JP5278230B2 - Lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting device capable of alleviating adverse effect on a lighting circuit, even in case a material with a low thermal conductivity is used as a light-emitting substrate, by containing a light source using light emitting elements and the lighting circuit in a device body. <P>SOLUTION: The device includes a light emitting unit 29 with the light emitting elements mounted on one side of a light-emitting substrate 38 with a material having a thermal conductivity of &le;0.4 W/mk and with a heat sink 40 mounted on the other side, a lighting circuit 30 for lighting the light emitting elements, a case 41 with an attachment 45 attached to the heat sink 40 at a position not overlapping the mounting position of the light emitting elements for containing the lighting circuit 30, and a device body 11 housing the case 41 containing the light emitting unit 29 and the lighting circuit 30. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an illumination device using a light emitting element such as a light emitting diode or an organic EL.

  As lighting fixtures using light-emitting elements such as light-emitting diodes and organic EL, a polygonal surface is formed by changing the angle of these multiple substrates using a large number of white light-emitting diodes provided on one substrate. Such a configuration is known that employs a configuration in which light is emitted in multiple directions (see, for example, Patent Document 1).

  A lighting device for lighting the light emitting diode mounted on the substrate is attached to the base and accommodated in the cover, a base is attached to one side of the cover, and the light emitting diode is covered on the other side of the cover. There is a lighting fixture in which a globe is attached to dissipate heat generated from a light emitting diode from a base (see, for example, Patent Document 2).

JP 2004-200102 A JP 2008-91140 A

  However, the lighting fixture of Patent Document 1 has a structure in which a plurality of substrates are attached to the fixture body and a substantially hemispherical light-transmitting cover that covers the substrates is attached to the opening of the fixture body. However, there is a problem that the product cost is increased because the number of parts is increased and the number of assembly steps is increased.

  Moreover, in the thing of patent document 2, although it is trying to radiate the heat_generation | fever of a light emitting diode from a base, since the lighting device is attached to a base, the heat | fever from a base transmits heat to a lighting device, There is no consideration for heat transfer from the base to the lighting device. In particular, when a material having low thermal conductivity is used as the light emitting substrate, it is necessary to consider heat transfer from the base to the lighting device.

  The present invention provides a lighting device in which a light source using a light emitting element and a lighting circuit are housed in a fixture body, and the thermal effect on the lighting circuit can be reduced even when a material having low thermal conductivity is used as a light emitting substrate. The purpose is to do.

The lighting device according to claim 1 is a light-emitting unit in which a light-emitting element is mounted on one surface of a light-emitting substrate made of a material having a thermal conductivity of 0.4 W / mk or less, and a heat radiating plate is disposed on the other surface; A lighting circuit for lighting; a case having a mounting portion attached to the heat radiating plate at a position not overlapping with a mounting position of the light emitting element; and a case for housing the lighting circuit; a case for housing the light emitting unit and the lighting circuit A circuit board of the lighting circuit is a substrate made of a material having a thermal conductivity of 0.4 W / mk or less, and the solder surface of the lighting circuit does not face the heat sink, The case is attached to the heat sink so that an air layer is formed between the circuit board of the lighting circuit and the heat sink .

  In the present invention and the following inventions, definitions and technical meanings of terms are as follows unless otherwise specified.

  Examples of the light emitting substrate having a thermal conductivity of 0.4 W / mk or less include a paper phenol substrate and a glass epoxy substrate. The paper phenol substrate is obtained by impregnating a paper with a phenol resin, and is inexpensive and has good workability, but has a characteristic that the thermal conductivity is inferior to an alumina substrate. The glass epoxy board is a glass fiber cloth (cloth) layered with an epoxy resin impregnated. It has excellent electrical and mechanical properties, but has a higher thermal conductivity than an alumina substrate. Has inferior characteristics.

  As the light emitting element, a solid light emitting element that can be disposed on a light emitting substrate such as a light emitting diode or an organic EL is applied. The light emitting unit is configured by mounting a light emitting element on one surface of a light emitting substrate and disposing a heat sink on the other surface of the light emitting substrate.

  The lighting circuit is housed in the case. For example, the case is formed in a rectangular shape with a metal having high thermal conductivity, and is attached to the heat radiating plate of the light emitting unit with a fixing tool such as a screw. The case is attached to the heat dissipation plate at a position that does not overlap with the mounting position of the light emitting element. This is to suppress the temperature of heat transfer from the case mounting portion to the case.

  In other words, when light emitting elements are dispersedly arranged on a light emitting substrate with low thermal conductivity, the temperature of the mounting portion of the light emitting element is the highest, and the temperature distribution becomes lower as the distance from the mounting portion increases. Although the rate is high, the temperature distribution is not uniform even in the heat sink, and the temperature near the light emitting diode mounting portion is still higher than the surrounding area. Therefore, the temperature at which heat is transferred from the mounting portion to the case can be suppressed by setting the mounting portion of the case so as not to overlap the mounting portion of the light emitting diode.

“ The solder surface of the circuit board” means a surface on the back side of the surface on which components and elements are mounted on the circuit board. The reason for “the direction in which the solder surface of the lighting circuit does not face the heat sink” is to prevent the heat transmitted from the light emitting element side through the heat sink from affecting the solder surface side. The reason why the air layer is formed between the circuit board of the lighting circuit and the heat sink is to make it difficult for the heat of the heat sink to be transmitted to the circuit board.

According to a second aspect of the present invention, in the lighting device of the first aspect, the case is attached to the heat sink so that the mounting position of the light emitting element is not located inside the case.

“The mounting position of the light-emitting element is not located inside the case” means that the light-emitting element is positioned on one surface of the light-emitting board corresponding to the mounting position of the lighting circuit case when the lighting circuit case is mounted on the heat sink. Is not implemented.

As a result, the region with the highest temperature distribution does not face the inner region of the case, and the thermal effect on the circuit components and solder inside the case can be suppressed. In addition, heat radiation from the light emitting element can be reduced as much as possible by inhibiting the heat radiation action by attaching the case to the heat radiation plate.

The lighting device according to claim 3 is the lighting device according to claim 1 or 2, wherein the circuit board of the lighting circuit is a board having a thermal conductivity of 0.4 W / mk or less, and the solder surface of the lighting circuit is the soldering surface. The case is attached to the heat sink so that an air layer is formed between the circuit board of the lighting circuit and the heat sink in a direction not facing the heat sink.

  According to the first aspect of the present invention, the case housing the lighting circuit is attached to the heat radiating plate on the other surface of the light emitting unit so as not to overlap the mounting position of the light emitting element. Heat from the light emitting element mounted on the substrate is hardly transmitted to the mounting portion of the heat sink, and heat from the light emitting element can be suppressed from being transferred to the lighting circuit.

Also, since the case is attached to the heat sink so that the solder surface of the circuit board of the lighting circuit does not face the heat sink and an air layer is formed between the circuit board of the lighting circuit and the heat sink, the heat sink It becomes difficult to be directly affected by heat. Further, since the circuit board of the lighting circuit has a low thermal conductivity, the heat transmitted from the heat sink to the case is hardly transmitted to the inner region of the circuit board of the lighting circuit. That is, the components mounted on the inner side from the side edge side of the circuit board and the solder portion are less susceptible to direct thermal influence from the heat sink.

According to the invention of claim 2, since the lighting circuit is attached to the heat sink so that the mounting position of the light emitting element is not located inside the case of the lighting circuit, the heat from the light emitting element enters the case containing the lighting circuit. Can be suppressed.

The perspective view which shows an example of the illuminating device concerning embodiment of this invention. FIG. 2 is a side sectional view of FIG. 1. The bottom view of FIG.

  Embodiments of the present invention will be described below. FIG. 1 is a perspective view showing an example of a lighting device according to an embodiment of the present invention. FIG. 1 shows a case where the lighting device is a security light. The illumination device main body 11 includes a translucent cylindrical cover 12, a base portion 14 attached to the proximal end portion 13 of the cylindrical cover 12, and an arm 15.

  As for the cylindrical cover 12, the top part 16 is obstruct | occluded, the opening part 17 is formed in the base end part 13 side, and forms the cylinder shape as a whole. The cylindrical cover 12 is composed of a cylinder body 18 on the top 16 side and a flange 19 on the base end 13 side. The flange 19 of the base end 13 has a cylindrical outer periphery, The outline of the opening 17 is also circular. The cylinder body 18 is formed to extend from the flange portion 19 to the top portion 16 side, and is provided integrally with the flange portion 19 in a cylindrical shape slightly smaller than the outer diameter of the flange portion 19.

  An accommodation space that communicates with the opening 17 is formed inside the cylindrical cover 12, and this accommodation space is a substantially closed space that does not communicate with anything other than the opening 17. A light emitting unit and a lighting circuit described later are accommodated in the space.

  The cylindrical cover 12 is integrally formed of a translucent resin such as acrylic or polycarbonate, and has translucency as a whole. In addition, a white pigment and a light diffusing material are added to the translucent resin for forming the cylindrical cover 12, and the whole has a milky white appearance. In addition, the whole cylindrical cover 12 may be transparent, and a part may have a form which has translucency.

  The cylindrical main body 18 of the cylindrical cover 12 functions as a light projecting unit 20 that transmits the irradiation light to the road surface whose lower side is an irradiation surface, and the upper side functions as a shade 21. A wall portion 22 having a U-shaped cross section is formed above the cap portion 21 on the flange portion 19 side, and the wall portion 22 is formed at a height such that the tips thereof are aligned and flat.

  On the periphery of the cylindrical body 12 in the width direction of the cylindrical body 18, a step portion 23 that protrudes slightly outward from the outer peripheral surfaces of the light projecting portion 20 and the shade portion 21 is continuously formed in a band shape. By projecting the step portion 23 to the outside, the step portion 23 functions as a ridge of the light projecting unit 20, and it becomes difficult for water droplets during rainfall to flow down to the light projecting unit 20. Dirt is difficult to adhere to. Further, since the step portion 23 is continuously formed around the longitudinal direction of the cylinder body 18, the mechanical strength of the cylinder body 18 is also improved.

  Next, the base portion 14 is attached to the cylindrical cover 12, closes the opening 17 of the cylindrical cover 12, and is connected to a lead wire 24 that supplies power to the light emitting unit housed in the cylindrical cover 12. ing. That is, the base portion 14 has a wiring portion as will be described later, and power is supplied from the lead wire 24 to the lighting circuit through the wiring portion.

  The arm 15 is detachably attached to the base portion 14 with a screw or the like, and the cylindrical cover 12 to which the base portion 14 is attached is attached to a pole such as a utility pole installed on the road surface. The arm 15 has a curved portion 25 in which an intermediate portion of a U-shaped metal piece is curved in a substantially L shape, and a mounting band wound around a utility pole is passed through the rear end portion of the curved portion 16. A hole 26 and a dart hole 27 for locking the mounting screw are formed.

  At this time, the long axis direction of the cylindrical cover 12 is installed with an inclination of about 20 to 30 ° with respect to the horizontal plane so that the top 16 side faces upward by the curved portion 25 of the arm 15. Accordingly, the opening 17 of the cylindrical cover 12 is always directed downward by about 20 to 30 ° in the installed state of the cylindrical cover 12, and water droplets due to rain are unlikely to enter the opening 17 and the waterproof performance is improved. . Furthermore, since the efficiency of the convection and heat exchange in the shade part 21 with a comparatively large surface area improves by making the top part 16 side of the cylindrical cover 12 face upwards, a heat dissipation characteristic can also be improved.

  Here, the distal end portion of the arm 15 is disposed so as to form a slight gap with the distal end of the wall portion 22 of the shade portion 21. This tip portion functions to maintain sufficient strength even with a load when used as a scaffold for the worker on the pole.

  FIG. 2 is a sectional side view of FIG. As shown in FIG. 2, the cylinder main body 18 of the cylindrical cover 12 is a tapered cylinder whose outer diameter decreases toward the top 16. In particular, the outer diameter dimension of the cylinder body 18 in the vertical direction has a larger rate of decreasing toward the top portion 16 than the outer diameter dimension in the width direction, and the cross-sectional shape of the cylinder body 18 in the vicinity of the top portion 16 has the major axis in the width direction. It has a flat and substantially elliptical shape.

  An accommodation space 28 communicating with the opening 17 is formed inside the cylindrical cover 12, and the light emitting unit 29 and the lighting circuit 30 are accommodated in the accommodation space 28. The lighting circuit 30 is housed in a case 41 and attached to the light emitting unit 29. A groove portion 31 for mounting the light emitting unit 29 in the accommodation space 28 is formed inside the step portion 23 of the cylindrical cover 12. The groove portions 31 are provided in the width direction at least along the longitudinal direction of the cylindrical cover 12, and a pair of groove portions 31 are formed as viewed from the opening 17.

  The base portion 14 has a closing portion 32 that closes the opening portion 17 of the cylindrical cover 12 and is formed in a bottomed cylindrical shape on the base end portion 13 side. The closing part 32 is inserted into the inside of the flange part 19 at the bottom side, and comes into contact with the joint part of the base end part 13 via the O-ring 33. The O-ring 33 is pressed by the closing portion 32 and elastically deformed, so that the inside of the opening portion 17 has a watertight structure to ensure waterproofness.

  A closing plate 34 that closes the opening 17 is provided on the distal end side of the closing portion 32, and the light emitting unit 29 is fixed by contacting the closing plate 34 and the end of the light emitting unit 29. A wiring portion 35 through which the lead wire 24 for supplying power to the light emitting unit 29 is inserted is provided at a substantially central portion of the closing plate 34. The wiring part 35 is provided with a waterproof bushing 36, and the waterproofness of the wiring part 35 is ensured by inserting the lead wire 24 into the waterproof bushing 36. A cylindrical step portion 37 having substantially the same diameter as the flange portion 19 is formed integrally with the closing portion 32 on the rear end side of the base portion 14, and the arm 15 is fixed to the cylindrical step portion 37 with a screw (not shown). .

  Next, the light emitting unit 29 has a light emitting substrate 38, and a light emitting diode 39 as a light emitting element is mounted on the main surface side of the light emitting substrate 38. On the main surface side of the light emitting substrate 38, a wiring pattern (not shown) and a land for connecting terminals of the light emitting diode 39 are formed of copper foil. On the main surface side of the light emitting substrate 38, a plurality of light emitting diodes 39 that emit white light are mounted at predetermined intervals. For example, four rows of light emitting diodes 39 are mounted in two rows (a total of eight).

  The light emitting substrate 38 is a substrate having a thermal conductivity of 0.4 W / mk or less, for example, a printed board made of paper phenol (thermal conductivity: 0.31 W / mk), or a glass epoxy substrate (thermal conductivity: 0.38 W / mk).

  The light emitting unit 29 has a heat sink 40 made of aluminum, and a light emitting board 38 is attached to one surface side of the heat sink 40 by a screw or the like (not shown) so as to conduct heat. Heat generated by the light emitting diode 39 on the light emitting substrate 38 is radiated into the cylindrical cover 12 by the heat radiating plate 40.

  On the other surface side of the heat radiating plate 40, a lighting circuit 30 for lighting the light emitting diode 39 is provided. The lighting circuit 30 is configured by housing a circuit board 42 that constitutes a constant current circuit or the like inside a metal case 41, and the case 41 is attached to the other surface side of the heat radiating plate 40 with screws or the like. 30 is attached to the heat sink 40. The attachment position of the case 41 to the heat sink 40 will be described later.

  The circuit board 42 in the case 41 is fixed by being hooked by a notch portion provided in the case 41. As a result, it is not necessary to use screws to fix the case 41 and the circuit board 42 of the lighting circuit 30, and the circuit board 42 is fixed to the case 41 with play, so that the circuit board 42 is heated by heat. When expanded, the circuit board 42 can be prevented from cracking. The circuit board 42 is formed of a material having a thermal conductivity of 0.4 W / mk or less, like the light emitting board 38.

  In the case 41, the solder surface 43 of the circuit board 42 is disposed so as not to face the heat sink 40. That is, the circuit board 42 is accommodated in the case 41 so that the circuit components 44 of the circuit board 42 of the lighting circuit 30 face the heat sink 40 side. The case 41 is attached to the heat sink 40 so that an air layer is formed between the circuit board 42 of the lighting circuit 30 and the heat sink 40. This is to prevent heat from the light emitting element side of the light emitting unit 29 from affecting the solder surface side.

  Since the case 41 is attached to the heat radiating plate 40, the heat of the light emitting element is transmitted to the case 41 through the heat radiating plate 40, but the circuit board 42 of the lighting circuit has a low thermal conductivity (0.4 W / mk or less). Therefore, heat is hardly transmitted from the case 41 to the inner region of the circuit board 42 of the lighting circuit 30. In other words, the components mounted on the inner side from the side edge side of the circuit board 42 and the solder portion are less likely to be directly affected by heat from the heat sink 40.

  The light emitting unit 29 is supported by the cylindrical cover 12 by inserting the peripheral edge portion of the heat radiating plate 40 into a pair of groove portions 31 provided in the accommodation space 28 of the cylindrical cover 12. Moreover, the front-end | tip part of the heat sink 40 is also engaged with the groove part 31 continued to the top part 16 side. Thus, the housing space 28 of the cylindrical cover 12 is substantially divided into the light projecting unit 20 side and the shade unit 21 side by the heat radiating plate 40.

  The internal volume of the storage space 28 on the cap portion 21 side is divided so as to be two to three times larger than the internal volume of the storage space 28 on the light projecting portion 20 side. Thereby, the accommodation space 28 on the side of the shade 21 is large in terms of heat capacity, and sufficient convection is performed. Therefore, heat transfer from the heat sink 40 and the case 41 of the lighting circuit 30 is utilized on the outer surface of the shade 21. Heat can be dissipated well by heat exchange.

  FIG. 3 is a bottom view of FIG. As shown in FIG. 3, a total of eight light emitting diodes 39 in four rows and two rows are mounted at predetermined intervals on the main surface side of the light emitting substrate 38 of the light emitting unit 29. The reason why the light emitting diodes 39 are mounted at a predetermined interval is that the light emitting substrate 38 is made of a material having a thermal conductivity of 0.4 W / mk or less and the heat conductivity is low, so that heat can be efficiently radiated. .

  Next, the case 41 is attached to the heat radiating plate 40 so as not to overlap the mounting position of the light emitting diode 39. FIG. 3 shows a case where the light emitting diode 39 is disposed at a position that does not overlap with the mounting position in the vertical direction. Further, the attachment portion 45 of the case 41 to the heat radiating plate 40 is attached with a screw or the like so as to be at an approximately middle position of the light emitting diode 39 at a predetermined interval. As a result, the mounting portion 45 is located away from the mounting position of the light emitting diode 39 that is a light emitting element, and is located away from any of the individual light emitting diodes 39.

  Further, the case 41 is attached to the heat radiating plate 40 so that the mounting position of the light emitting diode 39 which is a light emitting element is not located inside the case 41. That is, when the case 41 is attached to the heat radiating plate 40, the case 41 is attached to the heat radiating plate 40 so that the light emitting diode 39 is not mounted at the position of the main surface of the light emitting substrate 38 corresponding to the attachment position of the case 41. It is done. FIG. 3 shows a case where the case 41 is attached to the heat radiating plate 40 such that the periphery of the case 41 is in contact with the mounting position of the light emitting diode 39.

  As described above, since the mounting position of the light emitting diode 39 is not located inside the case 41, the entire region having the highest temperature distribution does not face the inner region of the case 39, and the circuit 41 and the solder inside the case 41 are not affected. Thermal effects can be suppressed. Further, since the entire mounting position is not located inside the case 41 for heat radiation from the light emitting diode 39, the heat radiation action from the heat radiation plate 40 can be minimized.

  Further, since the light emitting diodes 39 are distributed and mounted on the light emitting substrate 38 having low thermal conductivity, the temperature of the mounting part of the light emitting diodes 39 is highest, and the temperature distribution becomes lower as the distance from the mounting part increases. . In this case, although the heat dissipation plate 40 has a high thermal conductivity, the temperature distribution in the heat dissipation plate 40 is not uniform, and the temperature near the mounting portion of the light emitting diode 39 is still higher than the surrounding area. Therefore, by setting the mounting portion 45 of the case 41 to the heat radiating plate 40 so as not to overlap the mounting portion of the light emitting diode 39, the temperature transferred from the mounting portion 45 to the case 41 can be suppressed. In this way, the heat generated by the individual light emitting diodes 39 distributed on the light emitting substrate 38 having low thermal conductivity is efficiently radiated.

  As a result, the circuit component 44 and the solder housed inside the case 41 can suppress the thermal effect due to the lighting of the light emitting diode 39, so that the case 41 containing the lighting circuit 30 is directly attached to the heat radiating plate 40. Even if it exists, it can suppress that a malfunction arises in circuit operation | movement.

  According to the embodiment of the present invention, even when a material having low thermal conductivity is used as the light emitting substrate 38, heat generated from the light emitting diode 39 and heat generated from the solder surface 43 of the circuit board 42 are efficiently radiated. it can.

DESCRIPTION OF SYMBOLS 11 ... Instrument main body, 12 ... Cylindrical cover, 13 ... Base end part, 14 ... Base part, 15 ... Arm, 16 ... Top part, 17 ... Opening part, 18 ... Cylindrical body, 19 ... Flange part, 20 ... Light projection part , 21 ... shade part, 22 ... wall part, 23 ... step part, 24 ... lead wire, 25 ... curved part, 26 ... through hole, 27 ... daruma hole, 28 ... housing space, 29 ... light emitting unit, 30 ... lighting circuit 31 ... Groove portion, 32 ... Blocking portion, 33 ... O-ring, 34 ... Blocking plate, 35 ... Wiring portion, 36 ... Waterproof bushing, 37 ... Cylindrical step portion, 38 ... Light emitting substrate, 39 ... Light emitting diode, 40 ... Heat sink 41 ... Case, 42 ... Circuit board, 43 ... Solder surface, 44 ... Circuit components, 45 ... Mounting part

Claims (2)

A light emitting unit in which a light emitting element is mounted on one surface of a light emitting substrate made of a material having a thermal conductivity of 0.4 W / mk or less and a heat sink is disposed on the other surface;
A lighting circuit for lighting the light emitting element;
A case that has an attachment portion that is attached to the heat radiating plate at a position that does not overlap the mounting position of the light emitting element, and that houses the lighting circuit;
An instrument body that accommodates the light emitting unit and the case accommodating the lighting circuit; equipped with,
The circuit board of the lighting circuit is a board made of a material having a thermal conductivity of 0.4 W / mk or less, and the circuit board of the lighting circuit and the heat dissipation plate are oriented so that the solder surface of the lighting circuit does not face the heat dissipation plate. The lighting device is characterized in that the case is attached to the heat radiating plate so that an air layer is formed therebetween.   The lighting device according to claim 1, wherein the case is attached to the heat sink so that a mounting position of the light emitting element is not located inside the case.

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