JP4844246B2 - 発光装置及び液晶表示用バックライト装置 - Google Patents

発光装置及び液晶表示用バックライト装置 Download PDF

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Publication number
JP4844246B2
JP4844246B2 JP2006160554A JP2006160554A JP4844246B2 JP 4844246 B2 JP4844246 B2 JP 4844246B2 JP 2006160554 A JP2006160554 A JP 2006160554A JP 2006160554 A JP2006160554 A JP 2006160554A JP 4844246 B2 JP4844246 B2 JP 4844246B2
Authority
JP
Japan
Prior art keywords
light
light emitting
liquid crystal
crystal display
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006160554A
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English (en)
Japanese (ja)
Other versions
JP2007329374A (ja
JP2007329374A5 (enExample
Inventor
光博 苗代
博幸 田嶌
寿夫 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2006160554A priority Critical patent/JP4844246B2/ja
Priority to US11/802,105 priority patent/US8008674B2/en
Publication of JP2007329374A publication Critical patent/JP2007329374A/ja
Publication of JP2007329374A5 publication Critical patent/JP2007329374A5/ja
Application granted granted Critical
Publication of JP4844246B2 publication Critical patent/JP4844246B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Led Devices (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
JP2006160554A 2006-05-29 2006-06-09 発光装置及び液晶表示用バックライト装置 Expired - Fee Related JP4844246B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006160554A JP4844246B2 (ja) 2006-06-09 2006-06-09 発光装置及び液晶表示用バックライト装置
US11/802,105 US8008674B2 (en) 2006-05-29 2007-05-18 Light emitting device and LCD backlighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006160554A JP4844246B2 (ja) 2006-06-09 2006-06-09 発光装置及び液晶表示用バックライト装置

Publications (3)

Publication Number Publication Date
JP2007329374A JP2007329374A (ja) 2007-12-20
JP2007329374A5 JP2007329374A5 (enExample) 2008-10-23
JP4844246B2 true JP4844246B2 (ja) 2011-12-28

Family

ID=38929634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006160554A Expired - Fee Related JP4844246B2 (ja) 2006-05-29 2006-06-09 発光装置及び液晶表示用バックライト装置

Country Status (1)

Country Link
JP (1) JP4844246B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103178191B (zh) * 2011-12-24 2015-10-28 展晶科技(深圳)有限公司 发光二极管
JP6088160B2 (ja) * 2012-06-14 2017-03-01 シャープ株式会社 発光装置および当該発光装置を備えたバックライト
JP5538479B2 (ja) * 2012-06-19 2014-07-02 三菱電機株式会社 Ｌｅｄ光源及びそれを用いた発光体
JP6305668B1 (ja) * 2016-08-10 2018-04-04 京セラ株式会社 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置
TWI669029B (zh) * 2016-11-11 2019-08-11 日商京瓷股份有限公司 Package for mounting an electric component, array package, and electrical device
JP6849573B2 (ja) * 2017-10-31 2021-03-24 京セラ株式会社 バックライト装置
JP6703312B2 (ja) * 2018-05-31 2020-06-03 日亜化学工業株式会社 発光モジュールおよび面発光光源
JP6680311B2 (ja) * 2018-06-04 2020-04-15 日亜化学工業株式会社 発光装置および面発光光源
JP7652632B2 (ja) 2021-06-09 2025-03-27 株式会社ジャパンディスプレイ 表示装置及び表示装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025326A (ja) * 2000-07-13 2002-01-25 Seiko Epson Corp 光源装置、照明装置、液晶装置及び電子機器
JP2005038776A (ja) * 2003-07-17 2005-02-10 Sony Corp 導光板およびその製造方法、面発光装置、ならびに液晶表示装置
JP4288481B2 (ja) * 2003-10-02 2009-07-01 シチズン電子株式会社 発光ダイオード

Also Published As

Publication number Publication date
JP2007329374A (ja) 2007-12-20

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