JP4051730B2 - IC chip adhesive film - Google Patents
IC chip adhesive film Download PDFInfo
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- JP4051730B2 JP4051730B2 JP23014297A JP23014297A JP4051730B2 JP 4051730 B2 JP4051730 B2 JP 4051730B2 JP 23014297 A JP23014297 A JP 23014297A JP 23014297 A JP23014297 A JP 23014297A JP 4051730 B2 JP4051730 B2 JP 4051730B2
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- chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Description
【０００１】
【発明の属する技術分野】
本発明は、突起状バンプを有するＩＣチップと相対峙させた回路基板の電極を接続固定して電気的接続および物理的接着をするための接着方法、並びに同接着方法を適用した回路接続体の製造方法、及び回路接続体に関する。
【０００２】
【従来の技術】
電子機器の小型化に対応して、ＩＣチップを直接回路に表面実装するベアチップ実装が広まってきた。この接続材料として現在は、導電性粒子を絶縁性接着剤中に分散させてフィルム状に製膜した異方導電性接着フィルムが採用されている。
これらの実装に使用されるＩＣチップは、その接続電極以外を絶縁性酸化膜で保護し、さらにポリイミド樹脂等の保護膜で覆うことにより、基板回路との絶縁を図っている。もし、保護膜に欠陥があったり、保護膜そのものが無い場合は、従来の異方導電性接着フィルムで接続すると、異方導電性接着フィルム中の導電性粒子が基板回路とＩＣチップ内配線とを短絡させることにより、機能を発揮出来ない場合がある。従って現在は、高価な保護膜付けにコストを掛けているのが現状である。
また、ＩＣチップの周囲にはＩＣチップの検査のために、ＴＥＧラインと称する回路が露出して残っており、基板回路とＩＣチップ内配線がつながってしまう不具合が発生しやすい。そこで個々のチップにダイシング加工するときにダイシング刃で除去しているが、完全に除去するには二段切断等の工程増になっている。
【０００３】
【発明が解決しようとする課題】
本発明は、かかる状況に鑑みなされたもので、ＩＣチップの回路と基板回路の短絡を防止可能な接着方法、並びに同接着方法を適用した接続体の製造方法、及び回路接続体を提供することを目的とする。
【０００４】
【課題を解決するための手段】
すなわち本発明は、導電性粒子による上記不具合を防止するために、導電性粒子の添加をやめ、接続するＩＣチップのバンプ高さより小径の絶縁性粒子を絶縁性接着剤中に分散させかつ導電性粒子を含有しないＩＣチップ接続用接着フィルムを用いた接着方法、並びに同接着方法を適用した回路接続体の製造方法、及び回路接続体に関する。
【０００５】
【発明の実施の形態】
本発明で用いる絶縁性接着剤としては、初期熱溶融性と、フィルム形性能があれば特に特定されないが、たとえば、フェノキシ樹脂や熱可塑性エラストマー等の熱可塑性樹脂、エポキシ樹脂やフェノール樹脂等の熱硬化性樹脂が用いられる。また、絶縁性接着剤中に配合する絶縁性粒子としては、ＩＣチップのバンプ高さより小径であればよく、材質は特に問わないがプラスチック粒子、ガラスビーズ等の電気的絶縁物が用いられる。絶縁性粒子の形状としては球状が望ましく、また、絶縁性粒子の配合量は接着剤成分に対し０．１〜４．０％（体積）が好ましく、接着剤の厚さはＩＣチップのアンダーフィルに十分な量の確保と接着性を確保するために１０μｍ〜４０μｍが好ましい。本発明にかかる接着フィルムは、通常接着剤溶液をセパレーターの上に流延成形することにより製造することができる。図１に、本発明にかかる接着フィルムの断面構造の例を示したが、本発明を制限するものではない。図１−ａは絶縁性粒子を含有した接着剤層２をセパレータ１，３によりサンドイッチしたものであり、図１−ｂ、ｃは絶縁粒子を含有する接着剤層２と含有しない接着剤層４からなる構成され、用いるＩＣのバンプの状態により適宜選択して用いられる。この場合において、絶縁粒子を含有する接着剤層２と含有しない接着剤層４の溶融粘度に差を設けると、比較的少ない絶縁粒子の添加で本発明の目的を達成できる。溶融粘度差としては１７０℃で５００ポイズ程度あることが望ましい。溶融粘度差を設ける方法としては、絶縁粒子を含有する接着剤層２と含有しない接着剤層４に用いる接着剤そのものを異なる材料とすること、あるいは分子量に差をつけるといった方法が一般的である。図２は、本発明の接着フィルムを用いて、ＩＣチップ６をフレキシブル回路基板の接続電極１０に接続した場合のバンプ部近傍の状況を示す断面図である。バンプ９の頂上部は回路基板の電極に接しており、ＩＣチップ６と回路基板は、その間を絶縁性接着剤５で接着固定されている。また、ＩＣチップ上には、添加した絶縁性粒子８が介在した状態で回路基板の電極が位置しており、ＩＣチップ６と回路基板の電極１０間は、絶縁性粒子直径に近い間隔が保たれ絶縁されている。さらに、バンプの極近傍では、絶縁粒子は突起状のバンプ形状に沿って流動し排除されている。図３は、従来の異方導電性接着フィルムを用いて、ＩＣチップをフレキシブル回路基板に接続した場合のバンプ部近傍の状況を示す断面図である。ＩＣチップ６上と回路基板電極１０間には、導電性粒子１１が存在しており、ＩＣチップ６表面の保護膜１２に欠陥１３があると、回路基板の電極１０は、ＩＣチップとバンプ以外の場所が短絡状態になる可能性が高い。
【０００６】
【実施例】
フェノキシ樹脂（ＰＫＨＡ：ユニオンカーバイド社製高分子エポキシ樹脂）とマイクロカプセル型潜在製硬化剤を含有する液状エポキシ樹脂（ノバキュアＨＰ−３９４２ＨＰ：旭化成製、エポキシ当量１８５）の比率３０／７０とし、酢酸エチル３０％接着剤溶液を得た。この溶液に平均粒子径５μｍのポリスチレン樹脂製の絶縁粒子を体積比率で３％添加、撹拌分散させた絶縁粒子入り接着剤塗液を作成した。この絶縁粒子入り接着剤塗液を、離型処理した５０μｍ厚さの二軸延伸ＰＥＴ樹脂製セパレータＢ上に流延・乾燥して、上面に５０μｍ厚さのセパレータＡを貼り合わせた、接着剤厚み３０μｍ、総厚み１３０μｍ厚みの接着フィルムを得た。
１００μｍ角のパッドを４隅に配置し、その表面を５０００Å厚みのSiO2,SiN膜を付け、そのパッドに高さ６０μｍの金ワイヤバンプを成形した１ｍｍ角のＩＣチップを準備した。このＩＣチップには、電極間の抵抗が１０００Ωのテスト回路を設けてある。
また、１８μｍ厚みの電解銅箔を５０μｍ厚みのポリイミド樹脂製フィルムに接着した基材を化学エッチングして、回路加工した回路基板を準備した。
回路基板に上記接着フィルムを貼り付けた後、上記ＩＣチップのバンプと回路基板の電極を合わせて仮圧着した後、１８０℃、４００ｇｒ、２０秒の加熱加圧して回路接続体を作製した。
この接続体１００試料について、電極間抵抗１０００Ωのテスト回路電極の抵抗値を測定した結果、すべて１０００Ωの結果を得た。
【０００７】
比較例
実施例と同様に、フェノキシ樹脂（ＰＫＨＡ：ユニオンカーバイド社製高分子エポキシ樹脂）とマイクロカプセル型潜在製硬化剤を含有する液状エポキシ樹脂（ノバキュアＨＰ−３９４２ＨＰ：旭化成製、エポキシ当量１８５）の比率３０／７０とし、酢酸エチル３０％接着剤溶液を得た。この溶液に平均粒子径５μｍの金メッキしたポリスチレン樹脂製粒子を体積比率で１％添加、撹拌分散させた絶縁粒子入り接着剤塗液を作成した。この導電性粒子入り接着剤塗液を、離型処理した５０μｍ厚みの二軸延伸ＰＥＴ樹脂製セパレータＢ上に流延・乾燥して接着剤厚み３０μｍの異方導電性接着フィルムを得た。
実施例と同様のＩＣチップ、回路基板及び上記異方導電性接着フィルムを用い、実施例と同じ接続方法・条件により接続体Ｂを作成した。
この接続体Ｂ１００試料について、電極間抵抗１０００Ωのテスト回路電極の抵抗値を測定した結果、６試料の抵抗値は３０〜２５０Ωであり、その他の試料は１０００Ωの結果を得た。６試料はＩＣチップ上に位置している回路の一部と、ＩＣチップ内の回路の途中が接続状態となり、規定より低い抵抗値を示したものである。
【０００８】
【発明の効果】
本発明によれば、ＩＣチップと基板回路との間に導電性粒子が存在しないので、ＩＣチップと基板回路との短絡を完全に防止することができる。また本発明によれば、ＩＣチップの保護膜を必要としないのでコストの低減がはかれる。また本発明によれば、ＩＣチップの回路と基板回路の短絡を防止可能なＩＣチップ接続用接着フィルムを介在させた回路接続体を提供することができる。
【図面の簡単な説明】
【図１】 本発明による接着フィルムの構造を示す断面図。
【図２】 本発明の接着フィルムによるＩＣチップと回路基板電極の接続状態を示す断面図。
【図３】 比較例の異方導電性接着フィルムによるＩＣチップと回路基板電極の接続状態を示す断面図。
【符号の説明】
１ セパレータＡ ２ 絶縁性粒子入り接着剤層
３ セパレータＢ ４ 粒子なし接着剤層
５ 接着剤層 ６ ＩＣチップ
８ 絶縁性粒子 ９ 金バンプ
１０ 回路基板電極 １１ 導電性粒子
１２ 保護膜 １３ 保護膜の欠陥[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesion method for connecting and fixing an electrode of a circuit board that is opposed to an IC chip having protruding bumps for electrical connection and physical adhesion, and a circuit connection body to which the adhesion method is applied . The present invention relates to a manufacturing method and a circuit connection body.
[0002]
[Prior art]
In response to the downsizing of electronic equipment, bare chip mounting, in which an IC chip is directly mounted on a circuit, has become widespread. At present, an anisotropic conductive adhesive film in which conductive particles are dispersed in an insulating adhesive and formed into a film is used as the connection material.
The IC chips used for these mountings are insulated from the substrate circuit by protecting other than the connection electrodes with an insulating oxide film and further covering with a protective film such as polyimide resin. If there is a defect in the protective film or there is no protective film itself, the conductive particles in the anisotropic conductive adhesive film are connected to the substrate circuit and the wiring in the IC chip by connecting with the conventional anisotropic conductive adhesive film. The function may not be achieved by short-circuiting. Therefore, at present, the cost is incurred for attaching an expensive protective film.
Further, a circuit called a TEG line is exposed and left around the IC chip for the inspection of the IC chip, and a problem that the substrate circuit and the wiring in the IC chip are connected easily occurs. Then, when dicing to individual chips, it is removed with a dicing blade, but in order to completely remove it, the number of processes such as two-stage cutting is increased.
[0003]
[Problems to be solved by the invention]
The present invention has been made in view of such circumstances, and provides an adhesion method capable of preventing a short circuit between an IC chip circuit and a substrate circuit, a method of manufacturing a connection body to which the adhesion method is applied , and a circuit connection body. With the goal.
[0004]
[Means for Solving the Problems]
That is, the present invention stops adding the conductive particles, disperses the insulating particles having a diameter smaller than the bump height of the IC chip to be connected in the insulating adhesive, and prevents the inconvenience caused by the conductive particles . The present invention relates to an adhesion method using an adhesive film for connecting an IC chip that does not contain particles, a method for manufacturing a circuit connection body to which the adhesion method is applied , and a circuit connection body.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
The insulating adhesive used in the present invention is not particularly specified as long as it has initial heat meltability and film form performance. For example, a thermoplastic resin such as a phenoxy resin or a thermoplastic elastomer, or a heat such as an epoxy resin or a phenol resin. A curable resin is used. The insulating particles to be blended in the insulating adhesive may have a diameter smaller than the bump height of the IC chip, and the material is not particularly limited, but an electrical insulator such as plastic particles or glass beads is used. The shape of the insulating particles is preferably spherical, and the blending amount of the insulating particles is preferably 0.1 to 4.0% (volume) with respect to the adhesive component, and the thickness of the adhesive is the underfill of the IC chip. In order to ensure a sufficient amount and adhesion, the thickness is preferably 10 μm to 40 μm. The adhesive film according to the present invention can be usually produced by casting an adhesive solution on a separator. Although the example of the cross-section of the adhesive film concerning this invention was shown in FIG. 1, this invention is not restrict | limited. FIG. 1A shows an adhesive layer 2 containing insulating particles sandwiched between separators 1 and 3, and FIGS. 1B and 1C show an adhesive layer 2 containing insulating particles and an adhesive layer 4 not containing them. And is appropriately selected depending on the bump state of the IC used. In this case, if a difference is provided in the melt viscosity between the adhesive layer 2 containing insulating particles and the adhesive layer 4 not containing them, the object of the present invention can be achieved with the addition of relatively few insulating particles. The difference in melt viscosity is desirably about 500 poise at 170 ° C. As a method for providing a difference in melt viscosity, a method is generally used in which the adhesive itself used for the adhesive layer 2 containing insulating particles and the adhesive layer 4 not containing are made of different materials, or the molecular weight is made different. . FIG. 2 is a cross-sectional view showing a situation in the vicinity of the bump portion when the
[0006]
【Example】
The ratio of phenoxy resin (PKHA: Union Carbide Polymer Epoxy Resin) and liquid epoxy resin containing microcapsule-type latent curing agent (Novacure HP-3942HP: Asahi Kasei, epoxy equivalent 185) is 30/70, and ethyl acetate is used. A 30% adhesive solution was obtained. An insulating particle-containing adhesive coating liquid was prepared by adding 3% by volume of insulating particles made of polystyrene resin having an average particle diameter of 5 μm to this solution and stirring and dispersing the particles. This adhesive coating liquid containing insulating particles was cast and dried on a 50 μm-thick biaxially stretched PET resin separator B subjected to a release treatment, and a 50 μm-thick separator A was bonded to the upper surface. An adhesive film having a thickness of 30 μm and a total thickness of 130 μm was obtained.
A 1 mm square IC chip was prepared by arranging 100 μm square pads at the four corners, attaching a SiO 2 , SiN film with a thickness of 5000 mm on the surface, and molding gold wire bumps with a height of 60 μm on the pads. This IC chip is provided with a test circuit having a resistance between electrodes of 1000Ω.
Moreover, the base material which adhere | attached the electrolytic copper foil of 18 micrometers thickness on the 50-micrometer-thick polyimide resin film was chemically etched, and the circuit board which carried out the circuit process was prepared.
After adhering the adhesive film to the circuit board, the bumps of the IC chip and the electrodes of the circuit board were combined and temporarily pressure-bonded, and then heated and pressed at 180 ° C., 400 gr for 20 seconds to produce a circuit connector.
As a result of measuring the resistance value of the test circuit electrode having an interelectrode resistance of 1000Ω, the connection body 100 samples were all 1000Ω.
[0007]
Comparative Example As in the example, a liquid epoxy resin (Novacure HP-3942HP: manufactured by Asahi Kasei, epoxy equivalent 185) containing a phenoxy resin (PKHA: a polymer epoxy resin manufactured by Union Carbide) and a microcapsule type latent curing agent. The ratio was 30/70, and an ethyl acetate 30% adhesive solution was obtained. An adhesive coating solution containing insulating particles was prepared by adding 1% by volume of gold-plated polystyrene resin particles having an average particle diameter of 5 μm to this solution and stirring and dispersing the particles. The adhesive coating liquid containing conductive particles was cast and dried on a 50 μm-thick biaxially stretched PET resin separator B subjected to a release treatment to obtain an anisotropic conductive adhesive film having an adhesive thickness of 30 μm.
Using the same IC chip, circuit board and the above anisotropic conductive adhesive film as in the example, a connection body B was prepared by the same connection method and conditions as in the example.
As a result of measuring the resistance value of the test circuit electrode having an interelectrode resistance of 1000Ω with respect to this connection body B100 sample, the resistance value of 6 samples was 30 to 250Ω, and the other samples were 1000Ω. In the
[0008]
【The invention's effect】
According to the present invention, since no conductive particles exist between the IC chip and the substrate circuit, it is possible to completely prevent a short circuit between the IC chip and the substrate circuit. Further, according to the present invention, since a protective film for the IC chip is not required, the cost can be reduced. Further, according to the present invention, it is possible to provide a circuit connection body including an IC chip connection adhesive film capable of preventing a short circuit between an IC chip circuit and a substrate circuit.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing the structure of an adhesive film according to the present invention.
FIG. 2 is a cross-sectional view showing a connection state between an IC chip and a circuit board electrode using the adhesive film of the present invention.
FIG. 3 is a cross-sectional view showing a connection state of an IC chip and a circuit board electrode by an anisotropic conductive adhesive film of a comparative example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Separator A 2 Adhesive layer containing insulating particle 3 Separator B 4 Adhesive layer without
Claims (8)
前記ＩＣチップ接続用接着フィルムは、前記突起状バンプの高さより小径の絶縁性粒子を絶縁性接着剤中に分散させて含有しかつ導電性粒子を含有しないことを特徴とする前記接着方法。An IC chip connecting adhesive film is interposed between the IC chip having the protruding bumps and the circuit board, and heated and pressed to electrically and physically connect the protruding bumps of the IC chip and the electrodes of the circuit board. An adhesive method for connecting and fixing ,
Adhesive film for the IC chip connection, the bonding method characterized in that it does not contain by and electrically conductive particles contains height than the small diameter of the insulating particles of the protruding bumps are dispersed in an insulating adhesive.
前記ＩＣチップ接続用接着フィルムは、前記突起状バンプの高さより小径の絶縁性粒子を絶縁性接着剤中に分散させて含有しかつ導電性粒子を含有しない接着剤層と、前記絶縁粒子を含有しかつ導電性粒子を含有しない接着剤層の片面に積層した、絶縁粒子及び導電性粒子を含有しない接着剤層と、を有することを特徴とする前記接着方法。An IC chip connecting adhesive film is interposed between the IC chip having the protruding bumps and the circuit board, and heated and pressed to electrically and physically connect the protruding bumps of the IC chip and the electrodes of the circuit board. An adhesive method for connecting and fixing ,
The adhesive film for connecting an IC chip contains an insulating layer containing insulating particles having a diameter smaller than the height of the protruding bumps dispersed in an insulating adhesive and does not contain conductive particles, and the insulating particles. and and it was laminated on one surface of the adhesive layer containing no conductive particles, the bonding method and having a an adhesive layer containing no insulating particles and conductive particles.
前記ＩＣチップ接続用接着フィルムは、前記突起状バンプの高さより小径の絶縁性粒子を絶縁性接着剤中に分散させて含有しかつ導電性粒子を含有しない接着剤層と、前記絶縁粒子を含有しかつ導電性粒子を含有しない接着剤層の両面に積層した、絶縁粒子及び導電性粒子を含有しない接着剤層と、を有することを特徴とする前記接着方法。An IC chip connecting adhesive film is interposed between the IC chip having the protruding bumps and the circuit board, and heating and pressurization are performed to electrically and physically connect the protruding bumps of the IC chip and the electrodes of the circuit board. An adhesive method for connecting and fixing to
The adhesive film for connecting an IC chip contains an insulating layer containing insulating particles having a diameter smaller than the height of the protruding bumps dispersed in an insulating adhesive and does not contain conductive particles, and the insulating particles. and and it was laminated on both surfaces of the adhesive layer containing no conductive particles, the bonding method and having a an adhesive layer containing no insulating particles and conductive particles.
前記ＩＣチップ接続用接着フィルムは、前記突起状バンプの高さより小径の絶縁性粒子を絶縁性接着剤中に分散させて含有しかつ導電性粒子を含有しないことを特徴とする前記回路接続体の製造方法。An IC chip connecting adhesive film is interposed between the IC chip having the protruding bumps and the circuit board, and heated and pressed to electrically and physically connect the protruding bumps of the IC chip and the electrodes of the circuit board. A method of manufacturing a circuit connection body to be connected and fixed,
The adhesive film for connecting an IC chip contains insulating particles having a diameter smaller than the height of the protruding bumps dispersed in an insulating adhesive and does not contain conductive particles . Production method.
前記絶縁性接着剤層は、前記突起状バンプの高さより小径の絶縁性粒子を絶縁性接着剤中に分散させて含有しかつ導電性粒子を含有しないＩＣチップ接続用接着フィルムを、前記ＩＣチップと前記回路基板の間に介在させ加熱加圧して形成したものであることを特徴とする前記回路接続体。An IC chip having a projecting bump, and a circuit having an electrode and the projecting bump and the electrode that are electrically and physically connected and fixed with the projecting bump and the electrode facing each other. A circuit connection body having a substrate, and an insulating adhesive layer disposed between the IC chip and the circuit substrate,
The insulating adhesive layer includes an IC chip connecting adhesive film containing insulating particles having a diameter smaller than the height of the protruding bumps dispersed in the insulating adhesive and containing no conductive particles. And the circuit board, wherein the circuit connection body is formed by heating and pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23014297A JP4051730B2 (en) | 1997-08-27 | 1997-08-27 | IC chip adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23014297A JP4051730B2 (en) | 1997-08-27 | 1997-08-27 | IC chip adhesive film |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007271711A Division JP4788699B2 (en) | 2007-10-18 | 2007-10-18 | IC chip adhesive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1161056A JPH1161056A (en) | 1999-03-05 |
| JP4051730B2 true JP4051730B2 (en) | 2008-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23014297A Expired - Fee Related JP4051730B2 (en) | 1997-08-27 | 1997-08-27 | IC chip adhesive film |
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| JP (1) | JP4051730B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4387193B2 (en) | 2001-11-30 | 2009-12-16 | パナソニック フォト・ライティング 株式会社 | Strobe device and manufacturing method thereof |
| JP4649852B2 (en) * | 2004-03-08 | 2011-03-16 | カシオ計算機株式会社 | Electronic component joining method and electronic component joining structure |
| JP2008046910A (en) * | 2006-08-17 | 2008-02-28 | Toppan Forms Co Ltd | Method for manufacturing semiconductor device |
| CN114716932A (en) * | 2022-04-24 | 2022-07-08 | 惠州市鑫亚凯立科技有限公司 | Easy-to-clean ultrahigh-hardness functional adhesive tape and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
| JP4282097B2 (en) * | 1994-06-15 | 2009-06-17 | 日立化成工業株式会社 | Circuit board connection method, connection structure, and adhesive film used therefor |
| JP3348131B2 (en) * | 1994-09-13 | 2002-11-20 | 京セラケミカル株式会社 | Compound semiconductor device |
| JPH08148213A (en) * | 1994-11-25 | 1996-06-07 | Hitachi Chem Co Ltd | Connection member and structure and method for connecting electrode using the same |
| JPH08148210A (en) * | 1994-11-25 | 1996-06-07 | Hitachi Chem Co Ltd | Connection member |
| JP3656768B2 (en) * | 1995-02-07 | 2005-06-08 | 日立化成工業株式会社 | Connection member, electrode connection structure using the connection member, and connection method |
| JPH08295870A (en) * | 1995-04-26 | 1996-11-12 | Toshiba Chem Corp | Heat-resistant electrically insulating adhesive |
| JP3801666B2 (en) * | 1995-05-22 | 2006-07-26 | 日立化成工業株式会社 | Electrode connection method and connection member used therefor |
| JPH0955279A (en) * | 1995-08-10 | 1997-02-25 | Hitachi Chem Co Ltd | Electrode connecting method and connection structure of electrode obtained by the method |
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| JPH1161056A (en) | 1999-03-05 |
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