JP4837513B2 - 半導体パッケージの製造方法、及び表示装置の製造方法 - Google Patents
半導体パッケージの製造方法、及び表示装置の製造方法 Download PDFInfo
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- JP4837513B2 JP4837513B2 JP2006273306A JP2006273306A JP4837513B2 JP 4837513 B2 JP4837513 B2 JP 4837513B2 JP 2006273306 A JP2006273306 A JP 2006273306A JP 2006273306 A JP2006273306 A JP 2006273306A JP 4837513 B2 JP4837513 B2 JP 4837513B2
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Description
図1は、本発明の実施の形態1に係る液晶ドライバパッケージの平面図である。図2は、図1に示した液晶ドライバパッケージを切断面線A−A´から見た断面図である。さらに図3は、液晶ドライバ2とインターポーザ基板3の接続を説明するための図である。以下、図1、図2及び図3を参照して、液晶ドライバパッケージの概略構成について説明を行う。
実施の形態1では、COF液晶ドライバパッケージを例示して説明したが、本発明は、TCP半導体パッケージにも適用が可能である。実施の形態2は、本発明を適用したTCP液晶ドライバパッケージについて説明する。
2.液晶ドライバ
3.インターポーザ基板
4.フィルム基板
5.封止樹脂
6.画像信号入力用接続端子
7.駆動信号出力用接続端子
8a.液晶ドライバ接続端子(入力)
8b.液晶ドライバ接続端子(出力)
9.デバイスホール
10a.フィルム基板接続端子(入力)
10b.フィルム基板接続端子(出力)
11.配線(インターポーザ基板)
12a.配線(フィルム基板・入力)
12b.配線(フィルム基板・出力)
13.配線先端部(インターポーザ基板)
14.ソルダーレジスト
21.液晶ドライバパッケージ(TCP)
22.液晶ドライバ
23.インターポーザ基板
24.フィルム基板
25.フライングリード
26.画像信号入力用接続端子
27.駆動信号出力用接続端子
28a.液晶ドライバ接続端子(入力)
28b.液晶ドライバ接続端子(出力)
30a.フィルム基板接続端子(入力)
30b.フィルム基板接続端子(出力)
31.半導体パッケージ
32.ICチップ
33.インターポーザ基板
Claims (6)
- 半導体チップと、フィルム基板と、インターポーザ基板とを備える半導体パッケージの製造方法において、
前記半導体チップが、前記インターポーザ基板を介して前記フィルム基板に接続されるように、前記半導体チップ、前記インターポーザ基板及び前記フィルム基板をそれぞれ接続する接続工程と、
前記半導体チップ、前記インターポーザ基板及び前記フィルム基板の間に、封止樹脂を充填する充填工程とを有し、
前記半導体チップは、少なくとも対向する2辺に、複数の端子をそれぞれ有し、
前記フィルム基板はデバイスホールを有するとともに、前記半導体チップは前記デバイスホール内に位置し、
さらに前記デバイスホールの対向する2辺それぞれにおける、前記半導体チップ端面と前記デバイスホール端面との距離は、前記半導体チップの対向する2辺のうち端子数の少ない方において、もう一方よりも短く、
前記充填工程では、前記半導体チップ端面の前記もう一方と前記デバイスホール端面との間から、前記封止樹脂を注入することを特徴とする半導体パッケージの製造方法。 - 前記半導体チップの対向する2辺のうちの一方の辺には、前記半導体チップへの入力信号端子が配置され、他方の辺には前記半導体チップからの出力信号端子が配置されていることを特徴とする請求項1に記載の半導体パッケージの製造方法。
- 前記出力信号端子の端子数は、前記入力信号端子の端子数より多いことを特徴とする請求項2に記載の半導体パッケージの製造方法。
- 前記インターポーザ基板は、シリコンからなることを特徴とする請求項1から3の何れかに記載の半導体パッケージの製造方法。
- 前記半導体チップが、液晶ドライバであることを特徴とする請求項1から4の何れかに記載の半導体パッケージの製造方法。
- 請求項1から5の何れかに記載の半導体パッケージの製造方法によって半導体パッケージを製造する工程と、
前記半導体パッケージの前記フィルム基板を表示装置に接続する工程とを有することを特徴とする表示装置の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2006273306A JP4837513B2 (ja) | 2006-10-04 | 2006-10-04 | 半導体パッケージの製造方法、及び表示装置の製造方法 |
PCT/JP2007/068359 WO2008041507A1 (en) | 2006-10-04 | 2007-09-21 | Semiconductor package, and display |
TW096136896A TWI361476B (en) | 2006-10-04 | 2007-10-02 | Semiconductor package and display apparatus |
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JP2006273306A JP4837513B2 (ja) | 2006-10-04 | 2006-10-04 | 半導体パッケージの製造方法、及び表示装置の製造方法 |
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JP2008091790A JP2008091790A (ja) | 2008-04-17 |
JP4837513B2 true JP4837513B2 (ja) | 2011-12-14 |
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JP5589462B2 (ja) * | 2010-03-16 | 2014-09-17 | カシオ計算機株式会社 | 半導体装置及び半導体装置の製造方法 |
JP6237315B2 (ja) * | 2014-02-18 | 2017-11-29 | セイコーエプソン株式会社 | 液体吐出ヘッド及び液体吐出装置 |
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KR100209863B1 (ko) * | 1995-01-13 | 1999-07-15 | 야스카와 히데아키 | 반도체 장치 테이프 캐리어 패키지 및 디스플레이 패널 모듈 |
JP3985016B2 (ja) * | 1997-10-31 | 2007-10-03 | 沖電気工業株式会社 | 半導体装置 |
JP3967263B2 (ja) * | 2002-12-26 | 2007-08-29 | セイコーインスツル株式会社 | 半導体装置及び表示装置 |
JP4689202B2 (ja) * | 2004-07-07 | 2011-05-25 | ルネサスエレクトロニクス株式会社 | 駆動装置及び表示装置 |
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TWI361476B (en) | 2012-04-01 |
JP2008091790A (ja) | 2008-04-17 |
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