of an annular body (donut shape) provided on the first surface 71 a of the wiring board 71 and the reflector 73. LED chip 74. As the LED chip 74, a chip that emits red light, a chip that emits green light, and a chip that emits blue light are used, and are arranged so as to be white light as a whole.

  The LED chip 74 is fixed on a support pad 75 provided on the first surface 71 a of the wiring board 71. The upper surface of the LED chip 74 that is not fixed is a light emitting surface that emits light, and has two electrodes (an anode electrode and a cathode electrode).

  Around the support pad 75, a first electrode pad 77 and a second electrode pad 78 formed by a part of the wiring 76 are arranged. The first electrode pad 77 and the second electrode pad 78 are connected to the electrodes of the LED chip 74 through conductive wires 79, respectively. A resin body 80 made of a transparent insulator is provided inside the reflector 73. The resin body 80 covers the LED chip 74 and the wire 79. As shown in FIG. 26, wiring 76 is provided on the first surface 71 a and the inside of the wiring board 71. A predetermined portion of the first surface 71 a of the wiring substrate 71 is covered with an insulating film 81.

  The reflector 73 is formed by applying a resin in a ring shape (endless shape) to the first surface 71a of the wiring board 71 and then curing the resin. The cross section of the reflector 73 is semicircular or semielliptical. Accordingly, when a predetermined voltage is applied to the LED chip 74, the light 82 is emitted from the light emitting surface. The light 82 passes through the resin body 80 and is emitted from the surface of the resin body 80 to the front of the first surface 71 a of the wiring board 71. The light 82 radiated to the side of the LED chip 74 is reflected by the surface of the reflector 73 and radiated in front of the first surface 71 a of the wiring board 71. Since the light 82 radiated to the side of the LED chip 74 is guided to the front of the lighting device 70 by the reflector 73, the light output of the lighting device 70 increases. In addition, since the plurality of LED light emitting units 72 are arranged and arranged on the first surface 71a of the wiring board 71, the illumination device 70 emits uniform light.

  However, in such an illuminating device 70, since the LED light emitting units 72 are separated and independent from each other, the interval between the adjacent LED light emitting units 72 becomes a useless area (dead space) that is not used. . The dead space hinders downsizing of the lighting device. Moreover, it becomes possible to arrange more LED light emission parts by reducing dead space, and the output of an illuminating device can be increased.

  An object of the present invention is to provide a manufacturing technique of an illuminating device that can achieve downsizing of the illuminating device.

  Another object of the present invention is to provide a technique for manufacturing a lighting device that can achieve improved output of the lighting device.

  Another object of the present invention is to provide a lighting device manufacturing technique capable of reducing the manufacturing cost of the lighting device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  The following is a brief description of an outline of typical inventions disclosed in the present application.

(1) The lighting device
A first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of light emitting diode chips arranged and mounted in the XY direction, A plurality of first electrode pads and second electrode pads electrically connected to the first electrode or the second electrode of the light emitting diode chip, respectively, and 1 electrically connected to the first electrode pad A wiring board having a plurality of first external electrode terminals and one or more second external electrode terminals electrically connected to the second electrode pad;
A plurality of pins fixed to the first surface of the wiring board and electrically connected to the first electrode pad and the second electrode pad respectively. A light emitting diode chip,
A reflector made of an endless body (for example, an annular body) provided on the first surface of the wiring board so as to surround one or more of the light emitting diode chips;
A resin body formed of a transparent and insulating resin that fills the inside of the reflector and covers the light emitting diode chip;
The adjacent reflectors are arranged in contact with each other in the arrangement of the light emitting diode chips in at least the X direction of the XY directions of the wiring board,
The inner peripheral surface of the reflector is a reflecting surface that reflects light emitted from the light emitting diode chip and guides it forward of the first surface of the wiring board.

  The plurality of light emitting diode chips may include a red light emitting diode chip that emits red light, a green light emitting diode chip that emits green light, and a blue light emitting diode chip that emits blue light. A plurality of the light emitting diode chips are arranged, and the light emitted toward the front of the first surface of the wiring board is white light as a whole. The first surface of the light emitting diode chip is provided with the first electrode and the second electrode, and the first electrode is connected to the first electrode pad via a conductive wire. The second electrode is connected to the second electrode pad via a conductive wire. Further, the reflector has a structure in which a plurality of endless bodies formed of resin are stacked, and an inner peripheral surface of the reflector formed of the plurality of endless bodies constitutes a reflecting mirror surface. .

Such a lighting device is
(A) a first surface and a second surface opposite to the first surface, and a plurality of light emitting diode chips arranged and mounted in the XY directions on the first surface; The first electrode pad and the second electrode pad respectively corresponding to and electrically connected to the first electrode or the second electrode of each light emitting diode chip, and electrically connected to the first electrode pad Preparing a wiring board having one or more first external electrode terminals to be connected and one or more second external electrode terminals electrically connected to the second electrode pad;
(B) preparing a plurality of groups of light emitting diode chips having different emission wavelengths;
(C) mounting each of the light emitting diode chips of each group on a predetermined region of the first surface of the wiring board, and the first and second electrodes of the light emitting diode chips and Electrically connecting the corresponding first electrode pad and the second electrode pad by connecting means;
(D) In all the light emitting diode chips mounted on the wiring board, a resin is applied to the first surface of the wiring board so as to swell endlessly so as to surround one or more of the light emitting diode chips, And curing to form a reflector made of an endless body (for example, an annular body),
(E) filling a transparent and insulating resin inside each of the reflectors, and curing the resin body to cover the light emitting diode chip; and
The reflectors are aligned and formed so as to be arranged along the X direction and the Y direction in the XY direction of the wiring board, and at least the reflectors adjacent to each other in each of the reflector rows arranged along the X direction. Is formed to contact through a contact point,
Formation of the reflector row in contact via the contact point is as follows:
After the predetermined position on the first surface of the wiring board is set as the application start position, the nozzle of the resin supply tool is positioned on the application start position, and then the reflector row while discharging the resin from the lower end of the nozzle A resin application step by one-stroke writing that returns to the application start position while moving the nozzle along the pattern;
Forming the resin by a curing process.

  In the step (b), a plurality of red light emitting diode chips emitting red light, green light emitting diode chips emitting green light, and blue light emitting diode chips emitting blue light are prepared.

  In the step (c), the light emitting diode chips of the groups are connected to the wiring board so that the light emitted toward the front of the first surface of the wiring board becomes white light as a whole. Mounting in a predetermined region of the first surface, connecting the first electrode of each light emitting diode chip and the first electrode pad with a conductive wire, and connecting the first electrode of each light emitting diode chip with the first electrode And connecting the second electrode and the second electrode pad with a conductive wire.

In the step (d), the resin coating operation in the formation of the reflector row by the 1st to mth reflectors arranged in the XY direction from the -X direction to the + X direction,
When the movement of the nozzle that moves along the reflector pattern of the reflector that is an endless body is a clockwise movement or a counterclockwise movement in the rotation direction around the center of the endless body,
a) a predetermined position of the reflector pattern of any one of the reflectors of No. 1 to No. m as a coating start position of the nozzle;
b) Move the nozzle clockwise or counterclockwise from the application start position to the contact point with the adjacent reflector pattern on one movement direction side of the + X side or the −X side, or When the contact point is the application start position, the position is kept as it is,
c) Next, the nozzle is moved from the contact point to the contact point with the next adjacent reflector pattern in the direction of rotational movement opposite to the previous clockwise movement or counterclockwise movement, or the movement of the nozzle. If the starting position is on the contact point, the nozzle is moved clockwise or counterclockwise to the adjacent contact point,
d) The resin application is terminated by causing the nozzle to repeat the operation of c) and moving the nozzle to the application start position.

  Further, in the step (d), the nozzle is moved from the application start position while discharging the resin, and then moved again to the application start position, and then again on the reflector formed by the resin application method. The operation of the nozzle that moves to the application start position is repeated one or more times to form a reflector having a multi-layered structure.

  (2) In the means of (1), the adjacent reflectors are arranged in contact with each other in the arrangement of the light emitting diode chips in the X and Y directions of the XY direction of the wiring board. Features.

  In such a lighting device, in the step (1), in the step (d), the reflectors are arranged so as to be aligned along the X direction and the Y direction in the XY direction of the wiring board. In the reflector rows formed and arranged along the X direction and the Y direction, adjacent reflectors are formed so as to contact each other through a contact point.

In the XY direction, n is formed by 1 to m rows of reflectors arranged from the -X direction to the + X direction, and 1 to n rows of reflectors arranged from the + Y direction to the -Y direction. The trajectory of the nozzle in the formation of the reflector group of column m rows is
When the movement of the nozzle that moves along the reflector pattern of the reflector that is an endless body is a clockwise movement or a counterclockwise movement in the rotation direction around the center of the endless body,
The nozzle is
(A) Each time the contact point by the reflector pattern of one column and one row and the reflector pattern of one column and two rows moves in the + X direction while moving clockwise, and reaches the contact point in the column direction, The clockwise movement and the activation in the + X direction are repeated to proceed to the contact point by the (m−1) -row reflector pattern and the m-row reflector pattern, and then the (m−1) -row reflector pattern and the The clockwise movement from the contact point by the m-th reflector pattern returns to the contact point by the (m-1) -th reflector pattern and the m-th reflector pattern, and the (m-1) -th row Each time it moves in the −X direction while moving clockwise from the contact point by the reflector pattern and the m-th row of reflector patterns, it moves in the clockwise direction and −X direction each time it reaches the contact point in the column direction. Repeat the above movement Proceeds to the contact point by reflector pattern of the first column 2 line and the reflector pattern of one row column,
(B) The reflector pattern of the first column and the first row and the reflection of the second column and the first row by moving 45 degrees clockwise from the contact point by the reflector pattern of the first column and the first row and the reflector pattern of the first column and the second row. Move to the contact point with the body pattern, then move clockwise by 45 degrees and proceed to the contact point by the reflector pattern of 2 columns and 1 row and the reflector pattern of 2 columns and 2 rows,
(C) From the contact point by the reflector pattern of the second column and the first row and the reflector pattern of the second column and the second row, the reflector of the next row by the same movement as the above (a) and (b) Proceed to the point of contact with the pattern and two rows of reflector patterns,
(D) The operation of (c) is repeated to proceed to the contact point by the reflector pattern of n columns and 1 row and the reflector pattern of n columns and 2 rows,
(E) From the contact point by the reflector pattern of the n column 1 row and the reflector pattern of the n column 2 row, the reflector pattern of the n column 1 row and the n column 2 row by the same movement as the above (a) Return to the contact point by the reflector pattern of
(F) Every time when moving in the + Y direction while moving clockwise and reaching the contact point in the row direction from the contact point by the reflector pattern of the n column and 1 row and the reflector pattern of the n column and 2 rows And repeating the clockwise movement and the movement in the + Y direction to return to the contact point by the reflector pattern of the first column and the first row and the reflector pattern of the first column and the second row,
In the one-stroke writing by the nozzle, a desired position on the locus is set as the application start position, and then the nozzle is moved from the application start position along the locus so as to coincide with a moving direction of the nozzle forming the locus. Or moving along the trajectory in a direction opposite to the moving direction of the nozzle forming the trajectory and returning to the application start position, thereby terminating the resin coating operation.

(3) In the above means (1),
The wiring board is an elongated rectangular body having a size in which the reflectors arranged in a plurality of rows in the XY direction are set to 1 along the Y direction and the reflectors are arranged in a row along the X direction,
A first electrode pad and a second electrode, which are electrically connected to the first electrode or the second electrode of the light emitting diode chip, respectively, inside each reflector on the first surface of the wiring board. The pad is located,
A first external electrode electrically connected to each of the first electrode pad and the second electrode pad on one side portion of the first surface of the wiring board along the longitudinal direction of the rectangular body A terminal and a second external electrode terminal are provided;
A light emitting diode chip that emits light of any one color of red, green, and blue is fixed in each reflector.
The light emitted in front of the first surface of the wiring board is white light as a whole.

  The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

  According to the means (1), (a) reflectors are arranged in the X and Y directions on the first surface of the wiring board, and each reflector has one of the colors red, green, and blue. Since the light-emitting diode chip that emits light is fixed, the illumination device emits white light in front of the first surface of the wiring board. Since the lighting device has a structure in which at least the reflector rows in the X direction out of the reflector rows arranged in the XY direction are in contact with each other on the first surface of the wiring board, the reflector along the X direction. There is no unused space between them, and the lighting device can be downsized.

  (B) By the above (a), there is no unused space between the reflectors at least along the X direction on the first surface of the wiring board. Thus, more reflectors can be arranged, and the output of the lighting device can be improved.

  (C) On the first surface of the wiring board, the formation of the reflector row at least along the X direction starts from the application start position and finally moves to the application start position by the nozzle for applying the resin. Since this method is used, it can be formed in a short time, and the manufacturing cost of the lighting device can be reduced.

  (D) A tall multi-stage stack by repeating one or more strokes on the reflector row formed by one stroke, starting from the coating start position and finally moving the nozzle to the coating start position. Structured reflectors can be formed. As a result, it is possible to increase the thickness of the resin body that is expected to have a lens action formed in the reflector.

  The means (2) has the following effects in addition to the effects of the means (1). That is, (a) in the XY direction reflector row on the first surface of the wiring board, the adjacent reflectors in the X direction reflector row are brought into contact with each other and also in the Y direction reflector row. It is configured to contact each other. As a result, there is no unused space between the reflectors along the X direction, and there is no unused space between the reflectors along the Y direction. Compared to the illumination device according to the means (1). Furthermore, the size of the lighting device can be reduced.

  (B) According to (a), there is no unused space between the reflectors along the XY direction on the first surface of the wiring board. Therefore, in the case of a lighting device of a predetermined size, (1) More reflectors can be arranged as compared with the illumination device according to the means, and the output of the illumination device can be further improved.

  (C) On the first surface of the wiring board, the formation of the plurality of reflector rows along the XY direction is performed by a one-stroke method in which the nozzle for applying the resin is moved from the application start position to the application start position. Therefore, it can be formed in a short time, and the manufacturing cost of the lighting device can be further reduced.

  The illuminating device by means (3) is an illuminating device having a structure having one row of reflector rows in the X direction in the illuminating device by means (1). The one row of reflectors is also formed by the means (1). Therefore, the effect of the means (1), that is, the effect of reducing the size of the lighting device or improving the output of the lighting device, reducing the manufacturing cost of the lighting device, and increasing the thickness of the resin body by the reflector having the multi-layered structure. be able to.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment of the invention, and the repetitive description thereof is omitted.

  1 to 11 are diagrams related to a lighting apparatus that is Embodiment 1 of the present invention. 1 to 4 are diagrams related to the structure of the lighting device, and FIGS. 5 to 11 are diagrams related to a method of manufacturing the lighting device.

  As shown in FIG. 1, the illuminating device 1 includes a wiring board 2 made of a rectangular body, and LED light emitting units 3 arranged and arranged on the first surface 2 a of the wiring board 2. The LED light emitting units 3 are arranged in n columns and m rows. In the first embodiment, the LED light emitting units 3 are arranged in 4 columns and 9 rows for convenience of explanation. That is, as shown in FIG. 1, nine LED light emitting units 3 are arranged along the length direction (X direction) of the wiring board 2 and in the width direction (Y direction) on the first surface 2 a of the wiring board 2. Four are arranged along. As a result, the wiring board 2 becomes rectangular. The LED light emitting unit 3 is formed by a circle drawn by a thick line in FIG. 1 and parts inside the circle.

  FIG. 3 is an enlarged view showing the LED light emitting unit 3. 4 is a cross-sectional view taken along line AA in FIG. The LED light emitting unit 3 can be roughly summarized as a reflector 4 formed of a circular annular body, a light emitting diode chip (LED chip) 5 fixed to a substantially center of the reflector 4, and a first of the LED chips 5. A wire 6 connected to an electrode (for example, an anode electrode) and a second electrode (for example, a cathode electrode), an LED chip 5 and a transparent resin body 7 filled in the reflector 4 covering the wire 6 are formed. Has been.

  In Example 1, the exposed surface on which the first electrode and the second electrode of the LED chip 5 are provided becomes a light emitting surface, and light 8 is emitted to the outside. As shown in FIG. 4, the light 8 passes through the resin body 7 from the light emitting surface of the LED chip 5 and is emitted in front of the first surface 2 a of the wiring board 2. Further, the light 8 emitted from the LED chip 5 and hitting the inner peripheral wall of the reflector 4 is reflected by the surface of the reflector 4 and is emitted in front of the first surface 2 a of the wiring board 2. Further, in order to efficiently guide the reflected light to the outside, the reflector 4 has a multi-stage structure and the height of the reflector 4 is increased. Since the thickness of the reflector 4 is increased, the thickness of the resin body 7 can be increased, and the light 8 can be efficiently guided to the outside.

  In the first embodiment, the LED chip 5 that emits red light (R), the LED chip 5 that emits green light (G), and the LED chip 5 that emits blue light (B) are used. These LED chips 5 are mixedly arranged as indicated by R, G, B in FIG. In the figure, R, G, and B displayed on the inside or outside of the reflector 4 indicate the emission color of the LED chip 5 fixed in the reflector 4, and are shown for convenience of explanation. Thereby, the light radiated | emitted from the illuminating device 1 turns into white light.

  The wiring board 2 is formed of an insulating plate such as a glass / epoxy resin plate, for example, and has a conductor layer having a predetermined pattern on the surface and inside thereof. Many of the conductor layers provided on the first surface 2a of the wiring board 2 are covered with an insulating film 10 (see FIG. 4).

  In the LED light emitting part 3, as shown in FIGS. 3 and 4, the insulating film 10 is opened in a rectangular shape. A square support pad 12 is provided at the center of the opened opening 11. The support pad 12 is a pedestal for fixing the LED chip 5 and is formed larger than the LED chip 5. Further, a first electrode pad 13 and a second electrode pad 14 to which the wire 6 is connected are provided in the opening part that is removed from both ends of the support pad 12. The support pad 12, the first electrode pad 13, and the second electrode pad 14 are formed of the conductor layer.

  One or more sets of external electrode terminals for supplying power to each LED light emitting unit 3 are provided on the peripheral portion of the first surface 2 a of the wiring board 2. In Example 1, two sets of external electrode terminal groups are provided, and one set is provided on each short side of the rectangular wiring board 2 as shown in FIGS. As shown in FIG. 2, the external electrode terminal group includes external electrode terminals 15R, 15G, and 15B and a common external electrode terminal 15Z.

  The external electrode terminals 15R, 15G, and 15B are electrically connected to the first electrode pads 13 of the LED light emitting units 3 indicated as R, G, and B in FIG. 2 through wirings 16R, 16G, and 16B, respectively. . The common external electrode terminal 15Z is electrically connected to the second electrode pad 14 of each LED light emitting unit 3 via the wiring 16Z (see FIG. 4). The external electrode terminals 15R, 15G, and 15B, the common external electrode terminal 15Z, and the wirings 16R, 16G, 16B, and 16Z are also formed of the conductor layer. FIG. 2 is a schematic diagram showing a wiring state between each electrode of each LED light emitting unit and an external electrode terminal. In FIG. 2, the common external electrode terminal 15Z and the second electrode pad 14 are shown in black. Although the wiring 16Z is omitted in FIG. 2, the wiring 16Z is provided inside the wiring board 2 as shown in FIG. The wiring 16Z connects, for example, a wiring that becomes a trunk line extending along the center of the reflector row arranged in the X direction, and the wiring that becomes the trunk line and the second electrode pad 14 of each LED light emitting unit 3. The wiring is a branch line, and the main line that is out of the reflector row is bent and connected to a predetermined common external electrode terminal 15Z.

  Accordingly, by applying a predetermined voltage between the common external electrode terminal 15Z and the desired external electrode terminals 15R, 15G, and 15B, the predetermined LED emission of the three types of R, G, and B LED light emitting units 3 is performed. The part 3 can emit light. The illuminating device 1 emits white light by causing all the LED light emitting units 3 among the three types of R, G, and B to emit light.

  In the first embodiment, the external electrode terminal group is provided on the first surface 2a of the wiring board 2. However, the external electrode terminal group may be provided on the second surface 2b serving as a reflector of the first surface 2a. It is good also as a structure provided in.

  In the illuminating device 1 of Example 1, in order to thicken the resin body 7 that covers the LED chip 5 and the wire 6, the thickness (height) of the reflector 4 serving as a jetty that stops the outflow of the resin when the resin is injected. Is also high. In order to increase the height of the reflector 4, the resin body 7 is formed thick by applying the resin a plurality of times. FIG. 4 shows a reflector 4 formed by applying resin twice. The reflector 4 is formed by applying a resin in a ring shape on the first surface 2a of the wiring board 2 and then curing the resin, and after applying the resin on the one-stage reflector 4a. It consists of a two-stage reflector 4b formed by curing a resin. Since the reflector 4 having the two-stage structure is thick, the resin can be injected thickly inside the reflector 4, and thus the resin body 7 can be thickened. Since the thickness of the resin body 7 is increased, the amount of light 8 reaching the inner peripheral surface of the reflector 4 is increased, and as a result, the amount of light radiated in front of the first surface 2a of the wiring board 2 as reflected light. Can be increased.

  As shown in FIGS. 1 and 3, the reflector 4 has a structure in which adjacent reflectors in each row extending in the X direction come into contact with each other. Thereby, since there is no gap between the reflector 4 and the reflector 4 in the X direction, the reflector row can be further shortened. As a result, the illumination device 1 can be shortened in the X direction. Moreover, when the dimension of the wiring board 2 is made constant, a vacant region is generated by bringing adjacent reflectors into contact with each other. Therefore, the LED light emitting unit 3 can be further arranged in this vacant region, so that the illumination device 1 light output can be increased.

  Next, a method for manufacturing the lighting device 1 will be described with reference to FIGS.

  First, a plurality of groups of LED chips having different wiring substrates 2 and emission wavelengths are prepared. In the embodiment, a plurality (a predetermined number) of three groups of LED chips 5 emitting red light, green light, and blue light are prepared.

  The wiring board 2 having the structure already described is prepared. FIG. 5 shows the first surface 2 a of the wiring board 2. As shown in FIG. 5, an insulating film 10 is selectively provided on the first surface 2a of the rectangular wiring board 2 as shown by dots. Although there is no particular limitation in the wiring board portion of FIG. 5, nine openings 11 (9 rows) formed in the X direction of the wiring board 2 and four openings (4 columns) in the Y direction are formed. Is provided.

  The openings 11 are uniformly arranged on the first surface 2 a of the wiring board 2. The opening 11 is rectangular, and a square support pad 12 for fixing the LED chip 5 is provided at the center thereof. The region for fixing the LED chip 5 is the support pad 12 portion. As a result, the LED chips 5 are uniformly arranged on the first surface 2 a of the wiring board 2. In FIG. 5, for convenience of explanation, characters R, G, B are marked on the upper edge side of the opening 11. R, G, and B indicate the emission colors of the LED chip 5 fixed to the support pad 12 in the opening 11. The arrangement of R, G, and B is the same as in FIGS.

  The support pad 12 is slightly larger than the square LED chip 5. A rectangular first electrode pad 13 and second electrode pad 14 are provided on the short side of the opening 11. The support pad 12, the first electrode pad 13, and the second electrode pad 14 are formed of a conductor layer as described above. In FIG. 5 as well, the second electrode pad 14 is shown in black. As described above, the first electrode pad 13 is electrically connected to one of the external electrode terminals 15R, 15G, and 15B via the wirings 16R, 16G, and 16B, and the second electrode pad 14 is connected to the wiring 16Z. Is electrically connected to the common external electrode terminal 15Z.

  Next, as shown in FIGS. 6 and 7, a predetermined LED chip 5 is fixed on the support pad 12 of each opening 11 with a bonding material (not shown). FIG. 6 is an enlarged view showing a portion including the opening 11, and FIG. 7 is a cross-sectional view taken along line BB in FIG. The exposed upper surface of the LED chip 5 becomes the first surface and becomes the light emitting surface. A first electrode (anode electrode) and a second electrode (cathode electrode) (not shown) are provided on the light emitting surface. Each support pad 12 has one of the LED chip 5 that emits red light (R), the LED chip 5 that emits green light (G), and the LED chip 5 that emits blue light (B). Fixed. The arrangement of R, G and B follows the arrangement shown in FIG.

  Next, as shown in FIGS. 6 and 7, the first electrode (anode electrode) of the LED chip 5 and the first electrode pad 13 are connected by the conductive wire 6 and the second electrode (cathode electrode). And the second electrode pad 14 are connected by a conductive wire 6.

  Next, as shown in FIGS. 8 and 9, the reflector 4 is formed so as to surround each opening 11. 8 is an enlarged plan view showing a state in which the LED chip 5 is mounted and the electrodes of the LED chip 5 and the electrode pads of the wiring board 2 are connected by the wires 6, and FIG. 9 is a cross-sectional view taken along the line CC in FIG. It is typical sectional drawing which shows the state which apply | coats resin.

  The reflector 4 is formed by a resin coating process in which a resin is formed in a ring shape on the wiring board 2 and a curing process process in which the resin is cured to form a cured body. For example, as shown in FIG. 9, a nozzle 20 of a resin supply tool (for example, a dispenser) that supplies resin is positioned on the application start position of the first surface 2 a of the wiring board 2. Thereafter, while discharging the resin 21 from the lower end of the nozzle 20, the nozzle 20 is moved along the pattern of the reflector that is an endless body, and returns to the application start position. Thereby, the endless body which forms a reflector with resin can be formed. Thereafter, the resin is cured and cured to form a reflector.

  In Example 1, a reflector is formed by applying resin twice. That is, the nozzle is moved annularly on the first surface 2a of the wiring substrate 2 to apply the resin in an annular shape to a predetermined portion of the first surface 2a of the wiring substrate 2, and then the resin is cured to make the one-stage reflector 4a. Form. Thereafter, as shown in FIG. 9, the resin 21 is applied by being overlapped on the first-stage reflector 4 a by the nozzle 20 to form the resin layer 21 a on the first-stage reflector 4 a. After the formation of the resin layer 21a, the resin layer 21a is cured to form the two-stage reflector 4b, and the reflector 4 is formed.

  In this example, the resin is cured twice, but a resin layer for forming the first-stage reflector 4a is formed, and then a resin layer for forming the second-stage reflector 4b is formed, and then the first-layer reflector 4a is formed. A method of curing both resin layers by a single curing process may be used. In this case, since the curing process is performed once, the working time can be shortened.

  Further, as shown in FIG. 9, the resin 21 uses a resin having a predetermined viscosity, so that the reflector has a semicircular arc cross section, and the inner peripheral surface of the reflector 4 emits light 8 generated by the LED chip 5. A reflection surface that can be reflected and guided forward of the first surface 2a of the wiring board 2 is formed.

  In the first embodiment, the reflectors 4 are aligned and formed so as to be aligned along the X direction and the Y direction in the XY direction of the wiring board 2. And it forms so that the reflector 4 which adjoins in the reflector row | line | column of each reflector 4 each arranged along a X direction may contact via a contact point. Therefore, the movement of the nozzle 20 in the resin coating process is performed by positioning the nozzle 20 on the coating start position on the first surface 2a of the wiring substrate 2 and then discharging the resin from the lower end of the nozzle 20 while discharging the resin. This is a process of applying the resin by one stroke returning to the application start position while moving the nozzle 20 along the pattern, and then performing a resin curing process for curing the resin.

  Here, a resin coating operation by one-stroke writing by a nozzle in a reflector row in which adjacent reflectors contact via a contact point from the −X direction to the + X direction will be described. Here, m reflectors (m rows) are arranged along the X direction.

  The resin application operation by the nozzle is performed in the rotational direction around the center of the endless body (annular body) by moving the nozzle moving along the reflector pattern (circular annular body) of the reflector which is an endless body. In the case of the clockwise movement or the counterclockwise movement, first, a) a predetermined position of the reflector pattern of any one of the first to m-th reflectors is set as the application start position of the nozzle.

  Next, b) the nozzle is moved clockwise or counterclockwise from the application start position and moved to the contact point with the adjacent reflector pattern on one movement direction side of the + X side or the −X side. Alternatively, when the contact point is set as the application start position, the position is kept as it is.

  Next, c) moving the nozzle from the contact point to the contact point with the next adjacent reflector pattern in the direction of rotational movement opposite to the previous clockwise movement or counterclockwise movement, or When the movement start position is on the contact point, the nozzle is moved to the adjacent contact point by moving clockwise or counterclockwise.

Next, d) causing the nozzle to repeat the operation of c) to move the nozzle to the application start position.
Thereby, the resin application operation by the nozzle is completed.

  Next, with reference to FIG. 10, a resin application operation by the nozzle 20 will be described as a specific example in which nine reflectors 4 are formed in the X direction. FIG. 10 shows a diagram in which the reflectors 1 (1 row) to 9 (9 rows) arranged in the XY direction of the first surface 2a of the wiring board 2 from the -X direction to the + X direction are arranged. It is. The intersections between the center line 24 of the reflector row and the contact point 25 between the reflectors 4 adjacent to each other are denoted by a to h from the -X direction to the + X direction.

  After the application start position 26 of the nozzle 20 is set to the −X end, the nozzle 20 is moved clockwise as indicated by the dotted arrow while discharging the resin 21 to move to the contact point 25. When the nozzle 20 that has moved in the clockwise direction exceeds the contact point a, the nozzle 20 changes to a counterclockwise movement and moves toward the contact point b as indicated by a dotted arrow. When the point b exceeds the contact point 25, the movement changes to the clockwise direction as indicated by the dotted arrow and moves toward the contact point c. In this way, while moving the nozzle 20 in the + X direction, every time it reaches each contact point 25, the rotational movement direction of the nozzle 20 is changed to a rotational movement direction opposite to the rotational movement direction before reaching the contact point 25. After moving to the h contact point 25, the movement from the counterclockwise movement is changed to the clockwise movement at the h contact point 25. When the movement returns to the h contact point 25 again, the movement from the clockwise movement to the counterclockwise movement is performed. Proceed to point 25. Thus, by changing the rotational movement direction of the nozzle 20 for each contact point 25, the nozzle 20 finally moves to the application start position 26 and returns. That is, the movement of the nozzle 20 overlaps the resin already applied at each contact point 25, but does not overlap the resin already applied and does not apply the resin, so that the resin is applied by so-called one-stroke writing.

  In this embodiment, the operation referred to as one-stroke writing is performed by continuously moving the tip of the nozzle 20 at a predetermined height of the first surface 2a of the wiring board 2 and discharging the resin 21 from the tip of the nozzle 20. The operation starts from the application start position 26 and returns to the application start position 26 without stopping midway.

  Further, it is possible to apply the resin by a single stroke by moving the nozzle 20 so as to reverse the movement described in FIG. That is, the nozzle 20 is moved counterclockwise from the application start position 26 of the nozzle 20 described in FIG. 10 to move to the contact point 25, and thereafter, the nozzle 20 is moved clockwise and counterclockwise repeatedly to repeat the application start position 26. Even in the method of returning to step 1, the resin can be applied by one stroke. The application start position may be the reflector pattern portion of any reflector 4.

  After the resin 21 is applied, the resin 21 is cured. For example, when a silicone resin is used as the resin 21, the resin 21 is cured by baking at a temperature of 150 ° C. for 300 minutes.

  In Example 1, the reflector 4 is formed by performing the second resin coating and curing process after the first resin coating and curing process. The inner peripheral surface of the reflector 4 formed by the two resin coating and curing processes constitutes a reflecting mirror surface.

  In forming the reflector 4, for example, by using the nozzle 20 having a resin application width (line width) of 0.4 mm, the reflector 4 having an outer diameter of 2.0 mm and an inner diameter of 1.2 mm is formed. Can do. The thickness of the reflector 4 is about 0.12 mm by the first resin coating and curing process, and the thickness of the reflector 4 is about 0.24 mm by the second resin coating and curing process. Further, an LED chip 5 made of a square having a side of about 0.4 mm is fixed to the center of each reflector 4.

  Note that the amount of resin discharged from the nozzle 20 may be controlled to decrease at each of the contact points 25, and the thickness may be the same as the coating thickness at other locations by two coatings.

  Next, an insulating and transparent resin is filled inside each reflector 4 so as to cover the LED chip 5 and the wire 6 and the like, and the resin body 7 is cured to form a resin body 7. The LED light emission part 3 as shown in FIG. 11 is formed. The resin body 7 constitutes a lens. As the resin, for example, a silicone resin is used. The lighting device 1 shown in FIG. 1 can be manufactured through the above steps.

  FIG. 12 shows a modification of the first embodiment. In this modified example, in the LED light emitting unit 3 of the first embodiment, the resin body 7 covering the LED chip 5 inside the reflector 4 gradually becomes thicker toward the center of the reflector 4, and the surface of the resin body 7 is curved. It has become. Since the resin body 7 serving as a lens has a hemispherical surface, light can be collected and emitted to the front of the first surface 2 a of the wiring board 2.

  In this modification, the connecting means between the first and second electrodes of the LED chip 5 and the first and second electrode pads 13 and 14 is flip-chip connection. That is, as shown in FIG. 12, the first electrode 30 and the second electrode 31 are provided on the first surface of the LED chip 5, and the first electrode 30 is overlapped with the first electrode pad 13 and connected. The second electrode 31 is connected to the second electrode pad 14 so as to overlap therewith. In the wire connection structure, the wire 6 having one end connected to the first and second electrodes of the LED chip 5 extends to the first and second electrode pads 13 and 14 positioned at the other end outside the LED chip 5. . Accordingly, the flip chip connection structure has a smaller area for the connection means than the wire connection structure, and the lighting device 1 can be reduced in size.

The first embodiment of the present invention has the following effects.
(1) On the first surface 2a of the wiring board 2, the reflectors 4 are arranged in the X and Y directions, and each reflector 4 emits light of any one of red, green, and blue. Since the diode chip 5 is fixed, the lighting device 1 emits white light in front of the first surface 2a of the wiring board 2. Since the lighting device 1 has a structure in which at least the reflector rows in the X direction out of the reflector rows arranged in the XY direction on the first surface 2a of the wiring board 2 are in contact with each other, the X-direction There is no unused space between the reflectors along, and the lighting device 1 can be downsized.

  (2) According to the above (1), on the first surface 2a of the wiring board 2, there is no unused space between the reflectors along at least the X direction. Therefore, in the case of the illumination device 1 having a predetermined size, More reflectors 4 can be arranged as compared with the prior art, and the output of the lighting device 1 can be improved.

  (3) On the first surface 2a of the wiring board 2, the formation of the reflector row at least along the X direction starts the nozzle 20 for applying the resin 21 from the application start position and finally moves to the application start position. Since it is performed by a one-stroke method, it can be formed in a short time, and the manufacturing cost of the lighting device 1 can be reduced.

  (4) A tall multi-layered structure is formed by repeating one or more strokes on the reflector row formed by one stroke, starting from the coating start position and finally moving the nozzle to the coating start position. A reflector 4 having a structure can be formed. As a result, the resin body 7 that is expected to have a lens action formed in the reflector 4 can be thickened.

  FIG. 13 is a schematic diagram showing a method of applying a resin to a wiring board with a single stroke to form a row of reflectors in the lighting apparatus that is Embodiment 2 of the present invention. In other words, this is another example of the one-stroke writing of the first embodiment. In FIG. 13, the reflector row is a diagram in which three reflectors 4 are arranged. However, in the same manner as in the first embodiment, m reflectors (m rows) are arranged along the X direction.

  The resin application operation by the nozzle is performed in the rotational direction around the center of the endless body (annular body) by moving the nozzle moving along the reflector pattern (circular annular body) of the reflector which is an endless body. In the case of the clockwise movement or the counterclockwise movement, first, a: a predetermined position of the reflector pattern of any one of the first to m-th reflectors is set as the application start position of the nozzle.

  Next, b: The nozzle is moved clockwise or counterclockwise from the application start position to the contact point with the adjacent reflector pattern on one movement direction side of the + X side or the −X side. Alternatively, when the contact point is set as the application start position, the position is kept as it is.

  Next, c: move the nozzle from the contact point to the contact point with the next adjacent reflector pattern in the same rotational movement direction as the previous clockwise movement or counterclockwise movement, or start moving the nozzle When the position is on the contact point, the nozzle is moved clockwise or counterclockwise to the adjacent contact point.

Next, d: causing the nozzle to repeat the operation c: to move the nozzle to the application start position.
Thereby, the resin application operation by the nozzle is completed.

  Next, with reference to FIG. 13, a resin coating operation by the nozzle 20 will be described as a specific example in which three reflectors 4 are formed in the X direction. FIG. 13 shows a diagram in which the reflectors No. 1 (1 row) to No. 3 (3 rows) arranged in the XY direction of the first surface 2a of the wiring board 2 from the -X direction to the + X direction are arranged. It is. Symbols a and b are given from the −X direction to the + X direction at the intersection of the center line 24 of the reflector row and the contact point 25 between the adjacent reflectors 4.

  After the application start position 26 of the nozzle 20 is set to the −X end, the nozzle 20 is moved clockwise as indicated by the solid line arrow while discharging the resin 21 and moved to the contact point 25. The nozzle 20 that has moved in the clockwise direction moves to the b contact point 25 by moving in the clockwise direction as indicated by the solid line arrow even when the a contact point 25 is exceeded. Even if the b contact point 25 is exceeded, the nozzle 20 moves clockwise as indicated by the solid arrow and returns to the b contact point 25. Thereafter, the nozzle 20 moves clockwise in the −X direction, passes through the b contact point 25 and the a contact point 25, and returns to the first application start position 26. In the second embodiment, when the nozzle 20 moves in the + X direction and the −X direction, the nozzle 20 always moves in the same rotational direction, that is, moves clockwise. In FIG. 13, the number of the reflector patterns is three.

  Also in the second embodiment, similarly to the first embodiment, the application amount of the resin 21 at the contact point 25 may be reduced, and the application thickness of the resin 21 at each position may be the same.

  The reflector row can also be written with a single stroke by the method of the second embodiment.

  FIG. 14 is a schematic diagram illustrating a method for applying a resin to a wiring board with a single stroke in order to form the arrangement of the reflector rows and the formation of a row of reflector rows in the lighting apparatus that is Embodiment 3 of the present invention. FIG. 14A is a schematic diagram showing an arrangement state of the reflector rows extending in a row in the X direction. FIG. 14B is a schematic diagram showing a method of applying a resin to the wiring board with a single stroke to form a row of reflectors.

  In the one-stroke writing according to the third embodiment, when the reflector 20 is formed by moving the nozzle 20 along the X direction, the nozzle 20 is always moved clockwise as in the second embodiment. In Example 3, the reflector 4 made of an endless body is a rectangular body. For the convenience of explanation, a reflector pattern composed of a rectangular body in FIG. 14 is denoted by a as the upper left vertex, b as the upper right vertex, c as the lower right vertex, and d as the lower left vertex. As shown in FIG. 14A, in the adjacent reflector pattern, the approximate center of the adjacent side protrudes to be a contact point 25 between the adjacent reflector pattern. When the thickness of the resin on the side constituting the reflector pattern facing the contact point 25 is the same as that of the other side, as shown in FIG. It is desirable to make it. When forming the contact point 25, as shown in FIG. 14B, the nozzle advances in the + X direction at a position e that is a course change point on the way between the sides bc, and between the sides ad of the adjacent reflector patterns. Move to position h, which is a course change point on the way. When the nozzle 20 advances in the −X direction, the nozzle 20 advances in the −X direction at a position g that is a course change point between the sides ad, and is a position that is a course change point between the sides bc of the adjacent reflector patterns. Move to f.

  The application of the resin by one stroke writing with the nozzles for forming the reflector row as shown in FIG. 14A is as shown in FIG. That is, when the application start position 26 of the nozzle 20 is set to the apex a of the first reflector pattern at the −X end, the nozzle 20 is moved clockwise as indicated by the solid line arrow while discharging the resin 21, and a, b , E, and moves from e to the next (second) reflector pattern h on the + X side. From h, the nozzle 20 moves clockwise, proceeds to e through a and b of the second reflector pattern, and again moves to h of the next (third) reflector pattern adjacent on the + X side. Next, from h of the third reflector pattern, the nozzle 20 moves clockwise and proceeds to e through a and b of the third reflector pattern, and again next (fourth) adjacent to the + X side. Move to h of the reflector pattern. Next, from h of the fourth reflector pattern, the nozzle 20 moves clockwise and moves to g of the fourth reflector pattern through a, b, c and d of the fourth reflector pattern.

  Thereafter, the nozzle 20 moves clockwise in the −X direction, and moves to f of the reflector pattern adjacent in the −X direction every time it reaches g of each reflector pattern. After moving to f of the first reflector pattern, the nozzle 20 moves clockwise, returns to a which is the application start position 26 through c and d of the reflector pattern, and finishes the resin coating operation. To do.

  Since a part of the resin 21 applied to the wiring board 2 (not shown) by the nozzle 20 flows on both sides, the width becomes wider than the resin discharge port of the nozzle. Therefore, by setting the distance between ef and hg to be narrow, the eh and fg resins 21 can come into contact with each other, and the endless reflector 4 can be formed. In order to reduce the dead space, the length between eh and the length between fg are made as short as possible.

  Effects similar to those of the first embodiment can be obtained also in the lighting device 1 having the reflector row and the manufacturing method thereof according to the third embodiment.

  FIGS. 15A and 15B are modifications of the third embodiment. FIG. 15A is a schematic diagram showing an arrangement state of reflector rows extending in a row in the X direction. FIG. 15B is a schematic diagram showing a method of applying a resin to the wiring board with a single stroke to form a row of reflector rows.

  In this modified example, as shown in FIG. 15B, the nozzle operation similar to that in the third embodiment is performed when the resin 21 is applied by the nozzle 20 at the portion where the contact point 25 connecting the adjacent reflectors 4 is formed. To do. However, the length of eh, the length of fg, the distance between ef, and the distance between hg are set to zero or a length (distance) close to zero, respectively.

  In such movement of the nozzle 20, the be and ha portions are applied with two layers of resin and applied twice, and the amount of the resin 21 increases and a part of the reflector pattern becomes wide and thick. In addition, the dg portion and the fc portion are also applied in layers and applied twice, so that the amount of the resin 21 increases and a part of the reflector pattern becomes wide and thick.

  Therefore, in the modified example, the resin discharge operation of the nozzle 20 is stopped (off) at the ha portion and the fc portion, as indicated by the dotted-line arrows so as not to be painted twice. Thereby, as shown to Fig.15 (a), the reflector row | line | column with which the rectangular reflector 4 used as an endless body can continue can be formed. Instead of stopping the resin discharge operation (off), when the nozzle 20 passes through the application portion twice, the first and second resin discharge amounts may be reduced.

  Effects similar to those of the first embodiment can be obtained also in the illumination device 1 having a reflector row and the manufacturing method thereof according to the modification of the third embodiment.

  In the modified example of the third embodiment, when the nozzle 20 moves, the discharge of the resin may be stopped, but the nozzle 20 starts from the application start position 26 and continuously moves without stopping in the middle. Since returning to 26, the application operation is performed with a single stroke.

  FIG. 16 is a schematic diagram showing a method of applying a resin to a wiring board with a single stroke to form a row of reflectors in a lighting apparatus that is Embodiment 4 of the present invention. FIG. 16A is a schematic diagram showing an arrangement state of reflector rows extending in a row in the X direction. FIG. 16B is a schematic diagram showing a method of applying a resin to a wiring board with a single stroke to form a row of reflectors.

  In the one-stroke writing according to the fourth embodiment, when forming the reflector row pattern by moving the nozzle 20 along the X direction, the nozzle 20 is moved clockwise or left each time it passes the contact point 25 as in the first embodiment. The reflector row pattern is formed by alternately changing the rotational movement.

  In Example 4, the reflector 4 made of an endless body is a hexagonal body. For convenience of explanation, the reflector pattern consisting of a hexagon is shown in FIG. 16 as a left-end vertex of the hexagon, a upper-left vertex b, upper-right vertex c, right-end vertex d, lower-right vertex e, lower-left vertex f To do. Further, the contact points 25 between the adjacent reflectors 4 are defined as p, q, r from the −X direction to the + X direction. p, q, and r are both a vertex (left end vertex) a and a vertex (right end vertex) d.

  Application of the resin by one-stroke writing with a nozzle for forming a reflector row as shown in FIG. 16A is as shown in FIG. That is, when the application start position 26 of the nozzle 20 is set to the left end vertex a of the first reflector pattern at the −X end, the nozzle 20 is moved clockwise as indicated by the solid line arrow while discharging the resin 21, and each vertex is moved. Rotate and move a, b, c, d. As a result, the nozzle 20 is positioned at the p contact point 25. From the p-contact point 25, the nozzle 20 moves counterclockwise and advances on the second reflector pattern to each vertex a, f, e, d, and is positioned at the q-contact point 25. The nozzle 20 moves clockwise from the q contact point 25 and advances on the third reflector pattern to the respective apexes a, b, c, and d, is located at the r contact point 25, and is closest to the + X direction side of the reflector row. Enter the reflector pattern located at.

  In the reflector pattern located on the most + X direction side of the reflector row, that is, in the last reflector pattern, the nozzle 20 moves counterclockwise from the r contact point 25 and moves counterclockwise until the next contact point 25 appears. This counterclockwise movement moves to each vertex a, f, e, d, c, b, a on the last reflector pattern, and returns to the r contact point 25 again.

  Thereafter, the nozzle 20 moves from the r contact point 25 in the −X direction as indicated by a dotted arrow. This movement moves clockwise from the r contact point 25 to each vertex d, e, f, a and is located at the q contact point 25, and moves from the q contact point 25 to each vertex d, c, b, a counterclockwise. The p-contact point 25 is moved to the apexes d, e, f, a clockwise from the p-contact point 25 to return to the application start position 26. Thereby, the resin application operation by the nozzle 20 is completed.

  Also in the fourth embodiment, the amount of the resin 21 discharged from the nozzle 20 may be reduced at the location to be the contact point 25 so that the same amount of resin as other portions is applied.

  Effects similar to those of the first embodiment can be obtained also in the lighting device 1 having the reflector row and the manufacturing method thereof according to the fourth embodiment.

  FIG. 17 is a schematic diagram showing a method of applying resin to a wiring board with a single stroke to form reflector rows arranged in contact with each other in a plurality of rows and a plurality of rows in a lighting apparatus that is Embodiment 5 of the present invention. FIG. FIG. 17 is a diagram showing a method of forming a reflector group with a single stroke when manufacturing an illumination device having a structure in which LED light emitting portions are arranged in four columns and four rows on a first surface of a wiring board (not shown). And in each reflector row | line | column in a reflector group, ie, each reflector row | line | column (for example, X direction) and row direction (for example, Y direction), adjacent reflectors contact (connect) at the contact point 25. It is configured. Although FIG. 17 shows four columns and four rows for convenience of explanation, in the embodiment, there are n columns and m rows.

  A one-stroke writing method for arranging and forming reflectors in n columns and m rows will be described below with reference to FIG. In FIG. 17, a group of circles (annular bodies) drawn with thick lines is the locus of the nozzle 20. For convenience of explanation, a circle (annular body) drawn with a thick line is also called a reflector 4 or a reflector pattern. The inner circle of each reflector 4 is the periphery of the resin 21 that is the inner diameter of the reflector 4, and the outer circle of each reflector 4 is the periphery of the resin 21 that is the outer shape of the reflector 4.

  In the first column, the contact points 25 between the adjacent reflector patterns are shown from the left to the right, that is, from the first row to the fourth row, with O, P, and Q attached thereto. Similarly, in the second column, the contact points 25 are R, S, and T, and in the third column, the contact points 25 are U, V, and W, and in the fourth column, they are X, Y, and Z. In the description of the trajectory by the nozzle, the contact point 25 in the first row is used, so that the contact points 25 are marked with A, from top to bottom in the first row, that is, from one column to four columns. Shown with B and C.

  In addition, the movement of the nozzle that moves along the reflector pattern of the reflector 4 that is an endless body is defined as a clockwise movement or a counterclockwise movement around the center of the endless body. The movement of moving from one reflector 4 adjacent to the other at the contact point 25 to the other reflector 4 is referred to as movement in the + X direction, movement in the −X direction, movement in the + Y direction, and movement in the −Y direction. To do.

  First, the locus formed by the movement of the nozzle 20 will be described. In FIG. 17, the reflectors 4 are arranged in 4 columns and 4 rows, but in the description, the locus of a reflector group in which the reflectors 4 are arranged in n columns and m rows will be described.

  In other words, the origin of the nozzle 20 in the formation of the trajectory, in other words, the application start position 26 is set, for example, as an O contact point 25 that is a contact point 25 between the reflector pattern in one column and one row and the reflector pattern in one column and two rows. An example will be described.

The locus is formed by a nozzle that performs the following operations.
(A) The nozzle 20 moves in the + X direction while moving clockwise from the O contact point 25 as indicated by an arrow b, and moves clockwise and moves in the + X direction each time it reaches each contact point in the row direction. Is repeated until the contact point of the (m−1) -th reflector pattern and the m-th reflector pattern. In FIG. 17, since each row is four rows, the nozzle 20 advances to a Q contact point 25, which is a contact point between the three rows of reflector patterns and the four rows of reflector patterns, as indicated by an arrow b.

  (B) Thereafter, the nozzle 20 moves clockwise from the contact point of the (m-1) rows of reflector patterns and the m rows of reflector patterns, thereby (m-1) rows of reflector patterns and m rows of reflector patterns. Proceed to the point of contact. That is, the nozzle 20 moves clockwise from the Q contact point 25 as indicated by an arrow c and returns to the Q contact point 25.

  (C) Next, the nozzle 20 moves in the −X direction while moving clockwise as indicated by an arrow d from the contact point of the (m−1) rows of reflector patterns and the m rows of reflector patterns. Each time the contact point in the column direction is reached, the clockwise movement and the movement in the −X direction are repeated to proceed to the contact point by the reflector pattern of one column and one row and the reflector pattern of one column and two rows. That is, the nozzle 20 returns from the Q contact point 25 to the O contact point 25 through the P contact point 25 by the clockwise movement and the movement in the −X direction.

  (D) Next, as shown by the arrow d, the nozzle 20 moves 45 degrees clockwise from the contact point (O contact point 25) by the reflector pattern of one column and one row and the reflector pattern of one column and two rows. Then, it moves to a contact point (A contact point 25) between the reflector pattern of one column and one row and the reflector pattern of two columns and one row. That is, the nozzle 20 moves from one reflector row to the contact point 25 of the reflectors 4 in the first row in the other reflector row adjacent thereto.

  (E) Next, as shown by the arrow e, the nozzle 20 moves clockwise by 45 degrees, and a contact point (R contact point 25) by the reflector pattern of 2 columns and 1 row and the reflector pattern of 2 columns and 2 rows. Proceed to

  (F) Next, as shown by arrows e, f, and g from the contact point (R contact point 25) by the reflector pattern of 2 columns and 1 row and the reflector pattern of 2 columns and 2 rows, the nozzle 20 The same movement as in (b) to (b) above proceeds to the contact point (U contact point 25) by the reflector pattern in the next row and the reflector pattern in the second row.

  (G) Next, the nozzle 20 repeats the above operation (f) and proceeds to a contact point by the reflector pattern of n columns and 1 row and the reflector pattern of n columns and 2 rows. In the embodiment, since the n rows are four rows, the nozzle 20 repeats the above-described operation (f) as shown by arrows h, i, j, k, and proceeds to the X contact point 25.

  (H) Next, the nozzle 20 reflects from the contact point by the reflector pattern of n columns and 1 row and the reflector pattern of n columns and 2 rows by the same movement as the above (a) to (c). Proceed to the contact point by the body pattern and the n-column 2-row reflector pattern. That is, the nozzle 20 returns to the X contact point 25 as indicated by arrows k, l, m.

  (I) Next, the nozzle 20 moves in the + Y direction while moving clockwise from the contact point by the reflector pattern of n columns and 1 row and the reflector pattern of n columns and 2 rows, that is, the X contact point 25, and the row. Each time a contact point in the direction is reached, a clockwise movement and a movement in the -Y direction are repeated, and a trajectory is formed by returning to the contact point by the reflector pattern of one column and one row and the reflector pattern of one column and two rows. . That is, in the embodiment, since the n columns are four columns, the nozzle 20 moves in the + Y direction while moving clockwise from the X contact point 25 as indicated by arrows n, o, and p, and in the row direction. Each time it reaches a point (C contact point 25, B contact point 25, A contact point 25), it repeats clockwise movement and movement in the + Y direction to make a reflector pattern with one column and one row and a reflector with one column and two rows. The trajectory is completed by returning to the O contact point 25 by the pattern. In forming the locus, the O contact point 25 is set as the application start position 26, but a desired position on the locus can be selected as the application start position.

  Then, in the one-stroke writing by the nozzle 20 that is actually performed, a desired position on the locus can be selected as the application start position 26. After the selection, the nozzle 20 is moved along the locus so as to coincide with the moving direction of the nozzle that forms the locus from the application start position 26, or the direction opposite to the moving direction of the nozzle that forms the locus. Then, the resin application operation is completed by moving along the locus and returning to the application start position 26.

  According to Example 5, in addition to the effect of Example 1, it has the following effect. That is, (1) In the XY-direction reflector row on the first surface 2a of the wiring board 2, adjacent reflectors in the X-direction reflector row are brought into contact with each other and also in the Y-direction reflector row. It is the structure which makes reflectors contact. As a result, there is no unused space (dead space) between the reflectors along the X direction, and there is no unused space (dead space) between the reflectors along the Y direction. Compared with the device 1, further downsizing of the lighting device can be achieved.

  (2) According to (1) above, there is no unused space (dead space) between the reflectors along the XY direction on the first surface 2a of the wiring board 2, so that the lighting device of a predetermined size In this case, more reflectors can be disposed as compared with the lighting device 1 of the first embodiment, and the output improvement of the lighting device can be further increased.

  (3) On the first surface 2a of the wiring board 2, the formation of the plurality of reflector rows along the XY direction is a one-stroke writing method in which the nozzle 20 for applying the resin 21 is moved from the application start position to the application start position. Therefore, it can be formed in a short time, and the manufacturing cost of the lighting device can be further reduced.

  18 and 19 are diagrams related to a lighting apparatus that is Embodiment 6 of the present invention. FIG. 18 is a schematic diagram showing a method of applying resin to a wiring board with a single stroke to form reflector rows arranged in contact with each other in two columns and two rows in the lighting device.

  FIG. 18 is an explanatory diagram of one-stroke drawing of the nozzles that form the reflectors 4 in two columns and two rows. That is, the first (row) and second (row) reflectors 4 arranged in the XY direction of the first surface of the wiring board (not shown) from the -X direction to the + X direction, and from the + Y direction to the -Y direction. This is an example of one-stroke writing in the reflector group 40 formed by one to two rows of reflectors 4 arranged side by side. Here, as shown in FIG. 18, the contact point 25 between the reflector 4 in the first row 1 and the reflector 4 in the second row 1 is N, and the reflector 4 in the first row 1 and the first row. A contact point 25 with the second reflector 4 is O, and a contact point 25 between the second-row first reflector 4 and the second-row second reflector 4 is P.

  In addition, the movement of the nozzle that moves along the reflector pattern of the reflector that is an endless body is referred to as a clockwise movement or a counterclockwise movement around the center of the endless body.

  In FIG. 18, a group of circles (annular bodies) drawn with thick lines is the locus of the nozzle 20. For convenience of explanation, a circle (annular body) drawn with a thick line is also called a reflector 4 or a reflector pattern. The inner circle of each reflector 4 is the periphery of the resin 21 that is the inner diameter of the reflector 4, and the outer circle of each reflector 4 is the periphery of the resin 21 that is the outer shape of the reflector 4.

First, the locus formed by the movement of the nozzle 20 will be described.
The origin of the nozzle 20 in the formation of the trajectory, in other words, the application start position 26 is, for example, an N contact point 25 that is a contact point 25 between the reflector pattern in one column and one row and the reflector pattern in two columns and one row. An example will be described.

The locus is formed by a nozzle that performs the following operations.
A: The nozzle 20 starts from the N contact point 25 and moves clockwise from the N contact point 25 to the O contact point 25 that is the contact point 25 in the first row and the first row and the contact point 25 in the first row and the second row.

  B: The nozzle 20 moves toward the + X direction so as to form the reflector 4 in one column and two rows from the O contact point 25 and moves counterclockwise to return to the O contact point 25.

  C: The nozzle 20 moves in the −X direction and moves 90 degrees clockwise so as to form the remainder of the reflector 4 in one column and one row from the O contact point 25, and proceeds to the N contact point 25.

  D: The nozzle 20 moves in the −Y direction and moves counterclockwise to the P contact point 25 so as to form the reflector 4 in two columns and one row from the N contact point 25.

  E: The nozzle 20 moves in the + X direction and moves clockwise to form the reflector 4 in two columns and two rows from the P contact point 25 and returns to the P contact point 25 again.

  F: The nozzle 20 moves clockwise from the P contact point 25 so as to form the remaining part of the reflector 4 in two columns and one row, and returns to the N contact point 25. This forms a trajectory.

  Then, in the one-stroke writing by the nozzle 20 that is actually performed, a desired position on the locus can be selected as the application start position 26. After the selection, the nozzle 20 is moved along the locus so as to coincide with the moving direction of the nozzle that forms the locus from the application start position 26, or the direction opposite to the moving direction of the nozzle that forms the locus. Then, the resin application operation is completed by moving along the locus and returning to the application start position 26.

  In the sixth embodiment, a reflector group with two columns and two rows can be formed with a single stroke, and the same effect as in the first embodiment can be obtained.

  FIG. 19 is a schematic plan view of the illuminating device 1 in which a plurality of reflector groups 40 arranged in two columns and two rows are arranged on the first surface 2 a of one wiring board 2. The lighting device 1 of the sixth embodiment is a wiring board 2 that has the same wiring pattern as the lighting device 1 of the first embodiment, although the wiring pattern is different. In the illuminating device 1 of FIG. 19, six reflector groups 40 are arranged in two columns and three rows in total. The thick circle is the reflector 4. In each reflector 4, five LED chips 5 indicated by R, G, and B are arranged. At the right end of the wiring board 2, four external electrode terminal groups including external electrode terminals 15R, 15G, and 15B and a common external electrode terminal 15Z are arranged. The electrical connection state between each external electrode terminal group and each LED chip 5 of each reflector 4 is indicated by a dotted line in FIG. The connection state between the external electrode terminals 15R, 15G, and 15B and the LED chips 5 in each row of the reflectors is shown in the fourth row of reflectors as shown in FIG. The electrical connection state between the common external electrode terminal 15Z and the LED chip 5 is the same as that in the first embodiment, and is omitted in FIG.

  In the illuminating device 1 of Example 6, the light emission part which consists of the reflector group 40 can be arrange | positioned in the area | region on the 1st surface 2a of the one wiring board 2, respectively, and it can be used as various lighting fixtures. For example, it can be used for car headlights, tail lamps, liquid crystal display light sources, and article lighting. Further, the number of the reflector groups 40 in each region may be a different number in part.

  20 to 24 are diagrams related to a lighting apparatus that is Embodiment 7 of the present invention. FIG. 20 is a plan view of the illumination device of the seventh embodiment. 21 to 24 are diagrams relating to a method of manufacturing the lighting device according to the seventh embodiment.

  The illuminating device 1 of Example 1 has a structure in which a plurality of rows of reflectors are arranged in the XY directions of the first surface 2a of the wiring board 2, respectively. On the other hand, the illuminating device 1 of Example 7 is the same as the illuminating device 1 of Example 1 except that the reflector 4 is 1 along the Y direction as shown in FIGS. 20 and 21. 4. In other words, the LED light emitting units 3 are arranged in a line. For this reason, the wiring board 2 has an elongated rectangular body, that is, a rectangular plate structure. In Example 7, the reflector 4 is an elliptical ring, and the end on the longer diameter side is a contact point 25 and is connected to the adjacent reflector 4.

  At the center of each reflector 4, an LED chip 5 that emits light of any one color of red (R), green (G), and blue (B) is fixed, and the whole structure emits white light. It has become. Although not shown, the LED chips 5 are arranged to repeat, for example, R, G, B, R, G, B. A structure in which a plurality of LED chips 5 are arranged inside the reflector 4 as in the sixth embodiment is also possible.

  A first electrode pad 13 and a second electrode pad 14 are arranged in the inner region of the elliptical reflector 4 and around the LED chip 5. The first electrode pad 13 and the first electrode (not shown) of the LED chip 5 are connected by a conductive wire 6. The second electrode pad 14 and the second electrode (not shown) of the LED chip 5 are connected by a conductive wire 6. The first electrode pad 13 is disposed on one end side of the elliptical reflector 4 on the longer diameter side, and the second electrode pad 14 is disposed on the other end side. In FIG. 19, the first electrode pad 13 is disposed on the left side of the LED chip 5, and the second electrode pad 14 is disposed on the right side of the LED chip 5.

  A wiring 16 a extends from the first electrode pad 13 to one side edge along the longitudinal direction of the wiring substrate 2. Similarly, the wiring 16 b extends from the second electrode pad 14 to one side edge along the longitudinal direction of the wiring board 2. The ends of the wiring 16a and the wiring 16b are exposed from the insulating film 10 provided on the first surface 2a of the wiring substrate 2 and become the first external electrode terminal 45 and the second external electrode terminal 46, respectively.

  As shown in FIGS. 21 and 22, the wiring board 2 has a conductor layer and an insulating film 10 on the first surface 2a side. FIG. 21 is a plan view of a wiring board used in the manufacturing method of the lighting device of Example 7, and FIG. 22 is an enlarged cross-sectional view along the line DD in FIG. One conductor layer forms the first electrode pad 13, the wiring 16a, and the first external electrode terminal 45, and one conductor layer forms the second electrode pad 14, the wiring 16b, and the second external electrode terminal 46. To do. One conductor layer constitutes a support pad 12 serving as a base for fixing the LED chip 5. The insulating film 10 is provided in the dotted area in FIG. For example, as shown in FIG. 21, a rectangular opening 47 is provided so that each support pad 12 and the first electrode pad 13 and the second electrode pad 14 on both sides thereof are exposed from the insulating film 10. An opening 48 is also provided at a portion corresponding to the tips of the wirings 16a and 16b. The exposed portions of the wirings 16 a and 16 b located in the opening 48 form the first external electrode terminal 45 and the second external electrode terminal 46.

  A transparent resin body 7 that covers the LED chip 5 and the wires 6 is provided on the inner side of the reflector 4 as in the first embodiment.

  In the illuminating device 1 of Example 7 as described above, by applying a predetermined voltage between the first external electrode terminal 45 and the second external electrode terminal 46 of each LED light emitting unit 3, red (R), Light of one of green (G) and blue (B) is emitted, and white light is emitted as a whole in front of the first surface 2a of the wiring board 2.

  If an example of the dimension of the LED light emission part 3 of the illuminating device 1 of Example 7 is given, the dimension of each part will be as follows. The outer shape of the elliptical reflector 4 is 2.7 mm in the X direction and 2.0 mm in the Y direction, and the outer shape of the inner diameter is 1.9 mm in the X direction and 1.2 mm in the Y direction. The line width (resin width) of the reflector 4 is 0.4 mm. The pitch in the X direction of the reflectors 4 is 2.3 mm. Further, when the reflector 4 is overcoated with resin twice, the thickness (height) of the reflector 4 is about 0.24 mm.

  The illuminating device 1 of Example 7 can be used as a light source for a backlight for liquid crystal, for example. That is, the lighting device 1 is mounted so that the ends of the first external electrode terminal 45 and the second external electrode terminal 46 (tip surfaces of the wirings 16a and 16b) overlap on the wiring board of the electronic device in which the liquid crystal device is incorporated. In such a case, a side-emitting illumination device (referred to as edge light) that emits light laterally is obtained. Therefore, if this edge light is arranged on one end side of the liquid crystal device, it can be used as a liquid crystal backlight.

  Next, a method for manufacturing the illumination device 1 according to the seventh embodiment will be described with reference to FIGS. First, the wiring board 2 shown in FIGS. 21 and 22 is prepared.

  Next, as shown in FIG. 23, the LED chip 5 is fixed on the support pad 12 of each opening 47 through a bonding material so that the light emitting surface and the first and second electrodes (not shown) are on the upper surface. .

  Next, as shown in FIG. 23, the one-stroke repetitive writing by the nozzle which has already explained the elliptical reflector 4 so as to surround the LED chip 5, the first electrode pad 13, the second electrode pad 14 and the wire 6 is repeated. The reflector row is formed by applying and curing the resin.

  Next, although not shown in the figure, a transparent resin is filled inside each reflector 4 so as to cover the LED chip 5, the wire 6, and the like, and the resin is cured to form a resin body 7. The illumination device 1 as shown in FIG. The LED chip 5 may be mounted on the wiring board 2 by flip chip connection.

  The invention made by the present inventor has been specifically described based on the embodiments. However, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the embodiment, the shape of the reflector 4 is an annular body including a circle and an ellipse, a quadrangle, and a hexagon, but may be another polygonal body such as an octagon.

It is a top view of the illuminating device which is Example 1 of this invention. It is a schematic diagram which shows the wiring state of each electrode of each LED light emission part in an illuminating device of Example 1, and an external electrode terminal. FIG. 3 is an enlarged plan view showing an LED light emitting unit of the illumination device of Example 1. It is sectional drawing which follows the AA line of FIG. FIG. 6 is a plan view of a wiring board used in the method for manufacturing the lighting device according to the first embodiment. It is an enlarged plan view which shows the part containing the opening part of the said wiring board. It is sectional drawing which follows the BB line of FIG. In the manufacturing method of the illuminating device of Example 1, it is an enlarged plan view which shows the state which mounted the LED chip and connected the electrode of the LED chip and the electrode pad of the wiring board with the wire. It is typical sectional drawing which shows the state which apply | coats resin in the cross section which follows the CC line | wire of FIG. In the manufacturing method of the illuminating device of Example 1, it is a schematic diagram which shows the resin application | coating method by one-stroke writing for forming the reflector row | line | column arranged in a line in a X direction. In the manufacturing method of the illuminating device of Example 1, it is a partial cross section figure which shows the state which formed the resin body inside the reflector which consists of annular bodies. FIG. 6 is a partial cross-sectional view illustrating a modification of the lighting device according to the first embodiment. It is a schematic diagram which shows the method of apply | coating resin to a wiring board by one stroke writing in order to form the row | line | column of a reflector in the illuminating device which is Example 2 of this invention. It is a schematic diagram which shows the arrangement | positioning state of the reflector row | line | column in the illuminating device which is Example 3 of this invention, and the method of apply | coating resin to a wiring board with one stroke for formation of a row of reflector row | line | columns. It is a schematic diagram which shows the arrangement | positioning state of the reflector row | line | column in the illuminating device which is the modification of Example 3 of this invention, and the method of apply | coating resin to a wiring board by one stroke drawing for formation of a row of reflector row | line | columns. It is a schematic diagram which shows the arrangement | positioning state of the reflector row | line in the illuminating device which is Example 4 of this invention, and the method of apply | coating resin to a wiring board by one stroke for formation of a row of reflector rows. It is a schematic diagram which shows the method of apply | coating resin to a wiring board in one stroke for formation of the reflector row | line | column arrange | positioned and arranged in contact with each other in a plurality of rows and multiple rows in the illumination device that is Embodiment 5 of the present invention. . It is a schematic diagram which shows the method of apply | coating resin to a wiring board in one stroke for formation of the reflector row | line | column arrange | positioned in contact with 2 columns 2 rows mutually arranged in the illuminating device which is Example 6 of this invention. . It is a typical top view of the illuminating device which has arrange | positioned the reflector row | line | column arranged in the said 2 columns 2 rows in multiple places on the 1st surface of one wiring board. It is a top view of the illuminating device which is Example 7 of this invention. It is a top view of the wiring board used for the manufacturing method of the illuminating device of Example 7. FIG. It is an expanded sectional view which follows the DD line of FIG. In the manufacturing method of the illuminating device of Example 7, it is a top view which shows the state which mounted the LED chip and connected the electrode of the LED chip and the electrode pad of the wiring board with the wire. In the manufacturing method of the illuminating device of Example 7, it is a top view which shows the state which formed the reflector row | line | column in the X direction by the application | coating of resin by one-stroke writing. It is a perspective view of the illuminating device proposed by the present applicant. It is an expanded sectional view which shows a part of illuminating device by the said applicant's proposal.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Illuminating device, 2 ... Wiring board, 2a ... 1st surface, 2b ... 2nd surface, 3 ... LED light emission part, 4 ... Reflector, 5 ... Light emitting diode chip (LED chip), 6 ... Wire, 7 ... resin body, 8 ... light, 10 ... insulating film, 11 ... opening, 12 ... support pad, 13 ... first electrode pad, 14 ... second electrode pad, 15R, 15G, 15B ... external electrode terminal, 15Z ... common external electrode terminals, 16R, 16G, 16B, 16Z ... wiring, 20 ... nozzle, 21 ... resin, 24 ... center line, 25 ... contact point, 26 ... application start position, 30 ... first electrode, 31 ... first 2 electrodes, 40 ... reflector group, 45 ... first external electrode terminal, 46 ... second external electrode terminal, 47, 48 ... opening, 70 ... lighting device, 71 ... wiring board, 71a ... first Surface, 71b ... second surface, 72 ... LED light emitting unit, 73 ... reflector, 74 ... ED chip, 75 ... support pad, 76 ... wire, 77 ... first electrode pad, 78 ... second electrode pad, 79 ... wire, 80 ... resin body, 81 ... insulating film, 82 ... light.

Claims (11)

A first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of light emitting diode chips arranged and mounted in the XY direction, A plurality of first electrode pads and second electrode pads electrically connected to the first electrode or the second electrode of the light emitting diode chip, respectively, and 1 electrically connected to the first electrode pad A wiring board having a plurality of first external electrode terminals and one or more second external electrode terminals electrically connected to the second electrode pad;
A plurality of pins fixed to the first surface of the wiring board and electrically connected to the first electrode pad and the second electrode pad respectively. A light emitting diode chip,
A reflector made of an endless body provided on the first surface of the wiring board so as to surround one or more of the light emitting diode chips;
A resin body formed of a transparent and insulating resin that fills the inside of the reflector and covers the light emitting diode chip;
The adjacent reflectors are arranged in contact with each other in the arrangement of the light emitting diode chips in at least the X direction of the XY directions of the wiring board,
The inner peripheral surface of the reflector is a reflecting surface that reflects light emitted from the light emitting diode chip and guides it forward of the first surface of the wiring board ,
The reflector has a structure in which a plurality of endless bodies formed of resin are stacked, and the inner peripheral surface of the reflector formed of the plurality of endless bodies constitutes a reflecting mirror surface. A lighting device. A first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of light emitting diode chips arranged and mounted in the XY direction, A plurality of first electrode pads and second electrode pads electrically connected to the first electrode or the second electrode of the light emitting diode chip, respectively, and 1 electrically connected to the first electrode pad A wiring board having a plurality of first external electrode terminals and one or more second external electrode terminals electrically connected to the second electrode pad;
A plurality of pins fixed to the first surface of the wiring board and electrically connected to the first electrode pad and the second electrode pad respectively. A light emitting diode chip,
A reflector made of an endless body provided on the first surface of the wiring board so as to surround one or more of the light emitting diode chips;
A resin body formed of a transparent and insulating resin that fills the inside of the reflector and covers the light emitting diode chip;
The adjacent reflectors are arranged in contact with each other in the arrangement of the light emitting diode chips in at least the X direction of the XY directions of the wiring board,
The inner peripheral surface of the reflector is a reflecting surface that reflects light emitted from the light emitting diode chip and guides it forward of the first surface of the wiring board,
The wiring board is an elongated rectangular body having a size in which the reflectors arranged in a plurality of rows in the XY direction are set to 1 along the Y direction and the reflectors are arranged in a row along the X direction,
A first electrode pad and a second electrode, which are electrically connected to the first electrode or the second electrode of the light emitting diode chip, respectively, inside each reflector on the first surface of the wiring board. The pad is located,
A first external electrode electrically connected to each of the first electrode pad and the second electrode pad on one side portion of the first surface of the wiring board along the longitudinal direction of the rectangular body A terminal and a second external electrode terminal are provided;
A light emitting diode chip that emits light of any one color of red, green, and blue is fixed in each reflector.
The light emitted in front of the first surface of the wiring board is white light as a whole. (A) a first surface and a second surface opposite to the first surface, and a plurality of light emitting diode chips arranged and mounted in the XY directions on the first surface; The first electrode pad and the second electrode pad respectively corresponding to and electrically connected to the first electrode or the second electrode of each light emitting diode chip, and electrically connected to the first electrode pad Preparing a wiring board having one or more first external electrode terminals to be connected and one or more second external electrode terminals electrically connected to the second electrode pad;
(B) preparing a plurality of groups of light emitting diode chips having different emission wavelengths;
(C) mounting each of the light emitting diode chips of each group on a predetermined region of the first surface of the wiring board, and the first and second electrodes of the light emitting diode chips and Electrically connecting the corresponding first electrode pad and the second electrode pad by connecting means;
(D) In all the light emitting diode chips mounted on the wiring board, a resin is applied to the first surface of the wiring board so as to swell endlessly so as to surround one or more of the light emitting diode chips, And curing to form an endless reflector,
(E) filling a transparent and insulating resin inside each of the reflectors, and curing the resin body to cover the light emitting diode chip; and
The reflectors are aligned and formed so as to be arranged along the X direction and the Y direction in the XY direction of the wiring board, and at least the reflectors adjacent to each other in each of the reflector rows arranged along the X direction. Is formed to contact through a contact point,
Formation of the reflector row in contact via the contact point is as follows:
After the predetermined position on the first surface of the wiring board is set as the application start position, the nozzle of the resin supply tool is positioned on the application start position, and then the reflector row while discharging the resin from the lower end of the nozzle A resin application step by one-stroke writing that returns to the application start position while moving the nozzle along the pattern;
Curing the resin;
The manufacturing method of the illuminating device characterized by the above-mentioned. In the XY direction, the application operation of the resin in the formation of the reflector row by the 1st to mth reflectors arranged from the −X direction to the + X direction,
When the movement of the nozzle that moves along the reflector pattern of the reflector that is an endless body is a clockwise movement or a counterclockwise movement in the rotation direction around the center of the endless body,
a) a predetermined position of the reflector pattern of any one of the reflectors of No. 1 to No. m as a coating start position of the nozzle;
b) Move the nozzle clockwise or counterclockwise from the application start position to the contact point with the adjacent reflector pattern on one movement direction side of the + X side or the −X side, or When the contact point is the application start position, the position is kept as it is,
c) Next, the nozzle is moved from the contact point to the contact point with the next adjacent reflector pattern in the direction of rotational movement opposite to the previous clockwise movement or counterclockwise movement, or the movement of the nozzle. If the starting position is on the contact point, the nozzle is moved clockwise or counterclockwise to the adjacent contact point,
4. The method of manufacturing an illumination device according to claim 3 , wherein the nozzle is moved to the application start position by repeating the operation of c). In the XY direction, the application operation of the resin in the formation of the reflector row by the 1st to mth reflectors arranged from the −X direction to the + X direction,
When the movement of the nozzle that moves along the reflector pattern of the reflector that is an endless body is a clockwise movement or a counterclockwise movement in the rotation direction around the center of the endless body,
a: a predetermined position of the reflector pattern of any one of the reflectors of No. 1 to No. m as a coating start position of the nozzle;
b: Move the nozzle clockwise or counterclockwise from the application start position to move to the contact point with the adjacent reflector pattern on one movement direction side of the + X side or the −X side, or When the contact point is the application start position, the position is kept as it is,
c: Next, the nozzle is moved from the contact point to the contact point with the next adjacent reflector pattern in the same rotational movement direction as the previous clockwise movement or counterclockwise movement, or the movement start position of the nozzle When the nozzle is on the contact point, the nozzle is moved clockwise or counterclockwise to the adjacent contact point,
4. The method of manufacturing an illumination device according to claim 3 , wherein the nozzle is moved to the application start position by repeatedly performing the operation of c: to the nozzle. The reflectors are aligned and formed so as to be aligned along the X and Y directions in the XY direction of the wiring board, and adjacent to each of the reflector rows aligned along the X and Y directions. The manufacturing method of the illuminating device according to claim 3 , wherein the reflectors are formed so as to contact each other through a contact point. In the XY direction, n columns m formed by 1 to m rows of reflectors arranged from the −X direction to the + X direction and 1 to n rows of reflectors arranged from the + Y direction to the −Y direction. The trajectory of the nozzle in the formation of the reflector group in a row is
When the movement of the nozzle that moves along the reflector pattern of the reflector that is an endless body is a clockwise movement or a counterclockwise movement in the rotation direction around the center of the endless body,
The nozzle is
(A) Each time the contact point by the reflector pattern of one column and one row and the reflector pattern of one column and two rows moves in the + X direction while moving clockwise, and reaches the contact point in the column direction, The clockwise movement and the activation in the + X direction are repeated to proceed to the contact point by the (m−1) -row reflector pattern and the m-row reflector pattern, and then the (m−1) -row reflector pattern and the The clockwise movement from the contact point by the m-th reflector pattern returns to the contact point by the (m-1) -th reflector pattern and the m-th reflector pattern, and the (m-1) -th row Each time it moves in the −X direction while moving clockwise from the contact point by the reflector pattern and the m-th row of reflector patterns, it moves in the clockwise direction and −X direction each time it reaches the contact point in the column direction. Repeat the above movement Proceeds to the contact point by reflector pattern of the first column 2 line and the reflector pattern of one row column,
(B) The reflector pattern of the first column and the first row and the reflection of the second column and the first row by moving 45 degrees clockwise from the contact point by the reflector pattern of the first column and the first row and the reflector pattern of the first column and the second row. Move to the contact point with the body pattern, then move clockwise by 45 degrees and proceed to the contact point by the reflector pattern of 2 columns and 1 row and the reflector pattern of 2 columns and 2 rows,
(C) From the contact point by the reflector pattern of the second column and the first row and the reflector pattern of the second column and the second row, the reflector of the next row by the same movement as the above (a) and (b) Proceed to the point of contact with the pattern and two rows of reflector patterns,
(D) The operation of (c) is repeated to proceed to the contact point by the reflector pattern of n columns and 1 row and the reflector pattern of n columns and 2 rows,
(E) From the contact point by the reflector pattern of the n column 1 row and the reflector pattern of the n column 2 row, the reflector pattern of the n column 1 row and the n column 2 row by the same movement as the above (a) Return to the contact point by the reflector pattern of
(F) Every time when moving in the + Y direction while moving clockwise and reaching the contact point in the row direction from the contact point by the reflector pattern of the n column and 1 row and the reflector pattern of the n column and 2 rows And repeating the clockwise movement and the movement in the + Y direction to return to the contact point by the reflector pattern of the first column and the first row and the reflector pattern of the first column and the second row,
In the one-stroke writing by the nozzle, a desired position on the locus is set as the application start position, and then the nozzle is moved from the application start position along the locus so as to coincide with a moving direction of the nozzle forming the locus. Or moving along the trajectory in a direction opposite to the moving direction of the nozzle forming the trajectory and returning to the application start position, thereby terminating the resin coating operation. Item 7. A method for manufacturing a lighting device according to Item 6 . The first and second reflectors arranged in the XY direction from the -X direction to the + X direction in the XY direction of the first surface of the wiring board, and the first to second rows of reflections arranged from the + Y direction to the -Y direction. The trajectory of the nozzle in the formation of the two-column, two-row reflector group formed by the body is
The contact point between the reflector in the first row and the first reflector in the second row is N, and the contact point between the reflector in the first row and the reflector in the first row is O. Let P be the contact point between the reflector in the first row and the reflector in the second row and the second,
When the movement of the nozzle that moves along the reflector pattern of the reflector that is an endless body is a clockwise movement or a counterclockwise movement in the rotation direction around the center of the endless body,
The nozzle is
A: Starting from the N contact point, moving clockwise from the N contact point and proceeding to the O contact point,
B: Moves counterclockwise from the O contact point so as to form a reflector with 1 column and 2 rows, and returns to the O contact point.
C: Move 90 degrees clockwise from the O contact point so as to form the remainder of the reflector in one column and one row, and proceed to the N contact point.
D: From the N contact point, move counterclockwise so as to form a reflector with 2 columns and 1 row, and proceed to the P contact point.
E: From the P contact point, it moves clockwise so as to form a reflector with 2 columns and 2 rows, and returns to the P contact point again.
F: formed by moving clockwise from the P contact point to form the remainder of the reflector in 2 columns and 1 row and returning to the N contact point;
In the one-stroke writing by the nozzle, a desired position on the locus is set as the application start position, and then the nozzle is moved from the application start position along the locus so as to coincide with a moving direction of the nozzle forming the locus. Or moving along the trajectory in a direction opposite to the moving direction of the nozzle forming the trajectory and returning to the application start position, thereby terminating the resin coating operation. Item 7. A method for manufacturing a lighting device according to Item 6 . The method of manufacturing an illumination device according to claim 3 , wherein the endless reflector is one of an annular body including a circle and an ellipse, and a polygonal body. The nozzle that moves from the application start position to the application start position on the reflector formed by a resin application method that moves the nozzle from the application start position while discharging resin and then moves the nozzle to the application start position again. 4. The method of manufacturing a lighting device according to claim 3 , wherein the reflector is formed in a multi-stage laminated structure by repeating the above operation one or more times. The manufacturing of the lighting device according to claim 3 , wherein when the nozzle crosses or overlaps the previously applied resin portion, the resin discharged from the nozzle is stopped or reduced. Method.

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