JP4759146B2 - 二重ビームを備えた二次電子放射顕微鏡のための装置および方法 - Google Patents
二重ビームを備えた二次電子放射顕微鏡のための装置および方法 Download PDFInfo
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- JP4759146B2 JP4759146B2 JP2000620658A JP2000620658A JP4759146B2 JP 4759146 B2 JP4759146 B2 JP 4759146B2 JP 2000620658 A JP2000620658 A JP 2000620658A JP 2000620658 A JP2000620658 A JP 2000620658A JP 4759146 B2 JP4759146 B2 JP 4759146B2
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- 238000000034 method Methods 0.000 title claims description 44
- 238000010894 electron beam technology Methods 0.000 claims description 72
- 238000003384 imaging method Methods 0.000 claims description 36
- 238000009825 accumulation Methods 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims 2
- 150000001768 cations Chemical class 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 239000000523 sample Substances 0.000 description 73
- 239000010410 layer Substances 0.000 description 31
- 238000007689 inspection Methods 0.000 description 29
- 239000004065 semiconductor Substances 0.000 description 25
- 230000007547 defect Effects 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000008901 benefit Effects 0.000 description 10
- 238000012545 processing Methods 0.000 description 9
- 230000001629 suppression Effects 0.000 description 7
- 210000004027 cell Anatomy 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000002047 photoemission electron microscopy Methods 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000012472 biological sample Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 241000132007 Bahia Species 0.000 description 2
- 229930194845 Bahia Natural products 0.000 description 2
- 235000017858 Laurus nobilis Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 210000001124 body fluid Anatomy 0.000 description 2
- 239000010839 body fluid Substances 0.000 description 2
- 210000000988 bone and bone Anatomy 0.000 description 2
- 210000003855 cell nucleus Anatomy 0.000 description 2
- 210000002421 cell wall Anatomy 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 210000000805 cytoplasm Anatomy 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 230000003211 malignant effect Effects 0.000 description 2
- 210000003470 mitochondria Anatomy 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 210000003205 muscle Anatomy 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 238000006424 Flood reaction Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005591 charge neutralization Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001340 low-energy electron microscopy Methods 0.000 description 1
- 238000007620 mathematical function Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 210000002381 plasma Anatomy 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000011410 subtraction method Methods 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 210000001519 tissue Anatomy 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
- H01J2237/0044—Neutralising arrangements of objects being observed or treated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/25—Tubes for localised analysis using electron or ion beams
- H01J2237/2505—Tubes for localised analysis using electron or ion beams characterised by their application
- H01J2237/2538—Low energy electron microscopy [LEEM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/262—Non-scanning techniques
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13574299P | 1999-05-25 | 1999-05-25 | |
US60/135,742 | 1999-05-25 | ||
US09/354,948 | 1999-07-16 | ||
US09/354,948 US6087659A (en) | 1997-11-05 | 1999-07-16 | Apparatus and method for secondary electron emission microscope |
PCT/US2000/014583 WO2000072355A1 (en) | 1999-05-25 | 2000-05-25 | Apparatus and methods for secondary electron emission microscopy with dual beam |
US09/579,867 | 2000-05-25 | ||
US09/579,867 US6586733B1 (en) | 1999-05-25 | 2000-05-25 | Apparatus and methods for secondary electron emission microscope with dual beam |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003500821A JP2003500821A (ja) | 2003-01-07 |
JP4759146B2 true JP4759146B2 (ja) | 2011-08-31 |
Family
ID=41180684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000620658A Expired - Fee Related JP4759146B2 (ja) | 1999-05-25 | 2000-05-25 | 二重ビームを備えた二次電子放射顕微鏡のための装置および方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4759146B2 (de) |
DE (1) | DE60043103D1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI323783B (en) * | 2003-01-27 | 2010-04-21 | Ebara Corp | Mapping projection type electron beam apparatus for sample inspection by electron emitted from the sample,sample evaluation method and semiconductor device manufacturing using same |
TWI473140B (zh) * | 2008-04-11 | 2015-02-11 | Ebara Corp | 試料觀察方法與裝置,及使用該方法與裝置之檢查方法與裝置 |
WO2011151116A1 (en) * | 2010-06-03 | 2011-12-08 | Carl Zeiss Sms Gmbh | A method for determining the performance of a photolithographic mask |
US10380728B2 (en) * | 2015-08-31 | 2019-08-13 | Kla-Tencor Corporation | Model-based metrology using images |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05205688A (ja) * | 1992-01-28 | 1993-08-13 | Toshiba Corp | 走査型電子顕微鏡 |
JPH06243814A (ja) * | 1993-02-16 | 1994-09-02 | Jeol Ltd | 走査電子顕微鏡 |
JPH0714537A (ja) * | 1993-06-22 | 1995-01-17 | Hitachi Ltd | 走査型電子顕微鏡による計測方法 |
JPH07153411A (ja) * | 1993-11-29 | 1995-06-16 | Nikon Corp | 電子ビーム観察方法および装置 |
JPH10275583A (ja) * | 1997-03-28 | 1998-10-13 | Jeol Ltd | 絶縁性物質を含む試料の分析装置 |
WO1999023684A1 (en) * | 1997-11-05 | 1999-05-14 | Kla-Tencor Corporation | Apparatus and method for secondary electron emission microscope |
-
2000
- 2000-05-25 DE DE60043103T patent/DE60043103D1/de not_active Expired - Lifetime
- 2000-05-25 JP JP2000620658A patent/JP4759146B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05205688A (ja) * | 1992-01-28 | 1993-08-13 | Toshiba Corp | 走査型電子顕微鏡 |
JPH06243814A (ja) * | 1993-02-16 | 1994-09-02 | Jeol Ltd | 走査電子顕微鏡 |
JPH0714537A (ja) * | 1993-06-22 | 1995-01-17 | Hitachi Ltd | 走査型電子顕微鏡による計測方法 |
JPH07153411A (ja) * | 1993-11-29 | 1995-06-16 | Nikon Corp | 電子ビーム観察方法および装置 |
JPH10275583A (ja) * | 1997-03-28 | 1998-10-13 | Jeol Ltd | 絶縁性物質を含む試料の分析装置 |
WO1999023684A1 (en) * | 1997-11-05 | 1999-05-14 | Kla-Tencor Corporation | Apparatus and method for secondary electron emission microscope |
Also Published As
Publication number | Publication date |
---|---|
DE60043103D1 (de) | 2009-11-19 |
JP2003500821A (ja) | 2003-01-07 |
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