JP4751276B2 - 半導体ウェハケース - Google Patents
半導体ウェハケース Download PDFInfo
- Publication number
- JP4751276B2 JP4751276B2 JP2006228310A JP2006228310A JP4751276B2 JP 4751276 B2 JP4751276 B2 JP 4751276B2 JP 2006228310 A JP2006228310 A JP 2006228310A JP 2006228310 A JP2006228310 A JP 2006228310A JP 4751276 B2 JP4751276 B2 JP 4751276B2
- Authority
- JP
- Japan
- Prior art keywords
- bottom plate
- vacuum
- wafer
- semiconductor wafer
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
1a ウェハケース壁
2 真空孔
3 真空孔ピン蓋
4a 扇形ウェハ片
4b 欠損ウェハ
5 裏面真空導通溝
Claims (4)
- 円形の底板と、前記底板に設けられた複数の真空孔と、前記真空孔を塞ぐ真空孔ピン蓋であって、脱着自在であり前記真空孔に差し込まれた場合には頭頂部が前記底板の上面より上に出っ張る真空孔ピン蓋と、前記真空孔を連結するために前記底板の裏面に形成された溝と、前記溝の反対側であって、前記底板の周縁に設けられたウェハケース壁とからなる半導体ウェハケース。
- オリエンテーションフラットを有する半導体ウェハの外形に合わせた底板と、前記底板に設けられた複数の真空孔と、前記真空孔を塞ぐ真空孔ピン蓋であって、脱着自在であり前記真空孔に差し込まれた場合には頭頂部が前記底板の上面より上に出っ張る真空孔ピン蓋と、前記真空孔を連結するために前記底板の裏面に形成された溝と、前記溝の反対側であって、前記底板の周縁に設けられたウェハケース壁とからなる半導体ウェハケース。
- ノッチを有する半導体ウェハの外形に合わせた底板と、前記底板に設けられた複数の真空孔と、前記真空孔を塞ぐ真空孔ピン蓋であって、脱着自在であり前記真空孔に差し込まれた場合には頭頂部が前記底板の上面より上に出っ張る真空孔ピン蓋と、前記真空孔を連結するために前記底板の裏面に形成された溝と、前記溝の反対側であって、前記底板の周縁に設けられたウェハケース壁とからなる半導体ウェハケース。
- 角型形状の半導体ウェハの外形に合わせた底板と、前記底板に設けられた複数の真空孔と、前記真空孔を塞ぐ真空孔ピン蓋であって、脱着自在であり前記真空孔に差し込まれた場合には頭頂部が前記底板の上面より上に出っ張る真空孔ピン蓋と、前記真空孔を連結するために前記底板の裏面に形成された溝と、前記溝の反対側であって、前記底板の周縁に設けられたウェハケース壁とからなる半導体ウェハケース。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006228310A JP4751276B2 (ja) | 2006-08-24 | 2006-08-24 | 半導体ウェハケース |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006228310A JP4751276B2 (ja) | 2006-08-24 | 2006-08-24 | 半導体ウェハケース |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008053469A JP2008053469A (ja) | 2008-03-06 |
JP4751276B2 true JP4751276B2 (ja) | 2011-08-17 |
Family
ID=39237230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006228310A Expired - Fee Related JP4751276B2 (ja) | 2006-08-24 | 2006-08-24 | 半導体ウェハケース |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4751276B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010287692A (ja) * | 2009-06-10 | 2010-12-24 | Nikon Corp | 基板カバー |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5028386U (ja) * | 1973-07-06 | 1975-04-01 | ||
JPH03102849A (ja) * | 1989-09-14 | 1991-04-30 | Fujitsu Ltd | ウェハアダプタ及び露光装置 |
JPH0562045U (ja) * | 1992-01-24 | 1993-08-13 | 関西日本電気株式会社 | 半導体ウェーハ吸着装置 |
JP3099235B2 (ja) * | 1993-08-12 | 2000-10-16 | 株式会社東京精密 | ウエハ検査装置 |
JPH1074824A (ja) * | 1996-08-30 | 1998-03-17 | Nec Kansai Ltd | ウェーハ吸着ステージ |
JPH10261676A (ja) * | 1997-03-17 | 1998-09-29 | Sharp Corp | 半導体のウエハテスト方法 |
-
2006
- 2006-08-24 JP JP2006228310A patent/JP4751276B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2008053469A (ja) | 2008-03-06 |
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