JP4726571B2 - Semiconductor wafer dicing frame - Google Patents

Description

  The present invention relates to a semiconductor wafer dicing frame used for semiconductor wafer dicing and expanding operations.

  As shown in FIGS. 4 to 6, a conventional dicing frame for a semiconductor wafer includes a frame 1A for housing a semiconductor wafer W having a diameter of 300 mm (12 inches), and the dicing for holding the semiconductor wafer W on the frame 1A. It is comprised by sticking the film 21 (refer patent document 1).

  The frame 1A is formed hollow using, for example, SUS or the like, and a barcode 4 for managing information on the semiconductor wafer W and its processing process is attached to a part of the surface, and a set of 25 sheets is illustrated. Aligned and stored in a storage container for semiconductor wafers. The dicing film 21 includes a soft vinyl chloride resin formed into a film with a thickness of, for example, 50 to 200 μm, and an acrylic adhesive has a thickness of 10 to 50 μm on the surface of the soft soft vinyl chloride resin. It has been applied and is detachably attached to the back surface of the frame 1A to close the hollow portion.

In the semiconductor wafer dicing frame having such a configuration, the semiconductor wafer W adhered and held on the dicing film 21 is diced into a plurality of dies (chips) D by the diamond blade 30 (see FIG. 4), and the adhesive remains. The entire dicing film 21 including the dicing film 21 is irradiated with UV, pressed onto the expander 31 from above and stretched in the radial direction (see FIGS. 5 and 6), and a plurality of dies D are mutually connected. The distance between the semiconductor wafers W is increased so that they do not come into contact with each other. Thereafter, the dies D are individually picked up and transferred from the semiconductor wafer W, and operations such as package assembly and substrate mounting are performed.
JP 2000-319662 A

  A conventional dicing frame for a semiconductor wafer has a problem in that workability and convenience are lacking because the frame 1A is made of SUS as described above, and has high strength but is heavy (for example, about 300 g). To solve such a problem, it is sufficient to select a resin as the material of the frame 1A. However, if this is done, not only will the strength of the frame 1A decrease, but the thickness of the frame 1A will be 3.7 mm or more. There will be a new major problem that it cannot be used for existing equipment and devices.

  In recent years, the amount of information to be managed by increasing the semiconductor wafer W from 8 inches (diameter 200 mm) to 12 inches has been increasing, but conventionally, a bar code 4 having a small amount of information is simply pasted. Since it stops, there is a problem that it cannot cope with an increase in the amount of information. To solve this problem, the RF tag of the RFID system may be used instead of the barcode 4, but when the frame 1A is made of metal, the frame 1A has an adverse effect on the communication characteristics of the RF tag, and eddy currents. There is a high risk that wireless communication will be hindered due to the occurrence of wireless communication.

  The present invention has been made in view of the above, and can improve the lightness, workability, and convenience while maintaining the strength of the frame, and can cope with the increase in the amount of information on the semiconductor wafer and its processing steps. An object of the present invention is to provide a dicing frame for a semiconductor wafer.

In order to solve the above-mentioned problems in the present invention, a hollow frame that accommodates a semiconductor wafer, and a flexible dicing layer that is attached to the flat rear surface of the frame and holds the accommodated semiconductor wafer in an adhesive manner , After the semiconductor wafer adhered and held on this dicing layer is diced into a plurality of dies, the dicing layer is set in the expander from above and the frame is pressed downward, so that the dicing layer is stretched in the radial direction. A frame,
The frame is injection-molded to a thickness of 2 to 3 mm with a molding material in which polyphenylene sulfide, carbon fiber, and calcium carbonate are mixed and kneaded, and the inner peripheral surface thereof is inclined so as to form a triangle in cross-sectional view. The flexural modulus in the range of 30 to 40 GPa and the flexural strength in ASTM D790 in the range of 210 to 370 MPa, a housing hole for housing the RFID tag for the RFID system is integrally formed on the surface of the frame, and the back surface of the frame Roughen the adherend area for the dicing layer of the
The dicing layer is formed from a planar circular polyolefin film covering the hollow of the frame, and an acrylic adhesive that is applied to the surface of the polyolefin film and holds the semiconductor wafer in an adhesive state. This adhesive is bonded to the adherend area on the back of the frame .

Here, the semiconductor wafer in the claims is mainly a 300 mm diameter type, but is not particularly limited, and may be a 450 mm diameter type. Moreover, although there exist a kind of Si wafer and a GaP wafer in a semiconductor wafer, any may be sufficient. The flexible dicing layer includes transparent, opaque, and translucent films and sheets that hold and hold a semiconductor wafer. The dicing layer may contain a polyolefin film.

ASTM refers to an industry standard set and issued by the American Society for Testing Materials. Further, the RFID system (Radio Frequency Identification) is also referred to as a mobile object identification device or a remote ID, and includes an RFID that moves together with the mobile object, an antenna that performs wireless communication with the RFID, a reader / writer, and the like. A wireless communication system.

According to the present invention, since the frame is injection-molded using a molding material such as polyphenylene sulfide, the weight can be reduced, and through this, workability and convenience can be improved. In addition, polyphenylene sulfide exhibits excellent fluidity, dimensional stability, and the like, and strength and rigidity can be ensured by the carbon fiber. Moreover, since the flexural modulus is in the range of 30 to 40 GPa and the flexural strength is in the range of 210 to 370 MPa as the frame material is changed, the strength of the frame is not reduced even if resin is used. Moreover, it is possible to use existing equipment and devices as they are by thinning the frame to 3 mm or less. Further, even if a resin is used, the frame can be prevented from being broken, bent, cracked, etc., so even if an EVA-based dicing layer is used, the frame and the dicing layer are rarely separated. Explaining this point in detail, the EVA-based dicing layer suppresses adhesion of the adhesive to the die and improves productivity. However, since the elongation rate during pulling is small, the distance between the die and the die is reduced. In order to fully expand, it is necessary to press the expanded apparatus strongly from above. In this regard, when the strength of the frame is low, the frame may be deformed and the dicing layer may come off or peel off. However, according to the present invention, the resin frame that does not decrease the strength is used. It is possible to effectively prevent separation, peeling, etc. from the dicing layer.

In addition, since the frame is made of resin, even if the RF tag of the RFID system is used, the frame does not adversely affect the communication characteristics of the RF tag, and the possibility of malfunction such as malfunction in wireless communication is effectively obtained. It becomes possible to eliminate. In addition, since the RF tag is integrally attached to the frame, it is possible to simplify the information system, and since there is no need to inquire about the information, the response is quick and the information can be distributed. It is possible to respond flexibly to changes and changes. In addition, when the frame is made of metal, it is necessary to cut the RF tag storage hole in the frame over time, but when the frame is made of resin, the storage hole is formed when the frame is molded. Can be easily formed integrally, so that improvement in productivity can be expected. Furthermore, since the region to be bonded on the back surface of the frame is roughened, the bonding strength with the dicing layer can be improved by the spike effect.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A dicing frame for a semiconductor wafer in this embodiment is a 12-inch semiconductor wafer W patterned as shown in FIGS. And a flexible dicing layer 20 that detachably adheres and holds the semiconductor wafer W that is attached to the frame 1 and is enclosed and enclosed.

  As shown in FIG. 2, the frame 1 is injection-molded into a substantially ring shape having a thickness of 2 to 3 mm larger than a 12-inch semiconductor wafer W with a predetermined molding material, and the inner peripheral surface is substantially rectangular in cross section and substantially triangular. Alternatively, the front, rear, left and right of the outer peripheral surface are linearly cut out, and a pair of positioning notches 2 are cut out side by side at the front of the outer peripheral surface.

  The predetermined molding material includes, for example, a material obtained by mixing and kneading polyphenylene sulfide (PPS) excellent in fluidity, dimensional stability, low wear and precision molding, carbon fiber ensuring strength and rigidity, and calcium carbonate. . In addition, a material in which at least one resin selected from polyphenylene sulfide and polyamide and aluminum borate whisker excellent in strength, chemical resistance, and the like are mixed can be given.

  As shown in FIG. 2, a housing hole 3 extending in the horizontal direction is integrally formed in the rear portion of the front surface of the frame 1, and the RF tag 11 of the RFID system 10 is mounted in the housing hole 3. As shown in FIG. 1, the RFID system 10 includes an RF tag 11 that moves with the frame 1 when an internal memory is accessed by radio waves, an antenna unit 12 that transmits and receives radio waves and power between the RF tag 11, and an RF A reader / writer 13 that controls communication with the tag 11 and a computer 14 that controls the reader / writer 13 are provided.

  The antenna unit 12 and the reader / writer 13 are configured separately, but are integrated as necessary. In addition, various controllers are used in place of the computer 14 as long as the reader / writer 13 is not particularly affected by the control.

  Such a frame 1 has a flexural modulus of 25 to 50 GPa, preferably 25 to 40 GPa in the industry standard ASTM D790, and a flexural strength of 150 to 600 MPa, preferably 150 to 400 MPa in ASTM D790. It is said. This is because when the bending elastic modulus and bending strength of the frame 1 are out of the above ranges, the strength of the frame 1 is reduced or the frame 1 is easily damaged.

  The dicing layer 20 includes, for example, a polyolefin film made of ethylene vinyl acetate (EVA) or the like that restricts the adhesive from adhering to the die D, and an acrylic film that is applied to the surface of the polyolefin film and adheres to the semiconductor wafer W. It is formed in a thin flat disk shape having a pressure sensitive adhesive, and is adhered to the adherend region on the back surface of the frame 1 to close the hollow portion. The area to be bonded on the back surface of the frame 1 may be left as it is, but may be roughened into a substantially spike-like unevenness to improve the bonding strength with the dicing layer 20. The other parts are the same as those in the conventional example, and thus the description thereof is omitted.

  According to the above, since the frame 1 is injection-molded using a molding material such as polyphenylene sulfide instead of metal, the weight can be reduced, and the workability and convenience can be significantly improved through this. Moreover, since the bending elastic modulus is set in the range of 25 to 50 GPa and the bending strength is set in the range of 150 to 600 MPa along with the material change of the frame 1, even if resin is used, the strength of the frame 1 is reduced. In addition, the frame 1 can be made as thin as 3 mm or less, and existing equipment and devices can be used as they are. Even if resin is used, the frame 1 can be prevented from being broken, bent, cracked, etc., so even if the EVA-based dicing layer 20 is used, the frame 1 and the dicing layer 20 are not separated. .

  Explaining this point in detail, the EVA-based dicing layer 20 is different from the soft vinyl chloride resin in that it prevents the adhesive from adhering to the die D and improves the productivity, but has a low elongation at the time of tension. Therefore, in order to sufficiently widen the space between the die D and the die D, it is necessary to strongly press against the expanding device 31 from above. In this regard, when the strength of the frame 1 is low, as shown in FIG. 3, the frame 1 may be deformed and the dicing layer 20 may be detached or peeled off. However, according to the present embodiment, the strength is not lowered. Since the resin frame 1 is used, it is possible to effectively prevent separation, peeling, and the like between the frame 1 and the dicing layer 20.

  In addition, since the frame 1 is made of resin instead of metal, even if the RF tag 11 of the RFID system 10 is used, the frame 1 does not adversely affect the communication characteristics of the RF tag 11 and malfunctions in wireless communication. It is possible to eliminate the possibility of causing trouble such as the above effectively. In addition, since the RF tag 11 of the RFID system 10 is integrally attached to the frame 1, the information system can be simplified, and since an inquiry of information is unnecessary, the response becomes very fast and the information Can be distributed, so that it is possible to flexibly cope with system expansion and changes.

  Unlike barcodes (maximum information amount of 10 digits) 4, which is easily printed, information can be read remotely and power can be transmitted, and the amount of information can be increased (maximum information amount of 1000 digits) and information can be rewritten. It is possible to facilitate the improvement of the contamination resistance. Furthermore, when the frame 1 is made of metal, the housing hole 3 for the RF tag 11 must be cut over the frame 1 over time. However, when the frame 1 is made of resin, Since the storage hole 3 can be easily integrally formed at the time of molding 1, significant improvement in productivity can be greatly expected.

  In the above embodiment, the housing hole 3 is formed in the rear of the front surface of the frame 1, but the present invention is not limited to this. For example, the storage hole 3 may be formed in at least a part of the side portion of the frame 1. Further, the RF tag 11 may be directly attached without recessing the storage hole 3 on either the front or back surface of the frame 1. The RFID system 10 includes an electromagnetic coupling method with a short communication distance, an electromagnetic induction method, a radio wave method with a long communication distance, and the like. Further, the RF tag 11 includes a label shape, a cylindrical shape, a card shape, a box shape and the like, and any of them may be used.

Embodiments of a semiconductor wafer dicing frame according to the present invention will be described below together with comparative examples.
Example 1
First, a frame shown in FIG. 2 was injection molded by an injection molding machine using a predetermined molding material. As the predetermined molding material, a material obtained by kneading and mixing 100 parts by weight of polyphenylene sulfide, 100 parts by weight of carbon fiber, and 200 parts by weight of calcium carbonate was used. The frame had an outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 2.5 mm, and the weight of the frame was about 120 g.

  Further, when the above kneaded and mixed materials were injection-molded into a dumbbell shape and the flexural modulus and flexural strength were measured, the flexural modulus in ASTM D790 was 30 GPa and the flexural strength in ASTM D790 was 210 MPa.

  Next, a dicing layer is attached to the back surface of the injection-molded frame, and an RFID tag having a frequency of 13.56 MHz of the RFID system (trade name: ACCUWAVE, manufactured by Dainippon Printing Co., Ltd.) is formed in the recess hole formed in the rear surface of the frame. Affixed. As the dicing layer, a dicing film [trade name: Adwill D] manufactured by Lintec Corporation was used.

  When the dicing layer is thus attached to the frame, a semiconductor wafer that has been back-ground to 140 μm in advance is bonded to the surface of the dicing layer, and the semiconductor wafer is separated into pieces by a dicing machine (trade name: DAD381 manufactured by DISCO Corporation). At the same time, the entire dicing frame was irradiated with UV light by a die bonder (manufactured by NEC Machinery Co., Ltd.) to expand 8 mm, and the distance between the die was set to 150 μm.

  At this time, the dicing frame was observed, but deformation such as bending was not observed, and no separation or peeling was confirmed in the dicing layer. In addition, although information was written to the RF tag of the frame at a communication distance of 2 mm and the written information was read, there was no particular problem.

Example 2
First, a frame shown in FIG. 2 was injection molded by an injection molding machine using a predetermined molding material. As the predetermined molding material, a material obtained by kneading and mixing 100 parts by weight of polyamide [MXD6 nylon] and 185 parts by weight of aluminum borate whiskers was used. The frame had an outer diameter of 400 mm, an inner diameter of 350 mm, and a thickness of 2.5 mm, and the weight of the frame was about 120 g.

  Further, when the above kneaded and mixed materials were injection molded into a dumbbell shape and the flexural modulus and flexural strength were measured, the flexural modulus in ASTM D790 was 40 GPa and the flexural strength in ASTM D790 was 370 MPa.

  A dicing layer was attached to the back surface of the injection-molded frame, and an RF tag for the RFID system was attached to a storage hole formed in a recess in the frame. A dicing film [trade name: UC] manufactured by Furukawa Electric Co., Ltd. was used as the dicing layer. The other parts were the same as in Example 1.

  Although the dicing frame was observed, deformation such as bending was not observed, and the dicing layer was not detached or peeled off. Also, information was written to the RF tag of the frame at a communication distance of 20 mm, and the written information was read out, but there was no particular problem.

Comparative Example First, a frame was cut out from a stainless steel plate having a thickness of 1.5 mm. This frame had an outer diameter of 400 mm and an inner diameter of 350 mm, and the weight of the frame was about 300 g.

  Next, a dicing layer is attached to the back surface of the frame, and an RFID tag with a frequency of 13.56 MHz of RFID system (trade name: ACCUWAVE, manufactured by Dai Nippon Printing Co., Ltd.) is attached to the storage hole cut in the rear surface of the frame. did. As the dicing layer, a dicing film [trade name: Adwill D] manufactured by Lintec Corporation was used.

  Once the dicing layer is attached to the frame, a semiconductor wafer that has been back-ground to 140 μm is bonded to the surface of the dicing layer, and the semiconductor wafer is separated into pieces by a dicing machine (trade name: DAD381 manufactured by DISCO Corporation). The entire dicing frame was irradiated with UV light by a die bonder (manufactured by NEC Machinery Co., Ltd.) to expand 8 mm, and the distance between the die was set to 150 μm.

  Although the dicing frame was observed, deformation such as bending was not observed, and the dicing layer was not detached or peeled off. On the other hand, when information was written to the RF tag of the frame at a communication distance of 2 mm or an operation of reading the written information was performed, there was a case where the reading was hindered.

It is a whole perspective explanatory view showing an embodiment of a semiconductor wafer dicing frame concerning the present invention. It is a plane explanatory view showing an embodiment of a frame for dicing of a semiconductor wafer concerning the present invention. It is explanatory drawing which shows the problem at the time of setting to the expansion apparatus in embodiment of the dicing frame of the semiconductor wafer concerning this invention. It is perspective explanatory drawing which shows the state at the time of the dicing operation | work of the dicing frame of the conventional semiconductor wafer. It is explanatory drawing which shows the state which sets the frame for dicing of the conventional semiconductor wafer to an expanding apparatus. It is explanatory drawing which shows the state which set the frame for dicing of the conventional semiconductor wafer to the expand apparatus.

Explanation of symbols

1 Frame 1A Frame 2 Notch 3 Storage hole 4 Bar code 10 RFID system 11 RF tag 12 Antenna unit 13 Reader / writer 14 Computer 20 Dicing layer 21 Dicing film 30 Diamond blade 31 Expanding device D Die W Semiconductor wafer

Claims (1)

A hollow frame that accommodates a semiconductor wafer and a flexible dicing layer that is attached to the flat rear surface of the frame and holds the accommodated semiconductor wafer in an adhesive manner. A plurality of semiconductor wafers that are adhesively held in the dicing layer A dicing frame of a semiconductor wafer in which a dicing layer is set in an expanding apparatus from above and the dicing layer is stretched in a radial direction by pressing the frame downward .
The frame is injection-molded to a thickness of 2 to 3 mm with a molding material in which polyphenylene sulfide, carbon fiber, and calcium carbonate are mixed and kneaded, and the inner peripheral surface thereof is inclined so as to form a triangle in cross-sectional view. The flexural modulus in the range of 30 to 40 GPa and the flexural strength in ASTM D790 in the range of 210 to 370 MPa, a housing hole for housing the RFID tag for the RFID system is integrally formed on the surface of the frame, and the back surface of the frame Roughen the adherend area for the dicing layer of the
The dicing layer is formed from a planar circular polyolefin film covering the hollow of the frame, and an acrylic adhesive that is applied to the surface of the polyolefin film and holds the semiconductor wafer in an adhesive state. A dicing frame for a semiconductor wafer, characterized in that the adhesive is bonded to a bonded area on the back side of the frame.

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