JP4779866B2 - Method for manufacturing antireflection structure - Google Patents

Method for manufacturing antireflection structure Download PDF

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JP4779866B2
JP4779866B2 JP2006216862A JP2006216862A JP4779866B2 JP 4779866 B2 JP4779866 B2 JP 4779866B2 JP 2006216862 A JP2006216862 A JP 2006216862A JP 2006216862 A JP2006216862 A JP 2006216862A JP 4779866 B2 JP4779866 B2 JP 4779866B2
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antireflection structure
molding
mold
press
antireflection
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梅谷　　誠
隆正 田村
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description

本発明は、大面積に亘って、パターンずれの発生しない、高精度な反射防止構造を有する反射防止構造体を製造する方法に関する。   The present invention relates to a method of manufacturing an antireflection structure having a high-precision antireflection structure that does not cause pattern deviation over a large area.

近年、光学素子の表面反射を防止するために、光学素子の表面に反射防止構造を形成する方法が提案されている。提案されている反射防止構造は、サブミクロンピッチでアスペクト比が１以上の非常に微細な凹凸形状を有している。そして、このような微細な構造を形成する方法として、ドライエッチングを用いた微細加工法が提案されている。   In recent years, a method for forming an antireflection structure on the surface of an optical element has been proposed in order to prevent surface reflection of the optical element. The proposed antireflection structure has a very fine concavo-convex shape with a submicron pitch and an aspect ratio of 1 or more. As a method for forming such a fine structure, a fine processing method using dry etching has been proposed.

一方、高精度な光学素子を、大量かつ安価に製造する有効な方法として、ガラスあるいは樹脂からなる光学材料（成形用素材）をプレス成形する方法が提案されている。   On the other hand, as an effective method for manufacturing a high-precision optical element in a large amount and at a low cost, a method of press molding an optical material (molding material) made of glass or resin has been proposed.

加熱軟化したガラスあるいは樹脂からなる光学材料を、金型を用いてプレス成形する場合には、光学材料が金型から離型し難いため、金型の表面に特殊な離型膜を形成したり、成形ショットごとに離型剤を塗布したりして、離型が容易となるように工夫されている。特に、ガラスを光学材料として用いる場合には、金型の表面にかなり特殊なコーティングが施される。例えば、特許文献１には、炭化タングステン（ＷＣ）を主成分とする超硬合金又はサーメットを金型材料として用い、当該金型材料を用いて作製した金型の表面に貴金属系保護膜をコーティングしたものが開示されている。そして、かかる構成の金型を用いることにより、プレス成形による光学素子の量産を可能とすることができる。また、特許文献２に記載の金型においては、窒化ホウ素、窒化クロム、炭化クロム、酸化クロム、炭化珪素、炭素、白金あるいは超硬合金からなる金型本体の光学機能面に１０ｎｍ以下の膜厚を有する炭素膜を形成することにより、ガラスとの離型性が良好となるようにされている。   When an optical material made of heat-softened glass or resin is press-molded using a mold, the optical material is difficult to release from the mold, so a special release film may be formed on the surface of the mold. A mold release agent is applied for each molding shot, so that the mold release is facilitated. In particular, when glass is used as the optical material, a very special coating is applied to the surface of the mold. For example, in Patent Document 1, a cemented carbide or cermet containing tungsten carbide (WC) as a main component is used as a mold material, and a noble metal protective film is coated on the surface of a mold manufactured using the mold material. Has been disclosed. By using the mold having such a configuration, it is possible to mass-produce optical elements by press molding. Moreover, in the metal mold | die of patent document 2, the film thickness of 10 nm or less is provided on the optical function surface of the metal mold body made of boron nitride, chromium nitride, chromium carbide, chromium oxide, silicon carbide, carbon, platinum or cemented carbide. By forming a carbon film having the above, release properties from glass are improved.

したがって、たとえば、特許文献１の方法において、ＷＣを主成分とする超硬合金又はサーメットを金型材料にサブミクロンピッチでアスペクト比が１以上の非常に微細な凹凸形状をドライエッチング法により形成し、貴金属系保護膜をコーティングした金型を用いて、加熱軟化したガラスあるいは樹脂からなる光学材料をプレス成形すると反射防止構造体を大量生産できる可能性があると想像できる。   Therefore, for example, in the method of Patent Document 1, a very fine uneven shape having a submicron pitch and an aspect ratio of 1 or more is formed by dry etching on a die material of a cemented carbide or cermet mainly composed of WC. It can be imagined that there is a possibility that an antireflection structure can be mass-produced by press-molding an optical material made of heat-softened glass or resin using a mold coated with a noble metal protective film.

また、特許文献２の方法で、窒化ホウ素、窒化クロム、炭化クロム、酸化クロム、炭化珪素、炭素、白金あるいは超硬合金からなる金型本体にサブミクロンピッチでアスペクト比が１以上の非常に微細な凹凸形状をドライエッチング法により形成し、１０ｎｍ以下の膜厚を有する炭素膜を形成した金型を用いて、加熱軟化したガラスあるいは樹脂からなる光学材料をプレス成形すると反射防止構造体を大量生産できる可能性があると想像できる。
特公昭６２−２８０９１号公報 特開平６−３０５７４２号公報 In addition, the method of Patent Document 2 is applied to a die body made of boron nitride, chromium nitride, chromium carbide, chromium oxide, silicon carbide, carbon, platinum or cemented carbide, and has a very fine aspect ratio of 1 or more at a submicron pitch. Mass production of anti-reflective structures by press-molding an optical material made of heat-softened glass or resin using a mold formed with a dry concavo-convex shape and a carbon film with a film thickness of 10 nm or less I can imagine that there is a possibility.
Japanese Examined Patent Publication No. 62-28091 JP-A-6-305742

しかし、ＷＣを主成分とする超硬合金又はサーメットを金型材料にサブミクロンピッチでアスペクト比が１以上の非常に微細な凹凸形状をドライエッチング法により形成し、貴金属系保護膜をコーティングした金型を用いて、加熱軟化したガラスあるいは樹脂からなる光学材料をプレス成形すると、加熱軟化した光学材料を金型と接触させた状態（プレスした状態）で冷却しないと金型と光学材料が離型しないので、金型と光学材料との熱膨張率の差に起因して熱応力が発生し、その結果、光学材料に転写されるパターンの精度が低下してしまう。時にはガラスが破損し、金型表面に残ってしまうことがある。特に、金型の中心から外周に向けて距離が長くなるほど、光学材料に転写されるパターンのずれが大きくなるため、大面積に亘って、微細な凹凸パターンを正確に転写することはできない。このため、冷却せずに金型をプレス成形した光学材料から離型させる必要がある。   However, a WC-based cemented carbide or cermet is used as a mold material and a very fine irregular shape with a submicron pitch and an aspect ratio of 1 or more is formed by a dry etching method and coated with a noble metal protective film. When an optical material made of heat-softened glass or resin is press-molded using a mold, the mold and the optical material are released unless the heat-softened optical material is in contact with the mold (pressed state) and cooled. Therefore, thermal stress is generated due to the difference in thermal expansion coefficient between the mold and the optical material, and as a result, the accuracy of the pattern transferred to the optical material is lowered. Sometimes the glass breaks and remains on the mold surface. In particular, as the distance from the center of the mold increases toward the outer periphery, the shift of the pattern transferred to the optical material increases, so that a fine uneven pattern cannot be accurately transferred over a large area. For this reason, it is necessary to release the mold from the optical material obtained by press molding without cooling.

また、窒化ホウ素、窒化クロム、炭化クロム、酸化クロム、炭化珪素、炭素、白金あるいは超硬合金からなる金型本体にサブミクロンピッチでアスペクト比が１以上の非常に微細な凹凸形状をドライエッチング法により形成し、１０ｎｍ以下の膜厚を有する炭素膜を形成した金型を用いて、加熱軟化したガラスあるいは樹脂からなる光学材料をプレス成形すると、冷却せずに離型させることはできるが、炭素膜は酸化し易く、繰り返し成形を行うと次第に冷却しなければ離型できなくなる。したがって、結果的に大量生産は困難となる。   Also, dry etching is used to form very fine irregularities with a submicron pitch and aspect ratio of 1 or more on a die body made of boron nitride, chromium nitride, chromium carbide, chromium oxide, silicon carbide, carbon, platinum or cemented carbide. When an optical material made of heat-softened glass or resin is press-molded using a mold in which a carbon film having a film thickness of 10 nm or less is formed, the mold can be released without cooling. The film is easy to oxidize, and if it is repeatedly formed, it cannot be released unless it is gradually cooled. Therefore, as a result, mass production becomes difficult.

本発明は、従来技術における前記課題を解決するためになされたものであり、大面積に亘って、パターンずれの発生しない、高精度な反射防止構造を有する反射防止構造体を繰り返し成形することが可能な製造方法を提供することを目的とする。   The present invention has been made in order to solve the above-described problems in the prior art, and it is possible to repeatedly form an antireflection structure having a high-precision antireflection structure that does not cause pattern displacement over a large area. The object is to provide a possible manufacturing method.

上記の目標を達成するために、本発明の反射防止構造体の製造方法は、反射防止構造体
成形用金型でガラス材料からなる被成形物をプレス成形するプレス成形工程を有する、サブミクロンピッチの微細構造からなる反射防止構造体の製造方法であって、前記反射防止構造体成形用金型が、そのプレス面に主たる結晶構造が六方晶構造からなる窒化硼素（ＢＮ）を主成分とする保護膜を形成した反射防止構造を有し、前記被成形物が、Ａｕ、Ｐｔ、Ｃｕ、Ａｇ、Ｎｉ、Ｃｒ、Ａｌの元素のうち、１種類以上を主成分とする薄膜からなる離型膜を有するものである。 In order to achieve the above-mentioned goal, the manufacturing method of the antireflection structure of the present invention has a submicron pitch having a press molding step of press molding a molding made of a glass material with an antireflection structure molding die. A method for manufacturing an antireflection structure having a fine structure as described above, wherein the antireflection structure molding mold has boron nitride (BN) whose main crystal structure is a hexagonal crystal structure as a main component on a press surface thereof. A release film having an antireflection structure having a protective film, wherein the molding is a thin film mainly composed of one or more of the elements Au, Pt, Cu, Ag, Ni, Cr, and Al. It is what has .

また、本発明の反射防止構造体の製造方法は、前記プレス成形工程の後、冷却せずに離型させる冷却工程を有するものである。   Moreover, the manufacturing method of the antireflection structure of the present invention includes a cooling step of releasing the mold without cooling after the press molding step.

また、本発明の反射防止構造体の製造方法は、Ａｕ、Ｐｔ、Ｃｕ、Ａｇ、Ｎｉ、Ｃｒ、Ａｌの元素のうち、１種類以上を主成分とする薄膜からなる離型膜が、スパッタリング、蒸着、ＣＶＤ或いはイオンプレーティングなどの手法により形成されるものである。


Moreover, the manufacturing method of the antireflection structure of the present invention is such that a release film composed of a thin film mainly composed of one or more elements selected from Au, Pt, Cu, Ag, Ni, Cr, and Al is formed by sputtering, depositing a shall be formed by a method such as CVD or ion plating.


上記方法により、高温での離型が可能となる。   By the above method, release at a high temperature is possible.

本発明の反射防止構造体の製造方法を用いることにより、ＢＮと金属の離型性は非常に良く、金属は塑性変形を起こして金型形状を忠実に転写するため、加熱軟化したガラスあるいは樹脂からなる光学材料をプレス成形すると、冷却しなくても離型させることができ、繰り返し成形してもガラス付着などが発生せず、大面積に亘って、パターンずれのない、高精度な反射防止構造を有する反射防止構造体を大量に安定して低コストで製造できるようになる。   By using the method for producing an antireflection structure of the present invention, the release property between BN and metal is very good, and the metal undergoes plastic deformation to faithfully transfer the mold shape. When an optical material made of is press-molded, it can be released without cooling, and even if it is repeatedly molded, glass adhesion does not occur, and there is no pattern displacement over a large area, and high-precision antireflection A large number of antireflection structures having a structure can be stably manufactured at low cost.

また、ＢＮ保護膜が耐酸化性に優れていることから、繰り返し成形を行っても離型性にまったく変化はなく、大量生産が可能となる。   In addition, since the BN protective film is excellent in oxidation resistance, the releasability is not changed at all even if it is repeatedly molded, and mass production becomes possible.

以下、本発明を実施するための最良の形態について、図面を参照しながら説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

（実施の形態１）
本実施の形態においては、本発明の反射防止構造を有する反射防止構造体の製造方法として、片面にピッチ０．１５μｍ、深さ０．１５μｍの円錐型の微細構造を有する平板光学素子の製造方法を例に挙げて説明する。 (Embodiment 1)
In the present embodiment, as a method of manufacturing an antireflection structure having an antireflection structure of the present invention, a method of manufacturing a flat optical element having a conical microstructure with a pitch of 0.15 μm and a depth of 0.15 μm on one side Will be described as an example.

図１は本発明の実施の形態１における反射防止構造を有する反射防止構造体のプレス成形用金型を示す断面図である。   FIG. 1 is a cross-sectional view showing a press-molding die of an antireflection structure having an antireflection structure according to Embodiment 1 of the present invention.

図１中、１は２０ｍｍ×２０ｍｍ×５ｍｍの石英ガラス基板である。石英ガラス基板１の表面（プレス面）には、ピッチ０．１５μｍ、高さ０．１５μｍの円錐型の反射防止構造２が形成されており、この反射防止構造２が形成された石英ガラス基板１が反射防止構造体の成形用金型３として用いられる。   In FIG. 1, 1 is a quartz glass substrate of 20 mm × 20 mm × 5 mm. A conical antireflection structure 2 having a pitch of 0.15 μm and a height of 0.15 μm is formed on the surface (press surface) of the quartz glass substrate 1, and the quartz glass substrate 1 on which the antireflection structure 2 is formed. Is used as the molding die 3 for the antireflection structure.

以下、反射防止構造体の成形用金型３の作製方法について、図２を参照しながら説明する。図２(a)に示すように、まず、石英ガラス基板１の表面（プレス面）を、高精密研削加工及び研磨加工によって平滑に加工した（Ｒａ約２ｎｍ）。次いで、図２(b)に示すように、平滑に加工された石英ガラス基板１の表面（プレス面）に、スパッタリング法を用いて、Ｃｒ膜２０を０．１μｍの厚みで形成した。次いで、図２(c)に示すように、Ｃｒ膜２０の表面に、スピンコート法を用いて、ＰＭＭＡレジスト２１を０．３μｍの厚みで形成した。次いで、図２(d)に示すように、ＥＢ（電子ビーム）描画法を用いて、Ｃｒ膜２０の表面に、ＰＭＭＡレジストからなる直径０．１５μｍの円柱パターン２２をピッチ０．１５μｍで形成した。次いで、図２(e)に示すように、Ｃｒ膜２０をウェットエッチングすることにより、石英ガラス基板１の表面（プレス面）に、反射防止構造２に対応するＣｒからなる円柱パターンをマスクとして形成した（Ｃｒマスク２３）。このＣｒマスク２３は、使用波長以下のピッチでアレイ状に形成されている。次いで、図２(f)に示すように、円柱状のＣｒマスク２３が形成された石英ガラス基板１を、ＲＦドライエッチング装置の中に入れ、ＣＨＦ3 ＋Ｏ2 ガスを用いて、石英ガラス基板１の表面をエッチングした。これにより、石英ガラス基板１と共にＣｒマスク２３も僅かずつエッチングされ、幅が小さくなる。そして、Ｃｒマスク２３が完全に無くなるまでエッチングすることにより、石英ガラス基板１の表面（プレス面）に、ピッチ０．１５μｍ、高さ０．１５μｍの円錐型の反射防止構造２が形成された。エッチング後の表面荒れは少なく、研磨面とほぼ等しい表面粗さであった。最後に、円錐型の反射防止構造２が形成された石英ガラス基板１の表面（プレス面）に、スパッタリング法を用いて、表面保護のためのＩｒ−Ｒｈ合金膜を０．０５μｍの厚みで形成した。そして、さらにその表面にスパッタリング法を用いて、高温離型のための保護膜として、主たる結晶構造が六方晶構造からなるＢＮ膜を０．０５μｍの厚みで形成した。以上により、反射防止構造体の成形用金型３が得られた。 Hereinafter, a method for producing the mold 3 for forming the antireflection structure will be described with reference to FIG. As shown in FIG. 2A, first, the surface (press surface) of the quartz glass substrate 1 was processed smoothly (Ra about 2 nm) by high precision grinding and polishing. Next, as shown in FIG. 2B, a Cr film 20 having a thickness of 0.1 μm was formed on the surface (pressed surface) of the quartz glass substrate 1 processed smoothly using a sputtering method. Next, as shown in FIG. 2C, a PMMA resist 21 having a thickness of 0.3 μm was formed on the surface of the Cr film 20 by spin coating. Next, as shown in FIG. 2D, a cylindrical pattern 22 made of PMMA resist and having a diameter of 0.15 μm was formed at a pitch of 0.15 μm on the surface of the Cr film 20 by using an EB (electron beam) drawing method. . Next, as shown in FIG. 2 (e), the Cr film 20 is wet etched to form a cylindrical pattern made of Cr corresponding to the antireflection structure 2 on the surface (press surface) of the quartz glass substrate 1 as a mask. (Cr mask 23). The Cr mask 23 is formed in an array with a pitch equal to or less than the operating wavelength. Next, as shown in FIG. 2 (f), the quartz glass substrate 1 on which the cylindrical Cr mask 23 is formed is placed in an RF dry etching apparatus, and the quartz glass substrate 1 is used by using CHF 3 + O 2 gas. The surface of was etched. Thereby, the Cr mask 23 is also etched little by little together with the quartz glass substrate 1, and the width is reduced. Then, the conical antireflection structure 2 having a pitch of 0.15 μm and a height of 0.15 μm was formed on the surface (press surface) of the quartz glass substrate 1 by etching until the Cr mask 23 was completely eliminated. The surface roughness after etching was small, and the surface roughness was almost equal to the polished surface. Finally, an Ir—Rh alloy film for surface protection is formed to a thickness of 0.05 μm on the surface (press surface) of the quartz glass substrate 1 on which the conical antireflection structure 2 is formed by using a sputtering method. did. Further, a BN film having a main crystal structure of a hexagonal crystal structure with a thickness of 0.05 μm was formed as a protective film for high-temperature release using a sputtering method on the surface. Thus, the molding die 3 for the antireflection structure was obtained.

下金型４は、以下のような構造を有している。すなわち、図１に示すように、２０ｍｍ×２０ｍｍ×５ｍｍのＷＣを主成分とする超硬合金の中央部分に、１５ｍｍ×１５ｍｍ×０．５ｍｍの窪み４ａが形成され、窪み４ａが形成された表面には、スパッタリング法を用いて、表面保護のためのＩｒ−Ｒｈ合金膜が０．５μｍの厚みで形成されている。   The lower mold 4 has the following structure. That is, as shown in FIG. 1, a surface in which a recess 4 a of 15 mm × 15 mm × 0.5 mm is formed in a central portion of a cemented carbide mainly composed of 20 mm × 20 mm × 5 mm WC, and the recess 4 a is formed. In this case, an Ir—Rh alloy film for surface protection is formed with a thickness of 0.5 μm by sputtering.

以下、上記のような構成を有する反射防止構造体の成形用金型３と下金型４を用いて、反射防止構造を有する反射防止構造体を製造する方法について、図３、図４を参照しながら説明する。図３は本発明の実施の形態１における反射防止構造を有する反射防止構造体の成形プロセスを示す工程図、図４は本発明の実施の形態１における反射防止構造を有する反射防止構造体のプレス成形方法を示す工程図である。   Hereinafter, referring to FIG. 3 and FIG. 4 for a method of manufacturing an antireflection structure having an antireflection structure using the molding die 3 and the lower die 4 of the antireflection structure having the above-described configuration. While explaining. FIG. 3 is a process diagram illustrating a molding process of the antireflection structure having the antireflection structure according to Embodiment 1 of the present invention, and FIG. 4 is a press of the antireflection structure having the antireflection structure according to Embodiment 1 of the present invention. It is process drawing which shows a shaping | molding method.

図３(a)に示すように、まず、チャンバー１５で覆われた成形機の上ヘッド５に、上記した反射防止構造体の成形用金型３を上型６として固定し、当該上型６をプレスステージ８と共に所定の温度（ここでは、５９０℃）まで昇温した。また、予熱ステージ７も５９０℃まで昇温した。そして、上記した下金型４を下型１０として用い、１５ｍｍ×１５ｍｍ×１．０ｍｍのクラウン系の硼珪酸ガラス（転移点（Ｔｇ）：５０１℃、屈伏点（Ａｔ）：５４９℃）にスパッタリング法を用いて、高温離型のためのＮｉ膜１６が０．1μｍの厚みで形成されている成形用材料１１として下型１０の上に載せ、成形用材料１１が載せられた下型１０を、チャンバー１５の金型投入口１２から成形機内に投入して、５９０℃に設定された予熱ステージ７で３分間加熱した。（図４(a)参照）。   As shown in FIG. 3 (a), first, the molding die 3 for the antireflection structure is fixed as an upper die 6 to the upper head 5 of the molding machine covered with the chamber 15, and the upper die 6 is fixed. The temperature was raised to a predetermined temperature (here, 590 ° C.) together with the press stage 8. The preheating stage 7 was also heated to 590 ° C. Then, using the lower die 4 as the lower die 10, sputtering is performed on a 15 mm × 15 mm × 1.0 mm crown borosilicate glass (transition point (Tg): 501 ° C., yield point (At): 549 ° C.). The Ni film 16 for high-temperature mold release is placed on the lower mold 10 as a molding material 11 formed with a thickness of 0.1 μm using the method, and the lower mold 10 on which the molding material 11 is placed is mounted. Then, it was introduced into the molding machine from the mold inlet 12 of the chamber 15 and heated on the preheating stage 7 set at 590 ° C. for 3 minutes. (See FIG. 4 (a)).

次に、図３(b)に示すように、成形用材料１１が載せられた下型１０を、予熱ステージ７から同じく５９０℃に設定されたプレスステージ８に搬送した。次いで、シリンダー１３を下降させて、同じく５９０℃に設定され、かつ、上ヘッド５に固定された上型６により、成形用材料１１を１０００Ｎの加圧力で３分間プレスした（図４(a)、(b)参照）。そして、冷却せずに（そのままの温度で）シリンダー１３を上昇させることにより、上ヘッド５と共に上型６を上昇させて、上型６を、プレス成形した成形用材料１１から離型させた（図４(b)、(c)参照）。ここで、冷却せずに（高温のままで）、上型６を、プレス成形した成形用材料１１から離型させることができるのは、成形用材料１１の表面に形成したＮｉと反射防止構造体の成形用金型３に形成しているＢＮとのぬれ性が悪いからである。上型６がプレス成形された成形用材料１１から離型すると、プレス成形された成形用材料１１は下型１０の上に載った状態となる。   Next, as shown in FIG. 3 (b), the lower mold 10 on which the molding material 11 was placed was conveyed from the preheating stage 7 to the press stage 8 which was also set to 590 ° C. Next, the cylinder 13 was lowered, and the molding material 11 was pressed for 3 minutes with a pressure of 1000 N by the upper die 6 that was also set to 590 ° C. and fixed to the upper head 5 (FIG. 4A). (See (b)). Then, by raising the cylinder 13 without cooling (at the same temperature), the upper die 6 is raised together with the upper head 5, and the upper die 6 is released from the press-molded molding material 11 ( (See FIGS. 4B and 4C). Here, the Ni and the antireflection structure formed on the surface of the molding material 11 can be released from the molding material 11 that has been press-molded without cooling (while still at a high temperature). This is because the wettability with BN formed on the body molding die 3 is poor. When the upper mold 6 is released from the press-molded molding material 11, the press-molded molding material 11 is placed on the lower mold 10.

次に、図３(c)に示すように、プレス成形された成形用材料１１が載せられた下型１０を、プレスステージ８から３００℃に設定された冷却ステージ９に搬送し、そこで３分間冷却した。   Next, as shown in FIG. 3 (c), the lower mold 10 on which the press-molded molding material 11 is placed is conveyed from the press stage 8 to the cooling stage 9 set to 300 ° C., and there for 3 minutes. Cooled down.

最後に、チャンバー１５の金型取り出し口１４から下型１０と共にプレス成形された成形用材料１１を外部に取り出し、プレス成形された成形用材料１１を下型１０から取り外した後、希硝酸に浸漬してＮｉ膜１６を除去した。これにより、反射防止構造を有する反射防止構造体１７が得られた（図４(c)参照）。   Finally, the molding material 11 press-molded together with the lower mold 10 is taken out from the mold outlet 14 of the chamber 15, and the press-molded molding material 11 is removed from the lower mold 10 and then immersed in dilute nitric acid. Then, the Ni film 16 was removed. Thereby, an antireflection structure 17 having an antireflection structure was obtained (see FIG. 4C).

なお、図３中の１８は、チャンバー１５内に窒素ガス等の雰囲気ガスを導入するための雰囲気ガス導入口である。   3 is an atmospheric gas inlet for introducing atmospheric gas such as nitrogen gas into the chamber 15.

本実施の形態によれば、上記のように、冷却せずに上型６（反射防止構造体の成形用金型３）をプレス成形した成形用材料１１から離型させることが可能となるので、上型６とプレス成形される成形用材料１１との熱膨張率の差に起因する熱応力の発生を防止して、成形用材料１１に転写されるパターンの精度を高めることができる。その結果、大面積に亘って、パターンずれの発生しない、高精度な反射防止構造を有する反射防止構造体１７を、繰り返し成形することが可能となる。また、本実施の形態によれば、反射防止構造体の成形用金型３に形成したＢＮ膜は非常に耐酸化性にすぐれているので、繰り返し成形を行っても、離型性はまったく変化せず、反射防止構造を有する反射防止構造体１７を再現性良く成形することができる。その結果、量産性が飛躍的に向上するので、生産コストを著しく低下させることが可能となる。   According to the present embodiment, as described above, it is possible to release the upper mold 6 (molding mold 3 for the antireflection structure) from the molding material 11 that has been press-molded without cooling. The occurrence of thermal stress due to the difference in thermal expansion coefficient between the upper die 6 and the molding material 11 to be press-molded can be prevented, and the accuracy of the pattern transferred to the molding material 11 can be increased. As a result, it is possible to repeatedly form the antireflection structure 17 having a highly accurate antireflection structure that does not cause pattern deviation over a large area. In addition, according to the present embodiment, the BN film formed on the molding die 3 of the antireflection structure is very excellent in oxidation resistance, so that the releasability is completely changed even after repeated molding. The antireflection structure 17 having the antireflection structure can be molded with good reproducibility. As a result, mass productivity is dramatically improved, and production costs can be significantly reduced.

なお、本実施の形態では、成形用材料１１として、ガラス材料にスパッタリング法を用いてＮｉの離型膜を形成する説明を行ったが、スパッタリングの他に蒸着、ＣＶＤ、イオンプレーティング等の手法を用いてもよいし、また、Ｎｉ膜の他に、Ａｕ、Ｐｔ、Ｃｕ、Ａｇ、Ｃｒ、Ａｌ等の低融点金属を主成分とする薄膜であってもよい。   In the present embodiment, as the molding material 11, a description has been given of forming a Ni release film using a sputtering method on a glass material. However, in addition to sputtering, methods such as vapor deposition, CVD, and ion plating are used. In addition to the Ni film, a thin film mainly composed of a low melting point metal such as Au, Pt, Cu, Ag, Cr, or Al may be used.

本発明は、反射防止効果が要求されるレンズ素子、プリズム素子、ミラー素子などの光学素子のほかに、スクリーン、レンズ鏡筒、遮蔽部材、蛍光灯などの光学部材、及び太陽電池など広く適用可能であり、これらが光学素子あるいは光学部材が搭載される光再生記録装置の光ピックアップ光学系、デジタルスチルカメラの撮影光学形、プロジェクタの投影系および照明系、光走査光学系等に好適である。   The present invention is widely applicable to optical elements such as screens, lens barrels, shielding members, fluorescent lamps, and solar cells in addition to optical elements such as lens elements, prism elements, and mirror elements that require antireflection effects. These are suitable for an optical pickup optical system of an optical reproducing / recording apparatus on which an optical element or optical member is mounted, a photographing optical type of a digital still camera, a projection system and an illumination system of a projector, an optical scanning optical system, and the like.

本発明の実施の形態１における反射防止構造を有する反射防止構造体のプレス成形用金型を示す断面図Sectional drawing which shows the metal mold | die for press molding of the antireflection structure which has an antireflection structure in Embodiment 1 of this invention. 本発明の実施の形態１における反射防止構造体の成形用金型の作製プロセスを示す工程図Process drawing which shows the manufacturing process of the metal mold | die for the antireflection structural body in Embodiment 1 of this invention 本発明の実施の形態１における反射防止構造を有する反射防止構造体の成形プロセスを示す工程図Process drawing which shows the shaping | molding process of the reflection preventing structure which has the reflection preventing structure in Embodiment 1 of this invention 本発明の実施の形態１における反射防止構造を有する反射防止構造体のプレス成形方法を示す工程図Process drawing which shows the press molding method of the antireflection structure which has the antireflection structure in Embodiment 1 of this invention

符号の説明Explanation of symbols

１ 石英ガラス基板
２ 反射防止構造
３ 反射防止構造体の成形用金型
４ 下金型
４ａ 窪み
５ 上ヘッド
６ 上型
７ 予熱ステージ
８ プレスステージ
９ 冷却ステージ
１０ 下型
１１ 成形用材料
１２ 金型投入口
１３ シリンダー
１４ 金型取り出し口
１５ チャンバー
１６ Ｎｉ膜
１７ 反射防止構造を有する反射防止構造体
１８ 雰囲気ガス導入口
２０ Ｃｒ膜
２１ ＰＭＭＡレジスト
２２ 円柱パターン
２３ Ｃｒマスク DESCRIPTION OF SYMBOLS 1 Quartz glass substrate 2 Antireflection structure 3 Mold for shaping | molding of antireflection structure 4 Lower mold 4a Depression 5 Upper head 6 Upper mold 7 Preheating stage 8 Press stage 9 Cooling stage 10 Lower mold 11 Molding material 12 Mold input Mouth 13 Cylinder 14 Mold outlet 15 Chamber 16 Ni film 17 Antireflection structure body having antireflection structure 18 Atmospheric gas inlet 20 Cr film 21 PMMA resist 22 Cylindrical pattern 23 Cr mask

Claims (3)

反射防止構造体成形用金型でガラス材料からなる被成形物をプレス成形するプレス成形工程を有する、サブミクロンピッチの微細構造からなる反射防止構造体の製造方法であって、
前記反射防止構造体成形用金型が、そのプレス面に主たる結晶構造が六方晶構造からなる窒化硼素（ＢＮ）を主成分とする保護膜が形成された反射防止構造を有し、
前記被成形物が、Ａｕ、Ｐｔ、Ｃｕ、Ａｇ、Ｎｉ、Ｃｒ、Ａｌの元素のうち、１種類以上を主成分とする薄膜からなる離型膜を有することを特徴とする反射防止構造体の製造方法。 A method for producing an antireflection structure having a submicron pitch microstructure, comprising a press molding step of press molding a molding material made of a glass material with an antireflection structure molding die,
The antireflection structure molding die has an antireflection structure in which a protective film mainly composed of boron nitride (BN) whose main crystal structure is a hexagonal crystal structure is formed on the press surface;
An antireflective structure characterized in that the molding has a release film composed of a thin film mainly composed of one or more of the elements Au, Pt, Cu, Ag, Ni, Cr, and Al . Production method. 前記プレス成形工程の後、冷却せずに離型させる冷却工程を有することを特徴とする請求項１記載の反射防止構造体の製造方法。 The method for producing an antireflection structure according to claim 1, further comprising a cooling step of releasing the mold without cooling after the press forming step. 前記Ａｕ、Ｐｔ、Ｃｕ、Ａｇ、Ｎｉ、Ｃｒ、Ａｌの元素のうち、１種類以上を主成分とする薄膜からなる離型膜が、スパッタリング、蒸着、ＣＶＤ或いはイオンプレーティングなどの手法により形成されることを特徴とする請求項１記載の反射防止構造体の製造方法。 A release film composed of a thin film mainly composed of one or more of the elements of Au, Pt, Cu, Ag, Ni, Cr, and Al is formed by a technique such as sputtering, vapor deposition, CVD, or ion plating. method of manufacturing the anti-reflection structure according to claim 1, wherein the that.
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