JP4786465B2 - Optical mask member and manufacturing method thereof - Google Patents

Description

  The present invention relates to an optical mask member for surface mounting and a method for manufacturing the same.

  Conventionally, an optical semiconductor device such as a semiconductor light emitting element or a semiconductor light receiving element and an optical component such as a mask that is optically coupled to the optical semiconductor device and shields light from a portion other than a predetermined light transmitting portion are separately formed. , And are optically coupled to each other during assembly.

As an example thereof, for example, one disclosed in Patent Document 1 is known. In this document, a plurality of microlenses are linearly formed on one surface of a glass substrate at a predetermined pitch, and on the other surface opposite to the surface on which the microlens array is formed around the light passage portion of the microlens array. An electrically insulating light absorption film is formed by vacuum deposition, and light in the portion other than the light passage portion in the microlens array is absorbed by this light absorption film, and the leakage light in the microlens array is immediately attenuated. . At the same time, nickel, copper, or gold is deposited on the base as an electrode to be bonded to the light receiving element by vapor deposition or plating, and the electrode part of the light receiving element array and the electrode part of the microarray formed at a predetermined pitch are bonded by gold bumps.
Japanese Patent Laid-Open No. 05-121710

  However, in the optical coupling structure disclosed in the above-mentioned patent document, since a glass substrate having excellent surface smoothness is used as a substrate for forming a microlens, a light absorbing film and an electrode formed by vapor deposition are used. The adhesion strength to the substrate is low, and it takes time to form a film and is poor in mass productivity.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an optical mask member having high adhesion strength and excellent mass productivity, and a method for manufacturing the same.

  An optical mask member according to the present invention comprises: a light shielding member that shields light of a predetermined wavelength; a metal plate provided at the periphery of the light shielding member; and a transparent resin that seals the light shielding member and the metal plate. The metal plate is covered with a transparent resin so that at least one end surface is exposed from the transparent resin.

  Since the optical mask member configured in this manner is formed by including a light shielding member, a metal plate, and a transparent resin for resin-sealing the light shielding member and the metal plate, the optical mask member can be easily manufactured. And excellent mass productivity can be obtained. Moreover, since the metal plate is covered with the transparent resin so that at least one end face is exposed from the transparent resin, the adhesion strength of the metal plate to the transparent resin can be increased.

  In the optical mask member according to the present invention, a region of the transparent resin covering the metal plate is provided with a conductor that penetrates the resin layer formed of the transparent resin and is electrically connected to the metal plate. Is preferred. In this case, since the conductor functions as an external connection terminal to which the conductor is electrically connected, the electrical connection with the outside can be easily and reliably performed.

  A method for producing an optical mask member according to the present invention is a method for producing the above-described optical mask member according to the present invention. (1) A resist for forming a predetermined resist pattern on a main surface of a conductive substrate. (2) A metal that forms a metal plate on the main surface of the substrate by electrodepositing a conductive metal on the exposed portion of the main surface of the substrate excluding the resist pattern formed in the resist pattern forming step. A plate electrodeposition step; (3) a resist pattern removal step of removing the resist pattern from the substrate after the metal plate electrodeposition step; and (4) light of a predetermined wavelength on the main surface of the substrate after the resist pattern removal step. A light shielding member forming step for forming a light shielding member for shielding light, and (5) a resin sealing step for covering the metal plate and the light shielding member with a transparent resin by using a flat upper mold after the light shielding member forming step. And (6 Characterized in that it comprises a substrate removal step of removing the substrate after the resin sealing step. In this case, an optical mask member having strong adhesion strength of the metal plate to the transparent resin can be easily mass-produced.

  A method for manufacturing an optical mask member according to the present invention is a method for manufacturing the optical mask member according to the present invention, wherein (1) a first resist pattern is formed on a main surface of a conductive substrate. A first resist pattern forming step, and (2) electrodepositing a conductive metal on an exposed portion of the main surface of the substrate excluding the first resist pattern formed in the first resist pattern forming step. A metal plate electrodeposition step for forming a metal plate thereon; (3) a first resist pattern removal step for removing the first resist pattern from the substrate after the metal plate electrodeposition step; and (4) first resist pattern removal. A second resist pattern forming step for forming a second resist pattern on the main surface of the metal plate after the step; and (5) gold excluding the second resist pattern formed in the second resist pattern forming step. A conductor electrodeposition step of electrodepositing a conductive metal on an exposed portion of the main surface of the plate to form a conductor on the main surface of the metal plate; and (5) a metal plate after the conductor electrodeposition step. A second resist pattern removing step for removing the second resist pattern from the substrate, and (6) a light shielding member for forming a light shielding member for shielding light of a predetermined wavelength on the main surface of the substrate after the second resist pattern removing step. (7) After the light shielding member forming step, a resin seal that covers the metal plate and the light shielding member with a transparent resin together with the upper die and the substrate so that the inner surface of the flat upper die contacts the conductor. It is preferable to include a stopping step and (8) a substrate removing step of removing the substrate after the resin sealing step. In this case, an optical mask member having strong adhesion strength of the metal plate to the transparent resin can be easily mass-produced.

  The method for manufacturing an optical mask member according to the present invention is a method for manufacturing the optical mask member according to the present invention described above, and (1) a predetermined resist pattern is formed on a main surface of a conductive substrate. And (2) forming a metal plate on the main surface of the substrate by electrodepositing a conductive metal on the exposed portion of the main surface of the substrate excluding the resist pattern formed in the resist pattern forming step. A metal plate electrodeposition step, (3) a resist pattern removal step for removing the resist pattern from the substrate after the metal plate electrodeposition step, and (4) a predetermined wavelength on the main surface of the substrate after the resist pattern removal step. A light shielding member forming step for forming a light shielding member that shields the light of the metal plate, and (5) a metal plate using an upper mold having a convex portion that comes into contact with the metal plate when the substrate is aligned with the substrate after the light shielding member forming step. And light A resin sealing step of covering the covering member with a transparent resin, (6) a substrate removing step of removing the substrate after the resin sealing step, and (7) a transparent formed by the upper mold convex portion when combined with the substrate. It is preferable to include a connecting step of embedding a conductor in the concave portion of the resin and electrically connecting the conductor to the metal plate. In this case, an optical mask member having strong adhesion strength of the metal plate to the transparent resin can be easily mass-produced.

  According to the present invention, it is possible to provide an optical mask member having high adhesion strength and excellent mass productivity and a method for manufacturing the same.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent components are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
First, a first embodiment of an optical mask member and a manufacturing method thereof according to the present invention will be described. FIG. 1 is a top view, a cross-sectional view, and a bottom view of an optical mask member 1 according to the first embodiment. FIG. 1A shows a top view, FIG. 1B shows a cross-sectional view, and FIG. 1C shows a bottom view. The optical mask member 1 shown in this figure includes a light shielding member 10, metal plates 22 and 24, and a transparent resin 30, and is formed in a rectangular parallelepiped shape by integral molding.

  The light shielding member 10 is made of a member that shields light of a predetermined wavelength, has a circular opening 10b at the center, and has a flat plate shape. The light shielding member 10 has a characteristic of shielding light having a light emission wavelength of a light emitting element optically connected or a light reception wavelength of a light receiving element, and examples thereof include a black resist. The bottom surface 10 a of the light shielding member 10 is exposed from the transparent resin 30, and the other plane is covered with the transparent resin 30.

  The metal plates 22 and 24 have a flat plate shape, and are provided symmetrically on both sides of the light shielding member 10. Lower surfaces (end surfaces) 22 a and 24 a of the metal plates 22 and 24 are formed on the same plane and exposed from the transparent resin 30, and the other planes of the metal plates 22 and 24 are covered with the transparent resin 30.

  The transparent resin 30 seals the light shielding member 10 and the metal plates 22 and 24 so as to cover them. The lower surface 30a of the transparent resin 30, the lower surfaces 22a and 24a of the metal plates 22 and 24, and the bottom surface 10a of the light shielding member 10 are formed on the same plane. In addition, as the transparent resin 30, a transparent resin used for resin sealing is used. For example, the transparent resin 30 is transparent to light having a light emission wavelength of a light emitting element optically connected to the optical mask member 1 or a light receiving wavelength of a light receiving element. The thermosetting epoxy transparent resin and silicone transparent resin which are are mentioned. The transparent resin 30 is filled in the opening 10 b provided in the center of the light shielding member 10, thereby forming a light transmitting portion 32 that transmits light of a predetermined wavelength.

  Since the optical mask member 1 configured in this way is formed by resin-sealing the light shielding member 10 and the metal plates 22 and 24 using a transparent resin 30, it is easily manufactured and has excellent mass productivity. It is done. Then, the exposed lower surfaces 22a and 24a of the metal plates 22 and 24 are soldered onto, for example, the light receiving element, so that the optical mask member 1 is mounted on the light receiving element. Since such an optical mask member 1 remains in a resin-sealed form without being put into a package, it can be reduced in size and thickness, and can be surface-mounted on other components such as a light receiving element. The density can be improved.

  Further, since the metal plates 22 and 24 are sealed with the transparent resin 30 and the lower surfaces 22a and 24a are exposed from the transparent resin 30, the adhesion strength of the metal plates 22 and 24 to the transparent resin 30 can be obtained high. The metal plates 22 and 24 function as alignment means, and when the optical mask member 1 is mounted on another component, the alignment operation with the other component can be easily performed. For example, when the optical mask member 1 is mounted on the light receiving element, the positions of the metal plates 22 and 24 are set in accordance with the positions of the electrode pads of the light receiving element at the design stage, and the metal plates 22 and 24 of the optical mask member 1 are received. The position of the optical mask member 1 can be easily determined by mounting directly on the electrode pad of the element with solder or the like and reflowing, and can be mounted with a high yield. Moreover, since the optical mask member 1 and other components can be connected by self-alignment when mounting by solder, highly accurate positioning can be easily performed.

  Further, the optical mask member 1 is formed by sealing the light shielding member 10 and the metal plates 22 and 24 with a transparent resin 30, and the bottom surface 10 a of the light shielding member 10 and the lower surfaces 22 a and 24 a of the metal plates 22 and 24. Other planes except for are taken in by the transparent resin member 30. For this reason, the thickness of the optical mask member 1 can be reduced, and the optical mask member 1 can be thinned.

  Next, a method for manufacturing the optical mask member 1 according to the first embodiment will be described. FIG. 2 is a flowchart illustrating a method for manufacturing the optical mask member 1 according to the first embodiment. 3 and 4 are process diagrams illustrating a method of manufacturing the optical mask member 1 according to the first embodiment. In these drawings, a case where a plurality (three in the drawing) of optical mask members 1 are manufactured simultaneously is shown.

  First, in the resist pattern forming step (step S1), a predetermined resist pattern 42 is formed on the main surface of the conductive substrate 40 (FIGS. 3A and 3B). The board | substrate 40 used here is a metal plate with flat both surfaces, and thickness is 0.1 mm, for example, for example, consists of stainless steel, aluminum, copper, etc. Resists 42 and 44 are applied to both surfaces of the substrate 40 (FIG. 3A). The resist applied here is, for example, an alkali type photosensitive film resist having a thickness of 50 μm. A mask having a predetermined pattern is arranged on one main surface of the substrate 40 coated with the resist, and in this state, double-sided exposure is performed by ultraviolet irradiation, and development processing is performed. Thereby, the resist on the main surface of the substrate 40 is cured, and a predetermined resist pattern 42 is formed (FIG. 3B).

  In the metal plate electrodeposition step (step S2) subsequent to the resist pattern formation step (step S1), the conductive metal is electrodeposited on the exposed portion of the main surface of the substrate 40 excluding the resist pattern 42, so that the main surface of the substrate 40 is obtained. Metal plates 22 and 24 are formed thereon (FIG. 3C). Before this electrodeposition, surface activation treatment such as removal of the surface oxide film by chemical etching or chemical treatment with chemicals is performed as necessary. For example, nickel, nickel-cobalt alloy, copper and other various metals are used as electrodeposits, and a matte bath of nickel sulfamate is used. The thickness of the resist pattern 42 is about 40 to 50 μm. Metal plates 22 and 24 are formed. If necessary, it is preferable to perform gold plating or the like for improving the binding force on the surfaces of the metal plates 22 and 24 in a thickness of 0.3 to 0.4 μm.

  In the resist pattern removal step (step S3) subsequent to the metal plate electrodeposition step (step S2), the resists 42 and 44 are removed from the substrate 40 (FIG. 3D). As a resist removal method, a swelling removal method using an alkaline solution or the like is possible.

  In the light shielding member forming step (step S4) subsequent to the resist pattern removing step (step S3), the light shielding member 10 that shields light of a predetermined wavelength is formed on the main surface of the substrate 40 (FIG. 4A). . Specifically, for example, a black resist having a property of shielding light having a light emission wavelength or light reception wavelength is applied to a predetermined position on the main surface of the substrate 40 and cured to form a light shielding member 10 having a predetermined pattern. Let

  In the resin sealing step (step S5) subsequent to the light shielding member forming step (step S4), the metal plates 22, 24 and the light shielding member 10 are covered and sealed with the transparent resin 30. Specifically, a flat mold die (upper die) 50 is mounted on the upper surface of the substrate 40 (FIG. 4B), and the transparent resin 30 is press-fitted into the cavity in the mold die. As the transparent resin 30, for example, a thermosetting epoxy resin that is transparent to light having a light emission wavelength or a light reception wavelength is used. At this time, the substrate 40 functions as a lower mold during resin molding. As a result, the transparent resin 30 flows between the mold 60 and the substrate 40, and a plurality of metal plates 22, 24, etc. are arranged on the substrate 40 and integrally sealed with the transparent resin 30. (FIG. 4 (c)). If a plurality of substrates 40 are arranged in parallel at the time of molding, and the transparent resin 30 is distributed and press-fitted between each substrate 40 and the mold die 50 by a runner, a large number of resin sealing can be performed efficiently. Can be done. And after the transparent resin 30 hardens | cures, the mold die 50 is removed and a resin sealing process is complete | finished (FIG.4 (d)).

  In the substrate removal step (step S6) subsequent to the resin sealing step (step S5), the substrate 40 is removed to expose the lower surfaces 22a, 24a of the metal plates 22, 24 and the bottom surface 10a of the light shielding member 10. A sealing body is obtained (FIG. 4E). As a method for removing the substrate 40, in addition to a method for forcibly peeling and removing the substrate 40 from the resin sealing body, the resin sealing body side may be used depending on the material constituting the substrate 40 or the like. A method of dissolving and removing the substrate 40 with a solvent or the like that does not affect the surface is also possible. The lower surfaces 22a and 24a of the metal plates 22 and 24, the bottom surface 10a of the light shielding member 10, and the lower surface 30a of the transparent resin 30 are on the same plane. If necessary, a thin film of a conductive metal layer such as gold or silver is mounted on the lower surfaces 22a and 24a of the metal plates 22 and 24 by a method such as flash plating after the process, if necessary. It may be formed with a thickness of 5 μm.

  In the cutting step (step S7) subsequent to the substrate removing step (step S6), the resin sealing body is cut along the cutting line indicated by the broken line in FIG. Mask member 1 (FIG. 1) is manufactured.

  Thus, by integrally molding the light shielding member 10 and the metal plates 22 and 24 with the transparent resin 30, the optical mask member 1 can be easily mass-produced, resulting in an effect of reducing the manufacturing cost. In the optical mask member 1 manufactured by this manufacturing method, the adhesion strength of the metal plates 22 and 24 to the transparent resin 30 is strong.

  Next, a modification of the optical mask member 1 will be described with reference to FIG. 5A, the bottom surface 10a of the light shielding member 10 and the lower surface 30a of the transparent resin 30 are formed on the same plane. However, the lower surfaces 222a and 242a of the metal plates 222 and 242 are light-shielded. The optical mask member 1 is formed so as to protrude from the bottom surface 10 a of the member 10 and the lower surface 30 a of the transparent resin 30. In this case, similarly to the above-described embodiment, when the optical mask member 1 is mounted on another component, the alignment operation with the other component can be easily performed, and the optical mask member 1 can be thinned. Become. Further, the lower surfaces 222a and 242a of the metal plates 222 and 242 protrude from the bottom surface 10a of the light shielding member 10 and the lower surface 30a of the transparent resin 30 to the outside of the optical mask member 1, thereby preventing a short circuit due to a solder flow during mounting. Can be expected. In the manufacturing method of the optical mask member 1 in this case, the substrate used is processed so that the region where the conductive metal is to be electrodeposited (the region where the metal plates 222 and 242 are formed) is recessed relative to the other regions. It is necessary to be done.

  5B, the bottom surface 10a of the light shielding member 10 and the lower surface 30a of the transparent resin 30 are formed on the same plane, but the lower surfaces 224a and 244a of the metal plates 224 and 244 are light-shielded. The optical mask member 1 is formed so as to be recessed from the bottom surface 10 a of the member 10 and the lower surface 30 a of the transparent resin 30. In this case, similarly to the above-described embodiment, when the optical mask member 1 is mounted on another component, the alignment operation with the other component can be easily performed, and the optical mask member 1 can be thinned. Become. Further, the lower surfaces 224a and 244a of the metal plates 224 and 244 are recessed from the bottom surface 10a of the light shielding member 10 and the lower surface 30a of the transparent resin 30 to the inside of the optical mask member 1, thereby preventing a short circuit due to a solder flow during mounting. Can be expected. In the method of manufacturing the optical mask member 1 in this case, the substrate to be used is such that the region where the conductive metal is to be electrodeposited (the region where the metal plates 224 and 244 are formed) protrudes from the other regions. It is necessary to be processed.

(Second Embodiment)
Next, a second embodiment of the optical mask member according to the present invention will be described. FIG. 6 is a top view, a cross-sectional view, and a bottom view of the optical mask member 2 according to the second embodiment. FIG. 1A shows a top view, FIG. 1B shows a cross-sectional view, and FIG. 1C shows a bottom view. The translucent cap member 2 shown in this figure includes a light shielding member 10 that shields light of a predetermined wavelength, metal plates 22 and 24 provided on both sides of the light shielding member 10, and the light shielding member 10 and the metal plate. And a transparent resin 30 for resin-sealing 22 and 24, and formed by integral molding.

  Compared with the optical mask member 1 according to the first embodiment shown in FIG. 1, the optical mask member 2 according to the second embodiment shown in FIG. 6 is different in that it includes conductors 26 and 28. . Specifically, the region of the transparent resin 30 covering the metal plates 22 and 24 (that is, the region covering the upper surfaces 22b and 24b of the metal plates 22 and 24) penetrates the resin layer formed of the transparent resin 30. Conductors 26 and 28 electrically connected to the metal plates 22 and 24 are provided, and the lower surfaces of the conductors 26 and 28 are connected to the upper surfaces 22b and 24b of the metal plates 22 and 24, respectively. 26 a and 28 a are exposed from the transparent resin 30 and formed on the same plane as the upper surface 30 b of the transparent resin 30. Since other structures have the same structure as that of the first embodiment, description thereof is omitted.

  By adopting such a configuration, the optical mask member 2 according to the second embodiment is excellent in that the adhesion strength of the metal plates 22 and 24 to the transparent resin 30 is high as in the first embodiment. Mass production is possible. Further, when performing surface mounting, it is possible to easily perform alignment work with other components. Furthermore, by providing the conductors 26 and 28, the conductors 26 and 28 function as external connection terminals to which the conductors 26 and 28 are electrically connected, and electrical connection with the outside can be easily and reliably performed.

  Next, a method for manufacturing the optical mask member 2 according to the second embodiment will be described. FIG. 7 is a flowchart illustrating a method for manufacturing the optical mask member 2 according to the second embodiment. 8-10 is process drawing explaining the method to manufacture the optical mask member 2 which concerns on 2nd Embodiment. In these drawings, a case where a plurality (three in the drawing) of optical mask members 2 are manufactured simultaneously is shown.

  First, in the first resist pattern forming step (step S10), the first resist pattern 42 is formed on the main surface of the conductive substrate 40 (FIGS. 8A and 8B). The board | substrate 40 used here is a metal plate with flat both surfaces, and thickness is 0.1 mm, for example, for example, consists of stainless steel, aluminum, copper, etc. Resists 42 and 44 are applied to both surfaces of the substrate 40 (FIG. 8A). The resist applied here is, for example, an alkali type photosensitive film resist having a thickness of 50 μm. A mask having a first pattern is arranged on one main surface of the substrate 40 coated with the resist, and in this state, double-sided exposure is performed by ultraviolet irradiation, and development processing is performed. As a result, the resist on the main surface of the substrate 40 is cured, and the first resist pattern 42 is formed (FIG. 8B).

  In the metal plate electrodeposition step (step S11) subsequent to the first resist pattern formation step (step S10), the conductive metal is electrodeposited on the exposed portion of the main surface of the substrate 40 excluding the first resist pattern 42, and the substrate Metal plates 22 and 24 are formed on the main surface of 40 (FIG. 8C). In addition, since this process is the same as that of step S2 of the manufacturing method of 1st Embodiment, detailed description is abbreviate | omitted.

  In the first resist pattern removal process (step S12) subsequent to the metal plate electrodeposition process (step S11), the resists 42 and 44 are removed from the substrate 40 (FIG. 8D). As the first resist removal method, a swelling removal method using an alkaline solution or the like is possible.

  In the second resist pattern forming step (step S13) subsequent to the first resist pattern removing step (step S12), the second resist pattern 46 is formed on the main surface of the substrate 40 and the metal plates 22 and 24 (FIG. 9 ( a), (b)). That is, resists 46 and 48 are applied to the main surfaces of the metal plates 22 and 24 and the substrate 40 and the other plane of the substrate 40, respectively (FIG. 9A). The resist applied here is, for example, an alkali type photosensitive film resist having a thickness of 50 μm. A mask of a second pattern is arranged on the main surface of the substrate 40 and the metal plates 22 and 24 coated with the resist, and in this state, double-sided exposure is performed by ultraviolet irradiation, and development processing is performed. As a result, the resist on the main surfaces of the substrate 40 and the metal plates 22 and 24 is cured, and a second resist pattern 46 is formed (FIG. 9B).

  In the conductor electrodeposition step (step S14) subsequent to the second resist pattern formation step (step S13), conductive metal is electrodeposited on the exposed portions of the main surfaces of the metal plates 22 and 24 excluding the second resist pattern 46. Thus, the conductors 26 and 28 are formed on the main surfaces of the metal plates 22 and 24, respectively (FIG. 9C). In addition, since this process is the same as that of step S2 of the manufacturing method of 1st Embodiment, detailed description is abbreviate | omitted.

  In the second resist pattern removing step (step S15) subsequent to the conductor electrodeposition step (step S14), the resists 46 and 48 are removed from the substrate 40 and the metal plates 22 and 24 (FIG. 9D). As the second resist removal method, a swelling removal method using an alkaline solution or the like is possible.

  In the light shielding member forming step (step S16) subsequent to the second resist pattern removing step (step S15), the light shielding member 10 that shields light of a predetermined wavelength is formed on the main surface of the substrate 40 (FIG. 10A). )). Specifically, for example, a black resist having a property of shielding light having a light emission wavelength or light reception wavelength is applied to a predetermined position on the main surface of the substrate 40 and cured to form a light shielding member 10 having a predetermined pattern. Let

  In the resin sealing step (step S17) subsequent to the light shielding member forming step (step S16), the metal plates 22, 24 and the light shielding member 10 are covered and sealed with the transparent resin 30. Specifically, at this time, the mold mold 52 and the substrate 40 are combined so that the inner surface 52a of the flat mold mold (upper mold) 52 is in contact with the conductors 26 and 28 (FIG. 10B). The transparent resin 30 is pressed into the cavity in the mold 52. As the transparent resin 30, for example, a thermosetting epoxy resin that is transparent to light having a light emission wavelength or a light reception wavelength is used. At this time, the substrate 40 functions as a lower mold during resin molding. Thereby, the transparent resin 30 flows between the mold 52 and the substrate 40, and a plurality of metal plates 22, 24, etc. are arranged on the substrate 40 and integrally sealed with the transparent resin 30. (FIG. 10 (c)). If a plurality of substrates 40 are arranged in parallel at the time of molding, and the transparent resin 30 is distributed and press-fitted between each substrate 40 and the mold die 52 by a runner, a large number of resin sealing can be efficiently performed. Can be done. And after the transparent resin 30 hardens | cures, the mold die 52 is removed and a resin sealing process is complete | finished (FIG.10 (d)).

  In the substrate removal process (step S18) subsequent to the resin sealing process (step S17), the upper surfaces 26a, 28a of the conductors 26, 28 and the lower surfaces 22a, 24a of the metal plates 22, 24 are removed by removing the substrate 40. An exposed resin sealing body is obtained (FIG. 10E). As a method for removing the substrate 40, in addition to a method for forcibly peeling and removing the substrate 40 from the resin sealing body, the resin sealing body side may be used depending on the material constituting the substrate 40 or the like. A method of dissolving and removing the substrate 40 with a solvent or the like that does not affect the surface is also possible. The lower surfaces 22a and 24a of the metal plates 22 and 24, the bottom surface 10a of the light shielding member 10, and the lower surface 30a of the transparent resin 30 are on the same plane. If necessary, a thin film of a conductive metal layer such as gold or silver is mounted on the lower surfaces 22a and 24a of the metal plates 22 and 24 by a method such as flash plating after the process, if necessary. It may be formed with a thickness of 5 μm.

  In the cutting step (step S19) subsequent to the substrate removal step (step S18), the resin sealing body is cut along the cutting line indicated by the broken line in FIG. Mask member 2 (FIG. 6) is manufactured.

  Thus, by integrally molding the metal plates 22, 24, the conductors 26, 28 and the light shielding member 10 with the transparent resin 30, the optical mask member 2 can be easily mass-produced and the manufacturing cost can be reduced. Bring effect.

  In addition, the manufacturing method of the optical mask member 2 which concerns on 2nd Embodiment is not limited to said manufacturing method, You may manufacture as follows. Hereinafter, another method for manufacturing the optical mask member 2 according to the second embodiment will be described. FIG. 11 is a flowchart for explaining another method of manufacturing the optical mask member 2 according to the second embodiment. In this other manufacturing method, the steps from the resist pattern forming step (step S21) to the light shielding member forming step (step S24) are the same as steps S1 to S4 of the manufacturing method according to the first embodiment, and thus description thereof is omitted. . Hereinafter, steps different from the manufacturing method of the first embodiment will be described with reference to FIG.

  In the resin sealing step (step S25) subsequent to the light shielding member forming step (step S24), the metal plates 22, 24 and the light shielding member 10 are covered and sealed with the transparent resin 30. At this time, specifically, it is mounted on the upper surface of the substrate 40 using a mold die (upper die) 54 having a convex portion 54a that comes into contact with the metal plates 22 and 24 when mating with the substrate 40 (FIG. 12A). ) The transparent resin 30 is press-fitted into the cavity inside the mold 54. As the transparent resin 30, for example, a thermosetting epoxy resin that is transparent to light having a light emission wavelength or a light reception wavelength is used. At this time, the substrate 40 functions as a lower mold during resin molding. As a result, the transparent resin 30 flows between the mold 54 and the substrate 40, and a plurality of metal plates 22, 24, etc. are arranged on the substrate 40 and integrally sealed with the transparent resin 30. (FIG. 12B). After the transparent resin 30 is cured, the mold 54 is removed, and the resin sealing process is completed. A concave portion 56 is formed in a portion corresponding to the convex portion 54a of the mold 54 when the resin sealing body is combined with the substrate 40 (FIG. 12C).

  Since the substrate removal step (step S26) following the resin sealing step (step S25) is the same as the substrate removal step (step S6) of the manufacturing method of the first embodiment, a duplicate description is omitted.

  In the connection step (step S27) in which the conductor is electrically connected to the metal plate following the substrate removal step (step S26), the conductors 26 and 28 are embedded in the recess 56, respectively. They are electrically connected to the plates 22 and 24 (FIG. 12 (d)). The conductors 26 and 28 may be metal conductors or conductive resins. In this case, the conductors 26 and 28 may be formed such that the upper surfaces 26a and 28a thereof are flush with the upper surface 30b of the transparent resin 30 or protrude from the upper surface 30b of the transparent resin 30. May be.

  In the cutting step (step S28) subsequent to the connecting step (step S27), the resin sealing body is cut along a cutting line indicated by a broken line in FIG. Member 2 (FIG. 6) is manufactured.

  In another manufacturing method of the optical mask member 2 described above, the connecting step of electrically connecting the conductor to the metal plate may be performed between the resin sealing step and the substrate removing step. That is, it is possible to perform a connecting step after the resin sealing step and then perform a substrate removing step.

  Further, the same modification (FIG. 5) as that of the optical mask member 1 according to the first embodiment can be adopted for the optical mask member 2 according to the second embodiment.

  The present invention is not limited to the above embodiment. For example, in the above embodiment, the number of metal plates or conductors is two, but the number may be increased or decreased as necessary.

It is the top view, sectional drawing, and bottom view of the optical mask member which concerns on 1st Embodiment. It is a flowchart explaining the method to manufacture the optical mask member which concerns on 1st Embodiment. It is process drawing explaining the method to manufacture the optical mask member which concerns on 1st Embodiment. It is process drawing explaining the method to manufacture the optical mask member which concerns on 1st Embodiment. It is a figure which shows the modification of the optical mask member which concerns on 1st Embodiment. It is the upper side figure, sectional drawing, and bottom view of the optical mask member which concerns on 2nd Embodiment. It is a flowchart explaining the method to manufacture the optical mask member which concerns on 2nd Embodiment. It is process drawing explaining the method to manufacture the optical mask member which concerns on 2nd Embodiment. It is process drawing explaining the method to manufacture the optical mask member which concerns on 2nd Embodiment. It is process drawing explaining the method to manufacture the optical mask member which concerns on 2nd Embodiment. It is a flowchart explaining the other manufacturing method of the optical mask member which concerns on 2nd Embodiment. It is process drawing explaining the other manufacturing method of the optical mask member which concerns on 2nd Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,2 ... Optical mask member, 10 ... Light shielding member, 22, 24 ... Metal plate, 22a, 24 ... Lower surface (end surface), 26, 28 ... Conductor, 30 ... Transparent resin, 40 ... Substrate, 42, 44, 46, 48 ... resist, 50, 52, 54 ... mold (upper die), 52a ... inner surface, 54a ... convex part, 56 ... concave part.

Claims (5)

A light shielding member that shields light of a predetermined wavelength;
A metal plate provided on the periphery of the light shielding member;
A transparent resin for resin-sealing the light shielding member and the metal plate;
With
The metal plate is covered with the transparent resin so that at least one end surface is exposed from the transparent resin,
An optical mask member characterized by the above.   The region of the transparent resin that covers the metal plate is provided with a conductor that penetrates the resin layer formed of the transparent resin and is electrically connected to the metal plate. Item 5. The optical mask member according to Item 1. A method for producing the optical mask member according to claim 1, comprising:
A resist pattern forming step of forming a predetermined resist pattern on the main surface of the conductive substrate;
A metal plate electrodeposition step of electrodepositing a conductive metal on the exposed portion of the main surface of the substrate excluding the resist pattern formed in the resist pattern forming step, and forming a metal plate on the main surface of the substrate; ,
After the metal plate electrodeposition step, a resist pattern removal step of removing the resist pattern from the substrate,
After the resist pattern removing step, a light shielding member forming step for forming a light shielding member that shields light of a predetermined wavelength on the main surface of the substrate;
After the light shielding member forming step, a resin sealing step of covering the metal plate and the light shielding member with a transparent resin using a flat upper mold,
A substrate removal step of removing the substrate after the resin sealing step;
An optical mask member manufacturing method comprising: A method for producing the optical mask member according to claim 2,
A first resist pattern forming step of forming a first resist pattern on the main surface of the conductive substrate;
A metal plate for forming a metal plate on the main surface of the substrate by electrodepositing a conductive metal on the exposed portion of the main surface of the substrate excluding the first resist pattern formed in the first resist pattern forming step An electrodeposition process;
A first resist pattern removing step of removing the first resist pattern from the substrate after the metal plate electrodeposition step;
A second resist pattern forming step of forming a second resist pattern on the main surface of the metal plate after the first resist pattern removing step;
Conductive metal is electrodeposited on the exposed portion of the main surface of the metal plate excluding the second resist pattern formed in the second resist pattern forming step, and a conductor is formed on the main surface of the metal plate. A conductor electrodeposition process;
A second resist pattern removing step of removing the second resist pattern from the metal plate after the conductor electrodeposition step;
A light shielding member forming step of forming a light shielding member that shields light of a predetermined wavelength on the main surface of the substrate after the second resist pattern removing step;
Resin sealing that covers the metal plate and the light shielding member with a transparent resin together with the upper die and the substrate so that the inner surface of the flat upper die comes into contact with the conductor after the light shielding member forming step Process,
A substrate removal step of removing the substrate after the resin sealing step;
An optical mask member manufacturing method comprising: A method for producing the optical mask member according to claim 2,
A resist pattern forming step of forming a predetermined resist pattern on the main surface of the conductive substrate;
A metal plate electrodeposition step of electrodepositing a conductive metal on the exposed portion of the main surface of the substrate excluding the resist pattern formed in the resist pattern forming step, and forming a metal plate on the main surface of the substrate; ,
After the metal plate electrodeposition step, a resist pattern removal step of removing the resist pattern from the substrate,
After the resist pattern removing step, a light shielding member forming step for forming a light shielding member that shields light of a predetermined wavelength on the main surface of the substrate;
After the light shielding member forming step, a resin sealing step of covering the metal plate and the light shielding member with a transparent resin using an upper mold having a convex portion that comes into contact with the metal plate when matching with the substrate,
A substrate removal step of removing the substrate after the resin sealing step;
A connecting step of embedding a conductor in the concave portion of the transparent resin formed by the convex portion of the upper mold when combined with the substrate, and electrically connecting the conductor to the metal plate;
An optical mask member manufacturing method comprising:

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