JP4785257B2 - 発光装置の作製方法 - Google Patents

発光装置の作製方法 Download PDF

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Publication number
JP4785257B2
JP4785257B2 JP2001027421A JP2001027421A JP4785257B2 JP 4785257 B2 JP4785257 B2 JP 4785257B2 JP 2001027421 A JP2001027421 A JP 2001027421A JP 2001027421 A JP2001027421 A JP 2001027421A JP 4785257 B2 JP4785257 B2 JP 4785257B2
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Japan
Prior art keywords
coating liquid
nozzle
layer
film
light
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Expired - Lifetime
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JP2001027421A
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English (en)
Japanese (ja)
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JP2001291588A (ja
JP2001291588A5 (enExample
Inventor
正明 ▲ひろ▼木
典子 柴田
舜平 山崎
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2001027421A priority Critical patent/JP4785257B2/ja
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Publication of JP2001291588A5 publication Critical patent/JP2001291588A5/ja
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  • Special Spraying Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
JP2001027421A 2000-02-04 2001-02-02 発光装置の作製方法 Expired - Lifetime JP4785257B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001027421A JP4785257B2 (ja) 2000-02-04 2001-02-02 発光装置の作製方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000-27523 2000-02-04
JP2000027523 2000-02-04
JP2000027523 2000-02-04
JP2001027421A JP4785257B2 (ja) 2000-02-04 2001-02-02 発光装置の作製方法

Related Child Applications (1)

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JP2011133923A Division JP2011175986A (ja) 2000-02-04 2011-06-16 発光装置の作製方法

Publications (3)

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JP2001291588A JP2001291588A (ja) 2001-10-19
JP2001291588A5 JP2001291588A5 (enExample) 2008-02-07
JP4785257B2 true JP4785257B2 (ja) 2011-10-05

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JP2001027421A Expired - Lifetime JP4785257B2 (ja) 2000-02-04 2001-02-02 発光装置の作製方法

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JP (1) JP4785257B2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4066661B2 (ja) 2002-01-23 2008-03-26 セイコーエプソン株式会社 有機ｅｌ装置の製造装置および液滴吐出装置
JP3957535B2 (ja) 2002-03-14 2007-08-15 株式会社半導体エネルギー研究所 発光装置の駆動方法、電子機器
US6858464B2 (en) 2002-06-19 2005-02-22 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing light emitting device
JP4597490B2 (ja) * 2002-06-19 2010-12-15 株式会社半導体エネルギー研究所 発光装置の作製方法
WO2004045252A1 (ja) 2002-11-11 2004-05-27 Semiconductor Energy Laboratory Co., Ltd. 発光装置の作製方法
JP2004230209A (ja) * 2003-01-28 2004-08-19 Casio Comput Co Ltd 溶液噴出装置
US6908045B2 (en) 2003-01-28 2005-06-21 Casio Computer Co., Ltd. Solution spray apparatus and solution spray method
JP2004230211A (ja) * 2003-01-28 2004-08-19 Casio Comput Co Ltd 溶液噴出装置及び溶液噴出方法
JP3901119B2 (ja) * 2003-04-04 2007-04-04 セイコーエプソン株式会社 描画装置、有機ｅｌ装置の製造方法および製造装置、並びに有機ｅｌ装置および電子機器
TWI255150B (en) 2003-12-22 2006-05-11 Lg Philips Lcd Co Ltd Organic electroluminescent device and method of fabricating the same
JP2007152164A (ja) * 2005-12-01 2007-06-21 Dainippon Screen Mfg Co Ltd 塗布装置および塗布装置における複数のノズルのピッチの調整方法
JP4910518B2 (ja) * 2006-07-05 2012-04-04 富士ゼロックス株式会社 有機電界発光素子の製造方法
JP2009231090A (ja) * 2008-03-24 2009-10-08 Casio Comput Co Ltd Ｅｌパネル及びｅｌパネルの製造方法
JP4835637B2 (ja) * 2008-05-12 2011-12-14 パナソニック株式会社 液体塗布装置および液体塗布方法
JP6151136B2 (ja) 2013-09-05 2017-06-21 株式会社ジャパンディスプレイ 有機エレクトロルミネセンス表示装置
CN112640579B (zh) * 2018-09-07 2024-05-14 夏普株式会社 显示设备
WO2020065967A1 (ja) * 2018-09-28 2020-04-02 シャープ株式会社 表示デバイスの製造方法、表示デバイスの製造装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0731927A (ja) * 1993-07-23 1995-02-03 Canon Inc 接着剤塗布方法
JP3328048B2 (ja) * 1994-02-25 2002-09-24 富士写真フイルム株式会社 液体の混合方法
JPH07260797A (ja) * 1994-03-16 1995-10-13 Sanyo Electric Co Ltd 分注装置
JPH07299403A (ja) * 1994-05-02 1995-11-14 Canon Inc 塗布装置およびこれを用いて製造された画像形成装置
JPH10223138A (ja) * 1996-12-04 1998-08-21 Dainippon Printing Co Ltd 蛍光体充填装置
JP3580092B2 (ja) * 1997-08-21 2004-10-20 セイコーエプソン株式会社 アクティブマトリクス型表示装置
JP3861400B2 (ja) * 1997-09-01 2006-12-20 セイコーエプソン株式会社 電界発光素子およびその製造方法

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JP2001291588A (ja) 2001-10-19

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