JP4796548B2 - 発光表示装置 - Google Patents

発光表示装置 Download PDF

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Publication number
JP4796548B2
JP4796548B2 JP2007185865A JP2007185865A JP4796548B2 JP 4796548 B2 JP4796548 B2 JP 4796548B2 JP 2007185865 A JP2007185865 A JP 2007185865A JP 2007185865 A JP2007185865 A JP 2007185865A JP 4796548 B2 JP4796548 B2 JP 4796548B2
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JP
Japan
Prior art keywords
light emitting
semiconductor light
phosphor
emitting device
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2007185865A
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English (en)
Japanese (ja)
Other versions
JP2007274009A (ja
JP2007274009A5 (enrdf_load_stackoverflow
Inventor
哲也 花本
渉 高瀬
清 鈴木
香里 金坂
智和 相良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nemoto and Co Ltd
Sharp Corp
Original Assignee
Nemoto and Co Ltd
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nemoto and Co Ltd, Sharp Corp filed Critical Nemoto and Co Ltd
Priority to JP2007185865A priority Critical patent/JP4796548B2/ja
Publication of JP2007274009A publication Critical patent/JP2007274009A/ja
Publication of JP2007274009A5 publication Critical patent/JP2007274009A5/ja
Application granted granted Critical
Publication of JP4796548B2 publication Critical patent/JP4796548B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01063—Europium [Eu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01066—Dysprosium [Dy]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2007185865A 2000-09-21 2007-07-17 発光表示装置 Expired - Lifetime JP4796548B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007185865A JP4796548B2 (ja) 2000-09-21 2007-07-17 発光表示装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000287326 2000-09-21
JP2000287326 2000-09-21
JP2007185865A JP4796548B2 (ja) 2000-09-21 2007-07-17 発光表示装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001118790A Division JP4077170B2 (ja) 2000-09-21 2001-04-17 半導体発光装置

Publications (3)

Publication Number Publication Date
JP2007274009A JP2007274009A (ja) 2007-10-18
JP2007274009A5 JP2007274009A5 (enrdf_load_stackoverflow) 2010-05-20
JP4796548B2 true JP4796548B2 (ja) 2011-10-19

Family

ID=38676411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007185865A Expired - Lifetime JP4796548B2 (ja) 2000-09-21 2007-07-17 発光表示装置

Country Status (1)

Country Link
JP (1) JP4796548B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011014697A (ja) * 2009-07-01 2011-01-20 Mitsubishi Chemicals Corp 白色発光装置
JPWO2011027511A1 (ja) 2009-09-02 2013-01-31 株式会社東芝 白色ｌｅｄおよびそれを用いたバックライト並びに液晶表示装置
JP2016048718A (ja) * 2014-08-27 2016-04-07 豊田合成株式会社 発光装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2636338B2 (ja) * 1988-06-06 1997-07-30 松下電器産業株式会社 透過形カラー画像表示装置の照明装置
JPH1012925A (ja) * 1996-06-21 1998-01-16 Susumu Sato 蛍光体付き発光ダイオード
JP3065258B2 (ja) * 1996-09-30 2000-07-17 日亜化学工業株式会社 発光装置及びそれを用いた表示装置
JPH10112557A (ja) * 1996-10-08 1998-04-28 Nichia Chem Ind Ltd 発光装置及びそれを用いた表示装置
JP3419280B2 (ja) * 1996-11-05 2003-06-23 日亜化学工業株式会社 発光装置
JP2914350B2 (ja) * 1997-05-30 1999-06-28 セイコーエプソン株式会社 液晶表示装置
JPH11237631A (ja) * 1998-02-23 1999-08-31 Sanyo Electric Co Ltd カラー表示装置
JP3397141B2 (ja) * 1998-07-28 2003-04-14 住友電気工業株式会社 白色ｌｅｄ
JP2000049380A (ja) * 1998-07-30 2000-02-18 Sony Corp 表示装置
JP3366586B2 (ja) * 1998-12-28 2003-01-14 日亜化学工業株式会社 発光ダイオード
JP2001144331A (ja) * 1999-09-02 2001-05-25 Toyoda Gosei Co Ltd 発光装置
JP2000082849A (ja) * 1999-09-27 2000-03-21 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
JP2002033520A (ja) * 2000-07-14 2002-01-31 Toshiba Electronic Engineering Corp 半導体発光装置

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Publication number Publication date
JP2007274009A (ja) 2007-10-18

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