JP4851037B2 - 低損失ビーム経路を有する電子ビーム装置 - Google Patents
低損失ビーム経路を有する電子ビーム装置 Download PDFInfo
- Publication number
- JP4851037B2 JP4851037B2 JP2001520444A JP2001520444A JP4851037B2 JP 4851037 B2 JP4851037 B2 JP 4851037B2 JP 2001520444 A JP2001520444 A JP 2001520444A JP 2001520444 A JP2001520444 A JP 2001520444A JP 4851037 B2 JP4851037 B2 JP 4851037B2
- Authority
- JP
- Japan
- Prior art keywords
- dose
- electron beam
- window
- gap
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010894 electron beam technology Methods 0.000 title claims description 181
- 239000000758 substrate Substances 0.000 claims description 72
- 239000010410 layer Substances 0.000 claims description 40
- 230000005855 radiation Effects 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 13
- 229920006254 polymer film Polymers 0.000 claims description 9
- 230000000593 degrading effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 description 155
- 238000000576 coating method Methods 0.000 description 61
- 239000011248 coating agent Substances 0.000 description 59
- 229920001721 polyimide Polymers 0.000 description 37
- 239000010936 titanium Substances 0.000 description 36
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 35
- 229910052719 titanium Inorganic materials 0.000 description 35
- 230000001070 adhesive effect Effects 0.000 description 32
- 239000004642 Polyimide Substances 0.000 description 31
- 239000000853 adhesive Substances 0.000 description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 28
- 230000015556 catabolic process Effects 0.000 description 27
- 238000006731 degradation reaction Methods 0.000 description 26
- 238000012360 testing method Methods 0.000 description 24
- 238000010521 absorption reaction Methods 0.000 description 22
- 238000009826 distribution Methods 0.000 description 20
- 239000012790 adhesive layer Substances 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 239000011247 coating layer Substances 0.000 description 13
- 230000007423 decrease Effects 0.000 description 13
- 229910052757 nitrogen Inorganic materials 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 239000011253 protective coating Substances 0.000 description 11
- 150000003254 radicals Chemical class 0.000 description 11
- 230000006866 deterioration Effects 0.000 description 10
- 230000002829 reductive effect Effects 0.000 description 9
- 239000002390 adhesive tape Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 230000035515 penetration Effects 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 238000004364 calculation method Methods 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000002596 correlated effect Effects 0.000 description 4
- 238000004980 dosimetry Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 239000012855 volatile organic compound Substances 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- 238000000342 Monte Carlo simulation Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 241000282376 Panthera tigris Species 0.000 description 2
- -1 Polyethylene Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 231100000987 absorbed dose Toxicity 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000746 allylic group Chemical group 0.000 description 1
- 150000008430 aromatic amides Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003278 mimic effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J33/00—Discharge tubes with provision for emergence of electrons or ions from the vessel; Lenard tubes
- H01J33/02—Details
- H01J33/04—Windows
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Apparatus For Disinfection Or Sterilisation (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38673599A | 1999-08-31 | 1999-08-31 | |
| US09/386,735 | 1999-08-31 | ||
| PCT/US2000/020905 WO2001016991A1 (en) | 1999-08-31 | 2000-08-01 | Electron beam apparatus having a low loss beam path |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003508760A JP2003508760A (ja) | 2003-03-04 |
| JP2003508760A5 JP2003508760A5 (enExample) | 2007-08-09 |
| JP4851037B2 true JP4851037B2 (ja) | 2012-01-11 |
Family
ID=23526836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001520444A Expired - Fee Related JP4851037B2 (ja) | 1999-08-31 | 2000-08-01 | 低損失ビーム経路を有する電子ビーム装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6749903B2 (enExample) |
| EP (1) | EP1208581A1 (enExample) |
| JP (1) | JP4851037B2 (enExample) |
| AU (1) | AU6892000A (enExample) |
| CA (1) | CA2384608C (enExample) |
| WO (1) | WO2001016991A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE526700C2 (sv) * | 2003-06-19 | 2005-10-25 | Tetra Laval Holdings & Finance | Anordning och förfarande för sterilisering av en materialbana med elektronbestrålning |
| EP1670017A1 (en) * | 2004-12-03 | 2006-06-14 | Mbda Uk Limited | Electron beam window, window assembly, and electron gun |
| US8300905B2 (en) * | 2005-11-18 | 2012-10-30 | General Electric Company | Adaptive image processing and display for digital and computed radiography images |
| WO2009086347A1 (en) * | 2007-12-27 | 2009-07-09 | 3M Innovative Properties Company | Method for making a functionalized membrane |
| SE0802101A2 (sv) * | 2008-10-07 | 2010-07-20 | Tetra Laval Holdings & Finance | Omkopplingsbar anordning för elektronstrålesterilisering |
| US9299465B1 (en) | 2014-09-30 | 2016-03-29 | Pct Engineered Systems, Llc | Electron beam system |
| JP2018529094A (ja) * | 2015-08-26 | 2018-10-04 | エナジー サイエンシーズ,インコーポレイティド | 調節可能な空隙を有する電子線装置 |
| US10991540B2 (en) * | 2018-07-06 | 2021-04-27 | Moxtek, Inc. | Liquid crystal polymer for mounting x-ray window |
| JP2023547755A (ja) * | 2020-10-21 | 2023-11-14 | テトラ ラバル ホールディングス アンド ファイナンス エス エイ | 電子ビームエミッタ用電子射出窓箔 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60231323A (ja) * | 1984-04-27 | 1985-11-16 | Mitsubishi Electric Corp | 電子ビ−ム描画装置 |
| JPH0252200A (ja) * | 1988-08-15 | 1990-02-21 | Nippon Steel Corp | 成型炭の製造方法 |
| JPH04227673A (ja) * | 1990-04-20 | 1992-08-17 | Minnesota Mining & Mfg Co <3M> | 低電圧電子線硬化性エラストマーベース感圧接着テープ |
| WO1994007248A1 (en) * | 1992-09-23 | 1994-03-31 | Raychem Corporation | Particle accelerator |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB301719A (en) * | 1928-02-29 | 1928-12-06 | Hermann Plauson | Improvements in cathode ray tubes |
| DE529237C (de) * | 1928-04-01 | 1931-07-10 | Strahlungschemie G M B H Ges | Strahlenaustrittsfenster fuer Kathoden- oder Roentgenstrahlenroehren |
| US3418155A (en) * | 1965-09-30 | 1968-12-24 | Ford Motor Co | Electron discharge control |
| US3916204A (en) * | 1974-05-03 | 1975-10-28 | Western Electric Co | Irradiating elongated material |
| US4140129A (en) | 1977-04-13 | 1979-02-20 | Applied Radiation Corporation | Beam defining system in an electron accelerator |
| US4193043A (en) | 1977-09-12 | 1980-03-11 | The United States Of America As Represented By The United States Department Of Energy | Microwave accelerator E-beam pumped laser |
| US4246297A (en) | 1978-09-06 | 1981-01-20 | Energy Sciences Inc. | Process and apparatus for the curing of coatings on sensitive substrates by electron irradiation |
| US4362965A (en) * | 1980-12-29 | 1982-12-07 | The United States Of America As Represented By The Secretary Of The Army | Composite/laminated window for electron-beam guns |
| US4631444A (en) | 1982-09-29 | 1986-12-23 | Tetra Pak Developpement Sa | Readily attachable and detachable electron-beam permeable window assembly |
| US4494036A (en) | 1982-11-22 | 1985-01-15 | Hewlett-Packard Company | Electron beam window |
| JPH0252200U (enExample) * | 1988-10-05 | 1990-04-13 | ||
| US5266400A (en) * | 1990-04-20 | 1993-11-30 | Minnesota Mining And Manufacturing Company | Low voltage electron beam radiation cured elastomer-based pressure sensitive adhesive tape |
| US5147711A (en) * | 1990-10-10 | 1992-09-15 | The United States Of America As Represented By The United States Department Of Energy | Vacuum barrier for excimer lasers |
-
2000
- 2000-08-01 CA CA002384608A patent/CA2384608C/en not_active Expired - Fee Related
- 2000-08-01 JP JP2001520444A patent/JP4851037B2/ja not_active Expired - Fee Related
- 2000-08-01 WO PCT/US2000/020905 patent/WO2001016991A1/en not_active Ceased
- 2000-08-01 EP EP00957276A patent/EP1208581A1/en not_active Withdrawn
- 2000-08-01 AU AU68920/00A patent/AU6892000A/en not_active Abandoned
-
2002
- 2002-09-17 US US10/245,208 patent/US6749903B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60231323A (ja) * | 1984-04-27 | 1985-11-16 | Mitsubishi Electric Corp | 電子ビ−ム描画装置 |
| JPH0252200A (ja) * | 1988-08-15 | 1990-02-21 | Nippon Steel Corp | 成型炭の製造方法 |
| JPH04227673A (ja) * | 1990-04-20 | 1992-08-17 | Minnesota Mining & Mfg Co <3M> | 低電圧電子線硬化性エラストマーベース感圧接着テープ |
| WO1994007248A1 (en) * | 1992-09-23 | 1994-03-31 | Raychem Corporation | Particle accelerator |
Also Published As
| Publication number | Publication date |
|---|---|
| AU6892000A (en) | 2001-03-26 |
| CA2384608A1 (en) | 2001-03-08 |
| US6749903B2 (en) | 2004-06-15 |
| CA2384608C (en) | 2009-05-19 |
| JP2003508760A (ja) | 2003-03-04 |
| WO2001016991A1 (en) | 2001-03-08 |
| US20030094582A1 (en) | 2003-05-22 |
| EP1208581A1 (en) | 2002-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5065362B2 (ja) | 粒子ビーム処理装置 | |
| JP4851037B2 (ja) | 低損失ビーム経路を有する電子ビーム装置 | |
| US6188075B1 (en) | Electron beam irradiating method and object to be irradiated with electron beam | |
| JPH08510864A (ja) | 表面処理のための電子ビームアレイ | |
| JP4229593B2 (ja) | 低温電子ビーム重合 | |
| JP2018021205A (ja) | 架橋膜表面 | |
| JP2013523997A5 (enExample) | ||
| Azmoun et al. | A study of gain stability and charging effects in GEM foils | |
| JP5974106B2 (ja) | 切断性に優れた半導体ウエハー表面保護用粘着フィルム | |
| EP1735166B1 (en) | Materials treatable by particle beam processing apparatus, method of preparation, and package | |
| Hassan et al. | Irradiation influence on Mylar and Makrofol induced by argon ions in a plasma immersion ion implantation system | |
| CN103814093B (zh) | 调节粘着性的方法 | |
| US5066565A (en) | Selective protection of poly(tetra-fluoroethylene) from effects of chemical etching | |
| US20030235659A1 (en) | Particle beam processing apparatus | |
| Torrisi | Ion irradiation of polymethylmetacrylate (PMMA) | |
| WO2014190077A1 (en) | Film and methods of forming same | |
| CA2025575C (en) | Process for improving the adhesiveness of the surface of bodies fabricated from a polymeric material, and so obtained fabricated bodies | |
| Debré et al. | Gamma irradiation-induced modifications of polymers found in nuclear waste embedding processes Part I: The epoxy/amine resin | |
| TW539655B (en) | Production method of optical fiber | |
| Dickinson et al. | Electron‐beam‐induced fracture of polymers | |
| JP3904380B2 (ja) | 電子線量の測定方法および電子線照射処理装置 | |
| Scherzer | On the dynamic inventory of deuterium implanted in graphite | |
| Kleiman et al. | Long-term stability of ion-beam treated space polymers in geo-simulated environment | |
| KOJIMA et al. | 3. 7 Dosimetry Systems For Characteristics Study of Thin Film Dosimeters (n) | |
| Zhang et al. | Modification of poly (tetrafluoroethylene) and gold surfaces by thermal graft copolymerization for adhesion improvement |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070618 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070618 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100615 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100914 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20100914 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110719 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110926 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111018 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111020 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141028 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |