JP4852868B2 - 精密加工方法 - Google Patents
精密加工方法 Download PDFInfo
- Publication number
- JP4852868B2 JP4852868B2 JP2005107821A JP2005107821A JP4852868B2 JP 4852868 B2 JP4852868 B2 JP 4852868B2 JP 2005107821 A JP2005107821 A JP 2005107821A JP 2005107821 A JP2005107821 A JP 2005107821A JP 4852868 B2 JP4852868 B2 JP 4852868B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- grindstone
- ground
- base
- rotating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
Claims (3)
- 被研削体を回転させる回転装置および該回転装置を支持する第一の基台と、砥石を回転させる回転装置および該回転装置を支持する第二の基台と、からなる精密加工装置であって、前記第一の基台および/または前記第二の基台には、一方の基台を他方の基台側へ移動可能な移動調整手段が備えられており、該移動調整手段は、移動量に基づく制御と圧力に基づく制御が選択的に選定できるように構成されてなる精密加工装置を使用した精密加工方法において、
前記精密加工方法は、被研削体をダイヤモンド砥石によって研削することにより中間の被研削体を製作する第一工程と、該中間の被研削体をCMG砥石によって研削することにより最終の被研削体を製作する第二工程と、からなり、
第一工程は、粗研削段階と次の中仕上げ段階とからなり、該中仕上げ段階では該粗研削段階よりも細かい粒子の砥石が使用され、かつ、前記移動量に基づく制御により、該粗研削段階よりも該中仕上げ段階の送り速度が遅くなるようにして、回転装置および基台が送り速度の異なる多段送りによって送り制御されており、
第二工程においては、前記圧力に基づく制御により、回転装置および基台が圧力の異なる多段階の一定圧力にて移動制御されており、被研削体が延性モードに入るように、除々に圧力を低下するように調整し、最後は所定の一定圧力で最終の被研削体を製作することを特徴とする精密加工方法。 - 前記回転装置と前記第一の基台との間、または、前記回転装置と前記第二の基台との間には回転装置の姿勢を制御するための姿勢制御装置が介装されており、前記第一工程および前記第二工程において、被研削体の研削面と砥石面との角度のずれが姿勢制御装置で適宜修正されることを特徴とする請求項1に記載の精密加工方法。
- 回転装置にチャックされた被研削体を該回転装置からアンチャックすることなく、第一工程から第二工程へ移行することを特徴とする請求項1または2に記載の精密加工方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005107821A JP4852868B2 (ja) | 2005-04-04 | 2005-04-04 | 精密加工方法 |
EP06731465A EP1889686B1 (en) | 2005-04-04 | 2006-04-04 | Precision machining method |
PCT/JP2006/307518 WO2006107111A1 (ja) | 2005-04-04 | 2006-04-04 | 精密加工方法 |
DE602006019720T DE602006019720D1 (de) | 2005-04-04 | 2006-04-04 | Präzisionsbearbeitungsverfahren |
KR1020077025216A KR100953293B1 (ko) | 2005-04-04 | 2006-04-04 | 정밀 가공 방법 |
US11/887,786 US7997953B2 (en) | 2005-04-04 | 2006-04-04 | Precision machining method |
CN200680010445A CN100577355C (zh) | 2005-04-04 | 2006-04-04 | 精密加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005107821A JP4852868B2 (ja) | 2005-04-04 | 2005-04-04 | 精密加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006281412A JP2006281412A (ja) | 2006-10-19 |
JP4852868B2 true JP4852868B2 (ja) | 2012-01-11 |
Family
ID=37073642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005107821A Expired - Fee Related JP4852868B2 (ja) | 2005-04-04 | 2005-04-04 | 精密加工方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7997953B2 (ja) |
EP (1) | EP1889686B1 (ja) |
JP (1) | JP4852868B2 (ja) |
KR (1) | KR100953293B1 (ja) |
CN (1) | CN100577355C (ja) |
DE (1) | DE602006019720D1 (ja) |
WO (1) | WO2006107111A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8824553B2 (en) | 2003-05-12 | 2014-09-02 | Google Inc. | Video compression method |
JP4852868B2 (ja) | 2005-04-04 | 2012-01-11 | トヨタ自動車株式会社 | 精密加工方法 |
JP4839720B2 (ja) | 2005-08-04 | 2011-12-21 | トヨタ自動車株式会社 | 精密加工装置 |
US8377159B2 (en) | 2007-03-26 | 2013-02-19 | Tokyo Diamond Tools Mfg. Co., Ltd. | Synthetic grinding stone |
FI20095273A0 (fi) * | 2009-03-17 | 2009-03-17 | On2 Technologies Finland Oy | Digitaalinen videokoodaus |
US9014265B1 (en) | 2011-12-29 | 2015-04-21 | Google Inc. | Video coding using edge detection and block partitioning for intra prediction |
CN102658518A (zh) * | 2012-04-16 | 2012-09-12 | 肇庆市第二机床厂有限公司 | 一种自动恒压多工位抛光机 |
US8819525B1 (en) | 2012-06-14 | 2014-08-26 | Google Inc. | Error concealment guided robustness |
JP5930871B2 (ja) * | 2012-06-27 | 2016-06-08 | コマツNtc株式会社 | 研削加工装置およびその制御方法 |
US9210424B1 (en) | 2013-02-28 | 2015-12-08 | Google Inc. | Adaptive prediction block size in video coding |
US9313493B1 (en) | 2013-06-27 | 2016-04-12 | Google Inc. | Advanced motion estimation |
US9807416B2 (en) | 2015-09-21 | 2017-10-31 | Google Inc. | Low-latency two-pass video coding |
JP6509766B2 (ja) * | 2016-03-08 | 2019-05-08 | 東芝メモリ株式会社 | 半導体製造装置および半導体装置の製造方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS4840872B1 (ja) * | 1970-03-28 | 1973-12-03 | ||
JPS4840860B1 (ja) * | 1970-08-28 | 1973-12-03 | ||
US3919614A (en) * | 1972-01-17 | 1975-11-11 | Warner Swasey Co | Dual-cycle cam grinding machine with electrical pulse operated wheel feed |
US4528743A (en) * | 1982-01-16 | 1985-07-16 | Hauni-Werke Korber & Co. Kg | Grinding machine with magazine for spare grinding wheels |
JPS63144951A (ja) * | 1986-12-09 | 1988-06-17 | Yutaka Sangyo:Kk | 切断機の制御装置 |
JPH0671708B2 (ja) * | 1986-12-15 | 1994-09-14 | 鐘紡株式会社 | 半導体ウエハ−研磨用砥石 |
JPS63245369A (ja) * | 1987-03-27 | 1988-10-12 | Shintou Bureetaa Kk | 研摩方法及びその装置 |
JPH0632885B2 (ja) | 1987-05-19 | 1994-05-02 | 日清工業株式会社 | セラミックスの研削方法および装置 |
JP3037857B2 (ja) * | 1993-10-28 | 2000-05-08 | 新日本製鐵株式会社 | ベルト研削方法およびベルト研削装置 |
JP3052201B2 (ja) * | 1998-11-06 | 2000-06-12 | 茨城県 | 精密平面加工機械 |
KR20000047941A (ko) * | 1998-12-07 | 2000-07-25 | 세야 히로미치 | 유리 퍼널 시일 엣지를 연마하기 위한 방법 및 그 연마 장비 |
JP2000288929A (ja) * | 1999-04-06 | 2000-10-17 | Yotaro Hatamura | 板状体の研削方法及びその装置 |
JP2001260014A (ja) * | 2000-03-14 | 2001-09-25 | Toyoda Mach Works Ltd | 枚葉式両面ラップ盤およびウェーハ製造方法 |
JP2002134450A (ja) * | 2000-10-19 | 2002-05-10 | Inst Of Physical & Chemical Res | ウエハの薄厚加工方法及び装置 |
JP2002239881A (ja) * | 2001-02-08 | 2002-08-28 | Shigiya Machinery Works Ltd | 研削加工機による加工方法と、その装置 |
JP4573492B2 (ja) * | 2001-03-27 | 2010-11-04 | 株式会社東京ダイヤモンド工具製作所 | 合成砥石 |
JP2003103441A (ja) * | 2001-09-28 | 2003-04-08 | Toyoda Mach Works Ltd | 枚葉式両面加工装置 |
JP2003251555A (ja) | 2001-12-28 | 2003-09-09 | Ebara Corp | ポリッシング方法 |
JP4245141B2 (ja) * | 2003-04-23 | 2009-03-25 | 株式会社ディスコ | 研削装置 |
JP4153857B2 (ja) * | 2003-04-30 | 2008-09-24 | 株式会社日平トヤマ | 鏡面仕上げ装置 |
JP4387706B2 (ja) | 2003-06-30 | 2009-12-24 | コマツ工機株式会社 | 研削加工装置及び研削加工方法 |
CN1289262C (zh) | 2004-03-29 | 2006-12-13 | 湖南大学 | 纳米结构陶瓷涂层材料的精密磨削工艺 |
JP4396518B2 (ja) | 2004-12-28 | 2010-01-13 | トヨタ自動車株式会社 | 姿勢制御装置および精密加工装置 |
JP4506461B2 (ja) | 2004-12-28 | 2010-07-21 | トヨタ自動車株式会社 | 精密加工装置および精密加工方法 |
JP4852868B2 (ja) | 2005-04-04 | 2012-01-11 | トヨタ自動車株式会社 | 精密加工方法 |
JP4839720B2 (ja) | 2005-08-04 | 2011-12-21 | トヨタ自動車株式会社 | 精密加工装置 |
-
2005
- 2005-04-04 JP JP2005107821A patent/JP4852868B2/ja not_active Expired - Fee Related
-
2006
- 2006-04-04 WO PCT/JP2006/307518 patent/WO2006107111A1/ja active Application Filing
- 2006-04-04 EP EP06731465A patent/EP1889686B1/en not_active Not-in-force
- 2006-04-04 CN CN200680010445A patent/CN100577355C/zh not_active Expired - Fee Related
- 2006-04-04 US US11/887,786 patent/US7997953B2/en not_active Expired - Fee Related
- 2006-04-04 KR KR1020077025216A patent/KR100953293B1/ko not_active IP Right Cessation
- 2006-04-04 DE DE602006019720T patent/DE602006019720D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
KR100953293B1 (ko) | 2010-04-20 |
KR20070118278A (ko) | 2007-12-14 |
JP2006281412A (ja) | 2006-10-19 |
EP1889686A1 (en) | 2008-02-20 |
DE602006019720D1 (de) | 2011-03-03 |
CN100577355C (zh) | 2010-01-06 |
US20090047869A1 (en) | 2009-02-19 |
CN101151123A (zh) | 2008-03-26 |
EP1889686A4 (en) | 2009-01-21 |
US7997953B2 (en) | 2011-08-16 |
EP1889686B1 (en) | 2011-01-19 |
WO2006107111A1 (ja) | 2006-10-12 |
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