JP4649412B2 - 基板表面をパターニングする方法 - Google Patents
基板表面をパターニングする方法 Download PDFInfo
- Publication number
- JP4649412B2 JP4649412B2 JP2006530986A JP2006530986A JP4649412B2 JP 4649412 B2 JP4649412 B2 JP 4649412B2 JP 2006530986 A JP2006530986 A JP 2006530986A JP 2006530986 A JP2006530986 A JP 2006530986A JP 4649412 B2 JP4649412 B2 JP 4649412B2
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- JP
- Japan
- Prior art keywords
- substrate
- ink
- elastomeric stamp
- barrier layer
- stamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims description 52
- 238000000059 patterning Methods 0.000 title claims description 26
- 230000004888 barrier function Effects 0.000 claims abstract description 29
- 239000002904 solvent Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 31
- 239000002094 self assembled monolayer Substances 0.000 abstract description 13
- 239000013545 self-assembled monolayer Substances 0.000 abstract description 13
- 238000001035 drying Methods 0.000 abstract description 9
- 239000000976 ink Substances 0.000 description 73
- 239000004205 dimethyl polysiloxane Substances 0.000 description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000002209 hydrophobic effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000013536 elastomeric material Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 150000003573 thiols Chemical class 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical class CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 1
- GWOLZNVIRIHJHB-UHFFFAOYSA-N 11-mercaptoundecanoic acid Chemical compound OC(=O)CCCCCCCCCCS GWOLZNVIRIHJHB-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QJAOYSPHSNGHNC-UHFFFAOYSA-N octadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCCCS QJAOYSPHSNGHNC-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000010399 physical interaction Effects 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
- B05D1/283—Transferring monomolecular layers or solutions of molecules adapted for forming monomolecular layers from carrying elements
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
Description
Claims (3)
- インクを用いて基板の表面にパターニングする方法であって、
バルク表面と前記バルク表面から突起する少なくとも1つの形状を有するエラストマー・スタンプを提供する工程であって、前記突起形状が接触表面と前記接触表面から前記バルク表面に延在する端部を有し、前記突起形状と前記バルク表面が、当該方法の所要時間において前記インクが前記エラストマー・スタンプに浸透することを防止するバリア層を保持する工程と、
前記バリア層に前記インクと溶媒の溶液を適用する工程と、
前記バリア層から前記溶媒を除去する工程と、
前記バリア層より前記インクに対して高い親和性を有する表面を第1基板に提供する工程と、
前記突起形状の前記接触表面を前記第1基板の前記表面と接触させる工程と、
前記突起形状の前記接触表面から前記第1基板の前記表面に前記インクを転写する工程と、
前記第1基板の前記表面から前記エラストマー・スタンプを取り外す工程と、
前記バリア層より前記インクに対し高い親和性を有する表面を第2基板に提供する工程と、
前記突起形状の前記接触表面を前記第2基板の前記表面と接触させる工程と、
前記突起形状の前記端部から前記第2基板の前記表面に前記インクを転写することによって前記第2基板の前記表面にインク・パターンを提供する工程とを備える方法。 - さらに、前記第2基板の前記表面の、前記インク・パターンによって画定された部分を除去する工程を備える、請求項1に記載の方法。
- 前記第2基板の前記表面の前記部分の前記除去工程がエッチング工程を備える、請求項2に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0323902.7A GB0323902D0 (en) | 2003-10-11 | 2003-10-11 | Method for patterning a substrate surface |
PCT/IB2004/052009 WO2005035438A1 (en) | 2003-10-11 | 2004-10-07 | Method for patterning a substrate surface |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007508453A JP2007508453A (ja) | 2007-04-05 |
JP4649412B2 true JP4649412B2 (ja) | 2011-03-09 |
Family
ID=29433771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006530986A Active JP4649412B2 (ja) | 2003-10-11 | 2004-10-07 | 基板表面をパターニングする方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US8714082B2 (ja) |
EP (1) | EP1675802B1 (ja) |
JP (1) | JP4649412B2 (ja) |
KR (1) | KR101098317B1 (ja) |
CN (1) | CN1863729B (ja) |
AT (1) | ATE407098T1 (ja) |
DE (1) | DE602004016360D1 (ja) |
GB (1) | GB0323902D0 (ja) |
TW (1) | TWI362687B (ja) |
WO (1) | WO2005035438A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0323903D0 (en) * | 2003-10-11 | 2003-11-12 | Koninkl Philips Electronics Nv | Elastomeric stamp,patterning method using such a stamp and method for producing such a stamp |
US7632087B2 (en) * | 2003-12-19 | 2009-12-15 | Wd Media, Inc. | Composite stamper for imprint lithography |
KR100784827B1 (ko) * | 2006-12-29 | 2007-12-14 | 한국기계연구원 | 적층 탄성체를 이용한 스템프와 웨이퍼의 균일접촉 임프린팅 장치 |
US8274494B2 (en) | 2008-02-28 | 2012-09-25 | 3M Innovative Properties Company | Touch screen sensor having varying sheet resistance |
EP2257969B1 (en) | 2008-02-28 | 2017-12-20 | 3M Innovative Properties Company | Methods of patterning a conductor on a substrate |
EP2260367A4 (en) | 2008-02-28 | 2014-05-14 | 3M Innovative Properties Co | TOUCH SCREEN SENSOR WITH LADDERS OF LIGHT VISIBILITY |
US8284332B2 (en) | 2008-08-01 | 2012-10-09 | 3M Innovative Properties Company | Touch screen sensor with low visibility conductors |
CN107272978B (zh) | 2008-02-28 | 2020-09-15 | 3M创新有限公司 | 触屏传感器 |
KR20100046778A (ko) * | 2008-10-28 | 2010-05-07 | 삼성전자주식회사 | 프린트용 몰드, 그의 제조 방법 및 이를 이용한 박막 패턴 형성 방법 |
JP6128847B2 (ja) * | 2009-06-25 | 2017-05-17 | スリーエム イノベイティブ プロパティズ カンパニー | 自己組織化単層パターン化基材の湿式エッチング方法、及び金属パターン化物品 |
JP2011054683A (ja) * | 2009-08-31 | 2011-03-17 | Asahi Kasei E-Materials Corp | 金属配線基板の製造方法、及び金属配線基板 |
JP5224203B1 (ja) | 2012-07-11 | 2013-07-03 | 大日本印刷株式会社 | タッチパネルセンサ、タッチパネル装置および表示装置 |
CN107175939B (zh) * | 2016-03-09 | 2020-02-28 | 华邦电子股份有限公司 | 用于印刷线路制程的印章及其制造方法以及印刷线路制程 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002085639A1 (en) * | 2001-04-25 | 2002-10-31 | The Trustees Of Columbia University In The City Of New York | Edge transfer lithography |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6048623A (en) | 1996-12-18 | 2000-04-11 | Kimberly-Clark Worldwide, Inc. | Method of contact printing on gold coated films |
US6517995B1 (en) * | 1999-09-14 | 2003-02-11 | Massachusetts Institute Of Technology | Fabrication of finely featured devices by liquid embossing |
US6380101B1 (en) | 2000-04-18 | 2002-04-30 | International Business Machines Corporation | Method of forming patterned indium zinc oxide and indium tin oxide films via microcontact printing and uses thereof |
US7476523B2 (en) * | 2000-08-14 | 2009-01-13 | Surface Logix, Inc. | Method of patterning a surface using a deformable stamp |
US6596346B2 (en) * | 2000-09-29 | 2003-07-22 | International Business Machines Corporation | Silicone elastomer stamp with hydrophilic surfaces and method of making same |
GB0105145D0 (en) * | 2001-03-02 | 2001-04-18 | Koninkl Philips Electronics Nv | Thin film transistors and method of manufacture |
US7338613B2 (en) * | 2001-09-10 | 2008-03-04 | Surface Logix, Inc. | System and process for automated microcontact printing |
US6860956B2 (en) * | 2003-05-23 | 2005-03-01 | Agency For Science, Technology & Research | Methods of creating patterns on substrates and articles of manufacture resulting therefrom |
-
2003
- 2003-10-11 GB GBGB0323902.7A patent/GB0323902D0/en not_active Ceased
-
2004
- 2004-10-07 WO PCT/IB2004/052009 patent/WO2005035438A1/en active IP Right Grant
- 2004-10-07 DE DE602004016360T patent/DE602004016360D1/de active Active
- 2004-10-07 JP JP2006530986A patent/JP4649412B2/ja active Active
- 2004-10-07 US US10/575,437 patent/US8714082B2/en active Active
- 2004-10-07 AT AT04770195T patent/ATE407098T1/de not_active IP Right Cessation
- 2004-10-07 KR KR1020067006964A patent/KR101098317B1/ko active IP Right Grant
- 2004-10-07 CN CN2004800295784A patent/CN1863729B/zh active Active
- 2004-10-07 EP EP04770195A patent/EP1675802B1/en active Active
- 2004-10-08 TW TW093130627A patent/TWI362687B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002085639A1 (en) * | 2001-04-25 | 2002-10-31 | The Trustees Of Columbia University In The City Of New York | Edge transfer lithography |
Also Published As
Publication number | Publication date |
---|---|
CN1863729A (zh) | 2006-11-15 |
KR20060126953A (ko) | 2006-12-11 |
TWI362687B (en) | 2012-04-21 |
WO2005035438A1 (en) | 2005-04-21 |
US20070125255A1 (en) | 2007-06-07 |
JP2007508453A (ja) | 2007-04-05 |
US8714082B2 (en) | 2014-05-06 |
KR101098317B1 (ko) | 2011-12-26 |
EP1675802B1 (en) | 2008-09-03 |
GB0323902D0 (en) | 2003-11-12 |
EP1675802A1 (en) | 2006-07-05 |
CN1863729B (zh) | 2010-06-16 |
ATE407098T1 (de) | 2008-09-15 |
TW200524000A (en) | 2005-07-16 |
DE602004016360D1 (de) | 2008-10-16 |
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