JP2000114123A - Lead wire forming equipment of electrolytic capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable achieving smooth and proper bending mold working of a lead wire with a simple constitution and a low cost, without generating excess stress on the lead wire. SOLUTION: A first and a second lead wire holding means 20A, 20B, constituted of outer molds 16, 16 for holding and an inner mold 18 for holding, are installed corresponding to lead-out base parts from an electrolytic capacitor main body 12 having a pair of lead wires 14, 14. Furthermore, a lead wire molding means 30 is installed which is constituted of a first molding inner mold 24 which has a curved tip part 24a facing the inner mold 18 for holding of the first lead wire holding means 20A, molding outer molds 22, 22 which are arranged so as to hold the first molding inner mold 24, a second molding inner mold 28 which has a flat tip part 28a facing the inner mold 18 for holding of the second lead wire holding means 20B, and molding outer molds 26, 26 which are arranged so as to hold the second molding inner mold 28.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead wire forming apparatus for an electrolytic capacitor, and more particularly to a lead wire for an electrolytic capacitor capable of smoothly forming a lead wire in an electrolytic capacitor with a lead wire. The present invention relates to a molding device.

[0002]

2. Description of the Related Art An electrolytic capacitor from which a pair of lead wires is led out of a main body is connected to a through hole formed in a printed circuit board when this is mounted on a printed circuit board or the like to form a desired electric circuit. When the wire is inserted, the lead wire is locked to the printed circuit board to prevent the electrolytic capacitor from falling off, and the lead wire must be bent in two directions in order to properly maintain the posture of the electrolytic capacitor. The forming process to be performed is generally performed.

For example, as shown in FIG. 2, an electrolytic capacitor manufactured by a usual general manufacturing process before a lead wire forming process is performed is formed by a pair of lead wires 3 from a main body 2 of the electrolytic capacitor 1. , 3 are derived almost linearly. Therefore, first, a first forming means provided with a primary forming die comprising a tapered pin 4 which moves forward and backward so as to intersect in a direction substantially perpendicular to the lead wires 3, 3 on one side of these lead wires 3, 3. 5 (see FIG. 2A). By driving the first forming means 5, the taper pin 4 as a primary forming die is moved forward between the pair of lead wires 3, 3, so that the taper pin 4 moves from the main body 2 of the electrolytic capacitor 1. As shown in FIG. 2 (b), the lead wires 3, which are led out, are expanded along the tapered surface of the tapered pin 4, and are subjected to a primary forming process, that is, a preliminary forming process in a C shape. Can be.

Next, as shown in FIG. 3 (a), a secondary molding die comprising a pair of molding outer dies 6, 6 approaching and separating from each other and a molding inner die 7 located inside thereof is provided. A second forming means 8 is provided to hold the lead wires 3, 3 preformed in a U-shape by the pair of forming outer dies 6, 6 and the forming inner die 7, thereby forming the lead. The lines 3, 3 are symmetrical bent portions 3a, as shown in FIG.
3b can be formed into a bent shape.

[0005]

However, in the above-mentioned conventional forming process of the lead wire of the electrolytic capacitor, the lead wires 3, 3 are first simply expanded in a V shape as shown in FIG. 2 (b). From the primary forming process (preliminary forming process) that only requires opening, the lead portions 3 are bent to form a bent shape as shown in FIG.
Stresses a and 3b become excessive, and there is a problem that the LC level after the molding process deteriorates with respect to the LC level before the molding process, that is, the leakage current characteristic. Also, lead wire 3,
Since abrupt stress is applied to the lead 3, the lead wires 3, 3 are deteriorated or damaged, and there is a problem that the incidence of defective products increases.

Further, in the conventional lead wire forming apparatus, the first forming means 5 for preforming the lead wire.
And the first forming means 8 for forming the bent portions 3a and 3b are completely different in mechanical structure, and therefore are independent and independent equipments. Therefore, the electrolytic capacitor smoothly moves between these equipments. There is a drawback in that it needs to be transferred, and the equipment costs for this need also increase significantly.

Therefore, the present inventor has made extensive studies and studies, and as a result, when constructing a lead wire forming apparatus for an electrolytic capacitor for performing a bending process on a pair of lead wires derived from the electrolytic capacitor. First, a pair of holding outer dies is arranged outside the base of the pair of lead wires leading out from the electrolytic capacitor body, and an inner holding mold is arranged between the pair of lead wires. The first and second lead wire holding means are configured to hold the lead base of the lead wire by moving the holding outer die forward with respect to the holding inner die. A first molding inner mold having a curved tip portion which moves forward and backward in the extending direction of the lead wire facing the holding inner mold of the holding means, and a pair of moldings arranged to hold the first molding inner mold; With the outer mold, the first molding inner mold is A first forming process of forming the lead base of the lead wire into a curved expansion by holding the lead wire by the pair of outer molds; and forming the second lead wire holding means. Having a flat tip portion which moves forward and backward in the direction in which the lead wire extends in opposition to the holding inner die of
The second molding inner die is advanced by holding the lead base of the lead wire forward by the molding inner die and a pair of molding outer dies arranged to hold the second molding inner die. And a lead forming means configured to perform a second forming process in which the lead base of the lead wire is bent and formed by holding the lead wire with the outer mold of the present invention. It has been found that a smooth and proper bending process of a lead wire can be achieved without causing it.

Accordingly, an object of the present invention is to provide an electrolytic solution capable of achieving smooth and proper bending of a lead wire at a low cost with a simple structure without causing excessive stress to the lead wire. An object of the present invention is to provide a lead wire forming device for a capacitor.

[0009]

In order to achieve the above object, an apparatus for forming a lead wire of an electrolytic capacitor according to the present invention comprises an electrolytic capacitor for bending a pair of leads derived from the electrolytic capacitor. In a lead wire forming apparatus for a capacitor, a pair of holding outer dies is disposed outside a base for leading out a pair of lead wires from an electrolytic capacitor body, and a holding inner die is provided between the pair of lead wires. First and second lead wire holding means arranged and configured to hold the lead base of the lead wire by moving the pair of holding outer dies forward with respect to the holding inner die; and A first molding inner mold having a curved distal end that moves forward and backward in the direction in which the lead wire extends in opposition to the holding inner mold of the lead wire holding means;
A pair of outer molding dies arranged to hold the first inner molding die, and the first inner molding die is advanced to
A first forming process for expanding the lead-out base portion of the lead wire into a curved shape is performed by clamping the lead wire with a pair of outer molds. A second molding inner mold having a flat tip portion which moves toward and away from the inner mold in the direction in which the lead wire extends;
A pair of outer molding dies arranged to hold the inner molding die, the second inner molding die is advanced while holding the lead base of the lead wire, and the pair of outer molding dies is formed by the pair of outer molding dies. And a lead forming means configured to perform a second forming process for bending and forming the lead base of the lead wire by holding the lead wire.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of an apparatus for forming a lead wire of an electrolytic capacitor according to the present invention will be described in detail with reference to the accompanying drawings.

FIGS. 1A to 1E are schematic explanatory views showing a lead wire forming apparatus for an electrolytic capacitor according to the present invention and a forming process thereof.

FIG. 1A shows a configuration of a lead wire forming apparatus for performing a first forming process on a lead wire of an electrolytic capacitor. That is, this first forming process
As shown in FIG. 1 (b), a pair of lead wires 14, 14 led out substantially linearly from the main body 12 of the electrolytic capacitor 10 manufactured in a normal general manufacturing process is used.
(C), the pair of lead wires 14, 14
Is formed by expanding and expanding the lead-out base portion in a curved shape.

For this reason, as shown in FIG. 1A, the lead wire forming apparatus in this embodiment
0, a pair of lead wires 14, 14 derived from the main body 12.
A pair of outer holding dies 16 and 16 are arranged outside the lead-out base, and an inner holding die 18 is arranged between the pair of lead wires 14 and 14 to form the pair of outer holding dies. Mold 16, 16
Is moved forward with respect to the holding inner mold 18,
A first lead holding means 20A configured to hold the lead bases of the leads 14, 14 is provided.

Then, the lead wires 14, 14 are opposed to the holding inner mold 18 with respect to the lead wire holding means 20 A.
A first molding die 24 having a curved tip portion 24a that moves forward and backward in the direction in which the first molding die 24 extends, and a pair of molding outer dies 22, 22 are arranged outside the first molding die 24 so as to hold the first molding die 24. And
The first forming inner mold 24 is advanced and held by the pair of forming outer molds 22, 22 so that the lead bases of the lead wires 14, 14 are expanded and formed in a curved shape.
1 (see FIG. 1 (c)). A fitting recess 24b is provided at the center of the tip of the first molding inner mold 24 to be in contact with the holding inner mold 18.

Further, in the lead wire forming apparatus according to the present embodiment, a pair of lead wires 14, 14 is applied to a first formed electrolytic capacitor 10 as shown in FIG. As shown in (e), a pair of lead wires 14,
A lead wire forming means 30 for performing a second forming process for bending the 14 is provided.

That is, as shown in FIG. 1D, the basic configuration of the lead wire forming means 30 for performing the second forming process is the same as that shown in FIG. 1A. That is, in the present embodiment, the second lead wire holding means 2 configured similarly to the first lead wire holding means 20A is used.
0B, the lead wire 1 faces the inner die 18 for holding.
A second forming inner mold 28 having a flat tip portion 28a which moves forward and backward in the extending direction of the fourth and the fourth forming molds 14, and a pair of forming outer molds 26, 26 are provided outwardly to hold the second forming inner mold 28. Are disposed, and the second molding inner mold 28 is moved forward and clamped by the pair of molding outer molds 26, 26,
Lead wire forming means 30 for performing a second forming process (see FIG. 1 (e)) to bend and form the bent portions 14a, 14b symmetrically with respect to the lead bases of the lead wires 14, 14. Is configured. A fitting recess 28b is provided at the center of the distal end of the second molding inner mold 28 so as to be in contact with and fit to the holding inner mold 18.

In the lead wire forming apparatus for an electrolytic capacitor according to the present invention, the first and second lead wire holding means 20A and 20B for holding the lead-out bases of the lead wires, respectively, are provided. The lead wire forming means 30 having the first molding die 24 for expanding the lead-out base into a curved shape, and the lead-out base of the lead wire expanded in a curved shape are formed into symmetrical bent portions 14a and 14b. Lead wire forming means 3 having second forming inner mold 28 for bending and forming
With the configuration consisting of zero, smooth and proper bending of the lead wire can be achieved without causing excessive stress to the lead wire.

While the preferred embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various design changes can be made without departing from the spirit of the present invention.

[0019]

As is apparent from the above-described embodiment, the lead wire forming apparatus for an electrolytic capacitor according to the present invention is an electrolytic capacitor for bending a pair of lead wires derived from the electrolytic capacitor. In the lead wire forming apparatus of the present invention, a pair of outer dies for holding is arranged outside a base for leading out a pair of lead wires from the electrolytic capacitor body, and an inner die for holding is arranged between the pair of lead wires. First and second lead wire holding means configured to hold the lead base of the lead wire by moving the pair of holding outer dies forward with respect to the holding inner die; and the first lead. A first molding inner mold having a curved tip portion which moves forward and backward in the direction in which the lead wire extends in opposition to the holding inner mold of the wire holding means;
A pair of outer molding dies arranged so as to hold the inner molding die, and the lead wire is led out by advancing the first inner molding die and clamping it by the pair of outer molding dies. A flat tip that is configured to perform a first forming process for expanding and expanding a base in a curved shape, and that moves forward and backward in a direction in which the lead wire extends in opposition to a holding inner die of the second lead wire holding means. A second molding inner mold having a portion, and a pair of molding outer molds arranged to hold the second molding inner mold,
The second forming inner die is advanced while holding the lead wire lead-out base, and is clamped by the pair of forming outer dies, whereby the lead lead-out base is bent and formed. By providing the lead wire forming means configured to perform the forming process, it is possible to achieve a smooth and proper bending process of the lead wire without causing excessive stress to the lead wire.

In particular, according to the lead forming apparatus for an electrolytic capacitor according to the present invention, the use of the first forming inner mold and the second forming inner mold causes an abrupt stress on the lead wire during bending of the lead wire. As a result, the deterioration and breakage of the lead wire can be suppressed, and at the same time, the change in the LC level during the bending process, that is, the deterioration of the leakage current characteristics, can be prevented, and an electrolytic capacitor with consistently high quality can be manufactured. can do.

[Brief description of the drawings]

FIG. 1 shows a lead wire forming means and a lead wire forming state in a lead wire forming apparatus for an electrolytic capacitor according to the present invention, wherein (a) schematically shows a forming means using a first inner mold. FIG. 1B is a schematic diagram of a lead wire before preforming by a first molding die, and FIG. 2C is a schematic explanatory diagram of a lead wire after preforming by a first molding die.
(D) is a schematic configuration diagram of a molding unit using a second molding inner die, and (e) is a schematic explanatory diagram of a lead wire after the completion of molding by the second molding inner die.

FIGS. 2A and 2B show a lead wire and a schematic configuration of a first forming means using a primary mold in a conventional lead wire forming apparatus for an electrolytic capacitor, and FIG. 2A shows a state before a primary molding process. FIG. 3B is an explanatory view showing a state after the primary molding.

FIG. 3A is an explanatory view showing a schematic configuration of a second forming means using a secondary forming die for a lead wire in a conventional lead forming apparatus for an electrolytic capacitor, and FIG.
It is explanatory drawing which shows the schematic structure of the lead wire after a next shaping | molding process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electrolytic capacitor 12 Electrolytic capacitor main body 14, 14 Lead wire 14a 1st bending part 14b 2nd bending part 16, 16 Holding outer die 18 Holding inner die 20A 1st lead wire holding means 20B 2nd lead wire Holding means 22, 22 Molded outer mold 24 First molded inner mold 24a Curved tip 24b Fitting recess 26, 26 Molded outer mold 28 Second molded inner mold 28a Flat tip 28b Fitting recess 30 Lead wire forming means

Claims (1)

[Claims] 1. A lead wire forming apparatus for an electrolytic capacitor for performing a bending process on a pair of lead wires derived from an electrolytic capacitor, comprising: A pair of outer holding dies, an inner holding die between the pair of lead wires, and advancing the pair of outer holding dies with respect to the inner holding die. First and second lead wire holding means configured to hold a lead-out base of the wire, and a curve that moves forward and backward in the direction in which the lead wire extends in opposition to the holding inner die of the first lead wire holding means. A first molding inner mold having a tip portion, and a pair of molding outer dies arranged to hold the first molding inner mold, wherein the first molding inner mold is advanced to advance the pair of molding outer dies. By holding this with a mold, the lead wire A first forming process for expanding and forming the lead-out base into a curved shape, and a flat surface which moves forward and backward in the direction in which the lead wire extends in opposition to the holding inner die of the second lead wire holding means. A second molding inner mold having a tip portion, and a pair of molding outer dies arranged to hold the second molding inner mold, wherein the second molding inner mold is held while holding the lead base of the lead wire. Lead wire forming means configured to perform a second forming process for bending and forming the lead base of the lead wire by advancing the mold and holding the pair by the pair of forming outer dies. Characteristic lead wire forming equipment for electrolytic capacitors.