JP4794705B2 - Electrolytic capacitor lead wire forming equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a lead wire forming apparatus for an electrolytic capacitor, and more particularly to a lead wire forming apparatus for an electrolytic capacitor capable of smoothly achieving lead wire bending in an electrolytic capacitor with a lead wire.
[0002]
[Prior art]
When an electrolytic capacitor from which a pair of lead wires is led out from the main body is mounted on a printed circuit board or the like to form a desired electric circuit, the lead wires are inserted into through holes formed in the printed circuit board. In this case, the lead wire is locked to the printed circuit board to prevent the electrolytic capacitor from dropping off, and the lead wire is bent in two directions to properly maintain the posture of the electrolytic capacitor. Is generally implemented.
[0003]
For example, as shown in FIG. 2, an electrolytic capacitor manufactured in a normal general manufacturing process before the lead wire is processed includes a pair of lead wires 3 and 3 from the main body 2 of the electrolytic capacitor 1. It is derived almost linearly. Therefore, firstly, a first forming means provided with a primary forming die comprising a taper pin 4 which moves forward and backward so as to intersect the lead wires 3 and 3 in a substantially perpendicular direction on one side of the lead wires 3 and 3. 5 (see FIG. 2A). Then, by driving the first molding means 5, the taper pin 4 as a primary molding die is moved forward between the pair of lead wires 3, 3, thereby removing the main body 2 of the electrolytic capacitor 1. As shown in FIG. 2B, the lead wires 3 and 3 that have been led out are expanded along the taper surface of the taper pin 4, and are subjected to primary forming processing, that is, preforming processing into a C-shape. Can do.
[0004]
Next, as shown in FIG. 3 (a), a second molding provided with a secondary molding die comprising a pair of molding outer dies 6, 6 approaching and separating from each other and a molding inner die 7 located inside thereof. By providing means 8 and holding the lead wires 3 and 3 preformed in the C shape by the pair of molded outer molds 6 and 6 and the molded inner mold 7, the lead wires 3 and 3 can be formed into a bent shape having symmetrically bent portions 3a and 3b as shown in FIG.
[0005]
[Problems to be solved by the invention]
However, in the above-described conventional electrolytic capacitor lead wire forming process, the lead wires 3 and 3 are initially formed by simply expanding into a letter C shape as shown in FIG. (Preliminary forming) and then suddenly forming into a bent shape as shown in FIG. 3B, the stress on the bent portions 3a and 3b of the lead wires 3 and 3 becomes excessive, and the LC level before forming That is, there is a problem that the LC level after the molding process deteriorates with respect to the leakage current characteristics. In addition, since a sudden stress is applied to the lead wires 3 and 3, the lead wires 3 and 3 are deteriorated or broken, and there is a problem that the incidence of defective products is increased.
[0006]
In the conventional lead wire forming apparatus, the first forming means 5 for pre-forming the lead wires and the first forming means 8 for forming the bent portions 3a and 3b are mechanically configured. Therefore, the electrolytic capacitors need to be smoothly transferred between these facilities, and there is a problem that the equipment cost for this is remarkably increased.
[0007]
Therefore, as a result of intensive research and examination, the present inventor first constructed a pair of electrolytic capacitor lead wire forming apparatuses for bending a pair of lead wires derived from the electrolytic capacitor. A pair of holding outer dies are disposed outside the lead-out base portion of the lead wire from the electrolytic capacitor main body, and a holding inner die is disposed between the pair of lead wires. The first and second lead wire holding means are configured to hold the lead wire lead-out base by moving the outer die forward relative to the holding inner die, while the first lead wire holding means A first molded inner mold having a curved tip that moves forward and backward in the direction in which the lead wire extends in opposition to the holding inner mold, and a pair of molded outer molds arranged to hold the first molded inner mold; To advance the first inner mold, The lead wire lead-out base portion is held by a pair of forming outer dies to perform a first forming process in a curved shape, and the second lead wire holding means holding inner portion is configured. A second molded inner mold having a flat tip portion that moves forward and backward in the direction in which the lead wire extends in opposition to the mold, and a pair of molded outer molds arranged to hold the second molded inner mold, The second molding inner mold is advanced while holding the lead wire lead-out base, and is held by the pair of molding outer molds, and the lead wire lead-out base is bent to perform a second molding process. By providing the lead wire forming means configured as described above, it has been found that smooth and proper bending of the lead wire can be achieved without causing excessive stress on the lead wire.
[0008]
Accordingly, an object of the present invention is to provide an electrolytic capacitor lead that can achieve smooth and proper bending of the lead wire at a low cost with a simple configuration without causing excessive stress on the lead wire. The object is to provide a wire forming apparatus.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, an electrolytic capacitor lead wire forming apparatus according to the present invention is an electrolytic capacitor lead wire forming device that performs a bending process on a pair of lead wires derived from an electrolytic capacitor.
A pair of holding outer dies are arranged outside the base portion of the lead wire from the electrolytic capacitor main body, and a holding inner die is arranged between the pair of lead wires. First and second lead wire holding means configured to hold the lead wire lead-out base by moving the outer die forward relative to the holding inner die;
A first molded inner mold having a curved tip portion that moves forward and backward in the direction in which the lead wire extends in opposition to the holding inner mold of the first lead wire holding means, and to hold the first molded inner mold It consists of a pair of molded outer molds arranged, and the first molded inner mold is advanced and held by the pair of molded outer molds, so that the lead-out base portion of the lead wire is expanded in a curved shape. And so as to perform the first forming process,
A second molded inner mold having a flat tip portion that moves forward and backward in the lead wire extending direction facing the holding inner mold of the second lead wire holding means, and so as to hold the second molded inner mold. The lead is formed by a pair of molded outer dies arranged, the second molded inner die is advanced with the lead wire lead-out base held, and held by the pair of molded outer dies. And lead wire forming means configured to perform a second forming process for bending the lead-out base portion of the wire.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the electrolytic capacitor lead wire forming apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0011]
(A)-(e) of Drawing 1 is a schematic explanatory view showing the lead wire forming device of an electrolytic capacitor concerning the present invention, and its forming process.
[0012]
FIG. 1A shows a configuration of a lead wire forming apparatus that performs a first forming process on a lead wire of an electrolytic capacitor. In other words, the first molding process is performed as shown in FIG. 1B, in which a pair of leads led out substantially linearly from the main body 12 of the electrolytic capacitor 10 manufactured in a normal general manufacturing process. As shown in FIG. 1C, the lead-out base portions of the pair of lead wires 14 and 14 are expanded and formed in a curved shape with respect to the wires 14 and 14, respectively.
[0013]
For this reason, as shown in FIG. 1A, the lead wire forming apparatus in the present embodiment is disposed outside the lead bases of the pair of lead wires 14 and 14 led out from the main body 12 of the electrolytic capacitor 10. A pair of holding outer dies 16, 16 are arranged, and a holding inner die 18 is arranged between the pair of lead wires 14, 14, and the pair of holding outer dies 16, 16 are arranged in the holding inner A first lead wire holding means 20 </ b> A configured to hold the lead bases of the lead wires 14 by moving forward with respect to the mold 18 is provided.
[0014]
Then, a first molded inner die 24 having a curved tip portion 24a that moves forward and backward in the extending direction of the lead wires 14 and 14 facing the holding inner die 18 with respect to the lead wire holding means 20A, and the first A pair of molded outer dies 22, 22 are arranged on the outer side so as to hold one molded inner mold 24, and the first molded inner mold 24 is advanced by the pair of molded outer dies 22, 22. By holding this, the lead wire forming means 30 for performing a first forming process (see FIG. 1C) for expanding and forming the lead bases of the lead wires 14 and 14 into a curved shape is constituted. Note that a fitting recess 24 b is provided at the center of the tip of the first molding inner mold 24 so as to come into contact with the holding inner mold 18.
[0015]
Furthermore, the lead wire forming apparatus in the present embodiment is different from the electrolytic capacitor 10 in which the pair of lead wires 14 and 14 are first formed as shown in FIG. As shown in FIG. 5, the lead wire forming means 30 is provided for performing a second forming process for bending the pair of lead wires 14 and 14.
[0016]
That is, the lead wire forming means 30 for performing the second forming process has the same basic configuration as shown in FIG. 1A, as shown in FIG. That is, in this embodiment, the lead wires 14 and 14 are extended to face the holding inner mold 18 with respect to the second lead wire holding means 20B configured in the same manner as the first lead wire holding means 20A. A second molded inner die 28 having a flat tip 28a that moves forward and backward in the present direction, and a pair of molded outer dies 26, 26 arranged on the outside so as to hold the second molded inner die 28; The second inner mold 28 is moved forward and held by the pair of outer molds 26, 26 so that the bent parts 14a, 14b are symmetrical with respect to the lead bases of the lead wires 14, 14. The lead wire forming means 30 is configured to perform a second forming process (see FIG. 1E) that is bent so as to be. Note that a fitting recess 28b is provided at the center of the tip of the second molding inner mold 28 so as to come into contact with and fit to the holding inner mold 18.
[0017]
In the lead wire forming apparatus for an electrolytic capacitor according to the present invention configured as described above, the first and second lead wire holding means 20A and 20B for holding the lead wire lead-out base portion, and the lead wire lead-out base portion, respectively. The lead wire forming means 30 having the first forming inner mold 24 that expands in a curved shape and the lead-out base portion of the lead wire expanded in a curved shape are bent so as to be symmetrically bent portions 14a and 14b. With the configuration comprising the lead wire forming means 30 having the second forming inner die 28, smooth and proper lead wire bending can be achieved without causing excessive stress on the lead wire. .
[0018]
The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various design changes can be made without departing from the spirit of the present invention.
[0019]
【The invention's effect】
As is apparent from the above-described embodiments, the electrolytic capacitor lead wire forming apparatus according to the present invention is an electrolytic capacitor lead wire forming device that performs a bending process on a pair of lead wires derived from the electrolytic capacitor. A pair of holding outer dies disposed outside the base portion of the lead wire from the electrolytic capacitor main body and a pair of holding inner dies disposed between the pair of lead wires. First and second lead wire holding means configured to hold the lead wire lead-out base by moving the holding outer die forward relative to the holding inner die, and holding the first lead wire holding means A first molded inner mold having a curved tip that moves forward and backward in the direction in which the lead wire extends in opposition to the inner mold, and a pair of molded outer molds arranged to hold the first molded inner mold And advance the first mold inner mold And holding the second lead wire while holding the second lead wire by holding the pair of forming outer molds so as to perform a first forming process for expanding and forming the lead-out base portion of the lead wire into a curved shape. A second molded inner mold having a flat tip portion that moves forward and backward in the extending direction of the lead wire opposite to the holding inner mold of the means, and a pair of molded outer molds arranged so as to hold the second molded inner mold The lead wire lead-out base is bent by advancing the second molding inner die while holding the lead wire lead-out base and holding it with the pair of molding outer dies. By providing the lead wire forming means configured to perform the second forming process to be formed, the lead wire can be smoothly and properly bent without causing excessive stress to the lead wire. be able to.
[0020]
In particular, according to the lead wire molding apparatus for electrolytic capacitors according to the present invention, a sudden stress is applied to the lead wire during bending of the lead wire by using the first molding inner die and the second molding inner die. Therefore, it is possible to suppress the deterioration and breakage of the lead wire, and to prevent the change of the LC level at the time of bending forming, that is, the deterioration of the leakage current characteristic, and to always manufacture an electrolytic capacitor having a stable quality. it can.
[Brief description of the drawings]
FIG. 1 shows a lead wire forming means and a lead wire forming state in a lead wire forming apparatus for an electrolytic capacitor according to the present invention, wherein (a) is an outline of a forming means using a first forming inner mold. Configuration diagram, (b) is a schematic explanatory diagram of the lead wire before the preforming process by the first molding inner mold, (c) is a schematic explanatory diagram of the lead wire after the preliminary molding process by the first molding inner mold, (d) Is a schematic configuration diagram of a molding means using the second molding inner mold, and (e) is a schematic explanatory diagram of the lead wire after the molding process by the second molding inner mold is completed.
FIG. 2 shows a schematic configuration of a lead wire and a first molding means using a primary molding die in a conventional electrolytic capacitor lead wire molding apparatus, wherein (a) shows a state before the primary molding process; Explanatory drawing, (b) is explanatory drawing which shows the state after a primary shaping | molding process.
FIG. 3A is an explanatory view showing a schematic configuration of second forming means using a secondary forming die for a lead wire in a conventional lead forming device for electrolytic capacitors, and FIG. 3B is a secondary forming using a secondary forming die. It is explanatory drawing which shows schematic structure of the lead wire after a process.
[Explanation of symbols]
10 Electrolytic Capacitor 12 Electrolytic Capacitor Main Body 14, 14 Lead Wire 14a First Bent Part 14b Second Bent Part 16, 16 Holding Outer Mold 18 Holding Inner Mold 20A First Lead Wire Holding Means 20B Second Lead Wire Holding means 22, 22 Molding outer mold 24 First molding inner mold 24a Curved tip 24b Fitting recess 26, 26 Molding outer mold 28 Molding inner mold 28a Flat tip 28b Fitting recess 30 Lead wire molding means

Claims (1)

In an electrolytic capacitor lead wire forming apparatus for bending a pair of lead wires derived from an electrolytic capacitor,
A pair of holding outer dies are arranged outside the base portion of the lead wire from the electrolytic capacitor main body, and a holding inner die is arranged between the pair of lead wires. First and second lead wire holding means configured to hold the lead wire lead-out base by moving the outer die forward relative to the holding inner die;
A first molded inner mold having a curved tip portion that moves forward and backward in the direction in which the lead wire extends in opposition to the holding inner mold of the first lead wire holding means, and to hold the first molded inner mold It consists of a pair of molded outer molds arranged, and the first molded inner mold is advanced and held by the pair of molded outer molds, so that the lead-out base portion of the lead wire is expanded in a curved shape. And so as to perform the first forming process,
A second molded inner mold having a flat tip portion that moves forward and backward in the lead wire extending direction facing the holding inner mold of the second lead wire holding means, and so as to hold the second molded inner mold. The lead is formed by a pair of molded outer dies arranged, the second molded inner die is advanced with the lead wire lead-out base held, and held by the pair of molded outer dies. A lead wire forming apparatus for an electrolytic capacitor, comprising: a lead wire forming means configured to perform a second forming process of bending a lead-out base portion of the wire.

Images