JP4763652B2 - Inspection condition determination method - Google Patents

Description

  The present invention is a method for determining inspection conditions in an appearance inspection machine that inspects the mounting state of components on a substrate and the printed state of solder using a plurality of cameras having different resolutions at the time of photographing. The present invention relates to a method of determining a moving path of a camera and a camera to be used.

  Appearance inspection machine is a device that inspects the mounting position and mounting state of components and the printed state of solder by photographing the components mounted on the board by the component mounting machine and processing the obtained images. It is.

  In appearance inspection, it is necessary to photograph parts accurately, but parts with small sizes and parts with small lead (electrode) spacing are increasing, and such parts need to be photographed with high resolution. It becomes. However, if high-resolution shooting is to be performed with a normal camera, zoom shooting is required. For this reason, the imaging region is narrowed. On the other hand, parts with a large size can be inspected even when photographing with a wide photographing area and low resolution.

  Therefore, by changing the field of view of the camera, it is necessary to shoot the parts while changing the resolution at the time of shooting, and to perform an appearance inspection. Alternatively, it is necessary to perform an appearance inspection while changing the resolution (field of view) at the time of shooting by switching the cameras using a plurality of cameras having different resolutions at the time of shooting.

On the other hand, in order to shorten the time required for the appearance inspection, it is important to appropriately select the moving path of the camera (see, for example, Patent Document 1).
JP 2006-308349 A

  However, although Patent Document 1 proposes a method for searching for a moving path of a camera, it is not premised on switching the resolution at the time of camera shooting.

  For this reason, there is a problem that the resolution switching timing and the moving path of the camera cannot be optimized in the appearance inspection machine that shoots a part while changing the resolution at the time of shooting of the camera.

  The present invention has been made to solve the above-described problems, and in an appearance inspection machine that captures a part while changing the resolution (field of view) at the time of capturing by the camera, the resolution switching timing and the moving path of the camera It aims to optimize.

  In order to achieve the above object, an inspection condition determining method according to the present invention is a method for determining an inspection condition in an appearance inspection machine for photographing a component on a board with a plurality of resolutions and inspecting a mounting state of the component. In this method, the resolution required at the time of photographing the component is determined in advance, and at least one photographing region is determined so as to include the component to be photographed at the resolution for each of the plurality of resolutions. An area determining step, and a path determining step for determining a shortest path for going around the imaging area determined in the imaging area determining step.

  According to this method, the shooting area is determined for each resolution in the shooting area determination step, and the shortest route for going through all the shooting areas is obtained in the path determination step. For this reason, the camera can be moved in the shortest movement time while appropriately switching the resolution at the time of shooting. Therefore, it is possible to optimize the switching timing of the resolution at the time of shooting and the moving path of the camera.

  Preferably, in the above-described inspection condition determination method, for each of the imaging regions determined in the imaging region determination step, all components included in the imaging region are higher in resolution than the imaging resolution in the imaging region. Including the integration step of integrating the imaging region into the other imaging region by deleting the imaging region, and the route determination step includes the integration. The shortest route for traversing the imaging area after being integrated in the step is determined.

  Parts that can be photographed at a low resolution can be photographed even at a high resolution. For this reason, when a part capable of photographing at a low resolution is included in a photographing area at a high resolution, photographing at a high resolution can be performed. As a result, the same part is not photographed a plurality of times, and the number of photographing can be reduced.

  More preferably, in the above-described inspection condition determination method, for each of the imaging regions to be determined by the route determination step, the imaging region is maintained as much as possible while maintaining the parts included in the imaging region. A route determination preprocessing step for moving to the center of

  By bringing the imaging region as close to the center of the substrate as possible, the distance between the imaging regions can be shortened. Thereby, the camera can be moved in the shortest time.

  More preferably, in the above-described inspection condition determination method, for each of the imaging regions to be determined in the route determination step, the vertical direction of the adjacent imaging region is maintained while maintaining the components included in the imaging region. Alternatively, a route determination pre-processing step of moving the imaging region so that the horizontal positions are aligned as much as possible is included.

  By aligning the horizontal or vertical positions of the shooting areas as much as possible, the distance between the shooting areas can be shortened. Thereby, the camera can be moved in the shortest time. Also, when the operator moves the camera by operating the input device and checks the parts in the shooting area, the camera can be moved in a certain direction (vertical direction or It is only necessary to move in the horizontal direction. For this reason, an operator's operation load can be reduced.

  The present invention can be realized not only as an inspection condition determination method including such characteristic steps, but also as an inspection condition determination device using the characteristic steps included in the inspection condition determination method as a means. Or, it can be realized as a program that causes a computer to execute characteristic steps included in the inspection condition determination method. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  In an appearance inspection machine that takes a picture of a part while changing the resolution of the camera, the resolution switching timing and the moving path of the camera can be optimized.

Hereinafter, an appearance inspection machine according to an embodiment of the present invention will be described.
FIG. 1 is an external view of an appearance inspection machine according to an embodiment of the present invention.

  The appearance inspection machine 100 is an apparatus that inspects the mounting state of components and the printing state of solder by photographing a board with a camera. The substrate 20 is conveyed into the appearance inspection machine 100 from the left direction of the appearance inspection machine 100, and the appearance inspection of the substrate 20 is performed.

  The appearance inspection machine 100 is provided with a display unit 102 such as a CRT (Cathode-Ray Tube) or an LCD (Liquid Crystal Display), and the display unit 102 displays an inspection result or the like.

FIG. 2 is a diagram illustrating a configuration of a camera device that captures images of components on a board.
The camera device 104 is provided in the appearance inspection machine 100, and images parts on the board 20 by moving on the board 20 by an XY robot.

  The camera device 104 includes a base 110, a high resolution camera 106 and a low resolution camera 108 attached to the base 110, and a ring illumination 109 attached to the tips of the high resolution camera 106 and the low resolution camera 108.

  The high resolution camera 106 and the low resolution camera 108 are different in view size and resolution at the time of photographing (resolution of photographed image data). Assume that the high resolution camera 106 and the low resolution camera 108 are cameras having the same number of pixels. For this reason, the high resolution camera 106 has a narrower field of view than the low resolution camera 108, but has a high resolution. On the other hand, the low resolution camera 108 has a wider field of view than the high resolution camera 106, but has a lower resolution. As an example, the field size of the high resolution camera 106 is 25 mm × 16 mm, and the field size of the low resolution camera 108 is 50 mm × 32 mm. Note that the number of pixels of the high resolution camera 106 and the low resolution camera 108 may be different.

  FIG. 3 is a view of the camera device 104 as viewed from the right side. Below the low-resolution camera 108, a ring illumination 109 made up of LEDs (Light Emitting Diodes) arranged in a ring shape is provided. In a state where the ring illumination 109 is applied to the component 22 on the substrate 20, the low resolution camera 108 images the component 22. Note that the light amount of the ring illumination 109 can be switched. For this reason, imaging of the component 22 is performed while switching the light amount of the ring illumination 109 based on the member of the component 22 or the like.

FIG. 4 is a diagram illustrating an example of the board 20 on which components are mounted.
A plurality of chip parts, package parts such as QFP (Quad Flat Package), and the like are arranged on the substrate 20. The appearance inspection machine 100 inspects all the components 22 by imaging the components 22 in each imaging region 24 while moving the high resolution camera 106 and the low resolution camera 108.

  Note that there are cases where the part cannot be photographed well at the end of the photographing region 24. For this reason, as shown in FIG. 5, when the part 22 is photographed, the part 22 is photographed at least at a position where the part comes inside a predetermined width (for example, 2 mm) from the end of the photographing region 24.

  However, the size of the imaging region 24 is fixed. For this reason, even if a certain component 22 is stored in the imaging region 24, other components may protrude from the imaging region 24. Further, when the length of the component 22 is longer than one side of the imaging region 24, the component 22 protrudes from the imaging region 24 no matter how the imaging region 24 is set. In such a case, as shown in FIG. 6, the camera device 104 is moved so that the imaging region 24 is overlapped by a predetermined width (for example, 2 mm). Take a picture. The appearance inspection machine 100 can generate an image of the component 22 by integrating a plurality of captured images.

  In addition, there are parts that require shooting at a high resolution and parts that can be shot at a low resolution. At this time, only the high-resolution camera 106 is permitted for parts that require high-resolution shooting, but the low-resolution camera 108 for parts that can be shot at low resolution is not limited to high-resolution shooting. It is also assumed that photographing by the resolution camera 106 is permitted. For example, as shown in FIG. 7A, a component 22a that needs to be photographed at a high resolution and a component 22b that can be photographed at a low resolution are arranged on the substrate 20 side by side. To do. In such a case, as shown in FIG. 7B, the part 22a may be photographed with the camera of the high resolution camera 106, and the part 22b may be photographed with the low resolution camera 108. As shown in c), the parts 22 a and 22 b may be photographed by the high resolution camera 106. Note that the shooting area 24 a indicates a shooting area by the high-resolution camera 106, and the shooting area 24 b indicates a shooting area by the low-resolution camera 108.

FIG. 8 is a functional block diagram showing the configuration of the appearance inspection machine 100.
The appearance inspection machine 100 includes a mechanism unit 120, a mechanism control unit 111, a display unit 102, an input unit 103, a storage unit 114, a communication I / F (interface) unit 115, and an inspection condition determination unit 116. Prepare.

  The mechanism unit 120 is a set of mechanism parts including a transport path for transporting the substrate into the appearance inspection machine 100, the camera device 104, a motor and a controller for driving the camera device 104, and the like.

  The mechanism control unit 111 controls the mechanism unit 120 according to the inspection condition determined by the inspection condition determination unit 116. By this control, the mounting state of components on the substrate 20 and the printing state of solder are inspected. The mechanism control unit 111 corresponds to the inspection unit described in the claims.

  The display unit 102 is a CRT or LCD as described above. The input unit 103 is a keyboard, a mouse, or the like. These are used for a dialogue between the appearance inspection machine 100 and an operator.

  The storage unit 114 is a hard disk, a memory, or the like, and stores mounting data 114a and the like.

  As shown in FIG. 9, the mounting data 114a is data for storing, for each mounting point, the component type of the component to be mounted, the mounting point coordinates, the component size, and the image resolution required at the time of shooting. . For example, a component type A component is mounted at the first mounting point, the coordinates of the mounting point are (10, 20), and the component size (x size, y size) is (30, 45). It is shown that the resolution required when photographing the part is high. A part requiring high resolution is photographed by the high resolution camera 106, and a part capable of photographing at a low resolution is photographed by the high resolution camera 106 or the low resolution camera 108. The coordinates of the mounting point may be the center coordinates of the component, or the coordinates of the end of the component (for example, the upper left corner).

  The communication I / F unit 115 is a LAN (Local Area Network) adapter or the like, and is used for communication between the appearance inspection machine 100 and other devices.

  The inspection condition determination unit 116 is a processing unit that determines an inspection condition such as a moving path of the camera device 104 and a camera to be used during component inspection. The inspection condition determination unit 116 corresponds to an imaging region determination unit and a route determination unit described in the claims.

  FIG. 10 is a flowchart of processing executed by the inspection condition determination unit 116 of the appearance inspection machine 100. In the example described below, all parts have the same size, but the same processing is performed even when the parts have different sizes.

  The inspection condition determination unit 116 determines an imaging area when the component is imaged by the high resolution camera 106 (S2). When described using an example, as shown in FIG. 11A, a component (hereinafter referred to as “high-resolution component”) that requires high-resolution imaging (photographing by the high-resolution camera 106) on the substrate 20 is illustrated. And a component (hereinafter referred to as “low-resolution component”) capable of photographing at a low resolution (photographing by the low-resolution camera 108). In the figure, high resolution parts are represented by hatched squares, and low resolution parts are represented by non-hatched squares. The size of the shooting area 24c (24d) of the high resolution camera 106 is fixed in advance. The inspection condition determination unit 116 determines an arrangement position of the imaging region that includes as many high-resolution components as possible in the imaging region. At this time, as described above, a predetermined distance is provided from the end of the imaging region to the part. A method for determining the arrangement position of an imaging region including as many high-resolution components as possible can be formulated as a knapsack problem. The inspection condition determination unit 116 determines the arrangement position of the imaging region by solving the formulated knapsack problem. In the example of the figure, the imaging regions 24c and 24d are arranged. With this process, all high-resolution components are included in any of the imaging regions.

  Next, the inspection condition determination unit 116 determines an imaging area when the component is imaged by the low resolution camera 108 (S4). For example, as shown in FIG. 11B, the size of the shooting area 24e (24f, 24g) of the low resolution camera 108 is fixed in advance. The inspection condition determination unit 116 sets the imaging region at a position that includes as many low-resolution components as possible in the imaging region. Also in this case, a predetermined distance is provided from the end of the imaging region to the part. The method for determining the arrangement position of the imaging region including as many low-resolution parts as possible can be formulated as a knapsack problem as in the process of S2. The inspection condition determination unit 116 determines the arrangement position of the imaging region by solving the formulated knapsack problem. In the example of the figure, photographing areas 24e, 24f and 24g are arranged. By this processing, all the low resolution components are included in any one of the imaging regions.

  The inspection condition determination unit 116 integrates the imaging area whose arrangement is determined in the process of S2 and the imaging area whose arrangement is determined in the process of S4 (S6). That is, the inspection condition determination unit 116 determines whether or not a part that is a subject to be photographed by one photographing by the low resolution camera 108 is included in a part that is a subject to be photographed by one photographing by the high resolution camera 106. Are included, the shooting areas of the two cameras are integrated into the shooting area of the high-resolution camera 106. For example, the two parts included in the imaging region 24e shown in FIG. 11B are all included in the imaging region 24c shown in FIG. Therefore, the inspection condition determination unit 116 integrates the imaging region 24c and the imaging region 24e into the imaging region 24c as shown in FIG. Further, the four parts included in the imaging region 24f shown in FIG. 11B are all included in the imaging region 24d shown in FIG. Therefore, the inspection condition determination unit 116 integrates the imaging region 24d and the imaging region 24f into the imaging region 24d as illustrated in FIG. As a result of the integration, as shown in FIG. 11C, two imaging areas of the high resolution camera 106 and one imaging area of the low resolution camera 108 are determined. Thus, all parts mounted on the board 20 are photographed and inspected by two photographings by the high resolution camera 106 and one photographing by the low resolution camera 108. As shown in the figure, the component 22c included in both the imaging region 24c by the high-resolution camera 106 and the imaging region 24g by the low-resolution camera 108 is inspected using an image captured by the high-resolution camera 106. You may do it.

  Next, a process for determining a route for searching the imaging area is performed for the imaging area determined in the processes up to S6 (S8, S10).

  First, the inspection condition determination unit 116 performs preprocessing so that the distance between the searched routes is shortened (S8). Specifically, as shown in FIG. 12A, the inspection condition determination unit 116 moves each imaging region to a position as close as possible to the center in the Y-axis direction. Next, as shown in FIG. 12B, the inspection condition determination unit 116 moves each imaging region to a position as close as possible to the center in the X-axis direction. The parts 22d and 22e included in both the imaging region 24g of the low resolution camera 108 and the imaging region 24c of the high resolution camera 106 are imaged by the high resolution camera 106 in the imaging region 24c. For this reason, it is ignored when the imaging region 24g is moved. Therefore, there may be a case where the part protrudes from the imaging region 24g like the part 22d. By performing the above processing, all the imaging regions can be arranged at the center of the substrate 20 as much as possible. With this process, the distance between the imaging regions can be made as short as possible.

  Next, the inspection condition determination unit 116 determines a route for searching for a pre-processed imaging region (S10). Specifically, as shown in FIG. 13, the search path of the shooting area is obtained by sequentially selecting the shooting areas with the closest distance by the greedy method, starting from the shooting area in the upper left corner. Note that the coordinates of the imaging region are represented by the coordinates of the center position. Next, the inspection condition determination unit 116 obtains a search route having a shorter moving distance by applying the 2-OPT method of the traveling salesman problem to the search route of the imaging region determined by the greedy method.

  For example, when the final shooting area search path is obtained as shown in FIG. 13, the high-resolution camera 106 images the part at the position of the shooting area 24c, and then the low-resolution camera 108 captures the image. The inspection conditions are the field-of-view switching timing and the movement path of the camera device 104 in which the part is imaged at the position of the area 24g and finally the high-resolution camera 106 images the part at the position of the imaging area 24d.

  The appearance inspection machine 100 shoots a part while switching the camera in the determined imaging region while moving the camera device 104 along the determined route.

  According to the present embodiment, in appearance inspection machine 100 that captures parts while switching between high-resolution camera 106 and low-resolution camera 108, optimization is performed so that the movement path of high-resolution camera 106 and low-resolution camera 108 is shortened. Can be performed. For this reason, it is possible to inspect the mounting state of the components in a short time.

  Although the appearance inspection machine according to the embodiment of the present invention has been described above, the present invention is not limited to this embodiment.

  For example, in the above-described embodiment, in the pre-path determination process (S8 in FIG. 10), the imaging region is moved as much as possible to the center of the substrate 20, but the imaging is performed so that the X coordinate or Y coordinate of the imaging region matches as much as possible. The area may be moved. For example, when a plurality of shooting areas 24h are arranged as shown in FIG. 14A, the y coordinate is set to Y2 for the upper three shooting areas as shown in FIG. 14B. The lower three imaging regions may be moved so that the coordinates are Y1. As described above, by moving the imaging region so that the X coordinate or the Y coordinate matches as much as possible, the distance between the imaging regions can be shortened as compared with the case where the X coordinate or the Y coordinate does not match. Further, when the operator operates the input unit 103 to move the camera device 104 to check the parts in the imaging region, the camera device 104 is moved without complicated movement of moving the camera device 104 up, down, left, and right. Need only be moved in a certain direction (in the example of FIG. 14B, the x-axis direction when checking the parts in the upper and lower three imaging regions). For this reason, an operator's operation load can be reduced. In the example shown in FIG. 14, the size of all the shooting areas is the same. However, even when the shooting area by the high resolution camera 106 and the shooting area by the low resolution camera 108 are mixed, Similarly, the imaging region may be moved so that the X coordinate or the Y coordinate matches as much as possible.

  Further, the intensity of illumination at the time of photographing may be determined in advance for each part. In such a case, the high-resolution camera 106 and the low-resolution camera 108 photograph parts while changing the intensity of the ring illumination 109. Further, the moving path of the camera may be determined as follows. For example, it is assumed that parts are arranged as shown in FIG. Here, the number in the figure represents the illumination intensity, and it is assumed that there are two types of illumination intensity of level 1 or level 2. In such a case, an imaging region is determined for each level strength component. That is, as shown in FIG. 15B, first, paying attention to only the level 1 component, the processing of S2 to S6 shown in FIG. 10 is executed to determine the imaging region of the level 1 component. Next, as shown in FIG. 15C, paying attention only to the level 2 component, similarly, the processing of S2 to S6 shown in FIG. 10 is executed to determine the imaging region of the level 2 component. Next, the process of S8 and S10 in FIG. 10 is executed for all the determined level 1 and level 2 shooting areas, thereby determining a path for searching for the shooting area.

  FIG. 16 is a diagram illustrating an example of a search path for a part of the determined imaging region. In this example, the imaging region moves in the order of FIG. 16 (a) and FIG. 16 (b). That is, in the imaging region 24i shown in FIG. 16A, after the high-resolution camera 106 captures a part with level 1 illumination, the illumination is changed to level 2 at the same position, and the part is captured again. Next, the high-resolution camera 106 is moved to the imaging region 24k shown in FIG. 16B, and similarly, the high-resolution camera 106 shoots a part with level 1 and level 2 illumination. However, there is no need to capture the part 22i again after the part is imaged with level 1 illumination in the imaging region 24i shown in FIG. In such a case, the high-resolution camera 106 may be moved to the next imaging region 24k after the component imaging with level 1 illumination. That is, the shooting area may be moved as shown in FIG. In the imaging area 24i shown in FIG. 17A, after the high-resolution camera 106 takes an image of a part with level 1 illumination, the high-resolution camera 106 is moved to the imaging area 24j shown in FIG. Next, the high resolution camera 106 shoots the parts in the shooting area 24j with level 2 illumination. Thereafter, the high-resolution camera 106 is moved to the position of the imaging region 24k shown in FIG. 17C, and the high-resolution camera 106 images the parts in the imaging region 24k with the level 1 and level 2 illumination. Note that there is a part that needs to be photographed by switching illumination even if it is a single part. For example, as in an IC (Integrated Circuit) part, the body portion is black and the pin portion is made of metal. For such a part, a search path for an imaging region is obtained on the assumption that two types of parts, a level 1 illumination part and a level 2 illumination part, exist virtually at the same position on the substrate.

  In FIGS. 15 to 17, all components are high resolution components, but high resolution components and low resolution components may be mixed. In such a case, the camera is switched together with the illumination.

  In addition, components other than the mechanism unit 120 and the mechanism control unit 111 of the appearance inspection machine 100 described above can be realized using a computer. In this case, the storage unit 114 corresponds to a hard disk or memory of a computer, and the inspection condition determination unit 116 is realized by executing the processing program shown in FIG. 10 on the CPU.

  In the appearance inspection machine 100 described above, the case where the camera device 104 includes two cameras has been described. However, the camera apparatus 104 includes only one camera, and the zoom process allows the photographing of parts while changing the resolution at the time of photographing. It may be what you do.

  In the above-described embodiment, the inspection condition is determined in the appearance inspection machine 100. However, a computer connected to the appearance inspection machine 100 may determine the inspection condition. That is, the computer may function as an inspection condition determination device by executing a program for appearance inspection determination processing shown in FIG. 10 on the computer. The inspection conditions determined by the computer are downloaded to the appearance inspection machine 100, so that the appearance inspection machine 100 performs inspection based on the downloaded inspection conditions.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to an appearance inspection machine that inspects the mounting state of components and the printing state of solder.

It is an external view of the external appearance inspection machine which concerns on embodiment of this invention. It is a figure which shows the structure of the camera apparatus which image | photographs the components on a board | substrate. It is the figure which looked at the camera apparatus from the right side. It is a figure which shows an example of the board | substrate with which components were mounted. It is a figure for demonstrating the imaging | photography area | region of components. It is a figure for demonstrating the imaging | photography area | region of components. It is a figure for demonstrating the imaging | photography area | region when the components for which imaging | photography at high resolution is requested | required and the components for which imaging | photography by low resolution is requested | required are arrange | positioned in the vicinity. It is a functional block diagram which shows the structure of an external appearance inspection machine. It is a figure which shows an example of mounting data. It is a flowchart of the process which the inspection condition determination part of an external appearance inspection machine performs. It is a figure for demonstrating the process of S2-S6 of FIG. It is a figure for demonstrating the process of S8 of FIG. It is a figure for demonstrating the process of S10 of FIG. It is a figure for demonstrating the other method of route determination pre-processing (S8 of FIG. 10). It is a figure for demonstrating the route determination process of the imaging | photography area | region when components with different illumination intensity at the time of imaging | photography are mixed. It is a figure for demonstrating the route determination process of the imaging | photography area | region when components with different illumination intensity at the time of imaging | photography are mixed. It is a figure for demonstrating the route determination process of the imaging | photography area | region when components with different illumination intensity at the time of imaging | photography are mixed.

Explanation of symbols

20 Substrate 22, 22a-22d, 22i Parts 24, 24a-24k Imaging region 100 Appearance inspection machine 102 Display unit 103 Input unit 104 Camera device 106 High resolution camera 108 Low resolution camera 109 Ring illumination 110 Base 111 Mechanism control unit 114 Storage Unit 114a mounting data 115 communication I / F unit 116 inspection condition determining unit 120 mechanism unit

Claims (4)

It is an inspection condition determination method for determining an inspection condition in an appearance inspection machine that images a component on a substrate with a plurality of resolutions and inspects the mounting state of the component,
The resolution required when shooting the part is determined in advance,
For each of the plurality of resolutions, an imaging area determination step for determining at least one imaging area so as to include a component to be imaged at the resolution;
A route determination step for determining the shortest route for circulating the imaging region determined in the imaging region determination step;
For each of the imaging area to be route determining target in said path determination step, the while maintaining the components included in the imaging area, the only possible imaging area before route determination moves to the center of the substrate processing steps and the including
Inspection condition determining method. It is an inspection condition determination method for determining an inspection condition in an appearance inspection machine that images a component on a substrate with a plurality of resolutions and inspects the mounting state of the component,
The resolution required when shooting the part is determined in advance,
For each of the plurality of resolutions, an imaging area determination step for determining at least one imaging area so as to include a component to be imaged at the resolution;
A route determination step for determining the shortest route for circulating the imaging region determined in the imaging region determination step;
For each of the shooting areas to be determined in the path determination step, the shooting area is set so that the vertical or horizontal positions of the adjacent shooting areas are aligned as much as possible while maintaining the components included in the shooting area. a path determination preprocessing step of moving is including
Inspection condition determining method. An inspection method for photographing a component on a substrate with a plurality of resolutions and inspecting a mounting state of the component,
The resolution required when shooting the part is determined in advance,
For each of the plurality of resolutions, an imaging area determination step for determining at least one imaging area so as to include a component to be imaged at the resolution;
A route determination step for determining the shortest route for circulating the imaging region determined in the imaging region determination step ;
A route determination pre-processing step for moving the imaging region to the center of the substrate as much as possible while maintaining the components included in the imaging region for each imaging region to be determined in the route determination step,
An inspection method comprising: inspecting a mounting state of a component by photographing the component in the imaging region determined in the imaging region determination step while moving the camera along the route determined in the route determination step. An inspection method for photographing a component on a substrate with a plurality of resolutions and inspecting a mounting state of the component,
The resolution required when shooting the part is determined in advance,
For each of the plurality of resolutions, an imaging area determination step for determining at least one imaging area so as to include a component to be imaged at the resolution;
A route determination step for determining the shortest route for circulating the imaging region determined in the imaging region determination step;
For each of the shooting areas to be determined in the path determination step, the shooting area is set so that the vertical or horizontal positions of the adjacent shooting areas are aligned as much as possible while maintaining the components included in the shooting area. A route determination preprocessing step to be moved;
An inspection step of inspecting the mounting state of the component by imaging the component in the imaging area determined in the imaging area determination step while moving the camera along the path determined in the path determination step;
Including inspection methods.

Images