JP2008249346A - Manufacturing method of microchip, and the microchip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing low-cost microchip suitable for a disposable type easily and with proper yield by forming a microchannel on one plastic substrate through forming a pattern by means of screen printing with a hot-melt adhesive and also forming an electrode on the other plastic substrate and then by bonding the both substrates by thermocompression. <P>SOLUTION: The manufacturing method of microchip comprises a process for forming a microchannel 2 which is a part having no hot-melt adhesive 5 through performing patterning on one substrate 1 that uses screen printing with a hot-melt adhesive; a process for forming a film of an electrode 3 on the other substrate 4 by ion plating corresponding to the microchannel; a process for positioning and superposing the both substrates so that the microchannel and the electrode formed on the substrates are set opposed to each other; and a process for jointing the both substrates by thermocompression. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a microchip in which a fine channel groove is formed on a surface portion of one substrate, an electrode is formed on the other substrate, and two substrates are joined, and a method for manufacturing the microchip.

In a conventional microchip manufacturing method, for example, a glass microchip substrate can be formed by coating a substrate with a metal or a photoresist resin and baking a channel pattern, followed by an etching process.
However, glass is not suitable for mass production and is very expensive, and in the case of a micro-channel that is difficult to clean after measurement when analyzed with a microchip, the sample from the previous analysis remains and is accurate. There was a risk that measured values could not be obtained.

  Microchip substrates made of plastic can be manufactured by various molding methods such as injection molding. In injection molding, molten thermoplastic material is introduced into the mold cavity, and the cavity is cooled to cure the resin. Therefore, since the microchip substrate can be manufactured efficiently and economically, it is suitable for mass production.

As a method for bonding a plastic microchip substrate, a method of bonding by heating, ultrasonic waves or laser is known.
In joining by heating, the plastic substrate may be excessively melted by heat, and the cross section of the microchannel may be deformed. In the case of a microchip for visually observing the microchannel, the deformation and alteration of the plastic may be affected by the measurement. The impact is likely. (See Patent Document 1)

In addition, ultrasonic bonding can be performed on several mm square surfaces, but is not suitable for bonding several centimeter square surfaces. Depending on the size of the microchip, welding may be insufficient.
There is a method of using an ultrasonic transducer head micro-machined in the same shape as a microchannel only at a joint other than the microchannel, but this step is necessary. (See Patent Document 2)

In addition, in laser joining, it is very difficult to overheat only the central part of the plastic such as the two bonded surfaces. In addition, there is a method of masking a portion other than a joint portion such as a flow path, but this step is necessary. (See Patent Document 3)
JP-A-2005-77218 JP 2005-77239 A JP-A-2005-74796

In the conventional method of joining a chip for a microsystem using plastic as a substrate, since the microchip substrate is dissolved, the microchip and the microchannel (microchannel) are deformed and deteriorated, resulting in a decrease in yield. there were.
In addition, the method using a mask or the like at the time of bonding has a problem that the number of steps for bonding increases and the cost increases.

  The subject (object) of the present invention is to form a pattern on one plastic substrate by forming a pattern by screen printing with a hot melt adhesive, and to form an electrode on the other plastic substrate, By thermocompression bonding the two, a microchip suitable for an inexpensive disposable type is simply produced with good yield.

  In order to solve the above-mentioned problems, a process of patterning a hot melt adhesive on one substrate by screen printing to form a fine channel that is a portion where the hot melt adhesive does not exist, and on the other substrate A step of forming an electrode corresponding to the fine flow path by ion plating, and aligning the electrodes so that the fine flow path formed on the one substrate and the other substrate faces the electrode. A method of manufacturing a microchip, comprising a step of superimposing and a step of thermocompression bonding the two substrates. (Claim 1)

Further, the one and the other substrates are plastic substrates. (Claim 2)
Further, the one substrate is made of polycarbonate. (Claim 3)

Further, the adjustment of the height of the fine flow path after bonding by thermocompression bonding the two substrates is adjusted by the height of the hot melt adhesive formed by screen printing on the one substrate. To do. (Claim 4)
In addition, a plurality of the fine channels and electrodes corresponding to the fine channels are formed on the one and the other substrates, and a plurality of channels are formed on the same substrate. (Claim 5)

  Further, an electrode formed by ion plating on the first substrate, and a fine flow formed by screen printing a hot melt adhesive on the second substrate corresponding to the electrode on the second substrate. A microchip characterized by thermocompression bonding with matching paths. (Claim 6)

In addition, a plurality of the electrodes and the fine flow paths are formed on the same substrate. (Claim 7)
The fine channel may penetrate through the side surface of the second substrate. (Claim 8)
In addition, the electrodes are exposed on both side surfaces of the fine channel. (Claim 9)
The second substrate may be polycarbonate. (Claim 10)

  According to the microchip manufacturing method and the microchip of the present invention described in claims 1 to 10, the microchip substrate can be bonded in a short time (about 30 seconds) with a high yield, and the microchip can be formed with a small number of steps. Since it can be manufactured, it can contribute to lowering the cost to mass production. In addition, even when substances having different materials such as a substrate with electrodes are combined, it is possible to perform simple and simple bonding. Since bonding is not performed by melting the microchip substrate itself but by bonding layer, the bonding is performed at a temperature lower than the melting temperature of the microchip substrate, so that deformation / degeneration of the microchip can be avoided.

The microchip manufacturing method of the present invention will be described below with reference to the flowchart of FIG.
A hot melt adhesive is patterned on one plastic substrate (lid substrate) by screen printing to form a fine channel that is a portion where the hot melt adhesive does not exist. (Step S1)
At that time, the height of the fine flow path becomes lower than that at the time of formation by a thermocompression bonding procedure described later, so that the height is set to allow for that amount.
In addition, since the width of the fine channel formed as a portion where the hot melt adhesive does not exist is narrowed by the thermocompression bonding procedure, it is patterned to the expected width.
An electrode corresponding to the fine channel is formed on the other substrate (substrate body) by ion plating. (Step S2)
-Overlapping the fine channels formed on the one substrate and the other substrate in alignment so that the electrodes face each other. (Step S3)
-Bond the two substrates by thermocompression bonding. (Step S4)

Examples of instruments / reagents and processing operations used in the microchip manufacturing method of the present invention are as follows.
1． Instruments and reagents
(a) Reagent Acetone and ethanol (Wako, Japan) were used for cleaning the microchip substrate body.
(b) Instruments Laminator (Japan GC Corporation (Part No. GLM320R4)
(c) Microchip substrate Microchip lid substrate: formed by printing a pattern on a plastic substrate (polycarbonate) by hot-melt adhesive (JELCON AD-HM6) by screen printing.
(d) Microchip substrate body: An electrode or the like is formed on a plastic substrate (polyethylene terephthalate (PET)) by ion plating.

2. operation
(a) Microchip substrate cleaning (substrate body)
・ Place the microchip substrate (substrate body) in a beaker etc. and ultrasonically wash with acetone for 5 minutes.
・ Place the microchip substrate (substrate body) in a beaker, etc., and clean it with ethanol for 5 minutes.
・ Dry in an oven (about 50 ℃).

3. Gluing operation
(a) The microchip lid substrate and the microchip substrate body are aligned.
(b) Two plain papers are placed, and the microchip lid substrate and the microchip substrate body are placed in the valley.
(c) Using a laminator, the microchip lid substrate and the microchip substrate main body are bonded by thermocompression bonding at 110 ° C. and a speed of 55.5 cm / min. (One example of the pressure at this time was 1.13 MPa.)
(d) The joining state is confirmed with a microscope.

Next, the structure (configuration) of the microchip of the present invention will be described with reference to FIGS.
FIG. 2 is a diagram showing a state before thermocompression bonding.
In FIG. 2, a hot melt adhesive (5) is patterned on one plastic substrate (1) by screen printing, and a fine flow path (space 2 between 5 and 5) which is a portion where no hot melt adhesive exists. ) Is formed.
At this time, the height of the hot melt adhesive (the height of the fine flow path) is lower than that at the time of formation according to the thermocompression bonding procedure described later, so the height is formed to allow for that amount.
In addition, since the width of the fine channel formed as a portion where the hot melt adhesive does not exist is narrowed by the thermocompression bonding procedure, it is patterned to the expected width.
Further, an electrode (3) corresponding to the fine flow path is formed on the other substrate (4) by ion plating.

FIG. 3 is a diagram showing a state after thermocompression bonding (when the microchip is completed).
In FIG. 3, a hot melt adhesive obtained by patterning a hot melt adhesive (5) on one plastic substrate (1) by screen printing was formed on the other substrate (4) by ion plating. In the state of being thermocompression bonded onto the electrode (3), the height of the hot melt adhesive (the height of the fine flow path) is lower than that in FIG.
Further, it is desirable that the electrode 3 has a space at the top in the drawing with one substrate so that the contact area with the electrode when the micro flow path is filled with the liquid to be inspected is increased. .

FIG. 4 is a schematic diagram showing the relationship between components of the structure (configuration) of the microchip of the present invention.
In FIG. 4, a hot melt adhesive (5) is patterned on one plastic substrate (1) by screen printing, and a fine flow path (space 2 between 5 and 5) which is a portion where no hot melt adhesive exists. ) Is formed.
Further, an electrode (3) corresponding to the fine flow path is formed on the other substrate (4) by ion plating.

2 to 4 show an example in which one microchip is formed on the substrate.
It is also possible to form a plurality of channels on one substrate by forming a plurality of pairs of electrodes and fine channels (referred to as channels in the pair of electrodes and fine channels) on the same substrate. .
Moreover, although it is not clear in FIGS. 2-4, the fine flow path may be penetrated by the side surface of the said 2nd board | substrate.

It is a flowchart which shows the procedure of the manufacturing method of the microchip of this invention. It is a figure which shows the state before thermocompression bonding of the microchip of this invention. It is a figure which shows the state (at the time of completion of a microchip) after thermocompression bonding of the microchip of this invention. It is a schematic diagram which shows the relationship between each component of the structure (structure) of the microchip of this invention.

Explanation of symbols

1: One substrate (lid substrate)
2: Fine channel 3: Electrode 4: Other substrate (substrate body)
5: Hot melt adhesive

Claims (10)

Patterning hot melt adhesive on one substrate by screen printing to form a fine flow path that is a portion where the hot melt adhesive does not exist;
Forming an electrode corresponding to the fine channel by ion plating on the other substrate;
A process of aligning and superimposing the fine channels formed on the one substrate and the other substrate so that the electrodes face each other;
Bonding the two substrates by thermocompression bonding;
A method for producing a microchip, comprising:   2. The method of manufacturing a microchip according to claim 1, wherein the one and the other substrates are plastic substrates.   The method of manufacturing a microchip according to claim 2, wherein the one substrate is polycarbonate.   The height of the fine flow path after joining the two substrates by thermocompression bonding is adjusted by the height of a hot melt adhesive formed by screen printing on the one substrate. Item 4. The method for producing a microchip according to items 1 to 3.   5. A plurality of channels are formed on the same substrate by forming a plurality of the microchannels and electrodes corresponding to the microchannels on the one and the other substrates, respectively. 2. The method for producing a microchip according to any one of the above.   An electrode formed by ion plating on the first substrate, and a fine channel formed by screen printing a hot melt adhesive on the second substrate corresponding to the electrode on the second substrate. A microchip characterized by being thermocompression-bonded at the same position.   7. The microchip according to claim 6, wherein a plurality of the electrodes and fine flow paths are formed on the same substrate.   The microchip substrate according to claim 6 or 7, wherein the fine channel passes through a side surface of the second substrate.   The microchip according to any one of claims 6 to 8, wherein the electrodes are exposed on both side surfaces of the fine channel.   The microchip according to claim 6, wherein the second substrate is polycarbonate.

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