JP2013015421A - Contact position specifying method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact position specifying method for specifying a position at which each of a plurality of ports comes into electrical contact with an inspection object substrate via probes.SOLUTION: A test substrate 15 on which a plurality of linear wirings (151 to 155) are formed while aligned in parallel to each other is set on a substrate wiring inspection device, and conduction states between the wirings (151 to 155) and respective ports of inspection signals are inspected. This inspection is conducted for both cases where the substrate 15 is set to a tool so that the wirings (151 to 155) are in parallel to the Y axis of the substrate mounting surface and another case where the substrate 15 is set to a tool so that the wirings (151 to 155) are in parallel to the X axis of the substrate mounting surface.

Description

  The present invention relates to a method for using a wiring inspection apparatus that performs electrical inspection of wiring formed on a substrate, and in particular, includes a plurality of ports that supply inspection signals and a plurality of probes that contact the substrate wiring. It relates to the method of checking the connection.

  2. Description of the Related Art There is known a board wiring inspection apparatus that inspects for defects such as disconnection and short circuit occurring in wiring of a printed circuit board (bare board) before mounting an electronic component (see the following patent document). The substrate wiring inspection apparatus inspects a wiring defect by supplying an electrical signal by bringing a probe into contact with a pad on the wiring of the substrate and measuring an electrical resistance or capacitance between the pads.

  There are roughly two methods for bringing a probe into contact with a substrate in a substrate wiring inspection apparatus. One is called a flying probe method and the other is called a jig method. The flying probe method is a method in which the probe is mechanically moved to contact an arbitrary position on the substrate. The jig method is a method in which a large number of probes are held by a jig made for a specific substrate and are brought into contact with the wiring of the substrate at a time. Since the jig method uses a dedicated jig made to fit a specific substrate, you can not inspect any substrate like the flying probe method, but there is no probe movement time, In general, inspection can be performed at a higher speed than the flying probe method.

  This jig method further includes a method using a universal jig and a method using a dedicated jig.

  In the case of a system using a universal jig, the board wiring inspection apparatus includes a general-purpose inspection head unit on which the universal jig is mounted. In the inspection head portion, a large number of electrode portions having a margin larger than that required for normal inspection are regularly arranged on a plane. The universal jig holds a plurality of needle-like probes so that one tip of each probe is guided to a predetermined position on the surface of the substrate and the other tip is guided to a predetermined electrode portion of the inspection head portion. Each electrode portion of the inspection head portion includes a spring that expands and contracts in response to the tip of the probe, and the end of the spring is connected to a port for supplying an inspection signal. By attaching a universal jig to the inspection head and pressing the probe protruding from the universal jig against the surface of the board, the pad to be inspected on the board is electrically connected to the electrode part via the universal jig. The

  On the other hand, in the case of a method using a dedicated jig, the board wiring inspection apparatus does not include the general-purpose inspection head as described above, and the dedicated jig has a plurality of electrode portions for contacting the tip of the probe. keeping. The dedicated jig holds a plurality of needle-like probes so that one tip of each probe is guided to a predetermined position on the surface of the substrate and the other tip is guided to a predetermined electrode portion. Each electrode portion includes a spring that expands and contracts in response to the tip of the probe, and a cable is fixed to the end of the spring. Each cable is connected to a predetermined port that supplies a test signal.

Japanese Patent Laid-Open No. 06-058973

  The dedicated jig method described above does not have to have a large number of electrode portions with a margin as in the universal jig method, so there is a merit that the device configuration can be simplified, while a large number of cables connected to the electrode portions are provided. There is a demerit that it is necessary to connect to the inspection signal port one by one.

  FIG. 14 is a diagram exemplifying the arrangement of the electrode portions and the number of the port to which the cable is connected in the dedicated jig. In the example of FIG. 14, a black circle represents an electrode part, and a number represents a port to which a cable is connected. For example, the operator connects the cables of the electrode portions one by one to the inspection signal port while looking at such a drawing. Since the number of inspection signal ports may reach several thousand, this cable connection work requires a considerable amount of time. In addition, since the connection work is performed manually while looking at the drawing, if the number of ports increases, a connection error may occur even if considerable care is taken. For this reason, usually, after the cable is connected, a process is provided in which the operator checks the continuity between the electrode part (or probe) and the inspection signal port one by one while looking at the drawing. Time is required.

  The present invention has been made in view of such circumstances, and an object of the present invention is to inspect each of a plurality of ports via a probe so that the work time required for jig cable connection work and conduction check work can be reduced. It is an object of the present invention to provide a contact position specifying method for specifying a position in electrical contact with a substrate.

The connection position specifying method according to the present invention is for inspecting the wiring of the substrate using a wiring inspection apparatus in which a plurality of probes that contact the substrate to be inspected and a plurality of ports that supply inspection signals are connected. , And a method for specifying a position where each of the plurality of ports is in electrical contact with the substrate via the probe. In this contact position specifying method, coordinates based on the first coordinate axis and the second coordinate axis are defined on the board mounting surface of the wiring inspection apparatus on which the board to be inspected is mounted.
The contact position specifying method is as follows:
A test substrate on which a plurality of linear wirings are arranged in parallel is set on the substrate mounting surface of the wiring inspection apparatus with the orientation determined so that the plurality of wirings are parallel to the first coordinate axis. The first step;
A second step of inspecting a conduction state between the plurality of wirings and the plurality of ports of the test substrate set on the substrate mounting surface in the first step by the wiring inspection device;
A test substrate on which a plurality of linear wirings are arranged in parallel is oriented on the substrate mounting surface of the wiring inspection apparatus so that the plurality of wirings are oriented in parallel with the second coordinate axis. A third step;
A fourth step of inspecting a conduction state between the plurality of wirings and the plurality of ports of the test substrate set on the substrate mounting surface in the third step by the wiring inspection device;
Information indicating coordinate components with respect to the second coordinate axes of the plurality of wirings of the test substrate set on the substrate mounting surface in the first step, and conduction with each of the plurality of ports in the second step. On the basis of the information on the wiring of the test substrate in which the detection is detected, a coordinate component with respect to the second coordinate axis at a position where each of the plurality of ports is in electrical contact with the substrate to be inspected via the probe. A fifth step to identify;
Information indicating coordinate components with respect to the first coordinate axis of the plurality of wirings of the test substrate set on the substrate mounting surface in the third step, and conduction with each of the plurality of ports in the fourth step. On the basis of the information on the wiring of the test substrate in which the detection is detected, the coordinate component with respect to the first coordinate axis at a position where each of the plurality of ports is in electrical contact with the substrate to be inspected via the probe. A sixth step to identify;
Have

Preferably, the plurality of wirings of the test substrate set on the substrate mounting surface in the first step and the third step are a plurality of tests different from the plurality of ports connected to the plurality of probes. Connected to the port for
In the second step, the plurality of test ports connected to the plurality of wirings of the test substrate set on the substrate mounting surface in the first step and the plurality of ports connected to the plurality of probes. Inspect the continuity with the port by the wiring inspection device,
In the fourth step, the plurality of test ports connected to the plurality of wirings of the test substrate set on the substrate mounting surface in the third step and the plurality of probes connected to the plurality of probes. A state of continuity with the port is inspected by the wiring inspection device.

Preferably, the plurality of probes are formed to extend linearly,
The wiring inspection apparatus includes:
A first jig having the substrate mounting surface from which one end of the plurality of probes contacting the substrate to be inspected protrudes;
A second jig for holding a plurality of conductive portions that are in contact with the other ends of the plurality of probes and are electrically connected to the plurality of ports;
With
In the first step, the second step, the third step, and the fourth step, the plurality of points at intersections of a predetermined lattice pattern including a straight line parallel to the first coordinate axis and a straight line parallel to the second coordinate axis. A third jig having the substrate mounting surface from which the one end of the probe protrudes is used instead of the first jig,
The plurality of wirings of the test substrate are formed at positions overlapping with the straight lines of the lattice pattern when mounted on the substrate mounting surface of the third jig.

  Preferably, in the contact position specifying method, when the third jig is used, the coordinates of the positions at which each of the plurality of conductive portions is in electrical contact with the substrate to be inspected via the probe; When using one jig, based on the information indicating the correspondence relationship between the position of each of the plurality of conductive portions in electrical contact with the substrate to be inspected via the probe, the fifth step and When the first jig is used in place of the third jig, the coordinates of the contact positions of the plurality of ports specified in the sixth step are to be inspected via the probe. A seventh step of converting into coordinates of a position in electrical contact with the substrate.

Preferably, the first jig holds at least a part of the plurality of probes obliquely with respect to the substrate mounting surface, and the third jig holds the plurality of probes on the substrate mounting surface. Hold vertically.
Alternatively, the first jig may hold the plurality of probes perpendicular to the substrate mounting surface, and the third jig may include at least a part of the plurality of probes with respect to the substrate mounting surface. May be held at an angle.
Alternatively, the first jig may hold at least a part of the plurality of probes obliquely with respect to the substrate mounting surface, and the third jig may hold at least a part of the plurality of probes. The plurality of probes may be held so as to be inclined with respect to the substrate mounting surface and so that the distribution of the one ends of the plurality of probes on the substrate mounting surface is different from that of the first jig.

  According to the present invention, by specifying the position where each of the plurality of ports is in electrical contact with the substrate to be inspected via the probe, each probe can be set as an arbitrary inspection port without referring to the drawings. It becomes possible to connect, the connection work becomes easy, and the continuity check after the connection becomes unnecessary.

It is a figure which shows an example of a structure of a board | substrate wiring inspection apparatus. It is a figure which shows an example of a structure of a 1st jig | tool and a 2nd jig | tool. It is a figure for demonstrating the method to attach an electroconductive part (spring) to a 2nd jig | tool. It is a figure which shows the example of the 3rd jig | tool for a test used instead of a 1st jig | tool. It is a figure which illustrates the position of the tip of a probe pin in the substrate mounting surface of the 3rd jig. It is a figure which shows the example of the board | substrate for a test used instead of the board | substrate of a test object. It is a figure which shows the positional relationship of the wiring of the board | substrate for a test with which the 3rd jig | tool was mounted | worn in the 1st process, and the tip of a probe pin. It is a figure which shows the positional relationship of the wiring of the board | substrate for a test with which the 3rd process was mounted | worn in the 3rd process, and the tip of a probe pin. It is a figure for demonstrating the correspondence of the position of the tip of a probe in the case of using a 1st jig | tool, and the position of the tip of a probe in the case of using the 3rd jig for a test. It is a 1st figure which shows the modification of a 1st jig | tool. It is a 1st figure which shows the modification of a 3rd jig | tool. It is a 2nd figure which shows the modification of a 1st jig | tool. It is a 2nd figure which shows the modification of a 3rd jig | tool. It is the figure which illustrated arrangement | positioning of the electrode part in a special jig | tool, and the number of the port of a cable connection destination.

FIG. 1 is a diagram illustrating an example of a configuration of a substrate wiring inspection apparatus.
The substrate wiring inspection apparatus shown in FIG. 1 includes a jig 20 that holds a plurality of probes 2 that contact a substrate 10 to be inspected, and a plurality of cables 3 that are electrically connected to the plurality of probes 2 inside the jig 20. And a terminal section 30 having a plurality of terminals to which a plurality of cables 3 are connected, and an inspection section 40 having a plurality of ports for supplying inspection signals to the plurality of terminals of the terminal section 30.

  The board wiring inspection apparatus shown in the example of FIG. 1 includes a jig 20, a plurality of cables 3, and a terminal unit 30 for inspecting both surfaces (upper side and lower side) of the board 10. The inspection unit 40 includes ports used for inspection of each surface of the substrate 10.

  The inspection unit 40 supplies electrical signals for inspection from any two ports, and measures the voltage and current between the probes, the resistance of the probe 2, the capacitance between the probe 2 and the reference potential, and the like. For example, the inspection unit 40 includes a signal generation circuit that generates an electrical signal, a measurement circuit that measures a voltage value and a current value between ports, an amplitude of an alternating current signal generated at the port, and the signal lines of the signal generation circuit and the measurement circuit. It has a scanner circuit that switches connection with each terminal of the terminal unit 30, and a control device (such as a computer) that controls the operation of these circuits.

  FIG. 2 is a diagram illustrating an example of the configuration of the jig 20 and represents a cross section perpendicular to a plane (substrate mounting surface) on which the substrate 10 to be inspected is mounted. In the example of FIG. 2, the jig 20 includes a first jig 21 that holds a plurality of probes 2 (2 </ b> A, 2 </ b> B), and a second jig 22 that is arranged on the first jig 21. .

The first jig 21 protrudes on the substrate mounting surface (upper surface in the drawing) on which the substrate 10 to be inspected is mounted, on the surface (lower surface in the drawing) facing the second jig 22. Each probe 2 (2A, 2B) is held so that the other tip is projected.
The tip of the probe 2 protruding upward on the board mounting surface is in contact with the wiring forming surface of the board 10. In the example of FIG. 2, two types of probes 2A and 2B with different contact partner electrode sizes are shown. The probe 2A having a thin tip is used for a pad of a surface mounting component, and the probe 2B having a thick tip is used for a land of a through-hole mounting component.
The tip of the probe 2 protruding downward on the surface facing the second jig 22 is in contact with the conductive portion 221 provided on the second jig 22.

  Further, as shown in FIG. 2, the first jig 21 holds a part of the probes 2 while being inclined with respect to the substrate mounting surface. This is because the distance between the probes 2 increases from a group of pads densely arranged in a fine and narrow wiring region of the substrate 10 toward the conductive portions 221 arranged at a wider interval.

  For example, as shown in FIG. 2, the first jig 21 has a plurality of plate-like members (211 to 214) in which through holes (H 11 to H 14) for guiding each probe 2 are formed. The plate-shaped member 211 is disposed on the side closest to the substrate 10, and the plate-shaped members 212, 213, and 214 are sequentially disposed from the plate-shaped member 211 toward the second jig 22 side.

  A plurality of through holes H11, H12, H13, and H14 through which one probe 2 is passed are formed in the plate-like members 211, 212, 213, and 214, respectively. Each probe 2 passes through four through holes (H11 to H14) formed in the four plate-like members (212 to 214), whereby the positions of the tips protruding from both sides of the first jig 21 are determined. ing.

  The plate-like members 211 and 212 are directly overlapped and fixed, the plate-like members 212 and 213 are fixed with a gap by a column 215, and the plate-like members 213 and 214 are fixed with a gap by a column 216.

  An elastic sheet-like member 217 (for example, a rubber sheet) is interposed between the plate-like members 213 and 214, and each probe 2 penetrates through this. When assembling the first jig 21, for example, the probe 2 is inserted in the order of the through holes H12, H13, and H14 from the upper through hole H11, and the probe 2 penetrates the sheet-like member 217 in the middle. As a result, the individual probes 2 are fixed to the sheet-like member 217 and are not easily detached from the through holes (H11 to H14), so that the probes 2 can be prevented from falling off the first jig 21. . For example, even if the first jig 21 is used with the top and bottom of FIG. 2 turned upside down, the probe 2 does not fall down.

  The second jig 22 is formed with a plurality of conductive portions 221 that come into contact with the tips of the plurality of probes 2 protruding from the first jig 21, and a plurality of holding portions S1 for holding the plurality of conductive portions 221. Plate member 220.

  The conductive portion 221 is an elastic member formed of a conductive material, and is constituted by a rod-shaped spring, for example, as shown in FIG. One end of the spring of the conductive portion 221 is processed so that the tip of the probe 2 is properly received. In the example of FIG. 2, there is a small-diameter portion wound thinly near the tip of the spring, and the winding diameter gradually increases from the small-diameter portion toward the tip. When the tip of the probe 2 hits the bowl-shaped tip, the spring of the conductive portion 221 urges the probe 2 in a direction to push it back toward the substrate 10. This biasing force generates an appropriate contact pressure at the contact points at both ends of the probe 2 to ensure stable conduction. The cable 3 is fixed to the other end of the spring that does not contact the probe 2.

  The holding part S <b> 1 has a vertically long hole that accommodates the spring of the conductive part 221. The tip of the probe 2 is inserted from the opening of the hole facing the first jig 21. A small-diameter through hole through which the spring of the conductive portion 221 does not pass is formed on the opposite side of the opening (the bottom of the holding portion S1), and the cable 3 is inserted into the small-diameter through-hole.

  FIG. 3 is a view for explaining a method of attaching the spring of the conductive portion 221 to the holding portion S1 of the plate-like member 220. The plate-like member 220 has an opening of the holding portion S1 on the surface that is combined with the first jig 21. When attaching the spring of the conductive part 221 to the holding part S1, first, the cable 3 fixed to the spring of the conductive part 221 is inserted through the through hole on the opposite side from this opening. Then, the cable 3 is pulled out from the through hole until the spring of the conductive portion 221 hits the bottom of the holding portion S1.

  When assembling the jig 20 shown in FIGS. 1 and 2, the first jig 21 and the second jig 22 are first assembled separately, and then both are combined. That is, for the first jig 21, the probe 2 is inserted into each through hole (H11 to H14) as shown in FIG. 2, and for the second jig 22, the conductive portion 221 as shown in FIG. These jigs (21, 22) are united together with the springs attached to the respective holding portions S1.

  However, in order to complete the jig 20, an operation of connecting the plurality of cables 3 drawn from the second jig 22 and the plurality of terminals of the terminal portion 30 is further required. This operation can also be performed by carefully connecting each cable 3 to a predetermined terminal with reference to a drawing as shown in FIG. However, this method has a demerit that it takes a very long time to perform the connection while referring to the drawings, and a check operation using a tester is required after the cable connection.

  Therefore, in the embodiment of the present invention, each of the plurality of ports of the inspection unit 40 is in electrical contact with the substrate 10 via the cable 3, the conductive unit 221, and the probe 2 using the contact position specifying method described below. Specify the position to perform. Even when the connection state between the cable 3 and the terminal portion 30 is unknown when the jig 20 is completed, the position where each inspection port is in electrical contact with the substrate 10 can be specified by using this method. . Thereby, since it is permitted to connect any cable 3 to any terminal of the terminal portion 30, it is not necessary to connect the cable 2 while referring to the drawing as shown in FIG.

  Here, the contact position specifying method according to the embodiment of the present invention will be described.

First step:
First, in the first step, a test third jig 23 (FIG. 4) is mounted on the second jig 22 instead of the first jig 21 (FIG. 2), and a test substrate is used instead of the substrate 10. 15 (FIG. 6) is set on the substrate mounting surface of the third jig 23 in a predetermined direction.

  FIG. 4 is a diagram showing an example of a test third jig 23 used in place of the first jig 21, and is perpendicular to the substrate mounting surface on which the substrate 10 is mounted as in FIG. 2. Represents a cross section. The third jig 23 shown in FIG. 4 has the same configuration (probe 2, plate-like members 211 to 214, columns 215 and 216, and sheet-like member 217) as the first jig 21 (FIG. 2). However, it differs from the first jig 21 in the manner of holding the probe 2. That is, a part of the probe 2 is inclined with respect to the substrate mounting surface in the first jig 21, but all the probes 2 are held perpendicular to the substrate mounting surface in the third jig 23. The through-holes (H11 to H14) of the plate-like members (211 to 214) are formed.

FIG. 5 is a diagram illustrating the position of the tip of the probe pin 2 on the board mounting surface of the third jig 23. In FIG. 5, “◯” represents the position where the tip of the probe pin 2 protrudes, and the symbols (P1, P5, etc.) attached to this “◯” represent the port of the inspection unit 40 to which the probe pin 2 is connected. . Further, the lattice-like pattern represented by dotted lines is illustrated for easy understanding that the positions of the tips of the probe pins 2 are regularly arranged on the substrate mounting surface of the third jig 23. .
As shown in FIG. 5, the third jig 23 holds each probe pin 2 so that the tip of the third jig 23 comes into contact with the substrate 15 at the intersection of a predetermined lattice pattern on the substrate mounting surface. The lattice pattern represented by the dotted line is composed of a straight line group extending in the X-axis direction (horizontal direction in the figure) and a straight line group extending in the Y-axis direction (vertical direction in the figure) on the substrate mounting surface.
Since the probe pins 2 are held perpendicular to the substrate mounting surface in the third jig 23, the conductive portions 221 of the second jig 22 are also regularly arranged at the intersection points of the lattice pattern similar to the above. .

  FIG. 6 is a diagram illustrating an example of a test substrate 15 used instead of the substrate 10 to be inspected. A plurality of linear wires (151 to 155) are formed in parallel on the substrate 15, and positioning guide holes F1 are formed at four corners. The wirings 151 to 155 are formed at positions overlapping the straight lines of the lattice pattern (FIG. 5) described above when the substrate 15 is mounted on the substrate mounting surface of the third jig 23. For example, when the substrate 15 is mounted on the third jig 23 so that the wirings 151 to 155 are parallel to the Y-axis direction, the wirings 151 to 155 overlap with a straight line extending in the Y-axis direction of the lattice pattern (FIG. 5). Further, when the substrate 15 is mounted on the third jig 23 so that the wirings 151 to 155 are parallel to the X-axis direction, the wirings 151 to 155 overlap with a straight line extending in the X-axis direction of the lattice pattern.

  The plurality of wirings (151 to 155) of the substrate 15 are directly connected to a plurality of test ports different from the ports connected to the probe 2 of the jig 20. That is, the wirings 151, 152, 153, 154, and 155 are connected to the test ports P1001, P1002, P1003, P1004, and P1005.

In the first step, the test substrate 15 is mounted on the third jig 23 with the straight wirings 151 to 155 oriented so as to be parallel to the Y-axis direction in the figure.
FIG. 7 is a diagram showing the positional relationship between the wiring of the substrate 15 mounted on the third jig 23 and the tip of the probe pin 2 in the first step, and the wiring (151 to 155) of the substrate 15 is represented by a dotted line. ing. Since the tip of each probe pin 2 is held by the third jig 23 so as to be positioned at the intersection of a predetermined lattice pattern (FIG. 1) on the substrate mounting surface (FIG. 5), it is in the Y-axis direction of the lattice pattern. It contacts any of the wirings 151 to 155 formed so as to be positioned on the extending straight line. In the example of FIG. 7, the ports P20, P5, and P8 are in contact with the wiring 151, the port P1 is in contact with the wiring 152, the ports P10 and P44 are in contact with the wiring 153, and the port P31 is in contact with the wiring 154.

Second step:
In the second step, conduction between the plurality of wirings (151 to 155) of the substrate 15 mounted on the third jig 23 in the first step and the plurality of ports connected to the plurality of probe pins 2 of the jig 20 is performed. The state is inspected by the inspection unit 40. Specifically, the conduction state between the test ports (P1001 to P1005) connected to the wirings 151 to 155 of the substrate 15 and the plurality of ports connected to the plurality of probe pins 2 of the jig 20 is inspected. .
Thereby, in the test | inspection part 40, the information of the port group in a conduction | electrical_connection state is obtained as a test result. For example, in the case of FIG. 7, the port group that conducts with the test port P1001 is [P5, P8, P20, P1001], the port group that conducts with the test port P1002 is [P1, P1002], and the test port P1003. A test result is obtained that [P10, P44, P1003] is a port group that is electrically connected to and [P31, P1001] is a port group that is electrically connected to the test port P1004.

Third step:
In the third step, as in the first step, the test substrate 15 (FIG. 6) is set on the third jig 23 with the third jig 23 (FIG. 4) mounted on the second jig 22. However, the mounting direction of the substrate 15 is different from that in the first step. That is, the test substrate 15 is mounted on the third jig 23 with the straight wirings 151 to 155 oriented so as to be parallel to the X-axis direction in the figure.
FIG. 8 is a diagram showing the positional relationship between the wiring (151 to 155) of the substrate 15 mounted on the third jig 23 and the tip of the probe pin 2 in the third step. Since the tip of each probe pin 2 is located at the intersection of a predetermined lattice pattern (FIG. 1), it contacts any of the wirings 151 to 155 formed at a position overlapping with a straight line extending in the X-axis direction of the lattice pattern. In the example of FIG. 8, the port P8 is in contact with the wiring 151, the port P10 is in contact with the wiring 152, the port P44 is in contact with the wiring 153, the ports P1 and P5 are in contact with the wiring 154, and the ports P20 and P31 are wiring. Contact 155.

Fourth step:
In the fourth step, conduction between the plurality of wirings (151 to 155) of the substrate 15 mounted on the third jig 23 in the third step and the plurality of ports connected to the plurality of probe pins 2 of the jig 20 is performed. The state is inspected by the inspection unit 40. Specifically, the conduction state between the test ports (P1001 to P1005) connected to the wirings 151 to 155 of the substrate 15 and the plurality of ports connected to the plurality of probe pins 2 of the jig 20 is inspected. .
Thereby, in the test | inspection part 40, the information of the port group in a conduction | electrical_connection state is obtained as a test result. For example, in the case of FIG. 8, the port group that conducts with the test port P1001 is [P8, P1001], the port group that conducts with the test port P1002 is [P10, P1002], and the port that conducts with the test port P1003. The group is [P44, P1003], the port group conducting with the test port P1004 is [P5, P1, P1004], and the port group conducting with the test port P1005 is [P20, P31, P1005]. The test result is obtained.

5th step:
In the fifth step, information indicating the X-coordinate components of the wirings 151 to 155 of the substrate 15 (FIG. 6) set in the third jig 23 of the substrate wiring inspection apparatus in the first step and obtained in the second step Based on the information of the port group in the conductive state, the X coordinate component of the position where each of the plurality of ports of the inspection unit 40 is in electrical contact with the substrate 15 via the probe 2 is specified.
For example, in the case of FIG. 7, since the X-coordinate component of the wiring 151 parallel to the Y axis is “x1”, the port group in which conduction with the wiring 151 is detected in the second step (conduction with the test port P1001 is It can be seen that the ports P5, P8, and P20 belonging to the detected port group are in electrical contact with the substrate 15 at the position where the X coordinate component is “x1”.

Step 6:
In the sixth step, information indicating the Y coordinate components of the wirings 151 to 155 of the substrate 15 (FIG. 6) set in the third jig 23 of the substrate wiring inspection apparatus in the third step and obtained in the fourth step Based on the information of the port group in the conductive state, the Y coordinate component of the position where each of the plurality of ports of the inspection unit 40 is in electrical contact with the substrate 15 via the probe 2 is specified.
For example, in the case of FIG. 8, since the Y coordinate component of the wiring 151 parallel to the X axis is “y1”, the port group in which the conduction with the wiring 151 is detected in the fourth step (the conduction with the test port P1001 is It can be seen that the port P8 belonging to the detected port group) is in electrical contact with the substrate 15 at the position where the Y coordinate component is “y1”.

  By combining the results of the fifth step and the sixth step, the coordinates of the position at which each of the plurality of ports of the inspection unit 40 is in electrical contact with the substrate 15 via the probe 2 (hereinafter simply referred to as “contact position coordinates”). Is identified). For example, the coordinates of the contact position of the port P8 are (x1, y1), and the coordinates of the contact position of the port P31 are (x4, y5).

Step 7:
Since the coordinates of the contact position of each port specified in the fifth step and the sixth step are the coordinates when the third jig 23 for testing is used, in the seventh step, the third treatment for testing is performed. A process of converting the coordinates when using the tool 23 into the coordinates when using the first jig 21 is performed.
That is, when the third jig 23 is used, the coordinates of the position at which each of the plurality of conductive portions 221 is in electrical contact with the substrate to be inspected via the probe 2 and when the first jig 21 is used. Each port identified in the fifth step and the sixth step based on the information indicating the correspondence relationship between the coordinates of the position where each of the plurality of conductive portions 221 is in electrical contact with the substrate to be inspected via the probe 2 When the first jig 21 is used instead of the third jig 23, the contact position coordinates are converted into the coordinates of the position where the port is in electrical contact with the substrate to be inspected via the probe 2. .

FIG. 9 is a view for explaining the correspondence between the position of the tip of the probe 2 when the first jig 21 is used and the position of the tip of the probe 2 when the third jig 23 for testing is used. FIG. In FIG. 9, the dotted line “◯” indicates the position of the tip of the probe 2 when the test third jig 23 is used, and the solid line “◯” indicates the probe 2 when the first jig 21 is used. Indicates the position of the tip of. The dotted line “◯” and the solid line “◯” associated with the arrows indicate the position of the tip of the probe 2 in contact with the same conductive part 221, and the position of the tip uses the first jig 21. It is shown that the case differs from the case where the third jig 23 is used.
As shown in FIG. 9, the position of the tip of the probe 2 (dotted line “◯”) when the third jig 23 for testing is used is the tip of the probe 2 when the first jig 21 is used. 1 to 1 (solid line “◯”). Therefore, if the coordinates of the dotted line “◯” are found from the results of the fifth step and the sixth step, the coordinates of the solid line “◯” are specified based on the one-to-one correspondence relationship previously grasped. Can do.

As described above, according to the contact position specifying method according to the embodiment of the present invention, the test substrate 15 in which the plurality of linear wires (151 to 155) are formed in parallel is formed on the substrate wiring inspection apparatus. In this state, the continuity between these wirings (151 to 155) and each port of the inspection signal is inspected. This inspection is performed when the substrate 15 is set on the jig so that the wiring (151 to 155) is parallel to the Y axis of the substrate mounting surface, and when the wiring (151 to 155) is parallel to the X axis of the substrate mounting surface. This is performed for each of the cases where the substrate 15 is set on a jig. Then, based on the inspection result when the wires (151 to 155) are parallel to the Y axis, the X coordinate component of the position where each port is in electrical contact with the substrate is specified, and the wires (151 to 155) Based on the inspection result when parallel to the axis, the Y coordinate component of the position where each port is in electrical contact with the substrate is specified.
Thereby, even after the cable 3 connected to each probe 2 is connected to the terminal of each port of the terminal portion 30, the coordinates of the position where each port is in electrical contact with the substrate can be specified. In the operation of connecting to the terminal, it is not necessary to refer to the drawing as shown in FIG. 14, and the cable 3 may be connected to an arbitrary terminal. Therefore, the connection work of the cable 3 becomes much easier than in the prior art, the work time can be greatly reduced, and the skill level threshold required for the operator can be lowered. Moreover, since it is not necessary to check the continuity after the cable 3 is connected, the working time can be further reduced.

In addition, according to the contact position specifying method according to the embodiment of the present invention, when testing the continuity between the wiring (151 to 155) of the test substrate 15 and each port of the test signal, the third test test is performed. The jig 23 is used instead of the first jig 21 for normal inspection. In the third jig 23 for testing, a plurality of probes 2 are held so that the tip ends protrude at the intersection of the lattice pattern including the straight line parallel to the X axis and the straight line parallel to the Y axis on the substrate mounting surface. The In the test substrate 15, linear wiring (151 to 155) is formed at a position that overlaps a straight line of a predetermined lattice pattern when mounted on the substrate mounting surface of the third jig 23.
As a result, when the test substrate 15 is mounted on the substrate mounting surface of the third jig 23, the tip of each probe 2 protruding on the substrate mounting surface reliably contacts the wiring (151 to 155) of the substrate 15. Can be made.

  In addition, this invention is not limited to embodiment mentioned above, Various modifications are included.

  In the first jig 21 shown in FIG. 2, a part of the probes 2 is held obliquely with respect to the substrate mounting surface. This is because a spring or the like is compared with the fine wiring pitch of the substrate 10. This is because it is necessary to widen the interval between the conductive portions 221 to be included. However, when the arrangement interval of the conductive portions 221 can be reduced to the wiring pitch of the substrate 10, for example, as shown in FIG. 10, even if each probe 2 is held perpendicular to the substrate mounting surface in the first jig 21. Good.

  In this case, for example, as shown in FIG. 11, the third jig 23 is an arbitrary probe 2 so that the tip of each probe 2 is guided to the intersection of the lattice pattern whose pitch is wider than the arrangement interval of the conductive portions 221. May be held obliquely with respect to the substrate mounting surface. Thereby, even when the arrangement interval of the conductive portions 221 is narrow, the width of the wirings (151 to 155) of the substrate 15 can be increased, so that the tips of the probes 2 are surely brought into contact with the wirings (151 to 155) of the substrate 15. be able to. Further, by widening the width of the wirings (151 to 155), durability can be enhanced, and the test substrate 15 can be repeatedly used for inspection of other jigs.

  The first jig 21 shown in the example of FIG. 12 is the same as the first jig 21 shown in FIG. 2 in that a part of the probes 2 is held obliquely with respect to the substrate mounting surface. The arrangement interval of the conductive portions 221 is narrower than that in the example of FIG. In such a case, as shown in FIG. 13, for example, the third jig 23 may be arbitrarily connected so that the tip of each probe 2 is guided to the intersection of the lattice pattern whose pitch is wider than the arrangement interval of the conductive portions 221. The probe 2 may be held while being inclined with respect to the substrate mounting surface.

  In the contact position specifying method according to the above-described embodiment, an example is given in which the test substrate 15 used in the first step and the second step is the same as the test substrate 15 used in the third step and the fourth step. However, in other embodiments of the present invention, different test substrates may be used.

  The configurations of the first jig 21 and the second jig 22 shown in FIG. 2 (the number of plate-like members, the presence or absence of sheet-like members, the insertion position, the type and number of probes, etc.) are merely examples, and the present invention includes this. It is not limited.

  In the contact position specifying method according to the above-described embodiment, the processes of the fifth step to the seventh step may be executed using a computer as described below, for example.

(5th process)
The storage part of the computer stores the identification information of the test port and the X coordinate of each wiring (151 to 155) when the substrate 15 connected to the test port is set on the third jig 23 in the first step. A table TB1 in which component information is associated is stored in advance. In the process of the fifth step, the X coordinate component associated with the test port identification information included in the information of the one port group determined to be in the conductive state in the second step is acquired from the table TB1. . Then, the acquired information of the X coordinate component is stored in the storage unit of the computer as the coordinate information of other ports belonging to the information of the one port group.

(6th process)
In the storage unit of the computer, the identification information of the test port and the Y coordinate of each wiring (151 to 155) when the substrate 15 connected to the test port is set on the third jig 23 in the second step. A table TB2 in which component information is associated is stored in advance. In the process of the sixth step, the Y coordinate component associated with the test port identification information included in the information of the one port group determined to be in the conductive state in the fourth step is acquired from the table TB2. . Then, the acquired information of the Y coordinate component is stored in the storage unit of the computer as the coordinate information of other ports belonging to the information of the one port group.

(Seventh step)
In the storage part of the computer, the probe 2 in contact with the same conductive part 221 contacts the substrate when the first jig 21 is used and the coordinate information of the position in contact with the substrate when the third jig 23 is used. A table TB3 in which the coordinate information of the position to be associated is stored in advance. When the first jig 21 is used instead of the third jig 23, the coordinate information of each port stored in the storage unit of the computer as a result of the fifth process and the sixth process is based on the table TB3. Is converted into coordinate information indicating the contact position of the probe 2.

  2, 2A, 2B ... probe, 3 ... cable, 10 ... substrate for inspection, 15 ... substrate for test, 20 ... jig, 21 ... first jig, 22 ... second jig, 23 ... third jig 30 ... terminal part 40 ... inspection part 211-214,220 ... plate member, 215,216 ... post, 217 ... sheet member, 221 ... conductive part, 151-155 ... test wiring

Claims (7)

In order to inspect the wiring of the substrate using a wiring inspection apparatus in which a plurality of probes that contact a substrate to be inspected and a plurality of ports that supply inspection signals are connected, each of the plurality of ports includes the probe. A contact position specifying method for specifying a position in electrical contact with the substrate via
Coordinates based on the first coordinate axis and the second coordinate axis are defined on the board mounting surface of the wiring inspection apparatus on which the board to be inspected is mounted,
A test substrate on which a plurality of linear wirings are arranged in parallel is set on the substrate mounting surface of the wiring inspection apparatus with the orientation determined so that the plurality of wirings are parallel to the first coordinate axis. The first step;
A second step of inspecting a conduction state between the plurality of wirings and the plurality of ports of the test substrate set on the substrate mounting surface in the first step by the wiring inspection device;
A test substrate on which a plurality of linear wirings are arranged in parallel is oriented on the substrate mounting surface of the wiring inspection apparatus so that the plurality of wirings are oriented in parallel with the second coordinate axis. A third step;
A fourth step of inspecting a conduction state between the plurality of wirings and the plurality of ports of the test substrate set on the substrate mounting surface in the third step by the wiring inspection device;
Information indicating coordinate components with respect to the second coordinate axes of the plurality of wirings of the test substrate set on the substrate mounting surface in the first step, and conduction with each of the plurality of ports in the second step. On the basis of the information on the wiring of the test substrate in which the detection is detected, a coordinate component with respect to the second coordinate axis at a position where each of the plurality of ports is in electrical contact with the substrate to be inspected via the probe. A fifth step to identify;
Information indicating coordinate components with respect to the first coordinate axis of the plurality of wirings of the test substrate set on the substrate mounting surface in the third step, and conduction with each of the plurality of ports in the fourth step. On the basis of the information on the wiring of the test substrate in which the detection is detected, the coordinate component with respect to the first coordinate axis at a position where each of the plurality of ports is in electrical contact with the substrate to be inspected via the probe. A sixth step to identify;
A method for specifying a contact position. The plurality of wirings of the test substrate set on the substrate mounting surface in the first step and the third step are a plurality of test ports different from the plurality of ports connected to the plurality of probes. Connected to
In the second step, the plurality of test ports connected to the plurality of wirings of the test substrate set on the substrate mounting surface in the first step and the plurality of ports connected to the plurality of probes. Inspect the continuity with the port by the wiring inspection device,
In the fourth step, the plurality of test ports connected to the plurality of wirings of the test substrate set on the substrate mounting surface in the third step and the plurality of probes connected to the plurality of probes. Inspecting the continuity with the port by the wiring inspection device,
The contact position specifying method according to claim 1. The plurality of probes are formed to extend linearly,
The wiring inspection apparatus includes:
A first jig having the substrate mounting surface from which one end of the plurality of probes contacting the substrate to be inspected protrudes;
A second jig for holding a plurality of conductive portions that are in contact with the other ends of the plurality of probes and are electrically connected to the plurality of ports;
With
In the first step, the second step, the third step, and the fourth step, the plurality of points at intersections of a predetermined lattice pattern including a straight line parallel to the first coordinate axis and a straight line parallel to the second coordinate axis. A third jig having the substrate mounting surface from which the one end of the probe protrudes is used instead of the first jig,
The plurality of wirings of the test substrate are formed at positions that overlap the straight lines of the lattice pattern when mounted on the substrate mounting surface of the third jig.
The contact position specifying method according to claim 1 or 2. When the third jig is used, the coordinates of the position where each of the plurality of conductive portions is in electrical contact with the substrate to be inspected via the probe, and when the first jig is used, the plurality The plurality of specified parts in the fifth step and the sixth step based on information indicating a correspondence relationship between coordinates of a position where each of the conductive portions electrically contacts the substrate to be inspected via the probe. When the first jig is used instead of the third jig, the coordinates of the contact positions of the ports are the positions where the plurality of ports are in electrical contact with the substrate to be inspected via the probe. Having a seventh step of converting to coordinates;
The contact position specifying method according to claim 3. The first jig holds at least a part of the plurality of probes obliquely with respect to the substrate mounting surface,
The third jig holds the plurality of probes perpendicular to the substrate mounting surface;
The contact position specifying method according to claim 3 or 4. The first jig holds the plurality of probes perpendicular to the substrate mounting surface,
The third jig holds at least a part of the plurality of probes obliquely with respect to the substrate mounting surface;
The contact position specifying method according to claim 3 or 4. The first jig holds at least a part of the plurality of probes obliquely with respect to the substrate mounting surface,
The third jig tilts at least a part of the plurality of probes obliquely with respect to the substrate mounting surface, and the distribution of the one end of the plurality of probes on the substrate mounting surface is the same as that of the first jig. Holding the plurality of probes differently,
The contact position specifying method according to claim 3 or 4.