JP4687018B2 - Recycling method of disk recovered material, resin composition for film formation, and resin molded body for film formation - Google Patents

Description

  The present invention relates to a method for recycling a disk collection having a structure in which two disk substrates such as a DVD (Digital Versatile Disc) are bonded together with an adhesive, and formation of a film recycled by such a method. The present invention relates to a resin composition for coating and a resin molded body for film formation.

  For example, DVD-Video, DVD-Audio, DVD-ROM, DVD ± R, DVD ± R / W, and DVD-RAM (hereinafter collectively referred to as DVD) reproduce or record video, music, data, and the like. Widely used as media. Of course, like conventional tape-type media such as VHS tape, 8mm tape, and music tape, this DVD will be disposed of in large quantities as waste when it is used in the future. .

  Incidentally, a DVD has a structure in which two disk substrates are bonded together with an adhesive. In addition to such an adhesive, DVD contains a coating material such as a reflective film formed on a disk substrate, a recording film, a protective film, and printing ink as an additive. For this reason, even if the DVD is recovered and used again as a raw material for the disc, the above-mentioned additive is mixed as a foreign substance, resulting in a problem that reliable optical characteristics cannot be obtained.

  Thus, many techniques have been proposed for exfoliating and removing these additives by chemical treatment of the additives contained in the recovered disk (for example, Patent Documents 1 to 7).

  However, since such a conventional method uses a large amount of chemicals and generates a large amount of waste liquid, it has many problems from the viewpoint of resource saving and environmental protection. Also, most of these technologies are discs composed of a single disc substrate such as CD-DA, CD-R, CD-ROM, CD-R / W, and CD-RAM (hereinafter collectively referred to as CD). For DVDs in which two disc substrates are firmly bonded with an adhesive, it may be difficult to apply the DVD as it is.

  Under such circumstances, there is a strong social demand for an efficient DVD recycling method that is expected to be discarded in large quantities in the future.

JP-A-7-205154 JP 2003-200133 A JP-A-5-217219 JP 2001-287225 A Japanese Patent Laid-Open No. 11-57683 JP-A-8-164524 Japanese Patent No. 3270037

  Therefore, the present invention has been proposed in view of such a conventional situation, and a method for recycling a disk collection having a structure in which a disk substrate is bonded with an adhesive, and a method for reusing the same by such a method. It aims at providing the resin composition for film formation and the resin molding for film formation which were recycled.

In order to achieve this object, the method for recycling a disk collection according to the present invention includes a hydroxyl group, a phosphoric acid (salt) group, a sulfonium base, a diazonium base, an iodonium base, and a carboxyl group that are bonded to a disk substrate. Two disk substrates containing at least one coating material of a reflective film, a recording film, a protective film, and an ink film formed on the disk substrate together with an adhesive containing at least one kind A disk collection having a structure bonded with an adhesive is used as a raw material for the resin composition for film formation.

The resin composition for forming a film according to the present invention is an adhesive containing at least one or more of a hydroxyl group, a phosphoric acid (salt) group, a sulfonium base, a diazonium base, an iodonium base, and a carboxyl group to which a disk substrate is bonded. A structure in which at least one of a reflective film, a recording film, a protective film, and an ink film formed on the disk substrate, together with an agent, is bonded to the two disk substrates with an adhesive. The recovered disc is used as a raw material.

The resin-molded body for forming a film according to the present invention is an adhesive containing at least one or more of a hydroxyl group, a phosphoric acid (salt) group, a sulfonium base, a diazonium base, an iodonium base, and a carboxyl group to which a disk substrate is bonded. A structure in which two disk substrates containing at least one of a reflective film, a recording film, a protective film, and an ink film formed on the disk substrate together with the adhesive are bonded with the adhesive The recovered material having a disc is used as a raw material.

As described above, according to the present invention, together with an adhesive containing at least one or more of a hydroxyl group, a phosphoric acid (salt) group, a sulfonium base, a diazonium base, an iodonium base, and a carboxyl group to which the disk substrate is bonded, Disc recovery having a structure in which two disc substrates are bonded together with an adhesive containing at least one coating material of a reflective film, a recording film, a protective film, and an ink film formed on the disc substrate By using the product as a raw material for the film-forming resin composition or the film-forming resin molding, it is possible to effectively recycle the recovered disc without using a large amount of chemicals or generating waste liquid. It can be turned into resources.

  Hereinafter, a method for recycling a disk recovered material to which the present invention is applied, a resin composition for film formation, and a resin molded body for film formation will be described in detail with reference to the drawings.

  Examples of the DVD collection recovered by the method of recycling the disk collection to which the present invention is applied include, for example, DVDs (Digital Versatile Discs) 1 and 10 shown in FIGS.

  Specifically, as shown in FIG. 1, the DVD 1 includes a first record carrier 4 having a first recording film 3 formed on one surface side of a first disk substrate 2 having optical transparency, The first and second recording films 3 and 6 are formed on the one surface side of the transmissive second disk substrate 5 with the second recording carrier 7 on which the second recording film 6 is formed. The surfaces are opposed to each other and bonded together with an adhesive 8 having light transmittance.

  On the other hand, as shown in FIG. 2, the DVD 10 includes a first record carrier 4 in which a first recording film 3 is formed on one surface side of a first disk substrate 2 having optical transparency, and optical transparency. The second recording carrier 7 on which the second recording film 6 is formed on one surface side of the second disk substrate 5 having a surface on which the first and second recording films 3 and 6 are formed. It is located on the same side and is bonded with an adhesive 8 having light transmittance. A protective film 9 is provided on the second recording film 6 to protect the second recording film 6.

  In addition, the DVD collection is not limited to the structure of the DVDs 1 and 10, but a single-layer / single-layer single-layer disc, a double-sided / single-layer single-layer disc, a single-sided / double-layer dual-layer disc, a double-sided / double-layer dual layer A disk etc. can be mentioned.

  In addition to the first and second recording films 3 and 6 of the DVDs 1 and 10, the DVD collection contains at least one coating material such as a reflective film, a protective film, and an ink film. Can be mentioned.

  These DVDs 1 and 10 are read-only DVD-5, 9, 10, 18, DVD-Video, DVD-Audio, DVD-ROM, write-once DVD-R, DVD + R, and rewritable type. DVD-RW, DVD + RW, DVD-RAM, etc. can be mentioned.

  These DVDs 1 and 10 are generally produced by a reaction between a dihydric phenol and a carbonate precursor. That is, generally produced by reacting a dihydric phenol and a carbonate precursor by a solution method or a melting method, that is, a reaction of a dihydric phenol and phosgene, a transesterification method of a dihydric phenol and diphenyl carbonate, etc. Is.

  Examples of the dihydric phenol used here include hydroquinone, resorcinol, 4,4′-biphenol, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, and 2,2. -Bis (4-hydroxyphenyl) propane, 2,2-bis (3-methyl-4-hydroxyphenyl) propane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 2,2- Bis (4-hydroxyphenyl) butane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane, 2,2-bis (4-hydroxyphenyl) pentane, 4,4 '-(m-fluoro Nylenediisopropylidene) diphenol, 4,4 ′-(p-phenylenediisopropylidene) diphenol, 9,9-bis (4-hydroxyphenyl) fluorene, 1,1-bis (4-hydroxyphenyl) -4 -Isopropylcyclohexane, bis (4-hydroxyphenyl) ether, bis (4-hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) sulfone and the like can be mentioned. As the divalent phenol, it is preferable to use a 2,2-bis (4-hydroxyphenyl) alkane system, and it is particularly preferable to use 2,2-bis (4-hydroxyphenyl) propane.

  Examples of the carbonate precursor include carbonyl halide, carbonate ester, and haloformate. Specific examples include phosgene, diphenyl carbonate, dihaloformate of dihydric phenol, and the like.

  These aromatic polycarbonates usually have a weight average molecular weight (measured by GPC and in terms of polystyrene) of 10,000 to 100,000, preferably 30,000 to 60,000, or (Ubbelohde type) Using a viscometer, the viscosity of the methylene chloride solution at 20 ° C. is measured, whereby the viscosity average molecular weight (calculated from the intrinsic viscosity) is 10,000-60,000, preferably 14,000-20 1,000 are used.

  When the molecular weight is out of the above range, it is difficult to satisfy the resin characteristics when used as a resin composition or a resin molded body. That is, when the molecular weight is small, the impact resistance is lowered, and when the molecular weight is large, the fluidity is deteriorated.

  After forming a disk substrate using the aromatic polycarbonate as described above, usually a reflective film is formed on the disk substrate by sputtering, a protective film is formed, and these disk substrates are bonded with an adhesive. Thus, the DVDs 1 and 10 are produced.

  By the way, the recycling method of the DVD collection material to which the present invention is applied actively uses the additive contained in the DVD collection material from which the DVDs 1 and 10 are collected for the resin film formation. That is, the present inventors can form a film of a resin composition or a resin molded body using the DVD recovered material as a raw material by mixing the DVD recovered material as it is or with a predetermined amount of other resin to be painted or plated. It has been found that the characteristics are improved.

  Examples of the additive contained in the DVD collection include adhesives, coating materials such as a reflective film, a recording film, a protective film, and an ink film. Among these, resin compositions and resins In order to improve the film forming characteristics of the molded body, the adhesive used for bonding the DVDs 1 and 10 is particularly effective.

  Specifically, as the adhesive, an ultraviolet curable compound and a photopolymerization initiator are usually mentioned as essential components. As the ultraviolet curing component, monofunctional (meth) acrylate or polyfunctional (meth) acrylate is used as the polymerizable monomer. These can be used alone or in combination of two or more.

  Moreover, as a polymerizable monomer required by this invention, the following can be mentioned, for example. That is, as a monofunctional (meth) acrylate, as its substituent, for example, an alkyl group (methyl, ethyl, propyl, -butyl, i-butyl, t-butyl, amyl, 2-ethylhexyl, octyl, nonyl, lauryl, Dodecyl, tridecyl, hexadecyl, octadecyl, methoxyethyl, butoxyethyl, phenoxyethyl, cyclohexyl, stearyl, phenyl, benzyl), alkyl ether groups (methoxyethyl, butoxyethyl, phenoxyethyl, noniphenoxyethyl), hydroxyalkyl groups (2 -Hydroxyethyl, 2-hydroxypropyl, 3-chloro-2-hydroxypropyl), aminoalkyl groups (dimethylaminoethyl, diethylaminoethyl), glycidyl, tetrahydrofurfuryl, noniphenoxy Examples include tiltetrahydrofurfuryl, caprolactone-modified tetrahydrofurfuryl, caprolactone-modified dipentaerythritol, diethylene glycol ethoxylate, alkyl-modified dipentaerythritol, isobonyl, dicyclopentanyl, dicyclopentenyl, dicyclopentenyloxyethyl, etc. .

  Moreover, as a polyfunctional (meth) acrylate, as its substituent, for example, an alkyl ether group (ethylene glycol, polyethylene glycol, polypropylene glycol, propylene glycol, tripropylene glycol, 1,3-butylene glycol, neopentyl glycol) or Hydroxyalkyl groups (1,4-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol , Tricyclodecane dimethanol, tris (2-hydroxyethyl) isocyanurate, diol of ethylene oxide adduct of bisphenol A, glycerin, polyglycerin, pentaerythritol, dipentaerythritol), di (meth) Diacrylate of diol obtained by adding 4 mol or more of ethylene oxide or propylene oxide to 1 mol of acrylate (diarylate such as polypropylene glycol, di (meth) acrylate of tris (2-hydroxyethyl) isocyanurate, neopentyl glycol) ) Di (meth) acrylate of diol obtained by adding 2 mol of ethylene oxide or propylene oxide to 1 mol of acrylate, bisphenol A, and obtained by adding 3 mol or more of ethylene oxide or propylene oxide to 1 mol of trimethylolpropane Di (meth) acrylate of triol, di (meth) acrylate of diol obtained by adding 4 mol or more of ethylene oxide or propylene oxide to 1 mol of bisphenol A, hydroxyp Tripentyl triol obtained by adding 3 mol or more of ethylene oxide or propylene oxide to 1 mol of trimethylolpropane, neopentyl glycol diacrylate phosphate, caprolactone-modified hydroxypivalate neopentyl glycol diacrylate), tri (meth) acrylate (Meth) acrylate, tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, caprolactone-modified tris {(meth) acryloxyethyl} isocyanurate ), Poly (meth) acrylate (poly (meth) acrylate of dipentaerythritol, poly (meth) acrylate of alkyl-modified dipentaerythritol), Phosphoric acid (meth) acrylate (alkylated phosphoric acid (meth) acrylate, ethylene oxide modified phosphoric acid (meth) acrylate, ethylene oxide modified alkylated phosphoric acid (meth) acrylate), urethane (meth) acrylate (organic polyisocyanate and hydroxy (Reaction product of (meth) acrylate compound, or reaction product of polyol, organic polyisocyanate, and hydroxy (meth) acrylate).

  N-vinyl-2-pyrrolidone, (meth) acrylamide, vinylimidazole, 4-vinylpyridine, N-vinylformamide, vinyl acetate, acryloylmorpholine, N-vinylcaprolactam, (meth) acrylic acid, N-hydroxymethylacrylamide Alternatively, N-hydroxyethylacrylamide and alkyl ether compounds thereof can also be mentioned.

  Furthermore, as what can be used together like a polymerizable monomer, polyester (meth) acrylate, polyether (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate etc. can be mentioned as a polymerizable oligomer.

  Examples of the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone, benzyl, benzoin isobutyl ether, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-isopropylthioxanthone, 2- Chlorothioxanthone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, bis (2,6-dimethoxybenzoyl) -2, 4,4-trimethylpentylphosphine oxide, benzoyl ethyl ether, benzyldimethyl ketal, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1- (4-isopropylphenyl) -2-hydroxy 2-methylpropan-1-one, 2-methyl-1- (4-methylthiophenyl) -2-morpholino-propanone-1-one, benzophenone, diethoxyacetophenone, 4-phenylbenzophenone, isophthalophenone, 2- Hydroxy-2-methyl-1-phenylpropanone, benzoin isobutyl ether, benzoin n-butyl ether, 2,2-dimethoxy-1,2-diphenylethane-1-one, methylphenylglyoxylate, 3,6-bis (2-methyl-2-morpholinopropanonyl) -9-butyl-carbazole, isoacryl-4- (dimethylamino) benzoate, ethyl-4- (dimethylamino) benzoate, [4- (4-methylphenylthio) Phenyl] phenylmethane, 4-benzoyl-4 ′ Methyl-diphenyl sulfide, (1-6-η-cumene) (η-cyclopentadienyl) iron (1+) hexafluorophosphate (1-), 2,2-dimethoxy-2-phenylacetophenone, Michler's ketone, 2 -Methyl- [4- (methylthio) phenyl] -2-morpholino 1-propanone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-chlorothioxanthone, aromatic diazonium salt , Aromatic sulfonium salt {4,4′-bis [di (β-hydroxyethoxy) phenylsulfonio] phenyl sulfide-bishexafluoroantimonate, 2,4-bis (trichloromethyl) -6- (4-methoxy Phenyl) -1,3,5-triazine, triallylsulfonium hexafluorammonate, tri Lil sulfonium hexafluorophosphate}, which can be exemplified aromatic iodonium salts {tolylcumyliodonium tetrakis (pentafluorophenyl) borate}, and the like.

  Among the above adhesives (ultraviolet curable compound + photopolymerization initiator), it is preferable to use one having a hydroxyl group, a phosphoric acid (salt) group, a sulfonium base, a diazonium base, an iodonium base, or a carboxyl group. . Due to the presence of these characteristic groups, active sites are present on the resin surface, and the film-forming properties (plating properties and paintability) of the resin are improved. Of these characteristic groups, those having a hydroxyl group are particularly preferred. In addition, it can confirm that these characteristic groups are contained by measuring the said resin by FT-IR etc.

  The content of these adhesives is preferably 0.005 to 20% by weight, and 0.05 to 10% by weight with respect to the target film-forming resin composition or film-forming resin molding. % Is more preferable, and it is still more preferable that it is 0.5 to 5 weight%. If the added amount of the adhesive is less than this, it becomes difficult to obtain the effect of improving the film property of the resin, and conversely, if it is increased, the resin characteristics (such as mechanical characteristics) are impaired.

  Moreover, as other components other than the adhesive, at least one or more kinds of coating materials such as a reflective film, a recording film, a protective film, and an ink film can be mentioned.

  Specifically, examples of the reflective film include at least one of Al, Au, and Si, but there is no particular limitation as long as it is a grade that is usually used for optical disks, and it is a single object. It may also be a mixture (alloy) with other substances.

  As the recording film, for example, at least one of organic dyes including cyanine, azo, and phthalocyanine dyes, Te, Se, S, Ge, In, Sb, Fe, Tb, Co, Ag, Ce, and Bi An inorganic alloy made of

  Examples of the protective film include a prepolymer component (A), a monomer component (B), a polymerization initiator component (C), and other components (D).

  Examples of the component (A) include polyester acrylate, polyurethane acrylate, epoxy acrylate, and polyether acrylate.

  As the component (B), for example, a component (B1) that increases the cured coating strength of the composition and a diluted component (B2) that decreases the concentration of the composition can be contained.

  The component (B1) preferably has two or more (meth) acryloyl groups in the molecule, and more preferably has three or more (meth) acryloyl groups. For example, examples of the compound having two or more (meth) acryloyl groups in the molecule include dicyclopentanyl di (meth) acrylate, alkylene oxide-modified bisphenol A di (meth) acrylate such as ethylene oxide and propylene oxide, and the like. be able to. The compounds having two or more (meth) acryloyl groups in the molecule include trimethylolpropane tri (meth) acrylate, alkylene oxide-modified trimethylolpropane tri (meth) acrylate such as ethylene oxide and propylene oxide, dipenta Erythritol hexa (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, alkyl-modified dipentaerythritol penta (meth) acrylate, alkyl-modified dipentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol Tetra (meth) acrylate, tris [(meth) acryloxyethyl] isocyanurate, caprolactone-modified tris [(meth) acryloxy Chill] isocyanurate, mention may be made of ditrimethylolpropane tetra (meth) acrylate.

  The component (B2) desirably has 2 or less (meth) acryloyl groups in the molecule. For example, tripropylene glycol di (meth) acrylate, 1,6-hexanediol (meth) acrylate, neopentyl glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) Acrylate, tetrahydrofurfuryl (meth) acrylate, 2-hydroxy (meth) acrylate, isobornyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, amino (meth) acrylate: N, N-dimethyl Aminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, acrylic morpholine, aminoacrylamide: N-isopropyl (meth) acrylamide, N, N-dimethylacrylate Ruamido, N, may be mentioned N- dimethylaminopropyl (meth) acrylamide.

  In the protective film as described above, the usage ratio of the A1, B2 and B2 components is determined from the desired coating strength. As the proportion of the B2 component increases, the viscosity of the protective film decreases, but the coating strength decreases.

  As the component (C), for example, various photopolymerization initiators and photopolymerization sensitizers used in general ultraviolet curable resins can be used. For example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isobutyl ether, 2-methylbenzoin, benzylmethyl ketal, 1- (4-isopropyl) -2-hydroxy-2-methylpropan-1-one, 1- (4 -Dodecylphenyl) -2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, methylphenylglyoxylate, 2- Methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,44,6-trimethylbenzoyl Diphenylphosphine oxide, benzopheno Benzoyl, methyl benzoate, benzophenone sensitizer: triethylamine, methyldiethanolamine, triethanolamine, bis (N-methyl-2,2,6,6-tetramethyl-4-piperidinyl) sebacate, phenyl-4-pi HALS (hindered amine) such as peridinyl carbonate, 2-dimethylaminoethylbenzoate, p-dimethylaminoacetophenone, ethyl p-dimethylaminobenzoate, isoamyl p-dimethylaminobenzoate and the like can be mentioned.

  As the component (D), for example, various additives: an adhesion promoter, a polymerization inhibitor, a surfactant, and the like can be used as necessary. Among these, as the adhesion imparting agent, for example, ethylene oxide-modified succinic acid (meth) acrylate, ethylene oxide-modified phthalic acid (meth) acrylate, ethylene oxide-modified phosphoric acid (meth) acrylate, hydroxynaphthoxypro (meth) acrylate, etc. Can be mentioned. Examples of the polymerization inhibitor include hydroquinone, hydroquinone monomethyl ether, t-butylcatechol, p-benzoquinone, 2,5-t-butylhydroquinone, phenothiazine and the like. Examples of the surfactant include a fluorine-based nonionic surfactant.

  Among the above protective films (prepolymer component + monomer component + polymerization initiator component + other components), those having hydroxyl group, phosphoric acid (salt) group, sulfonium base, diazonium base, iodonium base, carboxyl group Will contribute to the improvement of the film properties of the resin composition or resin molded article by using in combination with the adhesive.

  The ink usually contains a pigment, a (photo) polymerization initiator, a prepolymer, a polyfunctional acrylate monomer, and various auxiliaries, but the components other than the pigment are the same as or similar to the above additives. Examples of the pigment in the ink include at least one of carbon black, titanium oxide, copper and a compound thereof, iron oxide, silica, molybdenum and a compound thereof.

  The additives listed above can be mixed with the polycarbonate in the DVD collection to improve the film-forming characteristics of the resin alone of the DVD collection or a mixture of the DVD collection and other resins. It is.

  In addition, these DVD collection items may be manufactured and collected in the factory (including runner materials, molded end materials, raw material pellets, etc.), defective products before sale, stock products, etc. Alternatively, it may be collected from the market. In addition, what is collected in the factory or before sales is more preferable for reuse because many of them have a uniform quality than those collected from the market. Note that the DVD recovered material may be used alone as a resin composition or a resin molded body, but may be used as a mixture with other types of resins.

  Examples of resins that can be mixed with the recovered DVD are PC, ABS (acrylonitrile-butadiene-styrene resin), AS (acrylonitrile-styrene resin), PS (polystyrene), HIPS (high impact polystyrene), and SPS (syndiotactic polystyrene). ), SBR (styrene-butadiene rubber), SBS (styrene-butadiene-styrene rubber), methyl methacrylate-styrene resin, MBS (methyl methacrylate-butadiene-styrene) resin, isoprene-styrene rubber, isoprene rubber, PB (polybutadiene) ), Butadiene-acrylic rubber, isoprene-acrylic rubber, ethylene-propylene rubber, PMMA (polymethacrylate), PPS (polyphenylene sulfide), PPE (polyphenylene ether) ), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PP (polypropylene), PE (polyethylene), nylon 6, nylon 66, nylon 12, PC / ABS, PC / PS, PC / HIPS, PC / PP , PC / PE, PC / PMMA, PC / PET, and PC / PBT alloys. Of these, PC, ABS, AS, PS, HIPS, PC / ABS alloy, PC / PS alloy, PC / HIPS alloy, PC / PP alloy, PC / PE alloy, PC / PMMA alloy, PC / PET alloy, PC / PBT alloy and PC / nylon alloy are more preferable.

  The above resins are commercially available for various grades such as general purpose, high rigidity, high impact, abrasion resistance, high sliding, heat resistance, flame resistance, transparency, high gloss, chemical resistance, and coating. Antistatic agents, colorants, pigments, antioxidants, flame retardants, plasticizers, light resistance promoters, compatibilizers, surface treatment agents, modifiers, colorants (carbon black, etc.), glass fibers, paper Various additives for resins such as unemployed cloth may be contained. Moreover, what was manufactured in the factory with resin which is not marketed (a runner material, the end material of a raw material pellet, etc.) may be sufficient. Moreover, the recycled resin collect | recovered from the market may be sufficient.

  In addition, when using recycled resin, there are many physical properties of the recovered materials discharged from standardized products (same products and product groups) as well as those generated in the factory. And more preferable.

  Various grades of film-forming resin compositions or film-forming resin moldings can be produced by mixing the recovered resin with the above-mentioned resins.

  In addition, when the DVD recovered material itself is used as a resin composition or a resin molded body, it is a matter of course that good film forming characteristics can be found. Is preferably 1 to 100% by weight, preferably 5 to 90% by weight, and more preferably 10 to 80% by weight. This is because if the blend ratio is lower than this, good film forming characteristics cannot be obtained.

  Moreover, when mixing a DVD collection | recovery thing and other resin, you may add a compatibilizing agent. Examples of the compatibilizer include an epoxy-modified block copolymer and a graft polymer of a vinyl monomer having a polyolefin as a main chain (LDPE-g-PS, PP-g-PS, EGMA-g-PS, EEA-g). -PS, EVA-g-PS, E / EA / MAH-g-PS, LDPE-g-PMMA, EGMA-g-PMMA, EEA-g-PMMA, EVA-g-PMMA, E / EA / MAH-g -PMMA, LDPE-g-AS, PP-g-AS, EGMA-g-AS, EEA-g-AS, EVA-g-AS, E / EA / MAH-g-AS). EGMA is an ethylene-glycidyl methacrylate copolymer, EEA is an ethylene-ethyl acrylate copolymer, EVA is an ethylene-vinyl acetate copolymer, and E / EA / MAH is an ethylene- Ethyl acrylate-maleic anhydride copolymer. Moreover, the addition amount of these compatibilizing agents is not particularly limited, but is usually 0.1 to 20% by weight, more preferably 1 to 10% by weight, based on the resin weight.

  In addition, as described above, by using a DVD recovered material, it is possible to improve the resin film forming characteristics. However, in order to impart flame retardancy to the resin molded product and the resin molded product, It can also be used in combination with a flame retardant.

  Specifically, the flame retardant is at least one selected from halogen flame retardants, phosphorus flame retardants, nitrogen flame retardants, inorganic flame retardants, silicon flame retardants, metal salt flame retardants, and fluorine flame retardants. The flame retardant can be mentioned.

  Among these, examples of the halogen flame retardant include halogenated bisphenols, aromatic halogen compounds, halogenated polycarbonates, halogenated aromatic vinyl polymers, halogenated cyanurate resins, and halogenated polyphenylene ethers. Preferably, decabromodiphenyl ether, tetrabromobisphenol A, an oligomer of tetrabromobisphenol A, brominated bisphenol phenoxy resin, brominated bisphenol polycarbonate, brominated polystyrene, brominated crosslinked polystyrene, brominated polyphenylene ether, Examples thereof include polydibromophenylene ether, decabromodiphenyl ether bisphenol condensate, halogen-containing phosphate ester and fluorine-based resin.

  The amount of the halogen-based flame retardant added is usually 0.1 to 30% by weight, preferably 1 to 20% by weight. That is, if it is more than this, the resin properties will be impaired, and if it is less than this, the effect of improving flame retardancy will be reduced.

  Examples of phosphorus flame retardants include organic phosphorus compounds, red phosphorus, and inorganic phosphates.

  Examples of the organic phosphorus compound include phosphine, phosphine oxide, biphosphine, phosphonium salt, phosphinic acid salt, phosphate ester, phosphite ester, and the like. Specifically, triphenyl phosphate, methyl Neopentyl phosphite, pentaerythritol diethyl diphosphite, methyl neopentyl phosphate, phenyl neopentyl phosphate, pentaerythritol diphenyl diphosphate, dicyclopentyl high positive phosphate, dineopentyl hypophosphite, phenyl pyrocatechol phosphite , Ethylpyrocatechol phosphite, dipyrrocatechol high positive phosphate, phenoxypropoxyphosphazene, diphenoxyphosphazene, pheno Shi amino phosphazene, there may be mentioned a phenoxy fluoroalkyl phosphazene, aromatic phosphoric acid ester monomer and condensate is preferable.

  As red phosphorus, in addition to general red phosphorus, the surface thereof is previously coated with a metal hydroxide film selected from aluminum hydroxide, magnesium hydroxide, zinc hydroxide and titanium hydroxide, Coated with a metal hydroxide selected from aluminum oxide, magnesium hydroxide, zinc hydroxide and titanium hydroxide and a thermosetting resin, aluminum hydroxide, magnesium hydroxide, zinc hydroxide, hydroxide An example of a double-coating treatment with a thermosetting resin film on a metal hydroxide film selected from titanium can be given.

  Examples of the inorganic phosphate include ammonium polyphosphate.

  The amount of the phosphorus-based flame retardant added is usually 0.1 to 30% by weight, preferably 1 to 20% by weight. If it is more than this, the resin properties (heat resistance, etc.) will be impaired, and if it is less than this, the effect of improving flame retardancy will be reduced.

  Examples of the nitrogen-based flame retardant include at least one of a triazine compound, a triazole compound, a tetrazole compound, a phosphazene compound, and a diazo compound. Specific examples include melamine, melam, melem, melon, melamine cyanurate, melamine phosphate, succinoguanamine, adipoguanamine, methylglutalogamine, melamine resin, BT resin, etc. Cyanurate is preferred.

  The amount of the nitrogen-based flame retardant added is usually 0.1 to 30% by weight, preferably 0.5 to 10% by weight. If it is more than this, the resin properties will be impaired, and if it is less than this, the effect of improving flame retardancy will be reduced.

  Inorganic flame retardants include silica, sodium sulfate, calcium sulfate, potassium sulfate, aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, barium hydroxide, calcium hydroxide, dolomite, hydrotalcite, basic magnesium carbonate, oxidation Tin hydrate, aluminum oxide, iron oxide, titanium oxide, manganese oxide, magnesium oxide, zirconium oxide, zinc oxide, molybdenum oxide, cobalt oxide, bismuth oxide, chromium oxide, tin oxide, antimony oxide, nickel oxide, copper oxide , Tungsten oxide, aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, nickel, copper, tungsten, tin, antimony, SUS, zinc borate, zinc metaborate, barium metaborate, zinc carbonate, carbonic acid Mug Siumu, calcium carbonate, barium carbonate, and hydrated glass. This may be a single type or a combination of two or more types. Of these, aluminum hydroxide, magnesium hydroxide, basic magnesium carbonate, hydrotalcide, and hydrated glass are preferred.

  The amount of the inorganic flame retardant added is usually 0.1 to 300% by weight, preferably 1 to 30% by weight. If it exceeds this, the resin properties (impact resistance, etc.) will be impaired, and if this is reduced, the effect of improving flame retardancy will be reduced.

Examples of silicon flame retardants include silicone compounds and silane compounds. Among these, as the silicone compound, silicon oil or polydiorganosiloxane or SiO ₂ , RSiO _3/2 , R ₂ SiO, R ₃ SiO _1/2 , R ¹ _a R ² _b SiO _{(4-ab) / 2} (wherein R ¹ is a functional group, R ² is a hydrocarbon having 1 to 12 carbon atoms, a and b are numbers satisfying the relations of 0 <a ≦ 3, 0 ≦ b <3, 0 <a + b ≦ 3) And a copolymer silicone resin and a copolymer silicone resin. Here, R is hydrogen group, methyl group, ethyl group, propyl group, phenyl group, benzyl group, vinyl group, alkoxy group, aryloxy, polyoxyalkylene group, hydroxyl group, carboxyl group, cyanol group, amino group, mercapto group. And epoxy groups. Among these, an alkyl group (methyl group, phenyl group), alkoxy group, hydrogen group, hydroxyl group, carboxyl group, amino group, and epoxy group are preferable. The number average molecular weight of these silicone resins is preferably in the range of 200 to 5,000,000, and the shape may be any of oil, varnish, gum, powder, and pellets.

  Examples of the silane compounds include polyalkylsilane compounds and polycarbosilane compounds. Among these, polymethylphenylsilane, polydiphenylsilane, and polyphenylsilane are representative. In addition, these compounds may be terminated with either an OH group or an alkyl group, or may have a cyclic structure.

  The amount of silicon flame retardant added is 0.01 to 10% by weight, preferably 0.1 to 5% by weight, based on the weight of the resin part. If the addition amount is less than this, the effect of improving the flame retardancy is lowered, and if it is too much, the appearance defect, the mechanical properties (impact resistance) of the resin and the like are lowered.

  Examples of the metal salt flame retardant include inorganic acids (salts) and organic acids (salts). Examples of the organic acid (salt) include organic sulfonic acid (salt), organic sulfuric acid (salt), organic phosphoric acid (salt), organic boric acid (salt), and organic carboxylic acid (salt). Counter ions (metals) used in various acid salts include alkali metals (sodium, lithium, potassium, cesium, etc.), alkaline earth metals (magnesium, calcium, strontium, barium, etc.), Zn, Sn, Al, Sb and the like are preferable. The organic acid (salt) may be substituted with a halogen such as fluorine, chlorine or bromine.

  Specifically, perfluoroalkane sulfonate (perfluoromethane sulfonate, perfluoroethane sulfonate, perfluoropropane sulfonate, perfluorobutane sulfonate, perfluoromethylbutane sulfonate, perfluoro Hexanesulfonate, perfluoroheptanesulfonate, perfluorooctanesulfonate), alkylsulfonic acid (salt), benzenesulfonic acid (salt), alkylbenzenesulfonic acid (salt), diphenylsulfonic acid (salt), naphthalenesulfone Acid (salt), diphenylsulfone-3-sulfonic acid (salt), 2,5-dichlorobenzenesulfonic acid (salt), 2,4,5-tolyrobenzenesulfonic acid (salt), diphenylsulfone-3,3 ′ -Disulfonic acid (salt), naphthalene trisulfonic acid ( ), Aromatic sulfonimide metal salts, fluorine-substituted products thereof, and aromatic rings of aromatic group-containing polymers such as styrene (co) polymers, polyphenylene ethers, polycarbonates, polyethylene terephthalates, etc. ), Sulfuric acid (salt), phosphoric acid (salt), boric acid (salt), and carboxylic acid (salt) bonded to each other. Among these, typical sulfonic acids (salts) are PS resin (polystyrene), HIPS resin (high impact polystyrene), AS resin (acrylonitrile-styrene copolymer), ABS resin (acrylonitrile-styrene-butadiene copolymer). ), Sulfonic acid metal salts such as polyphenylene ether, polycarbonate, and polyethylene terephthalate, metal salts of hydrolyzed products of AS resin and ABS resin with hot concentrated sulfuric acid, ion exchange resins, and the like. The introduction rate of the acid (salt) represented by these sulfonic acid groups is not particularly limited, but those having a substitution of 0.1 to 100 mol% are used.

  Examples of the organic carboxylic acid (salt) include perfluoroformic acid (salt), perfluoromethanecarboxylic acid (salt), perfluoroethanecarboxylic acid (salt), perfluoropropanecarboxylic acid (salt), and perfluorobutanecarboxylic acid. (Salt), perfluoromethylbutanecarboxylic acid (salt), perfluorohexanecarboxylic acid (salt), perfluoroheptanecarboxylic acid (salt), perfluorooctanecarboxylic acid (salt), and the like.

  These metal salt flame retardants may be used alone or in combination of two or more.

  The addition amount of the metal salt flame retardant as described above is 0.0005 to 5% by weight, preferably 0.001 to 2% by weight with respect to the resin part weight of the resin composition or the resin molded body. %, And more preferably 0.05 to 1% by weight. Even if the addition amount is larger than this, a flame retardant effect corresponding to the addition amount cannot be obtained, which is not economical.

  Examples of fluorine-based flame retardants are resins containing fluorine atoms in the resin, and include polymonofluoroethylene, polydifluoroethylene, polytrifluoroethylene, polytetrafluoroethylene, and tetrafluoro / hexafluoropropylene copolymers. I can do it. Moreover, you may use together the monomer copolymerizable with the said fluorine monomer as needed. These fluorine resins preferably have an average molecular weight of 100,000 to 10,000,000. In particular, those having a fibril forming ability are more preferable. The amount of the fluorine-based flame retardant added is 0 to 5% by weight, preferably 0.1 to 2% by weight, based on the resin part weight of the resin composition or the resin molded body. . Even if the addition amount is larger than this, a flame retardant effect corresponding to the addition amount cannot be obtained, which is not economical.

  The above-mentioned fluorine-based flame retardants are generally used mainly for the purpose of preventing drip, but the other examples of those used for the purpose of preventing drip include silicone resins and phenols described above. Examples thereof include resins, aramid resins (fibers), and polyacrylonitrile resins (fibers). Moreover, you may mix | blend a thermoplastic elastomer as needed, for example, a polyolefin type, a polyester type, a polyurethane type, a 1, 2- polybutene type, a polyvinyl chloride type elastomer can be mentioned.

  Moreover, you may add an inorganic filler to the resin composition for film formation which applied this invention, and the resin molding for film formation as needed. Examples of the inorganic filler include talc, mica, wollastonite, kaolin, diatomaceous earth, calcium carbonate, calcium sulfate, barium sulfate, glass fiber, carbon fiber, carbon black, potassium titanate, and titanium oxide. Can do. Among these, talc, mica, and wollastonite are preferable.

  As the inorganic filler, those having an average particle diameter of 0.1 to 50 μm are generally used, but 0.2 to 20 μm is particularly preferable. The amount of the inorganic filler as described above is 0 to 30% by weight, preferably 0 to 15% by weight, based on the resin part weight of the resin composition or the resin molded body. If the amount added is larger than this, the impact resistance strength and weld strength will decrease.

  The resin composition for film formation and the resin molded body for film formation to which the present invention is applied include pigments, dyes, lubricants, ultraviolet absorbers, hindered amine light stabilizers, antioxidants, and halogen supplements as necessary. Various additives such as an agent, a light-shielding agent, a metal deactivator, a quencher, an antistatic agent, a reinforcing agent, and a filler can be blended to such an extent that their physical properties are not impaired. For the purpose of electromagnetic wave shielding and the like, in-mold molding may be performed to integrate the resin and metal.

  A film-forming resin can be obtained by blending, mixing, and melt-kneading the above materials in an appropriate ratio. The compounding and kneading at this time are premixed with commonly used equipment such as a ribbon blender, a drum tumbler, etc., a Banbury mixer, a single screw extruder, a twin screw extruder, a multi-screw extruder, a kneader, etc. It can be performed by a method using Although the heating temperature at the time of melt-kneading depends on the type of resin to be mixed, it is usually appropriately selected within the range of 150 to 300 ° C. As the melt-kneading molding, it is preferable to use an extrusion molding machine, particularly a vent type extrusion molding machine. It should be noted that the components other than the collected DVD can be previously melt-kneaded with a polycarbonate resin or other thermoplastic resin, that is, added as a master batch.

  Further, the resin to which the present invention is applied is an injection molding method, an injection compression molding method, an extrusion molding method, a blow molding method, a press molding method, a vacuum molding method, using the above melt kneading molding machine or the obtained pellets as a raw material. Various molded products can be manufactured by a foam molding method or the like. In addition, the resin and the resin molded body using the DVD recovered material may be subjected to plating or painting treatment as necessary.

  This resin plating method is equivalent to a general resin plating method, and is performed by degreasing, chemical etching, chemical plating treatment, and electroplating treatment, and processing such as neutralization treatment, catalyst treatment, accelerator treatment, etc. Can be combined as appropriate. A surfactant is used for degreasing, and a mixed solution of an oxidizing agent and an acid is used for etching. After etching, a series of treatments such as neutralization treatment, catalyst treatment, accelerator treatment, etc. were performed to promote smooth plating film deposition and increase the adhesion between the plating layer and the resin substrate in the chemical plating process. After that, it is immersed in a chemical metal plating bath to perform metal plating. After chemical plating is applied to the molded body by such a method, the obtained chemical plating product is further subjected to electroplating treatment of copper, nickel, chromium, etc. by a known method to electroplate the product to obtain a plated product. be able to.

  The resin coating methods include acrylic lacquer paint, polyester paint, two-pack epoxy paint (acryl-epoxy paint, epoxy-polyester paint), acrylic paint, two-pack acrylic-silicon paint, alkyd paint. Paint, melamine resin-based baking paint, acrylic resin-based baking paint, phthalic acid resin-based paint, fluorine-based paint, cationic electrodeposition undercoat, polyurethane resin-based paint, acrylic urethane resin-based paint, polyester-modified acrylic urethane resin-based paint, alkyl An amino resin-based paint can be used. Moreover, it can apply | coat to the said resin composition and the said resin molding by apply | coating these coating materials at least once or more by spraying, dipping, a roller, a brush, etc.

  Hereinafter, examples actually produced by applying the method of recycling the collected DVD to which the present invention is applied will be described. In addition, comparative examples produced for comparison with these examples will be described.

  Examples 1-7 and Comparative Examples 1-9 were blended with resins A and B in the proportions shown in Table 1 below, fed to an extruder, kneaded and pelletized sufficiently, A resin molded body (in this case, a device casing) is manufactured by injection molding, and various coating treatments are performed on the surface of the resin molded body.

  In addition, among the resin components of the resin molded body shown in Table 1, the components of the resin A and the resin B are expressed by weight%. Of the resin parts shown in Table 1, PC is optical grade (high fluidity) polycarbonate, HIPS is impact resistant high impact polystyrene, and ABS is general fluid grade ABS resin.

  And the characteristic evaluation test with respect to the adhesiveness of a film was done about each resin molding shown to these Examples 1-7 and Comparative Examples 1-9. Specifically, for a resin molded body on which a plating film is formed, after peeling the plating film with a width of 10 mm, the peel strength when peeling from the resin molding at an angle of 90 ° is measured. For a resin molded body with a coating film formed, a cross-cut cross cut (100 squares of 1 mm × 1 mm) is applied to the resin molded body once coated with a multi-cross cutter, and then a peeling test using a cellophane tape. And the average value of (number of squares not peeled) / (number of grids) was measured.

  As shown in Table 1, the resin molded body of Example 1 was compared with the resin molded bodies of Comparative Examples 1 and 2, the resin molded body of Example 2 was compared with the resin molded bodies of Comparative Examples 3 and 4, and As is apparent from the comparison between the resin molded body of Example 4 and the resin molded body of Comparative Example 6, and the comparison of the resin molded body of Example 6 and the resin molded body of Comparative Example 8, the virgin PC resin and the CD recovered product It can be seen that the recovered DVD is superior in peel strength.

  Also, the resin molded body of Example 3 and the resin molded body of Comparative Example 5 were compared, the resin molded body of Example 5 was compared with the resin molded body of Comparative Example 7, and the resin molded body of Example 7 was compared. As is clear from the comparison with the resin molded body of Example 9, it can be seen that the DVD recovered material is superior in peel strength compared to the virgin PC resin and the CD recovered material.

  From the above, it has been clarified that a resin composition excellent in plating property and paintability can be obtained by using a DVD recovered material as a raw material.

It is sectional drawing which shows the structure of DVD. It is sectional drawing which shows another structure of DVD.

Explanation of symbols

  1 DVD, 2 Second disk substrate, 5 Second disk substrate, 8 Adhesive, 10 DVD

Claims (15)

A reflective film formed on the disk substrate together with an adhesive containing at least one of a hydroxyl group, a phosphoric acid (salt) group, a sulfonium base, a diazonium base, an iodonium base, and a carboxyl group to which the disk substrate is bonded. A resin composition for forming a film, comprising a disk collection containing at least one coating material of a recording film, a protective film, and an ink film and having a structure in which the two disk substrates are bonded together with the adhesive . Or the recycling method of the disk collection | recovery material used for the raw material of the resin molding for film formation.   The method for recycling a disk collection according to claim 1, wherein the resin composition for film formation contains the disk collection at a ratio of 1 to 100%.   The method of recycling a recovered disc material according to claim 1, wherein the ratio of the adhesive contained in the resin composition for film formation or the resin molded body for film formation is 0.005 to 20% by weight.   A flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, an inorganic flame retardant, a silicon flame retardant as a flame retardant, together with the disk recovery product, on the resin composition for film formation or the resin molded body for film formation 2. The method for recycling a recovered disc material according to claim 1, wherein at least one of a metal salt flame retardant and a fluorine flame retardant is contained.   PC (polycarbonate), ABS (acrylonitrile-butadiene-styrene copolymer), AS (acrylonitrile-styrene copolymer), PS, together with the recovered disc, the resin composition for film formation or the resin molded body for film formation. (Polystyrene), HIPS (high impact polystyrene), PC / ABS alloy, PC / PS alloy, PC / HIPS alloy, PC / PP (polypropylene) alloy, PC / PE (polyethylene) alloy, PC / PMMA (polymethyl methacrylate) 2. The method of recycling a disk recovery according to claim 1, wherein at least one of alloy, PC / PET (polyethylene terephthalate) alloy, PC / PBT (polybutylene terephthalate) alloy, and PC / nylon alloy is contained. A reflective film formed on the disk substrate together with an adhesive containing at least one of a hydroxyl group, a phosphoric acid (salt) group, a sulfonium base, a diazonium base, an iodonium base, and a carboxyl group to which the disk substrate is bonded. For forming a film using a recovered material of a disk having a structure in which at least one kind of a coating film material among a recording film, a protective film, and an ink film is bonded to the above-mentioned disk substrate with the adhesive . Resin composition.   The resin composition for forming a film according to claim 6, which contains the recovered disc at a ratio of 1 to 100%.   The resin composition for film formation according to claim 6, comprising the adhesive in a proportion of 0.005 to 20% by weight.   Along with the recovered discs, at least one of a halogen flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, an inorganic flame retardant, a silicon flame retardant, a metal salt flame retardant, and a fluorine flame retardant as a flame retardant. The resin composition for film formation of Claim 6 containing the above.   PC (polycarbonate), ABS (acrylonitrile-butadiene-styrene copolymer), AS (acrylonitrile-styrene copolymer), PS (polystyrene), HIPS (high impact polystyrene), PC / ABS alloy, PC / PS alloy, PC / HIPS alloy, PC / PP (polypropylene) alloy, PC / PE (polyethylene) alloy, PC / PMMA (polymethyl methacrylate) alloy, PC / PET (polyethylene terephthalate) alloy, PC / PBT ( The resin composition for film formation according to claim 6, comprising at least one of polybutylene terephthalate) alloy and PC / nylon alloy. A reflective film formed on the disk substrate together with an adhesive containing at least one of a hydroxyl group, a phosphoric acid (salt) group, a sulfonium base, a diazonium base, an iodonium base, and a carboxyl group to which the disk substrate is bonded. For forming a film using a recovered material of a disk having a structure in which at least one kind of a coating film material among a recording film, a protective film, and an ink film is bonded to the above-mentioned disk substrate with the adhesive . Resin molded body.   The resin molded product for film formation according to claim 11, wherein the recovered disc is contained at a ratio of 1 to 100%.   The resin-molded body for film formation according to claim 11, comprising the adhesive in a proportion of 0.005 to 20% by weight.   Along with the recovered discs, at least one of a halogen flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, an inorganic flame retardant, a silicon flame retardant, a metal salt flame retardant, and a fluorine flame retardant as a flame retardant. The resin-molded body for film formation according to claim 11 containing the above.   PC (polycarbonate), ABS (acrylonitrile-butadiene-styrene copolymer), AS (acrylonitrile-styrene copolymer), PS (polystyrene), HIPS (high impact polystyrene), PC / ABS alloy, PC / PS alloy, PC / HIPS alloy, PC / PP (polypropylene) alloy, PC / PE (polyethylene) alloy, PC / PMMA (polymethyl methacrylate) alloy, PC / PET (polyethylene terephthalate) alloy, PC / PBT ( The resin molded product for film formation according to claim 11, comprising at least one of polybutylene terephthalate) alloy and PC / nylon alloy.

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