JP4664763B2 - Temperature detector and high frequency heater - Google Patents

Temperature detector and high frequency heater Download PDF

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JP4664763B2
JP4664763B2 JP2005211331A JP2005211331A JP4664763B2 JP 4664763 B2 JP4664763 B2 JP 4664763B2 JP 2005211331 A JP2005211331 A JP 2005211331A JP 2005211331 A JP2005211331 A JP 2005211331A JP 4664763 B2 JP4664763 B2 JP 4664763B2
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case
container
infrared sensor
temperature
detection device
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JP2007024829A (en
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英徳 加古
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Toshiba Corp
Toshiba Lifestyle Products and Services Corp
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Toshiba Consumer Electronics Holdings Corp
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Description

本発明は、被検知物の温度を赤外線にて非接触で検知する温度検知装置及びこれを用いた高周波加熱器に関する。   The present invention relates to a temperature detector that detects the temperature of an object to be detected in a non-contact manner using infrared rays and a high-frequency heater using the same.

従来より、例えば電子レンジやオーブンレンジ等の高周波加熱器においては、被加熱物の温度を赤外線にて非接触で検知する温度検知装置を用いたものが供されている。
図７は、その温度検知装置１を示しており、赤外線センサ２が回路基板３に実装されている。赤外線センサ２は、サーモパイル４を検知素子として有し、これが導電性特には金属製の缶状を成す容器５に収納されている。サーモパイル４から出力される検知信号は微小で、それを増幅しているほどであり、外来ノイズを受けると、影響が出やすい。このため、検知信号出力のためのグランド用導体であるグランド端子６が、容器５特にはこれの底板５ａに挿通固着されて接続されており、かくして、サーモパイル４が導電体（容器５）によりシールドされ、外来ノイズに対して強くなされている。 2. Description of the Related Art Conventionally, high-frequency heaters such as microwave ovens and microwave ovens have been provided with a temperature detection device that detects the temperature of an object to be heated in a non-contact manner using infrared rays.
FIG. 7 shows the temperature detection device 1, and an infrared sensor 2 is mounted on a circuit board 3. The infrared sensor 2 has a thermopile 4 as a detection element, and this is housed in a container 5 that forms a conductive can, particularly a metal can. The detection signal output from the thermopile 4 is very small and is amplified so that it is easily affected by external noise. For this reason, the ground terminal 6 which is a conductor for ground for outputting a detection signal is inserted and fixed to the container 5, particularly the bottom plate 5 a of the container 5, and the thermopile 4 is shielded by the conductor (container 5). It is made strong against external noise.

なお、グランド端子６は回路基板３に挿通されてはんだ７により接続保持されている。又、グランド端子６を含んで赤外線センサ２が接続された回路基板３の回路には、コネクタ８によってハーネス９が接続されている。   The ground terminal 6 is inserted into the circuit board 3 and connected and held by the solder 7. A harness 9 is connected to a circuit of the circuit board 3 including the ground terminal 6 to which the infrared sensor 2 is connected by a connector 8.

そして、図８に示すように、上記赤外線センサ２から回路基板３が、ケース１０に収納されている。このケース１０は導電性これも特には金属製の角箱状を成すものであり、これで赤外線センサ２を囲うことによって、赤外線センサ２（サーモパイル４）が更に外来ノイズに対して強くなるようにしている。   As shown in FIG. 8, the circuit board 3 is housed in the case 10 from the infrared sensor 2. The case 10 is conductive, particularly in the form of a rectangular box made of metal, and by enclosing the infrared sensor 2 with this, the infrared sensor 2 (thermopile 4) is made more resistant to external noise. ing.

但し、赤外線センサ２は、前述のように、ケース１０外の被加熱物の温度を赤外線にて非接触で検知するものであり、このために、ケース１０には、赤外線センサ２、特にこれの容器５の形状に合わせて、円形の窓部１１が設けられている。そして、ケース１０内では、回路基板３が複数のボス部１２にそれぞれ螺挿するねじ１３等によって取付けられており、その取付けによって、赤外線センサ２、特にこれの容器５における赤外線透過部１４が、ケース１０の窓部１１を通してケース１０外に臨むようになっている（例えば特許文献１参照）。
特開平７−１１９９８０号公報 However, as described above, the infrared sensor 2 detects the temperature of the object to be heated outside the case 10 with infrared rays in a non-contact manner. A circular window portion 11 is provided in accordance with the shape of the container 5. In the case 10, the circuit board 3 is attached by screws 13 or the like that are respectively screwed into the plurality of boss parts 12, and by the attachment, the infrared sensor 2, particularly the infrared transmission part 14 in the container 5 thereof, It faces the outside of the case 10 through the window portion 11 of the case 10 (see, for example, Patent Document 1).
Japanese Unexamined Patent Publication No. 7-119980

しかしながら、上記従来のもののケース１０の窓部１１と赤外線センサ２の容器５との間には隙間があり、高周波加熱器に用いた場合に、その隙間から高周波が入って、それによる影響が赤外線センサ２に出やすい。又、回路基板３をケース１０内で取付けることにより、赤外線センサ２の赤外線透過部１４をケース１０の窓部１１を通してケース１０外に臨ませる構造であるため、その取付けの状態如何で赤外線センサ２の検知視野にばらつきが生じやすく、精度の良い温度検知ができにくかった。   However, there is a gap between the window portion 11 of the conventional case 10 and the container 5 of the infrared sensor 2, and when used in a high-frequency heater, a high frequency enters from the gap, and the influence of the gap is infrared. It is easy to come out to the sensor 2. In addition, since the infrared transmission part 14 of the infrared sensor 2 faces the outside of the case 10 through the window part 11 of the case 10 by attaching the circuit board 3 in the case 10, the infrared sensor 2 can be used depending on the state of the attachment. The detection field of view was likely to vary, making it difficult to detect temperature accurately.

そこで、図９に示すように、ケース１０に窓部１５を筒状特には円筒状に形成し、この筒状の窓部１５に赤外線センサ２の容器５を挿入して固定するようにしたものが供されている。   Therefore, as shown in FIG. 9, a window portion 15 is formed in a cylindrical shape, particularly a cylindrical shape, in the case 10, and the container 5 of the infrared sensor 2 is inserted and fixed in the cylindrical window portion 15. Is provided.

しかしながら、このものでは、図１０に示すように、赤外線センサ２から、ハーネス９、ハーネス９を接続する高周波加熱器の制御装置１６、制御装置１６が具えるアース導体１７、アース導体１７を接続する高周波加熱器の筐体１８、筐体１８に取付ける温度検知装置１のケース１０、そして、ケース１０が窓部１５で赤外線センサ２の容器５に接触することによる導通で、閉回路が構成されてしまい、その結果、ハーネス９が長くなるほど、赤外線センサ２が外来ノイズを受けやすくなって、検知信号の出力に影響が出、精度の良い温度検知ができにくいという問題点を有していた。   However, in this case, as shown in FIG. 10, from the infrared sensor 2, the harness 9, the control device 16 for the high-frequency heater that connects the harness 9, the ground conductor 17 that the control device 16 includes, and the ground conductor 17 are connected. A closed circuit is configured by the casing 18 of the high-frequency heater, the case 10 of the temperature detection device 1 attached to the casing 18, and conduction when the case 10 contacts the container 5 of the infrared sensor 2 at the window 15. As a result, as the harness 9 becomes longer, the infrared sensor 2 becomes more susceptible to external noise, which affects the output of the detection signal, and has a problem that it is difficult to perform accurate temperature detection.

本発明は上述の事情に鑑みてなされたものであり、従ってその目的は、外来ノイズに強く、高周波による影響並びに検知視野のばらつきもなくて、更に検知精度を良くできる温度検知装置及びこれを用いた高周波加熱器を提供するにある。   The present invention has been made in view of the above-described circumstances, and therefore the object thereof is to use a temperature detection device that is resistant to external noise, has no influence of high frequency and variation in detection field of view, and can further improve detection accuracy. There was to provide a high frequency heater.

上記目的を達成するために、本発明の温度検知装置においては、被検知物の温度を赤外線にて非接触で検知するものにおいて、検知素子を導電性の容器に収納すると共に、その容器に検知信号出力のためのグランド用導体を接続して構成された赤外線センサと、この赤外線センサを収納する導電性のケースとを具備し、そのケースが窓部を筒状に形成して有し、この窓部に前記赤外線センサの容器を挿入するものであって、前記ケースが、電気絶縁材から成るケース基体に導体のメッキを施して成り、そのメッキをするときに前記窓部にマスキングを施してメッキがされることを避けた部分でもって、前記赤外線センサの容器に接触しつつ、これとの間を電気絶縁する絶縁手段としたことを特徴とする（請求項１の発明）。 In order to achieve the above object, in the temperature detection device of the present invention, the temperature of the object to be detected is detected in a non-contact manner using infrared rays, and the detection element is housed in a conductive container and is detected by the container. An infrared sensor configured by connecting a ground conductor for signal output, and a conductive case for housing the infrared sensor, the case having a cylindrical window portion, The container of the infrared sensor is inserted into a window portion, and the case is formed by plating a conductor on a case base made of an electrically insulating material, and when the plating is performed, the window portion is masked. with the portion to avoid that the plating is, the while in contact with the container of the infrared sensor, characterized in that the insulating means for electrically insulating the this (the invention of claim 1).

又、本発明の高周波加熱器は、被加熱物を収容する加熱室と、この加熱室に高周波を供給して前記被加熱物を加熱する加熱手段と、前記被加熱物の温度を検知する温度検知装置と、この温度検知装置の検知信号の出力に基づいて前記加熱手段を制御する制御装置とを具備し、前記温度検知装置に請求項１記載の温度検知装置を用いたことを特徴とする（請求項２の発明）。 The high-frequency heater according to the present invention includes a heating chamber that houses an object to be heated, a heating unit that supplies high-frequency power to the heating chamber to heat the object to be heated, and a temperature that detects the temperature of the object to be heated. A temperature detection device according to claim 1 is used, comprising: a detection device; and a control device that controls the heating means based on an output of a detection signal of the temperature detection device. (Invention of Claim 2 ).

上記構成の温度検知装置及び高周波加熱器によれば、温度検知装置の検知素子が導電性の容器と導電性のケースとによって外来ノイズに対して強くなされた上に、ケースの筒状の窓部に赤外線センサの容器が挿入されて絶縁手段を介し固定されることで、高周波による影響並びに検知視野のばらつきを生じないようにでき、そして、それらに加え、上記絶縁手段にて、ケースと赤外線センサの容器との導通を絶ち、赤外線センサが外来ノイズを受けにくくできるので、外来ノイズの影響の更に出ない精度の良い温度検知ができる。   According to the temperature detection device and the high-frequency heater having the above-described configuration, the detection element of the temperature detection device is made strong against external noise by the conductive container and the conductive case, and the cylindrical window portion of the case Infrared sensor container is inserted into and fixed through the insulating means, so that the influence of high frequency and the variation in the visual field of detection can be prevented. Since the infrared sensor can be made less susceptible to external noise, the temperature can be detected with high accuracy without further influence of external noise.

以下、本発明の基本構成につき、図１ないし図５を参照して説明する。
まず、図３には、高周波加熱器の一例としてオーブンレンジ２１を示している。このオーブンレンジ２１は、外箱２２を筐体とし、前面に扉２３と操作パネル２４とを有している。扉２３はガラス２５張りであり、操作パネル２４は、表示器特には液晶表示器２６を有すると共に、調理内容選択のための多数のキースイッチ２７、並びに調理時間や調理温度設定のためのダイヤル２８を有している。 The basic configuration of the present invention will be described below with reference to FIGS.
First, FIG. 3 shows a microwave oven 21 as an example of a high-frequency heater. The microwave oven 21 has an outer box 22 as a casing, and has a door 23 and an operation panel 24 on the front surface. The door 23 is covered with glass 25, the operation panel 24 has a display, in particular a liquid crystal display 26, a number of key switches 27 for selecting cooking contents, and a dial 28 for setting cooking time and cooking temperature. have.

次いで、図４には、オーブンレンジ２１の内部構造を示しており、前記外箱２２の内部に配設した内箱２９によって加熱室３０を包囲形成し、この加熱室３０に、前記扉２３を開けて、図示しないで被加熱物ある食品が収容されるようになっている。又、加熱室３０の天井部には、図５に示すオーブンヒータ３１を配設しており、一方、加熱室３０外（外箱２２と内箱２９との間）のうちの上記操作パネル２４の裏側部分は機械室３２であって、この機械室３２に、同じく図５に示すマグネトロン３３や、インバータ３４、並びにマグネトロン３３を冷却するためのファン３５を配設している。マグネトロン３３は高周波発振器であり、前記加熱室３０に高周波を供給して前記食品（被加熱物）を加熱する加熱手段として機能するようになっている。   Next, FIG. 4 shows the internal structure of the microwave oven 21. A heating chamber 30 is surrounded by an inner box 29 arranged inside the outer box 22, and the door 23 is placed in the heating chamber 30. Opened, food to be heated is accommodated (not shown). An oven heater 31 shown in FIG. 5 is disposed on the ceiling of the heating chamber 30. On the other hand, the operation panel 24 outside the heating chamber 30 (between the outer box 22 and the inner box 29). The back side of the machine room 32 is a machine room 32, in which a magnetron 33, an inverter 34, and a fan 35 for cooling the magnetron 33 shown in FIG. The magnetron 33 is a high-frequency oscillator, and functions as a heating means for supplying a high frequency to the heating chamber 30 to heat the food (object to be heated).

ここで、図５には、前記操作パネル２４の裏面に取付けた回路基板３６を示しており、この回路基板３６に、制御手段である制御装置３７を設けている。この制御装置３７は、詳しくは図示しないが、例えばＣＰＵや、ＲＯＭ、ＲＡＭ等のメモリを具えるマイクロコンピュータを主体として構成している。なお、ＲＯＭには、マイクロコンピュータが実行する制御プログラムを格納している。又、制御装置３７には、補正データや使用履歴等を記憶する外部不揮発性記憶手段としてＥＥＰＲＯＭ３８を接続している。   Here, FIG. 5 shows a circuit board 36 attached to the back surface of the operation panel 24, and a control device 37 as a control means is provided on the circuit board 36. Although not shown in detail, the control device 37 is mainly composed of a microcomputer having a memory such as a CPU, a ROM, and a RAM. The ROM stores a control program executed by the microcomputer. The control device 37 is connected with an EEPROM 38 as external nonvolatile storage means for storing correction data, usage history, and the like.

上記制御装置３７には、前記操作パネル２４が有したキースイッチ２７群から各スイッチ信号がスイッチ群インターフェイス３９を介して入力されると共に、ダイヤル２８に応動するエンコーダ４０から応動パルス信号がエンコーダインターフェイス４１を介して入力され、前記食品の温度を検知する温度検知装置４２から検知信号が温度検知装置インターフェイス４３を介して入力されるようにしている。   Each switch signal is input from the key switch 27 group of the operation panel 24 through the switch group interface 39 to the control device 37, and a response pulse signal is transmitted from the encoder 40 that responds to the dial 28 to the encoder interface 41. The detection signal is input via the temperature detection device interface 43 from the temperature detection device 42 that detects the temperature of the food.

そして、それらの入力並びに前記ＲＯＭに格納した制御プログラムに基づいて、制御装置３７は、前記オーブンヒータ３１をヒータ駆動回路４４を介して制御すると共に、前記マグネトロン３３をマグネトロン駆動回路である前記インバータ３４を介して制御するようにしている。そのほか、制御装置３７は、前記ファン３５をファン駆動回路４５を介して制御すると共に、前記操作パネル２４が有した液晶表示器（ＬＣＤ）２６とＬＥＤ群４６及びブザー４７を、それぞれＬＣＤ駆動回路４８、ＬＥＤ群駆動回路４９、ブザー駆動回路５０を介して制御するようにしている。   Based on these inputs and the control program stored in the ROM, the control device 37 controls the oven heater 31 via the heater drive circuit 44 and the inverter 34 which is the magnetron drive circuit. To be controlled through. In addition, the control device 37 controls the fan 35 via the fan drive circuit 45, and the liquid crystal display (LCD) 26, the LED group 46, and the buzzer 47 included in the operation panel 24 are respectively connected to the LCD drive circuit 48. The LED group drive circuit 49 and the buzzer drive circuit 50 are used for control.

前記温度検知装置４２は図４にも示している。すなわち、前記加熱室３０（内箱２９）の図で右側（機械室３２側）の側壁に、開口５２を形成すると共に、この開口５２に臨ませてセンサダクト５３を外側（機械室３２側）に取付けており、そして、そのセンサダクト５３の奥部に、窓部５４を形成すると共に、この窓部５４に臨ませて温度検知装置４２を外側（機械室３２側）に取付けている。従って、温度検知装置３４は、窓部５４からセンサダクト５３及び開口５２を通じて、前記食品の温度を検知するようになっている。   The temperature detector 42 is also shown in FIG. That is, an opening 52 is formed on the right side (machine room 32 side) side wall in the figure of the heating chamber 30 (inner box 29), and the sensor duct 53 is placed outside (machine room 32 side) so as to face this opening 52. In addition, a window 54 is formed in the inner part of the sensor duct 53, and the temperature detection device 42 is attached to the outside (machine room 32 side) so as to face the window 54. Accordingly, the temperature detection device 34 detects the temperature of the food through the sensor duct 53 and the opening 52 from the window portion 54.

上記温度検知装置４２は、基本的には、前記図７ないし図９に示した温度検知装置１と同一のものであり、従って、それと同一の部分には同一の符号を付して説明を省略し、異なる部分についてのみ、以下に述べる。   The temperature detecting device 42 is basically the same as the temperature detecting device 1 shown in FIGS. 7 to 9, and therefore, the same parts are denoted by the same reference numerals and description thereof is omitted. Only the different parts are described below.

すなわち、この温度検知装置４２の前記温度検知装置１と異なる部分は、図１及び図２に示すように、赤外線センサ２から回路基板３を収納したケース５５である。このケース５５は、例えばカーボンを含有した樹脂材料で角箱状に形成しており、導電性を有している。このケース５５には、赤外線センサ２、特にこれの容器５の形状に合わせて、筒状特には円筒状の窓部５６を、前記ケース１０の窓部１５よりも径大に形成しており、回路基板３をケース５５内の複数のボス部１２にそれぞれ螺挿するねじ１３等によって取付けることによって、窓部５６に赤外線センサ２の容器５を挿入している。   That is, the portion of the temperature detection device 42 different from the temperature detection device 1 is a case 55 that houses the circuit board 3 from the infrared sensor 2 as shown in FIGS. The case 55 is formed in a square box shape with a resin material containing carbon, for example, and has conductivity. In this case 55, in accordance with the shape of the infrared sensor 2, in particular, the container 5 thereof, a cylindrical window, in particular, a cylindrical window part 56 is formed larger in diameter than the window part 15 of the case 10, The container 5 of the infrared sensor 2 is inserted into the window portion 56 by attaching the circuit board 3 with screws 13 or the like that are screwed into the plurality of boss portions 12 in the case 55.

そして、窓部５６には、絶縁手段として電気絶縁物のスペーサ５７をあらかじめ装着し、該スペーサ５７が上記赤外線センサ２の容器５との間に介在されるようにしている。従って、スペーサ５７は赤外線センサ２の容器５に接触してそれを固定しつつ、それとの間を電気絶縁するようになっている。
なお、スペーサ５７には、電気絶縁物の中でも、高周波を吸収する材質のものを採用している。 The window 56 is preliminarily fitted with an electrical insulator spacer 57 as an insulating means so that the spacer 57 is interposed between the container 5 of the infrared sensor 2. Therefore, the spacer 57 contacts the container 5 of the infrared sensor 2 and fixes it, and electrically insulates it.
The spacer 57 is made of a material that absorbs high frequency among electrical insulators.

上記構成の温度検知装置４２及びオーブンレンジ（高周波加熱器）２１によれば、検知素子であるサーモパイル４（図７参照）が導電性の容器５でシールドされ、更に、導電性のケース５５によって囲われることで外来ノイズに対して強くなされる。その上に、ケース５５の筒状の窓部５６に赤外線センサ２の容器５が挿入されて電気絶縁物のスペーサ５７を介し固定されることで、高周波による影響並びに検知視野のばらつきを生じないようにできる。   According to the temperature detection device 42 and the microwave oven (high-frequency heater) 21 having the above-described configuration, the thermopile 4 (see FIG. 7) that is a detection element is shielded by the conductive container 5 and further surrounded by the conductive case 55. It is made strong against external noise. In addition, the container 5 of the infrared sensor 2 is inserted into the cylindrical window 56 of the case 55 and fixed through the spacer 57 made of an electrical insulator so that the influence of high frequency and variation in the detection field of view do not occur. Can be.

そして、更にそれらに加え、上記電気絶縁物のスペーサ５７にて、ケース５５と赤外線センサ２の容器５との導通を絶ち、赤外線センサ２からハーネス９、ハーネス９を接続する制御装置３７、制御装置３７が具えるアース導体（図示せず）、アース導体を接続するオーブンレンジの筐体である外箱２２、外箱２２に取付ける温度検知装置４２のケース５５、そして、ケース５５の窓部５６から赤外線センサ２の容器５への閉回路が構成されることが避けられ、ハーネス９を通じて赤外線センサ２が外来ノイズを受けやすくなることがなくなるので、外来ノイズの影響の更に出ない精度の良い温度検知ができる。   Further, in addition to them, the electrical insulation spacer 57 cuts off the electrical connection between the case 55 and the container 5 of the infrared sensor 2 and connects the harness 9 and the harness 9 from the infrared sensor 2. A ground conductor (not shown) 37, an outer box 22 that is a casing of a microwave oven to which the ground conductor is connected, a case 55 of a temperature detection device 42 attached to the outer box 22, and a window portion 56 of the case 55. Since the closed circuit to the container 5 of the infrared sensor 2 is avoided and the infrared sensor 2 is not easily exposed to external noise through the harness 9, it is possible to detect the temperature accurately with no influence of the external noise. Can do.

以上に対して、図６は本発明の一実施例を示すもので、上記基本構成と同一の部分に同一の符号を付して説明を省略し、異なる部分についてのみ述べる。
このものの場合、第１実施例のケース５５に代わるケース６１が、ＡＢＳ樹脂等の電気絶縁材から成るケース基体６１ａにクロム等の金属の導体のメッキ６１ｂを施して成り、そのメッキをするときに第１実施例の窓部５６に代わる窓部６２にマスキングを施してメッキがされることを避けた部分６３でもって、第１実施例のスペーサ５７に代わる絶縁手段としている。 In contrast, FIG. 6 shows an embodiment of the present invention. The same reference numerals are given to the same parts as those in the above basic configuration, and the description thereof will be omitted. Only different parts will be described.
In this case, the case 61, which replaces the case 55 of the first embodiment, is formed by plating the case base 61a made of an electrical insulating material such as ABS resin with a metal conductor 61b such as chromium, and when plating is performed. A portion 63 that avoids plating by masking the window portion 62 in place of the window portion 56 in the first embodiment serves as an insulating means in place of the spacer 57 in the first embodiment.

このようにしても、ケース６１と赤外線センサ２の容器５との接触固定をしつつ、それらの導通を絶ち得るから、第１実施例同様に、高周波による影響並びに検知視野のばらつきを生じないようにできつつ、ハーネス９を通じての外来ノイズの影響の更に出ない精度の良い温度検知ができる。   Even if it does in this way, since the connection between the case 61 and the container 5 of the infrared sensor 2 can be cut off, the conduction between them can be cut off, so that the influence of the high frequency and the variation in the detection visual field do not occur as in the first embodiment. In addition, it is possible to detect the temperature with high accuracy without the influence of external noise through the harness 9.

このほか、本発明は上記し且つ図面に示した実施例にのみ限定されるものではなく、例えば高周波加熱器としては、オーブンレンジ以外に、電子レンジであっても良いなど、要旨を逸脱しない範囲内で適宜変更して実施し得る。   In addition, the present invention is not limited to the embodiments described above and shown in the drawings. For example, the high-frequency heater may be a microwave oven other than the microwave oven, and does not depart from the spirit of the invention. May be implemented with appropriate changes.

本発明の基本構成を示す主要部分の縦断側面図The longitudinal side view of the principal part which shows the basic composition of this invention 主要部分の正面図Front view of main parts オーブンレンジの外観斜視図External perspective view of microwave oven オーブンレンジの縦断面図Microwave oven vertical section 電気的構成のブロック図Electrical configuration block diagram 本発明の一実施例を示す図１相当図FIG. 1 equivalent view showing an embodiment of the present invention 従来例を示す主要部分の側面図Side view of main parts showing a conventional example 異なる従来例を示す図１相当図1 equivalent diagram showing a different conventional example 更に異なる従来例を示す図１相当図FIG. 1 equivalent diagram showing a further different conventional example. 主要部分と他の部分との接続状況を示すブロック図Block diagram showing the connection between the main part and other parts

符号の説明Explanation of symbols

図面中、２は赤外線センサ、４はサーモパイル（検知素子）、５は容器、６はグランド端子（グランド用導体）、２１はオーブンレンジ（高周波加熱器）、３０は加熱室、３３はマグネトロン（加熱手段）、３７は制御装置、４２は温度検知装置、５５はケース、５６は窓部、５７は電気絶縁物のスペーサ（絶縁手段）、６１はケース、６１ａはケース基体、６１ｂはメッキ、６２は窓部、６３はメッキがされることを避けた部分（絶縁手段）を示す。   In the drawings, 2 is an infrared sensor, 4 is a thermopile (detecting element), 5 is a container, 6 is a ground terminal (conductor for grounding), 21 is a microwave oven (high frequency heater), 30 is a heating chamber, and 33 is a magnetron (heating) Means), 37 is a control device, 42 is a temperature detection device, 55 is a case, 56 is a window portion, 57 is a spacer (insulating means) of an electrical insulator, 61 is a case, 61a is a case base, 61b is plating, 62 is A window portion 63 indicates a portion (insulating means) that is avoided from being plated.

Claims (2)

被検知物の温度を赤外線にて非接触で検知するものにおいて、
検知素子を導電性の容器に収納すると共に、その容器に検知信号出力のためのグランド用導体を接続して構成された赤外線センサと、
この赤外線センサを収納する導電性のケースとを具備し、
そのケースが窓部を筒状に形成して有し、この窓部に前記赤外線センサの容器を挿入するものであって、
前記ケースが、電気絶縁材から成るケース基体に導体のメッキを施して成り、そのメッキをするときに前記窓部にマスキングを施してメッキがされることを避けた部分でもって、前記赤外線センサの容器に接触しつつ、これとの間を電気絶縁する絶縁手段としたことを特徴とする温度検知装置。 In what detects the temperature of the object to be detected by infrared rays without contact,
An infrared sensor configured by storing a detection element in a conductive container and connecting a ground conductor for detection signal output to the container;
A conductive case for housing the infrared sensor;
The case has a cylindrical window portion, and the infrared sensor container is inserted into the window portion,
The case is made by plating a conductor on a case base made of an electrical insulating material, and masking the window portion when the plating is performed to avoid plating . A temperature detecting device characterized in that it is an insulating means that electrically insulates the container while contacting the container. 被加熱物を収容する加熱室と、
この加熱室に高周波を供給して前記被加熱物を加熱する加熱手段と、
前記被加熱物の温度を検知する温度検知装置と、
この温度検知装置の検知信号の出力に基づいて前記加熱手段を制御する制御装置とを具備し、
前記温度検知装置に請求項１記載の温度検知装置を用いたことを特徴とする高周波加熱器。 A heating chamber for storing an object to be heated;
Heating means for heating the object to be heated by supplying a high frequency to the heating chamber;
A temperature detection device for detecting the temperature of the object to be heated;
A control device for controlling the heating means based on the output of the detection signal of the temperature detection device,
A high-frequency heater using the temperature detection device according to claim 1 as the temperature detection device .
JP2005211331A 2005-07-21 2005-07-21 Temperature detector and high frequency heater Expired - Fee Related JP4664763B2 (en)

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