JP2013024966A - Optical component and lamp - Google Patents

Optical component and lamp Download PDF

Info

Publication number
JP2013024966A
JP2013024966A JP2011157670A JP2011157670A JP2013024966A JP 2013024966 A JP2013024966 A JP 2013024966A JP 2011157670 A JP2011157670 A JP 2011157670A JP 2011157670 A JP2011157670 A JP 2011157670A JP 2013024966 A JP2013024966 A JP 2013024966A
Authority
JP
Japan
Prior art keywords
light
led
lamp
body portion
optical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011157670A
Other languages
Japanese (ja)
Inventor
Fuyu Mizutani
芙由 水谷
Kenji Kawajiri
兼史 川尻
Hiroyuki Banba
広之 番場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwasaki Denki KK
Original Assignee
Iwasaki Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwasaki Denki KK filed Critical Iwasaki Denki KK
Priority to JP2011157670A priority Critical patent/JP2013024966A/en
Priority to NZ607838A priority patent/NZ607838A/en
Priority to PCT/JP2011/068394 priority patent/WO2012020830A1/en
Priority to AU2011290165A priority patent/AU2011290165B2/en
Publication of JP2013024966A publication Critical patent/JP2013024966A/en
Priority to AU2014233650A priority patent/AU2014233650B2/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Optical Elements Other Than Lenses (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent, even when light distribution of a plurality of LEDs is controlled, lowering of use efficiency of the LEDs while keeping light condensing performance.SOLUTION: A beam lamp optical component 46 is provided to an LED lamp 1 including a plurality of LEDs 15 as a light source and condenses and distributes light from the light source to a given range. The LEDs 15 each include condensation and distribution optical elements 47 integrally including condenser lenses 49 for collecting light incident from incident surfaces 49A and outputting the light from emission surfaces 49B and reflection surfaces 50 for reflecting the light deflected from the incident surfaces 49A to the emission surfaces 49B sides. Adjacent reflection surfaces 50 of the condensation and distribution optical elements 47 are overlapped with one another.

Description

本発明は、例えばLEDや有機EL等の発光素子を光源に備えたビームランプの集光性、及び効率の向上を図る技術に関する。   The present invention relates to a technique for improving the light condensing property and efficiency of a beam lamp having a light source such as an LED or an organic EL as a light source.

LEDの高出力化、及び低コスト化に伴い、電球の代替としてLEDランプが普及しており、近年では、配光に集光性を持たせて所定範囲(所定のビーム開き角の範囲)に集中配光するビームランプ型のLEDランプも実施されている。
ビームランプ型のLEDランプにおいて、配光に集光性を持たせたるための構成としては、LEDとは別体の光学部品にLEDの発光を入射させて配光を制御する構成が考え得る。
一方、LEDの利用効率、及び集光性を高める光学部品として、LEDの発光を集光して前方に照射するためのレンズと、このレンズの入射面から反れた光を前方に向けて反射する反射面とを一体に備えた光学部品が知られている(例えば、特許文献1、及び特許文献2参照)。
LED lamps are widely used as an alternative to light bulbs due to higher output and lower cost of LEDs. In recent years, light distribution has a light condensing property within a predetermined range (predetermined beam opening angle range). A beam lamp type LED lamp with concentrated light distribution is also implemented.
In the beam lamp type LED lamp, a configuration for concentrating the light distribution may be a configuration in which the light distribution is controlled by making the light emitted from the LED incident on an optical component separate from the LED.
On the other hand, as an optical component that improves the utilization efficiency and light condensing property of the LED, a lens for condensing the light emitted from the LED and irradiating it forward, and the light deflected from the incident surface of the lens is reflected forward. An optical component that is integrally provided with a reflecting surface is known (see, for example, Patent Document 1 and Patent Document 2).

特開2007−266242号公報JP 2007-266242 A 特開2007−142178号公報JP 2007-142178 A

従来の光学部品をビームランプ型のLEDランプの配光制御に用いることで、高い利用効率で良好な集光性が得られるが、LEDランプが複数のLEDを光源に備える場合には、次のような問題が生じる。
すなわち、複数のLEDを光源に備える場合、上記光学部品を各LEDに設けることとなるが、LEDランプのコンパクト化の要請からLEDの配置間隔には制限があり、隣接する光学部品間の干渉を防ぐために必然的に光学部品を小型化せざるを得えない。この結果、光学部品の小型化により、LEDの利用効率の低下を招くという問題が生じる。
By using conventional optical components for light distribution control of a beam lamp type LED lamp, good light collection can be obtained with high utilization efficiency. However, when the LED lamp includes a plurality of LEDs as a light source, Such a problem arises.
That is, when a plurality of LEDs are provided in the light source, the optical component is provided in each LED. However, there is a limitation in the arrangement interval of the LEDs due to a demand for compact LED lamps, and interference between adjacent optical components is caused. In order to prevent this, the optical components are inevitably downsized. As a result, there is a problem that the use efficiency of the LED is reduced due to the downsizing of the optical component.

本発明は、上述した事情に鑑みてなされたものであり、複数のLEDの配光を制御する場合でも、集光性を維持しつつ、LEDの利用効率の低下を招くことがない光学部品、及びランプを提供することを目的とする。   The present invention has been made in view of the circumstances described above, and even when controlling the light distribution of a plurality of LEDs, an optical component that does not cause a decrease in the utilization efficiency of the LEDs while maintaining the light collecting property, And to provide a lamp.

上記目的を達成するために、本発明は、複数の発光素子を光源に備えるランプに設けられ、前記光源の光を所定範囲に集中配光する光学部品であって、入射面から入射する光を集光して出射面から出力するレンズと、前記入射面から反れる光を前記出射面側に反射する反射面とを一体に有した光学素子を前記光源の発光素子ごとに備え、隣接する前記光学素子の反射面をラップさせたことを特徴とする。   In order to achieve the above object, the present invention provides an optical component that is provided in a lamp having a plurality of light emitting elements in a light source and distributes the light from the light source in a predetermined range in a concentrated manner. Each of the light sources of the light source includes an optical element integrally including a lens that collects and outputs from the exit surface and a reflection surface that reflects light deflecting from the entrance surface to the exit surface side. The reflective surface of the optical element is wrapped.

また本発明は、上記光学部品において、前記光学素子の各々の出射面に、前記光学素子の各々を一体的に覆う板状の透光部材を設けたことを特徴とする。   According to the present invention, in the above-described optical component, a plate-like light-transmitting member that integrally covers each of the optical elements is provided on the emission surface of each of the optical elements.

また上記目的を達成するために、本発明は、複数の発光素子を光源に備えるランプであって、前記光源の光を所定範囲に集中配光する光学部品を備え、前記光学部品は、入射面から入射する光を集光して出射面から出力するレンズと、前記入射面から反れる光を前記出射面側に反射する反射面とを一体に有した光学素子を前記光源の発光素子ごとに備え、隣接する前記光学素子の反射面をラップさせたことを特徴とする。   In order to achieve the above object, the present invention provides a lamp having a plurality of light emitting elements as a light source, and includes an optical component that concentrates and distributes light from the light source in a predetermined range, and the optical component includes an incident surface. For each light emitting element of the light source, an optical element integrally including a lens that collects light incident from the light source and outputs the light from the exit surface and a reflection surface that reflects light that is deflected from the entrance surface to the exit surface side And a reflection surface of the adjacent optical element is wrapped.

本発明によれば、複数の発光素子を備える光源の光を所定範囲に集中配光する光学部品において、入射面から入射する光を集光して出射面から出力するレンズと、入射面から反れる光を出射面側に反射する反射面とを一体に有した光学素子を前記光源の発光素子ごとに備え、隣接する光学素子の反射面をラップさせる構成とした。
この構成により、発光素子の発光を十分にレンズで集光し、かつレンズに入射しなかった光を十分に反射面で反射するように光学素子の寸法形状を設計した際に、当該光学素子の寸法よりも発光素子の配置間隔が狭い場合でも、光学素子をダウンサイズすることなく設けることができ、集光性、及び発光素子の利用効率の低下が抑えられる。
According to the present invention, in an optical component that concentrates and distributes light from a light source having a plurality of light emitting elements within a predetermined range, a lens that collects light incident from the incident surface and outputs the light from the output surface, An optical element that integrally has a reflection surface that reflects reflected light to the emission surface side is provided for each light emitting element of the light source, and the reflection surfaces of adjacent optical elements are wrapped.
With this configuration, when the dimensional shape of the optical element is designed so that the light emitted from the light emitting element is sufficiently collected by the lens and the light that has not entered the lens is sufficiently reflected by the reflecting surface, Even when the arrangement interval of the light emitting elements is narrower than the dimension, the optical elements can be provided without downsizing, and the light condensing property and the use efficiency of the light emitting elements can be suppressed.

本発明の実施形態に係るLEDランプを備えたLEDランプ装置を示す図である。It is a figure which shows the LED lamp apparatus provided with the LED lamp which concerns on embodiment of this invention. LEDランプの外観構成を示す斜視図であり、(A)は上方からみた外観斜視図、(B)は下方からみた外観斜視図である。It is a perspective view which shows the external appearance structure of an LED lamp, (A) is the external appearance perspective view seen from upper direction, (B) is the external appearance perspective view seen from the downward direction. LEDランプの外観構成を示す図であり、(A)は平面図、(B)は側面図、(C)は底面図である。It is a figure which shows the external appearance structure of an LED lamp, (A) is a top view, (B) is a side view, (C) is a bottom view. LEDランプを分解して示す上方斜視図である。It is an upper perspective view which decomposes | disassembles and shows an LED lamp. LEDランプを分解して示す下方斜視図である。It is a downward perspective view which decomposes | disassembles and shows an LED lamp. 図3(B)のI−I線における断面図である。It is sectional drawing in the II line | wire of FIG. 3 (B). ビームランプ用光学部品の構成を示す図であり、(A)は平面図、(B)は側面図、(C)は底面図である。It is a figure which shows the structure of the optical component for beam lamps, (A) is a top view, (B) is a side view, (C) is a bottom view. 集中配光光学素子の構成を示す図である。It is a figure which shows the structure of a concentrated light distribution optical element. 隣接した集中配光光学素子の作用を示す光線図である。It is a light ray diagram which shows the effect | action of the adjacent concentrated light distribution optical element. 隣接した集中配光光学素子のラップ量を示す図である。It is a figure which shows the amount of lap | wrapping of the adjacent concentrated light distribution optical element. 隣接した集中配光光学素子のラップ量を示す図である。It is a figure which shows the amount of lap | wrapping of the adjacent concentrated light distribution optical element.

以下、図面を参照して本発明の実施形態について説明する。
なお、以下の実施形態では、発光素子を光源に備えるランプとして、LEDを光源に備えたLEDランプを例示するが、本発明はこれに限定されるものではなく、例えば有機EL等の他の発光素子を光源に備えるランプにも適用可能である。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the following embodiments, an LED lamp having an LED as a light source is exemplified as a lamp having a light emitting element as a light source. However, the present invention is not limited to this, and other light emission such as an organic EL, for example. The present invention can also be applied to a lamp having an element as a light source.

図1は、本実施形態に係るLEDランプ1を備えたLEDランプ装置95を示す図である。
同図に示すLEDランプ装置95は、屋外の看板照明等に用いられる屋外設置型の照明器具であり、LEDランプ1と、LEDランプ1が装着されるランプホルダー60と、LEDランプ1に取り付けられた環状防水パッキン70とを備えている。
ランプホルダー60は、既存の電球を装着可能なホルダーであり、LEDランプ1は、既存の電球と形状及び光学特性が略同じになるように構成され、既存の電球の代わりにランプホルダー60に装着して使用可能となっている。
FIG. 1 is a diagram showing an LED lamp device 95 including the LED lamp 1 according to the present embodiment.
An LED lamp device 95 shown in the figure is an outdoor installation type lighting fixture used for outdoor signboard illumination and the like, and is attached to the LED lamp 1, a lamp holder 60 to which the LED lamp 1 is mounted, and the LED lamp 1. An annular waterproof packing 70 is provided.
The lamp holder 60 is a holder to which an existing light bulb can be mounted. The LED lamp 1 is configured to have substantially the same shape and optical characteristics as the existing light bulb, and is mounted on the lamp holder 60 instead of the existing light bulb. Can be used.

ランプホルダー60について詳細には、ランプホルダー60は、筒状のホルダー筐体62を備え、このホルダー筐体62の終端部62Aには、図示せぬ支持アームが回動自在に取り付けられるアーム取付部64が設けられている。
ホルダー筐体62の先端60Bは、既存の電球を装着したときに当該電球のガラス球の表面に図示せぬ防水パッキンを挟んで隙間無く係合する径で開口し、電球装着時には、当該開口縁部66からの水の浸入が防止されている。なお、同図において、ホルダー筐体62の先端60Bに設けられた突起68は、LEDランプ1、或いは既存の電球を覆って保護する網状のガード部材(図示せず)を固定するための部材である。
Specifically, the lamp holder 60 includes a cylindrical holder housing 62, and an arm mounting portion to which a support arm (not shown) is rotatably attached to a terminal portion 62 </ b> A of the holder housing 62. 64 is provided.
The front end 60B of the holder housing 62 opens with a diameter that engages with no gap on the surface of the glass bulb of the light bulb when the existing light bulb is mounted. Intrusion of water from the portion 66 is prevented. In the figure, a protrusion 68 provided at the tip 60B of the holder housing 62 is a member for fixing a net-like guard member (not shown) that covers and protects the LED lamp 1 or an existing light bulb. is there.

ホルダー筐体62の内部には、既存の電球ランプの口金、及びLEDランプ1の口金3が螺合するソケット65が配設されている。このソケット65には、外部から引き込まれた電力供給線が接続されており、ソケット65を通じて口金3からLEDランプ1、或いは、既存の電球ランプに電力が供給される。
環状防水パッキン70は、ゴム成型部材であり、LEDランプ1の胴体部2(後述)に着脱自在に装着され、LEDランプ1をランプホルダー60に装着したときにランプホルダー60の開口を塞ぎ、ランプホルダー60とLEDランプ1の隙間からの水の侵入を防止する。
なお、環状防水パッキン70は、ランプホルダー60への水の浸入防止を目的に使用されるため、例えば屋内に設置されたランプホルダー60、或いは、外部に露出したソケットにLEDランプ1を装着して使用する場合など、防水が不要な場合には、環状防水パッキン70を装着する必要はない。ただし、屋内使用時に環状防水パッキン70を装着することで、ほこり等の侵入を防止できる。
Inside the holder housing 62, a socket 65 into which the base of the existing bulb lamp and the base 3 of the LED lamp 1 are screwed is disposed. The socket 65 is connected to a power supply line drawn from outside, and power is supplied from the base 3 to the LED lamp 1 or the existing light bulb lamp through the socket 65.
The annular waterproof packing 70 is a rubber molding member, is detachably attached to a body portion 2 (described later) of the LED lamp 1, and closes the opening of the lamp holder 60 when the LED lamp 1 is attached to the lamp holder 60. Water intrusion from the gap between the holder 60 and the LED lamp 1 is prevented.
The annular waterproof packing 70 is used for the purpose of preventing water from entering the lamp holder 60. For example, the LED lamp 1 is attached to the lamp holder 60 installed indoors or a socket exposed to the outside. When waterproofing is not required, such as when used, it is not necessary to attach the annular waterproof packing 70. However, dust or the like can be prevented from entering by installing the annular waterproof packing 70 during indoor use.

次いで、LEDランプ1の構成について詳述する。
図2は本実施形態に係るLEDランプ1の外観構成を示す斜視図であり、図2(A)は上方からみた外観斜視図、図2(B)は下方からみた外観斜視図である。また、図3はLEDランプ1の外観構成を示す図であり、図3(A)は平面図、図3(B)は側面図、図3(C)は底面図である。図4はLEDランプ1を分解して示す上方斜視図であり、図5はLEDランプ1を分解して示す下方斜視図である。また図6は、図3(B)のI−I線における断面図である。
Next, the configuration of the LED lamp 1 will be described in detail.
2A and 2B are perspective views showing the external configuration of the LED lamp 1 according to the present embodiment. FIG. 2A is an external perspective view seen from above, and FIG. 2B is an external perspective view seen from below. FIG. 3 is a diagram showing an external configuration of the LED lamp 1, FIG. 3A is a plan view, FIG. 3B is a side view, and FIG. 3C is a bottom view. 4 is an upper perspective view showing the LED lamp 1 in an exploded manner, and FIG. 5 is a lower perspective view showing the LED lamp 1 in an exploded manner. FIG. 6 is a cross-sectional view taken along the line II of FIG.

本実施形態のLEDランプ1は、配光に集光性を有するビームランプ型として構成されており、上面12Aの中央部が若干膨出した円盤状の発光部12と、この発光部12の裏面の略中央から下方に向かって略垂直に延び終端に口金3を備える筒状部としての胴体部2と、発光部12の裏面に設けられた複数の放熱フィン25とを備え、さらに胴体部2には上記環状防水パッキン70が嵌め込まれている。
発光部12は、上面12Aの略全体から上方に向けて光を放射するものであり、図4に示すように、光源たる複数のLED15と、これらのLED15を実装した平面視略円形のLED基板16と、ビームランプ用光学部品46と、カバー22と、胴体部2の先端2Cに一体に設けられた平板部としてのベース板13とを備えている。
The LED lamp 1 according to the present embodiment is configured as a beam lamp type that has a condensing property for light distribution. A body portion 2 as a cylindrical portion that extends substantially perpendicularly downward from the center of the light source and has a base 3 at the end, and a plurality of heat radiation fins 25 provided on the back surface of the light emitting portion 12, and further includes a body portion 2. Is fitted with the annular waterproof packing 70.
The light emitting unit 12 emits light upward from substantially the entire upper surface 12A, and as shown in FIG. 4, a plurality of LEDs 15 serving as light sources and a substantially circular LED substrate mounted with these LEDs 15 in a plan view. 16, a beam lamp optical component 46, a cover 22, and a base plate 13 as a flat plate portion provided integrally with the distal end 2 </ b> C of the body portion 2.

ベース板13は、胴体部2よりも径が大きな上面視略円板状の部材であり、上記胴体部2は、このベース板13の裏面の略中央部から下方に向かって略垂直に延びている。ベース板13の表面には、図4に示すように、胴体部2に繋がる挿入開口14が開口し、LED15を点灯する電源(電力変換装置)や駆動回路を実装した電気回路基板8が挿入開口14から挿入されて胴体部2に収められる。
これらベース板13、及び胴体部2は同一の材料、すなわち熱伝導性樹脂材から金型を用いた樹脂成型によって一体に成型されており、これらベース板13、胴体部2、及び後述の絶縁筒部10により、LEDランプ1の筐体35が構成されている。
The base plate 13 is a substantially disk-shaped member having a larger diameter than the body portion 2 when viewed from above, and the body portion 2 extends substantially vertically downward from a substantially central portion on the back surface of the base plate 13. Yes. As shown in FIG. 4, an insertion opening 14 connected to the body portion 2 is opened on the surface of the base plate 13, and an electric circuit board 8 on which a power source (power conversion device) and a driving circuit for lighting the LED 15 are mounted is an insertion opening. 14 is inserted into the body part 2.
The base plate 13 and the body portion 2 are integrally formed from the same material, that is, a resin molding using a mold from a thermally conductive resin material. The base plate 13, the body portion 2, and an insulating cylinder described later. The housing 10 of the LED lamp 1 is configured by the unit 10.

LED15は、例えばLED素子をパッケージ化してなるものであり、本実施形態では、LED15に白色LEDが用いられている。なお、LED15に白色以外の他の発光色のLEDを用いても良いことは勿論である。
LED基板16は、図4、及び図5に示すように、略円板状に形成され、上面たる表面に複数のLED15が実装され、図4〜図6に示すように、ベース板13の上面にネジ18によりネジ止め固定されている。
The LED 15 is formed, for example, by packaging an LED element. In this embodiment, a white LED is used as the LED 15. Needless to say, an LED having a light emitting color other than white may be used for the LED 15.
The LED board 16 is formed in a substantially disc shape as shown in FIGS. 4 and 5, and a plurality of LEDs 15 are mounted on the upper surface, and the upper surface of the base plate 13 as shown in FIGS. 4 to 6. It is fixed with screws 18 by screws.

LED基板16の略中央には、リード線引出開口17が開口し、胴体部2に収められた電気回路基板8から電力供給用のリード線(図示せず)がリード線引出開口17を通じて引出されて、このLED基板16の上面に形成されている回路パターン80に電気的に接続され、当該回路パターン80を通じて各LED15に電力が供給されて点灯する。   A lead wire lead-out opening 17 is opened substantially at the center of the LED substrate 16, and a lead wire for power supply (not shown) is drawn out from the electric circuit board 8 housed in the body 2 through the lead wire lead-out opening 17. Then, the LED 15 is electrically connected to the circuit pattern 80 formed on the upper surface of the LED substrate 16, and power is supplied to each LED 15 through the circuit pattern 80 to light up.

ベース板13は、図4〜図6に示すように、平円板の周縁に沿って側壁19を有したトレー状を成し、この側壁19の内周面にLED基板16を覆うグローブとしてのカバー22が螺合して取り付けられている。このカバー22とベース板13の間にはOリング26が設けられており、カバー22を側壁19にねじ込むに伴い、Oリング26がカバー22とベース板13の間に挟み込まれる。このように、カバー22のベース板13への取付構造をネジ構造とするとともに、カバー22とベース板13との間にOリング26を挟み込むことで発光部12の防水性が高められている。
カバー22には、図示を省略するが、LEDランプ1の銘番を内面に印刷や刻印等で設けている。これにより、LEDランプ1が風雨に晒されても銘板が消えることがなく、また擦れによって消えたりすることもない。
As shown in FIGS. 4 to 6, the base plate 13 forms a tray shape having a side wall 19 along the periphery of the flat disk, and serves as a glove that covers the LED substrate 16 on the inner peripheral surface of the side wall 19. A cover 22 is attached by screwing. An O-ring 26 is provided between the cover 22 and the base plate 13, and the O-ring 26 is sandwiched between the cover 22 and the base plate 13 as the cover 22 is screwed into the side wall 19. As described above, the mounting structure of the cover 22 to the base plate 13 is a screw structure, and the waterproofness of the light emitting unit 12 is enhanced by sandwiching the O-ring 26 between the cover 22 and the base plate 13.
Although not shown, the cover 22 is provided with the name of the LED lamp 1 on the inner surface by printing, engraving, or the like. Thereby, even if the LED lamp 1 is exposed to wind and rain, the nameplate does not disappear and does not disappear due to rubbing.

ビームランプ用光学部品46は、LEDランプ1の発光部12の配光を制御する光学部品であり、LED15のそれぞれを覆う1つの部材として形成され、各LED15のそれぞれの発光の配光を制御してカバー22の上面12Aから放射することでビームランプ型の配光、すなわち、所定のビーム開き角の範囲への集中配光を実現する。このビームランプ用光学部品46の詳細な構成については後述する。   The beam lamp optical component 46 is an optical component that controls the light distribution of the light emitting unit 12 of the LED lamp 1, and is formed as one member that covers each of the LEDs 15, and controls the light distribution of each LED 15. By radiating from the upper surface 12A of the cover 22, a beam lamp type light distribution, that is, a concentrated light distribution within a predetermined beam opening angle range is realized. The detailed configuration of the beam lamp optical component 46 will be described later.

放熱フィン25は、ベース板13の裏面からみて胴体部2の周囲に放射状に設けられている。各放熱フィン25は、ベース板13の裏面から胴体部2に沿って延在するように設けられており、ベース板13に載置されたLED基板16が発する熱を放熱する。各放熱フィン25は、筐体35の射出成型時に胴体部2と一体に形成される。   The radiating fins 25 are provided radially around the body portion 2 when viewed from the back surface of the base plate 13. Each radiating fin 25 is provided so as to extend along the body part 2 from the back surface of the base plate 13, and radiates heat generated by the LED substrate 16 placed on the base plate 13. Each radiating fin 25 is formed integrally with the body portion 2 when the casing 35 is injection molded.

ところで、上述のLED基板16を熱伝導性の高い例えばアルミニウム材等の金属材で構成することで、LED15の発熱を効率良くベース板13に伝えて放熱フィン25から放熱させることができる。しかしながら、LED基板16を金属基板とすると電気的な絶縁性能が低下してしまう、という問題がある。
そこで本実施形態では、LED基板16に電気的絶縁性を有する樹脂基板を用い、その厚みを、いわゆる2重絶縁構造と同じ絶縁性能が得られる程度の厚みとし、高い絶縁性能を実現している。
ただし、樹脂材から成るLED基板16は、何ら対策を施さなければ、金属基板に比べて放熱性能が低いために、光出力の高出力化の妨げになる。
そこで本実施形態においては、LED基板16の表裏面のそれぞれを放熱層としての銅箔で覆うことでLED基板16の放熱性を高めることとしている。
By the way, the above-mentioned LED substrate 16 is made of a metal material such as an aluminum material having high thermal conductivity, so that the heat generated by the LED 15 can be efficiently transmitted to the base plate 13 and radiated from the radiation fins 25. However, when the LED substrate 16 is a metal substrate, there is a problem that the electrical insulation performance is deteriorated.
Therefore, in this embodiment, a resin substrate having electrical insulation is used for the LED substrate 16, and the thickness thereof is set to such a degree that the same insulation performance as that of a so-called double insulation structure can be obtained, thereby realizing high insulation performance. .
However, the LED substrate 16 made of a resin material has a low heat dissipation performance compared to a metal substrate unless any countermeasure is taken, and thus hinders an increase in light output.
Therefore, in the present embodiment, the heat dissipation of the LED substrate 16 is enhanced by covering the front and back surfaces of the LED substrate 16 with a copper foil as a heat dissipation layer.

具体的には、LED基板16の表裏面のそれぞれには、図3〜図5に示すように、導電性及び熱伝導性を有する放熱層として略円形の銅箔83が表面を覆って設けられている。各銅箔83は、LED基板16を囲む上記ベース板13の側壁19との間で電気的な絶縁が図れる程度の隙間、及び、LED基板16をネジ止めする際のネジ18との間の絶縁を図るための切り欠き83Aだけを除き、極力、LED基板16の表裏面を覆う大きさに形成されている。   Specifically, as shown in FIGS. 3 to 5, a substantially circular copper foil 83 is provided on each of the front and back surfaces of the LED substrate 16 as a heat dissipation layer having conductivity and thermal conductivity so as to cover the surface. ing. Each copper foil 83 is insulated between the gap surrounding the LED substrate 16 and the side wall 19 of the base plate 13 so as to be electrically insulated, and between the screw 18 when the LED substrate 16 is screwed. The LED board 16 is formed to a size that covers the front and back surfaces of the LED board 16 as much as possible, except for the notch 83A.

LED基板16の表裏面のうち、LED15のLED実装面には、複数のLED15が同心円状に実装されており、各LED15の回路パターン80が上記銅箔83を用いて形成されている。
すなわち、LED実装面では、図3及び図4に示すように、銅箔83に放射状に複数のスリット84が形成されており、各スリット84によって銅箔83が複数の略扇形の導電エリア85に分割(区画)される。各スリット84は、導電エリア85の間の電気的な絶縁を得るに十分な幅を有し、各スリット84には、LED15の裏面に設けられた正極端子及び負極端子(不図示)をそれぞれ隣り合う導電エリア85に接続するようにスリット84を跨いでLED15が設けられている。また、これらの導電エリア85のうち、少なくとも、隣接する2つの導電エリア85は、それぞれ電気回路基板8の電源回路に電気的に接続されており、これにより、各LED15が、各導電エリア85によって直列に接続された直列回路が形成される。
Among the front and back surfaces of the LED substrate 16, a plurality of LEDs 15 are mounted concentrically on the LED mounting surface of the LED 15, and the circuit pattern 80 of each LED 15 is formed using the copper foil 83.
That is, on the LED mounting surface, as shown in FIGS. 3 and 4, a plurality of slits 84 are formed radially on the copper foil 83, and the copper foil 83 is formed into a plurality of substantially fan-shaped conductive areas 85 by each slit 84. Divided (partitioned). Each slit 84 has a sufficient width to obtain electrical insulation between the conductive areas 85, and each slit 84 is adjacent to a positive electrode terminal and a negative electrode terminal (not shown) provided on the back surface of the LED 15. The LED 15 is provided across the slit 84 so as to connect to the matching conductive area 85. Of these conductive areas 85, at least two adjacent conductive areas 85 are electrically connected to the power supply circuit of the electric circuit board 8, so that each LED 15 is connected by each conductive area 85. A series circuit connected in series is formed.

このように、LED実装面を覆う銅箔83をスリット84によって、電源回路に電気的に接続する面状の導電エリア85に区画し、このスリット84を跨いでLED15を各導電エリア85に電気的に接続して、当該LED15を点灯するための回路パターン80を構成したため、LED実装面に高い放熱性が得られる。
特に、銅箔83にスリット84を放射状に設けたため、各導電エリア85が略扇形に形成されることとなり、各導電エリア85では径方向外側に向かうほど熱抵抗が小さくなることから、LED15の発熱を効率良く外側に伝達して拡散させることができる。
In this way, the copper foil 83 covering the LED mounting surface is partitioned by the slit 84 into a planar conductive area 85 that is electrically connected to the power supply circuit, and the LED 15 is electrically connected to each conductive area 85 across the slit 84. Since the circuit pattern 80 for lighting the LED 15 is configured by connecting to the LED 15, high heat dissipation is obtained on the LED mounting surface.
In particular, since the slits 84 are provided radially in the copper foil 83, each conductive area 85 is formed in a substantially fan shape, and in each conductive area 85, the heat resistance decreases toward the outside in the radial direction. Can be efficiently transmitted to the outside and diffused.

LED基板16の裏面側では、図5に示すように、銅箔83のうち、胴体部2の挿入開口14に対応する箇所をくり抜いて絶縁樹脂製のLED基板16を露出させた露出部16Aが設けられている。これにより、挿入開口14に挿入された電気回路基板8に対向する箇所が露出部16Aとなるため、電気回路基板8との間の電気的な絶縁性が維持される。
このとき、銅箔83に露出部16Aを設ける分だけ、放熱性能が低くなるものの、この露出部16Aには、ベース板13に載置固定されたLED基板16で押されて電気回路基板8を胴体部2の底部に押しつける後述の固定ブッシュ27が密着するように構成されている。この固定ブッシュ27には、胴体部2に密着する冷却用片27Aが一体に形成されており、露出部16Aの熱は、固定ブッシュ27の冷却用片27Aを通じて胴体部2に伝熱され、露出部16Aの過度な温度上昇を防止できる。
On the back surface side of the LED substrate 16, as shown in FIG. 5, an exposed portion 16 </ b> A in which a portion of the copper foil 83 corresponding to the insertion opening 14 of the body portion 2 is cut out to expose the insulating resin LED substrate 16. Is provided. Thereby, since the location which opposes the electric circuit board 8 inserted in the insertion opening 14 becomes the exposed part 16A, the electrical insulation between the electric circuit boards 8 is maintained.
At this time, although the heat radiation performance is lowered by the amount of the exposed portion 16A provided on the copper foil 83, the electric circuit board 8 is pressed against the exposed portion 16A by the LED substrate 16 mounted and fixed on the base plate 13. A fixing bush 27 (described later) that presses against the bottom of the body portion 2 is configured to be in close contact. The fixed bush 27 is integrally formed with a cooling piece 27A that is in close contact with the body portion 2, and the heat of the exposed portion 16A is transferred to the body portion 2 through the cooling piece 27A of the fixed bush 27 and exposed. The excessive temperature rise of the part 16A can be prevented.

なお、放熱層として銅箔83を例示したが、これに限らず、熱伝導性と、電気配線として機能し得る導電性を有する材料であれば、任意のものを用いることができる。また、LED基板16の表裏面の放熱層の材料が同一である必要はない。
さらに、回路パターン80はLED15の直列回路に限らず、並列回路等の任意の回路とすることができる。
In addition, although copper foil 83 was illustrated as a thermal radiation layer, it is not restricted to this, Arbitrary things can be used if it is the material which has heat conductivity and the electroconductivity which can function as an electrical wiring. Further, the material of the heat dissipation layer on the front and back surfaces of the LED substrate 16 need not be the same.
Furthermore, the circuit pattern 80 is not limited to the series circuit of the LEDs 15 and may be an arbitrary circuit such as a parallel circuit.

次いで、胴体部2の口金3の構成について説明する。
胴体部2の終端2Aには、口金3と胴体部2の絶縁を図るために、絶縁性を有する材料から形成された筒状の絶縁筒部10が設けられており、図6に示すように、この絶縁筒部10の終端10Aに上記口金3が冠着されている。電気回路基板8は、胴体部2から絶縁筒部10に亘って収められており、絶縁筒部10側の端部で図示せぬリード線を通じて口金3と電気的に接続されている。
Next, the configuration of the base 3 of the body part 2 will be described.
The end 2A of the body portion 2 is provided with a cylindrical insulating tube portion 10 made of an insulating material in order to insulate the base 3 and the body portion 2, as shown in FIG. The base 3 is attached to the terminal end 10A of the insulating cylinder 10. The electric circuit board 8 is accommodated from the body part 2 to the insulating cylinder part 10, and is electrically connected to the base 3 through a lead wire (not shown) at an end part on the insulating cylinder part 10 side.

口金3は、既設のランプホルダー60のソケット65(例えばE26型ソケット)に螺合するネジ山が切られた筒状のシェル5と、このシェル5の端部の頂部に絶縁部6を介して設けられたアイレット7とを備え、シェル5及びアイレット7が既存のソケットに装着可能な形状寸法に構成されている。これにより、当該LEDランプ1は、天井や壁面に既設のソケットや、既存の電球を装着して使用する上記ランプホルダー60のソケット65に装着でき、既存の電球の代替として使用できる。
シェル5と胴体部2とは、上述のように、絶縁筒部10によって電気的に絶縁されていることから、胴体部2の放熱性を高めるべく導電性を有する材料で構成しても、口金3のシェル5と胴体部2との間の絶縁が良好に維持される。
The base 3 includes a cylindrical shell 5 that is threaded into a socket 65 (for example, an E26 type socket) of an existing lamp holder 60, and an insulating portion 6 at the top of the end of the shell 5. The shell 5 and the eyelet 7 are configured to have a shape and size that can be attached to an existing socket. Thereby, the said LED lamp 1 can be mounted | worn with the socket 65 of the said lamp holder 60 which mounts and uses the existing socket and the existing light bulb, and can use it as an alternative of the existing light bulb.
Since the shell 5 and the body portion 2 are electrically insulated by the insulating cylinder portion 10 as described above, even if the shell 5 and the body portion 2 are made of a conductive material to improve the heat dissipation of the body portion 2, The insulation between the shell 5 and the body part 2 is maintained well.

ところで、胴体部2にアルミニウム等の金属材料を用いることで高い放熱性能が得られるものの当該胴体部2を含む筐体35が重くなることから、既設のソケットでは強度が不足することがあり、また胴体部2が金属材であるのに対し絶縁筒部10が非金属材となることから、胴体部2と絶縁筒部10の接合が弱くなる、という問題もある。
そこで本実施形態では、胴体部2の材料に熱伝導性樹脂を用いるとともに、絶縁筒部10の材料に絶縁性樹脂を用い、胴体部2及び絶縁筒部10をインサート成型により形成している。
By the way, although a high heat dissipation performance can be obtained by using a metal material such as aluminum for the body part 2, the casing 35 including the body part 2 becomes heavy, so that the existing socket may have insufficient strength. Since the body portion 2 is a metal material and the insulating cylinder portion 10 is a non-metal material, there is also a problem that the bonding between the body portion 2 and the insulating cylinder portion 10 is weak.
Therefore, in the present embodiment, a heat conductive resin is used as the material of the body portion 2, and an insulating resin is used as the material of the insulating cylinder portion 10, and the body portion 2 and the insulating cylinder portion 10 are formed by insert molding.

胴体部2を熱伝導性樹脂から形成することで、アルミニウム等の金属材料で筐体35を形成したときよりもLEDランプ1の軽量化が図られ、電球の代替としてLEDランプ1を既存のソケットや既存のランプホルダー60に装着する場合でも、当該LEDランプ1の重量を支えるために既存のソケットや既存のランプホルダー60を補強する作業や部材が必要なく、そのまま使用することができる。また軽量化により、放熱フィン25の枚数を増やすことができるので、表面積が増え、より効率的に放熱性を高めることができる。このような熱伝導性樹脂としては、熱伝導率が2W/mK以上の熱伝導性に優れた樹脂材が好ましく、例えば高熱伝導性のカーボン繊維(本実施形態では帝人(株)製ラヒーマ(登録商標))を混入したポリカーボネイト樹脂を好適に用いることができる。   By forming the body portion 2 from a heat conductive resin, the LED lamp 1 can be lighter than when the housing 35 is formed of a metal material such as aluminum, and the LED lamp 1 can be replaced with an existing socket as an alternative to a light bulb. Even when it is mounted on the existing lamp holder 60, there is no need to reinforce the existing socket or the existing lamp holder 60 in order to support the weight of the LED lamp 1, and it can be used as it is. Moreover, since the number of the radiation fins 25 can be increased by reducing the weight, the surface area can be increased and the heat dissipation can be improved more efficiently. As such a heat conductive resin, a resin material having a heat conductivity of 2 W / mK or more and excellent heat conductivity is preferable. For example, a highly heat conductive carbon fiber (in this embodiment, Lahima manufactured by Teijin Ltd. (registered) A polycarbonate resin mixed with a trademark)) can be suitably used.

胴体部2と絶縁筒部10とを樹脂材のインサート成型により一体に形成することで接合が強固なものとなるが、経年劣化により、胴体部2と絶縁筒部10との接合面(合わせ面)に隙間が生じ防水性が損なわれるおそれがある。
そこで、図6に示すように、胴体部2の終端2Aには、胴体部2の径方向内側に突出する係合凸部2Bを形成するとともに、絶縁筒部10の開口端手前の外周面には、内面側に窪んだ環状の係合凹部10Bを形成し、また絶縁筒部10の開口端には胴体部2の内周面及び係合凸部2Bに当接する当接部10Cを形成している。
この係合凸部2Bが係合凹部10Bに係合するとともに当接部10Cが胴体部2に当接することで、胴体部2と絶縁筒部10との接合部が、いわゆるラビリンス状に構成され、また、この接合部の面積が大きくなって接合強度が高められている。このラビリンス状の構成により、胴体部2と絶縁筒部10との接合部に経年劣化によるひび割れ等によりインサート成型面に隙間が生じた場合でも防水性が維持され、LED15の寿命に見合った耐久性が得られる。
なお、胴体部2の終端2Aと絶縁筒部10の開口端(挿入端)との接合面の形状は、上記ラビリンス状に限らず、防水性と接合強度の向上が得られる形状であれば例えば楔状等の任意の形状とできる。
The body part 2 and the insulating cylinder part 10 are integrally formed by insert molding of a resin material, so that the joining becomes strong, but due to aging deterioration, the joining surface (the mating face) between the body part 2 and the insulating cylinder part 10 ) May cause a gap and may impair waterproofness.
Therefore, as shown in FIG. 6, the end 2 </ b> A of the body part 2 is formed with an engagement convex part 2 </ b> B protruding radially inward of the body part 2, and on the outer peripheral surface in front of the opening end of the insulating cylinder part 10. Is formed with an annular engaging recess 10B that is recessed on the inner surface side, and an abutting portion 10C that contacts the inner peripheral surface of the body portion 2 and the engaging protrusion 2B is formed at the opening end of the insulating cylinder portion 10. ing.
The engaging convex portion 2B engages with the engaging concave portion 10B and the abutting portion 10C abuts on the trunk portion 2, so that the joint portion between the trunk portion 2 and the insulating cylinder portion 10 is formed in a so-called labyrinth shape. In addition, the area of the joint is increased and the joint strength is increased. With this labyrinth-like configuration, waterproofness is maintained even when a gap occurs in the insert molding surface due to cracks due to aging, etc. at the joint between the body portion 2 and the insulating cylinder portion 10, and durability corresponding to the life of the LED 15 Is obtained.
The shape of the joint surface between the terminal end 2A of the body portion 2 and the opening end (insertion end) of the insulating cylinder portion 10 is not limited to the labyrinth shape, and may be any shape that can improve waterproofness and joint strength. It can be any shape such as a wedge shape.

次いで、胴体部2への電気回路基板8の収容構造について更に説明する。
電気回路基板8は、図6に示すように、胴体部2の先端2Cから絶縁筒部10に亘る長さに形成され、また、図4、及び図5に示すように、胴体部2及び絶縁筒部10の内部形状に係合する形状を有して形成されている。
すなわち、胴体部2の上部直径R(図6)は、電気回路基板8の上部横幅と略同程度に形成されており、かかる電気回路基板8が胴体部2に挿入されると、絶縁筒部10の内部に形成された挟持部(図示せず)に電気回路基板8の下端が挟み込まれて電気回路基板8が胴体部2内に固定される。
Next, a structure for housing the electric circuit board 8 in the body portion 2 will be further described.
As shown in FIG. 6, the electric circuit board 8 is formed to have a length extending from the distal end 2C of the body part 2 to the insulating cylinder part 10, and as shown in FIGS. It is formed to have a shape that engages with the internal shape of the cylindrical portion 10.
That is, the upper diameter R (FIG. 6) of the body part 2 is formed to be approximately the same as the upper lateral width of the electric circuit board 8, and when the electric circuit board 8 is inserted into the body part 2, the insulating cylinder part The lower end of the electric circuit board 8 is inserted into a holding part (not shown) formed inside the electric circuit board 8, and the electric circuit board 8 is fixed in the body part 2.

このとき、胴体部2にあっては上部直径Rを電気回路基板8の上部幅程度まで小さくしてコンパクト化を図ると、胴体部2に電気回路基板8が近接し、胴体部2と電気回路基板8との間の電気的な絶縁性能が劣化する。そこで、胴体部2の中には、電気回路基板8を囲むように巻いた絶縁シート28を設けており、胴体部2の内側面の全体を絶縁シート28で覆い、電気回路基板8と胴体部2の間の絶縁性能を高めることとしている。
絶縁シート28は、可撓性及び絶縁性を有する1枚のシートを帯状に形成したものであり、胴体部2への装着時には、かかる1枚の帯状シートに胴体部2の延在方向に沿って延びる凹部28C(図4)を折り曲げによって形成した後、帯状シートの両端同士を重ねるように環状に巻き、凹部28Cを胴体部2の内部の係合片(図示せず)に係合させながらベース板13の挿入開口14から挿入する。
胴体部2に挿入すると、絶縁シート28が巻き戻りによって拡がり、このときの巻き戻る力によって胴体部2の内側面を覆うように装着される。
このように、絶縁シート28を帯状に形成し、巻いた状態でベース板13の挿入開口14に挿入し、絶縁シート28の巻き戻りによって胴体部2の中に装着する構成としたため、胴体部2の内側面の全面を覆うように絶縁シート28を簡単に装着することができる。
At this time, if the upper diameter R of the body portion 2 is reduced to about the upper width of the electric circuit board 8 to achieve compactness, the electric circuit board 8 comes close to the body section 2 and the body section 2 and the electric circuit are connected. The electrical insulation performance with the substrate 8 deteriorates. Therefore, an insulating sheet 28 wound around the electric circuit board 8 is provided in the body part 2, and the entire inner surface of the body part 2 is covered with the insulating sheet 28, so that the electric circuit board 8 and the body part are covered. The insulation performance between the two is to be improved.
The insulating sheet 28 is formed by forming a single sheet having flexibility and insulation into a strip shape. When the insulating sheet 28 is attached to the body portion 2, the insulating sheet 28 extends along the extending direction of the body portion 2. After the concave portion 28C (FIG. 4) extending by bending is formed by bending, the belt-like sheet is wound in an annular shape so as to overlap each other, and the concave portion 28C is engaged with an engagement piece (not shown) inside the body portion 2. Inserted from the insertion opening 14 of the base plate 13.
When inserted into the body part 2, the insulating sheet 28 is expanded by rewinding, and is mounted so as to cover the inner surface of the body part 2 by the rewinding force at this time.
In this way, the insulating sheet 28 is formed in a band shape, inserted into the insertion opening 14 of the base plate 13 in a wound state, and mounted in the body part 2 by rewinding the insulating sheet 28, so that the body part 2 The insulating sheet 28 can be easily attached so as to cover the entire inner surface of the cover.

胴体部2に収められた電気回路基板8は、図6に示すように、上端部8Cが固定ブッシュ27を介してLED基板16によって押圧されて強固に固定される。この固定ブッシュ27には、上述の通り、胴体部2に密着する冷却用片27Aが一体に形成されており、露出部16Aの熱が固定ブッシュ27の冷却用片27Aを通じて胴体部2に伝熱され、露出部16Aの過度な温度上昇が防止されている。
また、電気回路基板8の発熱も固定ブッシュ27を介して胴体部2に伝熱され放熱される。
As shown in FIG. 6, the electric circuit board 8 housed in the body part 2 is firmly fixed by pressing the upper end part 8 </ b> C by the LED board 16 through the fixing bush 27. As described above, the fixed bush 27 is integrally formed with a cooling piece 27A that is in close contact with the body portion 2. Heat from the exposed portion 16A is transferred to the body portion 2 through the cooling piece 27A of the fixed bush 27. Thus, an excessive temperature rise of the exposed portion 16A is prevented.
Further, the heat generated in the electric circuit board 8 is also transferred to the body portion 2 through the fixed bush 27 to be radiated.

なお、上述の通り、胴体部2の内側面は絶縁シート28が覆うが、この絶縁シート28には高熱伝導性を有するものが用いられており、固定ブッシュ27の冷却用片27Aから胴体部2への伝熱を阻害しないようになっている。
このように、絶縁シート28が高熱伝導性を有し、電気回路基板8の回路部品と絶縁シート28との間に、これらを熱的に繋ぐ熱伝導性部材たる冷却用片27Aを設けることで、電気回路基板8の絶縁性と放熱性との両方を高めることができる。
また固定ブッシュ27に冷却用片27Aを一体に形成しているため、電気回路基板8の固定と冷却とを簡単に行うことができる。
As described above, the insulating sheet 28 covers the inner side surface of the body portion 2, and the insulating sheet 28 is made of a material having high thermal conductivity, and the body portion 2 extends from the cooling piece 27 </ b> A of the fixed bush 27. It is designed not to impede heat transfer to.
As described above, the insulating sheet 28 has high thermal conductivity, and the cooling piece 27 </ b> A is provided between the circuit component of the electric circuit board 8 and the insulating sheet 28 as a heat conductive member that thermally connects them. Both the insulation and heat dissipation of the electric circuit board 8 can be enhanced.
Further, since the cooling piece 27A is formed integrally with the fixing bush 27, the electric circuit board 8 can be fixed and cooled easily.

かかる胴体部2とベース板13を含む筐体35は、上述のように、複数の放熱フィン25を一体に備えることで放熱性が維持されている。
放熱フィン25は、それぞれ薄い板状であり、ベース板13の裏面からみて胴体部2の軸線を中心にして放射状に多数立設されている。これらの放熱フィン25は、根元部分であるフィン根元部25Bがベース板13の裏面13Aに繋がっており、これら放熱フィン25、胴体部2及びベース板13が上述の熱伝導性樹脂から金型を用いた樹脂成型により一体に形成されている。このように、ベース板13、及び放熱フィン25を一体成型することで、ベース板13と放熱フィン25の間の熱抵抗が抑えられ、放熱フィン25への伝熱量が増加して高い放熱性能が得られる。
As described above, the housing 35 including the body portion 2 and the base plate 13 is provided with a plurality of heat radiation fins 25 so as to maintain heat dissipation.
The radiating fins 25 each have a thin plate shape, and a large number of the radiating fins 25 are provided in a radial manner with the axis of the body portion 2 as the center when viewed from the back surface of the base plate 13. These radiating fins 25 have fin base portions 25B, which are the base portions, connected to the back surface 13A of the base plate 13, and the radiating fins 25, the body portion 2 and the base plate 13 are molded from the above-described thermally conductive resin. It is integrally formed by the resin molding used. Thus, by integrally molding the base plate 13 and the heat radiating fins 25, the thermal resistance between the base plate 13 and the heat radiating fins 25 is suppressed, the amount of heat transfer to the heat radiating fins 25 is increased, and high heat radiating performance is achieved. can get.

放熱フィン25は、図1に示すように、ベース板13の裏面13A(図2)からホルダー筐体62の開口縁部66に向かって緩やかな弧を描く側面視略扇形状に形成されており、ランプホルダー60にLEDランプ1を装着した際に、ランプホルダー60との一体感を高めることで、意匠性を高めている。
各放熱フィン25のフィン先端25Aは、図6に示すように、水平(胴体部2の軸線に対して垂直)に形成されており、胴体部2に装着された環状防水パッキン70が当接する。
As shown in FIG. 1, the radiating fins 25 are formed in a substantially fan shape in a side view that draws a gentle arc from the back surface 13 </ b> A (FIG. 2) of the base plate 13 toward the opening edge 66 of the holder housing 62. When the LED lamp 1 is mounted on the lamp holder 60, the design is enhanced by enhancing the sense of unity with the lamp holder 60.
As shown in FIG. 6, the fin tips 25 </ b> A of the respective radiation fins 25 are formed horizontally (perpendicular to the axis of the body part 2), and the annular waterproof packing 70 attached to the body part 2 contacts.

環状防水パッキン70は、図1〜図6に示すように、側面視したときに、放熱フィン25の外形25Dが描く弧に連続する略切頭円錐状(断面略台形状)を成しており、これら放熱フィン25、及び環状防水パッキン70から成る輪郭形状が既存の電球のガラス球の輪郭形状と等しくなるように形成されており、既存の電球との代替時に形状の相違から生じる不具合の防止が図られている。   As shown in FIGS. 1 to 6, the annular waterproof packing 70 has a substantially truncated cone shape (substantially trapezoidal shape in cross section) that is continuous with an arc drawn by the outer shape 25 </ b> D of the radiating fin 25 when viewed from the side. In addition, the contour shape composed of the heat radiation fins 25 and the annular waterproof packing 70 is formed so as to be equal to the contour shape of the glass bulb of the existing light bulb, and prevents problems caused by the difference in shape when replacing the existing light bulb. Is planned.

ここで、胴体部2の素材には、高熱伝導性のカーボン繊維(以下、「熱伝導性繊維」と言う)を混入した樹脂材が用いられているが、この樹脂材にあっては、熱伝導性繊維の配向によって熱伝導率に異方性が生じることが知られている。
本実施形態では、胴体部2及びベース板13から放熱フィン25への熱伝導率が高くなるように熱伝導繊維を配向させることで、胴体部2の放熱能力を高めることとしている。かかる熱伝導繊維の配向は、樹脂射出成型時に樹脂を流す向きによって制御される。
Here, a resin material mixed with carbon fiber having high thermal conductivity (hereinafter referred to as “thermal conductive fiber”) is used as the material of the body portion 2. It is known that anisotropy occurs in thermal conductivity depending on the orientation of conductive fibers.
In the present embodiment, the heat radiation capacity of the body portion 2 is increased by orienting the heat conductive fibers so that the heat conductivity from the body portion 2 and the base plate 13 to the heat radiation fins 25 is increased. The orientation of the heat conducting fibers is controlled by the direction in which the resin flows during resin injection molding.

また放熱フィン25には、例えば図1に示すように、落下防止用のワイヤを通すためのワイヤ孔89が設けられており、このワイヤ孔89によって放熱フィン25の強度が低下しないように熱伝導性繊維の配向を変えても良い。   Further, for example, as shown in FIG. 1, the radiating fin 25 is provided with a wire hole 89 through which a wire for preventing fall is passed, and heat conduction is performed so that the strength of the radiating fin 25 is not lowered by the wire hole 89. The orientation of the conductive fiber may be changed.

次いで、筐体35の製造について説明する。
筐体35は、上述の通り、樹脂成型によって製造されるが、ベース板13、放熱フィン25、及び胴体部2から成る部分に熱伝導性樹脂が用いられ、絶縁筒部10に絶縁性樹脂が用いられることから、筐体35の樹脂成型は二色成型、或いはインサート成型によって形成される。
Next, manufacture of the housing 35 will be described.
As described above, the housing 35 is manufactured by resin molding. However, a heat conductive resin is used for a portion including the base plate 13, the heat radiating fins 25, and the body portion 2, and the insulating resin is applied to the insulating cylinder portion 10. Since it is used, the resin molding of the housing 35 is formed by two-color molding or insert molding.

筐体35の樹脂成型後には、耐候性や意匠性を高めるために表面に塗料や薬品が塗布される。この塗布工程において、従来の一般的な構成のLEDランプでは、胴体部2から放熱フィン25が放射状に延び、なおかつ、放熱フィン25のベース板13側の端部が当該ベース板13の裏面に繋がる構成であるため、胴体部2及び放熱フィン25とベース板13との繋ぎ目の隅部は塗料が入り難く、また塗布量を増やすとフィン手前側にタレが生じる、という問題がある。このため、塗布工程においては、複数回に分けて少量ずつ塗料等を塗布する必要があり、塗布回数が増えて高コスト化を招いている。
この問題に対し、放熱フィン25をベース板13の裏面から切り離して隙間を設けることで、ある程度の解決にはなるが、この場合には、LED基板16の発熱を受けるベース板13の放熱性能が低下することから、LED15に高出力型のものを用いることができない。
After the resin molding of the housing 35, a paint or a chemical is applied to the surface in order to improve weather resistance and designability. In this coating process, in the conventional LED lamp having a general configuration, the radiation fins 25 extend radially from the body 2, and the end of the radiation fin 25 on the base plate 13 side is connected to the back surface of the base plate 13. Since it is a structure, there is a problem that paint is hard to enter at the joint portion between the body portion 2 and the radiating fins 25 and the base plate 13 and that sagging occurs on the front side of the fins when the application amount is increased. For this reason, in the application process, it is necessary to apply a small amount of paint or the like divided into a plurality of times, which increases the number of applications and leads to an increase in cost.
This problem can be solved to some extent by separating the radiating fins 25 from the back surface of the base plate 13 to provide a gap, but in this case, the heat radiating performance of the base plate 13 that receives the heat generated by the LED substrate 16 is reduced. Since it falls, a high output type LED15 cannot be used.

そこで本実施形態のLEDランプ1では、全ての放熱フィン25を胴体部2から切り離すことで、ベース板13の放熱性を損なうことなく、塗布工程における液溜まりの問題を解決している。
すなわち、図6に示すように、全ての放熱フィン25と胴体部2との間に、ベース板13との繋ぎ箇所である放熱フィン25の根元部分であるフィン根元部25Bからフィン先端25Aに亘り、放熱フィン25と胴体部2を切り離す切離部91を設けることで、これら放熱フィン25と胴体部2との間に隙間を設けている。
Therefore, in the LED lamp 1 of this embodiment, all the heat radiation fins 25 are separated from the body portion 2 to solve the problem of liquid accumulation in the coating process without impairing the heat radiation performance of the base plate 13.
That is, as shown in FIG. 6, between all the radiation fins 25 and the trunk | drum 2, it extends from fin base part 25B which is a root part of the radiation fin 25 which is a connection location with the base board 13, to fin front-end | tip 25A. By providing the separating portion 91 that separates the heat radiation fin 25 and the body portion 2, a gap is provided between the heat radiation fin 25 and the body portion 2.

これにより、筐体35への塗料の塗布工程において、放熱フィン25と胴体部2の間に液溜まりが生じることがないため、1回あたりに塗布する液量を多くして塗布回数を少なくすることができ、ムラなく簡単に塗料を筐体35に塗布することができる。特に、スプレー等を用いて塗料を吹き付けることで、切離部91を通じて塗料が胴体部2の周囲に回り込み、1回の塗布で広範囲にムラなく塗料を塗ることができる。
さらに、切離部91を設けることで、筐体35の軽量化が図られ、また材料費を抑えることができる。またLEDランプ1の使用時には、放熱フィン25と胴体部2との間に雨水等が溜まることもない。
また、胴体部2から放熱フィン25を放射状に設ける従来構成においては、設置可能な放熱フィン25の枚数が胴体部2の外周長を、放熱フィン25のフィン根元部25Bの成型可能な最小厚みで除算して得られる枚数に制限されるが、放熱フィン25を胴体部2から切り離すことで、放熱フィン25の枚数をより多く設けることができ、放熱性能を高めることができる。
Thereby, in the coating application process to the housing 35, no liquid pool is generated between the radiating fins 25 and the body part 2, so that the amount of liquid applied per time is increased to reduce the number of times of application. Thus, the paint can be easily applied to the casing 35 without unevenness. In particular, by spraying the paint using a spray or the like, the paint wraps around the body portion 2 through the separating portion 91, and the paint can be applied evenly over a wide range by one application.
Furthermore, by providing the separation part 91, the housing 35 can be reduced in weight and the material cost can be suppressed. Further, when the LED lamp 1 is used, rainwater or the like does not collect between the heat radiating fins 25 and the body portion 2.
Further, in the conventional configuration in which the radiating fins 25 are provided radially from the body part 2, the number of radiating fins 25 that can be installed is equal to the outer peripheral length of the body part 2, with the minimum moldable thickness of the fin base part 25 </ b> B of the radiating fins 25. Although it is limited to the number obtained by dividing, by separating the radiating fins 25 from the body portion 2, a larger number of radiating fins 25 can be provided, and the heat radiation performance can be improved.

ところで、放熱フィン25を胴体部2から切り離す構成とした場合、胴体部2と接続している構成に比べて放熱フィン25の強度が下がる。
また、射出成型時に放熱フィン25に前記胴体部2からの材料の流れが無くなり、ベース板13から材料が流れ込むのみとなり、さらに本実施形態で用いる熱伝導性繊維を混入した樹脂の場合、成型時の樹脂の流れは混入しないものに比べ悪く、薄いフィン形状の先端まで充填不足することなく中実に成型するための射出圧力の管理も難しい。また、放熱性を高めるために放熱フィン25の枚数を増やすと、成型時に金型と樹脂との接触面積が増加する。その結果、成型品の型離れが悪くなり、成型サイクル時間が増加し成型性が落ちる欠点が生ずる。
そこで本実施形態では、図1〜図5に示すように、全ての放熱フィン25に、当該放熱フィン25のフィン根元部25Bからフィン先端25Aに亘って延びる補強リブ92を設けている。放熱フィン25に補強リブ92を設けることで、放熱フィン25が胴体部2についていた場合と同等程度の強度とすることができるとともに樹脂の流れが改善され成型性が向上する。さらに、金型からの製品取り出しの際に補強リブ92のリブ端部93に金型の突き出しピンの押し当てが可能となるため、製品の金型からの取り出しが確実に行うことができるとともに、製品の破損を防止できる。
By the way, when it is set as the structure which isolate | separates the radiation fin 25 from the trunk | drum 2, the intensity | strength of the radiation fin 25 falls compared with the structure connected with the trunk | drum 2.
In addition, when the resin is mixed with the heat conductive fibers used in the present embodiment, the material flow from the body portion 2 to the heat radiating fins 25 is eliminated and the material flows only from the base plate 13 at the time of injection molding. The flow of the resin is worse than that without mixing, and it is difficult to control the injection pressure for solid molding without insufficient filling up to the thin fin-shaped tip. Further, if the number of the heat radiating fins 25 is increased in order to improve the heat dissipation, the contact area between the mold and the resin increases at the time of molding. As a result, the mold release of the molded product becomes worse, the molding cycle time increases, and the moldability deteriorates.
Therefore, in this embodiment, as shown in FIGS. 1 to 5, all the radiation fins 25 are provided with reinforcing ribs 92 extending from the fin base portions 25 </ b> B of the radiation fins 25 to the fin tips 25 </ b> A. By providing the reinforcing ribs 92 on the heat radiating fins 25, it is possible to achieve the same strength as when the heat radiating fins 25 are attached to the body portion 2, and the flow of the resin is improved and the moldability is improved. Furthermore, since it is possible to press the protruding pin of the mold against the rib end portion 93 of the reinforcing rib 92 when taking out the product from the mold, the product can be reliably taken out from the mold, Product damage can be prevented.

次いで、上記ビームランプ用光学部品46の構成について詳述する。
LEDランプ1は、上述の通り、発光部12にビームランプ用光学部品46を備え、当該ビームランプ用光学部品46によって照射光が所定のビーム開き角の範囲に集中配光されている。
ビームランプ用光学部品46は、図3〜図6に示すように、発光部12が備えるLED15の全てを覆う1枚の光学部品として構成されており、ネジ18によりLED基板16とともにベース板13にネジ止め固定されている。
Next, the configuration of the beam lamp optical component 46 will be described in detail.
As described above, the LED lamp 1 includes the beam lamp optical component 46 in the light emitting unit 12, and the irradiation light is concentrated and distributed within a predetermined beam opening angle range by the beam lamp optical component 46.
As shown in FIGS. 3 to 6, the beam lamp optical component 46 is configured as one optical component that covers all of the LEDs 15 included in the light emitting unit 12, and is attached to the base plate 13 together with the LED substrate 16 by screws 18. It is fixed with screws.

図7は、ビームランプ用光学部品46の構成を示す図であり、図7(A)は平面図、図7(B)は側面図、図7(C)は底面図である。
ビームランプ用光学部品46は、同図に示すように、LED基板16に実装されたLED15ごとに設けられ各LED15の真上に位置するように配置された集中配光光学素子47と、それぞれの集中配光光学素子47を覆って各集中配光光学素子47の出射面47Bに繋がる透光板部48とを備えている。投光部材48の面内には、略中央(すなわち、LED基板16のリード線引出開口17に対応する位置)に貫通孔90が設けられている。
7A and 7B are diagrams showing the configuration of the optical component 46 for the beam lamp. FIG. 7A is a plan view, FIG. 7B is a side view, and FIG. 7C is a bottom view.
As shown in the figure, the beam lamp optical component 46 is provided for each LED 15 mounted on the LED substrate 16 and is arranged so as to be positioned directly above each LED 15. A light transmissive plate portion 48 that covers the concentrated light distribution optical element 47 and is connected to the emission surface 47B of each concentrated light distribution optical element 47 is provided. In the surface of the light projecting member 48, a through hole 90 is provided substantially at the center (that is, a position corresponding to the lead wire extraction opening 17 of the LED substrate 16).

図8は、1つの集中配光光学素子47を拡大して示す図である。
集中配光光学素子47は、図8に示すように、LED15の光軸Kと同軸に配置され、当該LED15の発光を所定の開き角の範囲に収まるように集光して同軸に沿って出力する透過型光学素子であり、集光レンズ49と反射面50とを透明樹脂材により一体に成型して構成されている。
集光レンズ49は、球面状の入射面49Aと平らな出射面49Bとを有する平凸レンズである。集光レンズ49は、LED15の直上に入射面49Aを位置させて光軸Kと同軸に配置され、入射面49Aから入射するLED15の光H1を集光して出射面49Bから出射する。
反射面50は、回転曲面状(例えば、回転放物面、或いは回転楕円面)に形成され、集光レンズ49、及びLED15を内部に含むように光軸Kと同軸に設けられ、集光レンズ49の入射面49Aから反れるLED15の光H2を出射面49Bに向けて反射する。
FIG. 8 is an enlarged view showing one concentrated light distribution optical element 47.
As shown in FIG. 8, the concentrated light distribution optical element 47 is arranged coaxially with the optical axis K of the LED 15, condenses light emitted from the LED 15 so as to be within a predetermined opening angle, and outputs the light along the coaxial. The condensing lens 49 and the reflecting surface 50 are integrally formed of a transparent resin material.
The condenser lens 49 is a plano-convex lens having a spherical incident surface 49A and a flat exit surface 49B. The condenser lens 49 is disposed coaxially with the optical axis K with the incident surface 49A positioned directly above the LED 15, condenses the light H1 of the LED 15 incident from the incident surface 49A, and emits the light from the output surface 49B.
The reflecting surface 50 is formed in a rotating curved surface (for example, a rotating paraboloid or rotating ellipsoid), and is provided coaxially with the optical axis K so as to include the condensing lens 49 and the LED 15 therein. The light H2 of the LED 15 that warps from the incident surface 49A of 49 is reflected toward the exit surface 49B.

この構成により、LED15の発光は、その殆どが集光レンズ49、及び反射面50のいずれかに入射して出射面49Bから出力されるため、LED15の利用効率が高められ、また集光レンズ49、及び反射面50のそれぞれで配光が制御されることから良好な集光性が得られる。   With this configuration, most of the light emitted from the LED 15 is incident on either the condensing lens 49 and the reflecting surface 50 and is output from the exit surface 49B. Since the light distribution is controlled by each of the reflecting surfaces 50, a good light collecting property can be obtained.

かかる集中配光光学素子47の形状について説明すると、集中配光光学素子47は、上記反射面50の底部を略水平に切り落とした外観形状を成している。当該反射面50の底部にLED15を収める凹部50Aが形成され、当該凹部50Aの底面(LED15と対向する面)が略球状に形成されて上記集光レンズ49の入射面49Aが形成されている。
本実施形態においては、図8に示すように、集光レンズ49のレンズ焦点P1と、反射面50の反射面焦点P2とは、それぞれ凹部50Aの外で光軸K上の互いに異なる位置であって、レンズ焦点P1よりも反射面焦点P2が凹部50Aに近い位置になるように設計されている。
The shape of the concentrated light distribution optical element 47 will be described. The concentrated light distribution optical element 47 has an external shape obtained by cutting off the bottom of the reflecting surface 50 substantially horizontally. A concave portion 50A for accommodating the LED 15 is formed at the bottom of the reflecting surface 50, and the bottom surface (surface facing the LED 15) of the concave portion 50A is formed in a substantially spherical shape to form the incident surface 49A of the condenser lens 49.
In the present embodiment, as shown in FIG. 8, the lens focal point P1 of the condenser lens 49 and the reflective surface focal point P2 of the reflective surface 50 are at different positions on the optical axis K outside the recess 50A. Thus, the reflecting surface focal point P2 is designed to be closer to the recess 50A than the lens focal point P1.

このとき、集中配光光学素子47の反射面50、及び集光レンズ49の入射面49Aのそれぞれの寸法形状は、LED15の発光面からの発光の殆どを反射面50、及び集光レンズ49に入射させることができ、なおかつ、入射光を十分に集光して平行度を高くして出射させることができることを前提に規定される。
ただし、LEDランプ1にあっては、複数のLED15が設けられているため、LED15が隣接して配置されていると、上記集中配光光学素子47の寸法形状を規定の形状とすることができない。
At this time, the size and shape of the reflecting surface 50 of the concentrated light distribution optical element 47 and the incident surface 49A of the condensing lens 49 are such that most of the light emitted from the light emitting surface of the LED 15 is directed to the reflecting surface 50 and the condensing lens 49. It is defined on the premise that it can be incident and that the incident light can be sufficiently condensed and emitted with a high degree of parallelism.
However, since the LED lamp 1 is provided with a plurality of LEDs 15, if the LEDs 15 are arranged adjacent to each other, the dimensional shape of the concentrated light distribution optical element 47 cannot be a prescribed shape. .

これに対し、例えばLED15の配置間隔を大きくすれば、集中配光光学素子47を規定の寸法形状にできるものの、LEDランプ1の発光部12が大型化し、また筐体35の材料費のコストも増加する。また、集中配光光学素子47のそれぞれをダウンサイズすることで、各LED15に集中配光光学素子47を設けることができるものの、寸法形状が規定値からズレるため、LED15の利用効率や集光性が劣化する、という問題がある。   On the other hand, for example, if the arrangement interval of the LEDs 15 is increased, the concentrated light distribution optical element 47 can be made to have a prescribed size and shape, but the light emitting portion 12 of the LED lamp 1 is increased in size, and the material cost of the housing 35 is also increased. To increase. In addition, although the concentrated light distribution optical element 47 can be provided in each LED 15 by downsizing each of the concentrated light distribution optical elements 47, the dimensional shape deviates from the specified value. There is a problem of deterioration.

そこで本実施形態では、図7、及び図9に示すように、隣接する集中配光光学素子47の反射面50同士をラップさせて連結する構成としている。これにより、集中配光光学素子47のそれぞれをダウンサイズすることなく、各LED15に集中配光光学素子47を設けることができ、LED15の利用効率や集光性の劣化を抑えることができる。さらに、集中配光光学素子47を連結することで、それらを一体のビームランプ用光学部品46として取り扱うことができ、取り扱いが容易となり、また構造的な強度を増すことができる。特に、各集中配光光学素子47の出射面49Bに透光板部48を一体に設けているため、構造的な強度が更に高められている。   Therefore, in this embodiment, as shown in FIGS. 7 and 9, the reflecting surfaces 50 of the adjacent concentrated light distribution optical elements 47 are connected by being wrapped. Accordingly, the concentrated light distribution optical element 47 can be provided in each LED 15 without downsizing each of the concentrated light distribution optical elements 47, and deterioration of utilization efficiency and light condensing property of the LEDs 15 can be suppressed. Further, by connecting the concentrated light distribution optical elements 47, they can be handled as an integrated beam lamp optical component 46, which can be handled easily and can be increased in structural strength. In particular, since the light transmitting plate portion 48 is integrally provided on the exit surface 49B of each concentrated light distribution optical element 47, the structural strength is further enhanced.

ただし、反射面50をラップさせるに際し、集中配光光学素子47の集光レンズ49に他の集中配光光学素子47の反射面50が侵入する程度までラップ量α(図9)を増やすと、ラップ領域Raが大きく増加し、集中配光光学素子47の集光性が劣化し過ぎるため、反射面50のラップ量αは、図10に示すように、集光レンズ49の終端である出射面49B以下であって反射面50の高さAの約1/2程度を限度としている。
なお、集光性を問題にしなければ、ランプ量αが反射面50の高さAの約1/2程度を超えて集光レンズ49まで侵入させても良い。しかしながら、図9、及び図10に示すように、反射面50がラップしたラップ領域Raに侵入する光H3は、反射面50で反射されることなく直進するため、ラップ量αを増やし過ぎると、配光が制御されずに出射され迷光の原因となる。したがって、ラップ領域Raを抜けた光による迷光が顕著にならない範囲のラップ量α(本実施形態の構成では、図11に示すように、反射面50の高さAの約3/4程度)とすることが好ましい。
However, when wrapping the reflecting surface 50, if the wrap amount α (FIG. 9) is increased to the extent that the reflecting surface 50 of another concentrated light distributing optical element 47 enters the condensing lens 49 of the concentrated light distributing optical element 47, Since the wrap region Ra is greatly increased and the light condensing performance of the concentrated light distribution optical element 47 is excessively deteriorated, the wrap amount α of the reflecting surface 50 is, as shown in FIG. It is 49B or less and is limited to about ½ of the height A of the reflecting surface 50.
If the light condensing property is not a problem, the lamp amount α may exceed about ½ of the height A of the reflecting surface 50 and enter the condensing lens 49. However, as shown in FIGS. 9 and 10, the light H3 that enters the wrap region Ra wrapped by the reflection surface 50 travels straight without being reflected by the reflection surface 50. Light distribution is emitted without being controlled, causing stray light. Therefore, the wrap amount α (about 3/4 of the height A of the reflecting surface 50 as shown in FIG. 11 in the configuration of the present embodiment) in a range where stray light due to light passing through the wrap region Ra is not significant. It is preferable to do.

以上説明した実施形態によれば次のような効果を奏する。
すなわち、本実施形態では、発光素子たるLED15を実装したLED基板16と、当該LED基板16を載置した平板部としてのベース板13と、このベース板13の裏面13Aから延びて終端2Aに口金3が設けられた筒状部としての胴体部2と、を備えたLEDランプ1において、ベース板13の裏面13Aに、胴体部2に沿って延びる複数の放熱フィン25を備え、これら放熱フィン25のそれぞれと胴体部2との間に、放熱フィン25の根元部分であるフィン根元部25Bからフィン先端25Aに亘り隙間を設ける構成とした。
この構成によれば、ベース板13、胴体部2、及び放熱フィン25を含む筐体35への塗料の塗布工程において、放熱フィン25と胴体部2の間に液溜まりが生じることがないため、1回あたりに塗布する液量を多くして塗布回数を抑えることができ、ムラなく簡単に塗料を筐体35に塗布することができる。特に、スプレー等を用いて塗料を吹き付けることで、切離部91を通じて塗料が胴体部2の周囲に回り込み、1回の塗布で広範囲にムラなく塗料を塗ることができる。
さらに、切離部91を設けることで、筐体35の軽量化が図られ、また材料費を抑えることができる。またLEDランプ1の使用時には、放熱フィン25と胴体部2との間に雨水等が溜まることもない。
また、胴体部2から放熱フィン25を放射状に設ける従来構成においては、設置可能な放熱フィン25の枚数が胴体部2の外周長を、放熱フィン25のフィン根元部25Bの成型可能な最小厚みで除算して得られる枚数に制限されるが、放熱フィン25を胴体部2から切り離すことで、放熱フィン25の枚数をより多く設けることができ、放熱性能を高めることができる。
According to the embodiment described above, the following effects can be obtained.
That is, in this embodiment, the LED board 16 on which the LED 15 as the light emitting element is mounted, the base plate 13 as a flat plate portion on which the LED board 16 is placed, and the base 2 extends from the back surface 13A of the base plate 13 to the terminal 2A. 3 is provided with a plurality of heat radiation fins 25 extending along the body portion 2 on the back surface 13A of the base plate 13, and the heat radiation fins 25. Between each of the above and the body portion 2, a gap is provided from the fin base portion 25 </ b> B, which is the root portion of the radiation fin 25, to the fin tip 25 </ b> A.
According to this configuration, in the coating process on the casing 35 including the base plate 13, the body portion 2, and the heat radiation fin 25, no liquid pool is generated between the heat radiation fin 25 and the body portion 2. The number of times of application can be increased by increasing the amount of liquid applied per time, and the paint can be easily applied to the casing 35 without unevenness. In particular, by spraying the paint using a spray or the like, the paint wraps around the body portion 2 through the separating portion 91, and the paint can be applied evenly over a wide range by one application.
Furthermore, by providing the separation part 91, the housing 35 can be reduced in weight and the material cost can be suppressed. Further, when the LED lamp 1 is used, rainwater or the like does not collect between the heat radiating fins 25 and the body portion 2.
Further, in the conventional configuration in which the radiating fins 25 are provided radially from the body part 2, the number of radiating fins 25 that can be installed is equal to the outer peripheral length of the body part 2, with the minimum moldable thickness of the fin base part 25 </ b> B of the radiating fins 25. Although it is limited to the number obtained by dividing, by separating the radiating fins 25 from the body portion 2, a larger number of radiating fins 25 can be provided, and the heat radiation performance can be improved.

また本実施形態によれば、放熱フィン25のフィン根元部25Bからフィン先端25Aに亘って補強リブ92を設けた。
放熱フィン25に補強リブ92を設けることで、放熱フィン25が胴体部2についていた場合と同等程度の強度とすることができるとともに樹脂の流れが改善され、成型性が向上する。さらに、金型からの製品取り出しの際に補強リブ92のリブ端部93に金型の突き出しピンの押し当てが可能となるため、製品の金型からの取り出しが確実に行うことができるとともに、製品の破損を防止できる。
Further, according to the present embodiment, the reinforcing rib 92 is provided from the fin base portion 25B of the radiating fin 25 to the fin tip 25A.
By providing the reinforcing ribs 92 on the heat radiating fins 25, it is possible to achieve the same strength as when the heat radiating fins 25 are attached to the body portion 2, and the flow of the resin is improved, thereby improving the moldability. Furthermore, since it is possible to press the protruding pin of the mold against the rib end portion 93 of the reinforcing rib 92 when taking out the product from the mold, the product can be reliably taken out from the mold, Product damage can be prevented.

また本実施形態によれば、複数のLED15を備える発光部12の光を所定範囲に集中配光するビームランプ用光学部品46が、入射面49Aから入射する光を集光して出射面49Bから出力する集光レンズ49と、入射面49Aから反れる光を出射面49B側に反射する反射面50とを一体に有した集中配光光学素子47を発光部12のLED15ごとに備えつつ、隣接する集中配光光学素子47の反射面50をラップさせる構成とした。   In addition, according to the present embodiment, the beam lamp optical component 46 that concentrates and distributes the light of the light emitting unit 12 including the plurality of LEDs 15 within a predetermined range condenses the light incident from the incident surface 49A and exits from the output surface 49B. Each of the LEDs 15 of the light emitting unit 12 is provided with a concentrated light distribution optical element 47 integrally including an output condensing lens 49 and a reflection surface 50 that reflects the light deflecting from the incident surface 49A to the emission surface 49B side. The reflecting surface 50 of the concentrated light distribution optical element 47 is configured to wrap.

この構成によれば、LED15の発光を十分に集光レンズ49で集光し、かつ集光レンズ49に入射しなかった光を十分に反射面50で反射するように集中配光光学素子47の寸法形状を設計した際に、当該集中配光光学素子47の寸法よりもLED15の配置間隔が狭い場合でも、集中配光光学素子47をダウンサイズすることなく各LED15に設けることができ、集光性、及びLED15の利用効率の低下を抑えることができる。   According to this configuration, the light from the LED 15 is sufficiently condensed by the condenser lens 49 and the light that has not entered the condenser lens 49 is sufficiently reflected by the reflecting surface 50 so that the concentrated light distribution optical element 47 can be reflected. When designing the size and shape, even if the arrangement interval of the LEDs 15 is narrower than the size of the concentrated light distribution optical element 47, the concentrated light distribution optical element 47 can be provided in each LED 15 without downsizing, and the light collecting is performed. And a decrease in utilization efficiency of the LED 15 can be suppressed.

また本実施形態によれば、集中配光光学素子47の各々の出射面49B上に、集中配光光学素子47の各々を一体的に覆う板状の透光板部48を設ける構成とした。
これにより、各集中配光光学素子47を強固に連結することができる。
Further, according to the present embodiment, the plate-shaped light transmitting plate portion 48 that integrally covers each of the concentrated light distribution optical elements 47 is provided on the emission surface 49B of each of the concentrated light distribution optical elements 47.
Thereby, each concentrated light distribution optical element 47 can be firmly connected.

なお、上述した実施形態は、あくまでも本発明の一態様を示すものであり、本発明の趣旨を逸脱しない範囲で任意に変形及び応用が可能である。   The above-described embodiment is merely an aspect of the present invention, and can be arbitrarily modified and applied without departing from the spirit of the present invention.

1 LEDランプ
2 胴体部
12 発光部
13 ベース板
15 LED(発光素子)
16 LED基板
25 放熱フィン
35 筐体
46 ビームランプ用光学部品(光学部品)
47 集中配光光学素子(光学素子)
47B 出射面
48 透光板部
49 集光レンズ(レンズ)
49A 入射面
49B 出射面
50 反射面
50A 凹部
95 LEDランプ装置
K 光軸
Ra ラップ領域
P1 レンズ焦点
P2 反射面焦点
DESCRIPTION OF SYMBOLS 1 LED lamp 2 Body part 12 Light emission part 13 Base board 15 LED (light emitting element)
16 LED substrate 25 Radiation fin 35 Case 46 Optical component for beam lamp (optical component)
47 Concentrated light distribution optical element (optical element)
47B Outgoing surface 48 Translucent plate 49 Condensing lens (lens)
49A Incident surface 49B Outgoing surface 50 Reflective surface 50A Concave portion 95 LED lamp device K Optical axis Ra Wrap region P1 Lens focus P2 Reflective surface focus

Claims (3)

複数の発光素子を光源に備えるランプに設けられ、前記光源の光を所定範囲に集中配光する光学部品であって、
入射面から入射する光を集光して出射面から出力するレンズと、前記入射面から反れる光を前記出射面側に反射する反射面とを一体に有した光学素子を前記光源の発光素子ごとに備え、隣接する前記光学素子の反射面をラップさせた、ことを特徴とする光学部品。
An optical component that is provided in a lamp including a plurality of light emitting elements as a light source, and concentrates and distributes light from the light source in a predetermined range,
The light emitting element of the light source includes an optical element that integrally includes a lens that collects light incident from the incident surface and outputs the light from the output surface, and a reflective surface that reflects light that is warped from the incident surface toward the output surface. An optical component characterized in that a reflection surface of the adjacent optical element is wrapped.
前記光学素子の各々の出射面に、前記光学素子の各々を一体的に覆う板状の透光部材を設けたことを特徴とする請求項1に記載の光学部品。   The optical component according to claim 1, wherein a plate-like translucent member that integrally covers each of the optical elements is provided on an emission surface of each of the optical elements. 複数の発光素子を光源に備えるランプであって、
前記光源の光を所定範囲に集中配光する光学部品を備え、
前記光学部品は、入射面から入射する光を集光して出射面から出力するレンズと、前記入射面から反れる光を前記出射面側に反射する反射面とを一体に有した光学素子を前記光源の発光素子ごとに備え、隣接する前記光学素子の反射面をラップさせた、ことを特徴とするランプ。
A lamp comprising a plurality of light emitting elements as a light source,
An optical component that concentrates and distributes the light of the light source within a predetermined range,
The optical component includes an optical element integrally including a lens that collects light incident from an incident surface and outputs the light from the output surface, and a reflective surface that reflects light that is deflected from the incident surface to the output surface side. A lamp provided for each light emitting element of the light source, wherein a reflecting surface of the adjacent optical element is wrapped.
JP2011157670A 2010-08-11 2011-07-19 Optical component and lamp Pending JP2013024966A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011157670A JP2013024966A (en) 2011-07-19 2011-07-19 Optical component and lamp
NZ607838A NZ607838A (en) 2010-08-11 2011-08-11 Lamp and optical component
PCT/JP2011/068394 WO2012020830A1 (en) 2010-08-11 2011-08-11 Lamp and optical component
AU2011290165A AU2011290165B2 (en) 2010-08-11 2011-08-11 Lamp and optical component
AU2014233650A AU2014233650B2 (en) 2010-08-11 2014-09-29 Lamp and optical component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011157670A JP2013024966A (en) 2011-07-19 2011-07-19 Optical component and lamp

Publications (1)

Publication Number Publication Date
JP2013024966A true JP2013024966A (en) 2013-02-04

Family

ID=47783403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011157670A Pending JP2013024966A (en) 2010-08-11 2011-07-19 Optical component and lamp

Country Status (1)

Country Link
JP (1) JP2013024966A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019220399A (en) * 2018-06-21 2019-12-26 シャープ株式会社 Luminaire and projector
WO2022176348A1 (en) * 2021-02-17 2022-08-25 パナソニックIpマネジメント株式会社 Optical system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006040727A (en) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd Light-emitting diode lighting device and illumination device
JP2007033944A (en) * 2005-07-27 2007-02-08 Canon Inc Illuminator and imaging apparatus
JP2008047541A (en) * 2007-09-25 2008-02-28 Mirai Kankyo Kaihatsu Kenkyusho Kk Lighting system
JP2008282754A (en) * 2007-05-14 2008-11-20 Akita Denshi Systems:Kk Illumination device and manufacturing method therefor
JP2009110827A (en) * 2007-10-31 2009-05-21 Iwasaki Electric Co Ltd Led light source device
JP2009110828A (en) * 2007-10-31 2009-05-21 Iwasaki Electric Co Ltd Led light source device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006040727A (en) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd Light-emitting diode lighting device and illumination device
JP2007033944A (en) * 2005-07-27 2007-02-08 Canon Inc Illuminator and imaging apparatus
JP2008282754A (en) * 2007-05-14 2008-11-20 Akita Denshi Systems:Kk Illumination device and manufacturing method therefor
JP2008047541A (en) * 2007-09-25 2008-02-28 Mirai Kankyo Kaihatsu Kenkyusho Kk Lighting system
JP2009110827A (en) * 2007-10-31 2009-05-21 Iwasaki Electric Co Ltd Led light source device
JP2009110828A (en) * 2007-10-31 2009-05-21 Iwasaki Electric Co Ltd Led light source device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019220399A (en) * 2018-06-21 2019-12-26 シャープ株式会社 Luminaire and projector
JP7126876B2 (en) 2018-06-21 2022-08-29 シャープ株式会社 luminaires and floodlights
WO2022176348A1 (en) * 2021-02-17 2022-08-25 パナソニックIpマネジメント株式会社 Optical system
US11940647B2 (en) 2021-02-17 2024-03-26 Panasonic Intellectual Property Management Co., Ltd. Optical system

Similar Documents

Publication Publication Date Title
WO2012020830A1 (en) Lamp and optical component
US9970647B2 (en) Lighting module and lighting device
US10641466B2 (en) Light emitting diode module and manufacturing method therefor, and lamp
US20100246172A1 (en) Led lamp
WO2012056669A1 (en) Illumination device
JP5636923B2 (en) lamp
JP2012038691A (en) Led lamp
JP5569372B2 (en) Lamp and lamp device
JP6014311B2 (en) lamp
US8016453B2 (en) LED lamp assembly
JP5752336B1 (en) LED lamp
JP2013024966A (en) Optical component and lamp
JP2013140725A (en) Lamp cover, and lamp equipped with the same
KR101404555B1 (en) Led fish-luring lamp
JP5278230B2 (en) Lighting device
JP2012119281A (en) Lamp
KR20140076390A (en) Led fish-luring lamp
JP6418277B2 (en) lamp
JP6028784B2 (en) lamp
JP2012195127A (en) Led lighting apparatus
US20110216547A1 (en) Lighting apparatus
JP5935854B2 (en) LED lamp
JP6589382B2 (en) lamp
JP6194937B2 (en) lighting equipment
JP5835414B2 (en) Lamp and lamp device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140410

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150113

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150312

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150512

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150710

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150915

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151112

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160426