JP4796548B2 - 発光表示装置 - Google Patents
発光表示装置 Download PDFInfo
- Publication number
- JP4796548B2 JP4796548B2 JP2007185865A JP2007185865A JP4796548B2 JP 4796548 B2 JP4796548 B2 JP 4796548B2 JP 2007185865 A JP2007185865 A JP 2007185865A JP 2007185865 A JP2007185865 A JP 2007185865A JP 4796548 B2 JP4796548 B2 JP 4796548B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- semiconductor light
- phosphor
- emitting device
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007185865A JP4796548B2 (ja) | 2000-09-21 | 2007-07-17 | 発光表示装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000287326 | 2000-09-21 | ||
| JP2000287326 | 2000-09-21 | ||
| JP2007185865A JP4796548B2 (ja) | 2000-09-21 | 2007-07-17 | 発光表示装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001118790A Division JP4077170B2 (ja) | 2000-09-21 | 2001-04-17 | 半導体発光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007274009A JP2007274009A (ja) | 2007-10-18 |
| JP2007274009A5 JP2007274009A5 (https=) | 2010-05-20 |
| JP4796548B2 true JP4796548B2 (ja) | 2011-10-19 |
Family
ID=38676411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007185865A Expired - Lifetime JP4796548B2 (ja) | 2000-09-21 | 2007-07-17 | 発光表示装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4796548B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011014697A (ja) * | 2009-07-01 | 2011-01-20 | Mitsubishi Chemicals Corp | 白色発光装置 |
| JPWO2011027511A1 (ja) * | 2009-09-02 | 2013-01-31 | 株式会社東芝 | 白色ledおよびそれを用いたバックライト並びに液晶表示装置 |
| JP2016048718A (ja) * | 2014-08-27 | 2016-04-07 | 豊田合成株式会社 | 発光装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2636338B2 (ja) * | 1988-06-06 | 1997-07-30 | 松下電器産業株式会社 | 透過形カラー画像表示装置の照明装置 |
| JPH1012925A (ja) * | 1996-06-21 | 1998-01-16 | Susumu Sato | 蛍光体付き発光ダイオード |
| JP3065258B2 (ja) * | 1996-09-30 | 2000-07-17 | 日亜化学工業株式会社 | 発光装置及びそれを用いた表示装置 |
| JPH10112557A (ja) * | 1996-10-08 | 1998-04-28 | Nichia Chem Ind Ltd | 発光装置及びそれを用いた表示装置 |
| JP3419280B2 (ja) * | 1996-11-05 | 2003-06-23 | 日亜化学工業株式会社 | 発光装置 |
| JP2914350B2 (ja) * | 1997-05-30 | 1999-06-28 | セイコーエプソン株式会社 | 液晶表示装置 |
| JPH11237631A (ja) * | 1998-02-23 | 1999-08-31 | Sanyo Electric Co Ltd | カラー表示装置 |
| JP3397141B2 (ja) * | 1998-07-28 | 2003-04-14 | 住友電気工業株式会社 | 白色led |
| JP2000049380A (ja) * | 1998-07-30 | 2000-02-18 | Sony Corp | 表示装置 |
| JP3366586B2 (ja) * | 1998-12-28 | 2003-01-14 | 日亜化学工業株式会社 | 発光ダイオード |
| JP2001144331A (ja) * | 1999-09-02 | 2001-05-25 | Toyoda Gosei Co Ltd | 発光装置 |
| JP2000082849A (ja) * | 1999-09-27 | 2000-03-21 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
| JP2002033520A (ja) * | 2000-07-14 | 2002-01-31 | Toshiba Electronic Engineering Corp | 半導体発光装置 |
-
2007
- 2007-07-17 JP JP2007185865A patent/JP4796548B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007274009A (ja) | 2007-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4077170B2 (ja) | 半導体発光装置 | |
| US8685762B2 (en) | Light emitting device and display | |
| JP4796548B2 (ja) | 発光表示装置 | |
| JP2007274009A5 (https=) | ||
| JP2007173733A (ja) | 発光装置 | |
| HK1021073B (en) | Light emitting device and display device | |
| AU5366900A (en) | Light emitting device and display |
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