JP4713332B2 - Contact probe device and circuit board inspection device - Google Patents

Description

  The present invention relates to a contact probe apparatus for performing electrical inspection by bringing a probe main body into contact with a probing object, and a circuit board inspection apparatus including the contact probe apparatus.

As this type of contact probe device, the applicant has proposed a probe unit for a chip component (hereinafter referred to as “probe unit”) capable of probing a solder fillet portion (hereinafter also referred to as “fillet portion”) in a chip component mounted on a circuit board. Is also disclosed in Japanese Utility Model Laid-Open No. 6-16871. This probe unit is formed in a rod shape as a whole by arranging two probes arranged with an insulating spacer in between in a cylindrical insulating holder. When probing with this probe unit, the moving mechanism lowers the insulating holder toward the inspection object (chip component) according to the control of the control unit, thereby bringing the tip portions of both probes into contact with the fillet portion. In addition, when the insulating holder is further lowered by the moving mechanism, both probes are slid relative to the insulating holder so that the coil spring disposed in the insulating holder is compressed. Thereby, the tip of the probe is pressed against the fillet by the repulsive force of the coil spring. In this case, in this probe unit, in order to make the tip part of both probes contact the desired probing position (in this example, both fillet parts) in a very narrow region while avoiding contact between both probes. The distance between the tips of both probes is adjusted by the thickness of the insulator sandwiched between the two probes. Therefore, the tip portions of both probes can be brought into contact with both fillet portions by simply lowering the insulating holder toward the inspection object on the circuit board. Thereafter, an electrical inspection is performed on the inspection object through both probes brought into contact with both fillet portions. Thereby, the probing for the inspection object is completed.
Japanese Utility Model Publication No. 6-16871 (page 7-10, FIG. 1-5)

  However, the probe unit disclosed by the applicant has the following problems to be improved. In other words, the probe unit disclosed by the applicant employs a configuration in which the tip portions of both probes are brought into contact with the inspection object from above. On the other hand, in today's circuit boards, in order to reduce the area occupied by the fillet part in order to achieve a fine pitch, the solder material and the amount of solder so that the surface of the fillet part is almost perpendicular to the circuit board. Is adjusted and the chip component is mounted. In addition, today, lead-free solder (lead-free solder) is generally used for forming the fillet, and the tip of the probe (probe body) is caused by the fact that lead-free solder is harder than normal solder. It is difficult to pierce the part into the fillet part. Therefore, when probing the inspection object, when the probe unit disclosed by the applicant is lowered toward the chip part, the tip of the probe slides down the surface of the fillet, and the surface of the circuit board. There is a risk of contact with the surface of the mounting pattern.

  The present invention has been made in view of such a problem to be improved, and it is a main object of the present invention to provide a contact probe device and a circuit board inspection device capable of reliably bringing the tip of the probe body into contact with an inspection object. And

In order to achieve the above object, in the contact probe device according to claim 1, an attachment portion for attachment to the probe guide mechanism and an abutment portion abutted against the inspection object are connected by a link mechanism, and the link mechanism is A pair of first arms having one end connected to the mounting portion, and a pair of second arms having one end connected to the first arm and the other end connected to the contact portion. wherein with the probe body to the other end of at least one of the two first arms are provided, said mounting portion is guided me by the said probe guide mechanism, in a direction toward and against the corresponding attachment portion Te wherein when the contact portion is allowed moved relative, the two second arms, the two first arm said with respect to the mounting portion so that the other ends of both the first arm is brought close to one another relative to It is rotated contacting the probe body from the side to the inspected object.

  In addition, in the configuration of “one end connected to the attachment portion” in the present invention, not only the configuration in which the one end portion of the first arm is directly connected to the attachment portion, but also other members (such as arms). The structure by which the one end part of the 1st arm is connected with the attachment part via is included. Similarly, the configuration that “one end portion is connected to the first arm” is not limited to the configuration in which the one end portion of the second arm is directly connected to the first arm, but also other members (such as an arm). Including a configuration in which one end portion of the second arm is connected to the first arm via the first end, and the configuration in which “the other end portion is connected to the contact portion” includes the other end portion of the second arm. Not only the structure directly connected to the contact part, but also the structure in which the other end of the second arm is connected to the contact part via another member (arm or the like) is included. In the present invention, the “probe body is disposed” includes not only the structure in which the probe body, which is formed separately from the first arm, is attached to the other end of the first arm, A configuration in which the probe main body is integrally formed at the other end of the arm is included.

  According to a second aspect of the present invention, there is provided the contact probe device according to the first aspect, wherein the probe main body is disposed at the other end of each of the first arms.

  Furthermore, the contact probe device according to claim 3 is the contact probe device according to claim 1 or 2, wherein each of the first arms has a shorter distance between the distal ends than a distance between the proximal ends. The two probe bodies are disposed at the other end.

  According to a fourth aspect of the present invention, there is provided the circuit board inspection apparatus according to any one of the first to third aspects, the probe guide mechanism, and the inspection object through the probe body in the contact probe apparatus. And a control unit that controls movement of the contact probe device by the probe guide mechanism and execution of the electrical inspection by the inspection unit.

According to the contact probe device of the first aspect , the mounting portion is guided by the probe guide mechanism including the pair of first arms and the pair of second arms, and the direction approaching the mounting portion (by the probe guide mechanism). when the guiding direction of the mounting portion contact portion in the opposite direction) was allowed moved relative both second arms relative to the mounting portion so as to approach the other ends of both the first arm with each other by that connects the mounting portion and the contact portion by Te both the first link mechanism to the arm is relatively rotated in contact with the probe body from the side to the test object, probing points in the test subject (e.g. Even when the surface of the fillet part) is formed to intersect with the substrate to be inspected at a large angle close to a right angle, The chromatography Bed body can reliably contact with the inspection object.

  Further, according to the contact probe device of the second aspect, since the probe main bodies are disposed on both the first arms, both side surfaces (for example, chip components) of the specimen object can be obtained by moving only one contact probe device. Since the probe main body can be brought into contact with both fillet portions in the above, the electrical inspection of the inspection object can be executed without using two contact probe devices.

  Furthermore, according to the contact probe device according to claim 3, by disposing both probe bodies on the other end of the first arm so that the distance between the distal ends is shorter than the distance between the proximal ends. Since the probe main body can be pressed from a substantially vertical direction (at a large angle) against the side surface of the object to be inspected, the probe main body is reliably brought into electrical contact with the side surface (fillet portion, etc.) of the object to be inspected. be able to.

  According to the circuit board inspection apparatus of the fourth aspect of the present invention, the electrical inspection of the inspection object is performed via any one of the contact probe apparatus, the probe guide mechanism, and the probe main body in the contact probe apparatus. By providing an inspection unit and a control unit that controls the movement of the contact probe device by the probe guide mechanism and the execution of the electrical inspection by the inspection unit, it reliably contacts the side surface (fillet portion, etc.) of the inspection object. The electrical inspection of the inspection object (chip component or the like) can be performed with high accuracy using the probe main body.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a contact probe device and a circuit board inspection device according to the invention will be described with reference to the accompanying drawings.

  First, the configuration of a circuit board inspection apparatus 1 including a contact probe apparatus according to the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the circuit board inspection apparatus 1 includes a probe unit 2, a moving mechanism 3, an inspection unit 4, and a control unit 5, and includes an inspection target substrate 10 on which various inspection objects such as chip parts are mounted. It is configured to perform electrical inspection. In this case, as shown in FIG. 2, a chip component 11, which is an example of an inspection object in the present invention, is mounted on the inspection object substrate 10. In this chip component 11, electrodes 11 a formed at both ends thereof are electrically connected to a conductor pattern (not shown) on the inspection target substrate 10 via a fillet portion 12.

  On the other hand, the probe unit 2 corresponds to a contact probe device according to the present invention. As shown in FIG. 2, the mounting portion 21, the pair of arms 22, 22, the pair of arms 23, 23 and the contact portion 24 are insulative. Are integrally formed of a resin material having In this case, in the probe unit 2, the pair of arms 22 and the pair of arms 23 constitute a link mechanism RM that is an example of a link mechanism in the present invention, and the attachment portion 21 and the abutting portion 24 are formed by the link mechanism RM. It is connected. One end of the mounting portion 21 (upper end in the figure: not shown) is attached to the moving mechanism 3, and a fulcrum (arc notch fulcrum) 31 is attached to the other end (lower end in the figure). A pair of arms 22 are connected via 31. The arm 22 corresponds to the first arm in the present invention, and is formed in an L shape in a side view as viewed from the front side in the figure. One end of the arm 22 is connected to the mounting portion 21, and the other end is A probe 25 corresponding to the probe main body in the present invention is attached. In this case, in this probe unit 2, the probes 25 are attached to both arms 22 so that the distance between the distal end portions 25a of both probes 25 is shorter than the distance between the proximal end portions 25b. Moreover, the base end part 25b of both the probes 25 is connected to the test | inspection part 4 via the signal cable.

  The arm 23 corresponds to the second arm in the present invention, one end of which is connected to the arm 22 via a fulcrum (arc notch fulcrum) 32 and the other end having a fulcrum (arc notch fulcrum) 33. It is connected to the contact part 24 via the contact. In this case, in the probe unit 2, the arm 23 is connected in the vicinity of the attachment position of the probe 25 in the arm 22. One end portion (upper end portion in the figure) of the abutment portion 24 is connected to the arm 23 and the other end portion (lower end portion in the figure) is brought into contact with the chip component 11. In addition, an elastic body 26 for avoiding a situation where the surface of the chip component 11 is damaged is disposed.

  The moving mechanism 3 corresponds to the probe guide mechanism in the present invention, and moves the probe unit 2 (attachment portion 21) toward the chip component 11 under the control of the control unit 5. The inspection unit 4 performs an electrical inspection on the chip component 11 and the like through the two probes 25 arranged in the probe unit 2 under the control of the control unit 5. The control unit 5 controls the movement of the probe unit 2 by the moving mechanism 3 and the electrical inspection of the chip component 11 by the inspection unit 4.

  Next, an electrical inspection method for the inspection target substrate 10 by the circuit board inspection apparatus 1 will be described with reference to the drawings.

First, the inspection target substrate 10 is set at a predetermined inspection position with the mounting surface of the chip component 11 or the like facing upward. Next, when the inspection start is instructed, the control unit 5 controls the moving mechanism 3 to move the probe unit 2 above the chip part 11 to be inspected as shown in FIG. Subsequently, the moving mechanism 3, the probe unit 2 toward the chip component 11 is lowered about the direction of the arrow A1. In this case, first, the elastic body 26 disposed at the lower end portion of the contact portion 24 contacts the surface of the chip component 11, and in this state, the attachment portion 21 is further lowered by the moving mechanism 3. abutment 24 is guided mounting portion by a "probe guide mechanism in the relatively upward movement is allowed is (present invention in the direction of the arrow B1 with respect to mounting portion 21, those in a direction toward and against the mounting portion an example of the operation of the "when the contact portion is allowed moved relative). Accordingly, both arms 23 are rotated with respect to the contact portion 24 in the direction of arrow C1, thereby rotating both arms 22 with respect to the mounting portion 21 in the direction of arrow D1 (" both " an example of the operation of the second arm, Ru is relatively rotating the two first arm relative to the mounting portion so that the other end of both the first arm is brought close to each other "). As a result, the probes 25 disposed on both arms 22 are moved as indicated by arrow E1, and as shown in FIG. 3, both tip portions 25a with respect to both fillet portions 12 from the side of the chip component 11 are shown. Is contacted.

  In this case, in the probe unit 2, as described above, the probes 25 are attached to both the arms 22 so that the distance between the distal end portions 25a of both probes 25 is shorter than the distance between the proximal end portions 25b. Therefore, as shown in FIGS. 2 and 3, the two probes 25 moved in the direction of the arrow E <b> 1 as the two arms 22 rotate with respect to the mounting portion 21 are viewed from a direction perpendicular to the surface of the fillet portion 12 ( (At an angle close to 90 °). As a result, the tip portions 25a of both probes 25 are sufficiently pushed into the fillet portion 12, and both probes 25 are electrically connected to both fillet portions 12 reliably. Next, the control unit 5 controls the inspection unit 4 to start an electrical inspection for the chip component 11. In response to this, the inspection unit 4 performs an electrical inspection (measurement of resistance value as an example) on the chip component 11 via both probes 25 brought into contact with both fillet portions 12.

  Subsequently, when the electrical inspection of the chip component 11 by the inspection unit 4 is completed, the control unit 5 controls the moving mechanism 3 to move the probe unit 2 upward above the chip component 11. At this time, as the mounting portion 21 is moved upward in the direction of the arrow A2 shown in FIG. 3 by the moving mechanism 3, both arms 23 are brought into contact with the contact portion 24 by elastic return of the fulcrums 31 to 33. And both arms 22 rotate in the direction of arrow D2 with respect to the attachment portion 21. As a result, the contact portion 24 is moved (lowered) relative to the mounting portion 21 in the direction of the arrow B2, and both the probes 25 arranged on the arm 22 are moved in the direction of the arrow E2 in the fillet portion 12. Separated from Thereby, the probing (electrical inspection of the chip component 11) for both fillet portions 12 is completed.

Thus, according to this probe unit 2, a pair of arms 22 and a pair of arms 23 are provided, and the mounting portion 21 is guided by the moving mechanism 3 and approaches the mounting portion 21 (by the moving mechanism 3). when the guiding direction of the mounting portion 21 contact portion 24 in the opposite direction) was allowed moved relative, the arms 23, the other ends of the arms 22 in the mounting portion 21 so as to approach each other The attachment portion 21 and the abutment portion 24 are connected to each other by the link mechanism RM that causes both the probes 22 to contact the object to be inspected (chip component 11 in this example) from the side by relatively rotating both the arms 22. Even when the surface of the fillet portion 12 is formed so as to intersect at a large angle close to a right angle with respect to the inspection target substrate 10 by being connected, It is possible to reliably contact the probe 25 is moving with respect to both the fillet portion 12.

  Further, according to the probe unit 2, since the probes 25 are disposed on both arms 22, respectively, the probes 25 can be brought into contact with both fillet portions 12 only by moving one probe unit 2. The electrical inspection of the chip component 11 can be performed without using two probe units.

  Furthermore, according to this probe unit 2, since both the probes 25 are disposed on the arm 22 so that the distance between the distal end portions 25a is shorter than the distance between the proximal end portions 25b, the surface of the fillet portion 12 can be reduced. Since the probe 25 can be pressed from a substantially vertical direction (at a large angle), the probe 25 can be reliably brought into electrical contact with the fillet portion 12.

  Further, according to the circuit board inspection apparatus 1, the probe unit 2, the moving mechanism 3, the inspection unit 4 that performs an electrical inspection on the inspection object via both probes 25, and the moving mechanism 3. By providing the control unit 5 that controls the movement of the probe unit 2 and the execution of the electrical inspection by the inspection unit 4, the chip component 11 can be detected using the probe 25 that is reliably brought into contact with both fillet portions 12. Electrical inspection can be performed with high accuracy.

  The present invention is not limited to the configuration exemplified in the above-described embodiment of the present invention. For example, the probe unit 2 employs a configuration in which the attachment portion 21 corresponding to the attachment portion in the present invention and the arm 22 corresponding to the first probe in the present invention are directly connected via the fulcrum 31. For example, as in the probe unit 2A shown in FIG. 4, it is possible to employ a configuration in which both the arms 22B, which are other examples of the first probe in the present invention, and the mounting portion 21 are connected via the arms 22A. . In the probe unit 2A shown in the figure and the probe units 2B to 2E (see FIGS. 5 to 8) described later, the same components as those of the probe unit 2 described above are denoted by the same reference numerals and overlapped. Description is omitted. In this probe unit 2A, both arms 22A are connected to the attachment portion 21 via a fulcrum 31, and both arms 22B are connected to an arm 22A via a fulcrum 34. Both arms 22A and both arms 22B The two arms 23 constitute a link mechanism RM1, which is another example of the link mechanism in the present invention. In this case, in the probe unit 2A, when the contact portion 24 is moved up relative to the mounting portion 21 during probing, both the arms 22B rotate with respect to the arm 22A, thereby providing a chip component. 11 (not shown), both probes 25 are brought into contact with the fillet portion 12 in the direction of an arrow E1. Accordingly, both probes 25 can be reliably brought into contact with the fillet portion 12 in the same manner as the probe unit 2 described above.

  Further, in the probe unit 2 described above, a configuration in which the arm 23 is connected in the vicinity of the attachment portion of the probe 25 in the arm 22 is adopted, but the connection position of the second arm with respect to the first arm is not limited to this. Specifically, for example, a probe unit 2B shown in FIG. 5, with respect to the arm 22C which is still another example of the first arm in the present invention, the connection portion side with the attachment portion 21 (near the connection portion) In the configuration, the arm 23 to which the contact portion 24A is attached can be connected via the fulcrum 32. In this probe unit 2B, the both arms 22C and both arms 23 constitute a link mechanism RM2, which is still another example of the link mechanism in the present invention. Also in this configuration, in the same manner as the probe unit 2 described above, both probes 25 are moved with respect to the fillet portion 12 by moving both probes 25 in the direction of arrow E1 from the side of the chip part 11 (not shown) during probing. Can be reliably contacted.

  Further, the shape of the mounting portion in the present invention is not limited to a straight line shape (bar shape) in the side view as in the above probe units 2, 2A, 2B. For example, as in the probe unit 2C shown in FIG. It can also be configured in a Y shape. In addition, the first arm in the present invention is not limited to the L shape in side view like the arm 22 in the probe unit 2 and the arm 22C in the probe unit 2B, but in side view like the arm 22D in the probe unit 2C. It can be configured in a straight line. In the probe unit 2C, a link mechanism RM3, which is still another example of the link mechanism in the present invention, is configured by the arms 22D and the arms 23. Also in this configuration, in the same manner as the probe unit 2 described above, both probes 25 are moved with respect to the fillet portion 12 by moving both probes 25 in the direction of arrow E1 from the side of the chip part 11 (not shown) during probing. Can be reliably contacted.

  Further, in the probe units 2 and 2A to 2C described above, the configuration in which the probes 25 are respectively disposed on both the first arms in the present invention is adopted, but for example, as in the probe unit 2D shown in FIG. A configuration in which the probe 25 is disposed only on one of the arms 22 and 22E corresponding to the first arm (in this example, the arm 22) can be employed. When this configuration is adopted, it is preferable to avoid crushing the fillet portion 12 during probing by, for example, chamfering the end portion P of the first arm (arm 22E) on the side where the probe 25 is not disposed.

  Furthermore, in the above probe units 2, 2A to 2D, the probe 25 corresponding to the probe main body in the present invention is formed separately from each arm and attached to the first arm. Like the probe unit 2E shown in FIG. 8, the tip 45 of the arm 22F, which is still another example of the first arm in the present invention, is sharply sharpened so that the probe 45 (the probe main body in the present invention is attached to the tip of the arm 22F). Another example) can be integrally formed. In this case, in the configuration in which the probe 45 is integrally formed at the tip of the arm 22F (first arm), both the arms 22F and other arms connected to the arm 22F are formed of a conductive material such as a metal material. Has been. Therefore, in this probe unit 2E, in order to bring both probes 45 into an electrically non-contact state, for example, as shown in FIG. The body 27 is sandwiched. Further, in order to ensure that the probe 45 is in contact with the fillet portion 12 during probing, the probe 45 is attached to both arms 22F so that the distance between the distal end portions 45a of both probes 45 is shorter than the distance between the proximal end portions 45b. Is preferably formed. In the probe unit 2E, a link mechanism RM, which is still another example of the link mechanism in the present invention, is configured by the arms 22F and the arms 23. Also in this configuration, in the same manner as the probe unit 2 described above, both probes 25 are moved with respect to the fillet portion 12 by moving both probes 25 in the direction of arrow E1 from the side of the chip part 11 (not shown) during probing. Can be reliably contacted.

  Further, the probe units 2 and 2A to 2E employ a configuration in which the arms and the like are connected via an arc notch fulcrum. The shape of each fulcrum constituting the link mechanism is an arc notch fulcrum. However, the present invention is not limited to this, and various fulcrums such as a hyperbolic notch fulcrum and an elliptic notch fulcrum can be employed.

1 is a block diagram showing a configuration of a circuit board inspection device 1. FIG. 4 is a side view of the probe unit 2 in a state of being positioned above the chip component 11. FIG. FIG. 3 is a side view of the probe unit 2 in a state in which probing is performed with respect to a chip component 11. It is a conceptual diagram which shows the structure of 2 A of probe units. It is a conceptual diagram which shows the structure of the probe unit 2B. It is a conceptual diagram which shows the structure of 2 C of probe units. It is a side view which shows the structure of probe unit 2D. It is a side view which shows the structure of the probe unit 2E.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 2,2A-2E Probe unit 3 Movement mechanism 4 Inspection part 5 Control part 10 Inspection object board 11 Chip component 12 Fillet part 21,21A Mounting part 22,22A-22F, 23 Arm 24,24A Contact part 25, 45 Probe 25a, 45a Tip portion 25b, 45b Base end portion 31-34 Support point RM, RM1-RM3 Link mechanism

Claims (4)

An attachment part for attaching to the probe guide mechanism and an abutting part to be brought into contact with the inspection object are connected by a link mechanism,
The link mechanism includes a pair of first arms having one end connected to the mounting portion, and a pair of second arms having one end connected to the first arm and the other end connected to the contact portion. wherein an arm with the probe body to the other end of at least one of the two first arms are provided, said mounting portion is guided me by the said probe guide mechanism, and pairs on the mounting portion when the contact portion in a direction toward was allowed moved relative, the two second arms, wherein the relative said mounting portion so that the other ends of both the first arm is brought close to one another A contact probe device in which both first arms are rotated relatively to bring the probe body into contact with the inspection object from the side thereof.   The contact probe device according to claim 1, wherein the probe main body is disposed at each of the other end portions of the first arms.   The contact probe device according to claim 2, wherein the two probe bodies are disposed at the other end portions of the first arms so that a distance between the distal end portions is shorter than a distance between the proximal end portions.   The contact probe device according to any one of claims 1 to 3, the probe guide mechanism, an inspection unit that performs an electrical inspection of the inspection object through the probe body in the contact probe device, A circuit board inspection apparatus comprising: a control unit that controls movement of the contact probe device by a probe guide mechanism and execution of the electrical inspection by the inspection unit.

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