JP2002372586A - Radiation image pickup unit, device and system - Google Patents

Radiation image pickup unit, device and system

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Publication number
JP2002372586A
JP2002372586A JP2001178845A JP2001178845A JP2002372586A JP 2002372586 A JP2002372586 A JP 2002372586A JP 2001178845 A JP2001178845 A JP 2001178845A JP 2001178845 A JP2001178845 A JP 2001178845A JP 2002372586 A JP2002372586 A JP 2002372586A
Authority
JP
Japan
Prior art keywords
fiber plate
radiation
imaging apparatus
fiber
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001178845A
Other languages
Japanese (ja)
Inventor
Osamu Hamamoto
Kenji Kajiwara
Koji Sato
浩司 佐藤
賢治 梶原
修 浜本
Original Assignee
Canon Inc
キヤノン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, キヤノン株式会社 filed Critical Canon Inc
Priority to JP2001178845A priority Critical patent/JP2002372586A/en
Publication of JP2002372586A publication Critical patent/JP2002372586A/en
Application status is Pending legal-status Critical

Links

Abstract

(57) [Problem] To prevent radiation from entering control means formed on a printed circuit board (12). SOLUTION: A fiber plate 2 that guides light converted by a phosphor 3 to a photoelectric conversion unit 1 and shields radiation that could not be converted by the phosphor 3, and reads out an electric signal converted by the photoelectric conversion unit 1. And a control means 12 for controlling the size of the fiber plate 2, wherein the control means 12 smaller than the fiber plate 2 is arranged so as to fit under the fiber plate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation imaging unit, apparatus and system, and more particularly, to a radiation imaging unit such as a medical X-ray imaging apparatus and an industrial destruction apparatus.
The present invention relates to an apparatus and a system.

[0002] In the present specification, radiation includes electromagnetic waves such as X-rays, α-rays, β-rays, and γ-rays.

[0003]

2. Description of the Related Art Conventionally, a radiation imaging apparatus, particularly an X-ray imaging apparatus for medical use, is required to have a thin X-ray imaging apparatus which is capable of performing X-ray moving images, has excellent image quality, and has a large area input range. ing. Further, there is a demand for a thin, inexpensive, large-area X-ray imaging apparatus not only for medical use but also for industrial non-destructive inspection machines.

As such an X-ray imaging apparatus, for example, there is an X-ray detection apparatus having a large area so that the non-light receiving portion of the CCD sensor does not interfere with a step in the thickness of the fiber plate.

FIG. 17 is a schematic cross-sectional view of the X-ray detecting device having the structure (1). FIG. 17 shows a phosphor 3 composed of a scintillator for converting X-rays into visible light, and a phosphor 3.
FIG. 1 shows a fiber plate 2 such as an optical fiber that guides visible light converted by the optical device to the image sensor 1 and an image sensor 1 that converts visible light transmitted by the fiber plate 2 into an electric signal.

In this X-ray imaging apparatus, the fiber plate 2 is inclined with respect to the image sensor 1, and between the fiber plates 2, each image sensor 1 is driven to transmit an electric signal from each image sensor 1. Control means for controlling reading is provided. Therefore, no X-rays are incident on the control means,
Generation of noise due to X-ray incidence can be suppressed.

FIG. 18 is a schematic perspective view of the X-ray detecting device having the configuration (2). In FIG. 18, FIG.
The same reference numerals are given to the same parts as. As shown in FIG. 18, by changing the length of the fiber plate 2, for example, by providing three image pickup devices 1 as a set and providing a step for each set, control means can be provided for each image pickup device 1. I have. However, depending on the size of the phosphor, X-rays may be incident on the control means provided in the image sensor 1 located in the periphery. It is necessary to provide the X-ray shielding member described above.

[0008]

However, the configuration of the above (1) first cuts the fiber plate obliquely, so that the processing of the fiber plate is difficult and the number of pieces per lot is reduced. There is a problem that the price is high. In addition, when the inclination is provided, the transmission efficiency of light in each fiber of the fiber plate deteriorates, and the sensitivity of the sensor decreases.

Further, the illustrated one is obtained by laminating 2 × 2 blocks of fiber plates. When the existing fiber plates are used, the size is limited to about 100 × 100 mm. However, if the inclination of the fiber is changed to 3 × 3 or the like, among the pixels in each image sensor, the light transmittance of the fiber plate arranged at the periphery is higher than that of the fiber plate arranged at the center. Inferiorly, unevenness occurs in the signals output from the respective image sensors.

In addition, the configuration (2) has a problem that the X-ray imaging apparatus is increased in size, and the weight is increased due to the provision of an X-ray shielding member such as lead. In addition, since the positioning accuracy between each stepped portion and the image sensor is strict, the number of manufacturing steps is increased, and a highly accurate positioning device is required. In view of these, the configuration of (2) is not realistic.

The above-mentioned conventional X-ray imaging apparatus is not always sufficient to meet the demands of the X-ray imaging apparatus such as increase in size, weight, cost reduction, workability in a manufacturing process and the like.

It is an object of the present invention to provide a radiation imaging apparatus and a radiation imaging system which are suitable for increasing the size and cost of an X-ray imaging apparatus and which are more excellent in workability in a manufacturing process.

[0013]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a fiber plate for guiding light converted by a phosphor to photoelectric conversion means and shielding radiation that could not be completely converted by the phosphor. And a control means for controlling reading of the electric signal converted by the photoelectric conversion means, wherein the control means smaller than the fiber plate is disposed so as to fit under the fiber plate. It is characterized by doing.

Further, the radiation ray imaging system of the present invention comprises:
The radiation imaging apparatus, signal processing means for processing a signal from the radiation imaging apparatus, recording means for recording a signal from the signal processing means, and display for displaying a signal from the signal processing means Means and a radiation source for generating said radiation.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) "Description of Configuration" FIG. 1 is a sectional view of an X-ray imaging apparatus according to Embodiment 1 of the present invention. FIG. 1 shows a phosphor (wavelength conversion means) 3 as a scintillator for converting X-rays into light having a wavelength detectable by an image sensor (photoelectric conversion means) 1 such as visible light,
A fiber plate 2 composed of a plurality of optical fibers including a shielding material for guiding the light converted by the phosphor 3 to the image pickup device side and shielding X-rays that could not be converted by the phosphor 3
And an adhesive 7 for bonding the fiber plate 2 to each other
A transparent adhesive 6 having excellent elasticity for bonding the fiber plate 2 and the image sensor 1, an image sensor 1 for converting light into an electric signal, and a flexible substrate 4 for outputting an electric signal from the image sensor 1 to the outside. A bump 5 for electrically connecting the flexible substrate 4 and the imaging device 1; a printed substrate 12 to which the flexible substrate 4 is connected; a protection sheet 8 made of aluminum or the like for protecting the phosphor 3; Is mounted between the imaging element 1 and the fiber plate 2, a base housing 10 for holding the base substrate 10, a housing cover 9 provided on the base housing 11, Spacer 13 for maintaining a constant interval, and joint filling adhesive 14 for interposing transparent adhesive 6 between fiber plate 2 and image sensor 1
And a sealing resin 15 that blocks the image sensor 1 from the outside air.

Here, as shown in FIG. 1, in the present embodiment, the printed circuit board 12 is made smaller than the fiber plate 2 and arranged so as to fit under the fiber plate 2. Therefore, X-rays that could not be converted into light by the phosphor 3 do not enter the printed circuit board 12 side. Incidentally, when such a method is not adopted, an X-ray shielding member such as lead must be attached to the housing cover 9 or the housing cover 9 must be manufactured from lead or the like.
The device is heavy.

The adhesive 7 includes an ethylene / vinyl acetate copolymer, a carboxyl-modified ethylene / vinyl acetate copolymer, an ethylene / isobutyl acrylate copolymer,
Polyamide, polyester, polymethyl methacrylate, polyvinyl ether, polyvinyl butyral, polyurethane, styrene / butylene / styrene (SBS) copolymer, carboxyl-modified SBS copolymer, styrene
Isoprene-styrene (SIS) copolymer, styrene
Ethylene-butylene-styrene (SEBS) copolymer,
Maleic acid-modified SEBS copolymer, polybutadiene rubber, chloroprene rubber (CR), carboxyl-modified C
R, styrene / butadiene rubber, isobutylene / isoprene copolymer, acrylonitrile / butadiene rubber (N
BR), carboxyl-modified NBR, epoxy resin, silicone rubber (SR), and the like. These may be used alone or in combination of two or more.

Further, if necessary, a reactive auxiliary agent, a phenol resin as a crosslinking agent, a polyol, an isocyanate, a melamine resin, a urea resin, a urotropin resin,
Amines, acid anhydrides, peroxides, metal oxides, organic metal salts such as chromium trifluoroacetate, alkoxides such as titanium, zirconia and aluminum, organic metal compounds such as dibutyltin dioxide, 2,2-die Photoinitiators such as toshiquiacetophenone and benzyl, sensitizers such as amines, phosphorus compounds and chlorine compounds, and further curing agents,
Vulcanizing agents, control agents, deterioration inhibitors, heat-resistant additives, heat conduction improvers, softeners, coloring agents, various coupling agents, metal deactivators, and the like may be appropriately added.

The shielding materials contained in the fiber plate 2 and the adhesive 7 include iron, cobalt, nickel, copper,
Zinc, silver, tin, gadolinium, tungsten, platinum,
Plating on heavy metals such as gold, lead and bismuth and their compounds or alloys, alloys used for solder (Pb-Sn) paste and silver paste, metal particles, and particles (carbon particles, plastic balls) made of inorganic or organic materials, Particles coated with a heavy metal by sputtering or the like can be used.

Incidentally, the X-ray imaging apparatus shown in FIG. 1 may be manufactured by bonding a fiber plate base having a plurality of fiber plates 2 and the imaging element 1 with a transparent adhesive 6, or FIG. As shown in (1), it may be manufactured by bonding a plurality of X-ray imaging units based on the size of the imaging device 1 or the fiber plate 2 or the like.

FIG. 2 is a plan view showing a schematic configuration of the image pickup device 1 of FIG. FIG. 2 shows a normal pixel 101 including a plurality of image sensors arranged two-dimensionally, a plurality of peripheral pixels 104 provided outside a driving circuit 103, and each normal pixel 1
01 and a drive circuit 10 for sequentially driving each peripheral pixel 104
3 and the input / output terminal 102 of the image sensor 1 are shown.

The normal pixels 101 are arranged substantially over the entire surface of the image pickup device 1, and the pitch of the normal pixels 101 is, for example, 160 μm as described later. Normal pixel 101
The driving circuit 103 is divided and arranged in a distributed manner. Since the area of the peripheral pixel 104 is smaller than that of the normal pixel 101, the pixel signal is corrected so that the difference in the area is eliminated.

FIG. 3A is a schematic sectional view showing the vicinity of the bump 5 and the flexible wiring board 4 shown in FIG. 1, and FIG.
FIG. 3 is a top view of FIG. In FIG. 3, in addition to the members shown in FIGS. 1 and 2, the inner lead 401 of the flexible substrate 4 connected to the bump 5 and the prevention of short-circuit between the end of the image sensor 1 and the inner lead 401 and the imaging Element 1
And an organic insulating layer 105 such as a polyimide resin layer for preventing edge loss.

"Explanation of Manufacturing Process" FIG. 4 is a view showing a state of electrical connection between the bump 5 and the flexible substrate 4 shown in FIG. First, for example, a polyimide resin layer is formed as the organic insulating layer 105 so as to have a thickness of 25 μm. Next, in order to electrically connect the bump 5 to the flexible substrate 4, the bump 5 is first formed on the input / output terminal 102 of the imaging device 1 by a stud bump method, plating, or the like.

Then, the bump 5 and the inner lead 401
Are bonded together by, for example, ultrasonic waves. Incidentally, the inner lead 401 is formed by etching a copper foil or the like, and is plated with nickel and gold to have a thickness of about 18 μm, and the total thickness of the flexible wiring board is about 50 μm.

Next, the jig 19 is moved in the direction of the holding tables 17 and 18 while the image pickup device 1 is held by the holding tables 17 and 18. Thus, the inner lead 401 is bent at about 90 ° toward the lower side in the drawing at the end of the image sensor 1.

FIG. 5A is an enlarged view of the vicinity of the flexible wiring board 4 of the image sensor 1 of FIG. FIG. 5 (b)
It is a top view of FIG. As shown in FIG. 5, in the length in the X direction, the width of the peripheral pixel 104 is smaller than the width of the normal pixel 101 (S1 <S2). Are arranged so as to be constant (P1 = P2 =
P). Further, the pixels are arranged such that the pitch between the normal pixels 101 is also the same (P). From this, the pixel pitches are all equal pitches, and the image quality is not inferior.

FIG. 6 shows the image pickup device 1 and the base substrate 1 shown in FIG.
It is a figure which shows the bonding process with 0. First, as described with reference to FIG. 4, the plurality of image pickup devices 1 including the flexible substrate 4 are aligned using an alignment head and an alignment camera movable in X, Y, Z directions and θ (rotation) directions. While placing it on the stage. At this time,
Each image sensor 1 is fixed on the stage by being sucked from a hole formed in the stage with a vacuum device or the like (FIG. 6A).

In this state, an inspection is performed to determine whether each image sensor 1 performs a required operation. In this inspection, it is checked using an inspection jig whether or not each imaging element 1 is broken by, for example, static electricity or the like (FIG. 6B).

If a defect is found in the image pickup device 1 as a result of the inspection, the vacuum device below the image pickup device is turned off and replaced with an alignment head (FIG. 6).
(C)).

Subsequently, an adhesive such as an ultraviolet curing type or a silicone resin is applied onto the image pickup device 1 (FIG. 6).
(D)).

Then, the flexible substrate 4 is inserted into the long hole provided in the base substrate 10, and then the image pickup device 1 and the base substrate 10 are brought into close contact with each other, and thereafter, are bonded by irradiating ultraviolet rays or pressing (FIG. 6). (E)).

As shown in FIG. 6 (e), it is preferable that the size of the fiber plate 2 and the size of the image pickup device 1 are the same, and these are aligned. Here, the base substrate 10 is made of glass or permalloy (iron +
Nickel) alloy is used.

Then, after bonding the image pickup device 1 and the base substrate 10, the vacuum device is turned off, and the image pickup device 1 and the base substrate 10 are removed from a jig such as a stage (FIG. 6 (f)).

FIG. 7 is an explanatory diagram of a process of bonding the image pickup device 1 and the base substrate 10 of FIG. 1 to the fiber plate base. FIGS. 7A and 7C are cross-sectional views, and FIGS. 7B and 7D are plan views.

As described with reference to FIG. 6, the spacers 13 are arranged on each of the imaging elements 1 bonded to the base substrate 10 so as to maintain a space between each of the imaging elements 1 and the fiber plate base 2 ( FIG. 7A).

The spacer 13 may be spherical or cylindrical.
Next, a sealing material and a joint filling adhesive are applied on the image sensor 1 (FIG. 7B).

The joint filling material is filled to fill the gap between the image pickup devices 1. Fig. 7
As shown in (b), a part is opened, and as described later, the transparent adhesive 6 is filled from here by using a vacuum injection method. At the time of injection, a gap filling adhesive is filled in the gap between the imaging elements 1 so as not to cause a vacuum leak. Then, the fiber plate substrate 2 is bonded onto the spacer 13 (FIG. 7C).

It is more preferable that the adhesive 7 for adhering the fiber plates 2 to each other is disposed in a gap between the image pickup devices 1 or directly above each pixel. The distance between the image pickup device 1 and the fiber plate is made uniform by pressing and heating, and the sealing material is cured. Then, in a vacuum chamber, when the gap between the fiber plate base and each image sensor 1 is evacuated, the transparent adhesive 6
The transparent adhesive 6 is filled in the gap by opening an opening portion in the boat storing the water and returning the vacuum state to the atmospheric pressure. afterwards,
The opening is sealed (FIG. 7D).

Then, a sealing resin 15 is applied between the fiber plate base 2 and the base substrate 10 so that the image pickup device 1 can be shielded from the outside air.

Further, for example, by attaching the phosphor 3 on a sheet to the fiber plate substrate 2,
An X-ray imaging device is formed.

The phosphor 3 can be provided by a method of vapor deposition on a fiber plate substrate or by mixing and applying a powdered phosphor to a binder, and in this case, referring to FIG. Before the steps described above, the phosphor 3 is provided on the fiber plate substrate.

By the way, as shown in FIG.
When manufacturing an X-ray imaging device from a X-ray imaging unit,
The image sensor 1 and the base substrate 10 may be bonded to the fiber plate base by the steps shown in FIGS. 20A to 20D described below.

That is, the fiber plate 2 is polished according to the area of the image pickup device 1, and the light input / output surface is polished on both sides to be flattened. Then, a spacer 13 such as a sphere or a column is arranged on each of the image sensors 1 bonded to the base substrate 10 so as to maintain a space between each of the image sensors 1 and the fiber plate 2 (FIG. 20A). .

Next, the sealing material 14 is applied on the image pickup device 1 (FIG. 20B).

As shown in FIG. 20B, a part of the sealing material is opened, and as described later, the transparent adhesive 6 is filled from here using a vacuum injection method. At the time of injection, a gap filling adhesive is filled in the gap between the imaging elements 1 so as not to cause a vacuum leak. After positioning the fiber plate 2 on the spacer 13, the fiber plate 2 and the imaging device 1 are bonded to each other by pressing and heating each other (FIG. 20C).

When the gap between each fiber plate 2 and each image pickup device 1 is evacuated in the vacuum chamber, an opening is formed in the boat storing the transparent adhesive 6 to return the vacuum to atmospheric pressure. Thus, the gap is filled with the transparent adhesive 6. Thereafter, the opening is sealed (FIG. 20).
(D)).

The phosphor 3 on the light incident surface side of the fiber plate 2 is formed by vapor deposition, coating, or printing, and the process is performed after polishing the fiber plate 2 or after bonding the same to the imaging device 1. Do with.

FIG. 8 is a schematic view showing a manufacturing process of the fiber plate substrate of FIG. The manufacturing process of the fiber plate substrate will be described with reference to FIG. FIG.
FIGS. 8A to 8C are plan views, and FIGS.
(E) is a sectional view.

First, as shown in FIG. 8A, the fiber plates 2 are attached to each other with an adhesive 7.
At this time, as shown in FIG. 8A, even if the fiber plates 2 are attached with care, they are strictly displaced from each other and are attached to each other, so that a gap is generated between the fiber plates. In order to eliminate these gaps, they are bonded with their positions shifted from each other. Then, polishing is performed up to the dotted line portion in FIG. 8A, and one side is flattened and aligned as shown in FIG. 8B.

Subsequently, by the same procedure as described with reference to FIGS. 8A and 8B, the two fiber plates 2 having one side aligned are so arranged that their flat surfaces are mutually aligned. Affix (FIG. 8 (c)).

Then, the two fiber plates 2 whose one side is aligned are polished up to the dotted line portion in FIG. 8C and by the same procedure as described in FIGS. 8A and 8B. Is further bonded to four fiber plates 2.

As shown in FIG. 8 (d), the cross section of the fiber plate 2 thus bonded is formed on each bonded portion by polishing the side surface or by handling during the process.
Chipping occurs. For this reason, the fiber plate 2 after bonding is polished on both the front surface and the back surface until chipping is eliminated, thereby creating a fiber plate substrate having no gap or chipping in the bonded portion as shown in FIG. .

The fiber plate substrate shown in FIG. 8E is bonded to the base substrate 10 via the spacer 13 as described with reference to FIG. 7C.

Incidentally, here, the case where the fiber plate substrate is manufactured by bonding the six fiber plates 2 has been described as an example, but actually, the predetermined size is set so that the fiber plate substrate has a required size. The number of fiber plates 2 are stuck together.

[Description of Operation] Next, the operation of the X-ray imaging apparatus will be described with reference to FIG. When an X-ray source (not shown) is installed on the phosphor 3 side, and X-rays are emitted from the X-ray source in a state where the subject is located between the X-ray source and the X-ray imaging apparatus, the X-rays are The subject is exposed. Then X
The line is transmitted to the X-ray imaging apparatus including X-ray information having an intensity difference when transmitted through the subject.

On the X-ray imaging apparatus side, most of the X-rays that have arrived are converted by the phosphor 3 into light such as visible light according to the intensity of the X-rays. The light obtained by the conversion is transmitted to the image sensor 1 through the fiber plate 2. At this time, since the fiber plate 2 and the image sensor 1 are bonded by the transparent adhesive 6, light is incident on the image sensor 1 without attenuation when passing through the transparent adhesive 6.

On the other hand, of the X-rays that have reached the X-ray imaging apparatus side, X-rays that cannot be converted by the phosphor 3 and X-rays that do not enter the phosphor 3 are converted into wavelengths that can be detected by the image sensor 1. It proceeds to the image sensor 1 side without being performed. X like this
The lines are shielded by the shielding member included in the fiber plate 2 and do not enter the imaging device 1 or the printed circuit board 12.

The light is also incident on the adhesive 7. The light incident on the adhesive 7 is absorbed or reflected, and the light transmittance is reduced. When this light is incident on the pixels of the image sensor 1, a line defect occurs. As described above, the size of the fiber plate 2 and the size of the image sensor 1 are made equal to each other, and when these are aligned, an adhesive material is formed. It is possible to adopt a configuration in which light from 7 hardly affects the pixels of the image sensor 1.

The image sensor 1 converts the incident light into an electric signal corresponding to the intensity of the light. This electric signal is read out to the flexible substrate 4 via the bump 5 in accordance with an instruction of a reading circuit (not shown). The electric signal read out to the flexible board 4 is sent to an external circuit board (not shown), and is subjected to A / D conversion and image processing.

(Embodiment 2) FIG. 9A is a sectional view of a fiber plate base according to Embodiment 2 of the present invention. FIG. 9B is an enlarged view of a portion indicated by a broken line in FIG. FIG. 9 shows a state in which the fiber plates 2 are connected to each other by an epoxy resin or the like containing an X-ray shielding member such as lead with an adhesive to form a fiber plate base.

The X-ray imaging apparatus according to the present embodiment is intended to prevent the X-rays that have not been converted into light out of the X-rays incident on the phosphor 3 from being incident on the image sensor 1. That is, of the X-rays incident on the phosphor 3, those which are not converted into light are:
The fiber plate 2 containing lead or the like is shielded by an adhesive containing a shielding member. Thus, in the present embodiment, the incidence of X-rays on the image sensor 1 is prevented, and the occurrence of noise and the like is suppressed.

The adhesive includes ethylene / vinyl acetate copolymer, carboxyl-modified ethylene / vinyl acetate copolymer, ethylene / isobutyl acrylate copolymer, polyamide, polyester, polymethyl methacrylate,
Polyvinyl ether, polyvinyl butyral, polyurethane, styrene / butylene / styrene (SBS) copolymer, carboxyl-modified SBS copolymer, styrene / isoprene / styrene (SIS) copolymer, styrene / ethylene / butylene / styrene (SEBS) Polymer, maleic acid-modified SEBS copolymer, polybutadiene rubber, chloroprene rubber (CR), carboxyl-modified CR, styrene / butadiene rubber, isobutylene / isoprene copolymer, acrylonitrile / butadiene rubber (NBR),
Examples thereof include carboxyl-modified NBR, epoxy resin, and silicone rubber (SR), and these are used alone or in combination of two or more.

Further, if necessary, a reactive auxiliary agent, a phenol resin as a crosslinking agent, a polyol, an isocyanate, a melamine resin, a urea resin, a urotropin resin,
Amines, acid anhydrides, peroxides, metal oxides, organic metal salts such as chromium trifluoroacetate, alkoxides such as titanium, zirconia and aluminum, organic metal compounds such as dibutyltin dioxide, 2,2-die Photoinitiators such as toshiquiacetophenone and benzyl, sensitizers such as amines, phosphorus compounds and chlorine compounds, and further curing agents,
Vulcanizing agents, control agents, deterioration inhibitors, heat-resistant additives, heat conduction improvers, softeners, coloring agents, various coupling agents, metal deactivators, and the like may be appropriately added.

The shielding member includes heavy metals such as iron, cobalt, nickel, copper, zinc, silver, tin, gadolinium, tungsten, platinum, gold, lead and bismuth, and compounds or alloys thereof, and solder (Pb- Sn) alloys and metal particles used for the paste and silver paste, particles obtained by coating heavy metal by plating, sputtering, or the like on particles (carbon particles, plastic balls) made of an inorganic or organic material can be used.

FIG. 10 is an explanatory diagram of a manufacturing process of the fiber plate substrate shown in FIG. First, as shown in FIG. 10A, the adhesive and the X-ray shielding member are stirred using a stirring rod or the like. Then, after the bubbles generated by the stirring have disappeared, the adhesive containing the X-ray shielding member is filled between the fiber plates by a dispenser or screen printing (FIG. 10B). The filling is preferably performed in a vacuum atmosphere so that air in the gap is easily released.

Then, the adhesive is cured while the fiber plates 2 are pressed against each other. For curing, UV irradiation or heating at a temperature in the range of room temperature to 200 ° C. is preferable. afterwards,
The adhesive protruding from the upper surface of the fiber plate 2 is scraped off (FIG. 10C). Thus, a fiber plate substrate is formed.

(Embodiment 3) FIG. 11 is a sectional view of a fiber plate substrate according to Embodiment 3 of the present invention. In the present embodiment, a fiber plate substrate is prepared using a low-melting metal (metal having a melting point of 330 ° C. or less) and a liquid flux.

Pb, Sn, Bi, S
b, an alloy containing two or more kinds of metals such as In, Ag, and Cd;
For example, Sn-Pb (63:37 wt%) eutectic solder or Sn-Pb (10:90 wt%) high melting point solder can be used. Further, it is desirable that the low melting point metal has a granular shape so as to be easily mixed with the liquid flux.

In the liquid flux, rosin-based liquid flux includes resin components such as purified rosin, hydrogenated rosin, and polymerized rosin, and alcohols such as terpineol, 1,4-butanediol, methyl cellosolve, and ketones. For example, a solvent component such as methyl ethyl ketone, methyl isopropyl ketone, and methyl isobutyl ketone is an essential component, and polyethylene glycol,
What appropriately added additive components such as a viscosity modifier such as polyvinyl butyral and petroleum resin and an activator such as malonic acid, succinic acid and triethanolamine is used.

The water-soluble liquid flux includes:
Polyhydric alcohol components such as polyethylene glycol, glycerin and polyvinyl alcohol, water as a solvent component are essential components, and further a viscosity modifier such as polyacrylamide, organic acid, organic or inorganic halide salt, diethylamine hydrochloride, etc. What mix | blends the additive component, such as an activator, suitably is used. Among them, a water-soluble liquid flux is preferably used.

FIG. 12 is an explanatory diagram of a manufacturing process of the fiber plate substrate shown in FIG. First, FIG.
As shown in (1), a powdery low melting point metal and a liquid flux are mixed. Then, after the bubbles generated by the stirring disappear, the liquid flux containing the X-ray shielding member is filled between the fiber plates by a dispenser or screen printing (FIG. 12B). The filling is preferably performed in a vacuum atmosphere so that air in the gap is easily released.

Then, the fiber plates 2 are mutually pressurized and simultaneously heated at a temperature higher than the melting point to fuse the low melting point metal. Thus, a fiber plate base as shown in FIG. 12C is formed.

(Embodiment 4) FIG. 13 is a sectional view of a fiber plate base according to Embodiment 4 of the present invention. In this embodiment, the fiber plate is bonded by the first and second metal layers to form a fiber plate base.

FIG. 14 is an explanatory diagram of a manufacturing process of the fiber plate substrate shown in FIG. First, for example, both sides of the fiber plate 2 are coated with an acid-resistant etching resist such as a photosensitive film (FIG. 14).
(A)). Then, the resist is brought into close contact with the fiber plate 2 by heating. Then, the first
To increase the adhesion between the metal layer and the glass, use hydrofluoric acid, potassium fluoride, ammonium acid fluoride, etc.
The end surface of the fiber plate 2 is etched to roughen the surface (FIG. 14B).

Subsequently, a first metal layer such as nickel or copper is formed on the etched end face by electroless plating (FIG. 14C). Then, a second metal layer, which is an alloy, is electroplated on the first metal layer (FIG. 14D).
It is difficult for the second metal layer to be plated directly on a non-conductor such as glass. Therefore, the above-described first metal layer is provided first to perform conductor processing, and thereafter, the second metal layer is formed by electroplating.

Then, the resist is peeled off, and the second metal layer is heated at a temperature of not less than the melting point and not more than 330 ° C. while mutually pressing the fiber plates 2 (FIG. 14).
(E)). After that, the first and second metal layers protruding from the upper surface of the fiber plate 2 are scraped off. Thus, a fiber plate substrate is formed.

As described above, in the second to fourth embodiments, since the fiber plates 2 are connected to each other by the adhesive portion having a shielding property for shielding X-rays, they are not converted into light by the phosphor 3. Thus, the X-rays emitted to the fiber plate substrate side are shielded by the fiber plate substrate, so that the X-rays are not incident on the imaging device 1 and the occurrence of noise and the like can be suppressed.

(Embodiment 5) FIG. 15 is a conceptual diagram showing a configuration of a nondestructive inspection system provided with the X-ray imaging apparatus described in Embodiment 1. FIG. 15 shows an X-ray imaging apparatus 1000 described in the first embodiment, a subject 2000 which is a non-destructive inspection target incorporated in, for example, an electric device, and a microfocus X-ray generator 3000 which irradiates the subject 2000 with X-rays. An image processing device 6000 for processing a signal output from the X-ray imaging device 1000; and a monitor 40 for displaying an image processed by the image processing device 6000.
00 and a controller 5000 that operates the image processing device 6000 and the monitor 4000.

The non-destructive inspection system shown in FIG. 15 irradiates an object 2000 to be subjected to a non-destructive inspection with X-rays generated by the microfocus X-ray generator 3000. However, through the X-ray imaging apparatus 1000, the image processing apparatus 600
Output to 0. In the image processing device 6000, the output signal is processed as an image signal between the peripheral pixels of each of the imaging elements 1 described above, subjected to dark correction, and the like, and displayed as an image on the monitor 4000.

The image displayed on the monitor 4000 is
By inputting instructions by the controller 5000,
For example, enlargement or reduction, shading control, and the like can be performed. Thus, through the image displayed on the monitor 4000, the presence or absence of destruction inside the subject 2000 is inspected. Then, if no destruction is found in the object 2000, it is regarded as a non-defective product and incorporated into the electric device. On the other hand, if a break is found in the object 2000, it is regarded as a defective product and is excluded from the manufacturing process.

(Embodiment 6) FIG. 16 is a conceptual diagram showing the configuration of an X-ray diagnostic system provided with the X-ray imaging apparatus described in Embodiment 1. FIG. 16 shows an X-ray imaging apparatus 1000.
, An X-ray generator 7000 for irradiating the subject 2000 with X-rays, processing of an image signal output from the X-ray imaging device 1000, and an X-ray generator 7000
The figure shows an image processor 8000 for controlling the timing of X-ray irradiation from the camera and a monitor 4000 for displaying an image signal processed by the image processor 8000. In FIG. 16, the same parts as those shown in FIG. 9 are denoted by the same reference numerals.

In the X-ray diagnostic system shown in FIG. 16, an X-ray generator 7000 generates X-rays based on an instruction from an image processor 8000 and irradiates the X-rays to a subject 2000 on a bed. Is output to the image processor 8000 through the X-ray imaging apparatus 1000. In the image processor 8000, the output signal is processed by processing the above-described image signal between the peripheral pixels of each image sensor 1, subjected to dark correction or the like, and stored in a memory (not shown). Display as

The image displayed on the monitor 4000 is
By inputting an instruction with the image processor 8000, for example, enlargement or reduction, shading control, and the like can be performed. Thus, the doctor examines the subject 2000 through the image displayed on the monitor 4000.

The subject 2000 after the doctor's consultation
X-ray information is provided by the recording means of this system,
The information may be recorded on a recording medium such as a recording medium on a disk.

In each of the embodiments of the present invention described above, the case where X-rays are used has been described as an example. However, radiation such as α, β, and γ-rays can be used. Light is an electromagnetic wave in a wavelength region that can be detected by a pixel, and includes visible light.
Further, the present invention can be applied to, for example, an electromagnetic wave electric signal converter that converts electromagnetic waves including radiation into electric signals.

[0088]

As described above, the present invention relates to a fiber plate having a plurality of fiber plates provided between a wavelength conversion means and a photoelectric conversion means for guiding light from the wavelength conversion means to the photoelectric conversion means. Since the base is made by bonding a plurality of fiber plates to each other using an adhesive, the radiation imaging apparatus can be manufactured without complicated processing and alignment of the fiber plates.

[Brief description of the drawings]

FIG. 1 is a sectional view of an X-ray imaging apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a schematic configuration of the image sensor of FIG. 1;

FIG. 3 is a schematic view of the vicinity of a bump and a flexible wiring board of FIG. 1;

FIG. 4 is a diagram illustrating a state of electrical connection between a bump and a flexible substrate illustrated in FIG. 3;

FIG. 5 is an enlarged view of the vicinity of a flexible wiring board of the imaging device of FIG. 1;

FIG. 6 is a view showing a bonding step between the image pickup device of FIG. 1 and a base substrate.

FIG. 7 is an explanatory view of a step of bonding the image pickup device 1 and the base substrate of FIG. 1 to a fiber plate base.

FIG. 8 is a schematic view showing a manufacturing process of the fiber plate substrate of FIG.

FIG. 9 is a cross-sectional view of a fiber plate base according to Embodiment 2 of the present invention.

FIG. 10 is an explanatory diagram of a manufacturing process of the fiber plate substrate shown in FIG.

FIG. 11 is a cross-sectional view of a fiber plate base according to Embodiment 3 of the present invention.

FIG. 12 is an explanatory diagram of a manufacturing process of the fiber plate substrate shown in FIG.

FIG. 13 is a sectional view of a fiber plate base according to a fourth embodiment of the present invention.

14 is an explanatory diagram of a manufacturing process of the fiber plate base shown in FIG.

FIG. 15 is a conceptual diagram illustrating a configuration of a nondestructive inspection system including the X-ray imaging device described in the first embodiment and the like.

FIG. 16 is a conceptual diagram illustrating a configuration of an X-ray diagnostic system including the X-ray imaging device described in the first embodiment and the like.

FIG. 17 is a perspective view of an X-ray imaging apparatus according to the related art (1).

FIG. 18 is a perspective view of an X-ray imaging apparatus of the related art (2).

FIG. 19 is a sectional view of the X-ray imaging unit.

20 is an explanatory diagram of a step of bonding the image pickup device 1 and the base substrate and the fiber plate base in FIG. 19;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Image sensor 2 Fiber plate 3 Phosphor (wavelength conversion means) 4 Flexible substrate 5 Bump 6 Transparent adhesive 7 Adhesive 8 Protective sheet 9 Housing cover 10 Base substrate 11 Base housing 12 Printed circuit board 13 Spacer 14 Joint filling adhesive 15 sealing resin

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 27/14 D (72) Inventor Kenji Kajiwara 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. F-term (reference) 2G088 EE01 EE29 FF02 FF04 FF05 FF06 GG15 GG19 JJ05 JJ09 JJ31 JJ33 JJ37 4M118 AA01 AA06 AB01 CB11 CB20 GA10 GB01 GB10 HA03 HA21 HA23 HA25 HA26 HA31 5C024 EX24 AX16 CAX AX12 AX16 C

Claims (7)

[Claims]
1. A fiber plate that guides light converted by a phosphor to a photoelectric conversion unit and shields radiation that could not be converted by the phosphor, and controls reading of an electric signal converted by the photoelectric conversion unit. A radiation imaging unit, comprising: a control unit that is smaller than the fiber plate; and wherein the control unit that is smaller than the fiber plate is disposed under the fiber plate.
2. The radiation imaging unit according to claim 1, wherein a surface of said fiber plate is polished and flattened.
3. The radiation according to claim 1, wherein after the fiber plate is bonded to the photoelectric conversion means, a side of the fiber plate where light does not enter and exit is polished according to an area of the photoelectric conversion means. Imaging unit.
4. The radiation imaging apparatus according to claim 1, wherein the fiber plate is attached to a turntable provided with a felt and a puff, and is polished by using a slurry as an abrasive, or is mechanically polished. unit.
5. A radiation imaging apparatus, wherein the radiation imaging unit according to claim 1 is formed by bonding together with an adhesive.
6. The radiation imaging apparatus according to claim 5, wherein the adhesive for bonding the fiber plates to each other is an adhesive having a shielding property for shielding the radiation.
7. A radiation imaging apparatus according to claim 5, signal processing means for processing a signal from said radiation imaging apparatus, recording means for recording a signal from said signal processing means, and said signal processing means. A radiation means for displaying a signal from the signal processing means, a transmission processing means for transmitting a signal from the signal processing means, and a radiation source for generating the radiation. system.
JP2001178845A 2001-06-13 2001-06-13 Radiation image pickup unit, device and system Pending JP2002372586A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001178845A JP2002372586A (en) 2001-06-13 2001-06-13 Radiation image pickup unit, device and system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001178845A JP2002372586A (en) 2001-06-13 2001-06-13 Radiation image pickup unit, device and system

Publications (1)

Publication Number Publication Date
JP2002372586A true JP2002372586A (en) 2002-12-26

Family

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Family Applications (1)

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Country Status (1)

Country Link
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007155561A (en) * 2005-12-07 2007-06-21 Acrorad Co Ltd Radiological image detection module and radiological image detection device
JP2007285709A (en) * 2006-04-12 2007-11-01 Canon Inc Method for manufacturing radiation imaging apparatus and radiation imaging system
JP2011145212A (en) * 2010-01-15 2011-07-28 Hitachi Metals Ltd Radiation detector and manufacturing method thereof
JP2011525238A (en) * 2008-06-16 2011-09-15 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Radiation detector and method for manufacturing the radiation detector
WO2011152194A1 (en) 2010-06-04 2011-12-08 浜松ホトニクス株式会社 Scintillator panel and radiation image sensor
JP2014062819A (en) * 2012-09-21 2014-04-10 Semiconductor Energy Lab Co Ltd Image pickup device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007155561A (en) * 2005-12-07 2007-06-21 Acrorad Co Ltd Radiological image detection module and radiological image detection device
JP2007285709A (en) * 2006-04-12 2007-11-01 Canon Inc Method for manufacturing radiation imaging apparatus and radiation imaging system
JP2011525238A (en) * 2008-06-16 2011-09-15 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Radiation detector and method for manufacturing the radiation detector
JP2011145212A (en) * 2010-01-15 2011-07-28 Hitachi Metals Ltd Radiation detector and manufacturing method thereof
WO2011152194A1 (en) 2010-06-04 2011-12-08 浜松ホトニクス株式会社 Scintillator panel and radiation image sensor
JP2014062819A (en) * 2012-09-21 2014-04-10 Semiconductor Energy Lab Co Ltd Image pickup device

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