JP4788699B2 - IC chip adhesive film - Google Patents
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- JP4788699B2 JP4788699B2 JP2007271711A JP2007271711A JP4788699B2 JP 4788699 B2 JP4788699 B2 JP 4788699B2 JP 2007271711 A JP2007271711 A JP 2007271711A JP 2007271711 A JP2007271711 A JP 2007271711A JP 4788699 B2 JP4788699 B2 JP 4788699B2
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Description
本発明は、突起状バンプを有するＩＣチップと相対峙させた回路基板の電極を接続固定して電気的接続および物理的接着をするために用いられる接着フィルムに関する。 The present invention relates to an adhesive film used for electrical connection and physical adhesion by connecting and fixing an electrode of a circuit board that is opposed to an IC chip having protruding bumps.
電子機器の小型化に対応して、ＩＣチップを直接回路に表面実装するベアチップ実装が広まってきた。この接続材料として現在は、導電性粒子を絶縁性接着剤中に分散させてフィルム状に製膜した異方導電性接着フィルムが採用されている。これらの実装に使用されるＩＣチップは、その接続電極以外を絶縁性酸化膜で保護し、さらにポリイミド樹脂等の保護膜で覆うことにより、基板回路との絶縁を図っている。 In response to the downsizing of electronic equipment, bare chip mounting, in which an IC chip is directly mounted on a circuit, has become widespread. At present, an anisotropic conductive adhesive film in which conductive particles are dispersed in an insulating adhesive and formed into a film is used as the connection material. The IC chips used for these mountings are insulated from the substrate circuit by protecting other than the connection electrodes with an insulating oxide film and further covering with a protective film such as polyimide resin.
もし、保護膜に欠陥があったり、保護膜そのものが無い場合は、従来の異方導電性接着フィルムで接続すると、異方導電性接着フィルム中の導電性粒子が基板回路とＩＣチップ内配線とを短絡させることにより、機能を発揮出来ない場合がある。従って現在は、高価な保護膜付けにコストを掛けているのが現状である。 If there is a defect in the protective film or there is no protective film itself, the conductive particles in the anisotropic conductive adhesive film are connected to the substrate circuit and the wiring in the IC chip by connecting with the conventional anisotropic conductive adhesive film. The function may not be achieved by short-circuiting. Therefore, at present, the cost is incurred for attaching an expensive protective film.
また、ＩＣチップの周囲にはＩＣチップの検査のために、ＴＥＧラインと称する回路が露出して残っており、基板回路とＩＣチップ内配線がつながってしまう不具合が発生しやすい。そこで個々のチップにダイシング加工するときにダイシング刃で除去しているが、完全に除去するには二段切断等の工程増になっている。 Further, a circuit called a TEG line is exposed and left around the IC chip for the inspection of the IC chip, and a problem that the substrate circuit and the wiring in the IC chip are connected easily occurs. Then, when dicing to individual chips, it is removed with a dicing blade, but in order to completely remove it, the number of processes such as two-stage cutting is increased.
本発明は、かかる状況に鑑みなされたもので、ＩＣチップの回路と基板回路の短絡を防止可能なＩＣチップ接続用接着フィルムを提供することを目的とする。 The present invention has been made in view of such circumstances, and an object thereof is to provide an adhesive film for connecting an IC chip that can prevent a short circuit between an IC chip circuit and a substrate circuit.
すなわち本発明は、導電性粒子による上記不具合を防止するために、導電性粒子の添加をやめ、接続するＩＣチップのバンプ高さより小径の絶縁性粒子を絶縁性接着剤中に分散させてなるＩＣチップ接続用接着フィルムに関する。 That is, in the present invention, in order to prevent the above problems caused by the conductive particles, the addition of the conductive particles is stopped, and the insulating particles having a diameter smaller than the bump height of the IC chip to be connected are dispersed in the insulating adhesive. The present invention relates to an adhesive film for chip connection.
本発明によれば、ＩＣチップと基板回路との間に導電性粒子が存在しないので、ＩＣチップと基板回路との短絡を完全に防止することができる。また本発明によれば、ＩＣチップの保護膜を必要としないのでコストの低減がはかれる。 According to the present invention, since no conductive particles exist between the IC chip and the substrate circuit, it is possible to completely prevent a short circuit between the IC chip and the substrate circuit. Further, according to the present invention, since a protective film for the IC chip is not required, the cost can be reduced.
本発明で用いる絶縁性接着剤としては、初期熱溶融性と、フィルム形性能があれば特に特定されないが、たとえば、フェノキシ樹脂や熱可塑性エラストマー等の熱可塑性樹脂、エポキシ樹脂やフェノール樹脂等の熱硬化性樹脂が用いられる。 The insulating adhesive used in the present invention is not particularly specified as long as it has initial heat meltability and film form performance. For example, a thermoplastic resin such as a phenoxy resin or a thermoplastic elastomer, or a heat such as an epoxy resin or a phenol resin. A curable resin is used.
また、絶縁性接着剤中に配合する絶縁性粒子としては、ＩＣチップのバンプ高さより小径であればよく、材質は特に問わないがプラスチック粒子、ガラスビーズ等の電気的絶縁物が用いられる。 The insulating particles to be blended in the insulating adhesive may have a diameter smaller than the bump height of the IC chip, and the material is not particularly limited, but an electrical insulator such as plastic particles or glass beads is used.
絶縁性粒子の形状としては球状が望ましく、また、絶縁性粒子の配合量は接着剤成分に対し０．１〜４．０％（体積）が好ましく、接着剤の厚さはＩＣチップのアンダーフィルに十分な量の確保と接着性を確保するために１０μm〜４０μｍが好ましい。 The shape of the insulating particles is preferably spherical, and the blending amount of the insulating particles is preferably 0.1 to 4.0% (volume) with respect to the adhesive component, and the thickness of the adhesive is the underfill of the IC chip. In order to ensure a sufficient amount and adhesion, the thickness is preferably 10 μm to 40 μm.
本発明にかかる接着フィルムは、通常接着剤溶液をセパレーターの上に流延成形することにより製造することができる。 The adhesive film according to the present invention can be usually produced by casting an adhesive solution on a separator.
図１に、本発明にかかる接着フィルムの断面構造の例を示したが、本発明を制限するものではない。図１−ａは絶縁性粒子を含有した接着剤層２をセパレータ１，３によりサンドイッチしたものであり、参考例の図１−ｂ、ｃは絶縁粒子を含有する接着剤層２と含有しない接着剤層４からなる構成され、用いるＩＣのバンプの状態により適宜選択して用いられる。この場合において、絶縁粒子を含有する接着剤層２と含有しない接着剤層４の溶融粘度に差を設けると、比較的少ない絶縁粒子の添加で本発明の目的を達成できる。溶融粘度差としては１７０℃で５００ポイズ程度あることが望ましい。溶融粘度差を設ける方法としては、絶縁粒子を含有する接着剤層２と含有しない接着剤層４に用いる接着剤そのものを異なる材料とすること、あるいは分子量に差をつけるといった方法が一般的である。
Although the example of the cross-section of the adhesive film concerning this invention was shown in FIG. 1, this invention is not restrict | limited. FIG. 1-a shows an adhesive layer 2 containing insulating particles sandwiched between separators 1 and 3, and FIGS. 1-b and c of the reference example show adhesive layers 2 containing insulating particles and no adhesive. It is composed of the agent layer 4 and is appropriately selected depending on the state of the bump of the IC to be used. In this case, if a difference is provided in the melt viscosity between the adhesive layer 2 containing insulating particles and the adhesive layer 4 not containing them, the object of the present invention can be achieved with the addition of relatively few insulating particles. The difference in melt viscosity is desirably about 500 poise at 170 ° C. As a method for providing a difference in melt viscosity, a method is generally used in which the adhesive itself used for the adhesive layer 2 containing insulating particles and the adhesive layer 4 not containing are made of different materials, or the molecular weight is made different. .
図２は、本発明の接着フィルムを用いて、ＩＣチップ６をフレキシブル回路基板の接続電極１０に接続した場合のバンプ部近傍の状況を示す断面図である。バンプ９の頂上部は回路基板の電極に接しており、ＩＣチップ６と回路基板は、その間を絶縁性接着剤５で接着固定されている。また、ＩＣチップ上には、添加した絶縁性粒子８が介在した状態で回路基板の電極が位置しており、ＩＣチップ６と回路基板の電極１０間は、絶縁性粒子直径に近い間隔が保たれ絶縁されている。さらに、バンプの極近傍では、絶縁粒子は突起状のバンプ形状に沿って流動し排除されている。
FIG. 2 is a cross-sectional view showing a situation in the vicinity of the bump portion when the IC chip 6 is connected to the
図３は、従来の異方導電性接着フィルムを用いて、ＩＣチップをフレキシブル回路基板に接続した場合のバンプ部近傍の状況を示す断面図である。ＩＣチップ６上と回路基板電極１０間には、導電性粒子１１が存在しており、ＩＣチップ６表面の保護膜１２に欠陥１３があると、回路基板の電極１０は、ＩＣチップとバンプ以外の場所が短絡状態になる可能性が高い。
FIG. 3 is a cross-sectional view showing a situation in the vicinity of a bump portion when an IC chip is connected to a flexible circuit board using a conventional anisotropic conductive adhesive film. When the conductive particles 11 exist between the IC chip 6 and the
（実施例）
フェノキシ樹脂（ＰＫＨＡ：ユニオンカーバイド社製高分子エポキシ樹脂）とマイクロカプセル型潜在製硬化剤を含有する液状エポキシ樹脂（ノバキュアＨＰ−３９４２ＨＰ：旭化成製、エポキシ当量１８５）の比率３０／７０とし、酢酸エチル３０％接着剤溶液を得た。この溶液に平均粒子径５μｍのポリスチレン樹脂製の絶縁粒子を体積比率で３％添加、撹拌分散させた絶縁粒子入り接着剤塗液を作成した。
(Example)
The ratio of phenoxy resin (PKHA: Union Carbide Polymer Epoxy Resin) and liquid epoxy resin containing a microcapsule type latent curing agent (Novacure HP-3942HP: Asahi Kasei, epoxy equivalent 185) is 30/70, and ethyl acetate is used. A 30% adhesive solution was obtained. An insulating particle-containing adhesive coating liquid was prepared by adding 3% by volume of insulating particles made of polystyrene resin having an average particle diameter of 5 μm to this solution and stirring and dispersing the particles.
この絶縁粒子入り接着剤塗液を、離型処理した５０μｍ厚さの二軸延伸ＰＥＴ樹脂製セパレータＢ上に流延・乾燥して、上面に５０μｍ厚さのセパレータＡを貼り合わせた、接着剤厚み３０μｍ、総厚み１３０μｍ厚みの接着フィルムを得た。 This adhesive coating liquid containing insulating particles was cast and dried on a 50 μm-thick biaxially stretched PET resin separator B subjected to a release treatment, and a 50 μm-thick separator A was bonded to the upper surface. An adhesive film having a thickness of 30 μm and a total thickness of 130 μm was obtained.
１００μｍ角のパッドを４隅に配置し、その表面を５０００Å厚みのＳｉＯ２，ＳｉＮ膜を付け、そのパッドに高さ６０μｍの金ワイヤバンプを成形した１ｍｍ角のＩＣチップを準備した。このＩＣチップには、電極間の抵抗が１０００Ωのテスト回路を設けてある。また、１８μｍ厚みの電解銅箔を５０μｍ厚みのポリイミド樹脂製フィルムに接着した基材を化学エッチングして、回路加工した回路基板を準備した。 A 1 mm square IC chip was prepared by arranging 100 μm square pads at four corners, attaching a SiO 2 , SiN film with a thickness of 5000 mm on the surface, and forming gold wire bumps with a height of 60 μm on the pads. This IC chip is provided with a test circuit having a resistance between electrodes of 1000Ω. Moreover, the base material which adhere | attached the electrolytic copper foil of 18 micrometers thickness on the 50-micrometer-thick polyimide resin film was chemically etched, and the circuit board which carried out the circuit process was prepared.
回路基板に上記接着フィルムを貼り付けた後、上記ＩＣチップのバンプと回路基板の電極を合わせて仮圧着した後、１８０℃、４００ｇｒ、２０秒の加熱加圧をして回路接続体を作製した。この接続体１００試料について、電極間抵抗１０００Ωのテスト回路電極の抵抗値を測定した結果、すべて１０００Ωの結果を得た。 After the adhesive film was attached to the circuit board, the bumps of the IC chip and the electrodes of the circuit board were combined and temporarily pressed, and then heated and pressed at 180 ° C., 400 gr for 20 seconds to produce a circuit connection body. . As a result of measuring the resistance value of the test circuit electrode having an interelectrode resistance of 1000Ω, the connection body 100 samples were all 1000Ω.
（比較例）
実施例と同様に、フェノキシ樹脂（ＰＫＨＡ：ユニオンカーバイド社製高分子エポキシ樹脂）とマイクロカプセル型潜在製硬化剤を含有する液状エポキシ樹脂（ノバキュアＨＰ−３９４２ＨＰ：旭化成製、エポキシ当量１８５）の比率３０／７０とし、酢酸エチル３０％接着剤溶液を得た。この溶液に平均粒子径５μｍの金メッキしたポリスチレン樹脂製粒子を体積比率で１％添加、撹拌分散させた絶縁粒子入り接着剤塗液を作成した。この導電性粒子入り接着剤塗液を、離型処理した５０μｍ厚みの二軸延伸ＰＥＴ樹脂製セパレータＢ上に流延・乾燥して接着剤厚み３０μｍの異方導電性接着フィルムを得た。
(Comparative example)
As in the examples, the ratio of phenoxy resin (PKHA: Union Carbide Polymer Epoxy Resin) and microcapsule-type latent hardener containing liquid epoxy resin (Novacure HP-3942HP: Asahi Kasei, epoxy equivalent 185) is 30. / 70 to obtain an ethyl acetate 30% adhesive solution. An adhesive coating solution containing insulating particles was prepared by adding 1% by volume of gold-plated polystyrene resin particles having an average particle diameter of 5 μm to this solution and stirring and dispersing the particles. The adhesive coating liquid containing conductive particles was cast and dried on a 50 μm-thick biaxially stretched PET resin separator B subjected to a release treatment to obtain an anisotropic conductive adhesive film having an adhesive thickness of 30 μm.
実施例と同様のＩＣチップ、回路基板及び上記異方導電性接着フィルムを用い、実施例と同じ接続方法・条件により接続体Ｂを作成した。この接続体Ｂ１００試料について、電極間抵抗１０００Ωのテスト回路電極の抵抗値を測定した結果、６試料の抵抗値は３０〜２５０Ωであり、その他の試料は１０００Ωの結果を得た。６試料はＩＣチップ上に位置している回路の一部と、ＩＣチップ内の回路の途中が接続状態となり、規定より低い抵抗値を示したものである。 Using the same IC chip, circuit board and the above anisotropic conductive adhesive film as in the example, a connection body B was prepared by the same connection method and conditions as in the example. As a result of measuring the resistance value of the test circuit electrode having an interelectrode resistance of 1000Ω with respect to this connection body B100 sample, the resistance value of 6 samples was 30 to 250Ω, and the other samples were 1000Ω. In the sample 6, a part of the circuit located on the IC chip is connected to the middle of the circuit in the IC chip, and the resistance value is lower than the specified value.
１ セパレータＡ、２ 絶縁性粒子入り接着剤層、３ セパレータＢ、４ 粒子なし接着剤層、５ 接着剤層、６ ＩＣチップ、８ 絶縁性粒子、９ 金バンプ、１０ 回路基板電極、１１ 導電性粒子、１２ 保護膜、１３ 保護膜の欠陥
1 Separator A, 2 Adhesive layer with insulating particles, 3 Separator B, 4 Adhesive layer without particles, 5 Adhesive layer, 6 IC chip, 8 Insulating particles, 9 Gold bump, 10 Circuit board electrode, 11 Conductivity Particle, 12 Protective film, 13 Defect in protective film
Claims (2)
前記ＩＣチップ接続用接着フィルムは、前記突起状バンプの高さより小径の絶縁性粒子を絶縁性接着剤中に分散させて含有しかつ導電性粒子を含有せず、
前記絶縁性接着剤は、接着剤成分としてフェノキシ樹脂及びエポキシ樹脂を含有し、
前記絶縁性粒子の配合量は、前記接着剤成分に対し０．１〜４．０％（体積）であることを特徴とするＩＣチップ接続用接着フィルム。 An IC chip connecting adhesive film interposed between an IC chip having protruding bumps and a circuit board, and used to electrically and physically connect and fix the protruding bumps of the IC chip and the electrodes of the circuit board. Because
The IC chip connecting adhesive film contains insulating particles having a diameter smaller than the height of the protruding bumps dispersed in an insulating adhesive and does not contain conductive particles .
The insulating adhesive contains a phenoxy resin and an epoxy resin as an adhesive component,
The compounding quantity of the said insulating particle is 0.1-4.0% (volume) with respect to the said adhesive agent component , The adhesive film for IC chip connection characterized by the above-mentioned .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007271711A JP4788699B2 (en) | 2007-10-18 | 2007-10-18 | IC chip adhesive film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007271711A JP4788699B2 (en) | 2007-10-18 | 2007-10-18 | IC chip adhesive film |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23014297A Division JP4051730B2 (en) | 1997-08-27 | 1997-08-27 | IC chip adhesive film |
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| JP2008045139A JP2008045139A (en) | 2008-02-28 |
| JP4788699B2 true JP4788699B2 (en) | 2011-10-05 |
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| US8613623B2 (en) | 2008-09-30 | 2013-12-24 | Sony Chemical & Information Device Corporation | Acrylic insulating adhesive |
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| JP2833111B2 (en) * | 1989-03-09 | 1998-12-09 | 日立化成工業株式会社 | Circuit connection method and adhesive film used therefor |
| JPH06132462A (en) * | 1992-10-15 | 1994-05-13 | Mitsui High Tec Inc | Lead frame and manufacture thereof |
| JPH06163610A (en) * | 1992-11-16 | 1994-06-10 | Toshiba Chem Corp | Semiconductor device |
| JPH0773921A (en) * | 1993-09-06 | 1995-03-17 | Hitachi Chem Co Ltd | Connecting member |
| JP3883214B2 (en) * | 1993-10-04 | 2007-02-21 | 富士通株式会社 | Adhesive for joining electronic components |
| JPH08167775A (en) * | 1994-12-14 | 1996-06-25 | Hitachi Chem Co Ltd | Manufacture of metal base copper clad board |
| JPH08186358A (en) * | 1994-12-30 | 1996-07-16 | Casio Comput Co Ltd | Connecting structure and method of electronic part |
| JP3801666B2 (en) * | 1995-05-22 | 2006-07-26 | 日立化成工業株式会社 | Electrode connection method and connection member used therefor |
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