JP5690615B2 - Ring frame and process management system - Google Patents

Description

  The present invention relates to a ring frame and a process management system.

In recent years, a data carrier (IC tag) affixed to an article to be managed (adhered body) is held over an information acquisition device (also referred to as a reader or a reader / writer) to obtain information from the IC tag and identify the article. Non-contact type RFID for performing management and management has been developed and spread. The IC chip incorporated in the IC tag is activated by electromagnetic waves emitted from the information acquisition device, and can transmit / receive information to / from the information acquisition device or rewrite data. IC tags are used in a wide variety of fields, such as commuter pass tickets for various transportation facilities, entry / exit management at companies, etc., inventory management of goods, and logistics management.
IC tags have begun to be used for managing semiconductor manufacturing processes. For example, Patent Document 1 describes an RF tag (also referred to as an IC tag) attached to a ring frame (support frame) for processing a semiconductor wafer. The ring frame described in Patent Document 1 is obtained by molding a molding material in which a conductive material is blended with a thermoplastic resin material into a ring shape, and a housing hole is formed in a part of the surface of the ring frame. The RF tag is attached to the storage hole. A semiconductor wafer (adhered body) is integrated with a ring frame to which this RF tag is attached via an adhesive sheet such as a mounting sheet.
When such a ring frame is used in a semiconductor processing process, for example, information on a semiconductor wafer, information on an adhesive sheet, and information on a processing process that has already been performed are recorded on the RF tag attached to the ring frame. Is done. When processing a semiconductor wafer, a reader / writer provided in the processing apparatus reads the information recorded on the RF tag to set processing conditions, or sets information on the processed conditions to the RF tag. Or write to. Thereafter, the ring frame is transported to the next process, and the information recorded on the RF tag is used. In this way, the ring frame with the RF tag is used in the process management system.

JP 2007-314650 A

Incidentally, the IC tag attached to the ring frame described in Patent Document 1 is a label type including a film substrate, an IC chip attached to the film substrate, and an antenna connected to the IC chip. The ring frame has a size that can be accommodated in a storage hole formed in a part of the ring frame surface.
However, in the case of such a ring frame, since the inner diameter of the antenna coil of the attached IC tag is inevitably limited to be within the film substrate surface, the communication distance of the IC tag is also limited. There is also a demand to increase the communication distance. If the communication distance is short, it is necessary to bring the ring frame closer to the reader / writer or to bring the reader / writer closer to the ring frame in order to transmit and receive process management information for semiconductor wafer processing.

  An object of the present invention is to provide a ring frame having a long data carrier communication distance, and a process management system using the ring frame.

The ring frame of the present invention is a ring frame for processing a semiconductor wafer, a frame main body obtained by molding a thermoplastic resin into a ring shape, a data carrier having a shape along the ring shape of the frame main body, wherein the data carrier is characterized that you have been accommodated along the ring shape inside the frame body.

In the ring frame of the present invention, it is preferable that the frame main body has a storage groove along the ring shape on the surface, and the data carrier is stored in the storage groove .
In the ring frame of the present invention, the frame main body is composed of two frame members having the same shape as the ring shape, and the data carrier is sandwiched and integrated between the two frame members. It is also preferable.
In the ring frame of the present invention, the data carrier includes an IC chip and an antenna coil connected to the IC chip, and the antenna coil is wound along the ring shape of the frame body. It is also preferable.

The process management system of the present invention is
The ring frame of the present invention;
A reading device,
The management information of the semiconductor wafer processing process is transmitted and received without contact with the data carrier.

In the process management system of the present invention,
It is preferable that the management information is at least one of information on a semiconductor manufacturing tape to be attached to the ring frame, information on a semiconductor wafer to be attached to the semiconductor manufacturing tape, and information on semiconductor wafer processing conditions.

According to the ring frame of the present invention, since the data carrier has a shape along the ring shape of the ring frame, compared to the case where the IC tag is attached to a part of the ring frame as in the prior art, the data carrier The inner diameter of the antenna coil is increased. As a result, the communication distance of the data carrier in the ring frame can be increased .
In addition, when the data carrier is housed inside the ring frame, the data carrier does not get in the way when processing semiconductor wafers, while the data carrier is broken or damaged during wafer processing or ring frame transport. Can be prevented.

According to the process management system of the present invention, since the ring frame of the present invention and the reader are provided, it is possible to construct a process management system in which the communication distance between the reader and the data carrier is increased. For example, when a conventional IC tag is simply attached to the frame body, the communication distance is short, and therefore it is necessary to bring the two close together when transmitting / receiving management information between the IC tag and the reader / writer. . If the process management system has a long communication distance as in the present invention, the two do not have to be close as in the prior art, so a reader / writer is installed at a position away from the ring frame, and management is performed from there. Information can be transmitted and received reliably. As a result, the degree of freedom in designing the semiconductor wafer processing apparatus and the processing line is increased.
Further, in the process management system of the present invention, the management information includes information on a semiconductor manufacturing tape to be attached to the ring frame, information on a semiconductor wafer to be attached to the semiconductor manufacturing tape, information on semiconductor wafer processing conditions, and the like. Therefore, appropriate processing can be performed on the semiconductor wafer. That is, since the process management system of the present invention uses a ring frame with a long communication distance, the management information can be reliably transmitted to the reader / writer, and the processing apparatus receives the management received by the reader / writer. Processing can be performed after setting appropriate processing conditions based on the information.

It is a plan view of a ring frame according to the first embodiment. It is a schematic diagram of a process control system according to the first embodiment. It is the schematic explaining the lamination process of a semiconductor wafer processing process. It is sectional drawing of the data carrier for storage cassettes affixed on the semiconductor wafer storage cassette which stores a semiconductor wafer. It is the schematic explaining the back grinding process of a semiconductor wafer processing process. It is the schematic explaining the mounting process of a semiconductor wafer processing process. It is the schematic explaining the dicing process of a semiconductor wafer processing process. It is the (A) top view and (B) sectional view of the ring frame concerning a second embodiment.

<First embodiment>
[Ring frame]
FIG. 1 shows a ring frame 1 according to the first embodiment.
The ring frame 1 includes a frame main body 2 formed in an annular shape and a data carrier 3 having a shape along the ring shape of the frame main body 2.
The ring frame 1 of the present embodiment supports a semiconductor wafer as an adherend in a semiconductor processing process.

The frame body 2 is obtained by molding a thermoplastic resin into a ring shape. In the present invention, the term “annular” includes not only a circular shape but also an elliptical shape, a polygonal shape such as a rectangular shape, and the like.
The frame body 2 is formed in a size larger than the semiconductor wafer (1 inch = 2.54 cm) so as to support a semiconductor wafer having a diameter of 8 inches (203.2 mm) or a diameter of 12 inches (304.8 mm). . The inner diameter of the frame body 2 is, for example, about 250 mm for a semiconductor wafer having a diameter of 8 inches and about 350 mm for a semiconductor wafer having a diameter of 12 inches. The width of the frame of the frame body 2 is formed to a size necessary for mounting the data carrier 3. More specifically, as long as it is possible to arrange the antenna coil 32 of the data carrier 3 along the ring shape of the frame body 2 as described later, the width is preferably 3 mm to 150 mm, more preferably 5 mm to 100 mm, 10 mm-50 mm are more preferable. If the width of the frame of the frame main body 2 is less than 3 mm, the width of the data carrier 3 is not sufficient, the antenna design of the data carrier 3 is limited, and each process as the ring frame 1 is performed. The strength in the process may be insufficient. If the width of the frame of the frame main body 2 exceeds 150 mm, it is not economical because it has an unnecessarily large size, and the storage cassette of the ring frame 1 and various semiconductor wafer processing machines (back grinding apparatus, dicing apparatus). Etc.), and the installation location of the apparatus may be hindered. In the present invention, the width of the frame of the frame body 2 is the distance from the inner periphery to the outer periphery of the frame body 2.
Although the thickness dimension of the frame main body 2 should just be suitably set according to the kind of resin used for shaping | molding, 1 mm-30 mm are preferable, for example, and 2 mm-10 mm are more preferable. If the thickness dimension is less than 1 mm, the strength in each processing step as the ring frame 1 may be insufficient. If this thickness exceeds 30 mm, it will be more expensive than necessary, and it will be uneconomical, and the size of the ring frame storage cassette and various semiconductor wafer processing machines (back grinding equipment, dicing equipment, etc.) will increase. In some cases, the location of the device may be hindered.
A notch 21 is formed on the outer peripheral surface of the frame body 2 for positioning when the ring frame 1 is transported or processed.

The thermoplastic resin used to mold the frame body 2 includes polypropylene, acrylonitrile-butadiene-styrene copolymer (ABS), polystyrene, polymethylmethacrylate and other acrylic resins, vinyl chloride, and polyphenylene. Examples thereof include oxides, polycarbonates, nylon resins, polyphenylene sulfide (PPS), and aromatic polysulfones. These may be used alone or in a blend. In order to ensure strength and rigidity, these thermoplastic resins may contain carbon fibers, calcium carbonate, and aluminum borate whiskers that are excellent in reinforcing effect and chemical resistance.
The thermoplastic resin used for forming the frame body 2 is preferably used by blending a thermoplastic material with a conductive material in order to suppress the generation of static electricity in the semiconductor wafer processing step. Examples of conductive materials include conductive carbon blacks such as ketjen black and acetylene black, metal oxides such as tin oxide and indium oxide, and lithium ion conductive materials such as lithium perchlorate and organic boron complex lithium salts. It is done. The blending amount of these conductive materials is not particularly limited, but is preferably 1 to 50 parts by weight, and more preferably 5 to 25 parts by weight with respect to 100 parts by weight of the thermoplastic resin. If the blending amount of the conductive material is less than 1 part by weight, the conductivity may be insufficient. When the blending amount of the conductive material exceeds 50 parts by weight, the blending amount may be excessive with respect to the contribution of improving the conductivity, or the strength of the ring frame may be insufficient.

A data carrier is a carrier having an information storage unit, and means a device that inputs and rewrites information and returns a response to a question from an interrogator regarding the input information. In the present invention, a non-contact type data carrier that can input or output information without contact using electromagnetic waves as a communication medium is preferably used. An example of such a non-contact data carrier is a so-called RF memory in which an IC chip and a conductive coil are connected.
In the present embodiment, the data carrier 3 is a non-contact type data carrier and includes an IC chip 31 and a conductive antenna coil 32 connected to the IC chip 31.
The data carrier 3 has a shape along the ring shape of the frame body 2. The number of turns (or also called the number of turns) of the antenna coil 32 may be one or more. The number of turns of the antenna coil 32 in the present embodiment is 1, and the antenna coil 32 is provided over substantially one turn along the ring shape of the frame body 2. The inner diameter of the antenna coil 32 is larger than the inner diameter of the frame body 2. Therefore, the inner diameter of the antenna coil 32 is 250 mm or more when the frame body 2 is for a semiconductor wafer having a diameter of 8 inches, and 350 mm or more when the frame body 2 is for a semiconductor wafer having a diameter of 12 inches. The outer dimensions of the antenna coil 32 are smaller than the outer dimensions of the frame body 2.
The line interval of the antenna coil 32 is appropriately set depending on the relationship between the number of turns and the width of the frame body 2.

The data carrier 3 is affixed to the frame body 2 with an adhesive or a double-sided pressure-sensitive adhesive sheet. A well-known thing can be used for the adhesive agent and double-sided adhesive sheet used here.
Further, a protective member that covers the data carrier 3 may be provided.
At this time, the data carrier 3 may be attached to the frame body 2 by using an adhesive layer on one surface of the protective member. As the core and protective member of the double-sided pressure-sensitive adhesive sheet, a paper material, cloth, a film made of a synthetic resin, or the like can be used.
Examples of the paper material include high-quality paper, glassine paper, craft paper, crepe paper, paperboard, and nonwoven fabric made of wood fiber or synthetic fiber.
Examples of the cloth include those woven with synthetic fibers such as acrylic fibers, polypropylene fibers, and polyethylene fibers, carbon fibers, cotton, silk, and hemp.
Examples of the synthetic resin include acrylic resin, urethane resin, vinyl chloride resin, polypropylene resin, polyethylene resin, silicone resin, styrene resin, and butadiene resin.
The thickness of the core of the double-sided pressure-sensitive adhesive sheet and the protective member is preferably 1 μm to 1 mm, more preferably 5 μm to 300 μm. If this thickness dimension is less than 1 μm, it may be difficult to attach because it is thin and has no stiffness, or it may be easily wrinkled or cut off. When the thickness dimension exceeds 1 mm, there is a problem that there is too much stiffness and the flexibility is insufficient, making it difficult to attach or increasing the size.
An acrylic resin, urethane resin, styrene resin, polyester resin, silicone resin, epoxy resin, or the like can be used as the double-sided pressure-sensitive adhesive sheet, the pressure-sensitive adhesive for the holding member, and the adhesive for attaching to the frame body 2.
The thickness of the pressure-sensitive adhesive or adhesive is preferably 1 μm to 500 μm, and more preferably 5 μm to 100 μm. If the thickness dimension is less than 1 μm, it may be difficult to obtain a uniform film or the adhesiveness may be insufficient. If it exceeds 500 μm, extra time may be required during film formation, leading to an increase in size, and there may be a problem of being uneconomical.
The data carrier 3 may be one in which the IC chip 31 and the antenna coil 32 are previously tagged. That is, the double-sided adhesive sheet is the same as when the IC tag obtained by mounting the IC chip 31 and the antenna coil 32 on the circuit substrate having a shape along the ring shape of the frame body 2 is attached to the frame body 2. You may affix on the frame main body 2. FIG. Examples of the circuit substrate in this case include the materials exemplified for the protective member, and the same applies to the preferred thickness dimensions. Further, the antenna coil 32 along the frame body 2 is formed on the circuit substrate, and an adhesive layer is laminated on the IC tag on which the IC chip 31 is mounted to form an adhesive label. The frame body 2 may be pasted and cut.

  As a method of forming the antenna coil 32, a method of winding a coated copper wire along the ring shape of the frame body 2, a method of printing a conductive paste along the ring shape, and laminating the frame body 2 and the circuit substrate. Examples include a method of etching a conductive metal foil such as copper or aluminum into a shape along the ring shape. Examples of the conductive paste include those obtained by dispersing metal particles such as gold, silver, nickel, and copper in a binder or an organic solvent. Examples of the binder include resins such as polyester, polyurethane, epoxy, and phenol.

[Process management system]
As shown in FIG. 2, the process management system 20 reads and transmits the radio wave between the data carrier 3 included in the ring frame 1 and the data carrier 3 by electromagnetic induction to access the internal memory of the data carrier 3. A reader / writer 4 as an apparatus is provided. Furthermore, it is preferable to include a computer 5 as a control device for controlling the reader / writer 4, and the reader / writer 4 and the computer 5 are connected by wire or wirelessly.
In the present embodiment, a case where the process management system 20 is used for managing a semiconductor wafer processing process will be described as an example. In the process management system 20, management information on the semiconductor wafer processing process is exchanged between the data carrier 3 and the reader / writer 4 provided in the ring frame 1.

In the semiconductor wafer processing, as shown in FIG. 2, the semiconductor wafer W is mounted on the ring frame 1 via an adhesive sheet S as a semiconductor manufacturing tape.
Examples of the semiconductor wafer W include a silicon semiconductor wafer and a gallium / arsenic semiconductor wafer.
As the pressure-sensitive adhesive sheet S, a pressure-sensitive adhesive sheet that has been conventionally used for processing a semiconductor wafer is used without particular limitation, but in the present invention, a pressure-sensitive adhesive sheet having an energy ray-curable pressure-sensitive adhesive layer is particularly preferably used. Details of such an energy ray curable pressure-sensitive adhesive sheet are described in JP-A-60-196956, JP-A-60-223139, JP-A-5-32946, JP-A-8-27239, and the like. ing.

  As management information, for example, information (adhesive sheet information) relating to the adhesive sheet S to be attached to the ring frame 1, information relating to the semiconductor wafer W attached to the adhesive sheet S and mounted on the ring frame 1 (wafer information), the semiconductor wafer W Information on wafer processing conditions (wafer processing information).

Each management information is demonstrated concretely.
As the adhesive sheet information, the product name, the product number, the lot number, the quality guarantee period, and the like of the adhesive sheet S can be cited. In the present embodiment, the pressure-sensitive adhesive sheet S hits a mounting tape used in a mounting process for integrating the semiconductor wafer W with the frame body 2 and a dicing process for cutting the semiconductor wafer W.

  The wafer information includes information related to the semiconductor wafer W. Examples of the information on the semiconductor wafer W include the lot number, type, size, thickness dimension, dimensional accuracy, presence / absence of a flaw, information on a circuit formed on the semiconductor wafer, and the like.

  Examples of the wafer processing information include back surface grinding information relating to conditions when the back surface of the semiconductor wafer W on which the circuit is not formed is ground, mount information when the semiconductor wafer W is integrated with the ring frame 1, and the like.

  A semiconductor wafer processing apparatus and a semiconductor wafer processing method for manufacturing a semiconductor using the ring frame 1 of the present invention configured as described above and the process management system 20 will be exemplified below.

3 to 8 are schematic views for explaining a semiconductor wafer processing step.
Here, the semiconductor wafer processing process will be described by taking a laminating process, a back grinding process, a mounting process, and a dicing process as examples.
A reader / writer and a computer included in various apparatuses used in a semiconductor wafer processing process described below are the same as the reader / writer 4 and the computer 5 described above.

(Lamination process)
FIG. 3 is a diagram showing an outline of the laminating process, and shows a flow of management information.
In the laminating process, a laminating apparatus 11 is used. The laminating apparatus 11 takes out the semiconductor wafer W from the semiconductor wafer storage cassette 6 in which the semiconductor wafer W having a circuit formed on the surface is stored, and affixes a protective tape 11c on the circuit surface of the semiconductor wafer W, Cut along the shape.

The laminating apparatus 11 includes a reader / writer 11a and a computer 11b. A storage cassette data carrier 6 a is attached to the semiconductor wafer storage cassette 6.
The storage cassette data carrier 6a is a non-contact type data carrier, which is composed of an IC chip and a conductive coil for transmission / reception connected to the IC chip, and is used by being attached to the semiconductor wafer storage cassette 6 It has a label type structure. That is, the storage cassette data carrier 6a is a data carrier having a different shape and structure from the data carrier 3 formed along the ring shape of the frame body 2 provided in the ring frame 1.

  As shown in FIG. 4, for example, the storage cassette data carrier 6a has a circuit 62 printed with conductive ink on the surface of a circuit substrate 61 such as polyethylene terephthalate, and an IC chip 63 mounted on the upper surface thereof. ing. And the surface base material 64, such as a polyethylene terephthalate, is affixed on the upper surface, for example, The print coat layer 65 in which thermal transfer printing (printing) is possible is provided in the surface. Further, a double-sided pressure-sensitive adhesive tape 68 having, for example, polyethylene terephthalate as a core material and adhesive layers 67 on both surfaces of the core material 66 is provided on the back side of the circuit substrate 61.

Wafer information (here, wafer information A) is written in the storage cassette data carrier 6a, and the reader / writer 11a of the laminating apparatus 11 reads the wafer information A.
The protective tape 11c is wound around the shaft core 11d, and a protective tape shaft core data carrier (not shown) similar to the storage cassette data carrier 6a is attached to the shaft core 11d. In the data carrier for the protective tape shaft core, information on the protective tape 11c, such as the product name, product number, lot number, and quality guarantee time limit (here, referred to as protective tape information B) is written. 11 reader / writer 11a reads the protective tape information B.
The computer 11b of the laminating apparatus 11 determines the attaching condition of the protective tape 11c based on the wafer information A and the protective tape information B read by the reader / writer 11a, and the laminating apparatus 11 follows the attaching condition. A protective tape 11c is attached to the semiconductor wafer W.

  The semiconductor wafer W to which the protective tape 11c is attached is stored in another semiconductor wafer storage cassette 7. The semiconductor wafer storage cassette 7 is attached with a storage cassette data carrier 7a similar to the storage cassette data carrier 6a. The reader / writer 11a is attached to the storage cassette data carrier 7a with wafer information A, protective tape information B, and sticking information C relating to conditions (sticking tension, sticking speed, etc.) when sticking with the laminating apparatus 11. Write.

(Back grinding process)
FIG. 5 is a diagram showing an outline of a back grinding process performed after the laminating process, and shows a flow of management information.
In the back grinding process, a grinder (back grinding apparatus) 12 is used. The grinder 12 sucks and holds the protective tape 11c side of the semiconductor wafer W on a suction table (not shown), and grinds the back surface on which no circuit is formed to a predetermined thickness dimension.

The grinder 12 includes a reader / writer 12a and a computer 12b.
The reader / writer 12a reads information (wafer information A, protective tape information B, and sticking information C) written in the storage cassette data carrier 7a of the semiconductor wafer storage cassette 7, and based on these information, the computer 12b. Determines the back grinding conditions. The grinder 12 grinds the back surface on which the circuit of the semiconductor wafer W is not formed until it reaches a predetermined thickness according to the back surface grinding conditions.

  After grinding to a predetermined thickness, the semiconductor wafer W to which the protective tape 11c is attached is accommodated in another semiconductor wafer storage cassette 8. The semiconductor wafer storage cassette 8 is attached with a storage cassette data carrier 8a similar to the storage cassette data carrier 6a. The reader / writer 12a uses the storage cassette data carrier 8a with wafer information A, protective tape information B, sticking information C, conditions when the back surface grinding is performed with the grinder 12 (grinding speed, grinder eye number, Write back grinding information D on finishing thickness dimension etc.

(Wafer mounting process)
FIG. 6 is a diagram showing an outline of the mounting process performed after the back grinding process, and shows the flow of management information.
In the wafer mounting process, the mounter 13 is used. The mounter 13 takes out the semiconductor wafer W from the semiconductor wafer storage cassette 8, sucks and holds the protective tape 11 c side of the semiconductor wafer W on a suction table (not shown), and places the ring frame 1 on the outer periphery of the semiconductor wafer W. Thereafter, the mounter 13 attaches the mount tape 13 c to the semiconductor wafer W and the ring frame 1, and cuts the mount tape 13 c into the outer shape of the ring frame 1. In this way, the semiconductor wafer W and the ring frame 1 are integrated via the mount tape 13c.
Instead of cutting the mount tape 13c on the outer shape of the ring frame 1, a mount tape 13c pre-cut in the shape of the ring frame 1 may be used.
The mount tape 13c is wound around the shaft core 13d, and a mount tape shaft data carrier (not shown) similar to the storage cassette data carrier 6a is attached to the shaft core 13d. In this mount tape axis data carrier, mount tape information E, such as a product name, a product number, a lot number, and a quality guarantee period, related to the mount tape 13c is written. The mount tape 13c corresponds to the above-described adhesive sheet S.

  In the wafer mounting process, the semiconductor wafer W is inverted together with the ring frame 1, and the protective tape 11c attached to the circuit surface of the semiconductor wafer W is peeled off using, for example, a separate peeling tape. It has become.

The mounter 13 includes a reader / writer 13a and a computer 13b.
The reader / writer 13a includes information (wafer information A, protective tape information B, pasting information C, and back grinding information D) written in the storage cassette data carrier 8a of the semiconductor wafer storage cassette 8, mount tape information E, and The ring frame information F (type, material, dimensions, date of manufacture, lot number, etc. of the ring frame 1) written in advance on the data carrier 3 of the ring frame 1 is read, and based on these information, the computer 13b determines the mounting conditions. Then, the mounter 13 integrates the semiconductor wafer W and the ring frame 1 in accordance with the mounting conditions.

After mounting the semiconductor wafer W, the reader / writer 13a transfers the wafer information A, protective tape information B, pasting information C, back grinding information D, mount tape information E, ring frame information F to the data carrier 3 of the ring frame 1. The mount information G relating to the mounting conditions (attachment speed and attachment pressure of the mount tape 13c) is written.
Since the communication distance of the ring frame 1 of the present invention is longer than that of the prior art, information can be reliably written to the data carrier 3 even when the reader / writer 13a is located away from the ring frame 1.
After the information is written, the semiconductor wafer W integrated with the ring frame 1 is stored in another semiconductor wafer storage cassette 9. Another storage cassette data carrier similar to the storage cassette data carrier 6 a may be attached to the semiconductor wafer storage cassette 9. In this case, information may be written to both the data carrier 3 of the ring frame 1 and the other storage cassette data carrier by the reader / writer 13a.

(Dicing process)
FIG. 7 is a diagram showing an outline of a dicing process performed after the mounting process, and shows a flow of management information.
In the dicing process, the dicing apparatus 14 is used. The dicing apparatus 14 takes out the semiconductor wafer W from the semiconductor wafer storage cassette 9 together with the ring frame 1 and cuts the semiconductor wafer W into a square shape.

The dicing apparatus 14 includes a reader / writer 14a and a computer 14b.
The reader / writer 14a receives information written on the data carrier 3 of the ring frame 1 (wafer information A, protective tape information B, pasting information C, back grinding information D, mount tape information E, ring frame information F, and mount information. G) is read. Since the communication distance of the ring frame 1 is longer than that of the prior art, information can be reliably read from the data carrier 3 even when the reader / writer 14a is located away from the ring frame 1.
Based on the read information, the computer 14b determines dicing conditions. The dicing apparatus 14 cuts the semiconductor wafer W according to the dicing conditions.

After cutting, the reader / writer 14a stores the wafer information A, protective tape information B, pasting information C, back grinding information D, mount tape information E, ring frame information F, and mount information G on the data carrier 3 of the ring frame 1. In addition, dicing information H relating to dicing conditions (the type of dicing blade, the number of dicing lines, the dicing blade rotation speed, the dicing dimension, etc.) when the semiconductor wafer W is cut is written. Since the information A to G is already written on the data carrier 3, only the dicing information H may be newly written on the data carrier 3.
Since the communication distance of the ring frame 1 is longer than that of the prior art, even if the reader / writer 14a is at a position away from the ring frame 1, information can be reliably written to the data carrier 3.
After the information is written, the semiconductor wafer W integrated with the ring frame 1 is stored in another semiconductor wafer storage cassette (not shown). A storage cassette data carrier similar to the storage cassette data carrier 6a may be attached to the semiconductor wafer storage cassette. In this case, information may be written to both the data carrier 3 of the ring frame 1 and the storage cassette data carrier by the reader / writer 13a.

  After the dicing process, the semiconductor wafer W is accommodated together with the ring frame 1 in another semiconductor wafer storage cassette (not shown), and is transferred to the next process, for example, a die bonding process. In the die bonding step, a semiconductor chip cut into a grid shape is picked up by a bonding apparatus and mounted on a substrate for electronic products. Also in this die bonding process, the information written on the data carrier 3 of the ring frame 1 is read by a reader / writer provided in the bonding apparatus, the semiconductor chip is picked up under the conditions determined by the computer based on the read information, and the substrate is loaded. Implement.

According to-ring frame 1, because it has a shape that the antenna coil 32 of data carrier 3 along the annular shape of the frame body 2, the inner diameter of the antenna coil 32 increases. As a result, the communication distance of the data carrier 3 in the ring frame 1 can be increased.

  Since the process management system 20 includes the ring frame 1, the reader / writer 4, and the computer 5, it is possible to construct a process management system that increases the communication distance between the reader / writer 4 and the data carrier 3. For example, when the conventional IC tag is simply attached to a part of the ring shape of the frame body, the inner diameter of the antenna coil is small and the communication distance is short. Therefore, the IC tag is managed between the IC tag and the reader / writer. When sending and receiving information, it is necessary to bring them closer together. If the process management system 20 has a long communication distance, the two do not need to be close as in the prior art. Therefore, even if the reader / writer 4 is installed at a position away from the ring frame 1, management information can be obtained from there. Can be reliably transmitted and received. As a result, the degree of freedom in designing semiconductor wafer processing apparatuses and lines is increased.

<Second embodiment>

FIG. 8 shows a ring frame 1a according to the second embodiment.
8A is a plan view of the ring frame 1a, and FIG. 8B is a cross-sectional view of the ring frame 1a. As shown in FIG. 8A, the ring frame 1a includes a frame body 2a formed in an annular shape and a data carrier 3 having a shape along the ring shape of the frame body 2a. As shown to (B), it differs from the ring frame 1 of the said embodiment by the point by which the data carrier 3 is accommodated in the inside of the frame main body 2a.

Examples of a method for accommodating the data carrier 3 including the IC chip 31 and the antenna coil 32 in the frame body 2a include the following methods, but are not limited thereto.
As a first method, the frame main body 2a is divided into two frame members having the same ring shape as the frame main body 2 and having a thickness dimension of about half, and the data carrier 3 is inserted between the two frame members. The method of pinching and integrating is mentioned.
The second method includes an insert molding method. In forming the frame main body 2a, a frame member having the same ring shape as the frame main body 2 and having a thickness of about half is injection-molded, and the data carrier 3 is inserted into the mold while the frame member remains in the mold. Arrange along the ring shape. Thereafter, the resin corresponding to the thickness of the remaining half of the frame body 2a is injection-molded, and the frame body 2a that accommodates the data carrier 3 therein is molded.

According to the ring frame 1a of the present embodiment, the communication distance can be increased similarly to the ring frame 1 of the first embodiment, and the following effects are produced.
In the ring frame 1a, the data carrier 3 is accommodated inside the frame body 2a, so that the data carrier 3 with improved resistance to breakage and damage can be obtained.

<Modification>
In addition, this invention is not limited to embodiment mentioned above, For example, the deformation | transformation as shown below is also included.

  For example, in the ring frame 1, a storage groove along the ring shape may be formed on the surface of the frame body 2, and the data carrier 3 may be stored along the ring shape in the storage groove.

  In addition, each processing apparatus may not include a reader / writer that exchanges information with the data carrier 3 of the ring frame 1 in a semiconductor processing process. For example, a reader / writer 4 and a computer 5 are installed on the transfer path in the middle of transferring the semiconductor wafer W together with the ring frame 1, and management information is read from the data carrier 3 by the reader / writer 4. The management information stored in the data carrier 3 may be sent to each processing device wirelessly or by wire. Since the ring frame 1 of the present invention has a long communication distance, it is possible to construct such a process management system, which is managed on the processing apparatus side until the semiconductor wafer W is transferred to the processing apparatus. Since information can be received and processing conditions can be set based on the received information and devices and members can be set based on the processing conditions, the semiconductor wafer W that has been transferred can be processed quickly. be able to.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

The ring frames of Examples 1 to 5 and Comparative Examples 1 to 5 illustrated below were produced, and the performance evaluation of the ring frame was performed by measuring the communication distance. A reader / writer (trade name: XIT-150-BR) manufactured by Welcat Co., Ltd. was used for measurement of the communication distance.
As for the communication distance, the ring frame and the reader / writer are brought close to each other and the IC tag is detected by the reader / writer. The maximum interval for detecting s was taken as the communication distance.

Example 1
A frame body for an 8-inch wafer was produced. Resin composition (100 parts by weight) comprising 80% by weight of aromatic polysulfone (manufactured by BASF Corporation, trade name: ULTRASON-E1010P) and 20% by weight of polyphenylene sulfide resin (trade name: Ryton E-1880, manufactured by Toray Industries, Inc.) ), Carbon black (trade name N-550U, manufactured by Columbian Co., Ltd.) (18 parts by weight), a molding material prepared by kneading and pelletizing in the range of 330 ° C. to 340 ° C. Was injection molded. The injection molding conditions were a resin temperature of 360 ° C. and a mold temperature of 150 ° C. The inner diameter of the frame body was 250 mm, the width dimension was 22 mm, and the thickness dimension was 2 mm.
Next, a coated copper wire (manufactured by Doit Co., Ltd., copper wire, trade name: S-252, diameter 2 mm) was attached along the ring shape of the frame body. The inner diameter of the antenna coil formed of the coated copper wire was 275 mm. The number of turns of the coated copper wire was 1. An adhesive (manufactured by HAKKO Co., Ltd., trade name: HAKKO MELTER STICK No. 810) was used for pasting the coated copper wire.
An IC chip (manufactured by NXP Corporation, product name: IcodeSLI) was mounted on the same surface as the surface on which the coated copper wire was pasted to form a data carrier. For mounting, a flip chip mounting machine (manufactured by Kyushu Matsushita Co., Ltd., product name: FB30T-M) was used. As the bonding material, anisotropic conductive paste (ACP, manufactured by Kyocera Chemical Co., Ltd., product name: TAP0602F) was used in an amount of ACP applied of 0.28 mg. Mounting was performed with the heating temperature to the ACP being 220 ° C. for the IC chip, the load to the IC chip being 2N (200 gf), and the pressure heating time being 7 seconds.
Thus, the ring frame of Example 1 was produced and the communication distance was measured. The measurement results are shown in Table 1.

(Example 2)
Dicing tape (trade name: Adwill G-19, manufactured by Lintec Corporation) was attached to the ring frame of Example 1, and the communication distance was measured with a silicon wafer (8 inches) mounted on the dicing tape. The measurement results are shown in Table 1.

(Example 3)
A frame body for a 12-inch wafer was produced. The frame body was manufactured in the same manner as the ring frame of Example 1 except that the inner diameter of the frame body was 350 mm and the inner diameter of the antenna coil formed of the coated copper wire was 375 mm, and the communication distance was measured. The measurement results are shown in Table 1.

Example 4
The dicing tape used in Example 2 was attached to the ring frame of Example 3, and the communication distance was measured with a silicon wafer (12 inches) mounted on the dicing tape. The measurement results are shown in Table 1.

(Example 5)
Except for changing the molding material of the frame main body to an acrylonitrile-butadiene-styrene copolymer (ABS) -based material, it was produced in the same manner as the ring frame of Example 1, and a dicing tape was applied in the same manner as in Example 2. The communication distance was measured with the silicon wafer mounted. The measurement results are shown in Table 1.
The molding material is composed of acrylonitrile-butadiene-styrene copolymer (ABS) resin and a lithium ion conductive agent (manufactured by Sanko Chemical Co., Ltd., trade name: TBX310) at a weight ratio of 10%. A molding material produced by kneading and pelletizing in a range of ˜340 ° C. was injection molded. The injection molding conditions were a resin temperature of 360 ° C. and a mold temperature of 150 ° C.

(Comparative Example 1)
An IC tag (trade name: Britem TS-L, resonance frequency: 13.56 MHz band, manufactured by Lintec Corporation) was attached to the frame main body manufactured in Example 1, a ring frame was manufactured, and the communication distance was measured. The measurement results are shown in Table 1.
The external dimension of this IC tag is 11 mm × 64 mm.

(Comparative Example 2)
The dicing tape used in Example 2 was attached to the ring frame produced in Comparative Example 1, and the communication distance was measured with a silicon wafer (8 inches) mounted on the dicing tape. The measurement results are shown in Table 1.

(Comparative Example 3)
A ring frame was prepared by attaching the same IC tag as in Comparative Example 1 to the frame body produced in Example 2, and the communication distance was measured. The measurement results are shown in Table 1.

(Comparative Example 4)
The dicing tape used in Example 2 was attached to the ring frame produced in Comparative Example 3, and the communication distance was measured with a silicon wafer (12 inches) mounted on the dicing tape. The measurement results are shown in Table 1.

(Comparative Example 5)
A ring frame was produced in the same manner as in Comparative Example 1 except that a stainless steel frame body for an 8-inch wafer was used, and the communication distance was measured. The measurement results are shown in Table 1.

As Table 1 shows, it was found that the ring distances of Examples 1 to 5 were 20 times or more longer in communication distance than the ring frames of Comparative Examples 1 to 5. It was also found that the communication distance decreased little even when the semiconductor wafer was mounted on the ring frame. Further, even when the material of the frame main body was changed, the difference in the communication distance was hardly seen when compared between Examples 1 and 2 and Example 5.
As for the ring frames of Comparative Examples 1 to 4, the IC tag was only stuck to a part of the ring shape of the frame body, so that the inner diameter of the antenna coil was small and the communication distance was shortened. Measurement was impossible with the metal ring frame of Comparative Example 5.

DESCRIPTION OF SYMBOLS 1, 1a ... Ring frame 2, 2a ... Frame main body 3 ... Data carrier 4 ... Reader / writer 5 ... Computer 20 ... Process control system 21 ... Notch 31 ... IC chip 32 ... Antenna coil S ... Adhesive sheet W ... Semiconductor wafer

Claims (6)

A ring frame for processing a semiconductor wafer,
A frame body obtained by molding a thermoplastic resin into a ring shape;
A data carrier having a shape along the ring shape of the frame body ,
The data carrier, the ring frame, characterized in that that is housed along the ring shape inside the frame body. The ring frame according to claim 1, wherein
The frame body has a storage groove along the ring shape on the surface,
The ring frame , wherein the data carrier is accommodated in the accommodation groove .   The ring frame according to claim 1, wherein
  The frame body is composed of two frame members having the same shape as the ring shape,
  The data carrier is sandwiched and integrated between the two frame members
  A ring frame characterized by that. In the ring frame according to any one of claims 1 to 3,
  The data carrier includes an IC chip and an antenna coil connected to the IC chip.
  The antenna coil is wound along the ring shape of the frame body.
  A ring frame characterized by that. And the ring frame according to any one of claims 1 to 4,
A reading device,
A process management system for transmitting and receiving management information of a semiconductor wafer processing process to and from the data carrier in a non-contact manner. In the process management system according to claim 5 ,
The management information is at least one of information on a semiconductor manufacturing tape to be attached to the ring frame, information on a semiconductor wafer to be attached to the semiconductor manufacturing tape, and information on semiconductor wafer processing conditions. Process management system.