JP4846650B2 - Electrode cover and vapor deposition device - Google Patents

Description

  The present invention relates to a thin film forming apparatus. In particular, the present invention relates to a vapor deposition apparatus having a mechanism for forming a film by a vapor deposition method using a material that can be formed by a vapor deposition method.

  In recent years, display devices in televisions, mobile phones, digital cameras, and the like have been demanded to be flat and thin display devices, and display devices using self-luminous light-emitting elements as display devices to satisfy these requirements. Is attracting attention. One of self-luminous light-emitting elements is a light-emitting element that uses electroluminescence. This light-emitting element is formed by sandwiching a light-emitting material between a pair of electrodes and applying a voltage to the light-emitting element. Light emission can be obtained.

  Such a self-luminous light emitting element has advantages such as higher pixel visibility than a liquid crystal display element and no need for a backlight, and is considered to be suitable as a flat panel display element. In addition, it is a great advantage that such a light-emitting element can be manufactured to be thin and light. Another feature is that the response speed is very fast.

  Further, since such a self-luminous light emitting element can be formed into a film shape, surface emission can be easily obtained by forming a large-area element. This is a feature that is difficult to obtain with a point light source typified by an incandescent bulb or LED, or a line light source typified by a fluorescent lamp, and therefore has a high utility value as a surface light source applicable to illumination or the like.

  A light-emitting element using electroluminescence is distinguished depending on whether the light-emitting material is an organic compound or an inorganic compound. Generally, the former is called an organic EL element and the latter is called an inorganic EL element.

  In an organic EL element using an organic compound as a light emitting material, the light emitting material is roughly classified into a high molecular (polymer) and a low molecular (monomer) material. A high molecular weight material is formed by a wet method such as a spin coating method or an ink jet method, and a low molecular weight material is mainly formed by a vapor deposition method.

  Usually, a vapor deposition apparatus has a holding part for holding a substrate and an evaporation source for holding a vapor deposition material. In the case of the resistance heating type vapor deposition apparatus, the evaporation source is installed between the electrodes, and the vapor deposition material is heated by passing an electric current through a boat, a crucible, a filament or the like holding the vapor deposition material using the electrode, A film can be formed.

  However, the electrode is located in the vicinity of a boat, crucible, filament, or the like that holds the vapor deposition material, and there is a problem that the vapor deposition material adheres during vapor deposition. Therefore, when depositing different materials, maintenance is required to clean the electrode and remove the material adhering to the electrode in order to prevent contamination.

  Moreover, in a large-sized vapor deposition apparatus, an electrode is also large and a weight is also large. Further, in the case of a vapor deposition apparatus having a plurality of evaporation sources, a large amount of labor is required for the cleaning operation because it has a plurality of pairs of electrodes. Moreover, although it is necessary to fix an electrode to the board etc. in which the evaporation source is installed, in order to prevent a fixing part from contamination, fixing from the lower part of a board is preferable. However, when the plate is fixed with screws or the like from the bottom of the plate, it is necessary to remove the plate on which the evaporation source is installed in order to remove the electrode for cleaning. The weight of the plate to be fixed may be 20 to 30 kg, and the work of removing the material adhering to the electrode is heavy labor. Further, in the case of a vapor deposition apparatus having a plurality of evaporation sources, the plate on which the plurality of evaporation sources are installed becomes heavier and more difficult.

  Therefore, an object of this invention is to provide the vapor deposition apparatus with easy maintenance. Another object of the present invention is to provide an electrode cover that prevents the deposition material from adhering to the electrode.

  One aspect of the present invention is an electrode cover that covers at least a part of an exposed surface of an electrode. In particular, the surface of the electrode on the evaporation source side is preferably covered.

  More preferably, it covers the entire exposed surface of the electrode. In addition, the part which connects each part of an electrode, or the part which connects an electrode and a power supply does not need to be covered.

  That is, one aspect of the present invention is an electrode cover that covers at least a part of an exposed surface of an electrode holding an evaporation source.

  Another aspect of the present invention is an electrode cover that covers at least a surface on an evaporation source side among exposed surfaces of an electrode holding an evaporation source.

  In the above configuration, the electrode cover is preferably made of a material having a high heat resistant temperature. Moreover, when an electrode consists of a several site | part and an electrode cover is provided between each site | part, it is preferable that the electrode cover is comprised with the electroconductive material. In the case where an electrode cover is not provided between each part of the electrode, the electrode cover is not limited to a conductive material, and may be made of a material having a heat resistant temperature higher than the temperature during vapor deposition (vapor deposition temperature). Good.

  Another aspect of the present invention is a vapor deposition apparatus using the above electrode cover.

  In other words, an electrode cover that includes at least a pair of electrodes and an evaporation source that is electrically connected between the pair of electrodes and covers at least a part of an exposed surface of the electrode is provided. It is the vapor deposition apparatus characterized by this.

  In addition, one aspect of the present invention includes at least a pair of electrodes and an evaporation source installed so as to be electrically connected between the pair of electrodes, and at least the evaporation source side of the exposed surfaces of the electrodes An electrode cover that covers the surface of the film is provided.

  Further, one aspect of the present invention includes a deposition chamber, a holding unit that holds an object to be processed, an evaporation source that holds an evaporation source, an electrode, an electrode cover, and a power source. It has a holding part on the upper side, an evaporation source, an electrode, and an electrode cover below the vapor deposition chamber. The electrode cover covers at least a part of the exposed surface of the electrode. The evaporation source and the power source are electrically connected, and the evaporation source is heated by resistance heating, and the material held in the evaporation source is transferred to the workpiece held above the evaporation source. A vapor deposition apparatus characterized in that a film is formed. Note that the power source may be installed outside the vapor deposition chamber.

  In addition, one aspect of the present invention includes a deposition chamber, a holding unit that holds an object to be processed, an evaporation source that holds an evaporation source, an electrode, an electrode cover, and a power source, and the evaporation chamber is held upward. And has an evaporation source, an electrode, and an electrode cover below. The electrode cover covers at least the evaporation source side surface of the exposed surface of the electrode, and the electrode and the power source are electrically connected. The evaporation source and the power source are electrically connected. The evaporation source is heated by resistance heating, and the material held in the evaporation source is formed on the workpiece held above the evaporation source. It is a vapor deposition apparatus characterized by being formed into a film.

  In the above configuration, the electrode cover preferably covers the entire exposed surface of the electrode. In addition, the part which connects each part of an electrode, or the part which connects an electrode and a power supply does not need to be covered.

  Moreover, in the said structure, it is preferable that the electrode cover is comprised with the material with high heat-resistant temperature. Moreover, when an electrode consists of a several site | part and an electrode cover is provided between each site | part, it is preferable that the electrode cover is comprised with the electroconductive material. In the case where an electrode cover is not provided between each part of the electrode, the electrode cover is not limited to a conductive material, and may be made of a material having a heat resistant temperature higher than the temperature during vapor deposition (vapor deposition temperature). Good.

  By using the electrode cover of the present invention, it is possible to prevent the deposition material from adhering to the electrode of the deposition apparatus.

  Further, by removing the electrode cover, the vapor deposition material adhering to the electrode can be removed, and maintenance of the vapor deposition apparatus is simplified. Further, since the maintenance is simplified and the time is shortened, the productivity of products manufactured using the vapor deposition apparatus is improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below.

  Note that a light-emitting device in this specification includes an image display device, a light-emitting device, or a light source (including a lighting device). In addition, a module in which a connector such as an FPC (Flexible Printed Circuit) or TAB (Tape Automated Bonding) tape or TCP (Tape Carrier Package) is attached to the panel, a TAB tape or a module having a printed wiring board at the end of TCP, Alternatively, a module in which an IC (integrated circuit) is directly mounted on a light emitting element by a COG (Chip On Glass) method is included in the light emitting device.

(Embodiment 1)
In this embodiment, a vapor deposition apparatus and an electrode cover of the present invention will be described.

  FIG. 1 shows one embodiment of the vapor deposition apparatus and electrode cover of the present invention. In FIG. 1A, a vapor deposition apparatus includes a holding unit 103 that holds an object to be processed 102, a plate 104 on which an evaporation source is installed, and an evaporation source 114 in an evaporation chamber 101. By heating the vapor deposition material held in the evaporation source 114, the vapor deposition material can be deposited on the surface of the workpiece held above. In FIG. 1A, a deposition plate 107 is provided to prevent the vapor deposition material from spreading throughout the vapor deposition chamber during vapor deposition. The evaporation source 114 is electrically connected to a pair of electrodes, and each electrode includes an upper part 111a of the electrode, a middle part 111b of the electrode, and a lower part 111c of the electrode. Among the electrodes, the middle part 111b of the electrode and the lower part 111c of the electrode are fixed by a plate 104 on which the evaporation source is installed and a screw 112. The middle part 111 b of the electrode and the lower part 111 c of the electrode are electrically connected by a screw 112. The upper part 111 a of the electrode is fixed by the middle part 111 b of the electrode and the screw 113. The evaporation source 114 can be held by sandwiching an evaporation source in which an evaporation material is held or an end of the evaporation source formed of the evaporation material between the upper part 111a of the electrode and the middle part 111b of the electrode. Further, the electrode and the evaporation source 114 can be electrically connected. The lower part 111 c of the electrode fixed to the plate 104 on which the evaporation source is installed is connected to the power source 106.

  When the plate 104 on which the evaporation source is installed is made of a conductive material, the insulating plate 105a, the plate 104, and the lower portion 111c of the electrode are interposed between the plate 104 and the middle portion 111b of the electrode. Is provided with an insulating plate 105b. By providing the insulating plate 105a and the insulating plate 105b, a short circuit between the two electrodes via the plate 104 can be prevented.

  Various sources can be used as the evaporation source. For example, it is good also as a structure which heats the vapor deposition material hold | maintained at the boat and the crucible with the heating source 303 using the boat 301 as shown to FIG. 8 (A), the crucible 302 as shown to FIG. 8 (B), As shown in FIG. 8C, a structure using a filament 304 formed of an evaporation material may be used. Moreover, the structure by which the vapor deposition material was hold | maintained at the filament may be sufficient. Various shapes of boats, crucibles, and filaments can be used. For example, as shown in FIG. 9A, an upper portion 401 and a lower portion 402 are provided, and the upper portion 401 has a plurality of holes. As shown in FIG. 9B, a boat having an upper part 403 and a lower part 404 and having one hole in the upper part 403 can be used. Further, as shown in FIG. 9C, a boat having an upper part 405, a middle part 406, and a lower part 407, one hole in the upper part 405, and two holes in the middle part 406. Can be used.

  The middle part 111 b of the electrode is covered with an electrode cover 121. FIG. 1B shows a perspective view of the electrode cover 121 as viewed from above, and FIG. 1C shows a perspective view of the electrode cover 121 as viewed from below. Further, FIG. 1D shows a perspective view seen from above the middle portion 111b of the electrode. Note that a cut surface represented by XY in FIG. 1D corresponds to a cross-sectional view of the middle portion 111b of the electrode located on the left side of FIG. Since the middle portion 111b of the electrode is electrically connected to the upper portion 111a of the electrode by the screw 113, the middle portion 111b of the electrode has a screw hole 141 as shown in FIG. Further, the middle portion 111b of the electrode shown in this embodiment is opposite to the upper surface (first surface 131), the side surface on the side where the evaporation source is installed (second surface 132), and the side where the evaporation source is installed. Side surface (fourth surface 134), other side surfaces (third surface 133 and fifth surface 135), and a surface (sixth surface 136) located on the plate 104 side where the evaporation source is installed.

  The electrode cover shown in FIG. 1 (A) is provided so as to cover all of the one surface located on the plate 104 side where the evaporation source is installed in the middle portion 111b of the electrode and the portion other than the portion connecting each portion of the electrode. 1B corresponds to a cross-sectional view of the middle portion 111b of the electrode and the electrode cover 121 located on the left side of FIG. 1A. In FIG. 1B and FIG. 1C, the electrode cover 121 is provided so as to cover other than the surface (sixth surface 136) and the screw hole 141 located on the plate 104 side of the middle portion 111b of the electrode. That is, the upper surface (first surface 131) of the middle portion 111b of the electrode, the side surface (second surface 132) on the side where the evaporation source is installed, and the side surface (fourth surface 134) opposite to the side where the evaporation source is installed. The other side surfaces (the third surface 133 and the fifth surface 135) are covered with the electrode cover 121.

  The electrode cover is preferably formed using a conductive material. By using a conductive material, the electrode and the evaporation source 114 can be electrically connected. Moreover, since the evaporation source becomes high temperature, the electrode cover is preferably formed of a material having high heat resistance. In the case of depositing an organic compound, the electrode cover is preferably formed of a material having a melting point of 300 ° C. or higher. Moreover, when depositing an inorganic compound having a higher deposition temperature than the organic compound, it is preferable that the material is formed of a material having a higher melting point, and the electrode cover is formed of a material having a melting point of 900 ° C. or higher. Is preferred. For example, a metal having a high melting point such as copper (Cu), gold (Au), silver (Ag), platinum (Pt), etc., and excellent conductivity can be used. An alloy may also be used.

  In addition, a screw hole for fixing the upper portion 111a of the electrode is formed on the upper portion 111a side of the electrode of the electrode cover 121. In order to electrically connect the middle part 111b of the electrode and the lower part 111c of the electrode, the screw 112 is formed using a conductive material.

  A vapor deposition apparatus using an electrode cover having a shape different from that in FIG. 1 is shown in FIG. FIG. 2B shows a perspective view of the electrode cover 122 as viewed from above, and FIG. 2C shows a perspective view of the electrode cover 122 as viewed from below. FIG. 2D shows a perspective view seen from above the middle portion 111b of the electrode. Note that a cut surface represented by XY in FIG. 2D corresponds to a cross-sectional view of the middle portion 111b of the electrode located on the left side of FIG. In FIG. 2, the electrode cover 122 is formed so as to cover the middle part of the electrode except for the surface opposite to the surface where the evaporation source is installed (fourth surface 134) and the surface on the plate 104 side (sixth surface 136). Has been. That is, the electrode cover 122 includes the upper surface (first surface 131) of the middle portion 111b of the electrode, the side surface (second surface 132) on the side where the evaporation source is installed, and the side surfaces (third surface 133 and fifth surface 135). Covering.

  Further, in FIG. 3, as another configuration, the electrode cover 123 covers other than the side surface (third surface 133 and fifth surface 135) of the electrode middle portion 111 b and the surface on the plate 104 side (sixth surface 136). The structure formed in is shown. In other words. The electrode cover 123 includes a surface (fourth surface 134) opposite to the surface on which the evaporation source of the middle part 111b of the electrode is installed, a surface (second surface 132) on which the evaporation source is installed, and a surface on the upper 111a side of the electrode. (First surface 131) is covered.

  In FIG. 4, the electrode cover 124 includes a side surface (third surface 133 and fifth surface 135) of the middle portion 111 b of the electrode and a surface (fourth surface 134) opposite to the surface on which the evaporation source is installed. The structure formed so that it may cover except the surface (6th surface 136) by the side of 104 is shown. That is, the electrode cover 124 covers the surface (second surface 132) where the evaporation source of the middle part 111b of the electrode is installed and the surface (first surface 131) on the upper part 111a side of the electrode.

  Further, in FIG. 5, as another configuration, the surface (second surface 132) where the evaporation source of the middle part 111 b of the electrode is installed and the surface (first surface 131) on the upper part 111 a side of the electrode are covered. An oblique surface is provided so as to prevent adhesion to the side surfaces (the third surface 133 and the fifth surface 135). As in the case of the electrode cover 125 illustrated in FIG. 5, the electrode cover may not necessarily be in contact with the electrode surface as long as the deposition material can be prevented from adhering to the electrode.

  FIG. 6 shows an electrode cover 126 that covers only the side surfaces (second surface 132, third surface 133, fourth surface 134, and fifth surface 135) of the middle portion 111b of the electrode. That is, the electrode cover covers the middle portion 111b of the electrode except for the surface on the upper 111a side (first surface 131) and the surface on the lower 111c side (sixth surface 136) of the electrode. In the case of an electrode cover that covers only the side surface of the electrode, there is no cover on the lower 111c side of the electrode and the upper 111a side of the electrode, so the electrode and the end of the evaporation source are electrically connected without a cover. The Therefore, the electrode cover may not have conductivity. Therefore, the electrode cover should just be formed using the material with high heat resistance, for example, ceramic etc. can also be used. In the case of depositing an organic compound, the electrode cover is preferably formed of a material having a heat resistant temperature of 300 ° C. or higher. In addition, when depositing an inorganic compound having a higher deposition temperature than the organic compound, the electrode cover is preferably formed of a material having a higher heat resistance temperature, and the electrode cover is made of a material having a heat resistance temperature of 900 ° C. or higher. Preferably it is formed.

  FIG. 7 also shows a surface (fourth surface 134) opposite to the surface on which the evaporation source of the middle part 111b of the electrode is installed, a surface on the plate side on which the evaporation source is installed (sixth surface 136), and the electrode. An electrode cover 127 covering the surface other than the surface (first surface 131) on the upper side 111a side is shown. In other words, the electrode cover 127 covers the surface (second surface 132) and the side surfaces (third surface 133 and fifth surface 135) where the evaporation source of the middle part 111b of the electrode is installed. Similarly to the electrode cover shown in FIG. 6, the electrode cover shown in FIG. 7 is not provided with a cover on the lower electrode 111c side and the upper electrode 111a side, so the electrode cover does not have conductivity. Good.

  As described above, since the electrode cover of the present invention prevents the deposition material from adhering to the electrode, it is preferably provided so as to cover at least a part of the exposed surface of the electrode. In particular, it is preferably formed so as to cover the surface of the electrode on the evaporation source side.

  The electrode cover can be used not only for the middle part 111b of the electrode but also for the upper part 111a of the electrode. By using for the upper part 111a of an electrode, adhesion of the vapor deposition material to the upper part 111a of an electrode can be prevented. In addition, by using a plurality of electrode covers, the number of electrode cleanings can be reduced, and maintenance work is simplified. The electrode cover may be disposable. That is, after use, it may be discarded without being washed. In that case, it is preferable to form the electrode cover with an inexpensive material. Further, the electrode cover can be formed at a lower cost by forming the electrode cover with a thin film.

  The shape of the electrode is not particularly limited. Further, the electrode cover may be designed as appropriate so as to prevent the deposition material from adhering to the electrode, and the shape is not particularly limited. For example, the electrode may have a rectangular parallelepiped shape or a polygonal columnar shape. It may be cylindrical. In the case of a cylindrical shape, an electrode cover may be provided so as to cover the evaporation source side of the electrode. Preferably, a cover is provided so as to cover more than half of the cylindrical side surface.

  In FIG. 1, the upper portion 111a of the electrode and the middle portion 111b of the electrode have the same cross-sectional shape, but the size and shape of each portion of the electrode may be different. For example, the size of the upper part of the electrode may be made smaller than the middle part of the electrode. In that case, it is preferable to provide an electrode cover so as to cover the surface between the middle part of the electrode and the upper part of the electrode.

  By providing the electrode cover of the present invention and removing the electrode cover after vapor deposition, the vapor deposition material adhering to the electrode can be removed, and maintenance of the vapor deposition apparatus is simplified. Further, since the maintenance is simplified and the time is shortened, the productivity of products manufactured using the vapor deposition apparatus is improved.

(Embodiment 2)
In this embodiment, an evaporation apparatus having a plurality of evaporation sources will be described with reference to FIG.

  In FIG. 10, the vapor deposition apparatus includes a holding unit 203 that holds an object to be processed 202, a plate 204 on which an evaporation source is installed, and an evaporation source 214 in an evaporation chamber 201. The evaporation source 214 is electrically connected to a pair of electrodes. Among the electrodes, the middle part 211b of the electrode and the lower part 211c of the electrode are fixed by a plate 204 on which the evaporation source is installed and a screw 212. . The middle part 211b of the electrode and the lower part 211c of the electrode are electrically connected by a screw 212. The upper part 211 a of the electrode is fixed by the middle part 211 b of the electrode and the screw 213. The evaporation source 214 can be held by sandwiching the evaporation source in which the evaporation material is held or the end of the evaporation source formed of the evaporation material between the upper part 211a of the electrode and the middle part 211b of the electrode. In addition, the electrode and the evaporation source 214 can be electrically connected. The lower part 211c of the electrode fixed to the plate 204 on which the evaporation source is installed can be connected to the power source 206.

  When the plate 204 on which the evaporation source is installed is made of a conductive material, the insulating plate 205a, the plate 204, and the plate 204 between the evaporation source and the middle part 211b of the electrode An insulating plate 205b is provided between the lower portions 211c of the electrodes. By providing the insulating plate 205a and the insulating plate 205b, a short circuit between both electrodes can be prevented.

  In the vapor deposition apparatus shown in FIG. 10, the plate on which the evaporation source is installed is circular, and the plurality of evaporation sources are arranged radially. The circular plate has a rotating shaft 207, and the evaporation source can be moved to a desired position and connected to the power source 206 by rotating around the rotating shaft 207. The pair of electrodes connected to the evaporation source may have the same shape or different shapes. Each electrode is provided with an electrode cover so as to cover the side surface on the evaporation source side.

  In the case of a vapor deposition apparatus having a plurality of evaporation sources as described above, the number of electrodes is large and the time required for maintenance work is long, but the maintenance work time can be shortened by using the electrode cover of the present invention. Can do. Further, the plate on which a plurality of evaporation sources are installed is heavier and the maintenance work is difficult, but the maintenance work can be greatly reduced by using the electrode cover of the present invention.

(Embodiment 3)
In this embodiment, one embodiment of a manufacturing apparatus having a plurality of vapor deposition chambers and a method for manufacturing a light-emitting device using the manufacturing apparatus will be described with reference to FIGS.

  Specifically, a multi-chamber manufacturing apparatus and manufacturing method will be described. In this manufacturing apparatus, after a thin film transistor, an anode (first electrode), a substrate 6111 provided with an insulator covering the end of the anode, and the like are continuously provided and processing such as film formation is continuously performed, A panel is completed by pasting the counter substrate separately from the substrate and performing a sealing process.

FIG. 11 shows gates 6000a to 6000w, transfer chambers 6001, 6002, 6003, 6004, and 6005 (a transfer robot 6112 for transferring a substrate is installed in each transfer chamber), a preparation chamber 6011, and delivery Chambers 6012, 6013, 6014, cassette chambers 6020a, 6020b, tray mounting stage 6021, film formation chamber 6022, substrate heating chamber 6023, substrate / mask stock chamber 6024, pretreatment chamber 6025, substrate heating chamber 6026, deposition chambers 6027Ha, 6027Ra, 6027Ga, 6027Ba, 6027Ea, pre-deposition chambers 6027Hb, 6027Rb, 6027Gb, 6027Bb, 6027Eb in which evaporation sources are installed, deposition chambers 6028, 6029, and sputtering chambers 6030, 6031 N ₂ replacement chamber for glass This is a multi-chamber manufacturing apparatus having a reference numeral 6032, a globe BOX 6033, a preparation chamber 6034, a substrate / opposing stock chamber 6035, a sealing chamber 6036, and an extraction chamber 6037.

  A cassette containing substrates is loaded into the cassette chamber 6020a or the cassette chamber 6020b.

  In the substrate / mask stock chamber 6024, metal masks to be used in a total of 10 chambers including a pretreatment chamber 6025, vapor deposition chambers 6027Ha, 6027Ra, 6027Ba, 6027Ga, 6027Ea, vapor deposition chambers 6028 and 6029, and sputtering chambers 6030 and 6031 are set.

A heater (such as a sheath heater) provided in the pretreatment chamber 6025 or the substrate heating chamber 6026 can perform substrate heating. In order to thoroughly remove moisture and other gases contained in the substrate, annealing for deaeration is performed under vacuum (5 × 10 ⁻³ torr (0.665 Pa) or less, preferably 10 ⁻⁴ to 10 ^−6. Pa). In particular, when an organic resin film is used as a material for an interlayer insulating film or a partition, depending on the organic resin material, moisture may be easily adsorbed and further degassing may occur. It is effective to perform vacuum heating to remove adsorbed moisture by performing natural cooling for 30 minutes after heating at 250 ° C., preferably 150 ° C. to 200 ° C., for example, 30 minutes or more.

  Next, after performing the above vacuum heating, the substrate is transferred from the transfer chamber 6002 to the vapor deposition chamber 6027Ha, and vacuum vapor deposition is performed to form a hole injection layer or a hole transport layer. Next, the substrate is transferred from the transfer chamber 6002 to the transfer chamber 6003 which is always kept in vacuum via the delivery chamber 6012 which is always kept in vacuum.

  Thereafter, the substrate is appropriately transferred to the vapor deposition chambers 6027Ra, 6027Ga, 6027Ba, and 6027Ea connected to the transfer chamber 6003, and the layers such as the red light emitting layer, the green light emitting layer, the blue light emitting layer, the electron transport layer, and the electron injection layer are vacuumed. It is formed by vapor deposition. Here, the vapor deposition chambers 6027Ha, 6027Ra, 6027Ga, 6027Ba, and 6027Ea will be described.

  In the vapor deposition chambers 6027Ha, 6027Ra, 6027Ga, 6027Ba, and 6027Ea, evaporation source holders and electrodes on which a plurality of evaporation sources can be mounted are installed. Multi-source co-evaporation can be easily performed. Each evaporation source is provided with an evaporation source shutter, and whether or not the material is actually evaporated is controlled by opening and closing the shutter.

  The deposition material is preferably installed in these deposition chambers by using the following manufacturing system. That is, it is preferable to form a film using a container (typically a crucible, a boat, or the like) in which a vapor deposition material is stored in advance by a material manufacturer. Furthermore, it is preferable that the installation is performed without exposure to the atmosphere, and the crucible is preferably introduced into the film formation chamber while being sealed in the second container when transported from the material manufacturer. Desirably, the pre-deposition chambers 6027Hb, 6027Rb, 6027Gb, 6027Bb, and 6027Eb having vacuum evacuation means connected to the deposition chambers 6027Ha, 6027Ra, 6027Ga, 6027Ba, and 6027Ea are set to a vacuum or an inert gas atmosphere. Take out the crucible from the container 2 and place the crucible in the evaporation source holder of the vapor deposition chamber. Thereby, not only can each deposition chamber 6027Ha, 6027Ra, 6027Ga, 6027Ba, 6027Ea be set to each evaporation source without opening it to the atmosphere, but also the crucible and the deposition material stored in the crucible immediately before the deposition. Can be kept clean.

  In the vapor deposition chamber, the electrode is covered with the electrode cover of the present invention shown in Embodiment Mode 1 to prevent the vapor deposition material from adhering to the electrode. For this reason, in a large-sized manufacturing apparatus as shown in the present embodiment, maintenance work can be reduced and product productivity is improved.

  By appropriately selecting a vapor deposition material used in the vapor deposition chambers 6027Ha, 6027Ra, 6027Ga, 6027Ba, and 6027Ea, a light emitting device that emits light of a single color (for example, white) or full color (red, green, blue) as a whole light emitting device. Can be formed.

  After the EL layer is appropriately formed by the above process, the substrate is transferred from the transfer chamber 6003 to the transfer chamber 6004 that is always kept in vacuum via the delivery chamber 6013 that is always kept in vacuum.

  Next, a cathode (second electrode) is formed. When the cathode is a reflective electrode, elements belonging to Group 1 or Group 2 of the Periodic Table of Elements, that is, alkali metals such as lithium (Li) and cesium (Cs), and magnesium (Mg), calcium (Ca), and strontium Alkaline earth metals such as (Sr) and alloys containing them (MgAg, AlLi), rare earth metals such as europium (Eu) and ytterbium (Yb) and alloys containing these can be used. For example, Al may be formed by a vacuum evaporation method using resistance heating in the evaporation chamber 6028 or the evaporation chamber 6029, or may be formed in the sputtering chamber 6030 or the sputtering chamber 6031 by a sputtering method.

Finally, a transparent protective film of calcium fluoride (abbreviation: CaF ₂ ) or zinc oxide (abbreviation: ZnO) is formed in the vapor deposition chamber 6028 or the vapor deposition chamber 6029.

  In the vapor deposition chamber, the electrode is covered with the electrode cover of the present invention shown in Embodiment Mode 1 to prevent the vapor deposition material from adhering to the electrode. For this reason, in a large-sized manufacturing apparatus as shown in the present embodiment, maintenance work can be reduced and product productivity is improved.

  Through the above process, a light-emitting element having a stacked structure is formed.

  Next, the substrate over which the light-emitting element is formed is sealed in a sealing chamber 6036, and the panel is completed. The panel thus completed is transferred to the take-out chamber 6037 via the transfer chamber 6005 and taken out.

  By using this manufacturing apparatus in the above procedure, a light emitting device can be manufactured.

  The manufacturing apparatus shown in this embodiment has a plurality of evaporation chambers and is a large manufacturing apparatus. Such a large manufacturing apparatus is more labor intensive than a small manufacturing apparatus, but the maintenance work can be greatly reduced by using the electrode cover of the present invention. Further, since the time required for maintenance work is shortened, productivity can be improved.

The figure explaining the electrode cover and vapor deposition apparatus of this invention. The figure explaining the electrode cover and vapor deposition apparatus of this invention. The figure explaining the electrode cover and vapor deposition apparatus of this invention. The figure explaining the electrode cover and vapor deposition apparatus of this invention. The figure explaining the electrode cover and vapor deposition apparatus of this invention. The figure explaining the electrode cover and vapor deposition apparatus of this invention. The figure explaining the electrode cover and vapor deposition apparatus of this invention. The figure explaining an evaporation source. The figure explaining an evaporation source. The figure explaining the vapor deposition apparatus of this invention. The figure explaining the manufacturing apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Deposition chamber 102 To-be-processed object 103 Holding part 104 Plate 105a Insulating plate 105b Insulating plate 106 Power supply 107 Depositing plate 111a Electrode upper part 111b Electrode middle part 111c Electrode lower part 112 Screw 113 Screw 114 Evaporation source 121 Electrode cover 122 Electrode cover 123 Electrode cover 124 Electrode cover 125 Electrode cover 126 Electrode cover 127 Electrode cover 131 1st surface 132 2nd surface 133 3rd surface 134 4th surface 135 5th surface 136 6th surface 141 Screw hole 201 Deposition chamber 202 Processed object 203 Holding Portion 204 Plate 205a Insulating plate 205b Insulating plate 206 Power source 207 Rotating shaft 211a Upper electrode 211b Middle electrode 211c Lower electrode 212 Screw 213 Screw 214 Evaporation source 301 Boat 302 Crucible 303 Heating source 304 Filament 401 Upper 402 Lower 4 3 Upper 404 Lower 405 Upper 406 Middle 407 Lower 6001 Transfer chamber 6002 Transfer chamber 6003 Transfer chamber 6004 Transfer chamber 6005 Transfer chamber 6011 Preparation chamber 6012 Delivery chamber 6013 Delivery chamber 6014 Delivery chamber 6020a Cassette chamber 6020b Cassette chamber 6021 Tray mounting stage 6022 Film formation Chamber 6023 Substrate heating chamber 6024 Substrate / mask stock chamber 6025 Pretreatment chamber 6026 Substrate heating chamber 6027Ha Deposition chamber 6027Hb Predeposition chamber 6027Ga Deposition chamber 6027Gb Predeposition chamber 6027Ba Deposition chamber 6027Bb Predeposition chamber 6027Ra Deposition chamber 6027Rb Predeposition chamber 6027Ea Deposition chamber 6027Eb evaporation front chamber 6028 deposition chamber 6029 deposition chamber 6030 sputtering chamber 6031 sputtering chamber 6032 opposite glass _{N 2} displacement chamber 6033 Grove BO
6034 Preparation chamber 6035 Substrate / opposite stock chamber 6036 Sealing chamber 6037 Extraction chamber 6111 Substrate 6111 Transfer robot 6000a Gate 6000b Gate 6000c Gate 6000d Gate 6000e Gate 6000f Gate 6000g Gate 6000h Gate 6000i Gate 6000j Gate 6000k Gate 6000l Gate 6000m Gate 6000m Gate 6000m Gate 6000m Gate 6000m Gate 6000m Gate 6000m Gate 6000p Gate 6000q Gate 6000r Gate 6000s Gate 6000t Gate 6000u Gate 6000v Gate 6000w Gate

Claims (13)

An electrode cover covering the electrode holding the evaporation source,
The electrode has an upper portion, a middle portion, and a lower portion,
Between the upper part of the electrode and the middle part of the electrode, the evaporation source is held across the end of the evaporation source,
The electrode cover is provided between an end portion of the evaporation source and a middle portion of the electrode,
The electrode cover covers the side surface of the evaporation source side of the middle of the previous SL electrode, and the electrode cover, characterized in that it have a surface not in contact with the middle of the electrode. An electrode cover covering the electrode holding the evaporation source,
The electrode has an upper portion, a middle portion, and a lower portion,
Between the upper part of the electrode and the middle part of the electrode, the evaporation source is held across the end of the evaporation source,
The electrode cover is provided between an end portion of the evaporation source and a middle portion of the electrode,
The electrode cover, electrode cover, characterized in that the pre-Symbol covering the side surface of the evaporation source side of central electrodes, and to have a diagonal of the surface not in contact with the middle of the electrode. An electrode cover covering the electrode holding the evaporation source,
The electrode has an upper portion, a middle portion, and a lower portion,
Between the upper part of the electrode and the middle part of the electrode, the evaporation source is held across the end of the evaporation source,
The electrode cover is provided between an end portion of the evaporation source and a middle portion of the electrode,
The electrode cover covers the side surface of the evaporation source side of the middle of the previous SL electrode, and an oblique surface not in contact with the middle of the electrode to prevent deposition of material from the evaporation source to middle of the electrode electrode cover, characterized in that the have a. An electrode cover covering the electrode holding the evaporation source,
The electrode has an upper part, a middle part, and a lower part electrically connected by screws;
Between the upper part of the electrode and the middle part of the electrode, the evaporation source is held across the end of the evaporation source,
The electrode cover is provided between an end portion of the evaporation source and a middle portion of the electrode,
The electrode cover covers the upper surface other than the hole of the screw provided in the middle of the electrode, covers the central side of the evaporation source side of the electrode, and to have a surface not in contact with the middle of the electrode An electrode cover featuring. An electrode cover covering the electrode holding the evaporation source,
The electrode has an upper part, a middle part, and a lower part electrically connected by screws;
Between the upper part of the electrode and the middle part of the electrode, the evaporation source is held across the end of the evaporation source,
The electrode cover is provided between an end portion of the evaporation source and a middle portion of the electrode,
The electrode cover covers an upper surface other than the screw hole provided in the middle of the electrode, covers a side surface on the evaporation source side of the middle of the electrode , and has an oblique surface not in contact with the middle of the electrode. An electrode cover. An electrode cover covering the electrode holding the evaporation source,
The electrode has an upper part, a middle part, and a lower part electrically connected by screws;
Between the upper part of the electrode and the middle part of the electrode, the evaporation source is held across the end of the evaporation source,
The electrode cover is provided between an end portion of the evaporation source and a middle portion of the electrode,
The electrode cover covers the upper surface other than the screw hole provided in the middle of the electrode, covers the side of the middle of the electrode on the evaporation source side, and the material from the evaporation source to the middle of the electrode electrode cover, characterized in that it have the oblique surfaces of not in contact with the middle of the electrode to prevent deposition. In any one of Claims 1 thru | or 6 ,
The electrode cover is made of a material having a heat resistant temperature higher than a temperature at which a vapor deposition material of the evaporation source evaporates . In any one of Claims 1 thru | or 6,
The electrode cover is made of a conductive material. In any one of Claims 1 thru | or 8,
The electrode cover can be removed. In any one of Claims 1 thru | or 9,
The electrode cover, wherein the evaporation source has a configuration in which a vapor deposition material is held in a boat. In any one of Claims 1 thru | or 9,
The electrode cover, wherein the evaporation source has a configuration in which a vapor deposition material is held in a crucible. The vapor deposition apparatus provided with the electrode cover as described in any one of Claims 1 thru | or 11 . A vapor deposition apparatus comprising the electrode cover according to any one of claims 1 to 11,
A vapor deposition apparatus, wherein a power source electrically connected to a lower portion of the electrode and the evaporation source are electrically connected via the electrode cover.

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