JP4703386B2 - 折り畳み式情報処理装置 - Google Patents
折り畳み式情報処理装置 Download PDFInfo
- Publication number
- JP4703386B2 JP4703386B2 JP2005347247A JP2005347247A JP4703386B2 JP 4703386 B2 JP4703386 B2 JP 4703386B2 JP 2005347247 A JP2005347247 A JP 2005347247A JP 2005347247 A JP2005347247 A JP 2005347247A JP 4703386 B2 JP4703386 B2 JP 4703386B2
- Authority
- JP
- Japan
- Prior art keywords
- fpc
- printed circuit
- circuit board
- hinge
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000010365 information processing Effects 0.000 title 1
- 238000004891 communication Methods 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 6
- 229930040373 Paraformaldehyde Natural products 0.000 description 5
- 229920006324 polyoxymethylene Polymers 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011205 natural fiber plastic composite Substances 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- -1 polyoxymethylene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42F—SHEETS TEMPORARILY ATTACHED TOGETHER; FILING APPLIANCES; FILE CARDS; INDEXING
- B42F7/00—Filing appliances without fastening means
- B42F7/06—Filing appliances comprising a plurality of pockets or compartments, e.g. portfolios or cases with a plurality of compartments
- B42F7/065—Filing appliances comprising a plurality of pockets or compartments, e.g. portfolios or cases with a plurality of compartments made of transparent material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R35/00—Flexible or turnable line connectors, i.e. the rotation angle being limited
- H01R35/02—Flexible line connectors without frictional contact members
- H01R35/025—Flexible line connectors without frictional contact members having a flexible conductor wound around a rotation axis
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
- H04M1/0216—Foldable in one direction, i.e. using a one degree of freedom hinge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42P—INDEXING SCHEME RELATING TO BOOKS, FILING APPLIANCES OR THE LIKE
- B42P2201/00—Books or filing appliances for special documents or for special purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/16—Connectors or connections adapted for particular applications for telephony
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Pivots And Pivotal Connections (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
110 可動側筐体
120 固定側筐体
130 ヒンジ部
160 センターシャフト
163 センターパイプ
170 フレキシブルプリント回路基板
180、180A 保護手段
Claims (7)
- 2つの筐体を折り畳み可能に結合するヒンジ部と、
前記ヒンジ部を通過し、前記2つの筐体を電気的に接続するクランク型構造のフレキシブルプリント回路基板と、
前記フレキシブルプリント回路基板の端面を前記ヒンジ部との接触から保護する保護手段とを有することを特徴とする移動式無線通信装置。 - 前記保護手段は、前記ヒンジ部の内面に設けられて前記フレキシブルプリント回路基板の端面が前記ヒンジ部に接触することを防止して前記フレキシブルプリント回路基板の端面と接触する樹脂部材であることを特徴とする請求項1記載の移動式無線通信装置。
- 前記樹脂部材はテープであることを特徴とする請求項2記載の移動式無線通信装置。
- 前記保護手段は、前記フレキシブルプリント回路基板に設けられ、前記ヒンジ部の内面に沿って延び、前記フレキシブルプリント回路基板の端面の代わりに前記ヒンジ部と接触する部材であることを特徴とする請求項1記載の移動式無線通信装置。
- 前記部材は、前記フレキシブルプリント回路基板の一部であることを特徴とする請求項4記載の移動式無線通信装置。
- 前記フレキシブルプリント回路基板は複数層から構成され、
前記部材は、両端の層のいずれか一層であることを特徴とする請求項4記載の移動式無線通信装置。 - 前記部材は、前記フレキシブルプリント回路基板の信号線を含まないことを特徴とする請求項5又は6記載の移動式無線通信装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005347247A JP4703386B2 (ja) | 2005-11-30 | 2005-11-30 | 折り畳み式情報処理装置 |
KR1020060013362A KR100758824B1 (ko) | 2005-11-30 | 2006-02-13 | 절첩식 정보 처리 장치 |
US11/359,388 US7534120B2 (en) | 2005-11-30 | 2006-02-23 | Foldable information processing apparatus having protected crank-type structured flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005347247A JP4703386B2 (ja) | 2005-11-30 | 2005-11-30 | 折り畳み式情報処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007157793A JP2007157793A (ja) | 2007-06-21 |
JP4703386B2 true JP4703386B2 (ja) | 2011-06-15 |
Family
ID=38088103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005347247A Expired - Fee Related JP4703386B2 (ja) | 2005-11-30 | 2005-11-30 | 折り畳み式情報処理装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7534120B2 (ja) |
JP (1) | JP4703386B2 (ja) |
KR (1) | KR100758824B1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4583307B2 (ja) * | 2003-07-28 | 2010-11-17 | 富士通株式会社 | 移動式無線通信装置 |
JP4315955B2 (ja) * | 2003-07-28 | 2009-08-19 | 富士通株式会社 | 移動式無線通信装置 |
JP2007184765A (ja) * | 2006-01-06 | 2007-07-19 | Nec Saitama Ltd | 携帯情報端末及びその組立方法 |
JP2009015544A (ja) * | 2007-07-04 | 2009-01-22 | Hioki Ee Corp | 折畳み電気計測器 |
US8866840B2 (en) * | 2008-09-08 | 2014-10-21 | Qualcomm Incorporated | Sending a parameter based on screen size or screen resolution of a multi-panel electronic device to a server |
TWI365578B (en) * | 2008-10-15 | 2012-06-01 | Inventec Corp | Hinge structure with a dc-in |
JP5515171B2 (ja) * | 2009-12-18 | 2014-06-11 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板、筐体構造、電子機器 |
JP7033941B2 (ja) * | 2018-02-01 | 2022-03-11 | 株式会社ワコム | センサシステム |
CN108425938B (zh) * | 2018-06-06 | 2020-01-10 | 合肥联宝信息技术有限公司 | 一种调节装置及电子设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04263494A (ja) * | 1991-02-19 | 1992-09-18 | Fujitsu Ltd | ケーブルの配設方法 |
JPH1041594A (ja) * | 1996-07-23 | 1998-02-13 | Toshiba Corp | フレキシブルプリント回路基板 |
JPH1153056A (ja) * | 1997-06-20 | 1999-02-26 | Compaq Computer Corp | 音道付きスピーカ・キャビネットを備えたポータブル・コンピュータ・システム |
JP2003198156A (ja) * | 2001-12-26 | 2003-07-11 | Matsushita Electric Ind Co Ltd | 折畳式電気機器 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4825395A (en) * | 1986-05-29 | 1989-04-25 | Hewlett-Packard Company | Apparatus with torsionally stressed conductors routed through a hollow articulated hinge |
JPH04315250A (ja) * | 1991-04-12 | 1992-11-06 | Matsushita Electric Ind Co Ltd | 電子機器装置 |
US5834705A (en) * | 1994-03-04 | 1998-11-10 | Silicon Graphics, Inc. | Arrangement for modifying eletrical printed circuit boards |
TW280962B (en) * | 1995-02-24 | 1996-07-11 | Sanyo Electric Co | Battery charger and a solar battery used for charging a battery |
US6215454B1 (en) * | 1998-02-20 | 2001-04-10 | Qualcomm, Inc. | Multi-layered shielded substrate antenna |
US6439905B2 (en) * | 1998-05-29 | 2002-08-27 | Nokia Mobile Phones Limited | Electrical connector with a loop and helical turn |
JP2000010661A (ja) * | 1998-06-18 | 2000-01-14 | Mitsubishi Electric Corp | 携帯型情報処理装置および携帯型情報処理装置用カバー、卓上型情報処理装置 |
JP3066802B1 (ja) * | 1998-12-10 | 2000-07-17 | 日本航空電子工業株式会社 | ヒンジコネクタ |
JP2001143797A (ja) * | 1999-11-17 | 2001-05-25 | Kel Corp | ケーブルコネクタ |
AT410728B (de) * | 2001-02-09 | 2003-07-25 | Pollmann Austria Ohg | Verfahren zum einbetten zumindest einer flexiblen leiterbahnfolie in kunststoff, leiterbahneneinheitsowie einbettungseinheit hiefür |
JP2002368440A (ja) * | 2001-06-06 | 2002-12-20 | Toshiba Corp | 折り畳み型電子機器とそのフレキシブル基板 |
JP4199451B2 (ja) | 2001-12-21 | 2008-12-17 | 埼玉日本電気株式会社 | キャップ実装構造 |
JP2004007218A (ja) | 2002-05-31 | 2004-01-08 | Toshiba Corp | 折畳み式携帯情報端末 |
JP3710780B2 (ja) * | 2002-11-29 | 2005-10-26 | 京セラ株式会社 | コネクタ接続部構造及びこれを用いた携帯端末装置 |
TWI233771B (en) * | 2002-12-13 | 2005-06-01 | Victor Company Of Japan | Flexible rigid printed circuit board and method of fabricating the board |
US7148785B2 (en) * | 2003-05-02 | 2006-12-12 | Tyco Electronics Corporation | Circuit protection device |
US7054147B2 (en) * | 2003-09-11 | 2006-05-30 | Nokia Corporation | Double articulated hinge mechanism for electronic devices |
-
2005
- 2005-11-30 JP JP2005347247A patent/JP4703386B2/ja not_active Expired - Fee Related
-
2006
- 2006-02-13 KR KR1020060013362A patent/KR100758824B1/ko not_active IP Right Cessation
- 2006-02-23 US US11/359,388 patent/US7534120B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04263494A (ja) * | 1991-02-19 | 1992-09-18 | Fujitsu Ltd | ケーブルの配設方法 |
JPH1041594A (ja) * | 1996-07-23 | 1998-02-13 | Toshiba Corp | フレキシブルプリント回路基板 |
JPH1153056A (ja) * | 1997-06-20 | 1999-02-26 | Compaq Computer Corp | 音道付きスピーカ・キャビネットを備えたポータブル・コンピュータ・システム |
JP2003198156A (ja) * | 2001-12-26 | 2003-07-11 | Matsushita Electric Ind Co Ltd | 折畳式電気機器 |
Also Published As
Publication number | Publication date |
---|---|
US7534120B2 (en) | 2009-05-19 |
KR100758824B1 (ko) | 2007-09-19 |
US20070123078A1 (en) | 2007-05-31 |
JP2007157793A (ja) | 2007-06-21 |
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