DE602006019720D1 - Präzisionsbearbeitungsverfahren - Google Patents

Präzisionsbearbeitungsverfahren

Info

Publication number
DE602006019720D1
DE602006019720D1 DE602006019720T DE602006019720T DE602006019720D1 DE 602006019720 D1 DE602006019720 D1 DE 602006019720D1 DE 602006019720 T DE602006019720 T DE 602006019720T DE 602006019720 T DE602006019720 T DE 602006019720T DE 602006019720 D1 DE602006019720 D1 DE 602006019720D1
Authority
DE
Germany
Prior art keywords
processing procedures
precision processing
precision
procedures
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006019720T
Other languages
English (en)
Inventor
Sumio Kamiya
Hisao Iwase
Tetsuya Nagaike
Hiroshi Eda
Libo Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of DE602006019720D1 publication Critical patent/DE602006019720D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE602006019720T 2005-04-04 2006-04-04 Präzisionsbearbeitungsverfahren Active DE602006019720D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005107821A JP4852868B2 (ja) 2005-04-04 2005-04-04 精密加工方法
PCT/JP2006/307518 WO2006107111A1 (ja) 2005-04-04 2006-04-04 精密加工方法

Publications (1)

Publication Number Publication Date
DE602006019720D1 true DE602006019720D1 (de) 2011-03-03

Family

ID=37073642

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006019720T Active DE602006019720D1 (de) 2005-04-04 2006-04-04 Präzisionsbearbeitungsverfahren

Country Status (7)

Country Link
US (1) US7997953B2 (de)
EP (1) EP1889686B1 (de)
JP (1) JP4852868B2 (de)
KR (1) KR100953293B1 (de)
CN (1) CN100577355C (de)
DE (1) DE602006019720D1 (de)
WO (1) WO2006107111A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8824553B2 (en) 2003-05-12 2014-09-02 Google Inc. Video compression method
JP4852868B2 (ja) 2005-04-04 2012-01-11 トヨタ自動車株式会社 精密加工方法
JP4839720B2 (ja) 2005-08-04 2011-12-21 トヨタ自動車株式会社 精密加工装置
ATE550144T1 (de) 2007-03-26 2012-04-15 Tokyo Diamond Tools Mfg Co Ltd Synthetischer schleifstein
FI20095273A0 (fi) * 2009-03-17 2009-03-17 On2 Technologies Finland Oy Digitaalinen videokoodaus
US9014265B1 (en) 2011-12-29 2015-04-21 Google Inc. Video coding using edge detection and block partitioning for intra prediction
CN102658518A (zh) * 2012-04-16 2012-09-12 肇庆市第二机床厂有限公司 一种自动恒压多工位抛光机
US8819525B1 (en) 2012-06-14 2014-08-26 Google Inc. Error concealment guided robustness
JP5930871B2 (ja) * 2012-06-27 2016-06-08 コマツＮｔｃ株式会社 研削加工装置およびその制御方法
US9210424B1 (en) 2013-02-28 2015-12-08 Google Inc. Adaptive prediction block size in video coding
US9313493B1 (en) 2013-06-27 2016-04-12 Google Inc. Advanced motion estimation
US9807416B2 (en) 2015-09-21 2017-10-31 Google Inc. Low-latency two-pass video coding
JP6509766B2 (ja) * 2016-03-08 2019-05-08 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840872B1 (de) * 1970-03-28 1973-12-03
JPS4840860B1 (de) * 1970-08-28 1973-12-03
US3919614A (en) * 1972-01-17 1975-11-11 Warner Swasey Co Dual-cycle cam grinding machine with electrical pulse operated wheel feed
US4528743A (en) * 1982-01-16 1985-07-16 Hauni-Werke Korber & Co. Kg Grinding machine with magazine for spare grinding wheels
JPS63144951A (ja) * 1986-12-09 1988-06-17 Yutaka Sangyo:Kk 切断機の制御装置
JPH0671708B2 (ja) * 1986-12-15 1994-09-14 鐘紡株式会社 半導体ウエハ−研磨用砥石
JPS63245369A (ja) * 1987-03-27 1988-10-12 Shintou Bureetaa Kk 研摩方法及びその装置
JPH0632885B2 (ja) 1987-05-19 1994-05-02 日清工業株式会社 セラミックスの研削方法および装置
JP3037857B2 (ja) * 1993-10-28 2000-05-08 新日本製鐵株式会社 ベルト研削方法およびベルト研削装置
JP3052201B2 (ja) * 1998-11-06 2000-06-12 茨城県 精密平面加工機械
KR20000047941A (ko) * 1998-12-07 2000-07-25 세야 히로미치 유리 퍼널 시일 엣지를 연마하기 위한 방법 및 그 연마 장비
JP2000288929A (ja) * 1999-04-06 2000-10-17 Yotaro Hatamura 板状体の研削方法及びその装置
JP2001260014A (ja) * 2000-03-14 2001-09-25 Toyoda Mach Works Ltd 枚葉式両面ラップ盤およびウェーハ製造方法
JP2002134450A (ja) * 2000-10-19 2002-05-10 Inst Of Physical & Chemical Res ウエハの薄厚加工方法及び装置
JP2002239881A (ja) * 2001-02-08 2002-08-28 Shigiya Machinery Works Ltd 研削加工機による加工方法と、その装置
JP4573492B2 (ja) 2001-03-27 2010-11-04 株式会社東京ダイヤモンド工具製作所 合成砥石
JP2003103441A (ja) * 2001-09-28 2003-04-08 Toyoda Mach Works Ltd 枚葉式両面加工装置
JP2003251555A (ja) 2001-12-28 2003-09-09 Ebara Corp ポリッシング方法
JP4245141B2 (ja) * 2003-04-23 2009-03-25 株式会社ディスコ 研削装置
JP4153857B2 (ja) * 2003-04-30 2008-09-24 株式会社日平トヤマ 鏡面仕上げ装置
JP4387706B2 (ja) 2003-06-30 2009-12-24 コマツ工機株式会社 研削加工装置及び研削加工方法
CN1289262C (zh) 2004-03-29 2006-12-13 湖南大学 纳米结构陶瓷涂层材料的精密磨削工艺
JP4506461B2 (ja) 2004-12-28 2010-07-21 トヨタ自動車株式会社 精密加工装置および精密加工方法
JP4396518B2 (ja) 2004-12-28 2010-01-13 トヨタ自動車株式会社 姿勢制御装置および精密加工装置
JP4852868B2 (ja) 2005-04-04 2012-01-11 トヨタ自動車株式会社 精密加工方法
JP4839720B2 (ja) 2005-08-04 2011-12-21 トヨタ自動車株式会社 精密加工装置

Also Published As

Publication number Publication date
WO2006107111A1 (ja) 2006-10-12
CN100577355C (zh) 2010-01-06
EP1889686B1 (de) 2011-01-19
EP1889686A4 (de) 2009-01-21
KR20070118278A (ko) 2007-12-14
JP4852868B2 (ja) 2012-01-11
CN101151123A (zh) 2008-03-26
US7997953B2 (en) 2011-08-16
JP2006281412A (ja) 2006-10-19
EP1889686A1 (de) 2008-02-20
KR100953293B1 (ko) 2010-04-20
US20090047869A1 (en) 2009-02-19

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