JP4834486B2 - パワー半導体モジュールと端子コネクタとの配置装置 - Google Patents

パワー半導体モジュールと端子コネクタとの配置装置 Download PDF

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Publication number
JP4834486B2
JP4834486B2 JP2006221518A JP2006221518A JP4834486B2 JP 4834486 B2 JP4834486 B2 JP 4834486B2 JP 2006221518 A JP2006221518 A JP 2006221518A JP 2006221518 A JP2006221518 A JP 2006221518A JP 4834486 B2 JP4834486 B2 JP 4834486B2
Authority
JP
Japan
Prior art keywords
power semiconductor
semiconductor module
terminal
contact
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006221518A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007059393A (ja
Inventor
シュテーガー ユルゲン
エバースベルガー フランク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik GmbH and Co KG filed Critical Semikron Elektronik GmbH and Co KG
Publication of JP2007059393A publication Critical patent/JP2007059393A/ja
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Publication of JP4834486B2 publication Critical patent/JP4834486B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
JP2006221518A 2005-08-24 2006-08-15 パワー半導体モジュールと端子コネクタとの配置装置 Expired - Fee Related JP4834486B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005039946A DE102005039946A1 (de) 2005-08-24 2005-08-24 Anordnung mit Leistungshalbleitermodul und mit Anschlussverbinder
DE102005039946.0 2005-08-24

Publications (2)

Publication Number Publication Date
JP2007059393A JP2007059393A (ja) 2007-03-08
JP4834486B2 true JP4834486B2 (ja) 2011-12-14

Family

ID=37517179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006221518A Expired - Fee Related JP4834486B2 (ja) 2005-08-24 2006-08-15 パワー半導体モジュールと端子コネクタとの配置装置

Country Status (7)

Country Link
EP (1) EP1758214B1 (de)
JP (1) JP4834486B2 (de)
CN (1) CN1921110B (de)
AT (1) ATE381798T1 (de)
DE (2) DE102005039946A1 (de)
DK (1) DK1758214T3 (de)
ES (1) ES2299127T3 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006058694B4 (de) * 2006-12-13 2011-06-16 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Kontaktfedern
DE102008012570B4 (de) 2008-03-04 2014-02-13 Infineon Technologies Ag Leistungshalbleitermodul-System, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung
DE102008034467B4 (de) * 2008-07-24 2014-04-03 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul und mit einer Verbindungseinrichtung
DE102013113143B4 (de) * 2013-11-28 2016-04-21 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417752B2 (de) * 1971-10-05 1979-07-02
DE3345285A1 (de) * 1983-12-14 1985-06-27 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiteranordnung
JPH02150771A (ja) * 1988-12-01 1990-06-11 Nec Corp 速度計測装置
JP3201187B2 (ja) * 1994-12-08 2001-08-20 富士電機株式会社 半導体装置
JPH08255643A (ja) * 1995-01-18 1996-10-01 Furukawa Electric Co Ltd:The プリント基板用コネクタ
TW328403U (en) * 1997-05-09 1998-03-11 Formosa Electronicindustries Inc Ac/dc power supplier having a replaceable plug
CN2315700Y (zh) * 1997-06-04 1999-04-21 吴祖榆 交直流两用可抽换电源插头的电源供应器
US6669495B2 (en) * 2000-11-06 2003-12-30 Research In Motion Limited Universal adapter with interchangeable plugs
DE10100460B4 (de) 2001-01-08 2006-06-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Gehäuse und Anschlußelementen
JP3644406B2 (ja) * 2001-05-08 2005-04-27 株式会社デンソー 指針計器及びその回動内機
EP1291914A1 (de) * 2001-09-10 2003-03-12 ABB Schweiz AG Druckkontaktierbares Leistungshalbleitermodul
DE102004025609B4 (de) * 2004-05-25 2010-12-09 Semikron Elektronik Gmbh & Co. Kg Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul

Also Published As

Publication number Publication date
JP2007059393A (ja) 2007-03-08
ATE381798T1 (de) 2008-01-15
DE502006000232D1 (de) 2008-01-31
DK1758214T3 (da) 2008-04-07
DE102005039946A1 (de) 2007-03-01
CN1921110A (zh) 2007-02-28
EP1758214B1 (de) 2007-12-19
EP1758214A1 (de) 2007-02-28
ES2299127T3 (es) 2008-05-16
CN1921110B (zh) 2010-12-01

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