JP2007324211A - Method of forming bump-shaped connecting member - Google Patents

Method of forming bump-shaped connecting member Download PDF

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Publication number
JP2007324211A
JP2007324211A JP2006150099A JP2006150099A JP2007324211A JP 2007324211 A JP2007324211 A JP 2007324211A JP 2006150099 A JP2006150099 A JP 2006150099A JP 2006150099 A JP2006150099 A JP 2006150099A JP 2007324211 A JP2007324211 A JP 2007324211A
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bump
mold
forming
pressing
roughened
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Masao Takemura
雅央 竹村
Toshiaki Hirozawa
稔明 広沢
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Canon Inc
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Canon Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H01L2224/1183—Reworking, e.g. shaping
    • H01L2224/1184—Reworking, e.g. shaping involving a mechanical process, e.g. planarising the bump connector

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simple method for forming bump-shaped connecting members which are used for electrically or thermally connecting two members together and capable of improving an electrical connection in both reliability and heat dissipating properties. <P>SOLUTION: Bump-shaped connecting members 105 are formed on a second member 106, the tops of all the bump-shaped connecting members are set nearly uniform in height by pressing them with a first meal die before the first and second member are joined together, and furthermore the surfaces of all the bump-shaped connecting members are roughened by pressing them with a second metal die 101. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、二つの部材間の電気的もしくは熱的接続を行うためのバンプ状接続部材の形成方法に係わり、特に電気的および熱的接続の信頼性向上に関する。   The present invention relates to a method for forming a bump-like connection member for making an electrical or thermal connection between two members, and more particularly to improving the reliability of electrical and thermal connection.

2つの接合基板の電気的もしくは熱的接続を行うためのバンプ状接続部材（以下、「バンプ」と呼称する）としては、パッシベーション膜としてのSiO2、SiNなどの膜を形成し、パターニングした後、アルミ電極上に密着向上層としてのTi、Cu、Wなどの材質からなるバリヤメタルを通常1〜3層設け、その後、その上にフォトリソ工程によってレジストパターンを形成した後、金を電解メッキによって成長させて形成するメッキバンプがある。特許文献１では、このメッキバンプによって、バンプ表面を表面粗さRa0.1μm〜3μmの微小凹凸が連続する面となるように形成し、IC実装時の接続抵抗値を低下させることが開示されている。しかし、メッキバンプを形成するためには、複数回にわたる真空成膜と露光・現像工程が必要であり、またバンプを設けるパッド部のパターン変更の度にフォトマスクの変更も必要である。また基板上のバンプ数が少ない場合は、成膜・フォトリソ工程は減らないため、特に１バンプあたりのコストが高くなる。   As a bump-like connection member (hereinafter referred to as “bump”) for electrical connection or thermal connection between two bonded substrates, a film such as SiO2 or SiN as a passivation film is formed and patterned. 1 to 3 layers of barrier metal made of materials such as Ti, Cu, and W as an adhesion improving layer are usually provided on the aluminum electrode, and after that, a resist pattern is formed thereon by a photolithography process, and then gold is grown by electrolytic plating. There are plating bumps to be formed. In Patent Document 1, it is disclosed that the bump surface is formed by this plating bump so that the bump surface has a continuous surface having a surface roughness of Ra 0.1 μm to 3 μm, and the connection resistance value during IC mounting is reduced. Yes. However, in order to form plated bumps, vacuum film formation and exposure / development processes are required a plurality of times, and a photomask needs to be changed every time the pattern of the pad portion where the bumps are provided is changed. Further, when the number of bumps on the substrate is small, the film formation / photolitho process is not reduced, and the cost per bump is particularly high.

このような背景から、近年では、ワイヤーボンディングを応用したスタッドバンプが注目を集めている。スタッドバンプは、キャピラリーと呼ばれるセラミックからなる管を通して出されたワイヤー先端部に、アーク放電にボールを形成した後、このボール部を基板上のパッド部に熱あるいは超音波を併用して接合し、キャピラリーを上昇させカットクランパーでワイヤーをつかみ、引っ張り応力によってワイヤーを破断させ、パッド上にボール部分のみを残すことによって形成される。このスタッドバンプは、メッキバンプ形成時に必要とするような真空成膜装置や露光装置を必要とせず、また基板上のパッド部のパターン変更に対しても、ワイヤーボンダーのデータ変更だけで対応できる。   Against this background, in recent years, stud bumps using wire bonding have attracted attention. Stud bumps form a ball in arc discharge at the tip of a wire drawn out through a ceramic tube called a capillary, and then bond this ball part to the pad part on the substrate using heat or ultrasonic waves together. It is formed by raising the capillary, holding the wire with a cut clamper, breaking the wire by tensile stress, and leaving only the ball portion on the pad. This stud bump does not require a vacuum film forming apparatus or an exposure apparatus that is necessary when forming a plating bump, and can change the pattern of the pad portion on the substrate only by changing the data of the wire bonder.

図5に従来のスタッドバンプのレベリングをする様子を示す。図5に示すように、スタッドバンプ505は頭頂部が平坦でないため、電気的接続を行うには、タンピングツール501を用いて各々のバンプ505に荷重を加え、バンプ頭頂部を平坦化してバンプ高さを均一にするレベリングが一般的に行われている。
特開2002-324819号公報 Fig. 5 shows the conventional leveling of stud bumps. As shown in FIG. 5, since the top of the stud bump 505 is not flat, a load is applied to each bump 505 using a tamping tool 501 to make electrical connection, and the bump top is flattened by flattening the bump top. Leveling to make the thickness uniform is generally performed.
JP 2002-324819 A

図6に従来のタンピングツールの押圧面の平面図およびA-A'断面図、図7に従来のバンプレベリング後、バンプを介して二つの部材を圧着接合する様子を示す。   FIG. 6 shows a plan view of a pressing surface of a conventional tamping tool and an AA ′ cross-sectional view, and FIG. 7 shows a state in which two members are crimped and joined via bumps after conventional bump leveling.

図7に示すように、従来、第一の部材にバンプを形成し、バンプを介して二つの部材を電気的もしくは熱的に接合する場合、以下に述べる課題があった。   As shown in FIG. 7, conventionally, when bumps are formed on the first member and the two members are joined electrically or thermally via the bumps, the following problems have been encountered.

図5の従来のタンピングツールを用いてバンプをレベリングすると、図7（a）に示すように、其々のバンプ704'の表面は平坦化されて高さはほぼ均一となる。しかし、このバンプ704'おいて、部材702・705との接合方向および当該方向に対して垂直な方向の断面形状がそれぞれ異なっている。さらに、バンプ704'が第一の部材702との圧接の際に変形する部位の体積も異なっている。これらが原因となって、バンプ704'を介して第一の部材702と第二の部材705を接合する際、其々のバンプ70４'に負荷される押圧荷重701に偏りが生じ、場合によっては図7（b）に示すバンプBやバンプDのように第一の部材702と未接合となる部分ができるため、十分な接合面積が得られずに電気的および熱的接続が損なわれる問題があった。また、バンプ704'の表面が平坦であるがゆえに、第一の部材702とバンプ704'が面接触するために接続抵抗が大きく、接続信頼性の観点からは好ましくない。   When bumps are leveled using the conventional tamping tool of FIG. 5, as shown in FIG. 7 (a), the surface of each bump 704 ′ is flattened and the height becomes substantially uniform. However, in the bump 704 ′, the joining direction with the members 702 and 705 and the cross-sectional shape perpendicular to the direction are different. Further, the volume of the portion where the bump 704 ′ is deformed when pressed with the first member 702 is also different. For these reasons, when the first member 702 and the second member 705 are joined via the bump 704 ′, the pressing load 701 loaded on each bump 704 ′ is biased, and in some cases Since there is a portion that is not joined to the first member 702 like the bump B and bump D shown in FIG. 7 (b), there is a problem that the electrical and thermal connection is impaired without obtaining a sufficient joining area. there were. Further, since the surface of the bump 704 'is flat, the first member 702 and the bump 704' are in surface contact with each other, resulting in a large connection resistance, which is not preferable from the viewpoint of connection reliability.

そこで本発明は、上記課題を解決するためになされたものであり、その目的とするところは、相互に接合することによって、2つの部材間の電気的もしくは熱的接続を行うための複数のバンプ状接続部材において、簡便に電気的接続の信頼性および放熱特性を向上できるバンプ状接続部材の形成方法を提供することにある。   Accordingly, the present invention has been made to solve the above-described problems, and the object of the present invention is to provide a plurality of bumps for electrical or thermal connection between two members by bonding to each other. An object of the present invention is to provide a method for forming a bump-like connection member that can easily improve the reliability of electrical connection and heat dissipation characteristics.

上記課題を解決するため、本発明は、相互に接合することによって、第一の部材と第二の部材間の電気的もしくは熱的接続を行うための複数のバンプ状接続部材において、第二の部材上に前記複数のバンプ状接続部材を形成し、前記第一の部材と前記第二の部材の接合前に、全ての前記バンプ状接続部材の表面を金型にて押圧することによって粗面化することを特徴とするバンプ状接続部材の形成方法を提供するものである。また、前記押圧により、前記バンプ状接続部材の高さをほぼ均一に形成することを特徴とするバンプ状接続部材の形成方法を提供することである。また、相互に接合することによって、第一の部材と第二の部材間の電気的もしくは熱的接続を行うための複数のバンプ状接続部材において、
第二の部材上に前記複数のバンプ状接続部材を形成し、前記第一の部材と前記第二の部材の接合前に、第一の金型にて押圧することによって全ての前記バンプ状接続部材の頂点の高さをほぼ均一に形成し、さらに前記全ての前記バンプ状接続部材の表面を第二の金型にて押圧することによって粗面化することを特徴とするバンプ状接続部材の形成方法を提供するものである。また、前記金型の押圧面はヘアライン仕上げされていることを特徴とする。あるいは、前記金型の押圧面は網目模様が形成されていてもよい。また、前記金型の押圧面を機械加工により粗面化することを特徴とするバンプ状接続部材の形成方法を提供するものである。また、前記金型の押圧面をシボ加工あるいはブラスト処理によって粗面化してもよい。さらに、前記バンプ状接続部材の表面を加熱しながら押圧すると好ましい。 In order to solve the above-mentioned problems, the present invention provides a plurality of bump-like connection members for electrical or thermal connection between a first member and a second member by bonding to each other. Forming the plurality of bump-shaped connecting members on a member, and pressing the surfaces of all the bump-shaped connecting members with a mold before joining the first member and the second member. The present invention provides a method for forming a bump-like connecting member. It is another object of the present invention to provide a method for forming a bump-shaped connecting member, wherein the bump-shaped connecting member is formed with a substantially uniform height by the pressing. In addition, in a plurality of bump-shaped connection members for performing electrical or thermal connection between the first member and the second member by bonding to each other,
All the bump-like connections are formed by forming the plurality of bump-like connecting members on the second member and pressing them with the first mold before joining the first member and the second member. A bump-shaped connection member, characterized in that the height of the apex of the member is formed substantially uniformly, and the surface of all the bump-shaped connection members is roughened by pressing with a second mold. A forming method is provided. The pressing surface of the mold is hairline finished. Alternatively, a mesh pattern may be formed on the pressing surface of the mold. Further, the present invention provides a method for forming a bump-like connecting member, wherein the pressing surface of the mold is roughened by machining. In addition, the pressing surface of the mold may be roughened by a texture process or a blast process. Furthermore, it is preferable to press while heating the surface of the bump-shaped connecting member.

あるいは、前記バンプ状接続部材の表面に超音波振動を印加しながら押圧すると好適である。   Alternatively, it is preferable to apply pressure while applying ultrasonic vibration to the surface of the bump-shaped connecting member.

以上述べたように、本発明によれば、押圧面が粗面化された金型でバンプを押圧することにより、バンプ表面を粗面化することで、バンプを介した部材間の接合時の接続抵抗が低下して接合強度が増し、簡便に電気的および熱的接続の信頼性を向上させることができる。   As described above, according to the present invention, the bump surface is roughened by pressing the bump with a mold having a roughened pressing surface, so that at the time of joining between the members via the bump. The connection resistance is reduced, the bonding strength is increased, and the reliability of electrical and thermal connection can be easily improved.

次に、本発明の詳細を実施例の記述に従って説明する。   Next, details of the present invention will be described in accordance with the description of the embodiments.

図1に本発明の第一の実施例において、金型にて押圧することによりバンプ表面を粗面化する様子を真横から見た図を示す。同図中の101は金型、103は金型の押圧面、104金型の押圧面に形成された微小な凹凸形状、104'はバンプ表面に形成された微小な凹凸形状、105は初期状態のバンプ、106はバンプが形成された部材である。同図において、部材106に形成されたバンプ105は、金型101にて表面を押圧され（図１（a））、表面が粗面化されたバンプ105が形成される様子を示している（図1（b））。   FIG. 1 shows a view from the side of how the bump surface is roughened by pressing with a mold in the first embodiment of the present invention. In the figure, 101 is a mold, 103 is a pressing surface of a mold, 104 is a minute uneven shape formed on the pressing surface of a mold, 104 'is a minute uneven shape formed on a bump surface, and 105 is an initial state. The bump 106 is a member on which a bump is formed. In the drawing, the surface of the bump 105 formed on the member 106 is pressed by the mold 101 (FIG. 1 (a)), and the bump 105 having a roughened surface is shown (FIG. 1A). Figure 1 (b)).

また、図2に本発明に用いるバンプを押圧する金型の形状例を示す平面図および断面図を示し、押圧面の形状を表す拡大図を同図（1）および（２）に示す。同図中の201は金型、202は金型の押圧面、203は金型の押圧面に形成された微小な凹凸形状である。   Further, FIG. 2 shows a plan view and a cross-sectional view showing a shape example of a mold for pressing the bump used in the present invention, and enlarged views showing the shape of the pressing surface are shown in FIGS. (1) and (2). In the figure, 201 is a mold, 202 is a pressing surface of the mold, and 203 is a minute uneven shape formed on the pressing surface of the mold.

さらに、図3に図2（1）で示した金型にて押圧されたバンプを介して二つの部材を圧着接合する様子を真横から見た図を示す。同図中の305'は金型にて押圧された後のバンプ、306はバンプが形成された第二の部材、302は第二の部材と接合する第一の部材、305''は第一の部材と第二の部材を圧着接合した後のバンプである。図3において、第一の部材301は押圧荷重を受けてバンプ305'に接触し、バンプ305'は押し潰されて第一の部材301と第二の部材306が電気的もしくは熱的に接続される。   Further, FIG. 3 shows a view from the side of a state in which two members are pressure-bonded and joined via bumps pressed by the mold shown in FIG. 2 (1). In the figure, 305 ′ is a bump after being pressed by a mold, 306 is a second member on which a bump is formed, 302 is a first member to be joined to the second member, and 305 ″ is a first member. This is a bump after the member and the second member are bonded by pressure bonding. In FIG. 3, the first member 301 receives a pressing load and comes into contact with the bump 305 ′, the bump 305 ′ is crushed and the first member 301 and the second member 306 are electrically or thermally connected. The

本発明では金型にて押圧することにより全てのバンプ表面を粗面化することを特徴としている。そのために、図２に示すように、本発明の金型の押圧面202には、ヘアライン仕上げや網目模様の形成によって微小な凹凸形状203が設けられている。   The present invention is characterized in that all bump surfaces are roughened by pressing with a mold. For this purpose, as shown in FIG. 2, the pressing surface 202 of the mold of the present invention is provided with a minute uneven shape 203 by hairline finishing or forming a mesh pattern.

そこで、図1に示すように、押圧面103に微小な凹凸形状104を有する金型101を用いてバンプ105を押圧すると、金型101の微小な凹凸形状104がバンプ105の表面に転写され、全てのバンプ105の表面は粗面化される。このとき、バンプ高さがほぼ均一になるように押圧することが望ましい。その後、図3に示すように、本発明の金型による押圧後のバンプ305'を介して第一の部材302と第二の部材306を圧着接合する場合、従来に比べて、バンプ305'が第一の部材302と接触する時の接触面積が増加し、接続抵抗が低下する。また、バンプ表面に微小な凹凸形状304'が連続して形成されているため、従来に比べて、バンプ高さのばらつきを吸収できる。その結果、バンプ305''を介した部材間の接合強度が増大し、信頼性の高い電気的接続が可能となる。また、接合時のバンプと部材の接触面積が増加するので、従来よりも優れた放熱特性を確保することができる。   Therefore, as shown in FIG. 1, when the bump 105 is pressed using the mold 101 having the minute uneven shape 104 on the pressing surface 103, the minute uneven shape 104 of the mold 101 is transferred to the surface of the bump 105, The surface of all the bumps 105 is roughened. At this time, it is desirable to press so that the bump height is substantially uniform. Thereafter, as shown in FIG. 3, when the first member 302 and the second member 306 are pressure-bonded and bonded via the bump 305 ′ after being pressed by the mold of the present invention, the bump 305 ′ is compared with the conventional case. The contact area when contacting the first member 302 increases, and the connection resistance decreases. In addition, since minute uneven shapes 304 ′ are continuously formed on the bump surface, it is possible to absorb variations in bump height as compared with the conventional case. As a result, the bonding strength between the members via the bump 305 ″ is increased, and highly reliable electrical connection is possible. Moreover, since the contact area between the bump and the member at the time of joining increases, it is possible to ensure heat dissipation characteristics superior to those of the conventional art.

なお、ここでは、図2（1）に示す形状の金型にて押圧したバンプを用いる場合について説明したが、図2（2）に示す形状の金型にて押圧したバンプを介して二つの部材を圧着接合する場合も、同様に信頼性の高い電気的接続および放熱特性の優れた熱的接続が得られることは明らかである。さらに、金型の押圧面形状はこれらに限定されるわけではなく、連続した微小な凹凸形状をバンプ表面に転写することによって粗面化できるような形状であればよい。   In addition, although the case where the bump pressed with the metal mold | die of the shape shown in FIG. 2 (1) was used was demonstrated here, two bumps were pressed via the bump pressed with the metal mold | die shown in FIG. 2 (2). It is obvious that a highly reliable electrical connection and a thermal connection with excellent heat dissipation characteristics can be obtained when the members are joined by pressure bonding. Furthermore, the shape of the pressing surface of the mold is not limited to these, and may be any shape that can be roughened by transferring a continuous minute uneven shape onto the bump surface.

また、本発明の金型の押圧面におけるヘアライン仕上げや網目模様の形成は、切削・研磨等の機械加工により実現されるが、シボ加工やブラスト処理によって形成してもよい。   Moreover, although the hairline finish and the formation of the mesh pattern on the pressing surface of the mold of the present invention are realized by machining such as cutting and polishing, they may be formed by embossing or blasting.

加えて、本実施例において、金型によってバンプ表面を所望の表面粗さに粗面化する際、熱あるいは超音波振動を印加しながらバンプを押圧すると、バンプ剛性の低下により比較的小さい荷重で押圧でき、さらにバンプを介した部材間の接合強度が増すため、より信頼性の高い電気的接続および放熱特性の優れた熱的接続が得られる。   In addition, in this embodiment, when the bump surface is roughened to a desired surface roughness with a mold, if the bump is pressed while applying heat or ultrasonic vibration, a relatively small load is applied due to a decrease in bump rigidity. Since it can be pressed and the bonding strength between the members via the bumps is increased, more reliable electrical connection and thermal connection with excellent heat dissipation characteristics can be obtained.

図4に本発明の第二の実施例において、金型にて押圧することによりバンプ表面を粗面化する様子を真横から見た図を示す。同図中の401は従来のタンピングツール、407は本発明の金型、405'は従来のタンピングツールにより押圧されたバンプ、405''は本発明の金型により押圧されたバンプを示している。   FIG. 4 shows a view from the side of how the bump surface is roughened by pressing with a mold in the second embodiment of the present invention. In the figure, 401 is a conventional tamping tool, 407 is a mold of the present invention, 405 'is a bump pressed by a conventional tamping tool, and 405' 'is a bump pressed by a mold of the present invention. .

第一の実施例では、図２に示す金型を用い、形成したままの初期状態のバンプを直接押圧して、表面が粗面化されたバンプを形成する場合について説明した。しかし、この場合、初期状態のそれぞれのバンプは、頂点の高さだけでなく、押圧方向の断面形状および押圧方向と垂直な断面形状が大きく異なっており、さらに押圧により変形する部位の体積も揃っていないため、金型による押圧後にわずかにバンプ高さが揃わない場合が生じ得る。そこで、本実施例では、まず、従来のタンピングツール401によりバンプ405を押圧し、一旦、バンプ405の高さをほぼ均一に揃えておく（図4（b））。次に、高さの揃ったバンプ405'を図2（1）に示す金型にて押圧し、全てのバンプ表面を粗面化する（図4（c））。このように、あらかじめ従来のタンピングツールを用いて全てのバンプ高さを揃えておくと、本発明の金型で押圧する際、押圧荷重に偏りが無くなるため、押圧後に高さがほぼ均一で、表面が粗面化されたバンプ405''を形成することができる。   In the first embodiment, the case where bumps having a roughened surface are formed by directly pressing the bumps in the initial state as they are formed using the mold shown in FIG. However, in this case, each bump in the initial state has not only the height of the apex, but also the cross-sectional shape in the pressing direction and the cross-sectional shape perpendicular to the pressing direction are greatly different, and the volume of the portion deformed by pressing is also uniform. Therefore, the bump heights may not be slightly aligned after pressing with the mold. Therefore, in this embodiment, first, the bump 405 is pressed by the conventional tamping tool 401, and the height of the bump 405 is once made substantially uniform (FIG. 4B). Next, the bumps 405 ′ having the same height are pressed with the mold shown in FIG. 2 (1) to roughen all bump surfaces (FIG. 4 (c)). Thus, if all bump heights are aligned using a conventional tamping tool in advance, when pressing with the mold of the present invention, the pressing load is not biased, so the height is almost uniform after pressing, A bump 405 ″ having a roughened surface can be formed.

その結果、バンプ405''を介した部材間の接合強度はさらに増大し、より信頼性の高い電気的接続が可能となる。また、接合時のバンプと部材の接触面積がさらに増加するので、第一の実施例よりも優れた放熱特性を確保することができる。   As a result, the bonding strength between the members via the bumps 405 ″ is further increased, and a more reliable electrical connection is possible. Further, since the contact area between the bump and the member at the time of joining further increases, it is possible to ensure heat dissipation characteristics superior to those of the first embodiment.

なお、第一の実施例と同様に、図2（1）に示す形状の金型にて押圧したバンプを用いる場合について説明したが、図2（2）に示す形状の金型にて押圧したバンプを介して二つの部材を圧着接合する場合も、より信頼性の高い電気的接続および放熱特性の優れた熱的接続が得られることは明らかである。   As in the first embodiment, the case of using the bump pressed by the mold having the shape shown in FIG. 2 (1) has been described. However, the bump pressed by the mold having the shape shown in FIG. 2 (2) is used. It is obvious that more reliable electrical connection and thermal connection with excellent heat dissipation characteristics can be obtained even when two members are bonded by pressure bonding via bumps.

さらに、本実施例においても、金型によってバンプ表面を所望の表面粗さに粗面化する際、熱あるいは超音波振動を印加しながらバンプを押圧すると、バンプ剛性の低下により比較的小さい荷重で押圧でき、さらにバンプを介した部材間の接合強度が増すため、より信頼性の高い電気的接続および放熱特性の優れた熱的接続が得られる。   Further, also in this embodiment, when the bump surface is roughened to a desired surface roughness by a mold, if the bump is pressed while applying heat or ultrasonic vibration, a relatively small load is applied due to a decrease in bump rigidity. Since it can be pressed and the bonding strength between the members via the bumps is increased, more reliable electrical connection and thermal connection with excellent heat dissipation characteristics can be obtained.

本発明の第一の実施例によりバンプ表面を粗面化する方法を示した図である。It is the figure which showed the method of roughening the bump surface by the 1st Example of this invention. 本発明の金型の形状例を示した図である。It is the figure which showed the example of the shape of the metal mold | die of this invention. 本発明の第一の実施例おいて、二つの部材を接合する様子を示した図である。In the 1st Example of this invention, it is the figure which showed a mode that two members were joined. 本発明の第二の実施例によりバンプ表面を粗面化する方法を示した図である。It is the figure which showed the method of roughening the bump surface by the 2nd Example of this invention. 従来のレベリングの様子を示した図である。It is the figure which showed the mode of the conventional leveling. 従来のタンピングツールを示した図である。It is the figure which showed the conventional tamping tool. 従来のバンプを介して、二つの部材を接合する様子を示した図である。It is the figure which showed a mode that two members were joined via the conventional bump.

符号の説明Explanation of symbols

101、201、407 金型
102、202、301、408、701 押圧荷重
103、303、404、504、602、703 押圧面
104、203、409 微小な凹凸形状（金型側）
104'、304'、409' 微小な凹凸形状（バンプ側）
105、405、505 レベリング前のバンプ（初期状態のバンプ）
105'、305'、405'、405''、704'、704'' レベリング後のバンプ
106、306、406、506、705 第二の部材
302、702 第一の部材
401、501、601 従来のタンピングツール
402、 502 ホーン
403、503 キャピラリー固定ビス 101, 201, 407 mold
102, 202, 301, 408, 701 Press load
103, 303, 404, 504, 602, 703 Press surface
104, 203, 409 Minute uneven shape (mold side)
104 ', 304', 409 'Minute uneven shape (bump side)
105, 405, 505 Bump before leveling (initial bump)
105 ', 305', 405 ', 405'',704', 704 '' bump after leveling
106, 306, 406, 506, 705 Second member
302, 702 First member
401, 501, 601 Conventional tamping tool
402, 502 Horn
403, 503 Capillary fixing screw

Claims (10)

相互に接合することによって、第一の部材と第二の部材間の電気的もしくは熱的接続を行うための複数のバンプ状接続部材の形成方法において、
第二の部材上に前記複数のバンプ状接続部材を形成し、前記第一の部材と前記第二の部材の接合前に、全ての前記バンプ状接続部材の表面を金型にて押圧することによって粗面化することを特徴とするバンプ状接続部材の形成方法。 In the method of forming a plurality of bump-like connection members for performing electrical or thermal connection between the first member and the second member by joining together,
Forming the plurality of bump-shaped connection members on the second member, and pressing the surfaces of all the bump-shaped connection members with a mold before joining the first member and the second member. A method for forming a bump-like connecting member, wherein the surface is roughened. 前記押圧により、前記バンプ状接続部材の高さをほぼ均一に形成することを特徴とする請求項１に記載のバンプ状接続部材の形成方法。   The method for forming a bump-shaped connection member according to claim 1, wherein the bump-shaped connection member has a substantially uniform height by the pressing. 相互に接合することによって、第一の部材と第二の部材間の電気的もしくは熱的接続を行うための複数のバンプ状接続部材の形成方法において、
第二の部材上に前記複数のバンプ状接続部材を形成し、前記第一の部材と前記第二の部材の接合前に、タンピングツールにて押圧することによって全ての前記バンプ状接続部材の頂点の高さをほぼ均一に形成し、さらに前記全ての前記バンプ状接続部材の表面を金型にて押圧することによって粗面化することを特徴とするバンプ状接続部材の形成方法。 In the method of forming a plurality of bump-like connection members for performing electrical or thermal connection between the first member and the second member by joining together,
Forming the plurality of bump-shaped connection members on a second member and pressing them with a tamping tool before joining the first member and the second member, the apexes of all the bump-shaped connection members The bump-shaped connection member forming method is characterized in that the height of each of the bump-shaped connection members is roughened by pressing the surfaces of all the bump-shaped connection members with a mold. 前記金型の押圧面はヘアライン仕上げされていることを特徴とする請求項1または請求項３に記載のバンプ状接続部材の形成方法。   The method for forming a bump-like connecting member according to claim 1 or 3, wherein the pressing surface of the mold has a hairline finish. 前記金型の押圧面は網目模様が形成されていることを特徴とする請求項1または請求項３に記載のバンプ状接続部材の形成方法。   4. The method for forming a bump-like connecting member according to claim 1, wherein the pressing surface of the mold is formed with a mesh pattern. 前記金型の押圧面を機械加工により粗面化することを特徴とする請求項１または請求項３に記載のバンプ状接続部材の形成方法。   4. The method for forming a bump-like connecting member according to claim 1, wherein the pressing surface of the mold is roughened by machining. 前記金型の押圧面をシボ加工により粗面化することを特徴とする請求項１または請求項３に記載のバンプ状接続部材の形成方法。   4. The method for forming a bump-like connecting member according to claim 1, wherein the pressing surface of the mold is roughened by a texture process. 前記金型の押圧面をブラスト処理により粗面化することを特徴とする請求項１または請求項３に記載のバンプ状接続部材の形成方法。   4. The method for forming a bump-like connecting member according to claim 1, wherein the pressing surface of the mold is roughened by blasting. 前記バンプ状接続部材の表面を加熱しながら押圧することを特徴とする請求項１または請求項３に記載のバンプ状接続部材の形成方法。   4. The method for forming a bump-shaped connecting member according to claim 1, wherein the surface of the bump-shaped connecting member is pressed while being heated. 前記バンプ状接続部材の表面に超音波振動を印加しながら押圧することを特徴とする請求項１または請求項３に記載のバンプ状接続部材の形成方法。   The method for forming a bump-shaped connection member according to claim 1, wherein the bump-shaped connection member is pressed while applying ultrasonic vibration to a surface of the bump-shaped connection member.
JP2006150099A 2006-05-30 2006-05-30 Method of forming bump-shaped connecting member Withdrawn JP2007324211A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2075741A2 (en) 2007-12-17 2009-07-01 Nec Corporation Image comparing method, apparatus and program
JP2010234534A (en) * 2009-03-30 2010-10-21 Brother Ind Ltd Liquid discharge device and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2075741A2 (en) 2007-12-17 2009-07-01 Nec Corporation Image comparing method, apparatus and program
JP2010234534A (en) * 2009-03-30 2010-10-21 Brother Ind Ltd Liquid discharge device and manufacturing method thereof
US8430483B2 (en) 2009-03-30 2013-04-30 Brother Kogyo Kabushiki Kaisha Liquid discharge device and manufacturing method thereof

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