CN101668991B - Heat detecting device, cooking apparatus using the same - Google Patents
Heat detecting device, cooking apparatus using the same Download PDFInfo
- Publication number
- CN101668991B CN101668991B CN2007800529297A CN200780052929A CN101668991B CN 101668991 B CN101668991 B CN 101668991B CN 2007800529297 A CN2007800529297 A CN 2007800529297A CN 200780052929 A CN200780052929 A CN 200780052929A CN 101668991 B CN101668991 B CN 101668991B
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- heat
- thermal source
- temperature sensor
- detecting unit
- transmission member
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C7/00—Stoves or ranges heated by electric energy
- F24C7/08—Arrangement or mounting of control or safety devices
- F24C7/087—Arrangement or mounting of control or safety devices of electric circuits regulating heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C15/00—Details
- F24C15/10—Tops, e.g. hot plates; Rings
- F24C15/102—Tops, e.g. hot plates; Rings electrically heated
- F24C15/105—Constructive details concerning the regulation of the temperature
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C15/00—Details
- F24C15/10—Tops, e.g. hot plates; Rings
- F24C15/102—Tops, e.g. hot plates; Rings electrically heated
- F24C15/106—Tops, e.g. hot plates; Rings electrically heated electric circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C15/00—Details
- F24C15/10—Tops, e.g. hot plates; Rings
- F24C15/108—Mounting of hot plate on worktop
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C7/00—Stoves or ranges heated by electric energy
- F24C7/08—Arrangement or mounting of control or safety devices
- F24C7/082—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination
- F24C7/083—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination on tops, hot plates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/0252—Domestic applications
- H05B1/0258—For cooking
- H05B1/0261—For cooking of food
- H05B1/0266—Cooktops
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/12—Cooking devices
- H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
- H05B2213/07—Heating plates with temperature control means
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Electric Stoves And Ranges (AREA)
- Baking, Grill, Roasting (AREA)
- Induction Heating Cooking Devices (AREA)
Abstract
A heat detecting device and a cooking apparatus using the same, in which the operation of a heating unit is appropriately controlled according to the presence or absence and/or type of cooking container (e.g., pan or pot) on the cooking apparatus. When there is no cooking container on the cooking apparatus, the duty cycle of the heat source is reduced, thereby preventing unnecessary operation of the heat source. Accordingly, power consumption is reduced. On the other hand, when there is a cooking container on the cooking appliance, the duty cycle of the heat source is increased, thereby making faster more efficient cooking possible.
Description
Technical field
Embodiment described herein relates to the temperature-detecting device of a kind of detection heat of transmission from the outside, and a kind of cooking equipment, and said cooking equipment is controlled the thermal source that uses said temperature-detecting device.
Background technology
Cooking equipment is the utensil of heating and cooking food.Especially, cooktop surface is to use the utensil that comes cooking food through the heating placement heat that cooking container produced onboard.Cooktop surface also is called as hot plate or grate.In recent years, the use of cooktop surface increases.
The cooktop surface of prior art generally includes a plurality of heating units that are positioned at the plate below.It is overheated to prevent that temperature-adjusting device is arranged in the heating unit.Temperature-adjusting device detects the heat that is produced by heating unit and is switched with connection/shutoff heating unit in predetermined temperature.In this way, temperature-adjusting device is regulated the temperature of plate.
But in this cooktop surface, temperature-adjusting device is configured to mechanically work in predetermined temperature.Therefore, the temperature of plate does not have suitably to be regulated as the function that applies load (that is, having or do not exist the type of cooking container or cooking container) onboard.In other words, thermal source is configured to predetermined duty cycle work, and no matter how whether have load and load types.Duty cycle recently defines and is expressed as T turn-on time by the unit of thermal source
On/ (T
On+ T
Off), wherein, T
OnAnd T
OffTurn-on time and the turn-off time of representing thermal source respectively.In addition, thermostatic heat sensitivity is mechanically worked because of it and is reduced.
Summary of the invention
Technical problem
Except other, the cooking equipment that illustrative embodiments described herein provides heat detecting device and used this heat detecting device wherein, can suitably be controlled the work of heating unit according to the load on the plate.
Technical scheme
In an illustrative embodiments, the heat detecting device that is used for cooking apparatus comprises the transmission member of detecting unit, support unit and heat.Said detecting unit comprises: can be in response to the temperature sensor of the variation of the heat that produces by thermal source, and said temperature sensor is arranged so that the heat that is produced by said thermal source directly is passed to said temperature sensor.Said support unit is configured for said detecting unit is supported on predetermined height place.Said transmission member contacts to transfer heat to said temperature sensor with said detecting unit.Said detecting unit further comprises substrate, and said temperature sensor is printed on the basal surface of said substrate.Said support unit comprises: the bottom; The middle part, said middle part extends upward predetermined height from an end of bottom; And the top, extend from the middle part along the direction identical with the bottom at said top, and at least a portion of said detecting unit is installed on the top of said support unit.
According to another illustrative embodiments, cooking equipment comprises: heating unit, and it comprises shell, is arranged on insulator and thermal source in the said shell; Be positioned at the plate of said thermal source top, said plate is configured for receiving cooking container; And heat detecting device, it is connected to said heating unit to detect the heat relevant with said thermal source.Said heat detecting device comprises: hot detecting unit; It has can be in response to the temperature sensor of the variation of the heat that is produced by said thermal source, and said temperature sensor is arranged so that the heat that is produced by said thermal source directly is passed to said temperature sensor from said thermal source; And support unit, it is configured for said hot detecting unit is supported on predetermined height place.The said hot detecting unit of said support unit supports and said heat detecting device is connected to said heating unit.Said hot detecting unit comprises substrate, and said temperature sensor is printed on the basal surface of said substrate.Said support unit comprises: the bottom; The middle part, said middle part extends upward predetermined height from an end of bottom; And the top, extend from the middle part along the direction identical with the bottom at said top, and at least a portion of said detecting unit is installed on the top of said support unit.
According to another illustrative embodiments, cooking equipment comprises thermal source, cooking surface and control module.Said cooking equipment further comprises: the device that is used to detect first heat that is produced by said thermal source; Be used to detect the device of second heat that produces by said cooking surface; And the device that is used for controlling said thermal source based on detected said first heat and said second heat.
According to another illustrative embodiments, a kind of method of controlling cooking apparatus, said cooking apparatus comprises thermal source, cooking surface and control module.Said method comprises: detect first heat that is produced by said thermal source; Second heat that detection is produced by said cooking surface; And control said thermal source based on detected said first heat and said second heat.
Beneficial effect
In the described herein embodiment, can detect the temperature of heating unit or plate delicately with the mode of electricity.
Can come the suitably work of control heating unit according to the load on the plate.
Description of drawings
Can more completely understand embodiment from detailed description below in conjunction with accompanying drawing.
Fig. 1 is the exploded perspective view that illustrates first embodiment of the cooking equipment that has ceramic wafer.
Fig. 2 is the stereogram after the assembling of heating unit and heat detecting device.
Fig. 3 is the partial sectional view of cooking equipment shown in Figure 1.
Fig. 4 is the stereogram of heat detecting device shown in Figure 2.
Fig. 5 is the exploded perspective view of heat detecting device shown in Figure 4.
Fig. 6 is the upward view of the embodiment of diagram heat detecting device shown in Figure 4.
Fig. 7 is shown in the partial sectional view that the heat under the state that does not have cooking container on the cooking equipment is transmitted.
Fig. 8 is shown in the partial sectional view that the heat under the state that has cooking container on the cooking equipment is transmitted.
Fig. 9 is the partial sectional view of another illustrative embodiments of diagram detecting unit.
The specific embodiment
Below will be according to the cooking equipment of describing heat detecting device in detail and using this heat detecting device with reference to the illustrative embodiments of accompanying drawing.
With reference to figure 1, Fig. 2 and Fig. 3, cooking equipment 1 comprises main body 2 and ceramic wafer 3.Main body 2 is held at least one heating unit 10, and ceramic wafer 3 is arranged on main body 2 tops.
Main body 2 limits the outward appearance of cooking equipment 1.Power supply 4, control module 8 and at least one heating unit 10 are arranged on main body 2 inside.
In Fig. 3, on ceramic wafer 3, there is cooking container 9.Control panel 5 and display unit 6 are arranged on the front upper surface of ceramic wafer 3 (referring to Fig. 1).Control panel 5 is used to control the culinary art work of cooking equipment 1, and display unit 6 shows the duty of heating cooking apparatus 1.
The work of cooking equipment 1 below will briefly be described.When with cooking equipment 1 cooking food, the cooking container 9 that will hold food is placed on the ceramic wafer 3 and starts the work of cooking equipment 1.When cooking equipment 1 was started working, heating unit 10 was started working.Some heat that produced by heating unit 10 directly are passed to cooking container 9, and some heat is passed to cooking container 9 through ceramic wafer 3.Food in the cooking container 9 is cooked by the heat of transmitting by this way thereupon.
During cooking, heat detecting device 20 detections from the heat of thermal source 130, wherein, utilize control module 8 suitably to operate thermal source 130 according to the information signal that is produced by heat detecting device 20 at least.
Below will describe the structure of heat detecting device 20 in detail.With reference to figure 4 to Fig. 6, for each heating unit 10 is provided with heat detecting device 20.As shown in Figure 2, heat detecting device 20 can be connected to a side of heating unit 10.
With reference now to Fig. 5 and Fig. 6,, detecting unit 210 comprises the substrate 211 that is formed by pottery or other insulating materials.Substrate 211 has top surface 211a and basal surface 211b.Temperature sensor 212 is arranged on the end of the basal surface 211b of substrate 211.
When temperature-detecting device 20 was connected to heating unit 10, temperature sensor 212 was exposed to heating unit 10.In at least one illustrative embodiments, temperature sensor 212 is relative with thermal source 130.That is, temperature sensor 212 is arranged to make it to face thermal source 130.But in other embodiments, temperature sensor 212 is exposed to thermal source 130 and does not face thermal source 130.Under any situation, when thermal source 130 work, by all direct radiation to the temperature sensor 212 of the heat of thermal source 130 generations.In other words, temperature sensor 212 directly detects the heat from thermal source 130 radiation.Therefore, temperature sensor 212 can detect the heat that is produced by thermal source 130 more accurately, and the control module 8 that comprises aforementioned microprocessor can be confirmed temperature more accurately and and then control the work of thermal source 130.
Pair of terminal 216 is arranged on the basal surface 211b of for example substrate 211.Terminal 216 is electrically connected to control module 8.Terminal 216 is electrically connected by pair of conductors 214 with temperature sensor 212.Although other structure also is possible, in this illustrative embodiments, terminal 216, conductor 214 and temperature sensor 212 all are arranged on the basal surface 211b of detecting unit 210.Conductor 214 can be by forming with the same or analogous material of the material of temperature sensor 212.
As shown in Figure 5, support unit 220 can for example comprise: bottom 222; Middle part 224, an end of 222 extends upward predetermined height from the bottom for it; And top 226, it 224 extends from the middle part along the direction identical with bottom 222.
More specifically, in this illustrative embodiments, the bottom 222 of support unit 220 is connected to the basal surface of heating unit 10.In addition, in bottom 222, be formed with at least one connecting hole 223, the connecting elements (not shown) passes said connecting hole 223.
The width at the top 226 of support unit 220 equals the width of detecting unit 210 basically, makes at least a portion of detecting unit 210 be installed on the top 226 of support unit 220.
With reference now to Fig. 7 and Fig. 8,, in this illustrative embodiments, the top surface of transmission member 230 contacts with the basal surface of ceramic wafer 3.Transmission member 230 is arranged on the detecting unit 210 will be passed to detecting unit 210 from the heat of ceramic wafer 3.Therefore, detecting unit 210 directly detects the heat that is produced by thermal source 130, and through the heat of transmission member 230 indirect detection from ceramic wafer 3.Transmission member 230 can be formed by the material with high-termal conductivity, aluminium for example, but be not limited to aluminium.
The heat that transmission member 230 is passed to detecting unit 210 of passing through from ceramic wafer 3 changes according to the load that is applied to ceramic wafer 3.Therefore, the temperature that is drawn by microprocessor changes according to load.Because temperature changes based on the heat of transmitting from ceramic wafer 3, so through considering that whether the load that is applied to ceramic wafer 3 exists, and can suitably control the work of heating unit 10 at least in part.
The control procedure that below will whether how to influence thermal source to the existence of load and load is elaborated.At this,, there is not the load that is applied to ceramic wafer 3 when cooking container 9 is not in 3 last times of ceramic wafer.When cooking container 9 is in 3 last times of ceramic wafer, then there is the load that is applied to ceramic wafer 3.The variation of load means that there have been variation in the type of cooking container 9 or the food in kind or the cooking container 9.
For example shown in Figure 5, transmission member 230 has the width that equals detecting unit 210 width basically and comprises and cover 232 and couplings.Lid 232 covers the part of the top surface of detecting unit 210, and couplings 234 is connected to support unit 220 with transmission member 230.
The thickness of couplings 234 can be greater than the thickness of lid 232.Therefore, when transmission member 230 is connected to when coupling alar part 227, couplings 234 is around the top 226 of detecting unit 210 and support unit 220.In this illustrative embodiments, detecting unit 210 can not move forward or backward, and can not move to the left or to the right.
Couple alar part 227 and have the hole of coupling 228, and couplings 234 also has the hole of coupling 235.Coupler member 240 is inserted and is coupled in hole 228 and 235 so that transmission member 230 is connected to supporting member 220.
When thermal source 130 work, the temperature sensor 212 of heat detecting device 20 is based on thermal output resistance value (that is the signal of telecommunication of the resistance value that, reflection and temperature sensor 212 are relevant).Then, the microprocessor in the control module 8 uses predetermined circuit to confirm temperature value based on the variation of this resistance value or resistance value.
When temperature reached first fiducial temperature, control module 8 turn-offed thermal source 130.After this, the temperature of being confirmed by microprocessor reduces.When the temperature of being confirmed by microprocessor reaches second fiducial temperature that is lower than first fiducial temperature, connect thermal source 130 once more.At thermal source 130 duration of works, control module 8 is based on constantly turning on and off thermal source 130 by this way by heat detecting device 20 detected heats and the temperature that draws thus.In this illustrative embodiments, the work of thermal source 130 is controlled such that by microprocessor and remains in the scope between first fiducial temperature and second fiducial temperature based on the temperature that heat detecting device 20 detected heat draw.Should be appreciated that duty cycle can be relatively large value when turn-on time of thermal source 130 is long, and when turn-on time of thermal source 130 in short-term, duty cycle can be less relatively.
In Fig. 7 and Fig. 8, indicate by arrow from thermal source 130 and the heat that ceramic wafer 3 transmits, wherein, big arrow is represented relatively large heat output, and wherein, small arrow is represented less relatively heat output.More specifically with reference to figure 7, when thermal source 130 was not having cooking container 9 to be in to work under the situation on the ceramic wafer 3, some heat 31 that produced by thermal source 130 directly were passed to ceramic wafer 3, and some heat 32 directly are passed to temperature sensor 212.In addition, some heat 41 that are passed to ceramic wafer 3 are passed to heating unit or thermal source, and some heat 42 are transmitted from temperature sensor 212.As stated, the heat 42 that is passed to temperature sensor 212 from ceramic wafer 3 is transmitted through transmission member 230.
Therefore, when cooking container 9 not in 3 last times of ceramic wafer, ceramic wafer 3 keeps the heat 31 transmitted from thermal source 130, and transmits heat 41 and 42 to transmission member 230 and heating unit 10.In other words, the most of heat that is passed to ceramic wafer 3 is passed to temperature sensor 212 or heating unit 10.Therefore, when connecting thermal source 130, rise rapidly and reach first fiducial temperature based on the temperature that is drawn by heat detecting device 20 detected heat.When temperature rises rapidly, shorter relatively based on reaching the needed time quantum of first fiducial temperature by the determined temperature of heat detecting device 20 detected heats by microprocessor.This means that the turn-on time of thermal source 130 is shorter relatively.
When the temperature of being confirmed by microprocessor reaches first fiducial temperature, turn-off thermal source 130.When turn-offing thermal source 130, temperature slowly descends till it reaches second fiducial temperature.The reason that temperature slowly descends is to continue to be fed to heat detecting device 20 because of the heat from ceramic wafer 3.When temperature slowly descended, it is longer relatively that temperature reaches the needed time quantum of second fiducial temperature.The turn-off time that this means thermal source 130 is longer relatively.
When detected temperature reaches second fiducial temperature, connect thermal source 130 once more and make the determined temperature of microprocessor reach first fiducial temperature rapidly.Thus, because the turn-on time of thermal source 130 is relatively short the turn-off time longer relatively, so the duty cycle of thermal source 130 (that is, unit turn-on time than) reduces.When cooking container 9 not in 3 last times of ceramic wafer, this duty cycle that reduces minimizes the working time of thermal source 130, thereby reduces unnecessary power consumption.
The cooking container of mentioning in the above 9 is not under the situation on the ceramic wafer 3, and control module 8 control thermals source 130 make the duty cycle of thermal source 130 reduce.And will it is obvious that, when thermal source 130 during with identical power work, the duty cycle that can saidly reduce is kept the work of thermal source 130.
With reference now to Fig. 8,, when thermal source 130 when cooking container 9 is in 3 last times of ceramic wafer work, some heat 31 that produced by thermal source 130 directly are passed to ceramic wafer 3, and some heat 32 directly are passed to temperature sensor 212.On the other hand, a spot of hot 44 are passed to temperature sensor 212 from ceramic wafer 3, and the heat 43 of relatively large amount is passed to cooking container 9.With do not have the status of cooking container on the ceramic wafer 3 and compare; Be passed to cooking container 9 because be passed to most of heat of ceramic wafer 3 from thermal source 130; So, by microprocessor based on slowly rising towards first fiducial temperature by the determined temperature of heat detecting device 20 detected heats.
When temperature slowly rose, it was longer relatively to reach the needed time quantum of first fiducial temperature by the definite temperature of microprocessor.The turn-on time that this means thermal source 130 is longer relatively.
When reaching first fiducial temperature, turn-off thermal source 130 by the temperature that microprocessor detected.After this, temperature descends towards second fiducial temperature relatively quickly.When temperature descended relatively quickly, it was shorter relatively to reach the needed time quantum of second fiducial temperature by the determined temperature of microprocessor.The turn-off time that this means thermal source 130 is shorter relatively.When reaching second fiducial temperature, connect thermal source 130 and make temperature rise relatively lentamente towards first fiducial temperature once more by the determined temperature of microprocessor.
Because the turn-on time of thermal source 130 is relatively long its turn-off time shorter relatively, so the duty cycle of thermal source 130 (that is, unit turn-on time than) is relatively large in this case.The increase that is in the duty cycle of ceramic wafer 3 last time thermal source 130 when cooking container 9 has reflected such fact: promptly, the heat that is produced by thermal source 130 is passed to cooking container 9 continuously and effectively.Therefore, can cook at a high speed.Thereby under this situation, thermal source 130 is controlled such that when cooking container 9 is in ceramic wafer 3 last time duty cycle and increases.
In the aforementioned exemplary embodiment, heat, and then be temperature is to use heat detecting device 20 to detect with the mode of electricity.In addition, temperature is not only the heat that produces based on by thermal source 130, but also confirm based on the heat of sending by ceramic wafer 3.Therefore, can use the high power thermal source and also can be more fast with cooking food effectively.
On the contrary, mechanically detect at the serviceability temperature adjuster under the situation of temperature of thermal source, the duty cycle of thermal source is kept consistently, no matter and whether have cooking container.Under this situation, when using the high power thermal source and only considering the internal temperature of heating unit, thermoregulator is turn-offed ahead of time makes duty cycle reduce.In this case, the heat that is produced by the high power thermal source effectively is not passed to cooking container.
But; Equally, in above-mentioned illustrative embodiments, when the mode with electricity detect heat and therefore detected temperatures and detection and consideration be applied to ceramic wafer cooking container (promptly; Load) time; The most heat that is produced by the high power thermal source is passed to cooking container, and therefore, the temperature of being confirmed by microprocessor slowly rises.Therefore, can be as using the low-power thermal source to control and keep the duty cycle of thermal source, culinary art becomes possibility thereby make at a high speed.
Fig. 9 is the partial sectional view of second illustrative embodiments of the hot detecting unit of diagram.As shown in the figure, detecting unit 310 comprises temperature sensor 312, conductor 314 and terminal 316.In the following description, identical reference number is used in reference to for the identical parts of having described.More specifically, ceramic guard member 318 is arranged on conductor 314 belows.
In addition, guard member 318 prevents that any between support unit 220 and the conductor 314 is electrically connected unintentionally, and support unit 220 is formed by metal with conductor 314 boths.
In above-mentioned illustrative embodiments, temperature sensor directly detects the heat of transmitting from thermal source, thereby can confirm temperature more accurately.In addition, owing to be passed to detecting unit from the heat of ceramic wafer through transmission member, temperature sensor can also detect the heat from ceramic wafer except can detecting the heat that is produced by thermal source.Therefore, can control the duty cycle of thermal source adaptively based on the load that is applied to ceramic wafer (that is cooking container).When not having load on the ceramic wafer, reduce the duty cycle of thermal source, thereby prevent the work that thermal source is unnecessary.Therefore, reduced power consumption.When having load on the ceramic wafer, increase the duty cycle of thermal source, culinary art becomes possibility thereby make at a high speed.And, can use the high power thermal source, this also helps culinary art at a high speed.
Although invention has been described with reference to a plurality of illustrative embodiments, should be appreciated that many other modifications are in the spirit and scope that can expect and belong to disclosure principle.More specifically, the assembly of the subject combination setting in the scope of the disclosure, accompanying drawing and accompanying claims and/or be provided with in can carry out variations and modifications.Except assembly and/or variation in being provided with and the modification, to those skilled in the art, substituting use also is conspicuous.Industrial applicibility
The work of heating unit can come suitably control according to the load on the plate.Therefore, the embodiment of temperature-detecting device and heating cooking apparatus has high industrial applicibility.
Claims (11)
1. heat detecting device that is used for cooking apparatus, said device comprises:
Detecting unit, it has can be in response to the temperature sensor of the variation of the heat that is produced by thermal source, and said temperature sensor is arranged so that the heat that is produced by said thermal source directly is passed to said temperature sensor;
Support unit, it is configured for said detecting unit is supported on predetermined height place, and
The transmission member of heat, said transmission member contact with said detecting unit transferring heat to said temperature sensor,
Wherein said detecting unit further comprises substrate, and said temperature sensor is printed on the basal surface of said substrate, and
Said support unit comprises: the bottom; The middle part, said middle part extends upward predetermined height from an end of bottom; And the top, extend from the middle part along the direction identical with the bottom at said top, and at least a portion of said detecting unit is installed on the top of said support unit.
2. heat detecting device as claimed in claim 1, wherein, said detecting unit further comprises:
Pair of terminal, this is arranged on the basal surface of said substrate to terminal; And
Pair of conductors, this is electrically connected said temperature sensor and said terminal to conductor, and this becomes and will be passed to this to terminal from said temperature sensor with the relevant information of heat that is produced by said thermal source conductor configuration.
3. heat detecting device as claimed in claim 2, wherein, said detecting unit further comprises:
Guard member, said guard member are arranged to make it to protect said conductor not receive the influence by the heat of said thermal source generation.
4. heat detecting device as claimed in claim 1, wherein, first side of said detecting unit is to said thermal source, and wherein, said transmission member is connected to second side opposite with said first side of said detecting unit.
5. heat detecting device as claimed in claim 4, wherein, said transmission member and said detecting unit are configured such that heat is through said transmission member indirect transfer to said temperature sensor.
6. cooking equipment comprises:
Heating unit, it comprises shell, is arranged on insulator and thermal source in the said shell;
Be positioned at the plate of said thermal source top, said plate is configured for receiving cooking container; And
Heat detecting device, it is connected to said heating unit with the detection heat relevant with said thermal source,
Wherein said heat detecting device comprises:
Hot detecting unit, it has can be in response to the temperature sensor of the variation of the heat that is produced by said thermal source, and said temperature sensor is arranged so that the heat that is produced by said thermal source directly is passed to said temperature sensor from said thermal source; And
Support unit, it is configured for said hot detecting unit is supported on predetermined height place,
The said hot detecting unit of wherein said support unit supports and said heat detecting device is connected to said heating unit,
Said hot detecting unit comprises substrate, and said temperature sensor is printed on the basal surface of said substrate, and
Said support unit comprises: the bottom; The middle part, said middle part extends upward predetermined height from an end of bottom; And the top, extend from the middle part along the direction identical with the bottom at said top, and at least a portion of said detecting unit is installed on the top of said support unit.
7. cooking equipment as claimed in claim 6 further comprises the transmission member that contacts with said hot detecting unit, and said transmission member is configured for transferring heat to the temperature sensor of said hot detecting unit.
8. cooking equipment as claimed in claim 7, wherein, said transmission member contacts with said plate, and wherein, said transmission member and said hot detecting unit be configured such that heat through said transmission member from said plate indirect transfer said temperature sensor extremely.
9. cooking equipment as claimed in claim 6 further comprises:
The control module that is used for said thermal source, wherein, the information relevant with heat is sent to said control module from said temperature sensor.
10. cooking equipment as claimed in claim 9, wherein, said control module comprises:
Processor, wherein said processor are configured to confirm temperature based on the said information relevant with heat that is sent to said control module from said temperature sensor.
11. cooking equipment as claimed in claim 10, wherein, said information is based on the heat that directly is passed to said temperature sensor from said thermal source and based on passing through the heat of transmission member from said plate indirect transfer to said temperature sensor.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2007-0030174 | 2007-03-28 | ||
| KR1020070030173A KR101388718B1 (en) | 2007-03-28 | 2007-03-28 | Heating apparatus and temperature sensing appratus thereof |
| KR1020070030174A KR101261647B1 (en) | 2007-03-28 | 2007-03-28 | Control method of heating apparatus |
| KR1020070030173 | 2007-03-28 | ||
| KR10-2007-0030173 | 2007-03-28 | ||
| KR1020070030174 | 2007-03-28 | ||
| PCT/KR2007/004163 WO2008117909A1 (en) | 2007-03-28 | 2007-08-29 | Heat detecting device, cooking apparatus using the same and a method of controoling the cooking apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101668991A CN101668991A (en) | 2010-03-10 |
| CN101668991B true CN101668991B (en) | 2012-09-05 |
Family
ID=39788633
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800529297A Expired - Fee Related CN101668991B (en) | 2007-03-28 | 2007-08-29 | Heat detecting device, cooking apparatus using the same |
| CN2007800529193A Expired - Fee Related CN101668990B (en) | 2007-03-28 | 2007-08-29 | Methods for controlling heating cooking apparatus |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800529193A Expired - Fee Related CN101668990B (en) | 2007-03-28 | 2007-08-29 | Methods for controlling heating cooking apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7968824B2 (en) |
| EP (1) | EP2137462B1 (en) |
| KR (1) | KR101261647B1 (en) |
| CN (2) | CN101668991B (en) |
| ES (1) | ES2569211T3 (en) |
| WO (1) | WO2008117910A1 (en) |
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| US10788220B2 (en) * | 2018-07-13 | 2020-09-29 | Haier Us Appliance Solutions, Inc. | Determining cookware location on a cooktop appliance based on temperature response |
| USD883015S1 (en) | 2018-08-09 | 2020-05-05 | Sharkninja Operating Llc | Food preparation device and parts thereof |
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- 2007-03-28 KR KR1020070030174A patent/KR101261647B1/en active IP Right Grant
- 2007-08-29 WO PCT/KR2007/004164 patent/WO2008117910A1/en active Application Filing
- 2007-08-29 CN CN2007800529297A patent/CN101668991B/en not_active Expired - Fee Related
- 2007-08-29 EP EP07793746.4A patent/EP2137462B1/en not_active Not-in-force
- 2007-08-29 CN CN2007800529193A patent/CN101668990B/en not_active Expired - Fee Related
- 2007-08-29 ES ES07793746.4T patent/ES2569211T3/en active Active
- 2007-09-19 US US11/902,198 patent/US7968824B2/en not_active Expired - Fee Related
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| CN1364990A (en) * | 2000-12-22 | 2002-08-21 | 埃莫森电器公司 | Controller for heater in range and its operation method |
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| CN2823852Y (en) * | 2005-08-22 | 2006-10-04 | 山东九阳小家电有限公司 | Temp-sensing temp-testing structure for electromagnetic oven |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080237215A1 (en) | 2008-10-02 |
| EP2137462A4 (en) | 2011-03-23 |
| CN101668990B (en) | 2011-09-28 |
| WO2008117910A1 (en) | 2008-10-02 |
| CN101668990A (en) | 2010-03-10 |
| US7968824B2 (en) | 2011-06-28 |
| CN101668991A (en) | 2010-03-10 |
| ES2569211T3 (en) | 2016-05-09 |
| KR20080087961A (en) | 2008-10-02 |
| EP2137462A1 (en) | 2009-12-30 |
| EP2137462B1 (en) | 2016-04-13 |
| KR101261647B1 (en) | 2013-05-06 |
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