JP2023054687A - Capacitive sensor device and manufacturing method therefor - Google Patents

Abstract

To provide a capacitive sensor device which offers an increase detection size, and a method of manufacturing the same.SOLUTION: A capacitive sensor device 1 provided herein comprises multiple capacitive sensor elements 20 spaced apart and two-dimensionally arranged on a printed wiring board 10, each capacitive sensor element comprising multiple two-dimensionally arranged pixels configured to individually detect capacitance between themselves and an inspection target facing them.SELECTED DRAWING: Figure 1

Description

The present invention relates to a capacitive sensor device and a method for manufacturing the capacitive sensor device.

A capacitive sensor element is a sensor that detects various states of an object to be inspected from a signal corresponding to the capacitance between the object to be inspected and the sensor electrode when the sensor electrode is brought close to the object to be inspected. This type of capacitive sensor element is used, for example, in an inspection apparatus for determining the quality of a conductive pattern formed on a circuit board.

JP-A-11-326424

The inspection takt time of the inspection equipment is an important specification. It is considered effective to increase the detection size as a means of improving the inspection takt time. However, since the capacitive sensor element is manufactured by the CMOS process, there is a yield, and there is also a restriction on the size that can be manufactured by the manufacturing equipment.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a capacitive sensor device capable of increasing the detection size and a method of manufacturing the same.

In the capacitive sensor device according to the first aspect of the present invention, a plurality of capacitive sensor elements each including a plurality of pixels arranged two-dimensionally and each detecting a capacitance between an object to be inspected facing each other are formed by printed wiring. A plurality of them are arranged two-dimensionally on the substrate at intervals.

A method for manufacturing a capacitive sensor device according to a second aspect of the present invention detects the capacitance between a surface plate having a flatness of ±5 μm or less and two-dimensionally arranged inspection objects facing each other. arranging the first surfaces of the plurality of capacitive sensor elements on a surface plate in alignment with the plurality of capacitive sensor elements including the plurality of pixels that are the opposite sides of the respective first surfaces; applying an adhesive to the second surface of each of the capacitive sensor elements; aligning the surface plate with the printed wiring board and bringing the printed wiring board into contact with the second surface of each capacitive sensor element; Pressing the printed wiring board with a pressing member configured to abut against the surface plate when in contact with the printed wiring board, and curing the adhesive in a state where the printed wiring board is pressed by the pressing member. equip.

ADVANTAGE OF THE INVENTION According to this invention, the capacitive sensor apparatus which can enlarge a detection size, and its manufacturing method can be provided.

FIG. 1 is a diagram showing a capacitive sensor device according to one embodiment. FIG. 2 is a schematic diagram for explaining pixels. FIG. 3 is a diagram showing a conceptual configuration of an inspection device including a capacitive sensor device. FIG. 4 is a diagram showing the configuration of an example of a capacitive sensor device manufacturing apparatus. FIG. 5 is a flow chart showing a method of manufacturing a capacitive sensor device. FIG. 6 is a diagram showing a capacitive sensor device according to a modification. FIG. 7 is a diagram showing a capacitive sensor device according to a modification.

Embodiments will be described below with reference to the drawings. FIG. 1 is a diagram showing a capacitive sensor device according to one embodiment. The capacitive sensor device 1 is a sensor device that is brought close to an object to be inspected and configured to output a signal corresponding to the capacitance between the object and the object to be inspected. The capacitive sensor device 1 is configured by two-dimensionally arranging capacitive sensor elements 20 on a printed circuit board 10 at intervals, that is, tiling them. The printed wiring board 10 may be a planar substrate such as a ceramic substrate or a silicon substrate. The capacitive sensor element 20 is a sensor chip composed of a plurality of pixels 21 that are two-dimensionally arranged and detect the electrostatic capacitance between each facing test object. In other words, the capacitive sensor element 20 can detect the capacitance on the surface by itself.

The pixel 21 has a sensor electrode 22 and a pixel circuit 23 . The sensor electrode 22 is, for example, a square electrode that is configured to output a voltage corresponding to the capacitance between the sensor electrode 22 and the object to be inspected. A detection area 22 a is configured by the sensor electrodes 22 . The pixel circuit 23 reads a voltage signal generated in the sensor electrode 22, and is connected to a peripheral circuit formed outside the detection area 22a. The peripheral circuit is a circuit or the like that bundles the outputs from the respective pixel circuits 23, and is a circuit that performs preprocessing such as readout of the output voltage signals of the respective pixel circuits 23, noise removal, amplification, etc., for subsequent determination processing. be. The connection between the peripheral circuit and the printed wiring board 10 can be made by various methods such as wire bonding, bump bonding, and flip chip bonding.

For example, in the example of FIG. 1, eight capacitive sensor elements 20 are arranged in a rectangular shape. Here, the width of one capacitive sensor element 20 is W, the height of the capacitive sensor element 20 is H, the width of the detection area 22a is PW, the height of the detection area 22a is PH, the interval between the detection areas 22a is PI, the capacitance When the spacing of the sensor elements 20 is CI, for example, the spacing PI between the detection areas 22a is equal to the size of the detection area 22a, that is, the width PW and the height PH of the detection area 22a. The spacing of placement may be determined. In practice, it is preferable that the spacing between the capacitive sensor elements 20 is less than or equal to the size of the detection area of the capacitive sensor elements 20 . Further, for example, when the sensor electrode 22 is not square and the width PW and the height PH of the detection area 22a are not equal, the interval PI between the detection areas may be different in the width direction and the height direction. A signal cannot be detected in a section where the capacitive sensor element 20 is not arranged. In order to obtain a signal in a section where no signal could be detected, it is necessary to actually move the capacitive sensor element 20 to that position. Since the arrangement interval of the capacitive sensor elements 20 is equal to or less than the size of the detection area of the capacitive sensor element, by moving the capacitive sensor device 1 by an amount corresponding to the size of the detection area, the capacitance is detected in the section where the signal could not be detected. A sensor element 20 can be positioned.

FIG. 2 is a schematic diagram for explaining the pixel 21. As shown in FIG. As mentioned above, the pixel 21 has the sensor electrode 22 and the pixel circuit 23 . The sensor electrode 22 is configured to output a voltage corresponding to the electrostatic capacitance between the inspection target T and the sensor electrode 22 . For example, when the inspection object T is a conductive pattern of a circuit board, the inspection signal Vin is applied to this conductive pattern. When the sensor electrode 22 is brought close to the conductive pattern in this state, a capacitor is formed between the sensor electrode 22 and the conductive pattern. At this time, the sensor electrode 22 outputs a voltage corresponding to the capacitance with the conductive pattern to the pixel circuit 23 . Here, the surface of each sensor electrode 22 may be covered with a protective film. By covering the surface of the sensor electrode 22 with the protective film, the sensor electrode 22 can be prevented from being damaged, worn, or soiled due to direct contact with the test object T.

In the pixel 21 as shown in FIG. 2, for example, the distance between one sensor electrode 22 and the inspection object T is d, the area of the surface of the sensor electrode 22 facing the inspection object T is S, and the sensor electrode 22 and the inspection object are The capacitance Cs of the capacitor is Cs=εS/d, where ε is the dielectric constant of a medium interposed between T and air, for example. That is, the electrostatic capacitance Cs changes with the distance d. For example, if the conductive pattern on the circuit board has a fault such as a disconnection or a short circuit, the distance d at this fault differs from the originally assumed value of the distance. For this reason, the electrostatic capacitance Cs at the fault location changes from its originally assumed value. A voltage is generated in the sensor electrode 22 according to the change in the capacitance Cs. From this change in voltage, it is possible to determine whether or not there is a fault in the conductive pattern of the circuit board, for example.

Here, in FIG. 1, eight capacitive sensor elements 20 are arranged. The number of capacitive sensor elements 20 is not limited to eight. For example, two, four, or six capacitive sensor elements 20 may be arranged in a rectangular shape, or ten or more capacitive sensor elements 20 may be arranged. Also, the number of capacitive sensor elements 20 is not necessarily an even number and may be an odd number. Furthermore, in FIG. 1, four capacitive sensor elements 20 are arranged in two rows. The number of rows of capacitive sensor elements 20 is not limited to two.

FIG. 3 is a diagram showing a conceptual configuration of an inspection device including the capacitive sensor device 1. As shown in FIG. The inspection device has a capacitive sensor device 1 and a stage 2 . The inspection apparatus also has a signal processing device including a power supply circuit 3, a drive mechanism 4, a mechanical control circuit 5, a measurement circuit 6, a determination circuit 7, a display device 8, and a control circuit 9. there is Here, the mechanical control circuit 5, the measurement circuit 6, the determination circuit 7, and the control circuit 9 do not necessarily have to be configured by hardware. Operations equivalent to those of the mechanical control circuit 5, the measurement circuit 6, the determination circuit 7, and the control circuit 9 may be implemented by software executed by a CPU or the like.

Under the control of the mechanical control circuit 5, the capacitive sensor device 1 is arranged at a position facing the conductive pattern of the test object T, for example, the circuit board. Then, each capacitive sensor element 20 of the capacitive sensor device 1 outputs to the measurement circuit 6 a voltage signal corresponding to the capacitance with the conductive pattern which is the object T to be inspected.

The stage 2 is a stage for placing an inspection object T thereon. The stage 2 may be a fixed stage or a movable stage. If the stage is movable, it can be configured such that the inspection object T can be replaced automatically.

The power supply circuit 3 is a power source for applying the inspection signal Vin to the conductive pattern as the inspection object T, for example. The inspection signal is, for example, a predetermined constant voltage. By applying a test signal to the conductive pattern by the power supply circuit 3, the pixel 21 of each capacitive sensor element 20 outputs a voltage signal corresponding to the capacitance with the conductive pattern.

The drive mechanism 4 is configured to move the capacitive sensor device 1 in the XY directions parallel to the conductive pattern as the inspection object T and in the Z direction perpendicular to the conductive pattern. The drive mechanism 4 has, for example, a Z movement mechanism, a Y movement mechanism, a support section, and an X movement mechanism. The Z movement mechanism is a mechanism that extends in the Z direction and has an actuator that moves the Y movement mechanism in the Z direction. The Y movement mechanism is a mechanism that extends in the Y direction and has an actuator that moves the support portion in the Y direction. The support section is a member that supports the X movement mechanism. The X movement mechanism is a mechanism that extends in the X direction and has an actuator that moves the capacitive sensor device 1 in the X direction. The configuration of the drive mechanism 4 is not limited to the configuration described here. The configuration of the drive mechanism 4 may be determined according to the inspection target T. FIG.

The mechanical control circuit 5 controls the driving mechanism 4 so as to move the capacitive sensor device 1 to the inspection position above the inspection object T. FIG. For example, the mechanical control circuit 5 commands the drive mechanism 4 to move the capacitive sensor device 1 to coordinates specified by the control circuit 9 .

The measurement circuit 6 performs processing for measurement based on voltage signals output from the respective capacitive sensor elements 20 of the capacitive sensor device 1 . For example, the measurement circuit 6 generates inspection images. The inspection image is an image whose pixel values are values generated based on the output of each pixel 21 of each capacitive sensor element 20 . For example, the measurement circuit 6 multi-values the voltage signal output from each capacitive sensor element 20, and assigns pixel coordinates and luminance values to the multi-valued signal to generate an inspection image. As shown in FIG. 1, since the voltage signal is not detected in the section between the capacitive sensor elements 20, the image lacks in this section. The measurement circuit 6 determines pixel coordinate values to be assigned to the multi-valued signal according to the coordinates specified by the control circuit 9 .

The determination circuit 7 compares the inspection image and the reference image to determine whether or not there is a defective portion such as a disconnection portion or a short circuit portion in the conductive pattern. The reference image is, for example, an image of a conductive pattern with no defects. In this case, a location where there is a difference in pixel value between the inspection image and the reference image becomes a defective location.

The display device 8 is a display device such as a liquid crystal display. The display device 8 displays the result of determination by the determination circuit 7, for example. The display of the determination result is a display of an image in which the difference between the inspection image and the reference image is emphasized. The display device 8 may be provided separately from the signal processing device.

A control circuit 9 is a processor such as a CPU, an ASIC, an FPGA, or the like, and controls the entire signal processing apparatus. For example, the control circuit 9 outputs signals for controlling the operation of the capacitive sensor device 1 . The control circuit 9 also outputs a signal for designating the coordinates of the capacitive sensor device 1 to the mechanical control circuit 5 and the measurement circuit 6 .

Next, a method for manufacturing the capacitive sensor device 1 according to the embodiment will be described. As described above, the pixels 21 forming each capacitive sensor element 20 of the capacitive sensor device 1 output a voltage signal corresponding to the distance from the inspection object T. FIG. Therefore, if the detection area of the capacitive sensor device 1 is not flat, even if the capacitive sensor elements 20 are arranged parallel to the flat test object T, the distance between each pixel 21 and the test object T will not be uniform. variation occurs without Therefore, one capacitive sensor element 20 should be arranged as flat as possible. For example, the flatness of the pixels 21 forming one capacitive sensor element 20 must be ±5 μm or less with respect to a predetermined value, for example, a predetermined reference plane. The flatness condition of the pixels 21 in one capacitive sensor element 20 can be achieved, for example, by making the manufacturing conditions the same in the CMOS process.

On the other hand, when a plurality of capacitive sensor elements 20 are tiled on the printed wiring board 10 as in the embodiment, the flatness of the pixels 21 between the capacitive sensor elements 20 must also be a predetermined value, for example, 5 μm or less. Here, when trying to tile the capacitive sensor elements 20 one by one on the printed wiring board 10, even if the flatness of each capacitive sensor element is ±5 μm or less, the capacitive sensor elements 20 cannot be tiled during tiling. Flatness varies between them. The magnitude of this variation is about ±30 μm, which is much larger than the variation in flatness within a single capacitive sensor element 20 . In other words, the method of tiling the capacitive sensor elements 20 one by one on the printed wiring board 10 cannot satisfy the flatness condition required for a capacitive sensor device.

Therefore, in the embodiment, the capacitive sensor elements 20 are not tiled one by one, but are collectively tiled under the same manufacturing conditions. This suppresses variations in flatness among the capacitive sensor elements 20 .

FIG. 4 is a diagram showing the configuration of an example of a manufacturing apparatus for the capacitive sensor device 1. As shown in FIG. The manufacturing apparatus shown in FIG. 4 is an apparatus for tiling together a plurality of capacitive sensor elements 20 on a printed wiring board 10 . It is assumed that each capacitive sensor element 20 is manufactured in advance so as to have a flatness of ±5 μm or less. It is also assumed that each capacitive sensor element 20 has an alignment mark formed thereon. Similarly, it is assumed that alignment marks are also formed on the printed wiring board 10 .

The manufacturing apparatus has a surface plate 101 , a vacuum suction mechanism 102 , a vacuum pump 103 and a pressing member 104 .

The platen 101 is a plate-like member on which the capacitive sensor element 20 is arranged. The flatness of the surface of the platen 101 in contact with the capacitive sensor element 20 is at least ±5 μm or less, preferably less than ±5 μm. A through-hole 101a is formed in the surface plate 101 at, for example, the central position where each capacitive sensor element 20 is to be arranged. Alignment marks are formed on the surface plate 101 in the vicinity of the locations where the capacitive sensor elements 20 are to be arranged. Further, alignment marks for positioning the printed wiring board 10 are also formed on the surface plate 101 .

The vacuum suction mechanism 102 is attached to, for example, the surface of the surface plate 101 opposite to the surface in contact with the capacitive sensor element 20, and the surface of the surface plate 101 opposite to the surface in contact with the capacitive sensor element 20 is hermetically sealed. do. The vacuum adsorption mechanism 102 is attached to the vacuum pump 103 . The vacuum pump 103 evacuates the inside of the vacuum adsorption mechanism 102 and the through hole 101 a by discharging air from the through hole 101 a through the vacuum adsorption mechanism 102 , thereby evacuating the capacitive sensor element 20 arranged on the surface plate 101 . is adsorbed on the surface plate 101 .

The pressing member 104 is a member that presses the surface plate 101 from the side of the surface of the surface plate 101 in contact with the capacitive sensor element 20 . The pressing member 104 presses the printed wiring board 10 aligned with the capacitive sensor element 20 to which the adhesive 11 is applied. A biasing portion 105 is formed on the surface of the pressing member 104 that contacts the printed wiring board 10 . In addition, around the surface of the pressing member 104 that contacts the printed wiring board 10, a contact portion 104a is formed so as to protrude so as to contact the surface plate 101 during pressing.

The biasing portion 105 applies biasing force to the printed wiring board 10 when the printed wiring board 10 is in contact with the printed wiring board 10 , thereby uniforming the load applied from the pressing member 104 to the printed wiring board 10 . The biasing portion 105 can be configured by, for example, a biasing member such as a compression spring, a mechanism such as an air pressure piston, or the like. The configuration of the biasing portion 105 is not limited to a specific configuration.

FIG. 5 is a flow chart showing a method for manufacturing the capacitive sensor device 1. As shown in FIG. In step S1, the surface plate 101 and the chip of each capacitive sensor element 20 are aligned by recognizing the alignment marks formed on the surface plate 101 and the chip of each capacitive sensor element 20 by, for example, a camera. . Then, the chips of the respective aligned capacitive sensor elements 20 are arranged on the platen 101 so that the detection area faces the platen 101 .

In step S<b>102 , each capacitive sensor element 20 is vacuum-sucked to the surface plate 101 by the vacuum pump 103 . Thereby, the capacitive sensor element 20 is fixed to the surface plate 101 .

In step S<b>3 , the adhesive 11 is applied to the back surface of each capacitive sensor element 20 . The adhesive 11 can be selected from any one of a room temperature curable adhesive, a thermosetting adhesive, an ultraviolet curable adhesive, or a combination of a thermosetting adhesive and an ultraviolet curable adhesive.

In step S4, the surface plate 101 and the printed wiring board 10 are aligned by recognizing the alignment marks formed on the surface plate 101 and the printed wiring board 10 with, for example, a camera. Then, the printed wiring board 10 is arranged on each capacitive sensor element 20 to which the adhesive 11 is applied.

In step S<b>5 , while the printed wiring board 10 is being pressed by the pressing member 104 , a process for curing the adhesive 11 is performed. Thereby, the capacitive sensor device 1 is manufactured. As a process for curing the adhesive 11, for example, if the adhesive 11 is a thermosetting adhesive, the adhesive 11 is heated in addition to being pressed by the pressing member 104. FIG. If the adhesive 11 is an ultraviolet curable adhesive, the adhesive 11 is irradiated with ultraviolet rays in addition to being pressed by the pressing member 104 . On the other hand, if the adhesive 11 is a room temperature curing adhesive, heating and ultraviolet irradiation are unnecessary.

As described above, according to the embodiment, a plurality of capacitive sensor elements including a plurality of pixels that are two-dimensionally arranged and detect the capacitance between an object to be inspected and are opposed to each other are mounted on the printed wiring board. A capacitive sensor device is configured by arranging them two-dimensionally with an interval between them. This eliminates the need to increase the chip size of each capacitive sensor element more than necessary. Therefore, the detection size can be increased without being restricted by the size of the capacitive sensor element due to yield or manufacturing equipment.

Here, when tiling a plurality of capacitive sensor elements on a printed wiring board, it becomes more difficult to keep the flatness within a certain range than in the case of a single capacitive sensor element. Therefore, in the embodiment, by tiling a plurality of capacitive sensor elements at the same time, variations in flatness can be reduced. Further, during manufacturing, a plurality of capacitive sensor elements and the printed wiring board are adhered while a load is applied to the printed wiring board while the capacitive sensor elements 20 are fixed to a flat board surface by vacuum suction. Further, when the printed wiring board is pressed, an urging force is applied to the printed wiring board by the urging member, and the abutting portion formed in the pressing portion abuts against the surface plate, thereby applying an excessive load to the printed wiring board. is suppressed. These can also reduce variations in flatness. As a result, the flatness condition required for the capacitive sensor device 1 is satisfied even when a plurality of capacitive sensor elements are tiled.

Further, in the embodiment, alignment is performed by alignment marks respectively formed on the surface plate, the capacitive sensor element, and the printed wiring board. That is, in the embodiment, the surface plate and the capacitive sensor element are aligned and then the capacitive sensor element is fixed to the surface plate. It is glued to the substrate. With such a two-step alignment, this allows each capacitive sensor element to be placed in the correct position and once in the correct orientation with respect to the printed circuit board. This also leads to suppression of errors in measurement.

[Modification]
A modification of the embodiment will be described. In an embodiment, the flatness condition required for the capacitive sensor device is achieved by the method for manufacturing the capacitive sensor device. On the other hand, for example, the distance between three or more capacitive sensor elements constituting the capacitive sensor device and the test object is measured, and the capacitive sensor device and the test object are aligned in parallel according to the measurement result of the distance. Alternatively, the posture of the inspection object may be controlled. It is desirable that the distances between the three or more capacitive sensor elements whose distances are to be measured be as long as possible. For example, in FIG. 1, the upper left, lower left, and lower right capacitive sensor elements may be selected as distance measurement targets. Also, as a method of attitude control of the capacitive sensor device, for example, a method of floating the capacitive sensor device by an air levitation unit can be considered. The distance measurement can be performed using a distance sensor such as a photointerrupter embedded in the printed wiring board 10 of the capacitive sensor device 1, for example.

Further, in the embodiment, the capacitive sensor elements 20 are arranged in a rectangular shape. In contrast, the capacitive sensor elements 20 do not necessarily have to be arranged in a rectangular shape. For example, as shown in FIG. 6, nine capacitive sensor elements 20 may be arranged in a square. Also, as shown in FIG. 7, 11 capacitive sensor elements 20 may be arranged in a zigzag pattern. The number of capacitive sensor elements 20 is not limited to a specific number even in the square and staggered arrangements.

The present invention is not limited to the above-described embodiments, and can be modified in various ways without departing from the scope of the present invention at the implementation stage. Further, each embodiment may be implemented in combination as appropriate, in which case the combined effect can be obtained. Furthermore, various inventions are included in the above embodiments, and various inventions can be extracted by combinations selected from a plurality of disclosed constituent elements. For example, even if some constituent elements are deleted from all the constituent elements shown in the embodiments, if the problem can be solved and effects can be obtained, the configuration with the constituent elements deleted can be extracted as an invention.

REFERENCE SIGNS LIST 1 capacitive sensor device 2 stage 3 power supply circuit 4 drive mechanism 5 mechanical control circuit 6 measurement circuit 7 determination circuit 8 display device 9 control circuit 10 printed wiring board 11 adhesive 20 capacitive sensor element , 21 pixel, 22 sensor electrode, 23 pixel circuit, 101 surface plate, 101a through hole, 102 vacuum suction mechanism, 103 vacuum pump, 104 pressing member, 104a contact portion, 105 biasing portion.

In the capacitive sensor device according to the first aspect of the present invention, a plurality of capacitive sensor elements each including a plurality of pixels arranged two-dimensionally and each detecting a capacitance between an object to be inspected facing each other is printed. A plurality of them are arranged two-dimensionally on the wiring board at intervals.

The method for manufacturing a capacitive sensor device according to the second aspect of the present invention is to reduce the capacitance between a surface plate having a flatness of ±5 μm or less and two-dimensionally opposed inspection objects. arranging the first surfaces of the plurality of capacitive sensor elements on the surface plate in alignment with the plurality of capacitive sensor elements including the plurality of pixels to be detected; applying an adhesive to the second surface of each capacitive sensor element; and aligning the surface plate with the printed circuit board and bringing the printed circuit board into contact with the second surface of each capacitive sensor element. pressing the printed wiring board with a pressing member configured to abut against the surface plate when in contact with the printed wiring board; and curing the adhesive while the printed wiring board is pressed by the pressing member. Equipped with

Claims (8)

A plurality of capacitive sensor elements each including a plurality of pixels that are two-dimensionally arranged and each detect a capacitance between an object to be inspected and are opposed to each other are two-dimensionally spaced apart on a printed circuit board. Deployed capacitive sensor device. the plurality of capacitive sensor elements are spaced apart and arranged in a square or rectangular shape;
A capacitive sensor device according to claim 1 . 2. The capacitive sensor device according to claim 1, wherein the plurality of capacitive sensor elements are spaced apart and arranged in a zigzag pattern. The interval is an interval corresponding to the size of the detection area of one capacitive sensor element,
flatness of each capacitive sensor element relative to the printed wiring board is ±5 μm or less;
4. A capacitive sensor device according to any one of claims 1 to 3. Align the positions of a surface plate having a flatness of ±5 μm or less and a plurality of capacitive sensor elements including a plurality of pixels arranged in a two-dimensional manner and detecting the capacitance between an object to be inspected and facing each other. placing the first surfaces of the plurality of capacitive sensor elements on the platen;
applying an adhesive to a second surface of each capacitive sensor element opposite the first surface;
aligning the surface plate and the printed wiring board and bringing the printed wiring board into contact with the second surface of each of the capacitive sensor elements;
pressing the printed wiring board with a pressing member configured to abut against the surface plate when in contact with the printed wiring board;
curing the adhesive while the printed wiring board is pressed by the pressing member;
A method of manufacturing a capacitive sensor device comprising: The adhesive is a room temperature curable adhesive, a thermosetting adhesive, an ultraviolet curable adhesive, or a combination of a thermosetting adhesive and an ultraviolet curable adhesive.
A method of manufacturing a capacitive sensor device according to claim 5 . An urging portion that applies a predetermined urging force to the printed wiring board is formed on a surface of the pressing member that contacts the printed wiring board,
7. A method of manufacturing a capacitive sensor device according to claim 5 or 6. 8. The method of manufacturing a capacitive sensor device according to any one of claims 5 to 7, further comprising sucking each of said capacitive sensor elements to said surface plate by vacuum suction.

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