JP4693297B2 - Radiation imaging apparatus and radiation imaging system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a fiber plate (also referred to as a fiber optic plate), a radiation imaging apparatus, a manufacturing method thereof, and a radiation imaging system including the same, and in particular, a conversion unit that converts radiation into light, and an optical signal as light. This is particularly relevant to a fiber plate used for a radiation imaging apparatus including a photoelectric conversion element that converts light into a photoelectric conversion element for guiding light from conversion means to the photoelectric conversion element.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there is a need for a radiation imaging apparatus, particularly an X-ray imaging apparatus for medical purposes, which can capture an X-ray moving image, has excellent image quality, is thin, and has a large area input range. In addition, not only for medical use, but also for industrial nondestructive inspection machines and the like, a thin and inexpensive large-area X-ray imaging apparatus is required.
[0003]
As such an X-ray imaging device, for example, (1) an X-ray detection device (1) having a large area by preventing the non-light receiving portion (peripheral circuit) of the CCD sensor from interfering with each other by inclining the fiber of the fiber plate For example, U.S. Pat. No. 5,563,414), (2) X-ray detection apparatus (for example, U.S. Pat. No. 5,834,782) having a large area so that the non-light-receiving portion of the CCD sensor does not interfere with the thickness of the fiber plate There is.
[0004]
FIG. 37 shows a schematic cross-sectional view of the X-ray detection apparatus having the configuration (1). FIG. 37 shows a phosphor 3 composed of a scintillator that converts X-rays into visible light, an individual fiber plate 2A such as an optical fiber that guides the visible light converted by the phosphor 3 to the image sensor 1, and an individual fiber plate 2A. 2 shows an X-ray detection apparatus having an image pickup device 1A that converts visible light guided by 1 into an electric signal.
[0005]
In this X-ray imaging apparatus, the individual fiber plate 2A is inclined with respect to the image sensor 1A, and a processing circuit for processing an electrical signal from each image sensor 1A is provided between the individual fiber plates 2A. Yes.
[0006]
FIG. 38 is a schematic perspective view of the X-ray detection apparatus having the configuration (2). In FIG. 38, the same parts as those in FIG. 37 are denoted by the same reference numerals. As shown in FIG. 38, the length of the fiber plate 2 is partially changed, for example, by providing a step for each set of three image pickup devices 1 as a set, each image pickup device 1 is provided with a processing circuit or the like. I am trying to do it.
[0007]
[Problems to be solved by the invention]
However, the configuration of (1) has a light guide surface (light incident / exit surface) that obliquely intersects the axis of the optical fiber, and is arranged so that the optical fiber axes of the respective fiber plates intersect each other. Has been. With this configuration, it is difficult to further reduce the size of the X-ray imaging apparatus.
[0008]
On the other hand, the configuration (2) further increases the size of the X-ray imaging apparatus. Further, since the alignment accuracy between each stepped portion and the image sensor is severe, the number of manufacturing steps is increased and a highly accurate alignment apparatus is required. In view of these, the configuration (2) is not realistic.
[0009]
As described above, the conventional X-ray imaging apparatus is not always sufficient in terms of an increase in size and cost of the X-ray imaging apparatus and workability in the manufacturing process.
[0010]
SUMMARY OF THE INVENTION An object of the present invention is to provide a large-area fiber plate, a radiation imaging apparatus, and a radiation imaging system that are suitable for downsizing and cost reduction of a radiation imaging apparatus and are more excellent in workability in the manufacturing process. is there.
[0011]
Another object of the present invention is to provide a fiber plate manufacturing method and a radiation imaging device manufacturing method capable of providing a large-area fiber plate, radiation imaging apparatus, and radiation imaging system at low cost.
[0012]
[Means for Solving the Problems]
A first aspect of the present invention relates to a radiation imaging apparatus, wherein the radiation imaging apparatus has a photoelectric conversion element having a plurality of pixels that convert light into an electrical signal, and a wavelength at which the photoelectric conversion element can detect radiation. A plurality of photoelectric conversion element chips mounted on a substrate, the wavelength conversion body converting into light, and a fiber plate provided between the wavelength conversion body and the photoelectric conversion element; A plurality of individual fiber plates having the same thickness adjacent to each other, and each of the plurality of individual fiber plates is an assembly of optical fibers each having an axis parallel to each other; The side surfaces are joined so that the axes of the optical fibers are parallel to each other, and the fiber plate and the plurality of photoelectric conversion elements -Up is bonded by a transparent adhesive, the width of the gap of the individual fiber plate adjacent to a width smaller than the pixel of the photoelectric conversion element.
A second aspect of the present invention relates to a radiation imaging apparatus, wherein the radiation imaging apparatus converts a light into an electric signal and a wavelength at which the radiation is converted into light having a wavelength detectable by the photoelectric conversion element. A converter, and a fiber plate provided between the wavelength converter and the photoelectric conversion element, wherein the photoelectric conversion element includes a plurality of photoelectric conversion element chips mounted on a substrate, and the fiber A plurality of individual fiber plates having the same thickness are arranged adjacent to each other, and each of the plurality of individual fiber plates is an assembly of optical fibers each having an axis parallel to each other. The optical fibers are joined so that their axes are parallel, and the fiber plate and the plurality of photoelectric conversion element chips are transparent adhesives. Therefore, the photoelectric conversion element has a plurality of pixels having different light receiving areas, and the width of the gap between the adjacent individual fiber plates has the minimum light receiving area of the photoelectric conversion element. It is smaller than the pixel width.
A third aspect of the present invention relates to a radiation imaging apparatus, wherein the radiation imaging apparatus has a photoelectric conversion element that converts light into an electrical signal, and a wavelength that converts radiation into light having a wavelength that can be detected by the photoelectric conversion element. A converter, and a fiber plate provided between the wavelength converter and the photoelectric conversion element, the photoelectric conversion element including a plurality of photoelectric conversion element chips mounted on a substrate, Each of the photoelectric conversion element chips includes a plurality of pixels, and the fiber plate includes a plurality of individual fiber plates having the same thickness, and the plurality of individual fiber plates are optical fibers each having an axis parallel to each other. A plurality of individual fiber plates are joined together so that the axes of the optical fibers are parallel to each other; Chromatography plate and the plurality of the photoelectric conversion element chip is bonded by a transparent adhesive, the gap of the individual fiber plates with adjacent, are located within the effective pixel region of the photoelectric conversion device chip.
A fourth aspect of the present invention relates to a radiation imaging apparatus, wherein the radiation imaging apparatus has a photoelectric conversion element having a plurality of pixels that convert light into an electrical signal, and a wavelength at which the photoelectric conversion element can detect radiation. A plurality of photoelectric conversion element chips mounted on a substrate, the wavelength conversion body converting into light, and a fiber plate provided between the wavelength conversion body and the photoelectric conversion element; A plurality of individual fiber plates having the same thickness adjacent to each other, and each of the plurality of individual fiber plates is an assembly of optical fibers each having an axis parallel to each other; The side surfaces are joined so that the axes of the optical fibers are parallel to each other, and the fiber plate and the plurality of photoelectric conversion elements -Up is bonded by a transparent adhesive, the gap of the individual fiber plates with adjacent, located on the gap of the plurality of pixels.
  Of the present inventionotherThe essence is that the plurality of individual fibers are arranged in adjacent fiber plates so that a plurality of individual fiber plates having the same thickness provide a light guide surface having a larger area than the light guide surface of one individual fiber plate. Each of the plates comprises an assembly of optical fibers having axes parallel to each other, and the side surfaces of the plurality of individual fiber plates are joined so that the axes of the optical fibers are parallel to each other. To do.
[0013]
In the said invention, it is preferable that the axis | shaft of the said optical fiber is parallel or inclined with respect to the normal line of the said light guide surface.
[0014]
In the above invention, it is preferable that at least one of the light guide surface and the side surface is a polished surface.
[0015]
In the said invention, it is preferable that the said side surfaces are joined by at least any one among an adhesive material or a metal.
[0016]
In the said invention, it is preferable that the said junction part is a radiation shielding junction part.
[0017]
In the said invention, it is preferable that the said side surface has a surface which cross | intersects with respect to the normal line of the said light guide surface.
[0018]
Another essence of the present invention is that the adjacent fiber plates are arranged so that a plurality of individual fiber plates having the same thickness provide a light guide surface having a larger area than the light guide surface of one individual fiber plate. Each of the plurality of individual fiber plates is composed of an assembly of optical fibers each having an axis parallel to a normal line of the light guide surface, and the side surfaces of the plurality of individual fiber plates are respectively aligned with the axes of the optical fibers. It is joined so that it may become parallel, The area of the surface used as the said light guide surface of the said fiber plate, and a back surface is equal.
[0019]
In the said invention, it is preferable that the mutually parallel side surfaces of the said several individual fiber plate are joined.
[0020]
In the above invention, the light guide surface is preferably a polished surface.
[0021]
In the above invention, the side surface is preferably a polished surface.
[0022]
In the said invention, it is preferable that the said side surfaces are joined by at least any one among an adhesive material or a metal.
[0023]
In the said invention, it is preferable that the said junction part is a radiation shielding junction part.
[0024]
In the said invention, it is preferable that the side surface where the said several individual fiber plate is joined has a surface which cross | intersects the normal line of the said light guide surface.
[0025]
Still another aspect of the present invention is a wavelength converter for converting radiation into light, a photoelectric conversion element for converting light into an electrical signal, and a fiber plate provided between the wavelength converter and the photoelectric conversion element. The fiber plate is arranged adjacent to each other so that a plurality of individual fiber plates having the same thickness provide a light guide surface having a larger area than the light guide surface of one individual fiber plate, Each of the plurality of individual fiber plates is an assembly of optical fibers each having an axis parallel to each other, and side surfaces of the plurality of individual fiber plates are joined so that the axes of the respective optical fibers are parallel to each other. It is characterized by being.
[0026]
In the said invention, it is preferable that the axis | shaft of the said optical fiber is parallel or inclined with respect to the normal line of the said light guide surface.
[0027]
In the above invention, it is preferable that at least one of the light guide surface and the side surface is a polished surface.
[0028]
In the said invention, it is preferable that the said side surfaces are joined by at least any one among an adhesive material or a metal.
[0029]
In the said invention, it is preferable that the said junction part is a radiation shielding junction part.
[0030]
In the said invention, it is preferable that the said side surface has a surface which cross | intersects with respect to the normal line of the said light guide surface.
[0031]
In the said invention, it is preferable that the width | variety of the space | interval of the said adjacent individual fiber plates is smaller than the width | variety of the pixel of the said photoelectric conversion element.
[0032]
In the above invention, the photoelectric conversion element has a plurality of pixels having different light receiving areas, and a width of a gap between the adjacent individual fiber plates is a pixel having a minimum light receiving area of the photoelectric conversion element. It is preferable that it is smaller than the width of.
[0033]
In the said invention, it is preferable that the gap | interval of the said adjacent individual fiber plates is located on the gap | interval of the chip | tip which comprises the said photoelectric conversion element.
[0034]
In the above invention, it is preferable that a gap between the adjacent individual fiber plates is located on an effective pixel region of a chip constituting the photoelectric conversion element.
[0035]
In the above invention, the joint line formed by the gap between the adjacent individual fiber plates intersects the joint line formed by the gap between the chips constituting the photoelectric conversion element at an angle larger than 0 ° and smaller than 90 °. That is preferable.
[0036]
Still another aspect of the present invention is a wavelength converter for converting radiation into light, a photoelectric conversion element for converting light into an electrical signal, and a fiber plate provided between the wavelength converter and the photoelectric conversion element. The fiber plates are arranged adjacent to each other such that a plurality of individual fiber plates having the same thickness provide a light guide surface having a larger area than the light guide surface of one individual fiber plate. Each of the plurality of individual fiber plates is an assembly of optical fibers each having an axis parallel to a normal line of the light guide surface, and the side surfaces of the plurality of individual fiber plates are connected to each other. A fiber plate that is joined so as to be parallel and has the same surface area as the light guide surface of the fiber plate. Characterized in that there.
[0037]
In the above invention, the side surface of the individual fiber plate is preferably a polished surface.
[0038]
In the above invention, the light guide surface is preferably a polished surface.
[0039]
In the said invention, it is preferable that the said side surfaces are joined by at least any one among an adhesive material or a metal.
[0040]
In the said invention, it is preferable that the said junction part is a radiation shielding junction part.
[0041]
In the said invention, it is preferable that the side surface of the said individual fiber plate has a surface which cross | intersects with respect to the normal line of the said light guide surface.
[0042]
In the said invention, it is preferable that the width | variety of the space | interval of the said adjacent individual fiber plates is smaller than the width | variety of the pixel of the said photoelectric conversion element.
[0043]
In the above invention, the photoelectric conversion element has a plurality of pixels having different light receiving areas, and a width of a gap between the adjacent individual fiber plates is a pixel having a minimum light receiving area of the photoelectric conversion element. It is preferable that it is smaller than the width of.
[0044]
In the said invention, it is preferable that the gap | interval of the said adjacent individual fiber plates is located on the gap | interval of the chip | tip which comprises the said photoelectric conversion element.
[0045]
In the above invention, it is preferable that a gap between the adjacent individual fiber plates is located on an effective pixel region of a chip constituting the photoelectric conversion element.
[0046]
In the above invention, the joint line formed by the gap between the adjacent individual fiber plates intersects the joint line formed by the gap between the chips constituting the photoelectric conversion element at an angle larger than 0 ° and smaller than 90 °. That is preferable.
[0047]
Other aspects of the present invention include a wavelength converter that converts radiation into light, a photoelectric conversion element chip that converts light into an electric signal, and an individual fiber provided between the wavelength converter and the photoelectric conversion element. In a radiation imaging apparatus in which a plurality of radiation imaging units each having a plate are arranged, the side surfaces of the individual fiber plates of the plurality of radiation imaging units are joined so that the axes of the optical fibers are parallel to each other. Features.
[0048]
In the above-mentioned invention, the side surface of the individual fiber plate is a polished surface.
[0049]
In the above invention, the light guide surface is preferably a polished surface.
[0050]
In the said invention, it is preferable that the said radiation imaging unit is that the said wavelength converter, the said photoelectric conversion element chip, and the said individual fiber plate are substantially the same size.
[0051]
Another aspect of the present invention is a method of preparing a plurality of individual fiber plates having a plurality of equal thicknesses, each of which is an assembly of optical fibers having mutually parallel axes in the fiber plate manufacturing method, The step of arranging the plurality of individual fiber plates adjacent to each other so as to provide a light guide surface having a larger area than the light guide surface of the optical fiber, and the side surfaces of the adjacent individual fiber plates are parallel to each other in the axis of the optical fiber. As mentioned above, the process of joining is included.
[0052]
In the above invention, the step of joining at least two of the plurality of individual fiber plates to form a set of individual fiber plates, the step of further joining a plurality of sets of the individual fiber plates to form the fiber plate, It is preferable to contain.
[0053]
In the said invention, after grind | polishing the side surface of the group of the said individual fiber plate, it is preferable to join the group of the said some individual fiber plate so that this side surface may adjoin.
[0054]
In the said invention, it is preferable to join the side surfaces of the said adjacent individual fiber plate using a metal or an adhesive material.
[0055]
In the said invention, after joining a some separate fiber plate, it is preferable to grind those surfaces.
[0056]
In the above invention, a step of preparing a plurality of individual fiber plates having a thickness equal to each other, the light guide surface of one individual fiber plate comprising an assembly of optical fibers having an axis parallel to the normal line of the light guide surface The step of arranging the plurality of individual fiber plates adjacent to each other so as to provide a light guide surface having a larger area, and joining the side surfaces of the adjacent individual fiber plates so that the axes of the respective optical fibers are parallel to each other. It is preferable to include the process to do.
[0057]
In the above invention, the step of joining at least two of the plurality of individual fiber plates to form a set of individual fiber plates, the step of further joining a plurality of sets of the individual fiber plates to form the fiber plate, It is characterized by including.
[0058]
In the said invention, after grind | polishing the side surface of the group of the said individual fiber plate, it is preferable to join the group of the said some individual fiber plate so that this side surface may adjoin.
[0059]
In the said invention, it is preferable to join the side surfaces of the said adjacent individual fiber plate using a metal or an adhesive material.
[0060]
In the said invention, after joining a some separate fiber plate, it is preferable to grind those surfaces.
[0061]
In the above invention, a step of preparing a plurality of individual fiber plates made of an assembly of optical fibers having mutually parallel axes, a light guide surface having a larger area than the light guide surface of one individual fiber plate is provided. As described above, it is preferable that the step of arranging the plurality of individual fiber plates adjacent to each other, and polishing the surfaces of the adjacent individual fiber plates after joining the side surfaces thereof.
[0062]
Still another aspect of the present invention is characterized in that in the method for manufacturing a radiation imaging apparatus, the above-described step of preparing the fiber plate and the step of bonding to the photoelectric conversion element are included.
[0063]
In the said invention, after bonding the said fiber plate with which the surface was planarized, and the said photoelectric conversion element, it is preferable to stick a sheet-like wavelength converter on this fiber plate.
[0064]
In the said invention, it is preferable to bond the said photoelectric conversion element, after bonding a sheet-like wavelength converter to the said fiber plate by which the surface was planarized.
[0065]
Further, another aspect of the present invention displays a signal processing means for processing a signal from the radiation imaging apparatus, a recording means for recording a signal from the signal processing means, and a signal from the signal processing means. A radiation imaging system comprising: display means for generating radiation; and a radiation source for generating the radiation.
[0066]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described below with reference to the drawings.
[0067]
FIG. 1 is a schematic perspective view for explaining a basic configuration of a fiber plate according to the present invention.
[0068]
In FIG. 1, 2 is one fiber plate (individual fiber plate) made of a large number of optical fibers, and 7 is a bonding material for bonding at least two adjacent individual fiber plates 2A.
[0069]
The individual fiber plate 2A used in the present invention is, for example, an optical fiber bundle in which about 1 to 100 million optical fibers having a diameter of about 1 μm to 100 μm are bundled in parallel and integrally formed so that a plane perpendicular to the axis of the optical fiber is exposed. Further, it is obtained by cutting into a plate shape having a thickness of about 1 mm to 20 mm.
[0070]
Accordingly, assuming that the light guide surface (light incident / exit surface) of the individual fiber plate 2A is the xy plane in FIG. 1, the axes of all the optical fibers are substantially parallel to the z axis in FIG. And the axis are parallel within an error range of about ± 1 °, and the angle formed by them is 0 ° ± 1 °.
[0071]
A plurality of individual fiber plates 2A having the same thickness are arranged along the xy plane so that the light incident / exit surfaces are on the same plane, and the side surfaces of the individual fiber plates 2A are parallel to each other. So as to join.
[0072]
Thereby, this fiber plate becomes the large area fiber plate 2 which provides a large area light incident / exit surface. Even if the thicknesses are the same, they do not have to be exactly the same, and some errors are within an allowable range.
[0073]
As another form, optical fiber axes inclined with respect to the xy plane are provided, and a plurality of individual fiber plates having a parallelogram cross section are prepared, and the side surfaces are joined so that these axes are parallel to each other. It may be a large area fiber plate.
[0074]
Here, only two individual fiber plates 2A are shown, but the number is not particularly limited. Further, the thickness of the individual fiber plate 2A does not have to be exactly the same, and some errors are allowed. If necessary, it is also preferable to polish the surface of the fiber plate 2 after joining the individual fiber plates 2A.
[0075]
The optical fiber is formed of a known material such as glass, and more preferably is made of a light transmissive material including a radiation shielding material such as lead, such as lead glass.
[0076]
As the bonding material, an organic adhesive or an inorganic bonding material as described later is used. In particular, a material having the same characteristics such as a thermal expansion coefficient as that of the fiber plate or a material having a similar characteristic such as a thermal expansion coefficient is preferably used.
[0077]
The size of the individual fever plate 2A is not particularly limited. For example, the area is several tens of centimeters.²~ Thousands of cm²A thing of a magnitude | size can be used.
[0078]
FIG. 2 is a schematic diagram showing a basic configuration of a radiation imaging apparatus using the above-described fiber plate.
[0079]
In FIG. 2, reference numeral 1A denotes an image pickup element constituted by an integrated circuit chip such as a CCD image sensor chip, a CMOS image sensor chip, a bipolar image sensor chip, a CMD image sensor chip, or a thin film transistor image sensor chip. An image sensor (photoelectric conversion element) 1 having a large area is configured by arranging the image sensors.
[0080]
A plurality of individual fiber plates 2A are arranged to form a large-area fiber plate 2.
[0081]
Reference numeral 3 denotes a wavelength converter, and Gd₂O₂It is a layered member made of a material called a scintillator or a phosphor such as gadolinium sulfide oxide such as S (Tb) and alkali metal halide represented by cesium iodide such as CsI (Tl).
[0082]
The light guide area of the bonded large-area fiber plate 2 is the same as or larger than the effective light receiving area of the bonded large-area imaging device 1, and the area of the wavelength converter 3 is further bonded. The area is preferably the same as or larger than the light guide area of the fiber plate 2.
[0083]
When radiation enters the upper surface of the wavelength converter 3 from above in FIG. 2, the wavelength converter 3 emits light in the visible light range. The fiber plate 2 disposed between the wavelength converter 3 and the image sensor 1 guides this light to the light receiving portion of the image sensor 1. The light incident on the light receiving unit is photoelectrically converted for each pixel and read out as an electric signal.
[0084]
Here, if a radiation-shielding fiber plate is used as the fiber plate 2A, it is possible to prevent radiation from entering the image sensor 1, so that malfunction of the image sensor and generation of noise can be suppressed.
[0085]
In FIG. 2, the number of individual fiber plates 2 </ b> A and the number of image pickup device chips 1 </ b> A are drawn as the same number, but the present invention is not limited to the same number and may be different from each other.
[0086]
Preferably, the size of the individual fiber plate 2A is larger than the size of the image sensor chip 1A, and the number of the individual fiber plates 2A is smaller than the number of the image sensor chips 1A.
[0087]
The imaging apparatus of the present invention can be suitably used for an X-ray imaging apparatus described below, but its application is not particularly limited to the X-ray imaging apparatus, and X, such as α, β, γ rays, etc. It can also be used for a radiation imaging apparatus that detects a radiation image other than a line.
[0088]
Light is an electromagnetic wave in a wavelength region that can be detected by a pixel, and includes visible light. Furthermore, for example, the present invention can be applied to an electromagnetic wave electric signal conversion device that converts an electromagnetic wave including radiation into an electric signal.
[0089]
(Embodiment 1)
FIG. 3 is a cross-sectional view of the X-ray imaging apparatus according to the first embodiment of the present invention. In FIG. 3, a phosphor (wavelength converter) 3 as a scintillator that converts X-rays into light having a wavelength that can be detected by an imaging element (photoelectric conversion element) such as visible light, and the wavelength converter 3 An apparatus having an individual fiber plate 2A composed of a plurality of optical fibers that guide light to the image sensor side and an image sensor 1 including a photoelectric conversion light receiving element that converts light into an electric signal is shown.
[0090]
The apparatus further includes an adhesive 7 that bonds the individual fiber plates 2A to each other, and further, elastically bonds the large-area fiber plate 2 and the image sensor 1 having a plurality of pixels as necessary. Transparent adhesive 6 having excellent resistance, a flexible substrate 4 having wiring for outputting an electric signal from each imaging element chip 1A to the outside, and a bump 5 for electrically connecting the flexible substrate 4 and the imaging element chip 1A. A printed circuit board 12 to which the flexible substrate 4 is connected, an aluminum protective sheet 8 for protecting the phosphor 3, a base substrate 10 on which the imaging device 1 is mounted, and a base housing 11 for holding the base substrate 10 , A housing cover 9 provided in the base housing 11, a spacer 13 provided between the imaging device 1 and the fiber plate 2 for maintaining a constant interval, Bright adhesive 6 and a joint filling adhesive 14 for interposing between the fiber plate 2 and the imaging element 1.
[0091]
The X-ray imaging apparatus shown in FIG. 3 is manufactured by bonding together the imaging element 1 and the large-area fiber plate 2 including a plurality of individual fiber plates 2 </ b> A with a transparent adhesive material 6.
[0092]
FIG. 4 is a plan view showing an example of a schematic configuration of an image sensor that can be used in the present invention.
[0093]
In FIG. 4, a normal pixel 101 including a plurality of light receiving elements arranged two-dimensionally, a plurality of peripheral pixels 104 provided outside the driving circuit 103, and driving for sequentially driving each normal pixel 101 and each peripheral pixel 104. The circuit 103 and the input / output terminal 102 of the image sensor chip 1A are shown.
[0094]
The normal pixels 101 are arranged almost on the entire surface of the image sensor chip 1A, and the pitch of the normal pixels 101 is set to 160 μm, for example, as will be described later. The drive circuit 103 is divided and distributed between the normal pixels 101. Since the peripheral pixel 104 has a smaller area than the normal pixel 101, the difference in area is eliminated by correcting the pixel signal.
[0095]
FIG. 5A and FIG. 5B show a configuration near the output terminal of the image sensor used in the present invention. 5A is a top view of the vicinity of the bump 5 and the flexible wiring board 4 of the image pickup device chip 1A, and FIG. 5B is a cross-sectional view taken along line 5B of FIG. 5A.
[0096]
In FIG. 5, 5 is a connection bump, 401 is an inner lead of the flexible substrate 4 connected to the bump 5, and 105 is a short circuit between the end of the image sensor chip 1 </ b> A and the inner lead 401 and the end of the image sensor 1. It is an organic insulating layer such as a polyimide resin layer that prevents defects.
[0097]
FIG. 6 is a schematic diagram for explaining a method of electrically connecting the bump 5 and the flexible substrate 4 shown in FIGS. 5 (a) and 5 (b).
[0098]
First, as the organic insulating layer 105, for example, a polyimide resin layer is formed at an end portion of the imaging element chip 1A so as to have a thickness of 25 μm.
[0099]
Next, in order to electrically connect the bump 5 and the flexible substrate 4, first, the bump 5 is formed on the input / output terminal 102 of the imaging element chip 1 </ b> A by a stud bump method or plating.
[0100]
Then, when the bump 5 and the inner lead 401 are fused by, for example, bonding using ultrasonic waves, the metal of the bump 5 and the metal of the inner lead 401 are connected to each other electrically and physically. .
[0101]
By the way, the inner lead 401 is formed by etching a copper foil or the like, plated with nickel and gold, and has a thickness of about 18 μm, and the total thickness of the flexible wiring board is 50 μm. You can use what you have.
[0102]
Next, the jig 19 is moved toward the holding bases 17 and 18 in the direction of the arrow in FIG. In this way, the inner lead 401 is bent at about 90 ° toward the lower side of the drawing at the end of the image pickup device chip 1A.
[0103]
FIG. 7A is a cross-sectional view of the vicinity of the flexible wiring board of the image sensor used in the present invention. FIG. 7B is a top view of the vicinity of the flexible wiring board of the image sensor.
[0104]
As shown in FIGS. 7A and 7B, in the X direction, the width S1 of the peripheral pixel 104 is smaller than the width S2 of the normal pixel 101 (S1 <S2).
[0105]
In FIG. 7B, the pitch P2 between the peripheral pixels 104 and the pitch P1 between the normal pixels 101 and the peripheral pixels 104 are depicted to be different. It is desirable that P1 = P2 and that the pitch P between the normal pixels is the same, that is, P1 = P2 = P.
[0106]
In this way, the pixel pitch is not limited to the peripheral pixels and the normal pixels, and all the pixels have the same pitch, and the image quality can be improved.
[0107]
FIG. 8A to FIG. 8F are diagrams showing the bonding process between the image sensor used in the present invention and the base substrate.
[0108]
First, a plurality of image sensor chips 1A including the flexible substrate 4 are mounted on the stage 32 while being aligned using the alignment head 31 and the alignment camera 33 that are movable in the X, Y, Z and θ (rotation) directions. Put.
[0109]
At this time, each imaging device chip 1A is fixed on the stage 32 by being sucked by a vacuum device (not shown) through a hole 32A formed in the stage 32 (FIG. 8A).
[0110]
In this state, it is inspected whether each image sensor chip 1A performs a required operation. In this inspection, an inspection jig 34 is used to check whether or not each imaging element chip 1A is destroyed by, for example, static electricity (FIG. 8B).
[0111]
If a defect is found in a certain image sensor chip 1A as a result of the inspection, the vacuum device below the image sensor chip 1A is turned off, and the defective chip is replaced using the alignment head 31 (FIG. 8C). )).
[0112]
Subsequently, an adhesive 35 such as an ultraviolet curable resin or a silicone resin is applied on the upper surface of the chip from the adhesive application dispenser 34 on the imaging element 1 (FIG. 8D).
[0113]
Then, the flexible substrate 4 is inserted into the long hole 10A provided in the base substrate 10, and after the image pickup device 1 and the base substrate 10 are brought into close contact with each other, the adhesive 35 is cured by irradiating ultraviolet rays or applying pressure. It fixes (FIG.8 (e)).
[0114]
At this time, the size of the individual fiber plate 2A and the size of the image pickup device chip 1A may be substantially the same, and these may be aligned. Here, it is preferable to use glass or a permalloy (iron + nickel) alloy for the base substrate 10 in consideration of the coefficient of thermal expansion between the base substrate 10 and the image sensor 1.
[0115]
Then, after the imaging device 1 and the base substrate 10 are bonded and fixed, the vacuum device is turned off and the imaging device 1 and the base substrate 10 are removed from the jig 36 such as a stage (FIG. 8F).
[0116]
In this way, a large area image sensor 1 in which a plurality of image sensor chips 1A are bonded is obtained.
[0117]
FIG. 9A to FIG. 9D are schematic views for explaining a process of bonding the large area imaging device used in the present invention and the large area fiber plate described above.
[0118]
9A and 9C show a cross section, and FIGS. 9B and 9D show a plane.
[0119]
Spacers 13 are arranged on each image sensor chip 1A bonded to the base substrate 10 so that the distance between each image sensor chip 1A and the large-area fiber plate 2 can be maintained (FIG. 9A).
[0120]
The spacer 13 may be spherical or cylindrical.
[0121]
Next, the sealing material 37 is applied on the image sensor 1, and the joint adhesive material 14 is applied so as to fill the gap between the image sensors 1 (FIG. 9B).
[0122]
A part 37A of the sealing material 37 is opened. As will be described later, the transparent adhesive 6 is filled from here using a vacuum injection method. At the time of injection, the joint adhesive 14 is also filled in the gap between the image pickup device chips 1A on the upper surface of the base substrate 10 so as not to cause a vacuum leak.
[0123]
Then, the large-area fiber plate 2 is bonded onto the large-area image sensor 1 with the spacer 13 interposed therebetween (FIG. 9C).
[0124]
Furthermore, it is also preferable that the bonding material 7 for bonding the fiber plates 2 to each other is disposed in the gaps between the image pickup device chips 1A or directly between the pixels as necessary.
[0125]
The gap between the imaging element chip 1A and the fiber plate is made uniform by pressurization and heating press, and the sealing material 37 is cured. In the decompression chamber, when the gap between the large-area fiber plate 2 and the image sensor 1 is in a decompressed state, an opening 37A is attached to a boat (not shown) in which the transparent adhesive 6 is stored, and the atmospheric pressure is reduced from the decompressed state. By returning to, the transparent adhesive is filled in the gap between the fiber plate 2 and the image sensor 1.
[0126]
Thereafter, the opening portion 37 is sealed with a sealing material 38 such as resin (FIG. 9D).
[0127]
Then, for example, an X-ray imaging apparatus is formed by sticking a sheet-like wavelength converter 3 on the fiber plate 2.
[0128]
The wavelength converter 3 can be provided on the fiber plate 2 by a method of vapor-depositing the material or a method of applying a powdery phosphor mixed with a binder. In this case, FIG. The wavelength converter 3 is provided on the fiber plate 2 before the step c).
[0129]
Next, the operation of the X-ray imaging apparatus will be described with reference to FIG. 3 again. When an X-ray source (not shown) is installed on the wavelength converter 3 side, and X-rays are irradiated from the X-ray source with the subject positioned between the X-ray source and the X-ray imaging apparatus, the X-rays are emitted. Is exposed to the subject. Then, the X-ray is sent to the X-ray imaging apparatus side including X-ray information having an intensity difference when passing through the subject.
[0130]
On the X-ray imaging device side, the wavelength converter 3 converts the light into visible light or the like corresponding to the X-ray intensity. The converted light is transmitted to the image sensor 1 side through the fiber plate 2. At this time, since the fiber plate 2 and the image sensor 1 are bonded by the transparent adhesive 6, the light enters the image sensor 1 without being attenuated when passing through the transparent adhesive 6.
[0131]
The light is also incident on the adhesive 7. The light incident on the adhesive 7 is absorbed or reflected, and the light transmittance is reduced. When this light is incident on the pixels of the image sensor 1, a line defect occurs. However, as described above, if the size of the individual fiber plate 2A and the size of the image sensor chip 1A are the same, and these are aligned. A configuration in which light from the adhesive 7 hardly affects the pixels of the image sensor 1 can be achieved.
[0132]
In the imaging element chip 1A, incident light is converted into an electric signal corresponding to the intensity of the light. This electric signal is read out to the wiring of the flexible substrate 4, that is, the lead 401 through the bump 5 in accordance with an instruction of a reading circuit (not shown). The electric signal read out to the flexible substrate 4 is sent to an external circuit manufactured on the printed circuit board 12 and subjected to image processing after A / D conversion.
[0133]
(Manufacturing method of large area fiber plate)
Here, the manufacturing method of the large area fiber plate used for this invention is demonstrated.
[0134]
FIG. 10A to FIG. 10D are schematic views showing an example of a method for producing a large-area fiber plate used in the present invention.
[0135]
First, as shown in FIG. 10A, two individual fiber plates 2A are bonded to each other with a bonding material. At this time, as shown in FIG. 10 (a), even if the individual fiber plates 2A are attached with care, strictly speaking, the individual fiber plates 2A are often attached with their positions shifted from each other. If all the individual fiber plates 2A are bonded together, a gap more than necessary is generated.
[0136]
In this manufacturing method, in order to prevent the occurrence of such a gap more than necessary, at least one side surface of the fiber plate 2 which is bonded to each other is polished to the dotted line portion 41, so that FIG. As shown, an aligned flat side 2B is obtained.
[0137]
Subsequently, according to the same procedure as in FIGS. 10 (a) and 10 (b), another set of two individual fiber plates 2A having one side polished and prepared is prepared, and the two sets of fiber plates are prepared. The respective flat polished side surfaces 2B are bonded to each other so as to abut each other (FIG. 10C).
[0138]
And one side is grind | polished to the dotted line 41 among the remaining 4 side surfaces as needed. Furthermore, as shown in FIG. 10 (d), if the remaining three side surfaces are polished as required, a gap between adjacent side surfaces can be reduced and a large area fiber plate in which all four side surfaces are flat is produced. Can do.
[0139]
Here, the case where the large-area fiber plate 2 is manufactured by laminating the four individual fiber plates 2A has been described as an example. However, in practice, a predetermined size is set so that the fiber plate 2 has a desired size. The individual fiber plates 2A of the number of sheets are bonded together.
[0140]
FIG. 11A and FIG. 11B are schematic cross-sectional views showing another method for manufacturing the fiber plate used in the present invention. Here, a case where the large-area fiber plate 2 is manufactured by pasting together the six fiber plates 2A is taken as an example, and therefore, in FIG. 11 (a) and FIG. 11 (b), three individual fiber plates 2A are included. Only is shown. Actually, a predetermined number of fiber plates 2A are bonded together so that the large-area fiber plate 2 has a desired size.
[0141]
When the cross section of the large-area fiber plate 2 obtained by the method shown in FIGS. 10 (a) to 10 (d) is viewed, as shown in FIG. A chipped portion 43 is generated due to chipping that occurs during handling in each process.
[0142]
For this reason, the front and back surfaces of the large-area fiber plate 2 that have been bonded together are polished on both sides until the chipped portion 43 disappears, and a large portion having no chipped portion as shown in FIG. An area fiber plate 2 is made.
[0143]
Then, the large-area fiber plate 2 as shown in FIG. 11B thus obtained is bonded to the large-area imaging device 1 through the spacer 13 as necessary.
[0144]
(Embodiment 2)
FIG. 12 is a cross-sectional view of a large-area fiber plate according to Embodiment 2 of the present invention.
[0145]
The large-area fiber plate 2 in FIG. 12 has a form using an adhesive made of an epoxy resin or the like containing an X-ray shielding member 7A such as lead as the bonding material 7.
[0146]
Specific examples of the adhesive include ethylene / vinyl acetate copolymer, carboxyl-modified ethylene / vinyl acetate copolymer, ethylene / isobutyl acrylate copolymer, polyamide, polyester, polymethyl methacrylate, polyvinyl ether, polyvinyl butyral, Polyurethane, styrene / butylene / styrene (SBS) copolymer, carboxyl-modified SBS copolymer, styrene / isoprene / styrene (SIS) copolymer, styrene / ethylene / butylene / styrene (SEBS) copolymer, maleic acid modified SEBS copolymer, polybutadiene rubber, chloroprene rubber (CR), carboxyl modified CR, styrene / butadiene rubber, isobutylene / isoprene copolymer, acrylonitrile / butadiene rubber (NBR), carboxyl modified BR, epoxy resin, can be mentioned such as silicone rubber (SR), which are used in a combination of at least one kind alone or in combination.
[0147]
In addition, if necessary, reactive aids, phenol resins as crosslinking agents, polyols, isocyanates, melamine resins, urea resins, urotropin resins, amines, acid anhydrides, peroxides, metal oxides, trioxides. Organometallic salts such as chromium fluoroacetate, alkoxides such as titanium, zirconia, and aluminum, organometallic compounds such as dibutyltin dioxide, photoinitiators such as 2,2-diethoxyacetophenone and benzyl, amines, phosphorus compounds, Sensitizers such as chlorine compounds, as well as curing agents, vulcanizing agents, control agents, deterioration inhibitors, heat resistance additives, heat conduction improvers, softeners, colorants, various coupling agents, metal deactivators, etc. You may add suitably.
[0148]
The shielding member 7A includes at least one metal selected from iron, cobalt, nickel, copper, zinc, silver, tin, gadolinium, tungsten, platinum, gold, lead, bismuth, and the like, or at least one of them. An alloy or at least one compound thereof is used. These metals, alloys, and compounds may be used together with lead-containing solder paste such as Pb—Sn, lead-free solder paste, silver paste, and the like. Alternatively, these metals, alloys, and compounds may be used in the form of particles, in which case particles (carbon particles, plastic balls) made of an inorganic or organic material are coated with plating, sputtering, or the like. It can also be used.
[0149]
According to the large-area fiber plate according to the present embodiment, since the radiation shielding bonding material is used at the joint portion, that is, the joint portion of the individual fiber plate, it is possible to prevent the radiation from being transmitted through the joint without limitation. it can.
[0150]
The X-ray imaging apparatus using this large-area fiber plate can prevent X-rays that have not been converted into light among the X-rays that have entered the wavelength converter 3 from entering the imaging element 1.
[0151]
That is, X-rays incident on the wavelength converter 3 that are not converted to light are blocked by the material of the large-area fiber plate 2 containing lead or the like and / or the shielding bonding material 7. Thereby, generation | occurrence | production of the noise etc. by incidence | injection of the X-ray to the image pick-up element 1 can be suppressed.
[0152]
FIG. 13A to FIG. 13C are schematic views for explaining a manufacturing method of the large-area fiber plate shown in FIG.
[0153]
First, the adhesive and the X-ray shielding member 7A are stirred using a stirring rod or the like (FIG. 13 (a)).
[0154]
Then, after the bubbles generated by stirring disappear, a bonding material made of an adhesive containing the X-ray shielding member 7A is filled between the fiber plates by a dispenser 46 or screen printing (FIG. 13B).
[0155]
This filling may be performed in a reduced-pressure atmosphere so that the air in the gap is easily removed.
[0156]
Then, the adhesive is cured while the individual fiber plates 2A are pressed against each other. For curing, UV irradiation or heating in the range of room temperature to 200 ° C is preferable. Thereafter, the adhesive protruding from the upper surface of the fiber plate 2 is scraped off (FIG. 13C).
[0157]
In this way, the large area fiber plate 2 is obtained.
[0158]
(Embodiment 3)
FIG. 14 is a schematic cross-sectional view of a large-area fiber plate according to Embodiment 3 of the present invention. In this embodiment, the individual fiber plate 2A is joined using a low melting point metal (metal having a melting point of 330 ° C. or lower) and a liquid flux to produce the large area fiber plate 2.
[0159]
Examples of the low melting point metal used in the present invention include alloys containing two or more metals such as Pb, Sn, Bi, Sb, In, Ag, and Cd, such as eutectic solder of Sn—Pb (63:37 wt%) and Sn. A high melting point solder of -Pb (10:90 wt%) can be used. Moreover, it is desirable that the low melting point metal has a grain shape so as to be easily mixed with the liquid flux.
[0160]
In addition, the liquid flux includes resin components such as purified rosin, hydrogenated rosin, and polymerized rosin and alcohols such as terpineol, 1,4-butanediol, methyl cellosolve, etc., or ketones such as methyl ethyl ketone. In addition, solvent components such as methyl isopropyl ketone and methyl isobutyl ketone are essential components, and viscosity modifiers such as polyethylene glycol, polyvinyl butyral, and petroleum resins, and activators such as malonic acid, succinic acid, and triethanolamine are added to this. What mix | blended the agent component suitably is used.
[0161]
In addition, as a water-soluble liquid flux, polyhydric alcohol components such as polyethylene glycol, glycerin and polyvinyl alcohol, water as a solvent component is an essential component, and further a viscosity modifier such as polyacrylic amide, an organic acid, An additive component such as an organic or inorganic halide salt or an activator such as diethylamine hydrochloride is appropriately used. Among these, a water-soluble liquid flux is preferably used.
[0162]
FIG. 15A to FIG. 15C are schematic views for explaining a manufacturing process of the large-area fiber plate shown in FIG.
[0163]
First, the powdery low melting point metal 48 and the liquid flux 47 are mixed (FIG. 15A).
[0164]
Then, after the bubbles generated by stirring are eliminated, a liquid flux 47 containing an X-ray shielding low melting point metal 48 is filled between the fiber plates by dispenser or screen printing (FIG. 15B).
[0165]
The filling is preferably performed in a reduced-pressure atmosphere so that the air in the gap can be easily removed.
[0166]
Then, the fiber plates 2A are pressurized to each other and simultaneously heated at a temperature equal to or higher than the melting point to fuse the low melting point metal 48. Thereafter, if the low melting point metal 48 protrudes from the upper surface of the fiber plate 2, it is scraped off.
[0167]
In this way, the large area fiber plate 2 is obtained (FIG. 15C).
[0168]
(Embodiment 4)
FIG. 16 is a schematic cross-sectional view of a large-area fiber plate according to Embodiment 4 of the present invention. In the present embodiment, the individual fiber plate 2A is bonded to the first metal layer 49 and the second metal layer 50 to produce the large-area fiber plate 2.
[0169]
FIG. 17A to FIG. 17E are schematic views for explaining a manufacturing process of the large-area fiber plate shown in FIG.
[0170]
First, for example, an acid-resistant etching resist 51 such as a photosensitive film is coated on both surfaces of the individual fiber plate 2A (FIG. 17A).
[0171]
Then, the resist 51 is brought into close contact with the fiber plate 2A by heating. Then, in order to improve the adhesion between the first metal layer 49 and glass, which will be described later, the end surface of the fiber plate 2 is etched using hydrofluoric acid, potassium fluoride, acidic ammonium fluoride, or the like to form the rough surface 52. To do. (FIG. 17B).
[0172]
Subsequently, a first metal layer 49 such as nickel or copper is formed on the etched end face (rough surface 52) by electroless plating (FIG. 17C).
[0173]
Then, the second metal layer 50 made of a low melting point metal alloy is electroplated on the first metal layer 49 (FIG. 17D).
[0174]
The second metal layer 50 is difficult to plate directly on a nonconductor such as glass. Therefore, the first metal layer 49 described above is provided first to change the base to be conductive, and then the second metal layer 52 is formed by electroplating.
[0175]
Then, the resist 51 is peeled off, and the second metal layer 50 is heated at a temperature not lower than the melting point and not higher than 330 ° C. while mutually pressing the fiber plate 2A (FIG. 17E).
[0176]
Thereafter, if there are protruding first and second metal layers 49, 50 from the upper surface of the fiber plate 2, they are scraped off. A large area fiber plate is thus obtained.
[0177]
As described above, in the second to fourth embodiments, the fiber plates 2A are connected to each other by the bonding material 7 having a shielding property for shielding X-rays. Therefore, if the large-area fiber plate of these embodiments is used in the radiation imaging apparatus as shown in FIGS. 2 and 3, the X-rays emitted to the fiber plate side without being converted into light by the wavelength converter 3 are the fibers. Blocked by the plate substrate. In this way, the image sensor 1 can be shielded from X-rays, and generation of noise and the like can be suppressed.
[0178]
(Embodiment 5)
18 is a plan view of an embodiment of the X-ray imaging apparatus of the present invention, and FIG. 19 is a cross-sectional view of the X-ray imaging apparatus.
[0179]
The basic configuration is the same as that of the imaging apparatus described with reference to FIGS. The difference from these devices is that the large area fiber plate 2 and the large area image sensor 1 are arranged so that the joint line formed by the joints 7 of the individual fiber plates 2A is located above the gap of the image sensor chip 1A. It is in the point which aligned and stuck.
[0180]
That is, the width of the joint line formed by the joint portion 7 is made smaller than the gap between the adjacent image sensor chips 1A so that the joint line does not cover the pixels even if a slight positional deviation occurs.
[0181]
In addition, as a joining material used for the joining part 7, the thing of the material which has the characteristics, such as a thermal expansion coefficient, etc. with a fiber plate equal or close is preferable. In this embodiment, since the positions of the joints of the fiber plates and the joints of the image sensor are aligned, the bonding material may be transparent or opaque.
[0182]
(Embodiment 6)
20 and 21 are a top view and a cross-sectional view showing another example of the X-ray imaging apparatus.
[0183]
As shown in FIGS. 20 and 21, when the fiber joint 7, which is a joint of the fiber plates, is arranged in a position shifted so as to cover the peripheral pixel 104 of the image sensor 1, From the difference between the light transmittance of 7 and the light transmittance of the fiber plate 2A, the pixel columns arranged under the joint 7, particularly the peripheral pixels 104, are small in size, and thus become line defects or pixel defects.
[0184]
Further, even in the normal pixel 101 which is a large pixel, the sensitivity is not lowered. Furthermore, if leaked X-rays that have been transmitted without being converted from light into the phosphor enter the image pickup device through the joint 7, shot noise is generated in a line shape and image quality is deteriorated, which may further cause deterioration of the device. .
[0185]
In the X-ray imaging apparatus shown in FIGS. 18 and 19, the positions of the fiber plate joints and the image sensor joints are aligned. By adopting such a configuration, the light from the phosphor entering from the joint of the fiber plate is prevented from entering the pixel column of the image sensor so that no line defect occurs. In addition, X-rays leaking from the phosphor are prevented from entering the image sensor from the joint of the fiber plate so that shot noise is not generated in a line.
[0186]
However, when the number of individual fiber plates and the number of image sensor chips are different, a situation occurs in which the joints of the individual fiber plates and the joints of the image sensor chips cannot be aligned and matched.
[0187]
The embodiment described below relates to a radiation imaging apparatus that can avoid occurrence of a line defect even in such a case.
[0188]
(Embodiment 7)
In the X-ray imaging apparatus shown in FIG. 22, the joint line formed by the joint portions 7 of the individual fiber plates and the pixel column line of the imaging element are inclined (angle θ ≠ 0 °). By adopting such a configuration, the light incident from the joints of the fiber plates does not enter all the pixels on one pixel column, thereby preventing the occurrence of line defects.
[0189]
In other words, even if light is incident on a part of a plurality of pixels arranged in a line through the fiber junction 7, only a defect signal is generated from some of the pixels, and a line defect does not occur. In such a case, an X-ray shielding bonding material such as a lead-containing adhesive may be used as a bonding material so that the leaked X-rays from the wavelength converter do not enter the image sensor from the joint of the fiber plate.
[0190]
In the embodiment described above, in order to prevent the joint line of the fiber plate from overlapping in parallel with the pixel column line of the image sensor, the joint line of the fiber plate and the pixel column line of the image sensor are arranged to be inclined. You may take the structure as described below.
[0191]
(Embodiment 8)
FIG. 23 is a top view of an X-ray imaging apparatus according to an embodiment of the present invention, and FIG. 24 is a cross-sectional view of the X-ray imaging apparatus.
[0192]
In the apparatus of FIGS. 23 and 24, the joint line of the fiber plate is arranged on the imaging region of the imaging device 1A and between adjacent pixel columns. With this configuration, light from the phosphor that enters from the joint of the fiber plate is prevented from entering the pixels of the image sensor.
[0193]
Further, if necessary, the width (joint line width) of the joint portion 7 is made sufficiently larger than the size of the normal pixel 104, so that even if the fiber plate joint portion 7 slightly deviates from between the normal pixels, a line defect may occur. I try not to be.
[0194]
In such a case, it is also preferable to use an X-ray shielding bonding material such as a lead-containing adhesive as a bonding material used for the bonding portion so that X-rays do not enter the image sensor from the joint of the fiber plate.
[0195]
In the form of FIG. 23 and FIG. 24, a large area fiber plate obtained by joining 16 individual fiber plates 2A and a large area image sensor composed of nine image sensor chips 1A are combined. It is also preferable that the number of imaging element chips is made larger than the number of individual fiber plates by reducing the number of imaging element chips.
[0196]
(Embodiment 9)
FIG. 25 is a schematic cross-sectional view of an X-ray imaging apparatus according to an embodiment of the present invention.
[0197]
In the fiber plate of this device, the side surface of the individual fiber plate at the joint is oblique, and is a surface that intersects the normal line of the light guide surface.
[0198]
In the X-ray imaging apparatus shown in FIG. 25, the end portion (side surface) of the fiber plate is placed so that the leaked X-ray incident on the joint portion 7 serving as the fiber plate joint enters the joint side surface of the fiber plate. It is processed so that leakage X-rays do not enter the image sensor.
[0199]
In order to allow the leaky X-rays to pass through the side surface on the joint side of the fiber plate, the side surface 71 on the joint side of the individual fiber plate 2A only needs to have a surface that is not parallel to the leaky X-ray. The side surface 71 of the fiber plate has a constant inclination with respect to the normal direction of the light guide surface of the fiber plate, that is, the axis of the optical fiber, for example, about several degrees to several tens of degrees.
[0200]
According to such a configuration, as shown in FIG. 25, the leaked X-ray transmitted through the wavelength converter 3 enters the fiber plate, and the X-ray is blocked by the fiber plate. In this way, since X-rays do not enter the image sensor through the joint, generation of line-shaped shot noise can be suppressed. Here, a radiation shielding fiber plate is used as the individual fiber plate, but the bonding material may not be a radiation shielding bonding material.
[0201]
Further, as the bonding material 7, it is preferable to use an adhesive material having the same or similar characteristics as the fiber plate such as a thermal expansion coefficient.
[0202]
In the embodiment described above, all of the side surfaces 71 of the fiber plate have a constant inclination with respect to the leakage X-ray, but a part of the side surface 71 of the fiber plate has a constant inclination with respect to the leakage X-ray. You may make it have.
[0203]
In the apparatus of FIG. 25, not only is the optical fiber axis parallel to the normal direction of the light guide surface of the individual fiber plate 2A, but the optical fiber axis is parallel to the side surface of the individual fiber plate 2A. May be.
[0204]
In this case, a plurality of individual fiber plates obtained by obliquely cutting a bundle of optical fibers may be prepared and bonded so that the axes of the optical fibers are parallel to each other. In this case, the position of the light guide surface serving as the light incident surface and the position of the light guide surface serving as the light output surface are shifted according to the inclination angle of the optical fiber.
[0205]
(Embodiment 10)
FIG. 26 is a schematic cross-sectional view of an X-ray imaging apparatus according to an embodiment of the present invention.
[0206]
In the fiber plate of this device, the side surfaces of the individual fiber plates in the joint are oblique to the opposite direction with respect to the turning point, and are surfaces that intersect the normal line of the light guide surface.
[0207]
As shown in FIG. 26, the joint portion 7 of the fiber plate has a “<” shape (chevron shape), and a part of the side surface 72 of the fiber plate in the thickness direction has a certain inclination with respect to the leaked X-ray. I am doing so.
[0208]
(Embodiment 11)
FIG. 27 is a schematic cross-sectional view of an X-ray imaging apparatus according to an embodiment of the present invention.
[0209]
As shown in FIG. 27, the side surface 73 of the fiber plate is processed into a step shape, and the joining portion 7 of the fiber plate has a step shape. The fiber plate of this apparatus is configured such that the side surface of the individual fiber plate at the joint has a surface that intersects the normal line of the light guide surface at the step.
[0210]
As mentioned above, with reference to FIGS. 25-27, some examples of the shape of the side surface (joining part 7) of the fiber plate used for this invention were shown.
[0211]
The shape of the side surface of the fiber plate used in the present invention may be any configuration as long as it has a surface that intersects the normal line of the light guide surface, that is, the leaked X-ray incident on the joint 7 As long as it passes, it may have any shape other than that shown in the figure, such as a zigzag shape or an arc shape.
[0212]
Embodiment 12
As shown in FIG. 20, when the joint 7 that is the joint of the fiber plates is arranged so as to overlap the peripheral pixels of the image sensor, the joint 7 that bonds the individual fiber plates 2A is the fiber plate 2A. Therefore, if the pixel row of the image pickup device 1 is arranged under the junction 7 and the junction 7 is wide, a line defect over a plurality of lines is caused.
[0213]
Further, when leaked X-rays that are transmitted without being converted into light from the wavelength converter enter the image sensor through the joint, shot noise is generated in a line shape and image quality is deteriorated.
[0214]
Note that the size of the peripheral pixels is smaller than the size of the normal pixels.
[0215]
Therefore, in this embodiment, as shown in FIGS. 28 and 29, the width d of the joint 7 of the fiber plate 2A is made smaller than the width P of the pixel 101 of the image sensor 1 (d <P), and the joint is performed. Even if the pixel column of the image pickup device 1 is arranged under the unit 7, the line defect can be suppressed to one line.
[0216]
If a bonding material such as an adhesive containing a radiation shielding material such as lead is used as the bonding material, X-rays leaking from the wavelength converter 3 can be shielded.
[0217]
More preferably, it is desirable that the width d of the junction 7 is smaller than the width a of the opening formed by the light shielding layer of the pixel 101 (d <a).
[0218]
Further, the width d of the joint portion 7 of the fiber plate is made smaller than the width of the peripheral pixel 104 which is smaller than the width of the normal pixel 101, that is, the width d of the joint portion 7 of the fiber plate 2 A is set in the image sensor 1. It is also preferable to make the width smaller than the minimum pixel width.
[0219]
Note that the material of the joint is preferably a material having the same or similar characteristics as the fiber plate such as a coefficient of thermal expansion.
[0220]
(Embodiment 13)
FIG. 30 is a schematic cross-sectional view of one imaging unit constituting the X-ray imaging apparatus according to one embodiment of the present invention. The apparatus of FIG. 30 includes a wavelength conversion means 3 that converts X-rays into light having a wavelength that can be detected by an imaging element such as visible light, and a plurality of optical fibers that guide the light converted by the wavelength converter 3 to the imaging element 1A side. Imaging having a fiber plate 2A made of a bundle of fibers, a transparent adhesive material 6 excellent in elasticity for bonding the fiber plate 2A and an image pickup device 1A having a plurality of pixels 101, and a light receiving portion for converting light into an electrical signal. The element 1A, a flexible substrate 4 having wiring for outputting an electric signal from the image pickup element 1A to the outside, a bump 5 for electrically connecting the flexible substrate 4 and the image pickup element 1A, and aluminum for protecting the wavelength converter 3 A protective sheet 8, a base substrate 10 on which the image sensor 1A is mounted, and a sealing material 14 for interposing the transparent adhesive 6 between the fiber plate 2A and the image sensor 1A are provided. It is.
[0221]
When a plurality of imaging units as shown in FIG. 30 are prepared and the side surfaces of the adjacent fiber plates 2A or the side surfaces of the units are joined to each other, a large area imaging device having a large area radiation receiving surface can be configured.
[0222]
Fig.31 (a)-FIG.31 (d) is a schematic diagram for demonstrating the manufacturing method of an X-ray imaging unit. 31A and 31C show a cross section, and FIGS. 31B and 31D show a plane.
[0223]
The side surface of the fiber plate 2A is polished, and the vertical and horizontal dimensions of the fiber plate 2A substantially coincide with the dimensions of the image pickup device 1A, and the respective areas are substantially equal.
[0224]
Further, since the fiber plate 2A is polished on both sides, the light guide surface (light incident / exit surface) is also a flat polished surface. The polishing method will be described later.
[0225]
First, the imaging element 1 </ b> A is bonded and fixed to the base substrate 10 with the adhesive 35. On the imaging surface of the imaging device 1A, spherical or columnar spacers 13 are arranged to maintain the distance between each imaging device and the fiber plate (FIG. 31 (a)).
[0226]
Next, the sealing material 37 is applied on the image sensor 1 (FIG. 31B).
[0227]
As shown in FIG. 31B, the sealing material has an opening 37A in part. Reference numeral 103 denotes a pixel driving circuit including a vertical shift register and a horizontal shift register.
[0228]
After positioning the fiber plate 2A on which the wavelength conversion body 3 is formed on the spacer 13, the fiber plate 2A and the image sensor 1A are pressed and heated to be bonded together (FIG. 31 (c)).
[0229]
In the vacuum chamber, when the gap between each fiber plate 2A and each image pickup device 1A is in a vacuum state, an opening 37A is attached to a boat in which a transparent adhesive (not shown) is stored to return the vacuum state to atmospheric pressure. The transparent adhesive is filled in the gap. Thereafter, the opening 37A is sealed with the sealing material 38 (FIG. 31D).
[0230]
In this way, an X-ray imaging unit is obtained.
[0231]
Then, a plurality of X-ray imaging units are arranged so that the X receiving surfaces are on the same plane and joined together, thereby obtaining a large-area X-ray imaging apparatus.
[0232]
In the example of FIGS. 31A to 31D, the sealing material 37 is applied only to a position inward of one peripheral pixel from the end of the image sensor chip 1A, but as shown in FIG. It may be given up to the end.
[0233]
In this apparatus, the wavelength converter 3 on the light incident surface side of the fiber plate 2A is formed by vapor deposition, coating, printing, or the like, but the process is preferably after the fiber plate 2 is polished. Alternatively, it may be after the fiber plate 2A is bonded to the image sensor 1A.
[0234]
(Embodiment 14)
FIG. 32A to FIG. 32E are schematic views for explaining another method for manufacturing the X-ray imaging unit according to the embodiment of the present invention. 32 (a), 32 (c), and 32 (d) show cross sections, and FIGS. 32 (b) and 32 (e) show planes.
[0235]
Spacers 13 are arranged on the image pickup device 1A bonded to the base substrate 10 so as to maintain the distance between the image pickup device 1A and the fiber plate 2A (FIG. 32A).
[0236]
Here, as the fiber plate 2A, a light incident / exit surface that has been flattened by polishing both surfaces in advance is used.
[0237]
Next, the sealing material 37 is applied on the image sensor 1 (FIG. 32B).
[0238]
As shown in FIG. 32B, the seal material 37 is partially provided with an opening 37A. As will be described later, the seal material 37 is filled with a transparent adhesive using a vacuum injection method.
[0239]
Then, after positioning the fiber plate 2A on the spacer 13, it is bonded together (FIG. 32 (c)).
[0240]
In the vacuum chamber, when the gap between the fiber plate 2A and the imaging device 1A is in a vacuum state, the transparent adhesive 6 is obtained by returning the vacuum state to atmospheric pressure by attaching an opening 37A to the boat in which the transparent adhesive is stored. The gap is filled. Thereafter, the opening portion 37 </ b> A is sealed with a sealing material 38.
[0241]
Next, the fiber plate 2A is polished in accordance with the area of the image pickup device 1A to align the side surface of the fiber plate 2A and the side surface of the image pickup device chip 1A so as to be substantially flush with each other (FIG. 32D). ).
[0242]
Note that the polishing in this step does not perform chemical polishing using a polishing solution such as potassium hydroxide, ammonia, hydrogen peroxide solution, etc., and is mechanically polished, thereby preventing the image sensor 1A from being damaged.
[0243]
The phosphor 3 as the wavelength converter 3 having the same area as the fiber plate 2A is pasted on the fiber plate 2A, or the phosphor 3 having a larger area is pasted on the fiber plate 2A. This is cut so as to have the same area as the fiber plate 2A.
[0244]
In this way, an X-ray imaging unit is obtained (FIG. 32 (e)).
[0245]
Then, a plurality of X-ray imaging units are arranged so that the X receiving surfaces are on the same plane and joined together, thereby obtaining a large-area X-ray imaging apparatus.
[0246]
(Embodiment 15)
Fig.33 (a)-FIG.33 (f) is a schematic diagram for demonstrating the manufacturing method of the large area fiber plate by one Embodiment of this invention.
[0247]
First, a plurality of individual fiber plates 2 </ b> A are placed on the surface of the bonding stage 500. The bonding material 7 is filled between the fiber plates 2A using a dispenser (not shown). At this time, the bonding stage 500 side of each fiber plate 2A becomes the reference plane 53 (FIG. 33A).
[0248]
Then, after the adhesive used as the bonding material 7 is cured, the bonded large-area fiber plate 2 is placed on the polishing stage 800 so that the reference surface 53 is on the suction hole 54 side. Further, a polishing pad 700 such as a felt is attached to the polishing disc 600 (FIG. 33B).
[0249]
A polishing agent 55 is applied on the large-area fiber plate 2 and the joint 7, and the polishing disc 600 and the polishing stage 800 are brought into contact with each other and rotated in reverse while applying pressure to each individual fiber plate 2 </ b> A and the joint. The portion 7 is polished (FIG. 33 (c)).
[0250]
As the polishing agent, a so-called slurry in which silica-based, ceria-based, or alumina-based abrasive grains are dispersed in a solution containing at least one selected from water, potassium hydroxide, ammonia, hydrogen peroxide, and the like may be used.
[0251]
In this way, the large-area fiber plate 2 flattened so that each individual fiber plate 2A and the joint portion 7 have the same plane is obtained (FIG. 33 (d)).
[0252]
Subsequently, the abrasive felt 900 is attached to the side surface of the abrasive disc 600. Then, the polishing disk 600 is pressed against the side surface of the large-area fiber plate 2 while rotating, and the polishing stage 800 is moved from the front side to the back side of the drawing (FIG. 33 (e)).
[0253]
In this way, the side surface of the large area fiber plate 2 is polished. Next, for example, the polished surface is spin-cleaned with the cleaning liquid 56 supplied from the spray nozzle 55 and then the polishing stage 800 is rotated at a high speed to dry each fiber plate 2A and the joint 7.
[0254]
If necessary, the reference surface 33 side is similarly polished to obtain a large-area fiber plate having both light guide surfaces polished.
[0255]
(Embodiment 16)
FIG. 34 is a top view of the radiation imaging apparatus according to the embodiment of the present invention.
[0256]
The radiation imaging apparatus of the present embodiment includes, for example, a large-area fiber plate produced by arranging 10 rectangular (for example, 60 mm × 150 mm) individual fiber plates 2A in 2 columns and 5 rows, and 28 rectangular (for example, 20 mm × 143 mm). The large-area image pickup device manufactured by arranging the image pickup device chips 1 </ b> A) in 2 columns and 14 rows.
[0257]
The large area fiber plate and the large area image sensor are assembled so that the joint 7 of the left and right individual fiber plates 2A in FIG. 34 is located in the gap between the left and right image sensor chips 1A.
[0258]
On the other hand, the joint 7 of the upper and lower individual fiber plates 2A and the gap between the upper and lower imaging element chips 1A in FIG. If necessary, it is also preferable to make the width (joint line width) of at least the joints 7 of the individual fiber plates 2A adjacent to each other vertically smaller than the pixel width of the image sensor chip 1A.
[0259]
As shown in FIG. 34, if at least one of the rows or columns of the image sensor chip 1A is 2, the external connection terminals of all the image sensor chips 1A are not between chips but at the free ends (of the large area image sensor). It is also possible to arrange them on any one of the four sides. If it does so, the space | interval of an adjacent image pick-up element chip | tip can further be narrowed.
[0260]
Among the imaging devices described above, a plurality of fiber plates 2A are joined together with an adhesive or the like to be enlarged, and a base substrate on which an imaging element having no plurality of frames is mounted is attached to the enlarged fiber plate, and wavelength conversion is performed. According to the apparatus combined with the body, the following effects can be expected.
[0261]
(1) A large area detection device can be manufactured.
[0262]
(2) An inexpensive large format fiber plate can be manufactured.
[0263]
(3) Since the fiber fiber is not bent or tilted, the light utilization efficiency is high.
[0264]
(4) It can be configured with a minimum fiber thickness.
[0265]
(5) There is no need to match the sensor to the fiber shape.
[0266]
(6) A large-area fiber plate can be easily manufactured.
[0267]
(7) Since a wavelength converter that tends to cause uneven growth, such as an alkali metal halide, can be favorably grown, a good image quality with little non-uniformity can be obtained in the obtained image.
[0268]
It is possible to provide an X-ray imaging apparatus that produces the above-described effects and is capable of producing an X-ray moving image, is excellent in image quality, is thin, and has a large area input range with high reliability. Moreover, it becomes inexpensive.
[0269]
(Radiation imaging system)
The form of the radiation imaging system described below is a system using the imaging device of each embodiment described above.
[0270]
FIG. 35 is a conceptual diagram illustrating a configuration of a nondestructive inspection system including an X-ray imaging apparatus.
[0271]
FIG. 35 shows the X-ray imaging apparatus 1000 according to each of the embodiments described above, a subject 2000 that is a nondestructive inspection object incorporated in, for example, an electric device, and a microfocus X as a radiation source that irradiates the subject 2000 with X-rays A line generator 3000, an image processing device 6000 for processing a signal output from the X-ray imaging device 1000, a monitor 4000 as a display means for displaying an image processed by the image processing device 6000, an image processing device 6000, and A controller 5000 for operating the monitor 4000 is shown.
[0272]
In the nondestructive inspection system shown in FIG. 35, when the subject 2000 to be subjected to the nondestructive inspection is irradiated with the X-rays generated by the microfocus X-ray generator 3000, information on the presence / absence of destruction inside the subject 2000 is expressed as X The image is output to the image processing apparatus 6000 through the line imaging apparatus 1000. In the image processing device 6000, the output signal is processed into an image signal between the peripheral pixels of each of the image pickup devices 1 described above, and if necessary, dark signal correction is performed and the image is displayed on the monitor 4000 as an image. indicate.
[0273]
The image displayed on the monitor 4000 can be enlarged or reduced, or can be subjected to density control, for example, by inputting an instruction using the controller 5000. In this way, through the image displayed on the monitor 4000, the presence or absence of destruction inside the subject 2000 is inspected. If no destruction is found in the subject 2000, it is regarded as a non-defective product and is incorporated into an electric device. On the other hand, if destruction is found in the subject 2000, it is regarded as a defective product and excluded from the manufacturing process.
[0274]
FIG. 36 is a conceptual diagram illustrating a configuration of an X-ray diagnostic system including the X-ray imaging apparatus according to each embodiment described above.
[0275]
FIG. 36 shows a bed provided with the X-ray imaging apparatus 1000, an X-ray generation apparatus 7000 as a radiation source for irradiating the subject 2000 with X-rays, and processing of image signals output from the X-ray imaging apparatus 1000 And an image processor 8000 for controlling the irradiation timing of the X-rays from the X-ray generator 7000 and a monitor 4000 as a display means for displaying an image signal processed by the image processor 8000. In FIG. 36, the same parts as those shown in FIG. 35 are denoted by the same reference numerals.
[0276]
In the X-ray diagnosis system shown in FIG. 36, the X-ray generator 7000 generates X-rays based on an instruction from the image processor 8000, and when the X-ray is irradiated on the subject 2000 on the bed, the X-ray information of the subject 2000 is obtained. Is output to the image processor 8000 through the X-ray imaging apparatus 1000. In the image processor 8000, the output signal is processed into the image signal between the peripheral pixels of each image sensor 1 described above, dark-corrected, etc., and stored in a memory (not shown), or the image is stored in the monitor 4000. Display as.
[0277]
The image displayed on the monitor 4000 can be enlarged or reduced, or can be subjected to density control, for example, by inputting an instruction using the image processor 8000. Thus, the doctor examines the subject 2000 through the image displayed on the monitor 4000.
[0278]
Further, the X-ray information of the subject 2000 after the doctor examines may be recorded on a disk-shaped recording medium or the like by providing recording means of this system.
[0279]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a large-area fiber plate, a radiation imaging apparatus, and a radiation imaging system that are small in size, low in cost, and excellent in workability in the manufacturing process.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a fiber plate according to the present invention.
FIG. 2 is a schematic diagram for explaining a configuration of a radiation imaging apparatus according to the present invention.
FIG. 3 is a schematic cross-sectional view of an X-ray imaging apparatus according to an embodiment of the present invention.
FIG. 4 is a schematic plan view of an image sensor used in the present invention.
FIG. 5 is a schematic diagram illustrating a configuration in the vicinity of an external connection terminal of an image sensor.
FIG. 6 is a schematic diagram for explaining a configuration in the vicinity of an external connection terminal of an image sensor.
FIG. 7 is a schematic diagram illustrating a configuration between adjacent image sensors.
FIG. 8 is a schematic diagram for explaining a manufacturing method of the imaging device.
FIG. 9 is a schematic diagram for explaining a method of manufacturing an imaging device according to the present invention.
FIG. 10 is a schematic view for explaining an example of a fiber plate manufacturing method according to the present invention.
FIG. 11 is a schematic view for explaining another example of the fiber plate manufacturing method according to the present invention.
FIG. 12 is a schematic diagram for explaining a configuration of a fiber plate according to an embodiment of the present invention.
FIG. 13 is a schematic diagram for explaining a method of manufacturing the fiber plate as shown in FIG.
FIG. 14 is a schematic cross-sectional view of a fiber plate according to another embodiment of the present invention.
FIG. 15 is a schematic diagram for explaining a method of manufacturing the fiber plate as shown in FIG. 14;
FIG. 16 is a schematic cross-sectional view of a fiber plate according to still another embodiment of the present invention.
17 is a schematic diagram for explaining a method of manufacturing the fiber plate as shown in FIG. 16. FIG.
FIG. 18 is a schematic plan view of an X-ray imaging apparatus according to another embodiment of the present invention.
19 is a schematic cross-sectional view of the X-ray imaging apparatus shown in FIG.
FIG. 20 is a schematic plan view of an X-ray imaging apparatus according to still another embodiment of the present invention.
FIG. 21 is a schematic cross-sectional view of the X-ray imaging apparatus shown in FIG.
FIG. 22 is a schematic plan view of an X-ray imaging apparatus according to another embodiment of the present invention.
FIG. 23 is a schematic plan view of an X-ray imaging apparatus according to still another embodiment of the present invention.
24 is a schematic cross-sectional view of the X-ray imaging apparatus shown in FIG.
FIG. 25 is a schematic cross-sectional view of an X-ray imaging apparatus according to still another embodiment of the present invention.
FIG. 26 is a schematic cross-sectional view of an X-ray imaging apparatus according to still another embodiment of the present invention.
FIG. 27 is a schematic cross-sectional view of an X-ray imaging apparatus according to still another embodiment of the present invention.
FIG. 28 is a schematic cross-sectional view of an X-ray imaging apparatus according to still another embodiment of the present invention.
FIG. 29 is a schematic cross-sectional view for explaining the relationship between the pixel of the imaging device used in the present invention and the joint portion of the fiber plate.
FIG. 30 is a schematic cross-sectional view of an X-ray imaging apparatus according to still another embodiment of the present invention.
FIG. 31 is a schematic diagram for explaining the manufacturing method of the radiation imaging apparatus according to the embodiment of the present invention.
FIG. 32 is a schematic diagram for explaining the manufacturing method of the radiation imaging apparatus according to another embodiment of the present invention.
FIG. 33 is a schematic diagram for explaining a fiber plate manufacturing method according to an embodiment of the present invention.
FIG. 34 is a schematic plan view of a radiation imaging apparatus according to another embodiment of the present invention.
FIG. 35 is a schematic diagram showing a configuration of a nondestructive inspection system including the X-ray imaging apparatus of the present invention.
FIG. 36 is a schematic diagram showing a configuration of an X-ray diagnostic system including the X-ray imaging apparatus of the present invention.
FIG. 37 is a schematic cross-sectional view of an imaging apparatus using a conventional large area fiber plate.
FIG. 38 is a schematic cross-sectional view of an imaging apparatus using another conventional large-area fiber plate.
[Explanation of symbols]
1 Large area image sensor
1A Image sensor chip
2 Large area fiber plate
2A Individual fiber plate
3 Wavelength converter
4 Flexible substrate
5 Bump
6 Transparent adhesive
7 joints
8 Protection sheet
9 Case cover
10 Base substrate
11 Base housing
12 Printed circuit board
13 Spacer
14 Joint joint adhesive

Claims (5)

A photoelectric conversion element having a plurality of pixels for converting light into an electrical signal;
A wavelength converter that converts radiation into light of a wavelength that can be detected by the photoelectric conversion element;
A fiber plate provided between the wavelength converter and the photoelectric conversion element;
The photoelectric conversion element includes a plurality of photoelectric conversion element chips mounted on a substrate,
In the fiber plate, a plurality of individual fiber plates having the same thickness are arranged adjacent to each other, and the plurality of individual fiber plates are aggregates of optical fibers each having an axis parallel to each other, and the side surfaces of the plurality of individual fiber plates are aligned with each other. Each optical fiber is joined so that the axes of the optical fibers are parallel,
The fiber plate and the plurality of photoelectric conversion element chips are bonded by a transparent adhesive ,
A radiation imaging apparatus, wherein a width of a gap between adjacent individual fiber plates is smaller than a width of a pixel of the photoelectric conversion element. A photoelectric conversion element that converts light into an electrical signal;
A wavelength converter that converts radiation into light of a wavelength that can be detected by the photoelectric conversion element;
A fiber plate provided between the wavelength converter and the photoelectric conversion element;
The photoelectric conversion element includes a plurality of photoelectric conversion element chips mounted on a substrate,
In the fiber plate, a plurality of individual fiber plates having the same thickness are arranged adjacent to each other, and the plurality of individual fiber plates are aggregates of optical fibers each having an axis parallel to each other, and the side surfaces of the plurality of individual fiber plates are aligned with each other. Each optical fiber is joined so that the axes of the optical fibers are parallel,
The fiber plate and the plurality of photoelectric conversion element chips are bonded by a transparent adhesive,
The photoelectric conversion element has a plurality of pixels having different light receiving areas,
A radiation imaging apparatus, wherein a width of a gap between adjacent individual fiber plates is smaller than a width of a pixel having a minimum light receiving area of the photoelectric conversion element. A photoelectric conversion element that converts light into an electrical signal;
A wavelength converter that converts radiation into light of a wavelength that can be detected by the photoelectric conversion element;
A fiber plate provided between the wavelength converter and the photoelectric conversion element;
The photoelectric conversion element includes a plurality of photoelectric conversion element chips mounted on a substrate, each of the plurality of photoelectric conversion element chips has a plurality of pixels,
In the fiber plate, a plurality of individual fiber plates having the same thickness are arranged adjacent to each other, and the plurality of individual fiber plates are aggregates of optical fibers each having an axis parallel to each other, and the side surfaces of the plurality of individual fiber plates are aligned with each other. Each optical fiber is joined so that the axes of the optical fibers are parallel,
The fiber plate and the plurality of photoelectric conversion element chips are bonded by a transparent adhesive,
A radiation imaging apparatus, wherein a gap between adjacent individual fiber plates is located on an effective pixel region of the photoelectric conversion element chip. A photoelectric conversion element having a plurality of pixels for converting light into an electrical signal;
A wavelength converter that converts radiation into light of a wavelength that can be detected by the photoelectric conversion element;
A fiber plate provided between the wavelength converter and the photoelectric conversion element;
The photoelectric conversion element includes a plurality of photoelectric conversion element chips mounted on a substrate,
In the fiber plate, a plurality of individual fiber plates having the same thickness are arranged adjacent to each other, and the plurality of individual fiber plates are aggregates of optical fibers each having an axis parallel to each other, and the side surfaces of the plurality of individual fiber plates are aligned with each other. Each optical fiber is joined so that the axes of the optical fibers are parallel,
The fiber plate and the plurality of photoelectric conversion element chips are bonded by a transparent adhesive,
A radiation imaging apparatus, wherein a gap between adjacent individual fiber plates is located on a gap between the plurality of pixels. A radiation imaging apparatus according to any one of claims 1 to 4, and a signal processing unit for processing a signal from the radiation imaging apparatus, a recording means for recording a signal from said signal processing means, said signal processing A radiation imaging system comprising: display means for displaying a signal from the means.

Images