JP4685081B2 - 電子部品製造方法 - Google Patents

電子部品製造方法 Download PDF

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Publication number
JP4685081B2
JP4685081B2 JP2007290402A JP2007290402A JP4685081B2 JP 4685081 B2 JP4685081 B2 JP 4685081B2 JP 2007290402 A JP2007290402 A JP 2007290402A JP 2007290402 A JP2007290402 A JP 2007290402A JP 4685081 B2 JP4685081 B2 JP 4685081B2
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JP
Japan
Prior art keywords
metal
bump
resin film
temperature
forming
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Expired - Fee Related
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JP2007290402A
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English (en)
Japanese (ja)
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JP2008109145A (ja
JP2008109145A5 (enExample
Inventor
誠樹 作山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
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Fujitsu Ltd
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Publication date
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Priority to JP2007290402A priority Critical patent/JP4685081B2/ja
Publication of JP2008109145A publication Critical patent/JP2008109145A/ja
Publication of JP2008109145A5 publication Critical patent/JP2008109145A5/ja
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Publication of JP4685081B2 publication Critical patent/JP4685081B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2007290402A 2007-11-08 2007-11-08 電子部品製造方法 Expired - Fee Related JP4685081B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007290402A JP4685081B2 (ja) 2007-11-08 2007-11-08 電子部品製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007290402A JP4685081B2 (ja) 2007-11-08 2007-11-08 電子部品製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004115957A Division JP4367630B2 (ja) 2004-04-09 2004-04-09 バンプ形成方法

Publications (3)

Publication Number Publication Date
JP2008109145A JP2008109145A (ja) 2008-05-08
JP2008109145A5 JP2008109145A5 (enExample) 2009-03-19
JP4685081B2 true JP4685081B2 (ja) 2011-05-18

Family

ID=39442188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007290402A Expired - Fee Related JP4685081B2 (ja) 2007-11-08 2007-11-08 電子部品製造方法

Country Status (1)

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JP (1) JP4685081B2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2823596B2 (ja) * 1989-07-15 1998-11-11 沖電気工業株式会社 半導体装置の製造方法
US5803340A (en) * 1995-09-29 1998-09-08 Delco Electronics Corporation Composite solder paste for flip chip bumping

Also Published As

Publication number Publication date
JP2008109145A (ja) 2008-05-08

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