JP2000194810A - Ic tag structure - Google Patents
Ic tag structureInfo
- Publication number
- JP2000194810A JP2000194810A JP37327298A JP37327298A JP2000194810A JP 2000194810 A JP2000194810 A JP 2000194810A JP 37327298 A JP37327298 A JP 37327298A JP 37327298 A JP37327298 A JP 37327298A JP 2000194810 A JP2000194810 A JP 2000194810A
- Authority
- JP
- Japan
- Prior art keywords
- film
- copper wire
- tag
- substrate
- coiled copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
- G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
- G06K19/0739—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering the incapacitated circuit being part of an antenna
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、タグ情報を記憶し
たＩＣチップとアンテナを主な内部部品として持ち、物
品等に付与され、非接触で外部装置との間で情報等の交
信を行うＩＣタグ構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC which has an IC chip storing tag information and an antenna as main internal parts, is attached to an article or the like, and communicates information or the like with an external device in a non-contact manner. It is about tag structure.
【０００２】[0002]
【従来の技術】物品等に付与されているタグ情報を自動
的に読み取って識別するためのシステムとして、バーコ
ード方式によるものがあるが、より大量の情報を扱え、
遠隔読み出しが可能となるデータキャリアシステムと呼
ばれるＩＣタグシステムの開発が進んでいる。2. Description of the Related Art As a system for automatically reading and identifying tag information given to an article or the like, there is a system based on a barcode system, but a larger amount of information can be handled.
The development of an IC tag system called a data carrier system capable of remote reading is progressing.
【０００３】このＩＣタグシステムは物品等に取り付け
られるＩＣタグと呼ばれる応答器と、質問器で構成さ
れ、これら応答器と質問器との間で、磁気、誘導電磁
界、マイクロ波（電波）等の伝送媒体を介して非接触で
交信を行うものである。This IC tag system includes a transponder called an IC tag attached to an article or the like and an interrogator. Between these transponders and the interrogator, a magnetic field, an induced electromagnetic field, a microwave (radio wave), and the like are provided. The communication is carried out in a non-contact manner via the transmission medium described above.
【０００４】図１は従来のＩＣタグ構造を示す分解斜示
図である。１はタグ情報を記憶したＩＣチップであり、
２はアンテナとなるコイル状に巻かれた銅線である。コ
イル状銅線２の巻きはじめの接続端部２ａと巻き終わり
の接続端部２ｂはＩＣチップに直接接続され、ＩＣタグ
を構成する。また、図示していないが、コイル状銅線２
の接続端部２ａ、２ｂのＩＣチップ１への接続はＩＣチ
ップを基板に搭載し、該基板のパターンを介して接続す
る構造もある。FIG. 1 is an exploded perspective view showing a conventional IC tag structure. 1 is an IC chip storing tag information,
Reference numeral 2 denotes a copper wire wound in a coil shape to be an antenna. The connection end 2a at the beginning of winding and the connection end 2b at the end of winding of the coiled copper wire 2 are directly connected to an IC chip to constitute an IC tag. Although not shown, the coiled copper wire 2
For connection of the connection ends 2a and 2b to the IC chip 1, there is also a structure in which the IC chip is mounted on a substrate and connected via a pattern on the substrate.
【０００５】前記コイル状銅線２の接続端部２ａ、２ｂ
を前記ＩＣチップ１に接続した後、フィルム３、フィル
ム４を用い、上下から挟んで接着してＩＣダグを完成す
る。前記フィルムはポリエチレン等の樹脂をシート状に
形成したものを用い、熱溶着による方法で接着したり、
粘着剤を有するフィルムにて接着されている。また、Ｉ
Ｃタグを直接物品等に貼り付けて用いる場合、物品に貼
り付ける面をあらかじめ粘着剤を有するフィルムで構成
しておき、粘着剤を介して物品に貼り付けてタグ情報の
自動認識システムに用いている。The connection ends 2a, 2b of the coiled copper wire 2
Is connected to the IC chip 1, and then the film 3 and the film 4 are sandwiched and adhered from above and below to complete an IC tag. The film is formed of a resin such as polyethylene in the form of a sheet, or bonded by a method of heat welding,
It is adhered by a film having an adhesive. Also, I
When the C tag is directly attached to an article or the like and used, the surface to be attached to the article is formed of a film having an adhesive in advance, and the tag is attached to the article via the adhesive and used for an automatic tag information recognition system. I have.
【０００６】図２は従来のＩＣタグを物品に貼り付けた
状態を示す断面図である。フィルム３、フィルム４で挟
まれ接着されたＩＣチップ１とコイル状銅線２はフィル
ム３の片面（ＩＣチップとコイル状銅線を接着する面と
は反対側の面）の粘着剤を介して物品５に貼付されてい
る。FIG. 2 is a sectional view showing a state where a conventional IC tag is attached to an article. The IC chip 1 and the coiled copper wire 2 sandwiched and bonded by the film 3 and the film 4 are bonded via an adhesive on one surface of the film 3 (the surface opposite to the surface where the IC chip and the coiled copper wire are bonded). Affixed to article 5.
【０００７】[0007]
【発明が解決しようとする課題】ところで、物品に貼り
付けられたＩＣタグは貼り付けた物品そのもののタグ情
報を記憶しているものなので、一度貼り付けたＩＣタグ
が、他の物品に貼り替えられるようなことがあると、誤
ったタグ情報が認識されてしまい物品の取扱に悪影響を
与えてしまう。そこで、物品に一度貼ったＩＣタグは、
再度利用できないようなＩＣタグ構造にする必要があ
る。図３は、図２のＩＣタグを剥がした状態を示す断面
図である。図３に示すように、フィルム３とフィルム４
はそれぞれ分離して剥がれるが、ＩＣチップ１とコイル
状銅線２はフィルム４に接着されたまま剥がれてしまう
場合がある。この時ＩＣチップ１とコイル状銅線２がう
まく分離して剥がれれば、ＩＣタグは壊れてしまうので
使えなくなる。しかし、図３のような状態で剥がれる
と、ＩＣタグの機能上、ＩＣチップ１とコイル状銅線２
は接続されたままなので、これを他の物品に付け替えて
使用することができてしまう。そこで、本発明は一度物
品に貼付したＩＣタグを剥がそうとした場合に、剥がす
ことによってＩＣタグが破壊される構造を提供しようと
するものである。Since an IC tag attached to an article stores tag information of the attached article itself, the IC tag once attached is replaced with another article. In such a case, incorrect tag information is recognized, which adversely affects the handling of articles. Therefore, the IC tag once attached to the article
It is necessary to have an IC tag structure that cannot be used again. FIG. 3 is a sectional view showing a state where the IC tag of FIG. 2 is peeled off. As shown in FIG.
Are separated from each other, but the IC chip 1 and the coiled copper wire 2 may be separated while being adhered to the film 4. At this time, if the IC chip 1 and the coil-shaped copper wire 2 are separated and peeled off, the IC tag is broken and cannot be used. However, if the IC chip 1 and the coiled copper wire 2 are peeled off in the state shown in FIG.
Since is still connected, it can be used by replacing it with another article. In view of the above, an object of the present invention is to provide a structure in which when an IC tag once attached to an article is to be peeled, the IC tag is broken by peeling.
【０００８】[0008]
【課題を解決するための手段】アンテナとなるコイル状
銅線と、ＩＣチップを有し、該ＩＣチップが基板に搭載
され、前記基板のパターン部に接続され、さらに前記基
板のパターン部と前記コイル状銅線の接続端部とが接続
されて成るＩＣタグを二枚のフィルムで挟んで接着する
ＩＣタグ構造において、一方のフィルムは前記コイル状
銅線の一方の側面の全面に接着され、他方のフィルムは
前記コイル状銅線の他方の側面の全面又は一部分と接着
されない構造とする。The present invention has a coiled copper wire serving as an antenna and an IC chip. The IC chip is mounted on a substrate, connected to a pattern portion of the substrate, and further connected to the pattern portion of the substrate. In an IC tag structure in which an IC tag formed by connecting a connection end of a coiled copper wire is sandwiched between two films and bonded, one film is bonded to the entire surface of one side surface of the coiled copper wire, The other film has a structure that is not bonded to the entire surface or a part of the other side surface of the coiled copper wire.
【０００９】前記基板を前記コイル状銅線の内径よりも
大きくなるように形成し、前記基板のパターン部を前記
基板に設け、前記基板のパターン部にＩＣチップを接続
してＩＣモジュール部を構成し、前記基板のパターン部
の外周に前記コイル状銅線を搭載して前記基板のパター
ン部と前記コイル状銅線の接続端部を接続したＩＣタグ
構造とする。The substrate is formed so as to be larger than the inner diameter of the coiled copper wire, a pattern portion of the substrate is provided on the substrate, and an IC chip is connected to the pattern portion of the substrate to form an IC module portion. Then, an IC tag structure is provided in which the coiled copper wire is mounted on the outer periphery of the pattern portion of the substrate, and the connection end of the coiled copper wire is connected to the pattern portion of the substrate.
【００１０】前記ＩＣモジュール部と前記コイル状銅線
が、片面のみ粘着剤を有するフィルムと、前記フィルム
よりもその外形状が小さく、両面に粘着剤を有するフィ
ルムの二種類のフィルムで挟んで接着されたＩＣタグ構
造とする。The IC module portion and the coiled copper wire are bonded by being sandwiched between two types of films, a film having an adhesive on one side and a film having an outer shape smaller than that of the film and having an adhesive on both sides. IC tag structure.
【００１１】前記ＩＣモジュール部と前記コイル状銅線
が、片面のみ粘着剤を有するフィルムと、前記フィルム
よりもその外形状が小さく形成されたフィルム状粘着剤
とで挟んで接着されたＩＣタグ構造とする。An IC tag structure in which the IC module portion and the coiled copper wire are adhered by being sandwiched between a film having an adhesive only on one side and a film-like adhesive having an outer shape smaller than that of the film. And
【００１２】[0012]
【発明の実施の形態】図４は本発明の一実施形態を示す
ＩＣタグ構造の分解斜示図である。６はＩＣチップ７を
搭載するための基板である。８はコイル状に巻かれた銅
線で、ＩＣチップ７内のタグ情報を伝送するためのアン
テナとなるものである。前記基板６の外形状は前記コイ
ル状銅線８の外形状に合わせて円盤状に形成されてい
る。前記基板６は前記コイル状銅線８の内径よりも大き
く形成すればよく、円盤状に限らず方形状でもよい。前
記基板６にはその中央部付近にパターン部９、１０が設
けられ、基板６の中央部にＩＣチップ７を搭載し、該Ｉ
Ｃチップ７と前記パターン部９、１０がそれぞれワイヤ
ーボンディング等により接続され、ＩＣモジュールを構
成している。FIG. 4 is an exploded perspective view of an IC tag structure showing an embodiment of the present invention. Reference numeral 6 denotes a substrate on which the IC chip 7 is mounted. Reference numeral 8 denotes a coiled copper wire, which serves as an antenna for transmitting tag information in the IC chip 7. The outer shape of the substrate 6 is formed in a disk shape according to the outer shape of the coiled copper wire 8. The substrate 6 may be formed to be larger than the inner diameter of the coiled copper wire 8, and may be not only disc-shaped but also square. The substrate 6 is provided with pattern portions 9 and 10 near the center thereof, and the IC chip 7 is mounted at the center of the substrate 6.
The C chip 7 and the pattern portions 9 and 10 are connected to each other by wire bonding or the like to form an IC module.
【００１３】前記ＩＣモジュールのパターン部９、１０
の外周にコイル状銅線８を搭載し、前記コイル状銅線８
の接続端部８ａをパターン部９に、接続端部８ｂをパタ
ーン部１０へそれぞれハンダ付け等により接続する。前
記ＩＣモジュールとコイル状銅線８でＩＣタグを構成す
る。尚、前記コイル状銅線８は前記基板６上への固定
（接着剤等による）はしないものとする。The pattern portions 9, 10 of the IC module
The coiled copper wire 8 is mounted on the outer periphery of the coiled copper wire 8.
The connection end 8a is connected to the pattern section 9 and the connection end 8b is connected to the pattern section 10 by soldering or the like. The IC module and the coiled copper wire 8 constitute an IC tag. The coiled copper wire 8 is not fixed on the substrate 6 (with an adhesive or the like).
【００１４】前記ＩＣタグは、さらに粘着剤を有するフ
ィルム１１、１２で挟み込むようにして接着して構成す
る。前記フィルム１１はその両面に粘着剤を有するもの
を用い、フィルム１２は片面（ＩＣタグを挟み込む側）
のみに粘着剤を有するものを用いる。前記フィルム１１
はその外形状を前記フィルム１２の外形状より小さく形
成する。また、前記フィルム１１は粘着剤そのものをフ
ィルム状に形成したものを用いてもよい。前記フィルム
を張り合わせて構成した後、フィルム１１の外側の面
（ＩＣタグを挟んでいない面）の粘着剤を介して物品等
に貼り付けて自動認識システムに用いる。尚、フィルム
１１の物品等に貼り付ける側の粘着剤は他の粘着剤（フ
ィルム１１、フィルム１２のＩＣタグを挟む面の粘着
剤）よりも粘着力の強いもので構成すると良い。[0014] The IC tag is further adhered by being sandwiched between films 11 and 12 having an adhesive. The film 11 has a pressure-sensitive adhesive on both sides, and the film 12 has one side (the side where the IC tag is sandwiched).
Only those having an adhesive are used. The film 11
Is formed so that its outer shape is smaller than the outer shape of the film 12. The film 11 may be formed by forming the adhesive itself into a film. After the film is laminated, it is attached to an article or the like via an adhesive on the outer surface of the film 11 (the surface not sandwiching the IC tag) and used for an automatic recognition system. The pressure-sensitive adhesive on the side of the film 11 to be attached to an article or the like is preferably made of a material having a higher adhesive strength than other pressure-sensitive adhesives (pressure-sensitive adhesive on the surface of the film 11 or the film 12 sandwiching the IC tag).
【００１５】図５は、本発明の一実施形態のＩＣタグを
物品に貼り付けた状態を示す断面図で、図６は、図５の
ＩＣタグを剥がした状態を示す断面図である。１３は物
品であり、前記したＩＣタグがフィルム１１の粘着剤を
介して物品１３に貼り付けられている。ＩＣタグのコイ
ル状銅線８はフィルム１１側にのみ接着され、ＩＣチッ
プ７の搭載された基板６はフィルム１２に接着された状
態である。一度貼り付けられたＩＣタグを剥がそうとし
た場合、外形状の大きいフィルム１２の端部１２ａが摘
まれて剥がされることとなる。図６に示す断面図のよう
に、粘着力の強いフィルム１１は物品側に貼り付いたま
ま残り、フィルム１１よりも粘着力の弱いフィルム１２
が剥がれだす。コイル状銅線８はフィルム１１の粘着剤
によりフィルム１１側に残り、基板６はフィルム１２の
粘着剤によりフィルム１２に貼り付いたまま剥がされる
ことになる。コイル状銅線８と基板６は接着固定されて
いないので容易に分離可能である。また、基板６の径が
コイル状銅線８の外径よりも小さく、コイル状銅線８の
一部がフィルム１２に接着された状態であっても、基板
６とコイル状銅線８の接触面積が、フィルム１２とコイ
ル状銅線８の接着面積よりも大きければ容易に分離可能
である。このような状態でフィルムを全て剥がそうとす
ると、図示してないが、基板６のパターン部９、１０に
接続されたコイル状銅線８の接続端部８ａ、８ｂが切断
され、ＩＣタグが破壊される。このような構成にするこ
とで、一度物品等に貼付したＩＣタグを再度利用するこ
とができないようにしている。FIG. 5 is a sectional view showing a state in which the IC tag according to one embodiment of the present invention is attached to an article, and FIG. 6 is a sectional view showing a state in which the IC tag in FIG. 5 is peeled off. Reference numeral 13 denotes an article, and the above-described IC tag is attached to the article 13 via an adhesive of the film 11. The coiled copper wire 8 of the IC tag is bonded only to the film 11 side, and the substrate 6 on which the IC chip 7 is mounted is bonded to the film 12. When the IC tag once attached is to be peeled off, the end 12a of the film 12 having a large outer shape is pinched and peeled. As shown in the cross-sectional view of FIG. 6, the film 11 having a strong adhesive force remains adhered to the article side, and the film 12 having a weaker adhesive force than the film 11 is attached.
Begins to peel off. The coiled copper wire 8 remains on the film 11 side by the adhesive of the film 11, and the substrate 6 is peeled off while being adhered to the film 12 by the adhesive of the film 12. Since the coil-shaped copper wire 8 and the substrate 6 are not bonded and fixed, they can be easily separated. Further, even if the diameter of the substrate 6 is smaller than the outer diameter of the coiled copper wire 8 and a part of the coiled copper wire 8 is adhered to the film 12, the contact between the substrate 6 and the coiled copper wire 8 can be prevented. If the area is larger than the adhesion area between the film 12 and the coiled copper wire 8, it can be easily separated. If it is attempted to remove the entire film in such a state, the connection ends 8a and 8b of the coiled copper wire 8 connected to the pattern portions 9 and 10 of the substrate 6 are cut, though not shown, and the IC tag is Destroyed. With such a configuration, the IC tag once attached to the article or the like cannot be reused.
【００１６】[0016]
【発明の効果】コイル状銅線と基板（ＩＣモジュール
部）をフィルムで挟んで構成する場合、一方のフィルム
はコイル状銅線に接着させ、他方のフィルムはＩＣモジ
ュールに接着するように構成したので、ＩＣタグを剥が
そうとしたときには、コイル状銅線と基板（ＩＣモジュ
ール）が分離し易くなり、ＩＣタグを確実に破壊でき
る。よって不正目的等による貼り替え行為の防止にな
る。When the coiled copper wire and the substrate (IC module part) are sandwiched between films, one film is bonded to the coiled copper wire and the other film is bonded to the IC module. Therefore, when the IC tag is to be peeled, the coiled copper wire and the substrate (IC module) are easily separated, and the IC tag can be reliably broken. Therefore, it is possible to prevent a replacement operation due to an unauthorized purpose or the like.
【００１７】基板をコイル状銅線の内径よりも大きく形
成することで、一方のフィルムはコイル状銅線に接着さ
れ、他方のフィルムは基板に接着するので、ＩＣタグを
剥がそうとしたとき、コイル状銅線と基板が分離しやす
くなる。By forming the substrate larger than the inner diameter of the coiled copper wire, one film is adhered to the coiled copper wire, and the other film is adhered to the substrate. The coiled copper wire and the substrate are easily separated.
【００１８】ＩＣモジュール部とコイル状銅線が、片面
のみ粘着剤を有するフィルムと、前記フィルムよりもそ
の外形状が小さく、両面に粘着剤を有するフィルムの二
種類のフィルムで挟まれて接着されたＩＣタグを、前記
両面に粘着剤を有するフィルム側を物品に貼り付けるの
で、これを剥がす場合、外形状の大きい外側のフィルム
のみが剥がされるようになった。よってコイル状銅線と
基板が分離し易くなる。The IC module portion and the coiled copper wire are sandwiched and adhered by two kinds of films, a film having an adhesive on one side only and a film having an outer shape smaller than that of the film and having an adhesive on both sides. Since the IC tag is attached to the article with the film side having the adhesive on both sides, only the outer film having a large outer shape is peeled off when the IC tag is peeled off. Therefore, the coiled copper wire and the substrate are easily separated.
【図１】従来のＩＣタグ構造を示す分解斜示図。FIG. 1 is an exploded perspective view showing a conventional IC tag structure.
【図２】従来のＩＣタグを物品に貼り付けた状態を示す
断面図。FIG. 2 is a cross-sectional view showing a state where a conventional IC tag is attached to an article.
【図３】図２のＩＣタグを剥がした状態を示す断面図。FIG. 3 is a sectional view showing a state where the IC tag of FIG. 2 is peeled off;
【図４】本発明の一実施形態を示すＩＣタグ構造の分解
斜示図。FIG. 4 is an exploded perspective view of an IC tag structure showing one embodiment of the present invention.
【図５】本発明の一実施形態のＩＣタグを物品に貼り付
けた状態を示す断面図。FIG. 5 is a sectional view showing a state where the IC tag according to the embodiment of the present invention is attached to an article.
【図６】図５のＩＣタグを剥がした状態を示す断面図。FIG. 6 is a sectional view showing a state where the IC tag of FIG. 5 is peeled off.
１ ＩＣチップ ２ コイル状銅線 ３ フィルム ４ フィルム ５ 物品 ６ 基板 ７ ＩＣチップ ８ コイル状銅線 ８ａ 接続端部 ８ｂ 接続端部 ９ パターン部 １０ パターン部 １１ フィルム １２ フィルム １２ａ 端部 １３ 物品 DESCRIPTION OF SYMBOLS 1 IC chip 2 Coiled copper wire 3 Film 4 Film 5 Article 6 Substrate 7 IC chip 8 Coiled copper wire 8a Connection end 8b Connection end 9 Pattern part 10 Pattern part 11 Film 12 Film 12a End part 13 Article
Claims (4)
プを有し、該ＩＣチップが基板に搭載され、前記基板の
パターン部に接続され、さらに前記基板のパターン部と
前記コイル状銅線の接続端部とが接続されて成るＩＣタ
グを二枚のフィルムで挟んで接着するＩＣタグ構造にお
いて、一方のフィルムは前記コイル状銅線の一方の側面
の全面に接着され、他方のフィルムは前記コイル状銅線
の他方の側面の全面又は一部分とは接着されていない構
造であることを特徴とするＩＣタグ構造。A coiled copper wire serving as an antenna, and an IC chip, wherein the IC chip is mounted on a substrate, connected to a pattern portion of the substrate, and further provided with a pattern portion of the substrate and the coiled copper wire. In an IC tag structure in which an IC tag connected to the connection end of the coil is sandwiched between two films and bonded, one film is bonded to the entire surface of one side of the coiled copper wire, and the other film is An IC tag structure having a structure that is not bonded to the entire surface or a part of the other side surface of the coiled copper wire.
大きくなるように形成し、前記基板のパターン部を前記
基板に設け、前記基板のパターン部にＩＣチップを接続
してＩＣモジュール部を構成し、前記基板のパターン部
外周に前記コイル状銅線を搭載して前記基板のパターン
部と前記コイル状銅線の接続端部を接続したことを特徴
とする請求項１記載のＩＣタグ構造。2. An IC module section, wherein the board is formed to be larger than the inner diameter of the coiled copper wire, a pattern section of the board is provided on the board, and an IC chip is connected to the pattern section of the board. 2. The IC tag according to claim 1, wherein the coil-shaped copper wire is mounted on an outer periphery of a pattern portion of the substrate, and a connection portion between the pattern portion of the substrate and the coiled copper wire is connected. Construction.
が、片面のみ粘着剤を有するフィルムと、前記フィルム
よりもその外形状が小さく、両面に粘着剤を有するフィ
ルムの二種類のフィルムで挟んで接着されたことを特徴
とする請求項１又は２記載のＩＣタグ構造。3. The IC module portion and the coiled copper wire are sandwiched between two types of films: a film having an adhesive on one side only, and a film having an outer shape smaller than the film and having an adhesive on both sides. The IC tag structure according to claim 1, wherein the IC tag structure is adhered by:
が、片面のみ粘着剤を有するフィルムと、前記フィルム
よりもその外形状が小さく形成されたフィルム状粘着剤
とで挟んで接着されたことを特徴とする請求項１又は２
記載のＩＣタグ構造。4. The IC module part and the coiled copper wire are adhered by being sandwiched between a film having an adhesive only on one side and a film-like adhesive having an outer shape smaller than that of the film. 3. The method according to claim 1, wherein
The described IC tag structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37327298A JP4132333B2 (en) | 1998-12-28 | 1998-12-28 | IC tag structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37327298A JP4132333B2 (en) | 1998-12-28 | 1998-12-28 | IC tag structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000194810A true JP2000194810A (en) | 2000-07-14 |
| JP4132333B2 JP4132333B2 (en) | 2008-08-13 |
Family
ID=18501885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP37327298A Expired - Fee Related JP4132333B2 (en) | 1998-12-28 | 1998-12-28 | IC tag structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4132333B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6816125B2 (en) | 2003-03-01 | 2004-11-09 | 3M Innovative Properties Company | Forming electromagnetic communication circuit components using densified metal powder |
| US7102522B2 (en) | 2002-12-24 | 2006-09-05 | 3M Innovative Properties Company | Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same |
| CN112992523A (en) * | 2021-04-23 | 2021-06-18 | 昆山联滔电子有限公司 | Coil assembling process |
-
1998
- 1998-12-28 JP JP37327298A patent/JP4132333B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7102522B2 (en) | 2002-12-24 | 2006-09-05 | 3M Innovative Properties Company | Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same |
| US6816125B2 (en) | 2003-03-01 | 2004-11-09 | 3M Innovative Properties Company | Forming electromagnetic communication circuit components using densified metal powder |
| CN112992523A (en) * | 2021-04-23 | 2021-06-18 | 昆山联滔电子有限公司 | Coil assembling process |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4132333B2 (en) | 2008-08-13 |
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