JP4731809B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP4731809B2
JP4731809B2 JP2003419731A JP2003419731A JP4731809B2 JP 4731809 B2 JP4731809 B2 JP 4731809B2 JP 2003419731 A JP2003419731 A JP 2003419731A JP 2003419731 A JP2003419731 A JP 2003419731A JP 4731809 B2 JP4731809 B2 JP 4731809B2
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film
peeled
substrate
adhesive
layer
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Expired - Fee Related
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JP2003419731A
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Japanese (ja)
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JP2004214645A (ja
JP2004214645A5 (enExample
Inventor
彩 安西
純矢 丸山
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2003419731A priority Critical patent/JP4731809B2/ja
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Publication of JP2004214645A5 publication Critical patent/JP2004214645A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2003419731A 2002-12-17 2003-12-17 半導体装置の作製方法 Expired - Fee Related JP4731809B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003419731A JP4731809B2 (ja) 2002-12-17 2003-12-17 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002365566 2002-12-17
JP2002365566 2002-12-17
JP2003419731A JP4731809B2 (ja) 2002-12-17 2003-12-17 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2004214645A JP2004214645A (ja) 2004-07-29
JP2004214645A5 JP2004214645A5 (enExample) 2007-02-08
JP4731809B2 true JP4731809B2 (ja) 2011-07-27

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JP2003419731A Expired - Fee Related JP4731809B2 (ja) 2002-12-17 2003-12-17 半導体装置の作製方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7872356B2 (en) * 2007-05-16 2011-01-18 Qualcomm Incorporated Die stacking system and method
US8232598B2 (en) * 2007-09-20 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
JP5665020B2 (ja) * 2009-12-22 2015-02-04 国立大学法人九州工業大学 配線用電子部品の製造方法
WO2012029638A1 (en) 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714982A (ja) * 1993-06-21 1995-01-17 Hitachi Ltd 半導体集積回路装置及びその製造方法
JP4085459B2 (ja) * 1998-03-02 2008-05-14 セイコーエプソン株式会社 ３次元デバイスの製造方法

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JP2004214645A (ja) 2004-07-29

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