KR102560720B1 - Inspection apparatus for substrate having multiple inspection units - Google Patents

Abstract

In the present invention, a substrate inspection device is disclosed. The board inspection device includes an inspection roller driven to rotate to provide a feeding force for the double-sided substrate matrix, and a plurality of inspection units arranged along the outer circumference of the inspection roller to generate different scan data for the double-sided substrate matrix, , Among the plurality of inspection units, the inspection units of the first group are divided along the width direction of the double-sided substrate mother body, and overlapping inspection units adjacent to each other along the width direction of the double-sided substrate mother body, along with some widths that do not overlap with each other Both widths are taken as the image area.
According to the present invention, it is possible to capture various types of defects without omission by providing scan data having excellent discrimination for different defects or scan data having different contrast regions of high contrast ratio in order to capture different types of defects. A board inspection device capable of is provided.

Description

Substrate inspection apparatus including a plurality of inspection units {Inspection apparatus for substrate having multiple inspection units}

The present invention relates to a substrate inspection apparatus including a plurality of inspection units.

The substrate inspection device may include conductive patterns formed on first and second opposite surfaces of the insulating film, based on a flexible insulating film, in the form of a continuous reel before being cut into unit substrates. Automated vision inspection can be performed on the formed double-sided substrate matrix.

An embodiment of the present invention provides scan data having excellent discrimination for different defects or scan data having different contrast regions of high contrast ratio in order to capture different types of defects, so that various types of defects are not omitted. It includes a board inspection device that can capture.

An embodiment of the present invention can generate high-resolution scan data without delay in scan time or transfer delay of a double-sided substrate parent body, automated vision inspection can be performed with high reliability from high-resolution scan data, and automated vision It includes a substrate inspection device that provides high-quality images so that visual inspection can be performed concurrently with inspection.

One embodiment of the present invention prevents out-focus due to overheating or expansion of the inspection roller on which a plurality of inspection units are arranged, and controls the temperature of the inspection roller to an appropriate level by capturing the positional change of the outer circumferential surface around which the double-sided board matrix is wound. By doing so, a substrate inspection device capable of maintaining in-focus where the image plane of the double-sided substrate matrix is formed within the depth of focus from the image pickup plane of the detector.

In order to achieve the above and other objects, the substrate inspection device of the present invention,

Including an inspection roller driven to rotate to provide a conveying force for the double-sided substrate matrix, and a plurality of inspection units arranged along the outer circumference of the inspection roller to generate different scan data for the double-sided substrate matrix,

Among the plurality of inspection units, the inspection units of the first group are divided along the width direction of the double-sided substrate mother body, and overlapping inspection units adjacent to each other along the width direction of the double-sided substrate mother body together with partial widths that do not overlap with each other. Both widths are taken as the image area.

For example, the substrate inspection apparatus combines the scan data generated from the first group of inspection units along the width direction of the double-sided substrate mother body based on the image area where the neighboring inspection units overlap each other, Scan data for the entire width of the substrate parent body can be generated.

For example, the first group of inspection units may include a plurality of inspection units disposed to be spaced apart from each other along the length direction and the width direction of the double-sided substrate matrices crossing each other.

For example, the plurality of inspection units,

a first group of inspection units having relatively high resolution so that a part of the width of the double-sided substrate mother body is an image area; and

A second group of inspection units having a relatively low resolution may be included so that the entire width of the double-sided substrate mother body is an image area.

For example, the substrate inspection device may further include a displacement sensor disposed on the outer circumferential surface of the inspection roller in a non-contact manner to capture a change in position of the outer circumferential surface due to overheating and expansion of the outer circumferential surface.

For example, the board inspection device captures a positional change of the outer circumferential surface of the inspection roller from the output of the displacement sensor, and according to the positional change of the outer circumferential surface, one of i) cooling of the inspection roller and ii) driving of the optical axis motor is selected. It may further include a control unit that selectively performs one or performed in parallel to control the position of the outer circumferential surface of the inspection roller to be maintained within the depth of focus of the inspection unit.

For example, the control unit that detects a change in the position of the outer circumferential surface of the inspection roller due to overheating may operate a drum cooler for cooling the inspection roller to control the position of the outer circumferential surface to return to a level prior to overheating.

For example, the controller detecting the approach of the outer circumferential surface due to the expansion of the inspection roller may operate the optical axis motor to control the position of the inspection unit on the optical axis to be away from the outer circumferential surface of the inspection roller.

According to the board inspection apparatus according to an embodiment of the present invention, by providing scan data having excellent discrimination for different defects or scan data having different contrast regions of high contrast ratio in order to capture different types of defects, Various types of defects can be captured without omission.

According to the board inspection device according to an embodiment of the present invention, high-resolution scan data can be generated without delay in scan time or transfer delay of the double-sided substrate mother body, and automated vision inspection is performed with high reliability from the high-resolution scan data. In addition, high-quality images can be provided so that the visual inspection can be performed in parallel with the automated vision inspection.

According to the substrate inspection apparatus according to an embodiment of the present invention, out-focusing due to overheating or expansion of the inspection roller on which a plurality of inspection units are arranged is prevented, and a change in the position of the outer circumferential surface around which the double-sided substrate mother body is wound is captured to detect the inspection roller. By controlling the temperature of the temperature at an appropriate level, it is possible to maintain in-focus where the image plane of the double-sided substrate matrix is formed within the depth of focus from the image pickup plane of the detector.

1 is a view showing the overall configuration of a substrate inspection apparatus including different stages arranged along a first direction.
2A to 2C are different views showing a configuration disposed around the first and second inspection rollers shown in FIG. 1 and an inspection area and a non-inspection area formed around the first inspection roller. .
3A and 3B are diagrams illustrating a configuration disposed around the first inspection roller and an inspection area and a non-inspection area formed around the first inspection roller.
4A and 4B are diagrams illustrating a configuration disposed around the second inspection roller and an inspection area and a non-inspection area formed around the second inspection roller.
5A to 5C are views showing different first to third types of light sources provided in different first to fifth inspection units.
FIG. 6 schematically illustrates generating a two-dimensional composite image through synthesis of scan data output from different pixel areas of first to fifth inspection units and third to fifth inspection units.
FIG. 7 is a view showing driving signals input to the first and second driving rollers and imaging signals input to the first to fifth inspection units.
8 is a schematic diagram for explaining out-of-focus due to overheating and expansion of the inspection roller.

Hereinafter, with reference to the accompanying drawings, a substrate inspection apparatus according to a preferred embodiment of the present invention will be described.

Referring to FIG. 1, a substrate inspection apparatus according to an embodiment of the present invention includes a loading stage LS in which a double-sided substrate mother body 10 wound on a supply reel is continuously unwound and loaded into the substrate inspection apparatus, and a double-sided substrate A first inspection stage IS1 for vision inspection of the first surface of the matrix 10 and a second inspection stage IS2 for vision inspection of the second surface opposite to the first surface of the double-sided substrate matrix 10; An unloading stage (US) in which the inspected double-sided substrate mother body 10 is wound around a recovery reel may be included.

The loading stage LS, the first inspection stage IS1 , the second inspection stage IS2 , and the unloading stage US may be sequentially arranged along the first direction Z1 . In one embodiment of the present invention, the first direction (Z1) may correspond to the direction of the long side of the base plate 70, which provides a support base for the substrate inspection device, and is generally the transfer direction of the double-sided substrate matrix 10. may apply to For example, in one embodiment of the present invention, the stages LS, IS1, IS2, and US arranged on the front side along the first direction Z1 may form the upstream side of the substrate inspection apparatus, The stages LS, IS1, IS2, and US disposed on the rear side along the first direction Z1 may form the downstream side of the substrate inspection apparatus.

For reference, throughout this specification, the second direction Z2 corresponds to a direction crossing the first direction Z1 and may correspond to a direction of a short side of the base plate 70 . As will be described later, between the loading stage LS and the first inspection stage IS1, between the first inspection stage IS1 and the second inspection stage IS2, and between the second inspection stage IS2 and unloading. The dancer rollers M15, M25, and M35 provided in the first to third transfer control mechanisms M1, M2, and M3 interposed between the stages US are accumulated while moving up and down along the second direction Z2. By supplying the existing double-sided substrate mother body 10, the shortage of the double-sided substrate mother body 10 can be eliminated or the surplus double-sided substrate mother body 10 can be accumulated.

For reference, throughout this specification, the third direction (Z3) may mean a direction crossing the first and second directions (Z1, Z2), for example, corresponding to the width direction of the double-sided substrate matrix 10 It can be. As will be described later, the third to fifth inspection units U3, U4, and U5 of each of the first and second inspection stages IS1 and IS2 are disposed at different positions along the third direction Z3, It is possible to perform a vision inspection on a portion of the width of the substrate matrix 10.

In one embodiment of the invention, each of the stages LS, IS1, IS2, US, namely the loading stage LS, the first inspection stage IS1, the second inspection stage IS2 and the unloading stage US ), a driving roller may be disposed to provide a conveying force along the conveying direction of the substrate, and each of the loading stage (LS), the first inspection stage (IS1), the second inspection stage (IS2) and the unloading stage ( US), a loading roller LR, a first inspection roller I1, a second inspection roller I2, and an unloading roller UR may be disposed as driving rollers, respectively. Through this specification, the loading roller (LR), the first inspection roller (I1), the second inspection roller (I2) and the unloading roller (UR) are driven and rotated to provide a conveying force to the double-sided substrate matrix 10 As such, these rollers may be collectively referred to as driving rollers.

The board inspection device may be provided with a driving roller and a driven roller that idlely rotates along the double-sided substrate matrix 10 by following the feeding force provided by the driving roller. The supply rollers I11 and I21 and the discharge rollers I12 and I22 provided in the two inspection stages IS1 and IS2 may correspond to driven rollers that rotate idle. The driven roller can be idle rotated by following the transport of the double-sided board matrix 10 in a state of being wound around a part of the double-sided board matrix 10 to guide the conveyance of the double-sided board matrix 10 or change the conveying direction. there is.

Referring to FIGS. 2A to 2C , the first and second inspection stages IS1 and IS2 may be disposed adjacent to each other with the second transfer control mechanism M2 interposed therebetween. The first and second inspection stages IS1 and IS2 may perform vision inspection on the first and second surfaces opposite to each other of the double-sided substrate matrix 10 . To this end, the first and second inspection stages IS1 and IS2 use the first and second inspection rollers I1 and I2 having inspection areas IC formed at a distance from each other or relatively far from each other. can include At this time, a plurality of inspection units U1, U2, U3, U4, and U5 are arranged along the inspection area IC of each of the first and second inspection rollers I1 and I2, so that the double-sided substrate mother body 10 It is possible to perform vision inspection on the first and second surfaces of the . In addition, the positions of the first and second inspection stages (IS1 and IS2, or the first and second inspection rollers I1 and I2 provided in the first and second inspection stages IS1 and IS2) face each other, or close to each other. A non-inspection area (NIC) may be formed at the location. An inspection area IC and a non-inspection area NIC may be formed along the outer circumferences of the first and second inspection rollers I1 and I2 provided in the first and second inspection stages IS1 and IS2, respectively. The inspection area IC and the non-inspection area NIC of the first and second inspection rollers I1 and I2 follow the boundary line O that simultaneously follows the first and second directions Z1 and Z2. It may be partitioned, and may be formed in opposite positions to each other. More specifically, the inspection areas IC of the first and second inspection rollers I1 and I2 may be disposed at opposite positions around the boundary line O, and may be disposed at a distance from each other. And, the non-inspection areas (NIC) of the first and second inspection rollers I1 and I2 may be disposed at opposite positions around the boundary line O, and may be disposed near each other. .

Along the outer circumference of the first inspection roller (I1), an inspection area (IC) in which the inspection of the double-sided substrate matrix 10 is performed, and the supply (supply roller I11) and discharge (discharge) of the double-sided substrate matrix 10 A non-inspection area (NIC) in which cleaning (drum cleaner G, FIG. 2b) and cooling of the first inspection roller (I1) for the first inspection roller (I1) is formed between supply and discharge while the roller 112) is performed. can Here, a plurality of inspection units U1, U2, U3, U4, and U5 that generate different scan data are disposed in the inspection area IC to perform a vision inspection on the first surface of the double-sided substrate matrix 10. It can be.

Similarly, along the outer circumference of the second inspection roller (I2), the inspection area (IC) where the double-sided board matrix 10 is inspected, and the double-sided board matrix 10 is supplied (supply roller, I11) And a non-inspection area in which cleaning (drum cleaner G, FIG. 2b) and cooling of the second inspection roller (I2) for the second inspection roller (I2) between feeding and discharging while the discharge (discharge roller, I12) is performed ( NIC) can be formed. Here, a plurality of inspection units (U1, U2, U3, U4, U5) that generate different scan data are disposed in the inspection area (IC) to perform a vision inspection on the second surface of the double-sided substrate matrix 10. It can be.

In one embodiment of the present invention, the plurality of inspection units (U1, U2, U3, U4, U5) provided in the first and second inspection stages (IS1, IS2) may have substantially the same structure, From the supply (supply roller, I11, I21) side where the double-sided board matrix 10 is supplied to the first and second inspection stages IS1 and IS2, from the first and second inspection stages IS1 and IS2 to the double-sided board matrix The first to fifth inspection units (U1, U2, U3, U4, and U5) may be sequentially disposed toward the discharge (discharge rollers, I12, I22) side where the (10) is discharged. At this time, the first to fifth inspection units U1, U2, U3, U4, and U5 of the first inspection stage IS1 are the first to fifth inspection units U1 and U2 of the second inspection stage IS2. , U3, U4, U5) may have substantially the same structure, and the arrangement structure diagram of the first to fifth inspection units U1, U2, U3, U4, and U5 of the first inspection stage IS1, the second The arrangement structure of the first to fifth inspection units U1, U2, U3, U4, and U5 of the inspection stage IS2 may be substantially the same. Through this specification, technical details regarding any inspection unit (U1, U2, U3, U4, U5) among a plurality of inspection units (U1, U2, U3, U4, and U5), the inspection of the first inspection stage (IS1) It may be commonly applied to the units U1, U2, U3, U4, and U5 and the inspection units U1, U2, U3, U4, and U5 of the second inspection stage IS2.

In one embodiment of the present invention, the inspection units (U1, U2, U3, U4, U5) are arranged in different inspection positions along the inspection area (IC), the first to fifth inspection units (U1, U2, U3, U4, U5) may be included. However, the technical scope of the present invention is not limited to the number of inspection units U1, U2, U3, U4, and U5, and in various embodiments of the present invention, the inspection units U1, U2, U3, U4, and U5 The number of is not limited to 5 and may be variously modified.

3A to 4B, each inspection unit (U1, U2, U3, U4, U5) is a light source (L1, L2, L3, L4, L5) for scanning the double-sided substrate matrix 10 and , On the optical axes of the detectors C1, C2, C3, C4, and C5 that generate electrical scan data by receiving the reflected light from the double-sided substrate matrix 10, and the detectors C1, C2, C3, C4, and C5. It may include aligned optical lenses 21 , 22 , 23 , 24 , and 25 . In one embodiment of the present invention, the detectors (C1, C2, C3, C4, C5) and the optical lenses (21, 22, 23, 24, 25) can be optically aligned with each other, for example, the detector ( Optical axes of C1, C2, C3, C4, and C5 and optical axes of optical lenses 21, 22, 23, 24, and 25 may be substantially aligned on the same optical axis. Throughout this specification, the optical axis may refer to an optical axis of an imaging optical system including detectors C1, C2, C3, C4, and C5 and optical lenses 21, 22, 23, 24, and 25.

In one embodiment of the present invention, the double-sided substrate matrix 10 and the detectors C1, C2, C3, C4, and C5 are disposed on opposite sides of the optical lenses 21, 22, 23, 24, and 25 along the optical axis. Light sources L1, L2, L3, L4, and L5 may be disposed around optical axes that deviate from optical axes between the double-sided substrate matrix 10 and the detectors C1, C2, C3, C4, and C5. The light sources (L1, L2, L3, L4, and L5) are between the double-sided substrate matrix 10 and the detectors C1, C2, C3, C4, and C5, more specifically, the double-sided substrate matrix 10 and the optical lens 21 , 22, 23, 24, 25) may be disposed around the optical axis off the optical axis.

5A to 5C, in one embodiment of the present invention, the first to fifth inspection units U1, U2, U3, U4, and U5 have different types of light sources L1, L2, L3, and L4. , L5) may be provided. In one embodiment of the present invention, the third to fifth inspection units U3, U4, and U5 may be provided with a first type of light source L3 (FIG. 5A) having the same structure, and The two inspection units U1 and U2 may be provided with a second type of light source L1 ( FIG. 5B ) and a third type of light source L2 ( FIG. 5C ), which are different from each other.

Hereinafter, the first type light source L3 ( FIG. 5A ), the second type light source L1 ( FIG. 5B ), and the third type light source L2 ( FIG. 5C ) will be described.

In the first type of light source (L3, FIG. 5A), the optical element array (L3a) arranged annularly to surround the circumference of the optical axis gradually moves from the double-sided substrate matrix 10 toward the optical lenses 23, 24, and 25. It may include a group of optical element arrays L3a arranged in a dome shape as a whole while being annularly arranged along a reduced diameter. For example, in one embodiment of the present invention, the optical element array L3a arranged in an annular shape along a diameter gradually reduced along the optical axis may be disposed on a curved surface that follows a dome shape as a whole, , In one embodiment of the present invention, considering the processing of the curved surface and the stability of the mounting of the optical element array L3a mounted on the curved surface, it is disposed on a polygonal shape having a plurality of planes following a dome shape. can For reference, throughout the present specification, the optical element arrays L3a and L1a mean that point light sources such as laser diodes are annular (first type light source, L3a, FIG. 5a) or plate-shaped (second type light source, L1a, FIG. 5b). ) may mean a form arranged in

As will be described later, in one embodiment of the present invention, the third to fifth inspection units U3, U4, and U5 set a part width of the double-sided substrate mother body 10 that does not overlap with each other as an image area, so that the double-sided substrate It is possible to generate scan data for a partial width of the mother body 10, and the work obtained from the third to fifth inspection units U3, U4, and U5 having the divided width of the double-sided substrate mother body 10 as an image area. Scan data for the entire width of the double-sided substrate parent body 10 may be generated by synthesizing the group scan data. At this time, the third to fifth inspection units U3, U4, and U5 include the same first type of light source L3 (see FIG. 5A), so that scan data under the same luminance condition can be generated. Scan data for the entire width of the double-sided board matrix 10 may be generated by synthesizing the scan data of the double-sided board matrix 10 along the width direction.

In one embodiment of the present invention, the third to fifth inspection units U3, U4, and U5 are equally divided along the width direction of the double-sided substrate matrix 10 to provide partial widths that do not overlap with each other, respectively. It is included in the image area of the third to fifth inspection units (U3, U4, U5), but the image areas of the third to fifth inspection units (U3, U4, U5) are adjacent to each other. ) may further include a width partially overlapping each other, and from each of the third to fifth inspection units U3, U4, and U5, centering on pixels overlapping with each other adjacent inspection units U3, U4, and U5. The generated scan data may be synthesized in the width direction to generate scan data for the entire width. At this time, the third to fifth inspection units (U3, U4, U5) are optical element arrays arranged in a dome shape covering a part of the image area corresponding to the image area of the double-sided substrate mother body 10 with a wide diameter ( A lighting environment independent from the outside can be provided through L3a, the first type of light source, FIG. 5A), and the third to fifth inspection units (U3, U4, U5) can be provided through an isolated lighting environment unaffected by the external environment. It is possible to easily detect pixels corresponding to overlapping widths from the scan data generated from ), and based on this, the scan data generated from each of the third to fifth inspection units U3, U4, and U5 By synthesizing along the width direction of the double-sided substrate matrix 10, scan data for the entire width of the double-sided substrate matrix 10 can be generated. That is, by isolating the lighting environment of the third to fifth inspection units U3, U4, and U5 from the external environment, it is possible to exclude the influence of the external environment and provide a uniform lighting environment. Based on pixels overlapping each other in the scan data generated from the inspection units U3, U4, and U5, scan data for a partial width generated from the third to fifth inspection units U3, U4, and U5 is In the synthesizing method, scan data for the entire width of the double-sided substrate matrix 10 may be generated.

The second type of light source (L1, FIG. 5B) includes different optical element arrays (L1a) spaced apart from each other along the circumference of the optical axis and arranged in a plate shape along an oblique inclination angle with respect to the optical axis, and the optical element array (L1a) It may include a reflective surface (L1b) disposed facing to form a light reflection path. At this time, the light source L1 may include different optical element arrays L1a arranged in a plate shape along an oblique inclination angle with respect to the optical axis. For example, two optical element arrays L1a arranged in a plate shape They may have symmetrical positions and symmetrical angles with respect to the optical axis, and may be disposed opposite to each other around the optical axis.

The reflective surface L1b disposed to face the optical element array L1a and forming a light reflection path converts the light path incident from the optical element array L1a toward the double-sided substrate matrix 10 and the double-sided substrate It may be formed in a dome shape to condensate onto the image area of the parent body 10 . The reflective surface (L1b) may include two reflective surfaces (L1b) having a position and orientation symmetrical to each other around the optical axis, disposed opposite to each other around the optical axis, and the same dome along the ground direction. Reflective members extending to have a dome-shaped cross section may be formed from structures arranged symmetrically with each other around an optical axis.

In the second type of light source (L1, FIG. 5b), the inclination angle of the plate-shaped array of optical elements (L1a, FIG. 5b) is gradually expanded along the direction of the optical lens (21) from the double-sided substrate matrix (10). It may be provided at an inclination angle defining the cross section of the trend, and in the first type light source (L3, FIG. 5a) described above, the optical element array (L3a, FIG. 5a) is transferred from the double-sided substrate matrix 10 to the optical lens 23, 24, 25) may be provided at an inclination angle opposite to a structure arranged along an annular shape that changes in a progressively reduced tendency along the direction.

In other words, the inclination angle of the plate in which the optical element array (second type of light source, FIG. 5B) is arranged in the first inspection unit U1 is the optical element array in the third to fifth inspection units U3, U4, and U5. Contrary to the structure in which the array (first type light source, FIG. 5A) is arranged along an annular shape that changes in a progressively narrowing tendency along the direction of the optical lenses 23, 24, and 25 from the double-sided substrate matrix 10. It may be provided at an inclined angle.

In one embodiment of the present invention, the first inspection unit (U1) and the third to fifth inspection units (U3, U4, U5) have different arrangements of optical element arrays (L1a, FIGS. 5B, L3a, and 5A). ), and a plate-shaped arrangement (second type of light source, FIG. 5b) having an inclination angle that tends to expand along the direction of the optical lenses 21, 22, 23, 24, and 25 from the double-sided substrate matrix 10 By including an annular arrangement (first type of light source, FIG. 5A) that changes in a decreasing trend, scan data having different contrast regions of high contrast ratio according to conditions of different light sources (L1, L3, L4, L5) can be obtained.

For example, in one embodiment of the present invention, the optical element array L3a in the first type of light source L3 (FIG. 5A) removes the optical lenses 23, 24, and 25 from the double-sided substrate matrix 10. By being arranged in an annular shape along a diameter gradually reduced toward the opposite direction, the optical element array L3a disposed inside the dome shape can be disposed in a tendency to face toward the double-sided substrate mother body 10 . Unlike the first type of light source (L3, FIG. 5A), in the second type of light source (L1, FIG. 5B), the optical element array (L1a) gradually moves from the double-sided substrate matrix 10 toward the optical lens 21. It can be arranged in a plate shape having an inclination angle that tends to be widened, and the optical element array L1a disposed inside the plate shape having an inclination angle can be arranged in a tendency to face away from the double-sided substrate mother body 10 . In this way, in the light sources of the first and second types (L3 in FIG. 5a and L1 in FIG. 5b), the orientation of the optical element arrays L3a and L1a is toward the double-sided substrate mother body 10 or the double-sided substrate mother body 10 It is formed in a direction away from , has different light and dark areas under different light sources (L1, L3, L4, L5) and has different types of defects (for example, a short circuit between conductive patterns of the double-sided substrate mother body 10 or a conductive pattern It is possible to obtain differential images with excellent identification of pinholes formed in the

The third type of light source (L2, FIG. 5C) includes a beam splitter 50 disposed on the optical axis between the double-sided substrate matrix 10 and the second optical lens 22 disposed opposite to each other along the optical axis. can do. At this time, the beam splitter 50 separates the incident path of the optical element 40 incident in a direction crossing the optical axis and the image pickup path reflected from the double-sided substrate matrix 10 and incident to the second optical lens 22 For example, while arranging the optical element 40 around the optical axis off the optical axis through the beam splitter 50 including the transmission / reflection surface 50a formed obliquely with respect to the optical axis, the double-sided substrate matrix Specular reflection can be induced by providing incident light perpendicular to (10).

As will be described later, in one embodiment of the present invention, the first and second inspection units U1 and U2 use the entire width of the double-sided substrate mother body 10 as an image area to cover the entire width of the double-sided substrate mother body 10. In order to detect defects of different types, the first and second light sources L1 and L2 provided in the first and second inspection units U1 and U2 have different luminance. conditions can be provided. That is, as described above, the first and second inspection units U1 and U2 include a second type of light source L1 ( FIG. 5B ) and a third type of light source L2 ( FIG. 5C ), which are different from each other. By doing so, different luminance conditions can be provided. For example, the second light source (L2 or optical device 40, FIG. 5c) has the same light intensity as that of the first light source (L1 or optical device array L1a, FIG. 5b). Even if provided, the intensity of light captured by the second detector C2 may be relatively low due to light loss on the transmission/reflection surface 50a of the beam splitter 50, and thus, the first and second inspection units Images captured under different luminance conditions can be obtained from (U1 and U2).

In one embodiment of the present invention, the light sources (L1, L2, L3, L4, L5) are disposed around the optical axis out of the optical axis, so that the double-sided substrate mother body 10 and the detector (C1) disposed on opposite sides along the optical axis , C2, C3, C4, C5), and a plurality of point light sources (optical element array, L3a, FIG. 5a, L1a, FIG. 5b) arranged in an annular or plate shape along the circumference of the optical axis. By including it, uniform light can be irradiated to the image area of the double-sided substrate matrix 10 in the form of a surface light source, and shadow areas can be removed through light radially diverging from a plurality of point light sources.

Although not shown in the drawing, in one embodiment of the present invention, a conductive pattern and a mounting area connected to the conductive pattern may be formed on the first and second surfaces of the double-sided board matrix 10. For example, the The conductive pattern and the mounting area correspond to the optical axis of the imaging optical system (optical lenses 21, 22, 23, 24, 25 and detectors C1, C2, C3, C4, C5) formed in the inspection units (U1, U2, U3, U4, U5). can be formed at different depths. In addition, the double-sided substrate matrix 10 according to an embodiment of the present invention may include structures having different reflectivities, for example, a conductive pattern made of a metal material having a relatively high reflectance and a conductive pattern having a relatively low reflectance. An insulating film may be included. For example, the conductive pattern may include a plurality of conductive patterns formed on the insulating film by using the insulating film as a support base, and the double-sided substrate matrix 10 having the insulating film as a support base is COF (Chip On Film) It can be formed in the form of a continuous reel before the film is cut into unit substrates.

In one embodiment of the present invention, the first to fifth inspection units (U1, U2, U3, U4, U5) may include light sources (L1, L2, L3, L4, L5) having different structures, In addition, different imaging optical systems (optical lenses 21, 22, 23, 24, 25 and detectors C1, C2, C3, C4, C5) including detectors (C1, C2, C3, C4, C5) with different resolutions are used. can form In this way, through the first to fifth inspection units U1, U2, U3, U4, and U5 in which different imaging optical systems are formed, in order to capture images with excellent identification or different types of defects for different defects, high It is possible to obtain images having different contrast ratios of light and dark areas, and various types of defects can be captured without omission.

For example, a bright part and a dark part may be formed in scan data generated from the first to fifth inspection units U1, U2, U3, U4, and U5 or an image implemented from the scan data, and each bright part and dark part It may appear as different luminance data in the scan data generated from the first to fifth inspection units U1, U2, U3, U4, and U5, which are different from each other. For example, the first to fifth inspection units U1, U2 According to the characteristics of the light sources (L1, L2, L3, L4, L5) provided in each of the , U3, U4, and U5, a specific area of the double-sided substrate matrix 10 forms a bright area, and the double-sided substrate matrix 10 Another specific area forms a dark area, and in the scan data generated from the first to fifth inspection units U1, U2, U3, U4, and U5, defects of different types appear as bright areas and dark areas having a high contrast ratio. can be captured.

Referring to FIG. 6 , in one embodiment of the present invention, the third to fifth inspection units U3 , U4 , and U5 have different partial widths along the width direction of the double-sided substrate matrix 10 in the image area A3 , A4, A5). In one embodiment of the present invention, the third to fifth inspection units (U3, U4, U5) are equally divided along the width direction of the double-sided substrate matrix 10, and have partial widths that do not overlap with each other, respectively. It is included in the image areas (A3, A4, A5) of the third to fifth inspection units (U3, U4, U5), but the image areas (A3, A4) of the third to fifth inspection units (U3, U4, U5) , A5) may further include a width in which the neighboring inspection units U3, U4, and U5 partially overlap each other, centering on pixels overlapping with each other, respectively. Scan data for the entire width may be generated by synthesizing scan data generated from the third to fifth inspection units U3, U4, and U5 in the width direction.

The third to fifth inspection units (U3, U4, U5) are disposed at different positions along the width direction (third direction, Z3) of the double-sided substrate matrix 10 corresponding to the scan direction, while transferring It may be disposed at different positions along the longitudinal direction (first direction, Z1) of the double-sided substrate matrix 10 corresponding to the direction. In one embodiment of the present invention, in order to shorten the scan time, the third to fifth detectors (C3, C4, C5) in which the scan line is divided into partial widths along the width direction (Z3) of the double-sided substrate matrix 10 are provided. At this time, the third to fifth detectors (C3, C4, C5) are disposed at different positions along the scan direction corresponding to the width direction (Z3) of the double-sided substrate matrix 10, while, In order to avoid physical interference with each other, they may be arranged at different positions along the transport direction corresponding to the longitudinal direction Z1 of the double-sided substrate parent body 10.

The third to fifth inspection units U3, U4, and U5 may generate relatively high-resolution scan data by using a portion of the width of the double-sided substrate matrix 10 as the image area A3, A4, and A5. . Unlike this, the first and second inspection units U1 and U2 may generate relatively low-resolution scan data by using the entire width of the double-sided substrate mother body 10 as the image areas A1 and A2. At this time, while the first and second inspection units U1 and U2 scan the entire width of the double-sided substrate mother body 10 as the image areas A1 and A2, the third to fifth inspection units (U3, U4, U5) can scan a portion of the width of the double-sided substrate matrix 10 as the image area (A3, A4, A5), for example, the first to fifth inspection units ( U1, U2, U3, U4, and U5) have the same number of image sensors along the width direction of the double-sided substrate mother body 10 so that the same number of image sensors corresponding to each pixel can be scanned during the same scan time. It may include line scan detectors (C1, C2, C3, C4, C5) arranged one-dimensionally.

In one embodiment of the present invention, the third to fifth detectors (C3, C4, C5) may be provided with high-resolution detectors (C3, C4, C5) having the same resolution, for example, the first, The second detectors C1 and C2 may be provided with higher resolution detectors C3, C4 and C5. In one embodiment of the present invention, the first and second detectors C1 and C2 may be provided with low resolution detectors C1 and C2 having the same resolution, for example, third to high resolution detectors C1 and C2. 5 detectors (C3, C4, C5) may be provided with relatively low resolution detectors (C1, C2) of lower resolution. The first and second detectors C1 and C2 can generate scan data for the entire width of the double-sided substrate matrix 10 by using the entire width of the double-sided substrate matrix 10 as a scan line, and a low-resolution detector ( C1 and C2), unlike the third to fifth detectors C3, C4 and C5, each of the first and second detectors C1 and C2 scans the entire width of the double-sided substrate mother body 10. Even if it does, delay in scan time may not occur, and restrictions on the transfer time of the double-sided substrate mother body 10 may not occur.

In one embodiment of the present invention, instead of scanning the entire width of the double-sided substrate matrix 10 with a single high-resolution detector, different high-resolution images are scanned over a portion of the width divided along the width direction of the double-sided substrate matrix 10. By applying the detectors, that is, the third to fifth detectors C1 , C2 , C3 , C4 , and C5 , a scan time can be shortened while obtaining high-resolution image quality. Unlike in the present invention, when scanning the entire width of the double-sided substrate parent body 10 using a single high-resolution detector (C3, C4, C5), the scan line becomes longer and the scan time is delayed, and the double-sided substrate mother body ( The feed rate of 10) may be limited.

In FIG. 6, the first to fifth inspection units U1, U2, U3, U4, and U5 are illustrated as including five pixels or image sensors, but this is for convenience of understanding, and one embodiment of the present invention The first to fifth inspection units U1, U2, U3, U4, and U5 may include line scan detectors C1, C2, C3, C4, and C5 including five or more image sensors. .

In one embodiment of the present invention, automatic inspection including image processing for scan data generated from the first to fifth inspection units U1, U2, U3, U4, and U5 is performed, or together with the automatic inspection, automatic Deep learning using artificial intelligence (AI) that can assist inspection or visual inspection can be performed in parallel. In one embodiment of the present invention, in a method of synthesizing scan data for a partial width of the double-sided substrate parent body 10 generated from the third to fifth inspection units (U3, U4, and U5) having relatively high resolution, both sides It is possible to synthesize an image of the entire width of the substrate parent body 10, and it is possible to support visual inspection by providing the synthesized image to the inspector. For example, in one embodiment of the present invention, scan data for the entire width of the double-sided substrate parent body 10 synthesized from the third to fifth inspection units (U3, U4, and U5) having a relatively high resolution is double-sided. A two-dimensional composite image may be provided by two-dimensional synthesis along the longitudinal direction Z1 of the substrate matrix 10 .

In one embodiment of the present invention, the scan data of the third to fifth inspection units U3, U4, and U5 are synthesized along the width direction Z3 of the double-sided board mother body 10 so that the entire double-sided board mother body 10 is formed. Generate scan data about the width, or generate two-dimensional scan data by synthesizing scan data about the entire width of the double-sided board matrix 10 along the length direction Z1 of the double-sided board matrix 10, or generate two-dimensional scan data Implementing the image image of may be performed under the involvement of a control unit that performs image processing.

In one embodiment of the present invention, among the plurality of inspection units (U1, U2, U3, U4, U5) arranged along the outer circumference of the inspection rollers (I1, I2), the inspection unit of the first group is a double-sided substrate matrix (10). ) as an image area, relatively high-resolution scan data can be generated, and another second group of inspection units takes the entire width of the double-sided substrate mother body 10 as an image area, and relatively low-resolution of scan data can be created. In one embodiment of the present invention, the inspection unit of the first group of high resolution may include the third to fifth inspection units U3, U4, and U5, and the inspection unit of the second group of low resolution may include the first , second inspection units (U1, U2), but in various embodiments of the present invention, the inspection unit of the first group, a plurality of inspection units disposed along the outer circumferential surface of the inspection rollers (I1, I2) (U1, U2, U3, U4, U5) may include any two different inspection units, and the inspection unit of the second group is a plurality of inspection rollers (I1, I2) disposed along the outer circumferential surface. Among the inspection units U1, U2, U3, U4, and U5, at least one inspection unit other than the inspection unit of the first group may be included. In other words, in various embodiments of the present invention, the high-resolution first group inspection unit and the low-resolution second group inspection unit determine whether a portion of the width of the double-sided substrate matrix 10 is the image area or the double-sided substrate matrix 10 ), and the number or position of the inspection units (U1, U2, U3, U4, U5) included in each of the first and second groups of inspection units is the image area. It is not limited by the one embodiment of the present invention described, and can be designed with various numbers and various positions.

Referring to FIG. 7 , in one embodiment of the present invention, the first to fifth detectors C1, C2, C3, C4, and C5 may be interlocked at the same frame rate. The detectors C1, C2, C3, C4, and C5 may be interlocked together by pulse signals input to servo motors (not shown) that drive the inspection rollers I1 and I2, and may be interlocked with each other over time. Imaging can be done in time. In one embodiment of the present invention, the first to fifth detectors (C1, C2, C3, C4, C5) are provided with servo motors (not shown) for power-rotating the first and second inspection rollers (I1, I2). An imaging signal synchronized with the input pulse signal may be input. For example, in one embodiment of the present invention, the first and second inspection rollers (I1 and I2, servo motors connected to the first and second inspection rollers I1 and I2), the first and second inspection rollers (I1 Pulse signals synchronized with each other at least with rising edges may be input to the first to fifth detectors C1, C2, C3, C4, and C5 arranged along the outer circumference of , I2). Arranged along the outer periphery of the first and second inspection rollers (I1, I2, servo motors connected to the first and second inspection rollers I1, I2) and the first and second inspection rollers (I1, I2) in the embodiment Different pulse signals synchronized with at least some rising edges may be input to the first to fifth detectors C1, C2, C3, C4, and C5, or the same pulse signal may be input in parallel. The signal may be input to a servo motor (not shown) as a driving signal for the first and second inspection rollers I1 and I2, and may be input to the first to fifth inspection units U1, U2, U3, U4, and U5. As an image pickup signal for the image, it may be input to the first to fifth inspection units U1, U2, U3, U4, and U5.

In this way, the first to fifth detectors C1, C2, C3, C4, and C5 have the same frame for the double-sided substrate mother body 10 that is transported at the same speed along the length direction of the double-sided substrate mother body 10. Since imaging proceeds at high speed, while the first and second detectors C1 and C2 of low resolution scan the entire width of the double-sided substrate matrix 10, the third to fifth detectors C3, C4 and C5 of high resolution can scan a portion of the width of the double-sided substrate matrix 10. For example, in one embodiment of the present invention, the first to fifth detectors C1, C2, C3, C4, and C5 have image areas of different widths along the width direction of the double-sided substrate matrix 10. , Optically, through the first to fifth optical lenses 21, 22, 23, 24, 25 of different magnifications, the same number of sensors (photoelectric conversion sensors) receiving images of different magnifications as inputs It may include line scan detectors (C1, C2, C3, C4, C5) having a one-dimensional sensor array.

3A to 4B, first to fifth optical lenses 21, 22, 23, 24, and 25 are disposed on optical axes of the first to fifth detectors C1, C2, C3, C4, and C5. It can be. In one embodiment of the present invention, in each of the first to fifth inspection units (U1, U2, U3, U4, U5), the first to fifth optical lenses (21, 22, 23, 24, 25) and the first Each of the first to fifth detectors C1 , C2 , C3 , C4 , and C5 may form one camera module (a total of five camera modules) integrally formed.

In one embodiment of the present invention, the first to fifth optical lenses 21, 22, 23, 24, and 25 disposed on the optical axes of the first to fifth detectors C1, C2, C3, C4, and C5 may be provided with zoom lenses of different magnifications. For example, the first and second optical lenses 21 and 22 disposed on the optical axes of the first and second detectors C1 and C2 of relatively low resolution have the same magnification higher than regular magnification (1 magnification), The third to fifth optical lenses 23 may include relatively low-magnification optical lenses 21 and 22 and are disposed on the optical axes of the third to fifth detectors C3, C4, and C5 having relatively high resolution. , 24, 25) may include optical lenses 23, 24, and 25 having the same magnification higher than regular magnification (1 magnification) and relatively high magnification. Based on the scan data from the third to fifth detectors C3, C4, and C5 of high resolution optically aligned with the optical lenses 23, 24, and 25 of relatively high magnification as described above, the double-sided substrate mother body 10 Images can be implemented, and vision inspection based on scan data, deep learning using artificial intelligence (AI) from scan data, or visual inspection using visible images implemented from scan data can be performed in parallel.

Referring to FIGS. 3A to 4B , in one embodiment of the present invention, the first to fifth inspection units U1, U2, U3, U4, and U5 are configured to form first and second inspection stages IS1 and IS2. It may be sequentially arranged from the supply rollers I11 and I21 toward the discharge rollers I12 and I22. For example, the first inspection unit U1 may be disposed at an inspection position (inspection start point, S) closest to the supply rollers I11 and I21 of the first and second inspection stages IS1 and IS2. The fifth inspection unit U5 may be disposed at an inspection position (examination end point, F) closest to the discharge rollers I12 and I22 of the first and second inspection stages IS1 and IS2. And, at different positions between the first inspection unit U1 disposed at the inspection start point S and the fifth inspection unit U5 disposed at the inspection end point F, the third to fifth inspection units U3 , U4, U5) may be arranged.

In one embodiment of the present invention, the positions of the inspection units (U1, U2, U3, U4, and U5) or detectors (C1, C2, C3, C4, and C5) are different angular positions along the inspection area (IC). It may mean, for example, the positions of the first to fifth inspection units U1, U2, U3, U4, and U5 or the positions of the first to fifth detectors C3, C4, and C5, the inspection area ( IC) may refer to the orientation angle of the first to fifth detectors C3, C4, and C5 or the optical axis direction of the imaging optical system provided to the third to fifth detectors C3, C4, and C5.

In one embodiment of the present invention, the first to fifth inspection units U1, U2, U3, U4, and U5 may be disposed at different positions along the inspection area IC, and the inspection rollers I1 and I2 ), the inspection area IC formed in the 180 degree angle area along the outer circumference is equally divided into 5 locations, in other words, the inspection start point S and the inspection end point F of the inspection area IC are respectively divided. A first inspection unit (U1) and a fifth inspection unit (U5) are disposed, and the second to fourth inspection units adjacent to each other are disposed between the first to fifth inspection units (U1, U2, U3, U4, and U5). The units U2, U3, and U4 may arrange the second to fourth inspection units U2, U3, and U4 to form an angle of 45 degrees.

In one embodiment of the present invention, the angle between the first to fifth inspection units U1, U2, U3, U4, and U5 adjacent to each other is set to 45 degrees, and the adjacent inspection units U1, U2, U3, In addition to avoiding physical interference between U4 and U5, optical interference between adjacent inspection units U1, U2, U3, U4, and U5 can be avoided. In one embodiment of the present invention, the unique luminance condition set for each inspection unit (U1, U2, U3, U4, U5) is the light source (L1, L2) of the neighboring inspection unit (U1, U2, U3, U4, U5). . Even if optical interference occurs between adjacent inspection units U1, U2, U3, U4, and U5 by forming an angle of 45 degrees by equally dividing the inspection area IC between U4 and U5, optical interference It is possible to minimize errors in judgment of good or bad due to

For reference, in the drawings accompanying this specification, five inspection units (U1, U2, U3, U4, U5) is illustrated as being disposed, but the number of inspection units (U1, U2, U3, U4, U5) disposed along the outer circumference of the inspection rollers (I1, I2) need not be limited to five, , In various embodiments of the present invention, a plurality of inspection units (U1, U2, U3, U4, U5) with a number less than 5 or a number greater than 5 are disposed along the outer circumference of the inspection rollers (I1, I2). can

In the drawings accompanying this specification, an inspection area (IC) in which a plurality of inspection units (U1, U2, U3, U4, and U5) are disposed along the outer circumference of the inspection rollers (I1, I2) is formed in a semicircular area of 180 degrees. However, the technical scope of the present invention is not limited thereto, and in various embodiments of the present invention, the inspection area IC may be formed at an angle smaller than 180 degrees or greater than 180 degrees.

In the drawings attached to this specification, the inspection area (IC) formed in the 180-degree semicircular area along the outer periphery of the inspection rollers (I1, I2) is equally divided into five places, and the first to fifth areas are equally divided. The inspection units (U1, U2, U3, U4, and U5) are disposed, and an angle of 45 degrees is formed between the neighboring inspection units (U1, U2, U3, U4, and U5), but the present invention The technical range is not limited thereto, and in various embodiments of the present invention, the inspection area IC in which the plurality of inspection units U1, U2, U3, U4, and U5 are disposed is less than 180 degrees or greater than 180 degrees. It can be formed in the angular range, and the number of inspection units (U1, U2, U3, U4, U5) disposed in the inspection area (IC) can be designed to be less than or greater than 5, so that neighboring The angle formed between the inspection units U1, U2, U3, U4, and U5 is not limited to 45 degrees. For example, in various embodiments of the present invention, the angular range of the inspection area IC, the inspection area ( Depending on the number of inspection units (U1, U2, U3, U4, U5) arranged in IC), the angle formed between adjacent inspection units (U1, U2, U3, U4, U5) is greater than 45 degrees or It can be designed small.

Referring to FIGS. 3A to 4B , in one embodiment of the present invention, on the outer circumferential surface of the inspection rollers I1 and I2, the double-sided substrate matrix 10 wound on the outer circumferential surface by capturing the positional change of the outer circumferential surface is a detector C1 , C2, C3, C4, C5) may be provided with an in-focusing mechanism for forming an image within a depth of focus. Hereinafter, an in-focusing mechanism provided in a substrate inspection apparatus according to an embodiment of the present invention will be described.

In one embodiment of the present invention, the inspection rollers (I1, I2) may be provided as a metal drum, the light irradiated from the light source (L1, L2, L3, L4, L5) of the inspection roller (I1, I2) In order not to be reflected by the surface and captured by the detectors C1, C2, C3, C4, C5, the inspection rollers I1, I2 may be provided with metal drums whose surfaces are colored black. For example, the inspection rollers I1 and I2 absorb light emitted from the light sources L1, L2, L3, L4 and L5 or are overheated by the driving heat of the light sources L1, L2, L3, L4 and L5. As it is, it can expand in a radial direction according to the thermal expansion coefficient of the specific metal material forming the inspection rollers (I1, I2).

Referring to FIG. 8, while the outer peripheral surfaces of the inspection rollers I1 and I2 expand toward the detectors C1, C2, C3, C4, and C5 and the imaging surfaces 80 of the detectors C1, C2, C3, C4, and C5, The double-sided substrate parent body 10 on the outer circumferential surface of the inspection rollers I1 and I2 may be imaged at a position out of the imaging surface 80 of the detectors C1, C2, C3, C4, and C5, for example, the double-sided substrate mother body While the imaging plane 80′ of (10) is formed at a position out of the depth of focus from the imaging plane 80 of the detectors C1, C2, C3, C4, and C5, the detectors C1, C2, and C3 Circles of confusion or blurring may be formed on the imaging surfaces 80 of , C4 and C5. For example, in one embodiment of the present invention, the double-sided substrate matrix 10 may include a plurality of conductive patterns formed on the insulating film based on the insulating film, and the thickness of these conductive patterns may be It can be formed as thin as μm to several tens of μm, and the inspection units (U1, U2, U3, U4, U5) for forming high-resolution scan data for conductive patterns with a thickness of several μm to several tens of μm are several μm or several tens of μm. It may have a depth of focus of μm or less. For example, since the inspection rollers I1 and I2 expanded by a temperature rise of 3 degrees can shorten the distance between the outer circumferential surface of the inspection rollers I1 and I2 and the imaging surface 80 by 10 μm, temperature monitoring It is necessary to capture out of focus according to the expansion of the inspection rollers I1 and I2 through the.

In one embodiment of the present invention, compared to the first and second inspection units U1 and U2 that generate relatively low magnification (low resolution) scan data, the third to third to second inspection units U1 and U2 generate relatively high magnification (high resolution) scan data. Out of focus may be caused by the expansion of the inspection rollers I1 and I2 in the fifth inspection units U3, U4, and U5, and the third to fifth inspection units U3 and U4 may be out of focus. The third to fifth optical lenses 23, 24, and 25 provided in the , U5) are larger than the first and second optical lenses 21 and 22 provided in the first and second inspection units U1 and U2. It may include optical lenses 23, 24, and 25 of relatively high magnification, and since the depth of focus is relatively short in the optical lenses 23, 24, and 25 of relatively high magnification, the same inspection For the expansion of the rollers (I1, I2), the probability of getting out of the depth of focus may be higher in the third to fifth inspection units (U3, U4, U5) than in the first and second inspection units (U1, U2). There may be a need to more sensitively capture the expansion of rollers I1 and I2.

In one embodiment of the present invention, the change in the position of the outer circumferential surface around which the double-sided board matrix 10 is wound is monitored, and the image formation surface 80' of the double-sided board matrix 10 is damaged according to the overheating of the inspection rollers I1 and I2. It is possible to capture out-of-focus out of focus depths from the imaging surfaces 80 of the detectors C1, C2, C3, C4, and C5.

Referring to FIGS. 3A to 4B , in one embodiment of the present invention, first to fifth inspection units U1, U2, U3, U4, and U5 are provided along the circumferential direction of the inspection rollers I1 and I2. Cleaning (drum cleaner G) for the arranged inspection area (IC), supply (supply rollers I11, I21) and discharge (discharge rollers I12, I22) and inspection rollers (I1, I2) of the double-sided substrate matrix 10, and A non-inspection area NIC in which the inspection rollers I1 and I2 are cooled may be formed, and at least one displacement sensor R may be disposed in the non-inspection area NIC. In one embodiment of the present invention, the displacement sensor (R) is a non-contact displacement sensor (R) having a directing angle toward the outer circumferential surface at a position spaced apart from the outer circumferential surface of the inspection rollers (I1, I2) and measuring a change in position of the outer circumferential surface. It may be implemented, for example, it may be implemented as a laser displacement sensor (R). Since the double-sided substrate parent body 10 is wound on the outer circumferential surface of the inspection rollers I1 and I2, non-contact displacement measurement is performed at a position away from the outer circumferential surface rather than contact displacement measurement on the outer circumferential surface of the inspection rollers I1 and I2. this may be preferred.

In one embodiment of the present invention, the displacement sensor R may measure a separation distance from a point on an outer circumferential surface toward which the displacement sensor R directs, and output an electrical signal related to the measured separation distance. can In one embodiment of the present invention, the electrical signal output from the displacement sensor R may be input to the control unit, and based on the output of the displacement sensor R, the position of the outer circumferential surfaces of the inspection rollers I1 and I2 is changed. According to the control unit that determines that the imaging position (imaging surface 80′, FIG. 8) of the double-sided board matrix 10 is out of the depth of focus of the detectors (C1, C2, C3, C4, C5), the inspection rollers (I1, I2) By resolving the overheating of the inspection rollers (I1, I2) and returning the outer circumferences of the inspection rollers (I1, I2) to the level before overheating, the imaging position (imaging surface 80′, FIG. In order to be formed within the focal depths of C4 and C5), the inspection rollers I1 and I2 may be cooled. In various embodiments of the present invention, the electrical signal output from the displacement sensor R may be input to a controller (not shown), and based on the output of the displacement sensor R, the inspection rollers I1 and I2 According to the change in the position of the outer circumferential surface of the double-sided substrate matrix 10 (imaging surface 80′, FIG. 8), the controller determines that the focal depth of the detectors C1, C2, C3, C4, and C5 is out of the optical lens. (21, 22, 23, 24, 25) and/or the optical axis motors of each of the detectors C1, C2, C3, C4, and C5 can be used to control the position to be in focus.

In one embodiment of the present invention, the displacement sensor (R) may include one displacement sensor (R) disposed on the outer circumferential surface of each of the first and second inspection rollers (I1, I2), the first The displacement sensor (R) of the inspection roller (I1) is a position adjacent to the inspection starting point (S) where the first inspection unit (U1) is disposed, and a preceding position before the inspection starting point (S), for example, the first It may be disposed between the first inspection unit (U1) and the drum cleaner (G) along the outer circumferential surface of the inspection roller (I1), and the displacement sensor (R) of the second inspection roller (I2) is the fifth inspection unit (U5). As a position adjacent to the disposed inspection end point (F), the fifth inspection unit (U5) and the drum cleaner (G ) can be placed between

In one embodiment of the present invention, overheating of the inspection rollers I1 and I2 is captured using a displacement sensor R disposed one by one for each inspection roller I1 and I2, and the overheating is detected. By controlling the temperature of I2) to an appropriate level, for example, through cooling of the inspection rollers I1 and I2 expanded due to overheating, the position of the outer circumferential surface of the inspection rollers I1 and I2 can be maintained within the depth of focus.

More specifically, in one embodiment of the present invention, on the outer circumferential surface of the inspection rollers (I1, I2), along with the displacement sensor (R), according to the electrical output signal from the displacement sensor (R), the inspection roller A drum cooler (not shown) may be disposed to relieve overheating of (I1, I2) and restore the outer circumferential surface of the inspection rollers (I1, I2) to a state before overheating. The drum cooler (not shown) determines whether the inspection rollers I1 and I2 are overheated or the inspection rollers I1 and I2 are inflated in a state of elastic contact with the outer circumferential surfaces of the inspection rollers I1 and I2. Regardless, heat absorption to the outer circumferential surface can be performed while maintaining contact with the outer circumferential surface.

For example, in one embodiment of the present invention, the drum cooler (not shown) may include a cooling element and an elastic pressing means for elastically contacting the cooling element on an outer circumferential surface. In one embodiment of the present invention, one end of the cooling element may act as a heat absorbing part and the other end of the cooling element may act as a heat dissipating part, such as a heat pipe or a thermoelectric device (TED), and the elastic pressing The means may press and contact the heat absorbing portion formed at one end of the cooling element on the outer circumferential surfaces of the inspection rollers I1 and I2. In one embodiment of the present invention, the drum cooler (not shown) may be disposed in a non-inspection area (NIC) where the inspection units U1, U2, U3, U4, and U5 are not disposed, and the non-inspection area (NIC) can be elastically contacted with respect to one location on the outer circumferential surface of the inspection rollers I1 and I2.

In one embodiment of the present invention, in order to capture the individual position change on the outer circumferential surface of the inspection rollers (I1, I2) to which each inspection unit (U1, U2, U3, U4, U5) is directed, the inspection rollers (I1, I2) A dedicated displacement sensor R may be disposed at each position adjacent to each of the inspection units U1 , U2 , U3 , U4 , and U5 along the outer circumferential surface of the . For example, a dedicated displacement sensor (R) assigned to each inspection unit (U1, U2, U3, U4, U5) is a plurality of inspection units (U1, U2) along the outer circumferential surface of the inspection rollers (I1, I2). , U3, U4, and U5) may be disposed in the inspection area IC, and may be disposed between inspection units U1, U2, U3, U4, and U5 disposed adjacent to each other.

In one embodiment of the present invention, each inspection unit (U1, U2, U3, U4, U5) from the output of the displacement sensor (R) assigned to each inspection unit (U1, U2, U3, U4, U5) It is possible to capture individual position changes on the outer circumferential surfaces of the inspection rollers I1 and I2 that are directed, and each inspection unit ( The positions of U1, U2, U3, U4, and U5) on the optical axis can be controlled. Through this specification, controlling the position on the optical axis of each inspection unit (U1, U2, U3, U4, U5) means that the optical lens 21 provided in each inspection unit (U1, U2, U3, U4, U5). , 22, 23, 24, 25) and/or control the positions of the detectors C1, C2, C3, C4, and C5 on the optical axis.

In one embodiment of the present invention, in response to overheating or expansion of the inspection rollers I1 and I2, an optical axis motor for controlling the position on the optical axis of each inspection unit U1, U2, U3, U4, and U5 (not shown). ) by driving the inspection rollers (I1, I2), despite the change in the position of the outer circumferential surface due to overheating, the image formation position of the double-sided board matrix 10 is determined by the depth of focus of the inspection units (U1, U2, U3, U4, and U5). In-focus by controlling the position on the optical axis of the inspection units U1, U2, U3, U4, and U5 to be away from the outer circumference in response to the approach of the outer circumferential surface due to overheating of the inspection rollers I1 and I2. can keep At this time, control of the optical axis motor may be performed based on the output of the dedicated displacement sensor R allocated to each inspection unit U1 , U2 , U3 , U4 , and U5 as described above.

In various embodiments of the present invention, the change in the position of the outer circumferential surface is captured from the output of the displacement sensor R, and the cooling of the inspection rollers I1 and I2 and the driving of the optical axis motor (not shown) according to the change in the position of the outer circumferential surface, It can be done alternatively or in parallel. For example, the substrate inspection apparatus according to an embodiment of the present invention, on the other hand connected to the displacement sensor (R), a drum cooler (not shown) and an inspection unit (not shown) for cooling the inspection rollers (I1, I2) It may include a controller (not shown) connected to an optical axis motor (not shown) for moving the position on the optical axis of U1, U2, U3, U4, and U5, and the controller (not shown) is a displacement sensor (R). Captures the positional change of the outer circumferential surface of the inspection rollers (I1, I2) from the output signal of the drum cooler (not shown) and / or optical axis motor according to the positional change of the outer circumferential surface due to overheating or expansion of the inspection rollers (I1, I2) (not shown) may be operated to maintain the position of the outer circumferential surfaces of the inspection rollers I1 and I2 within the depth of focus.

For example, when the cooling efficiency of the inspection rollers (I1, I2) is reduced, such as when it is difficult to rapidly cool the inspection rollers (I1, I2) in response to overheating or expansion of the outer peripheral surfaces of the inspection rollers (I1, I2), By driving an optical axis motor (not shown) for controlling the position of each of the inspection units U1, U2, U3, U4, and U5 on the optical axis, the position of the outer circumferential surface of the inspection rollers I1 and I2 can be maintained within the depth of focus. . For example, due to manufacturing limitations of the inspection rollers I1 and I2, when the inspection rollers I1 and I2 do not form an accurate circle and are eccentric, each of the inspection units U1, U2, U3, and U4 , U5) may individually control the positions on the optical axis of the inspection units (U1, U2, U3, U4, U5) corresponding to the individual positions on the outer circumferential surfaces of the inspection rollers (I1, I2) directed.

In various embodiments of the present invention, the displacement sensor R is located in an inspection area IC in which a plurality of inspection units U1, U2, U3, U4, and U5 are disposed along the outer circumferential surfaces of the inspection rollers I1 and I2. It may be arranged, and a plurality of inspection units (U1, U2, U3, U4, U5) may be arranged in the non-inspection area (NIC) excluded. In various embodiments of the present invention, the displacement sensor (R) can capture the change in the position of the outer circumferential surface of the inspection rollers (I1, I2) from which the double-sided substrate matrix 10 is excluded, for example, the double-sided substrate matrix ( 10) along the width direction of the double-sided board matrix 10 is oriented to the extra position of the inspection rollers (I1, I2) excluded or along the length direction of the double-sided board matrix 10, the double-sided board matrix 10 is inspected The position before being wound on the rollers I1 and I2 or the position after the double-sided substrate mother body 10 is separated from the outer circumferential surface of the inspection rollers I1 and I2 may be directed. The displacement sensor R detects a positional change on the outer circumferential surface of the inspection rollers I1 and I2 rather than the double-sided substrate matrix 10 itself, which has a large number of vibrations due to lack of rigidity on the outer circumferential surface of the inspection rollers I1 and I2. can capture

Referring to FIGS. 2A to 2C , in one embodiment of the present invention, along the outer periphery of the first and second inspection rollers I1 and I2 provided in each of the first and second inspection stages IS1 and IS2. Inspection area IC in which the first and second surfaces of the double-sided substrate matrix 10 are inspected and supply (supply rollers I11 and I12) and discharge (discharge roller I12, 122), a non-inspection area NIC in which cleaning (drum cleaner G) is performed for the first and second inspection rollers I1 and I2 may be formed between supply and discharge.

Regarding the arrangement order of the first to fifth inspection units U1, U2, U3, U4, and U5 arranged along the inspection area IC, the first to fifth inspection units U1, U2, U3, and U4 , U5) may be sequentially disposed from the supply rollers I11 and I21 of the inspection stages LS, IS1, IS2 and US toward the discharge rollers I12 and I22. For example, the first inspection unit U1 may be disposed at an inspection position (inspection starting point S) closest to the supply rollers I11 and I21 of the first and second inspection stages IS1 and IS2, , The fifth inspection unit U5 may be disposed at an inspection position (examination end point F) closest to the discharge rollers 12 and I22 of the first and second inspection stages IS1 and IS2.

In one embodiment of the present invention, the inspection area (IC) and the non-inspection area (NIC) are centered on a boundary line (O) crossing 180 degrees corresponding to the semicircle of the first and second inspection rollers (I1, I2). , and the inspection area (IC) and the non-inspection area (NIC) may be bisected around a boundary line (O) extending along 180 degrees. At this time, the boundary line O that borders the inspection area IC and the non-inspection area NIC is the first direction Z1 along the long side of the base plate 70 and the second direction along the short side of the base plate 70. It may extend along an oblique slope that simultaneously follows two directions (Z2). For example, the boundary line O may have an oblique inclination having an angle of 45 degrees between the first and second directions Z1 and Z2 perpendicularly intersecting each other. In the first and second inspection rollers I1 and I2 or the first and second inspection stages IS1 and IS2, the inspection area IC and the non-inspection area NIC extend parallel to each other along an oblique slope. It can be partitioned along the boundary line (O) to be.

For reference, in various embodiments of the present invention, the inspection area IC in which the inspection units U1, U2, U3, U4, and U5 are disposed and the inspection units U1, U2, U3, U4, and U5 are not disposed. The non-inspection area NIC does not need to be limited to an angular area of 180 degrees along the outer circumferential surfaces of the first and second inspection rollers I1 and I2, and the inspection unit U1 disposed in each inspection area IC. , U2, U3, U4, U5) need not be limited to five, as illustrated. In one embodiment of the present invention, the inspection area IC in which the inspection units U1, U2, U3, U4, and U5 are disposed and the non-inspection area in which the inspection units U1, U2, U3, U4, and U5 are not disposed (NIC) is expressed as a semicircle, but this expression is for convenience of understanding, and to limit that the inspection area (IC) and the non-inspection area (NIC) are formed in an angular area of 180 degrees corresponding to a semicircle. It is not.

In one embodiment of the present invention, an inspection start point S and an inspection end point F may be formed at one end and the other end of the boundary line O, respectively, and the boundary line ( An inspection start point (S) and an inspection end point (F) may be respectively formed at a lower position and an upper position among the one end position and the other end position of O). The inspection start point S and the inspection end point F may be formed at angular positions corresponding to each other in the first and second inspection stages IS1 and IS2, and the inspection start point S and the inspection end point ( Among the two semicircles (upper semicircle and lower semicircle) connecting F), one semicircle may form an inspection area IC, and the other semicircle may form a non-inspection area NIC.

The inspection areas IC of the first and second inspection stages IS1 and IS2 may correspond to semicircles opposite to each other around the boundary line O, and similarly, the first and second inspection stages ( The non-inspected areas NIC of IS1 and IS2 may correspond to semicircles opposite to each other with the boundary line O as the center. For example, the inspection area IC of the first inspection stage IS1 may correspond to the non-inspection area NIC of the second inspection stage IS2 (upper portions of the first and second inspection stages IS1 and IS2). semicircle), the non-inspection area NIC of the first inspection stage IS1 may correspond to the inspection area IC of the second inspection stage IS2 (the lower semicircle of the first and second inspection stages IS1 and IS2). ). In the first inspection stage IS1, the vision inspection is performed on the first surface of the double-sided substrate matrix 10, while in the second inspection stage IS2, the second surface of the double-sided substrate matrix 10 is inspected. Since the vision inspection is performed, the first and second inspection stages IS1 and IS2 perform the vision inspection on the first and second surfaces formed on opposite sides of the double-sided substrate matrix 10 in the first and second inspection stages IS1 and IS2. The inspection area IC in the inspection stages IS1 and IS2 may be formed in an upper semicircle and a lower semicircle that are inverted from each other.

In the first inspection stage IS1, the inspection area IC may extend clockwise from the inspection start point S toward the inspection end point F, and in the second inspection stage IS2, the inspection area ( IC) may extend counterclockwise from the inspection start point S toward the inspection end point F. In other words, the inspection direction in the first inspection stage IS1 and the inspection direction in the second inspection stage IS2 are clockwise and counterclockwise around the first and second inspection rollers I1 and I2, respectively. They may be inverted from each other, and accordingly, along the inspection direction in the first inspection stage IS1, the inspection start point S and the inspection end point F are directed from the bottom to the top of the inspection area IC, and , the inspection start point S and the inspection end point F are also directed from the bottom to the top of the inspection area IC along the inspection direction in the second inspection stage IS2.

In this way, in the first inspection stage IS1 and the second inspection stage IS2, the inspection start point S and the inspection end point F are formed at the lower and upper positions, respectively, so that, for example, each inspection As the inspection proceeds with the lower end and the upper end of the region IC as the inspection start point (S) and inspection end point (F), the effect of the self-weight of the double-sided substrate parent body 10 is eliminated, and the double-sided substrate mother body 10 The transfer of the double-sided substrate matrix 10 can be controlled by the adsorption force between the and inspection rollers I1 and I2 and the frictional force having a correlation thereto (ex. frictional force proportional to the adsorption force as normal drag), and the double-sided substrate matrix 10 ) and the inspection rollers (I1, I2), the adsorption force and frictional force can be maintained uniformly over the inspection area (IC), for example, the double-sided substrate matrix 10 and the inspection rollers (I1, I2) according to the effect of their own weight ), or effects such as wrinkling or twisting of the double-sided substrate matrix 10 can be excluded.

More specifically, it is as follows. That is, in one embodiment of the present invention, the inspection area (IC) is not formed between the lowermost position of the inspection rollers (I1, I2) and the uppermost position of the inspection rollers (I1, I2), but formed at a position outside of these That is, if the inspection start point (S) and the inspection end point (F) are not formed at the lowermost and uppermost positions of the inspection rollers (I1, I2), the inspection rollers (I1, I2) at the inspection start point (S) To make the double-sided substrate matrix 10 approach the outer circumferential surface at a gentle angle, and to allow the double-sided substrate matrix 10 to depart at a gentle angle from the outer circumferential surface of the inspection rollers I1 and I2 at the inspection end point (F). can serve the purpose. That is, in one embodiment of the present invention, the double-sided board matrix 10 can approach the outer circumferential surfaces of the inspection rollers I1 and I2 at a gentle angle and depart from the inspection rollers I1 and I2 at a gentle angle. An obliquely inclined boundary line O such that the region IC follows the first and second directions Z1 and Z2 at the same time, for example, 45 equally dividing the first and second directions Z1 and Z2 It can occupy a semicircle centered on the boundary line (O) of the degree angle, and accordingly, the approach and departure of the double-sided substrate parent body 10 from the inspection start point (S) and the inspection end point (F) corresponding to one end and the other end of the semicircle It can be made at a gentle angle.

More specifically, the inspection area IC may be formed in an upper semicircle or a lower semicircle around the obliquely inclined boundary line O so as to simultaneously follow the first and second directions Z1 and Z2. Such a structure Through this, at the inspection start point (S) and the inspection end point (F), the double-sided substrate matrix 10 can approach the outer circumferential surface of the inspection rollers (I1, I2) at a gentle angle to form surface contact, and also the inspection end point In (F), the double-sided substrate matrix 10 can be separated from the outer circumferential surfaces of the inspection rollers I1 and I2 at a gentle angle.

In one embodiment of the present invention, in the first and second inspection stages IS1 and IS2, the inspection area IC and the non-inspection area NIC are formed with orientations reversed from each other, while the first and second inspection stages are formed. A non-inspection area NIC may be formed at a near position of the stages IS1 and IS2 facing each other, and an inspection area IC may be formed at a far position away from each other. In one embodiment of the present invention, in the first and second inspection stages IS1 and IS2, the first and second inspection stages are passed through a non-inspection area NIC formed at a position close to each other (a position facing each other). An extra space can be secured in which the second transfer control mechanism M2 can be formed between (IS1 and IS2) (inspection units U1 and U2 in the non-inspection area NIC of the first and second inspection stages IS1 and IS2) , U3, U4, and U5 are not disposed), and the inspection units (U1, U2, U3, U4, and U5) are arranged by forming the inspection area (IC) at a position far from each other (a position facing each other). You can make sure you have enough space.

Unlike in the present invention, an inspection area (IC) in which a plurality of inspection units (U1, U2, U3, U4, and U5) are arranged is formed at the position of the first and second inspection stages (IS1, IS2) facing each other. In this case, since a sufficient distance between the first and second inspection stages IS1 and IS2 needs to be secured, the vertical length of the substrate inspection apparatus increases along the first direction Z1. In one embodiment of the present invention, a non-inspection area (NIC) excluding the inspection units (U1, U2, U3, U4, and U5) is formed at the position where the first and second inspection stages (IS1, IS2) face each other, thereby forming a non-inspection area (NIC). , It is possible to shorten the longitudinal length of the substrate inspection apparatus along the first direction (Z1), and the extra space to dispose the second transfer control mechanism (M2) between the first and second inspection stages (IS1, IS2) can be obtained.

In one embodiment of the present invention, the double-sided substrate mother body 10 discharged from the first transfer control mechanism M1 preceding the first inspection stage IS1 is located in the inspection area IC of the first inspection stage IS1. Inspection starting point formed at the lower position of the first inspection roller I1 while forming a lower U-turn section T1 (FIG. 2B) in which a U-turn is made by bypassing the inspection area IC of the first inspection stage IS1 to avoid It can be supplied towards (S). And, supply and discharge to the second transfer control mechanism (M2) disposed between the first and second inspection stages (IS1, IS2) is the non-inspection of the first and second inspection stages (IS1, IS2) facing each other. It can be performed without obstruction of the inspection units U1, U2, U3, U4, and U5 through the area NIC. For example, the double-sided substrate mother body 10 discharged from the first inspection stage IS1, It can be supplied to the second transfer control mechanism (M2) from the inspection end point (F) formed at the upper position of the inspection roller (I1), and the double-sided substrate matrix 10 discharged from the second transfer control mechanism (M2) It may be supplied toward the inspection starting point S formed at a lower position of the inspection roller I2. Further, the double-sided substrate mother body 10 discharged from the second inspection stage IS2 moves from the inspection end point F formed at the upper position of the second inspection roller I2 to the inspection area IC of the second inspection stage IS2. ), it can be supplied to the third transfer control mechanism M3 while forming an upper U-turn section T2 (FIG. 2B) that makes a U-turn.

In the substrate inspection apparatus according to an embodiment of the present invention, a non-inspection area (NIC) is formed at a position close to each other (a position facing each other) of the first and second inspection stages IS1 and IS2. In the remote positions of the first and second inspection stages IS1 and IS2 from each other (back to each other), the double-sided substrate matrix 10 is formed by making a U-turn to avoid the inspection area IC and the inspection area IC. A U-turn section (T1, T2, FIG. 2b) in which is supplied or discharged may be formed. At this time, the U-turn sections T1 and T2 ( FIG. 2B ) include the lower U-turn section T1 formed at the lower position by bypassing the upper semicircle (inspection area IC) of the first inspection stage IS1, and the second inspection stage ( An upper U-turn section T2 formed at an upper position bypassing the lower semicircle (inspection area IC) of IS2) may be included. In one embodiment of the present invention, the lower U-turn section (T1) may be formed at a forward position along the first direction (Z1) in which the double-sided substrate matrix 10 is transported, and the upper U-turn section (T2) is double-sided It may be formed at a rear position along the first direction Z1 in which the substrate base body 10 is transported. For example, the lower U-turn section T1 may be formed at a forward position overlapping the first inspection stage IS1 along the first direction Z1, and the upper U-turn section T2 may be formed in the first direction Z1. ) may be formed at a rear position overlapping the second inspection stage IS2.

In the first inspection stage IS1, the double-sided substrate parent body 10 supplied in the vertical direction along the second direction Z2 with respect to the first inspection roller I1 moves upward toward the inspection starting point S. While bending forward along the first direction (Z1) and obliquely approaching at an angle of 45, it is adsorbed on the outer circumferential surface of the first inspection roller (I1) and wound on the first inspection roller (I1), and the first to fifth It may be transferred toward the inspection units U1, U2, U3, U4, and U5.

The double-sided substrate mother body 10 supplied in the horizontal direction along the first direction Z1 with respect to the second inspection roller I2 in the second inspection stage IS2 moves toward the inspection starting point S, and While bending downward along the second direction (Z2) and approaching obliquely at an angle of 45, it is adsorbed on the outer circumferential surface of the second inspection roller (I2) and wound on the second inspection roller (I2) to form the first to fifth inspection units ( U1, U2, U3, U4, U5).

Referring to FIG. 2C, the double-sided substrate mother body 10 is supplied toward the first and second inspection stages IS1 and IS2 through the non-inspection area NIC, or the first and second inspection stages IS1 and IS2. Through the supply rollers I11 and I21 and the discharge rollers I12 and I22 respectively disposed at the front and rear positions along the first direction Z1 in which the double-sided substrate matrix 10 is transported, The double-sided substrate matrix 10 may be supplied and discharged from the front and rear positions of the non-inspection area NIC along the first direction Z1. A drum cleaner (G) and a drum cooler (not shown) may be disposed between the forward supply rollers (I11, I21) and the rear discharge rollers (I12, I22), and the drum cleaner (G) is disposed to face the outer circumferential surfaces of the first and second inspection rollers I1 and I2 from which the double-sided substrate matrix 10 is excluded, and can perform cleaning on the outer circumferential surfaces of the first and second inspection rollers I1 and I2. there is. For example, the drum cleaner (G) includes the first and second inspection rollers (I1, I2) in which the double-sided substrate mother body (10) is excluded between the supply rollers (I11, I21) and the discharge rollers (I12, I22). It is in contact with the surface of the first and second inspection rollers (I1, I2) to perform cleaning, the supply rollers (I11, I21) and discharge rollers (I12, I22) and drum cleaner (G), drum A cooler (not shown) may be formed in the non-inspection area NIC of the first and second inspection stages IS1 and IS2, respectively.

Although the present invention has been described with reference to the embodiments shown in the accompanying drawings, this is only exemplary, and those skilled in the art to which the present invention belongs can make various modifications and equivalent other embodiments. you will understand the point.

LS: loading stage LR: loading roller
US: unloading stage UR: unloading roller
IS1: first inspection stage IS2: second inspection stage
I1: first inspection roller I2: second inspection roller
M1, M2, M3: first to third transfer control mechanisms
U1 to U5: first to fifth inspection units C1 to C5: first to fifth imaging devices
L1 to L5: first to fifth light sources 21 to 25: first to fifth optical lenses
R: Displacement sensor G: Drum cleaner

Claims (8)

Including an inspection roller driven to rotate to provide a conveying force for the double-sided substrate matrix, and a plurality of inspection units arranged along the outer circumference of the inspection roller to generate different scan data for the double-sided substrate matrix,
Among the plurality of inspection units, the inspection units of the first group are divided along the width direction of the double-sided substrate mother body, and overlapping inspection units adjacent to each other along the width direction of the double-sided substrate mother body together with partial widths that do not overlap with each other. The width to be the same as the image area,
The substrate inspection device further comprises a displacement sensor disposed on the outer circumferential surface of the inspection roller in a non-contact manner to capture a change in position of the outer circumferential surface due to overheating and expansion of the outer circumferential surface. According to claim 1,
Based on the image area where the neighboring inspection units overlap each other, the scan data generated from the inspection units of the first group is synthesized along the width direction of the double-sided substrate parent body to obtain scan data for the entire width of the double-sided substrate parent body. A substrate inspection device characterized in that for generating. According to claim 1,
The inspection unit of the first group comprises a plurality of inspection units arranged to be spaced apart from each other along the length direction and the width direction of the double-sided substrate mother bodies crossing each other. According to claim 1,
The plurality of inspection units,
a first group of inspection units having relatively high resolution so that a part of the width of the double-sided substrate mother body is an image area; and
and a second group of inspection units having a relatively low resolution so that the entire width of the double-sided substrate mother body is an image area. delete According to claim 1,
From the output of the displacement sensor, the change in the position of the outer circumferential surface of the inspection roller is captured, and according to the change in the position of the outer circumferential surface, either i) cooling of the inspection roller and ii) driving the optical axis motor, either selectively or in parallel A substrate inspection apparatus further comprising a control unit that performs control to maintain the position of the outer circumferential surface of the inspection roller within the depth of focus of the inspection unit. According to claim 6,
The controller, which detects a change in the position of the outer circumferential surface due to overheating of the inspection roller, controls the position of the outer circumferential surface to return to a level before overheating by operating a drum cooler for cooling the inspection roller. According to claim 6,
The control unit, which detects the approach of the outer circumferential surface according to the expansion of the inspection roller, controls the position on the optical axis of the inspection unit to move away from the outer circumferential surface of the inspection roller by operating the optical axis motor.

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