JP4789818B2 - 光学製品の成形用金型および光学製品の成形方法 - Google Patents
光学製品の成形用金型および光学製品の成形方法 Download PDFInfo
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- JP4789818B2 JP4789818B2 JP2007018011A JP2007018011A JP4789818B2 JP 4789818 B2 JP4789818 B2 JP 4789818B2 JP 2007018011 A JP2007018011 A JP 2007018011A JP 2007018011 A JP2007018011 A JP 2007018011A JP 4789818 B2 JP4789818 B2 JP 4789818B2
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- 238000000465 moulding Methods 0.000 title claims description 87
- 230000003287 optical effect Effects 0.000 title claims description 29
- 238000000034 method Methods 0.000 title claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 53
- 239000000956 alloy Substances 0.000 claims description 53
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 53
- 229910001120 nichrome Inorganic materials 0.000 claims description 50
- 239000002826 coolant Substances 0.000 claims description 40
- 238000002347 injection Methods 0.000 claims description 24
- 239000007924 injection Substances 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 19
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 15
- 238000001746 injection moulding Methods 0.000 claims description 10
- 238000000748 compression moulding Methods 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 9
- 238000007751 thermal spraying Methods 0.000 claims description 8
- 238000007750 plasma spraying Methods 0.000 claims description 6
- 238000010285 flame spraying Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 130
- 239000000758 substrate Substances 0.000 description 69
- 230000002093 peripheral effect Effects 0.000 description 35
- 239000007921 spray Substances 0.000 description 27
- 239000000463 material Substances 0.000 description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 238000012546 transfer Methods 0.000 description 17
- 238000001816 cooling Methods 0.000 description 15
- 229910001220 stainless steel Inorganic materials 0.000 description 15
- 239000010935 stainless steel Substances 0.000 description 14
- 229910010293 ceramic material Inorganic materials 0.000 description 13
- 230000002950 deficient Effects 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- 239000011651 chromium Substances 0.000 description 11
- 229910052804 chromium Inorganic materials 0.000 description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
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- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 239000013590 bulk material Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000010583 slow cooling Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- -1 CTa Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001093 Zr alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001235 nimonic Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
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- Moulds For Moulding Plastics Or The Like (AREA)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007018011A JP4789818B2 (ja) | 2007-01-29 | 2007-01-29 | 光学製品の成形用金型および光学製品の成形方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007018011A JP4789818B2 (ja) | 2007-01-29 | 2007-01-29 | 光学製品の成形用金型および光学製品の成形方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008183765A JP2008183765A (ja) | 2008-08-14 |
| JP2008183765A5 JP2008183765A5 (enExample) | 2009-02-19 |
| JP4789818B2 true JP4789818B2 (ja) | 2011-10-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007018011A Expired - Fee Related JP4789818B2 (ja) | 2007-01-29 | 2007-01-29 | 光学製品の成形用金型および光学製品の成形方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4789818B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5234640B2 (ja) * | 2009-02-02 | 2013-07-10 | 株式会社名機製作所 | 極薄導光板の成形金型および成形方法 |
| JP6496578B2 (ja) * | 2015-03-12 | 2019-04-03 | 株式会社リケン | ピストンリング |
| JP6418619B1 (ja) * | 2017-10-19 | 2018-11-07 | トーノファインプレーティング株式会社 | 金型、金型の製造方法、樹脂成形装置及び成形品の成形方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04223537A (ja) * | 1990-12-26 | 1992-08-13 | Nec Eng Ltd | イメージファイルの格納方式 |
| JPH0551724A (ja) * | 1991-08-23 | 1993-03-02 | Toyota Motor Corp | 中空溶射層の形成方法 |
| JPH1134112A (ja) * | 1997-07-11 | 1999-02-09 | Toshiba Mach Co Ltd | 精密成形用金型 |
| JPH11156897A (ja) * | 1997-11-28 | 1999-06-15 | Hitachi Maxell Ltd | 光ディスク基板射出成形金型及び成形基板 |
| JPH11311498A (ja) * | 1998-04-28 | 1999-11-09 | Kyocera Corp | 熱交換器用伝熱管 |
| JP3890768B2 (ja) * | 1998-09-22 | 2007-03-07 | 旭硝子株式会社 | 減圧脱泡システムの減圧装置 |
| JP2004181716A (ja) * | 2002-12-02 | 2004-07-02 | Matsushita Electric Ind Co Ltd | 光ディスク射出成形用金型 |
| WO2004078446A1 (ja) * | 2003-03-03 | 2004-09-16 | Matsushita Electric Industrial Co. Ltd. | ディスク基板成形用金型およびディスク基板の製造方法 |
| JP4780932B2 (ja) * | 2004-05-25 | 2011-09-28 | 京セラ株式会社 | 耐食性部材とその製造方法および半導体・液晶製造装置用部材 |
| JP2008127614A (ja) * | 2006-11-20 | 2008-06-05 | Mitsubishi Engineering Plastics Corp | 溶射皮膜構造体、及び、入れ子 |
-
2007
- 2007-01-29 JP JP2007018011A patent/JP4789818B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008183765A (ja) | 2008-08-14 |
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