JP4682844B2 - Manufacturing method of joining member - Google Patents

Description

The present invention relates to the production how the joint member by joining the metal members to each other by soldering or brazing.

  In a metal member made of an aluminum alloy, since a strong passive film of aluminum oxide is formed on the surface thereof, general soldering is difficult as it is. In contrast, a solder coating method using ultrasonic vibration has been devised. In this ultrasonic soldering, the vibrating plate is immersed shallowly in the molten solder, or the molten solder is scooped with the vibrating plate so that the molten solder is placed thinly on the vibrating plate. Then, the joining surface of the aluminum alloy member is placed thereon, and the diaphragm is vibrated by an ultrasonic horn or the like. By doing so, it is possible to cause cavitation in the molten solder by the vibration of the diaphragm, destroy the oxide film on the joint surface, and apply the solder material to the joint surface. In the present specification, unless otherwise required, solder and solder are not distinguished from each other and are collectively referred to as solder.

  In such an aluminum alloy member joining method, various devices have been devised for forming a more appropriate solder layer on the joining surface (see, for example, Patent Document 1). In the method described in this document, a protrusion is formed at a position of the diaphragm that abuts against the central portion of the joint surface. As a result, the central part of the joint surface is eroded from other parts, so that solder can be accumulated in that part and the joint strength is improved.

In recent years, in order to avoid the need to form a water channel inside the member, it has been proposed to divide the member and form a water channel in the joint surface (see, for example, Patent Document 2). When such members are soldered together, it is desired to reliably join the joint surfaces and prevent blockage of the water channel. Therefore, after applying solder to the joint surface by this ultrasonic soldering, the solder in the water channel is removed before joining.
JP 2001-225163 A JP 2001-164986 A

  However, in the solder application method described in Patent Document 1, a recess due to erosion is formed at the center of the joint surface of the members to be joined. Therefore, while the solder material can be collected reliably, a gap is formed between the joint surfaces. For this reason, there was a risk that high contact pressure could not be obtained even if a joint load was applied. In that case, there is a problem that sufficient bonding strength cannot be obtained.

  In addition, as in the technique described in Patent Document 2, a member in which a non-bonded region such as a water channel is formed in the bonding surface requires a solder removal step for the non-bonded region, and thus the manufacturing process tends to be complicated. there were. In particular, in the case of a cast surface, the oxide layer is generally thick, the solder is difficult to be applied uniformly, and the smoothness of the joint surface is not so high. For this reason, it is difficult to ensure airtightness after joining, and there is a problem that leakage paths are easily formed.

The present invention has been made to solve the above-described problems of the prior art. That is, the problem is to produce a joining member that can obtain high joining strength and airtightness of the joining surface even on the casting surface, and can prevent solder from being applied to the non-joining region. It is to provide a mETHODS.

In the manufacturing method of the bonding member of the present invention to solve this problem it has been made for the purpose, producing the joint member by forming a solder layer on the bonding surface of the bonding member bonds the bonding faces forming the solder layer vibration member having a hand, the non-bonding region recessed bonding surface and the remainder is the junction region with is formed, the formation of the solder layer, the hole or groove of a shape corresponding to the non-bonding region of the bonding surface upon which the use, the the bonding surface of the workpieces in the molten solder and the vibration member, the non-bonding region of the junction surface between the hole or the groove of the vibration member is faced to face each other, it intends row by vibrating the vibration member.

According to the method for manufacturing a joining member of the present invention, since the vibration member has a hole or groove having a shape corresponding to the non-joining region of the joining surface, the facing portion faces the non-joining region of the joining surface. By doing so, vibration is not transmitted to the non-bonding region of the bonding surface. Therefore, the joining member manufacturing method can prevent the solder from being applied to the non-joining region of the joining surface.

Furthermore, in the method of the present invention, a concave portion shallower than the non-joining region is formed in advance in the joining region of the joining surface of one of the members to be joined within a range in which cavitation in the molten solder reaches the joining surface. In addition, a convex portion having a height within a range in which cavitation in the molten solder reaches the joint surface is formed in advance at a position corresponding to the concave portion of the one joint member in the joining region of the joining surface of the other joined member. And by joining the joining surfaces of one and the other members to be joined together, the concave portion of one of the members to be joined and the convex portion of the other member to be joined are engaged, and the joining surfaces are joined in that state. Is desirable. In this way, since solder adheres between the minute recesses or projections, more solder is applied compared to the joint surface without these recesses or projections. Therefore, even if it is a casting surface, high joint strength and airtightness of the joint surface can be obtained. Here, “in advance” means that before the solder coating process.

Further, in the method of the present invention , when the joining surfaces are overlapped with each other, it is desirable that the joining surfaces where the recesses are formed face up, and the joining surfaces where the protrusions are formed face down. . In addition, the method of the present invention is particularly significant when the member to be joined is a metal member of a type in which a passive film is formed on the surface.

According to the manufacturing how the joint member of the present invention, is possible to prevent the it is possible to obtain a a a with high bonding surfaces even bonding strength and airtightness casting surface, the solder in the unbonded regions are applied it can.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best mode for embodying the present invention will be described in detail with reference to the accompanying drawings. This embodiment is an application of the present onset bright to a method for the joining member by joining a metal member such as aluminum alloy. In addition, although this invention is suitable for the joining member made from an aluminum alloy, it is applicable also to another metal on the same principle.

As shown in FIG. 1, the solder coating apparatus 1 used in the present embodiment includes a solder melting tank 11 and a heater 12 for keeping the inside of the solder melting tank 11 at a high temperature. Solder 13 is accommodated in the solder melting tank 11. The vibration plate 14 is a metal plate such as SUS bent in a staircase shape, and its lower step is immersed in a very shallow position of the solder 13. An ultrasonic horn 16 connected to an ultrasonic oscillator 15 is attached to the upper stage of the diaphragm 14.

  The workpieces 21 and 22 which are joining members to which solder is applied by the solder applying apparatus 1 are metal members such as aluminum alloy members, and those whose joint surfaces are both cast surfaces are particularly targeted. At the time of solder application, the workpieces 21 and 22 are respectively held by the robot hand 23 and placed on the vibration plate 14 with the joint surface to which the solder is applied facing downward as shown in FIG. Then, the joint surface is held horizontally in a state where it is immersed very shallowly in the solder 13. When the workpieces 21 and 22 are aluminum alloy members, it is preferable to use zinc aluminum solder or zinc aluminum copper solder as the solder 13.

  Here, in this embodiment, as two types of workpieces 21 and 22 to be bonded to each other, as shown in FIG. 2 and FIG. To do. For example, as shown in FIG. 2, a large number of hemispherical convex portions 31 a are formed on the joint surface 31 of the workpiece 21. As shown in FIG. 3, a large number of hemispherical recesses 32 a are formed on the joint surface 32 of the workpiece 22.

  Each of the convex portions 31a and the concave portions 32a has a height from the joint surfaces 31, 32 to the peak of, for example, 1.5 mm or less, and a height within a range in which cavitation generated on the surface of the diaphragm 14 reaches. It is said to be deep. Desirably, the range of 0.5 mm to 1 mm is preferable. Further, when the joining surfaces 31 and 32 are overlapped, they are arranged at symmetrical positions so as to engage with each other. In order to mesh well, it is preferable that the convex portion 31a is formed slightly smaller than the concave portion 32a.

  Furthermore, the recessed parts 31b and 32b for waterways are also formed in the joining surfaces 31 and 32 of these workpieces 21 and 22. This is for forming a water channel 33 (see FIG. 6B) that crosses the joint surface after joining, and is a rather deep recess compared to the recess 32a. The water channel recesses 31b and 32b are non-joining regions. As a method of forming these convex portions 31a and concave portions 32a and water channel concave portions 31b and 32b, shapes corresponding to these may be formed in advance in a mold, and the workpieces 21 and 22 may be formed using the mold. . In this way, a process such as cutting the formed workpieces 21 and 22 is unnecessary. However, it does not exclude forming by cutting.

  In the solder coating apparatus 1 according to the present embodiment, the diaphragm 14 is changed and used in accordance with the shape of the non-bonded area formed on the workpiece to be solder coated. That is, as the vibration plate 14, one having a through hole that matches the shape of the non-joining region formed on the joint surface of the workpiece is used. For example, as shown in FIG. 4, the vibration plate 41 for applying solder to the joint surface 31 of the work 21 has a through hole 41 a at a position corresponding to the water channel recess 31 b which is a non-joint region. The outer shape of the through hole 41a matches the shape of the recess 31b for the water channel when the joining surface 31 of the work 21 is faced down. Similarly, for workpieces having different shapes in the non-bonded areas, diaphragms having corresponding through holes are used.

  In the part facing the through hole provided in the diaphragm 14, the vibration from the ultrasonic horn 16 is not transmitted to the workpiece, and cavitation does not occur. Therefore, since the oxide film is not destroyed in the non-bonding region of the workpiece facing the through hole of the diaphragm 14, no solder is applied. That is, as shown in FIG. 5, solder is applied to the joint surface 31 of the work 21 using the vibration plate 41 in which the through hole 41a is formed, so that no solder adheres to the recess 31b for the water channel. On the other hand, no special shape is formed on the diaphragm 41 with respect to the minute protrusion 31a.

  Similarly, solder can be prevented from adhering to the inside of the water channel recess 32b by using a diaphragm provided with a through hole corresponding to the water channel recess 32b. The recesses 31b and 32b for the water channel are generally symmetrical, and the diaphragm 41 needs to be matched to each other. However, if the water channel recesses 31b and 32b have the same shape, the same diaphragm 41 can be used. In this way, no solder is applied to the recesses 31b and 32b for the water channel of the workpieces 21 and 22 which are non-joining regions, so that a solder removal step is unnecessary.

  Next, a joining method using this solder coating apparatus 1 will be described. In this solder coating apparatus 1, as shown in FIG. 1, solder 13 is placed in a solder melting tank 11 and heated by a heater 12. The inside of the solder melting tank 11 is kept at the melting point of the solder 13 + 20 ° C. In general, the solder 13 having a high melting point is sometimes referred to as brazing and the solder having a low melting point is referred to as soldering. However, the solder coating apparatus 1 can be applied to any of them.

  Further, the diaphragm 14 having an appropriate through hole is selected and attached in accordance with the non-joining region of the workpiece. Then, using the robot hand 23 or the like, the work is held on the vibration plate 14 by aligning the positions of the through holes of the vibration plate 14 and the non-bonding region of the work as shown in FIG. In this state, by operating the ultrasonic oscillator 15, ultrasonic vibration is transmitted from the ultrasonic horn 16 to the diaphragm 14. As a result, cavitation occurs in the part of the joint surface of the workpiece excluding the non-joint region, the oxide layer is destroyed, and solder is applied.

  In the workpieces 21 and 22 described above, minute convex portions 31a and concave portions 32a are formed on the joint surfaces excluding the non-join region. In these, the height to the peak is, for example, 1.5 mm or less, and cavitation by the diaphragm 14 reaches. Therefore, the solder is also applied to the surfaces of the convex portions 31a and the concave portions 32a. At this time, in the case where the minute concave portion 32a is formed on the joint surface 32 like the workpiece 22, the solder is slightly accumulated in the concave portion 32a. On the other hand, the recesses 31b and 32b for the water channel face the through hole 41a of the vibration plate 41 and vibration is not transmitted, so that no solder is applied.

  When solder is applied to each of the joining surfaces 31 and 32 of the two workpieces 21 and 22 to be joined to each other, the joining surfaces 31 and 32 are joined together by heating and pressing as shown in FIG. . Here, the workpiece 21 is shown in the AA sectional view in FIG. 2, and the workpiece 22 is shown in the BB sectional view in FIG. At this time, as shown in FIG. 6A, if the bonding surface 31 of the workpiece 21 faces downward and the bonding surface 32 of the workpiece 22 faces upward, solder accumulated in the minute concave portion 32 a of the workpiece 22 is spilled. Can be joined so that there is no.

  As a result, as shown in FIG. 6B, the convex portion 31a of the joint surface 31 of the workpiece 21 and the concave portion 32a of the joint surface 32 of the workpiece 22 mesh with each other and are joined without a gap. In addition, when superposed and pressed in this way, as shown in an enlarged view in FIG. 7, the solder accumulated in the concave portion 32a of the workpiece 22 is pushed out by the convex portion 31a of the workpiece 21 and spreads to the surrounding flat portion. Therefore, even a workpiece such as a cast member having a low surface smoothness and a solder that is difficult to be placed uniformly can be appropriately joined while maintaining airtightness. Furthermore, the joining strength is increased due to the wide joining area and the engagement between the workpieces.

  Further, the water channel recess 31b and the water channel recess 32b face each other, and a water channel 33 is formed as shown in FIG. 6B. At this time, since the solder is not originally applied to the recesses 31b and 32b for the water channel, the water channel 33 is not filled with the solder. Therefore, the solder removal process is unnecessary. In addition, since the diaphragm 14 may be provided with a through hole in accordance with the shape of the non-joined region, even a water channel having a complicated shape can be easily formed.

  As shown in FIG. 6B, in the joining member formed in this way, the convex portion 31a of the workpiece 21 and the concave portion 32a of the workpiece 22 are engaged with each other, and solder is filled therebetween. Therefore, the joint surface is strongly joined and high airtightness is obtained. Further, no solder is attached to the water channel 33, and a good opening is obtained.

  Next, FIG. 8 shows an example of the shape of minute convex portions and concave portions formed on the joint surface of the workpiece. The dimple A is a hemispherical shape similar to the workpieces 21 and 22. A hemisphere having a diameter of about φ1 mm is arranged at a pitch of about 1.5 mm. B dimples are small hemispheres of about φ0.5 mm arranged at intervals of about 0.75 mm. The diamond of C is a square column with a diagonal of 1.0 mm and a height of about 0.5 mm arranged at a pitch of about 2.0 mm. The mountain valley of D is a mountain valley between about 1.0 mm and a peak-to-peak height of about 0.5 mm. The E pyramid is a pyramid shape having a side of 1.0 mm and a height of about 0.5 mm arranged at a pitch of about 1.5 mm. If the workpieces having the convex portions and the concave portions having these shapes are joined together, a strong joined member can be obtained.

  As described in detail above, according to the solder coating apparatus 1 of the present embodiment, the vibration plate 14 is vibrated by the ultrasonic horn 16 to generate cavitation on the joint surfaces 31 and 32 of the workpieces 21 and 22. At this time, since the convex portions 31a and the concave portions 32a are formed on the joint surfaces 31 and 32 of the workpieces 21 and 22, respectively, solder accumulates in the concave portions 32a. When these are brought into pressure contact, the convex portion 31a meshes with the concave portion 32a, so that the solder accumulated in the concave portion 32a protrudes and spreads. Therefore, solder can be effectively applied even to a workpiece having a thick oxide layer such as a casting.

  Furthermore, when the workpiece has a non-bonded region, the diaphragm is provided with a through hole corresponding to the region, so that no solder is attached to the non-bonded region. Accordingly, the solder coating apparatus 1 can obtain high joint strength and airtightness of the joint surface even on the casting surface, and can prevent solder from being applied to the non-joint region. Furthermore, if a through hole is formed in the diaphragm, the solder above and below the diaphragm is mixed appropriately through the through hole. Thereby, the effect that the local change of a solder component is prevented is also exhibited.

In addition, this form is only a mere illustration and does not limit this invention at all. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof.
For example, the shape of the minute protrusions and recesses provided on the joint surface of the workpiece is not limited to the example of FIG. As long as the joining surfaces mesh with each other and the height to the peak is within the range in which the cavitation of the diaphragm 14 can reach, anything may be used. For example, both the concave and convex portions may be formed on one joint surface. In addition, the upper and lower sides of the workpiece having a minute convex portion and the workpiece having a minute concave portion may be joined. In addition, if it is extremely small, it is effective to provide only a convex portion or a concave portion on the work on one side. In addition, since the convex portion and the concave portion are engaged with each other, the convex portion is slightly smaller than the concave portion, but the same may be used, or conversely, the convex portion may be slightly larger. In this case, the convex portion and the concave portion are slightly deformed and pushed in at the time of heating and pressing.

  In the above embodiment, the through hole is provided in a portion of the diaphragm corresponding to the non-bonding region of the workpiece. However, a groove may be provided instead of the through hole. In this case, the groove is naturally arranged on the surface on the workpiece side. The depth of the groove is at least 0.5 mm, and the depth is such that cavitation generated in the groove does not reach the joint surface. The groove may be formed by thinning the diaphragm at that portion, or by curving the diaphragm by pressing or the like.

It is a schematic block diagram which shows the solder application | coating apparatus of this form. It is a top view which shows a workpiece | work. It is a top view which shows a workpiece | work. It is a perspective view which shows the example of a diaphragm. It is sectional drawing which shows the example of a diaphragm. It is sectional drawing which piled up workpieces. It is explanatory drawing which shows a mode that a workpiece | work is joined. It is explanatory drawing which shows the example of the shape of the convex part and recessed part which are formed in a workpiece | work.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder coating apparatus 11 Solder melting tank 12 Heater 13 Solder 14, 41 Vibrating plate 15 Ultrasonic oscillator 21, 22 Work 31, 32 Joint surface 31a Convex part 32a Concave part 31b, 32b Concave part 41a Through-hole

Claims (4)

In the method of manufacturing a joining member by forming a solder layer on the joining surface of a member to be joined, and joining the joining surfaces on which the solder layer is formed,
A non-bonded area that is recessed in the bonding surface is formed and the remainder is a bonding area.
Solder layer formation,
Using a vibrating member having a hole or groove of a shape corresponding to the non-bonding area of the bonding surface,
In the molten solder, the joining surface of the member to be joined and the vibration member are faced so that the non-bonding area of the joining surface and the hole or groove of the vibration member face each other,
A method for manufacturing a joining member, comprising: vibrating a vibrating member. In the manufacturing method of the joining member according to claim 1,
In the joining region of the joining surface of one of the members to be joined, a recess having a depth within a range in which cavitation in the molten solder reaches the joining surface is formed in advance.
A protrusion having a height within a range in which cavitation in the molten solder reaches the bonding surface is formed in advance at a position corresponding to the concave portion of the one bonding member in the bonding region of the bonding surface of the other bonded member. ,
The non-bonded region is recessed deeper than the recess,
By overlapping the joining surfaces of the one and other members to be joined, the concave portion of the one member to be joined and the convex portion of the other member to be joined are engaged,
The manufacturing method of the joining member characterized by joining joining surfaces in the state. In the manufacturing method of the joining member according to claim 2 ,
When joining the joining surfaces, the joining surface in which the concave portion is formed faces upward, and the joining surface on which the convex portion is formed is superposed on the joining member. Production method. In the manufacturing method of the joining member as described in any one of Claim 1- Claim 3 ,
The method for manufacturing a joining member, wherein the member to be joined is a metal member of a type in which a passive film is formed on the surface.

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