JP4697853B2 - 圧力スイッチおよびその製造方法 - Google Patents
圧力スイッチおよびその製造方法 Download PDFInfo
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- JP4697853B2 JP4697853B2 JP2005006345A JP2005006345A JP4697853B2 JP 4697853 B2 JP4697853 B2 JP 4697853B2 JP 2005006345 A JP2005006345 A JP 2005006345A JP 2005006345 A JP2005006345 A JP 2005006345A JP 4697853 B2 JP4697853 B2 JP 4697853B2
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- electrode
- pressure
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- flexible partition
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- 238000004519 manufacturing process Methods 0.000 title description 26
- 239000000758 substrate Substances 0.000 claims description 131
- 238000005192 partition Methods 0.000 claims description 65
- 239000004065 semiconductor Substances 0.000 claims description 27
- 238000006073 displacement reaction Methods 0.000 claims description 20
- 238000009792 diffusion process Methods 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 16
- 239000011521 glass Substances 0.000 description 13
- 238000012544 monitoring process Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009795 derivation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
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- Measuring Fluid Pressure (AREA)
Description
5;ICタグリーダ、10;第1基板部材、11;可撓性隔壁、
12;半導体基板、13、25;切換電極、13a、13b、13c;電極体、
14、26;固定電極、15;密閉室、16;絶縁膜、
17a、17b、17c、27;電極体導出部、18、28;共通電極導出部、
19;結合段部、20;第2基板部材、21;通気孔、22;ガラス基板、
23、24;共通電極、29;導通スルーホール、30;第3基板部材、32;ガラス板、
40;シリコンウエファ、42;拡散層、44;絶縁層、45;電極層、
46;空洞、48;肉薄部分、50;ガラス平板、52;導電パターン。
Claims (2)
- 表面に共通の第1電極を設けた可撓性隔壁の第1基板部材と、表面に複数個の切換用第2電極を設けて前記可撓性隔壁に対向配置した第2基板部材と、この可撓性隔壁の裏面側に形成した空洞の開口に第3基板部材とを備え、前記空洞内を所定圧力に調整した密閉室とし、前記第2基板部材は通気孔を有する平板部材であり、前記可撓性隔壁の外周部で張り合わせ、前記可撓性隔壁の両面に作用する圧力差の度合で生ずる撓み変位を、予め設定する閾値により、前記第1電極および前記第2電極を接離させてスイッチングする圧力スイッチ。
- 第1基板部材は一方の面に不純物拡散層を形成し、他方の面に空洞と肉薄部分をエッチングにより調製した半導体基板からなり、前記共通電極および可撓性隔壁が単一基板上に形成されたことを特徴とする請求項1に記載の圧力スイッチ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005006345A JP4697853B2 (ja) | 2005-01-13 | 2005-01-13 | 圧力スイッチおよびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005006345A JP4697853B2 (ja) | 2005-01-13 | 2005-01-13 | 圧力スイッチおよびその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006194734A JP2006194734A (ja) | 2006-07-27 |
JP2006194734A5 JP2006194734A5 (ja) | 2008-01-24 |
JP4697853B2 true JP4697853B2 (ja) | 2011-06-08 |
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JP2005006345A Active JP4697853B2 (ja) | 2005-01-13 | 2005-01-13 | 圧力スイッチおよびその製造方法 |
Country Status (1)
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JP (1) | JP4697853B2 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH023629U (ja) * | 1988-06-17 | 1990-01-11 | ||
JPH04368736A (ja) * | 1991-06-17 | 1992-12-21 | Toyota Autom Loom Works Ltd | 圧力スイッチ |
JPH0553096U (ja) * | 1991-12-17 | 1993-07-13 | セイコー電子工業株式会社 | 圧力スイッチ |
JPH06267382A (ja) * | 1993-03-16 | 1994-09-22 | Seiko Instr Inc | 圧力スイッチ及びその製造方法 |
JPH06275179A (ja) * | 1993-03-17 | 1994-09-30 | Fujikura Ltd | 圧力スイッチ |
JP2000121473A (ja) * | 1998-10-14 | 2000-04-28 | Fuji Electric Co Ltd | 静電容量式絶対圧検出器 |
WO2004068096A1 (ja) * | 2003-01-30 | 2004-08-12 | Fujikura Ltd. | 半導体圧力センサ及びその製造方法 |
-
2005
- 2005-01-13 JP JP2005006345A patent/JP4697853B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH023629U (ja) * | 1988-06-17 | 1990-01-11 | ||
JPH04368736A (ja) * | 1991-06-17 | 1992-12-21 | Toyota Autom Loom Works Ltd | 圧力スイッチ |
JPH0553096U (ja) * | 1991-12-17 | 1993-07-13 | セイコー電子工業株式会社 | 圧力スイッチ |
JPH06267382A (ja) * | 1993-03-16 | 1994-09-22 | Seiko Instr Inc | 圧力スイッチ及びその製造方法 |
JPH06275179A (ja) * | 1993-03-17 | 1994-09-30 | Fujikura Ltd | 圧力スイッチ |
JP2000121473A (ja) * | 1998-10-14 | 2000-04-28 | Fuji Electric Co Ltd | 静電容量式絶対圧検出器 |
WO2004068096A1 (ja) * | 2003-01-30 | 2004-08-12 | Fujikura Ltd. | 半導体圧力センサ及びその製造方法 |
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JP2006194734A (ja) | 2006-07-27 |
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