JP3225603B2 - Manufacturing method of chip type capacitor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip-type capacitor capable of performing a bending step without applying excessive stress to a lead.

[0002]

2. Description of the Related Art Conventionally, chip type capacitors such as a chip aluminum electrolytic capacitor are shown in FIGS. 4 (a) to 4 (d) and FIG.
It was manufactured by going through the steps shown in (a) and (b).

According to this conventional manufacturing method, chip-type capacitor elements (hereinafter referred to as capacitor elements) A ...
As shown in FIG. 4 (a), they are arranged and separated by a parts feeder and sequentially separated and supplied one by one to a production line. And it is sequentially conveyed to the latter stage of a production line. As shown in FIG. 4 (b), in the first step of the transfer process, the extra lengths of the two leads b, b projecting from the main body a of the capacitor element A are cut and removed, and cut to a predetermined length. Aligned. Next, as shown in FIG. 4C, the leads b, b are press-formed from a circular cross section to a substantially flat plate shape, and then, as shown in FIG. , B are attached to the base of the element body a. Thereafter, as shown in FIG. 5A, the pressing members B are pressed against the tips of the leads b, b, and the pressing force causes the leads b, b to be pushed right and left and pressed by the pedestal c. It is folded to both sides. Next, as shown in FIG. 5B, the contact P is pressed against the leads b, b, and the electrical characteristics of the capacitor are inspected. Thereafter, a desired printed display is made on the surface of the element body a.

A conventional chip-type capacitor has been manufactured by the above-described steps.

[0005]

According to the above-described conventional manufacturing method, the lead bending step shown in FIG.
Since the pressing members B are pressed from the leading ends of the leads and the leads b and b are strongly bent by only one bending process, excessive stress is applied to the leads b and b, and an undesirable phenomenon occurs.

SUMMARY OF THE INVENTION It is an object of the present invention to be able to perform bending without applying excessive stress to a lead in a manufacturing process of a chip type capacitor.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a lead bending method in which a lead is preliminarily bent at a predetermined angle in a lead bending step and then a rotary bending member is pressed and expanded. It is characterized in that a main bending process is performed in which the lead is bent to a predetermined bending position together with the rotation expanding operation of the rotary bending member.

[0008]

Since the lead is bent through a two-step processing procedure of preliminary bending and main bending, no excessive stress is applied to the lead. In the pre-bending process, the lead is pushed and spread to a preset predetermined angle. Since the angle can be set to a size that does not cause stress on the lead, stress is hardly applied to the lead. Also, at the time of the main bending process, the lead which has been pushed and expanded in advance is pushed outward together with the rotation and expansion operation of the rotary bending member and is bent to the final bending position, so that the bending operation is smooth and excessive. No severe bending stress is applied to the leads.

Thus, the bending step can be performed without applying excessive stress to the lead.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 and FIG. 2 are process diagrams showing the steps of a manufacturing process of a chip-type capacitor according to the present invention, wherein chip-type capacitor elements (hereinafter referred to as capacitor elements) 10.
The leads 11, 11 are taped by a taping material 20, and are set in a device (not shown) in a state of a taped product, and are sequentially carried into a processing line in the device. A desired printed display is made on each of the taped capacitor elements 10 in advance.

As shown in FIG. 1A, when the capacitor elements 10 are carried into the apparatus in a taping state, the capacitor elements 10 are then connected to the leads 11, 11 as shown in FIG. 1B. Are sequentially separated from the taping material 20 except for a predetermined length. Then, they are sequentially and continuously transferred to the subsequent stage of the processing line. In the course of this continuous transfer, FIG.
As shown in FIG.
1 and 11 are press-formed from a circular cross section to a substantially flat plate shape. Next, as shown in FIG.
Are attached to the base of the element main body 101 through the leads 11, 11. After the bending of the leads of FIGS. 2 (a) and 2 (b) is completed, as shown in FIG. 2 (c), a pair of contacts are provided on the portions of the leads 11, 11 projecting laterally from the pedestal. The electrical characteristics inspection is performed by pinching and contacting 14, 14 and 15, 15 respectively. Next, the extra lengths of the leads 11, 11 protruding to the side of the pedestal are cut and removed, and the protruding lengths of the leads 11, 11 are processed into a predetermined L dimension. Thereafter, if necessary, burrs of the leads 11, 11 generated in the cutting step are removed.

Through the above steps, a single chip type capacitor 100 shown in FIG. 3 is manufactured.

In the above manufacturing process, the lead is bent in the following procedure.

As shown in FIG. 2A, the leads 11, 1
1 is pressed outward, and the lead is preliminarily bent. By this preliminary bending, the leads 11, 1
Numeral 1 is pushed and expanded about a base end by a predetermined angle set in advance. The angle and the pressing force for pushing and expanding the leads 11 and 11 are set to a size that does not cause stress on the leads 11 and 11.

When the pre-bending process is completed, the rotary bending member 13 is inserted between the expanded leads 11,11. The rotating bending member 13 is formed of a pair of wedge-shaped members, and is inserted between the leads 11 and 11 and then, as shown in FIG.
As shown in (2), it is rotated and expanded outward around the fulcrum at the tip. Along with this expanding operation, the leads 11, 11 are pushed outwardly around the base end while being contacted and pressed by the wedge-shaped member substantially the entire length in the longitudinal direction. It is bent to a preset final bending position, that is, a position where it is pressed against the pedestal 12. Thus, the main bending of the leads 11 is completed. In this bending process, the leads 11 and 11
In the pre-bending step, it is pushed and spread at a set angle within a range that does not cause stress, and in the main bending step, it is rotated from a state where it is pushed and spread by a certain angle in the pre-bending step. Member 13
Can be smoothly folded to the final bending position together with the turning and expanding operation of the lead, so that the bending is smooth and the leads 11 and
11 does not receive excessive stress.

[0017]

As described above, according to the present invention,
In the manufacturing process of the chip type capacitor, the lead can be smoothly and sequentially bent in two stages, and the lead can be bent without applying extra stress.
A highly reliable chip type capacitor having a high finishing accuracy can be manufactured.

[Brief description of the drawings]

1 (a), 1 (b), 1 (c) and 1 (d) are process diagrams showing a method for manufacturing a chip capacitor according to the present invention.

FIGS. 2 (a), (b), (c) and (d) are process diagrams illustrating a method for manufacturing a chip capacitor according to the present invention, and are diagrams continued from FIG. 1 (d).

FIG. 3 is a perspective view of a chip-type capacitor manufactured by a manufacturing method according to the present invention.

FIGS. 4 (a), (b), (c) and (d) are process diagrams showing a conventional method of manufacturing a chip capacitor.

5 (a) and 5 (b) are process diagrams showing a conventional method for manufacturing a chip-type capacitor, and are diagrams continuing from FIG. 4 (d).

[Explanation of symbols]

 11, 11 lead 13 rotary bending member 100 chip type capacitor 10 capacitor element

Claims (1)

(57) [Claims] 1. A chip for separating a chip-type capacitor element carried in a state of a taping product from a taping material, and forming a product through respective steps of lead forming, pedestal mounting, lead bending, characteristic inspection, and lead cutting. In the method of manufacturing a mold capacitor, in bending the lead, after pre-bending the lead by a predetermined angle and expanding, inserting a rotary bending member between the expanded lead and rotating the rotary bending member A method for manufacturing a chip-type capacitor, characterized in that the lead is expanded and bent to a predetermined bending position.