JP4792581B2 - Mechanical device with heat dissipation structure for reducing thermal deformation - Google Patents

Description

  The present invention relates to a mechanical device having a heat source inside and / or outside the device. More specifically, the present invention relates to thermal deformation of a mechanical device caused by heat generated by the heat source being transmitted to a housing of the mechanical device. The present invention relates to a mechanical device having a heat dissipation structure that can be easily reduced.

  One of the mechanical devices in which thermal deformation caused by heat generated by a heat source is a problem is a machine tool that performs metal cutting by relatively moving a workpiece made of metal and a tool. For this type of machine tool, various methods or means for reducing thermal deformation have been proposed. For example, a method of providing a cooling medium flow path in a housing of a machine tool to forcibly supply and circulate a liquid cooling medium (see, for example, Patent Document 1), or a method of forming a two-layer structure on the outer surface of a machine tool (For example, refer to Patent Document 2 and Patent Document 3) and the like.

A method of providing a coolant flow path in a machine tool housing and forcibly supplying and circulating a liquid coolant is conventionally used mainly for cooling a built-in spindle equipped with a built-in motor. In recent years, it has come to be used to reduce thermal deformation of machine tool bodies. In the prior art disclosed in Patent Document 1, a cavity capable of circulating liquid is formed inside a bed of a machine tool, and liquid is supplied to the cavity by a liquid circulating means to circulate, thereby reducing thermal deformation. Like to do.
JP 2004-066437 A (paragraph [0030], FIG. 1) JP 2004-098241 A (paragraph [0016], FIG. 2) JP 2002-355725 A (paragraph [0017], FIG. 1)

  However, for example, the method disclosed in Patent Document 1 for supplying and circulating a cooling medium inside a machine tool has a larger mass than a machine tool that does not use such a thermal deformation reduction method. There is a problem that the time required for the thermal deformation to reach a steady state becomes long, and it is impossible to follow a rapid change in the amount of heat generation. In addition, a high-power fluid supply means is required to pass the liquid cooling medium through the narrow flow path, but this is not preferable from the viewpoint of reducing the power consumption of the machine tool. As described above, the conventional thermal deformation reduction method using the liquid cooling medium includes many factors that increase the manufacturing cost and running cost of the machine tool.

  In addition, in the methods disclosed in Patent Document 2 and Patent Document 3, a cover is installed outside the outer surface of the machine tool in order to reduce the influence of the heat source existing outside the machine tool on the thermal deformation of the machine tool. The outer surface of the machine tool is doubled. In this method, an air layer is formed between the outer surface of the machine tool and the cover to insulate it from an external heat source, thereby reducing the influence of changes in environmental temperature such as room temperature. However, these conventional techniques do not consider the influence of internal heat generation of a motor or the like mounted on the machine tool, and it is difficult to reduce thermal deformation due to internal heat generation of the machine tool.

  In the conventional method for reducing thermal deformation of machine equipment, for example, when a liquid cooling medium is forcibly circulated, auxiliary equipment with high power consumption is required. Therefore, power consumption for reducing thermal deformation of a machine tool is required. Will be enormous. Further, since the fluid flow path is formed inside the housing of the mechanical device, the structure of the mechanical device cannot be simplified. In addition, a method has been proposed in which the outer surface of the machine tool has a two-layer structure so that it is not affected by an external heat source such as room temperature or solar radiation. However, this method does not provide a heat countermeasure against the internal heat source. It is enough.

  The present invention has been made to solve the above-described conventional problems, and for a mechanical device having a heat source inside and / or outside the device, without increasing the manufacturing cost or running cost of the mechanical device, It is an object to be solved to provide means that can effectively reduce thermal deformation of a mechanical device caused by heat generation of a heat source.

A mechanical device provided with a heat dissipation structure for reducing thermal deformation according to the present invention made to solve the above problems is a mechanical device having a heat source and a plurality of components joined or connected to each other. (I) The main body is disposed inside a component (hereinafter referred to as a “first component”) that is formed of a high thermal conductivity material and is closest to the heat generation source, while the tip is the first component. A heat dissipating member that protrudes to the outside and comes into contact with a gas outside the mechanical device, for example, air, and (ii) a high rigidity / low thermal conductivity material (including a heat insulating material), and includes a first component, An intermediate member sandwiched or interposed between the component and one or more other adjacent components (hereinafter referred to as “second component”); (iii) formed of a heat insulating material; Thermal insulation member arranged to cover the mechanical device That it comprises a and is characterized in.

  The mechanical device according to the present invention includes a cover member that is formed of a high thermal conductivity material and is connected to or coupled to the distal end portion of the heat radiating member, and covers the outer surface in a state of being separated from the outer surface of the mechanical device. It is preferable. In this case, it is more preferable to provide a gas supply means for supplying gas to the space between the cover member and the outer surface (hereinafter referred to as “cover facing surface”). Further, gas flow rate adjusting means for adjusting the flow rate of the gas flowing through the space portion may be provided according to the heat generation amount of the heat generation source. Or you may provide the gas supply means which produces a gas flow around the cover member (near both front and rear spreading surfaces). In this case, it is preferable to provide a gas flow rate adjusting means for adjusting the flow rate of the gas flowing around the cover member in accordance with the heat generation amount of the heat generation source.

  The mechanical device according to the present invention can easily perform thermal deformation caused by the heat generated in the internal and / or external heat source of the mechanical device by utilizing joint parts to be joined to each other and a high thermal conductivity material. It has a heat-dissipating structure for preventing the power consumption for reducing the thermal deformation of the mechanical device.

  According to the mechanical device of the present invention, the intermediate member is inserted into the joint surface between the components of the mechanical device, and the heat radiating member into the first component closest to (or adjacent to or adjacent to) the heat source. With this arrangement, the heat generated in the heat generating part and transmitted to the machine apparatus main body can be quickly guided to the outer surface of the machine apparatus and released to the outside of the apparatus. That is, the intermediate member formed of the low thermal conductivity material prevents or suppresses heat transfer from the first component closest to the heat source to the second component, so that the heat generated in the heat source is mechanical. Does not spread throughout the device. The heat in the first component is quickly released into the gas outside the apparatus via the heat dissipation member.

  In this mechanical device, the heat dissipation member and the intermediate member have a simple structure and do not consume energy such as electric power. Therefore, according to the mechanical device of the present invention, it is possible to effectively reduce the thermal deformation of the mechanical device due to the heat generated by the heat source without increasing the manufacturing cost and running cost.

Furthermore, the machine according to the first embodiment of the present invention, since the heat insulating member for covering the mechanical device is provided, the heat source which is installed away from the machine and (external heat source), the machine is installed It is less affected by changes in the external environmental temperature such as the room temperature of the room.

  In the mechanical device according to the present invention, when the cover member is provided, the heat of the heat radiating member is quickly released to the gas outside the device through the cover member having a large heat transfer area. Further, the heat in the space from the outside to the mechanical device is hindered by the gas in the space between the cover member and the cover facing surface of the mechanical device. For this reason, the heat source (external heat source) installed away from the mechanical device or the room temperature of the room in which the mechanical device is installed is less affected by changes in the external environment temperature.

  Further, when the gas supply means is provided, the heat flowing from the cover member into the gas is further promoted by the gas flowing in the space between the cover member and the cover facing surface of the machine device. Here, for example, when an electric fan is used as the gas supply means, the power consumption for driving the fan is the power of the fluid supply device used in the conventional thermal deformation reduction method of circulating the liquid cooling medium. Since it is extremely small compared to consumption, running costs are hardly increased.

  Note that, in the heat dissipation structure according to the present invention, an intermediate member formed of a low thermal conductivity material is interposed in a joint portion of a component part, and this intermediate member heats from the first component part to the second component part. Therefore, if the position of the heat source of the mechanical device can be specified, the heat dissipation structure can be provided locally in the mechanical device. In this case, it becomes possible to reduce thermal deformation more efficiently.

  Hereinafter, embodiments of the present invention (best mode for carrying out the present invention) will be described in detail with reference to the accompanying drawings. 1 to 14, 19, and 21 to 24, substantially the same components are denoted by the same reference numerals.

(Embodiment 1)
As shown in FIGS. 1 and 2, the mechanical device according to Embodiment 1 of the present invention includes three substantially rectangular parallelepiped component parts 1 (for example, formed of an iron-based material such as cast iron). A thin plate-like intermediate member 2 made of a material having high rigidity and low thermal conductivity (for example, zirconia, ceramic, etc.) is sandwiched between components 1 adjacent to each other in the arrangement direction. Or it is interposed. That is, the component parts 1 adjacent to each other in the arrangement direction are joined or connected to each other via the intermediate member 2.

  Heat is generated on one outer surface of the component 1 located at the center of the array (hereinafter, this component is referred to as “central component 1” and the other component is referred to as “end component 1”). Source 3 is attached. Hereinafter, in order to clarify the positional relationship, for convenience, the side on which the heat source 3 is provided is referred to as “rear” and the opposite side is referred to as “front”.

  The central component 1 having the heat source 3 attached to the rear surface is provided with a substantially cylindrical hole 1a extending in the front-rear direction. The hole 1 a is open on the front surface of the central component 1. However, although the hole 1a is close to the rear surface, it is not opened. And in this hole 1a, the heat radiating member 4 formed by high heat conductivity material (for example, aluminum, silver, copper, etc.) is arrange | positioned. The main body 4a of the heat radiating member 4 is accommodated in the hole 1a, but the front end 4b and the vicinity thereof protrude forward from the front surface of the central component 1 or the opening of the hole 1a, and the outside of the mechanical device. In contact with the gas. Further, the outer surface of the mechanical device is formed of a heat insulating material (for example, glass wool, ceramic fiber, heat-resistant plastic, etc.) except for a portion where the heat source 3 is attached and a portion where the heat radiating member 4 protrudes. It is covered with a heat insulating member 5.

  In the mechanical device according to the first embodiment, most of the heat generated by the heat source 3 flows into the central component 1 that is adjacent to (in contact with) the heat source 3. The heat that has flowed into the central component 1 further flows into the main body 4 a of the heat radiating member 4. Here, the rear part of the main body part 4a of the heat radiating member 4 is close to the heat source 3 and has a larger diameter or a larger capacity than the front part, so that a large amount of heat flows from the heat source 3 into the central component 1. The portion quickly flows into the main body 4a. Here, since the heat radiating member 4 is made of a high thermal conductivity material, the heat flowing into the main body portion 4a quickly moves toward the tip portion 4b, and is released into the air outside the device near the tip portion. The As described above, the heat flowing into the central component 1 from the heat source 3 is quickly released into the air outside the apparatus via the heat radiating member 4, so that the temperature of the central component 1 does not increase so much. Therefore, it is possible to effectively reduce the thermal deformation of the central component 1 resulting from the heat generation of the heat generating source 3, and thus the thermal deformation of the mechanical device.

  In addition, an intermediate member 2 formed of a low thermal conductivity material is sandwiched or interposed between the central component 1 and the left and right end component 1, so that the end from the central component 1 Heat transfer to the component 1 is suppressed. That is, the heat generated by the heat source 3 is not diffused throughout the mechanical device. For this reason, since the heat generated in the heat source 3 hardly flows into the end component 1, the temperature of the end component 1 hardly increases. Therefore, it is not necessary to provide the heat radiating member 4 in the end component 1. That is, in this mechanical device, since the intermediate member 2 is provided, the thermal deformation of the mechanical device can be effectively prevented or suppressed only by locally providing the heat dissipation structure only in the central component 1. .

  Furthermore, since the outer surface of the mechanical device according to the first embodiment is covered with the heat insulating member 5, it is hardly affected by changes in the external environmental temperature such as the room temperature of the room in which the mechanical device is installed. . Even when an external heat source exists outside the mechanical device, it is hardly affected by the heat generated by the external heat source. For this reason, it is possible to effectively prevent or suppress thermal deformation of the mechanical device due to such external factors.

  As described above, in the mechanical device according to the first embodiment, it is possible to effectively prevent thermal deformation caused by the heat generated in the heat source 3, but the intermediate member 2, the heat radiating member 4, and the heat insulating member, which are the means, can be used. 5 is a very simple and inexpensive member and does not require any energy such as electric power. Therefore, in this mechanical device, the thermal deformation caused by the heat generated by the heat generating source 3 can be effectively reduced without substantially increasing the manufacturing cost and the running cost.

(Embodiment 2)
Hereinafter, Embodiment 2 of the present invention will be described with reference to FIG. However, since the mechanical device according to the second embodiment has many common points with the mechanical device according to the first embodiment shown in FIG. 1 and FIG. A different point from the form 1 is demonstrated.

  As shown in FIG. 3, in the mechanical device according to the second embodiment, a plate shape that is formed of a high thermal conductivity material (for example, aluminum, silver, copper, etc.) and is coupled or connected to the distal end portion 4 b of the heat radiating member 4. The cover member 4c is provided. The cover member 4c has a rectangular spreading surface that covers the entire front surface of the mechanical device, and is disposed at a distance from the front surface of the mechanical device. The cover member 4c may be integrally formed with the main body 4a or the tip 4b of the heat radiating member 4, or may be separately formed and joined (for example, welded) to the tip 4b of the heat radiating member 4. It may be. Other configurations are the same as those of the mechanical device according to the first embodiment. Although not shown, in order to increase the heat radiation efficiency, an electric fan that forcibly generates an air flow is provided around the cover member 4c, that is, in the vicinity of the front and rear spreading surfaces of the cover member 4c. Also good. In this case, a gas flow rate adjusting means for adjusting the flow rate of the air flowing around the cover member 4c according to the heat generation amount of the heat generation source 3, for example, a controller for adjusting the output of the fan motor according to the heat generation amount of the heat generation source 3 Etc. may be provided. In addition, you may provide the fin for promoting heat dissipation in the front surface of the cover member 4c (refer FIG.19 (b) based on Embodiment 4).

  According to the mechanical device according to the second embodiment, the heat generated in the heat generating source 3 and flowing into the main body 4a of the heat radiating member 4 through the central component 1 is exposed to the air outside the device (that is, the heat transfer). It is quickly released into the air through the cover member 4c having a large thermal area. For this reason, compared with the mechanical apparatus which concerns on Embodiment 1, the thermal deformation of a mechanical apparatus can be prevented or suppressed more effectively.

  In addition, the heat in the space between the cover member 4c and the front surface of the machine apparatus prevents heat from being transmitted from the outside into the machine apparatus. For this reason, compared with the mechanical apparatus which concerns on Embodiment 1, the thermal deformation of the mechanical apparatus resulting from an external factor can be prevented or suppressed effectively.

(Embodiment 3)
Hereinafter, Embodiment 3 of the present invention will be described with reference to FIG. However, since the mechanical device according to the third embodiment has many common points with the mechanical device according to the second embodiment (and thus the first embodiment) shown in FIG. The differences from the second embodiment will be mainly described.

  As shown in FIG. 4, in the mechanical device according to the third embodiment, the electric motor outside the device is forcibly introduced or supplied to the space between the rear surface of the cover member 4 c and the front surface of the mechanical device. A fan 6 (gas supply means) is provided. A heat insulating member 5 that covers the entire front surface of the cover member 4c is provided. Here, gas flow rate adjusting means for adjusting the flow rate of the air flowing through the space according to the amount of heat generated by the heat source 3, for example, the output of a motor (not shown) of the fan 6 according to the amount of heat generated by the heat source 3. You may provide the controller etc. which adjust these. In addition, you may abbreviate | omit the heat insulation member 5 which covers the front surface of the cover member 4c. Other configurations are the same as those of the mechanical device according to the second embodiment.

  According to the mechanical device according to the third embodiment, the heat flowing from the cover member 4c into the air is greatly promoted by the air flowing through the space between the cover member 4c and the front surface of the mechanical device. In this case, the power consumption for driving the fan 6 is much higher than the power consumption of a fluid supply device (see Patent Document 1) used in a conventional thermal deformation reduction method for circulating a liquid cooling medium, for example. The running cost is hardly increased.

  Hereinafter, a mechanical device (analysis model 1) provided with the intermediate member 2, the heat radiating member 4, and the cover member 4c as a heat radiating structure, and a machine provided with the heat radiating member 4 and the cover member 4c, but not including the intermediate member 2. A thermal deformation analysis is performed on the apparatus (analysis model 2) based on an experiment, and the result of analyzing the influence of heat generated by the heat generation source 3 on the mechanical apparatus is shown.

  5 and 7 are a perspective view and a rear view, respectively, of a test mechanical device used as the analysis model 1. FIG. 9 is a cross-sectional view of the mechanical device shown in FIG. In this analysis model 1, all three component parts 1 are cast iron blocks. The two intermediate members 2 are plates formed of zirconia. Moreover, the heat radiating member 4 (the main-body part 4a and the front-end | tip part 4b) is an aluminum rod, and the cover member 4c is an aluminum plate. 7 and 9 show the dimensions of each part of the test machine.

  6 and 8 are a perspective view and a rear view, respectively, of a test mechanical device used as the analysis model 2. FIG. 10 is a cross-sectional view of the mechanical device shown in FIG. In the analysis model 2, the single component 10 is a cast iron block having a hole 10a. Moreover, the heat radiating member 4 (the main-body part 4a and the front-end | tip part 4b) is an aluminum rod, and the cover member 4c is an aluminum plate. 8 and 10 show the dimensions of each part of this test machine.

  11 and 12 are diagrams showing boundary conditions in the thermal analysis of the analysis model 1 and the analysis model 2, respectively. FIGS. 13 and 14 are diagrams showing boundary conditions in the deformation analysis of the analysis model 1 and the analysis model 2, respectively.

Table 1 below shows the physical properties of cast iron, zirconia, and aluminum used as materials for the heat dissipation structure, and the physical properties of air.

Table 1 Heat dissipation material and air properties

FIGS. 15 and 16 show analysis model 1 and analysis model 2 when the supply air flow rate, that is, the flow rate of air flowing through the space between the rear surface of the cover member 4c and the front surface of the machine is 1 m / s, respectively. The thermal analysis result of is shown. Each numerical value in FIG. 15 and FIG. 16 indicates the temperature rise (K).
FIGS. 17 and 18 show the deformation analysis results of the analysis model 1 and the analysis model 2 when the supply air flow velocity is 1 m / s, respectively. In addition, each numerical value in FIG. 17 and FIG. 18 has shown the thermal deformation amount (micrometer).

  As is clear from FIGS. 15 and 16, in the analysis model 1 including the intermediate member 2, the temperature increase amount of the mechanical device is generally lower than that in the analysis model 2 not including the intermediate member 2. In particular, the temperature rise in the end component 1 is around 10 degrees (K). On the other hand, in the analysis model 2, although the temperature increase amount of the mechanical device is less than 30 degrees (K) in any part, the vicinity of the end of the single component 10 (in the analysis model 1, the end point The temperature rise amount in the part corresponding to the component part exceeds 20 degrees (K). Therefore, it can be seen that the intermediate member 2 is very effective in preventing or suppressing the heat generated by the heat source 3 from diffusing to the entire machine apparatus, and thus preventing or suppressing the thermal deformation of the entire machine apparatus. .

  As is clear from FIGS. 17 and 18, in the analysis model 1 including the intermediate member 2, the amount of thermal deformation of the mechanical device is relatively small compared to the analysis model 2 not including the intermediate member 2. 52 μm. In the analysis model 2, the maximum thermal deformation amount is 58.2 μm. Also by this, it turns out that the intermediate member 2 is very effective in preventing or suppressing the thermal deformation of the whole machine apparatus.

Table 2 shows the results obtained by analyzing the amount of thermal deformation when the supply air flow velocity is 0.1 m / s, 1 m / s, or 10 m / s for analysis model 1 and analysis model 2.

Table 2 Average value of thermal deformation

  As is clear from Table 2, the amount of thermal deformation decreases as the supply air flow rate, that is, the flow rate of air flowing through the space between the rear surface of the cover member 4c and the front surface of the machine device increases. However, since the power consumption of the fan 6 increases if the supply air flow rate is increased too much, it is practical to set the supply air flow rate to 1 to 10 m / s.

  As described above, according to the mechanical devices according to the first to third embodiments of the present invention, any thermal deformation caused by the heat generated by the heat source 3 can be effectively reduced without substantially increasing the manufacturing cost and the running cost. Can do. In the mechanical devices according to the first to third embodiments, the number of the heat sources 3 is one. However, the present invention can of course be applied to a mechanical device provided with a plurality of heat sources 3. It is. Further, in the mechanical device according to the first to third embodiments, the three component parts 1 arranged in a row are provided, but the arrangement form or the number of the component parts 1 is not limited to these. .

(Embodiment 4)
The fourth embodiment of the present invention will be described below with reference to FIGS. 19 (a) and 19 (b). However, since the mechanical device according to the fourth embodiment has many common points with the mechanical device according to the second embodiment (and hence the first embodiment) shown in FIG. The differences from the second embodiment will be mainly described.

  As shown in FIG. 19A, in the mechanical device according to the fourth embodiment, a heat insulating member 5 that covers the entire rear surface of the cover member 4c is provided. On the other hand, the front surface of the cover member 4c is exposed to the surrounding air. Here, a gas supply means (not shown) such as a fan is provided outside the mechanical device in order to generate an air flow around or in front of the cover member 4c to promote heat dissipation from the front surface of the cover member 4c. It may be provided. Further, a gas flow rate adjusting means for adjusting the flow rate of air flowing around or in front of the cover member 4c according to the amount of heat generated by the heat source 3, for example, a fan motor (not shown) according to the amount of heat generated by the heat source 3 A controller or the like for adjusting the output may be provided. Other configurations are the same as those of the mechanical device according to the second embodiment.

  As shown in FIG. 19B, in the mechanical device according to the embodiment, it is preferable to provide fins 4d for promoting heat dissipation on the front surface of the cover member 4c. In the specific example shown in FIG. 19B, each fin 4d is a grid-like fin that extends in the vertical direction and has a rectangular cross section. However, the shape of the fins 4d is not limited to such a lattice shape, and any shape can be used as long as it increases the surface area of the front surface of the cover member 4c (for example, a plate shape or a thin plate). Shaped fins).

  According to the mechanical device according to the fourth embodiment, the heat release from the cover member 4c into the air is greatly promoted by the natural air flow or the forced air flow in front or front of the cover member 4c. . When a gas supply means such as a fan is provided, the power consumption for driving the gas supply means is, for example, a fluid supply device used in a conventional thermal deformation reduction method for circulating a liquid cooling medium ( Compared to the power consumption of Patent Document 1), the running cost is hardly increased.

  FIG. 20 shows the results obtained by numerical simulation of the heat dissipation characteristics or heat dissipation performance of two types of mechanical devices according to the fourth embodiment. Of the two types of mechanical devices, one uses a flat cover member 4c (aluminum heat radiating plate) that does not have fins on the front surface, and the other uses a cover member 4c (aluminum) that has lattice-shaped fins 4d on the front surface. Using a heat sink). Further, a fan was used to generate an air flow around or in front of the cover member 4c, and the fan outlet flow velocity was set to 0.1 m / s or 5.9 m / s.

Hereinafter, specific conditions for the numerical simulation will be described.
FIG. 21 shows the overall dimensions of the mechanical device and the shape and position of the heat source 3. The physical properties of the materials of the component 1, intermediate member 2 and heat radiating member 4 and the physical properties of the air constituting the mechanical device are as shown in Table 1 above. The heat source 3 is a surface heat source (electric heater) having a power consumption of 15 W and a surface heat generation density of 6 kW / m ² .

As shown in FIG. 22, the heat radiating member 4 is five aluminum bars arranged in a region where the heat source 3 acts.
As shown in FIG. 23, the numerical simulation was performed on the assumption that the mechanical device was arranged in a test chamber having a substantially cubic outer shape. The test chamber has a configuration in which the bottom surface is fully open to the outside, an air suction port (fan model) is provided on the top surface, and the four side surfaces are closed.
As shown in FIG. 24, in this numerical simulation, only the left half of the mechanical device that is a left-right symmetric model as viewed from the front side is analyzed. In addition, the influence of air convection in the test chamber due to temperature rise is ignored.

  As is clear from FIG. 20, according to the numerical simulation, in the mechanical device according to the fourth embodiment, the difference between the maximum value and the minimum value of the temperature rise value of the mechanical device is approximately 1.5 ° K. Is very small. And in the mechanical apparatus using the cover member 4c with a fin, the temperature rise value is quite small compared with the mechanical apparatus using the cover member 4c which is not provided with a fin. Therefore, it can be seen that providing the fins 4d on the front surface of the cover member 4c is very effective in improving the heat dissipation characteristics or heat dissipation performance of the mechanical device.

  In addition, when the fan outlet flow velocity is 5.9 m / s, compared to the case where the fan outlet flow velocity is 0.1 m / s (substantially no wind), regardless of whether or not the cover member 4c has a fin, The temperature rise value is greatly reduced. Therefore, it can be seen that forcibly generating an air flow around or in front of the cover member 4c is very effective in improving the heat dissipation characteristics or heat dissipation performance of the mechanical device.

1 is a perspective view of a mechanical device according to Embodiment 1 of the present invention. It is the sectional view on the AA line of the machine apparatus shown in FIG. It is a cross-sectional view of the mechanical apparatus which concerns on Embodiment 2 of this invention. It is a cross-sectional view of the mechanical apparatus which concerns on Embodiment 3 of this invention. 1 is a perspective view of a mechanical device having an intermediate member used as an analysis model 1. FIG. 3 is a perspective view of a mechanical device that does not have an intermediate member used as an analysis model 2. FIG. It is a rear view of the machine apparatus shown in FIG. It is a rear view of the mechanical apparatus shown in FIG. FIG. 6 is a cross-sectional view of the mechanical device shown in FIG. It is CC sectional view taken on the line of the mechanical apparatus shown in FIG. It is a figure which shows the boundary conditions in the thermal analysis of the mechanical apparatus (analysis model 1) shown in FIG. It is a figure which shows the boundary conditions in the thermal analysis of the mechanical apparatus (analysis model 2) shown in FIG. It is a figure which shows the boundary conditions in the deformation | transformation analysis of the mechanical apparatus (analysis model 1) shown in FIG. It is a figure which shows the boundary conditions in the deformation | transformation analysis of the mechanical apparatus (analysis model 2) shown in FIG. It is a figure which shows the thermal-analysis result (temperature rise) of the mechanical apparatus (analysis model 1) shown in FIG. It is a figure which shows the thermal-analysis result (temperature rise) of the mechanical apparatus (analysis model 2) shown in FIG. It is a figure which shows the thermal deformation analysis result (thermal deformation amount) of the mechanical apparatus (analysis model 1) shown in FIG. It is a figure which shows the thermal deformation analysis result (thermal deformation amount) of the mechanical apparatus (analysis model 2) shown in FIG. (A) is a cross-sectional view of a mechanical device according to Embodiment 4 of the present invention using a cover member not provided with fins, and (b) is an embodiment of the present invention using a cover member with fins. It is a cross-sectional view of the mechanical apparatus which concerns on form 4. It is a graph which shows the result of having calculated | required those heat dissipation characteristics by numerical simulation about two types of mechanical apparatuses which concern on Embodiment 4. FIG. It is a figure (perspective view) which shows the whole dimension of the mechanical apparatus used for the numerical simulation, and the shape of the heat generating source. It is a figure (perspective view) which shows the form of the thermal radiation member of the mechanical apparatus used for the numerical simulation. It is a figure (perspective view) which shows the form of the test chamber which accommodates the mechanical apparatus. It is a figure (perspective view) which shows the analysis area | region of the mechanical apparatus in numerical simulation.

Explanation of symbols

  1 mechanical component 1a hole 2 intermediate member made of high rigidity / low thermal conductivity material 3 heat source 4 heat dissipation member made of high thermal conductivity material 4a body part 4b tip part 4c cover member 4d fin, 5 heat insulating member, 6 fan, 10 component, 10a hole.

Claims (6)

In a mechanical device having a heat source and a plurality of components joined together,
A heat radiating member formed of a high thermal conductivity material and having a main body disposed inside a component closest to the heat source, while a tip portion projects outside the component and contacts a gas outside the mechanical device,
An intermediate member formed of a material having high rigidity and low thermal conductivity, and sandwiched between the above component and another component adjacent to the component;
A mechanical device provided with a heat dissipation structure for reducing thermal deformation, characterized by comprising a heat insulating member formed of a heat insulating material and arranged to cover the mechanical device.   A cover member that is formed of a high thermal conductivity material and is connected to a tip portion of the heat radiating member, and covers the outer surface in a state of being separated from the outer surface of the mechanical device. The mechanical device according to 1.   The machine apparatus according to claim 2, further comprising gas supply means for supplying a gas to a space between the cover member and the outer surface.   The mechanical device according to claim 3, further comprising a gas flow rate adjusting means for adjusting a flow rate of the gas flowing through the space according to a heat generation amount of the heat generation source.   The machine apparatus according to claim 2, further comprising gas supply means for generating a gas flow around the cover member.   6. The machine apparatus according to claim 5, further comprising a gas flow rate adjusting means for adjusting a flow rate of the gas flowing around the cover member in accordance with a heat generation amount of the heat generation source.

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