JP4640576B2 - Resistance element mounting sheet, manufacturing method thereof, and manufacturing method of multilayer wiring board with built-in resistance using resistance element mounting sheet - Google Patents

Description

  The present invention relates to a resistance element mounting sheet, a manufacturing method thereof, and a manufacturing method of a resistance built-in multilayer wiring board using the resistance element mounting sheet.

  In recent years, with the development of electronic devices, demands for miniaturization and weight reduction in addition to high performance of electronic components have become increasingly severe. In particular, in portable wireless electronic devices typified by mobile phones, the demand is remarkable from the pursuit of convenience. Against this background, in order to efficiently mount semiconductor chips and passive elements, there has been a shift from insert-type mounted components to surface-mounted components. Furthermore, as represented by ultra-small chip components and chip size packages, surface mount components have been downsized. At the same time, the wiring line width of the printed wiring board to be mounted has been reduced and the wiring density of the build-up board has been increased. On the other hand, the number of passive components such as resistance elements and capacitor elements is increasing due to the progress of high-performance devices. From such a background, the space on the surface of the wiring board has become insufficient, and a technique for incorporating passive components in the printed wiring board is required. In addition, since these passive components must be individually mounted on the printed circuit board one by one, there is an increase in the component mounting time per wiring board, and there is a method that can mount passive components all at once. It has been demanded.

  As a method of incorporating a resistance element in a printed circuit board, a method of forming a nickel-phosphorus thin film between predetermined wirings by an electroless plating method has been developed. As another method, a metal foil having a two-layer structure consisting of a copper foil serving as a wiring layer and a nickel phosphorus thin film layer serving as a resistance layer is bonded to an insulating substrate by pressing, and a wiring and a resistance portion are produced by a selective etching method. The method (for example, refer nonpatent literature 1) to do is put into practical use.

  As another resistance element forming method, for example, as shown in Non-Patent Document 2, a method of forming a conductive paste such as a carbon-containing resin by printing between predetermined wirings by a printing method and thermosetting, for example, As shown in Patent Document 1, there is a method for manufacturing a multilayer wiring board including a thin film resistance element made of chromium, silicon, and oxygen.

JP-A-5-347357 “Thin Film Embedded Resistors in HDI Applications”, IPC's First International Conference on Embedded Passives, P.M. 199-201. “A New Material System for High Precision Embedded Polymer Resistor”, IPC's First International Conference on Embedded Passives, P.A. 192-195. “System Considation in Production Environment for Laser Trimming of Embedded Passive Components”, IPC's First International Conference on EmbeddedPed. 192-195.

  The allowable error value of the resistance value of these resistance elements varies depending on the application, but usually about 0.5 to 10% is required. Therefore, trimming is performed by forming a resistor on the inner or outer layer of the wiring board and monitoring the resistance value of the resistance element using a probe while cutting a part of the resistance element with a laser to adjust the resistance value to a predetermined specification. Need to do. A conventional trimming method is disclosed in Non-Patent Document 3, for example. A probe card using a plurality of L-type probe pins attached to the outer frame as shown in FIG. 1 is manufactured, and the probe is brought into contact with the wiring to which the resistance element is connected, and the resistance value is monitored. Trimming is performed, and when the target value is reached, the laser output is stopped. In such a conventional method, the laser is irradiated from the surface where the resistance element to be trimmed with the laser is installed, and therefore it is necessary to design the probe pin and jig so as not to block the optical path of the laser. It was difficult to increase the installation density and absolute number of resistance elements. In addition, because the size of the outer frame is limited, not only is it difficult to increase the area of the substrate, but it is also necessary to trim the entire large substrate while moving the jig step by step. There was a problem of being extremely bad.

  The present invention provides a highly resistive resistive element mounting sheet with high accuracy in resistance value formed on and in a printed wiring board, capable of installing a large number of resistive elements, and capable of accommodating a large area substrate, and its manufacture. And a method of manufacturing a resistance built-in multilayer wiring board using a resistance element mounting sheet.

In order to solve the above problems, the present invention is configured as follows.
(1) A step of forming a plurality of sets of conductive pads 3 isolated on the surface of the sheet-like insulating support substrate 1 and a sheet-like resistance element 2 connected to the conductive pads 3, A trimming step of adjusting a resistance value of the resistance element 2 to a target value by removing a part of the resistance element 2 by laser irradiation while measuring the resistance value of the resistance element 2 by bringing the resistance measurement probe 20 into contact with each of them. In the manufacturing method of the resistive element mounting sheet including
Including a step of providing an opening 7 leading to the conductive pad 3 in the sheet-like insulating support substrate 1 from the side opposite to the surface of the sheet-like insulating support substrate 1 on which the resistance element 2 is formed, and the trimming step includes A resistance element mounting sheet, wherein the resistance value of the resistance element 2 is measured by bringing the resistance measurement probe 20 into contact with the conductive pad 3 through the opening 7 and the resistance value of the resistance element 2 is adjusted to a target value. Manufacturing method.
(2) The manufacturing method of the resistive element mounting sheet according to item (1), wherein the thickness of the sheet-like insulating support substrate 1 is from 10 micrometers to 500 micrometers.
(3) The method for producing a resistive element mounting sheet according to item (1) or (2), wherein the sheet-like insulating support substrate 1 is one of a glass epoxy substrate, a glass polyimide substrate, a polyimide film substrate, and an epoxy film substrate. .
(4) A step of providing an opening 7 that leads to the conductive pad 3 in the sheet-like insulating support substrate 1 from the opposite side of the surface of the sheet-like insulating support substrate 1 on which the resistance element 2 is formed by the resistance measurement probe 20. And the trimming step measures the resistance value of the resistance element 2 by bringing the resistance measurement probe 20 into contact with the conductive pad 3 through the opening 7 and adjusts the resistance value of the resistance element 2 to a target value. The manufacturing method of the resistive element mounting sheet | seat of the term (2) or (3) characterized.
(5) The resistance element mounting sheet manufacturing method according to item (4), wherein the resistance measuring probe 20 is a resistance measuring probe 20 having a sharp tip.
(6 ) A resistance element mounting sheet manufactured by the method for manufacturing a resistance element mounting sheet according to any one of items (1) to ( 5 ).
( 7 ) A method of manufacturing a resistance-incorporating multilayer wiring board including a laminating step in which the resistance element mounting sheet 22 according to item ( 6 ) and an inner core substrate on which a predetermined circuit is formed on an insulating layer are integrated by a laminating press.

  A trimming step for adjusting a resistance value to a predetermined value by measuring resistance using a probe from a surface side on which a resistance element is not formed on the sheet-like insulating support substrate in the method of manufacturing a resistance element mounting sheet Can be efficiently performed, the accuracy of the resistance value is high, a large number of resistance elements can be installed, and it can be applied to a large-area substrate, so that productivity is high. Furthermore, by producing a multilayer wiring board using a resistance element mounting sheet produced by such a method, it becomes possible to produce a resistance built-in wiring board that incorporates a resistance element having an accurate resistance value. Can be achieved.

  The 1st form of the manufacturing method of the resistive element mounting sheet | seat of this invention is demonstrated using FIGS. First, as shown in FIG. 1, a plurality of resistance elements 2 and two or more conductive pads (conductive circuits) 3 and 4 connected to each resistance element 2 are provided on a sheet-like insulating support substrate 1. A plurality of sets are formed. Each conductive pad (conductive circuit) 3 and 4 connected to the resistance element 2 includes measurement terminal portions 5 and 6, respectively, and the sheet-like insulating support substrate 1 reaches the measurement terminal portion 5. Are preferably provided with openings 7 and 8 respectively. A resistor element mounting sheet 22 before trimming is prepared. The plurality of sets of conductive pads 3 are electrically isolated from each other, and the resistance elements 2 are connected to one conductive pad 3 respectively.

The sheet-like insulating support substrate 1 has a function of holding the mounted resistance element 2 and conductive pad (conductive circuit) 3, and the thickness is preferably 10 to 500 micrometers. It is necessary that necessary and sufficient insulation is ensured, and the volume resistivity is preferably 1 × 10 ⁶ ohm · cm or more. The material of the insulating support substrate 1 is preferably, for example, a glass epoxy substrate, a glass polyimide substrate, a polyimide film substrate, an epoxy film substrate or the like that is usually used as a wiring board material. The conductive pads (conductive circuits) 3 and 4 are circuits made of a conductive material and have a conductivity of 10 ⁶ S / m or more. As an example of a preferable material, copper, aluminum, nickel, silver, gold and the like and alloys containing them are used. Further, a conductive circuit 9 that is not connected to any of the resistance elements 2 may be arranged as necessary. The resistive element 2 is preferably designed to have a sheet resistance value of 5Ω to 1MΩ and a film thickness in the range of 0.01 to 50 micrometers. As an example, it is preferable to be made of a material such as a nickel / phosphorus thin film, ceramic, resin containing conductive particles such as carbon or silver. As an example of the resin containing conductive particles, Resistive Paste TU-00-8, TU-15-8, TU-50-8, or TU-100-8 manufactured by Asahi Chemical Research Co., Ltd. can be used.

  In the resistance element mounting sheet manufacturing method of the present invention, the trimming process is performed by bringing the resistance measurement probe 20 into contact with the conductive pad 3 from the opposite side of the surface of the sheet-like insulating support substrate 1 on which the resistance element 2 is formed. The resistance value of the element 2 is measured, and the resistance value of the resistance element 2 is adjusted to a target value. Accordingly, it is only necessary that a part or all of the conductive pad 3 is exposed from the opposite side of the surface of the sheet-like insulating support substrate 1 on which the resistance element 2 is formed.

  The sheet-like insulating support substrate 1 reaches the measurement terminal portion 5 of the conductive pad (conductive circuit) 3 from the side opposite to the surface of the sheet-like insulating support substrate 1 on which the resistance element 2 is formed. Are preferably provided with openings 7 and 8 respectively. The method for forming the opening 7 is not particularly limited as long as a hole can be formed in the insulating support substrate 1 made of an insulating resin, and examples thereof include a laser method and a wet etching method. The opening 7 may be provided after the resistance element 2 and the conductive pad (conductive circuit) 3 are formed on the sheet-like insulating support substrate 1, or the opening 7 and the sheet-like insulating support substrate 1 may be provided in advance. A hole to be formed may be formed, and then the resistance element 2 and the conductive pad (conductive circuit) 3 may be formed. In this case, a metal foil may be affixed to the sheet-like insulating support substrate 1 provided with the openings 7 as a conductor material to be the conductive pad (conductive circuit) 3.

  Alternatively, the opening 7 may be formed by piercing the insulating support substrate 1 with the resistance measurement probe 20 having a sharp tip. In that case, the opening 7 may be formed in advance by the resistance measuring probe 20 having a sharp tip, or the opening 7 is formed, and at the same time, resistance measurement is performed on the measurement terminal portion 5 of the conductive pad (conductive circuit) 3. Trimming may be performed by contacting the probe 20 and measuring the resistance value of the resistance element 2.

  FIG. 2 shows an example of an embodiment of a jig for laser trimming the resistance element 2 of the resistance element mounting sheet 22 before trimming prepared as described above. The jig includes a probe card 10, a pressing plate 11, guide pins 12 of the pressing plate 11, and a stopper 13 of the pressing plate 11. In the probe card 10, a resistance measurement probe (probe pin) 20 for measuring resistance is vertically attached to the probe board 17, and a multichannel resistance is connected via a cable 21 attached to the resistance measurement probe (probe pin) 20. Connected to a measuring instrument. The probe board 17 is attached to a support plate 19 via a spacer 18, and the cable 21 can be disposed between the spacer 18 and the support plate 19.

  Such a structure makes it possible to arrange the resistance measurement probes (probe pins) 20 with high density. The pressing plate 11 is for fixing the trimming target resistance element mounting sheet 22. As an example of a desirable configuration of the suitable pressing plate 11, a two-layer configuration of a soft cushion layer 15 placed on the side in contact with the resistance element mounting sheet 22 and a rigid hard support layer 14 may be used. The cushion layer can be made of rubber, silicon rubber or the like, preferably having a thickness of 0.05 mm to 3 mm, and the support layer 14 is preferably made of metal or plastic board, and preferably has a thickness of 1 mm. The range is 50 mm. By adopting such a configuration, the resistance element mounting sheet 22 to be trimmed can be firmly held and can be reliably applied to the resistance measurement probe (probe pin) 20. Further, the pressing plate 11 is provided with an opening 16 for allowing a laser for subsequent trimming to pass therethrough.

  Next, as shown in FIG. 3, the resistance element mounting sheet 22 to be trimmed is mounted on the probe card 10. At that time, the resistance measurement probe (probe pin) 20 is disposed so as to contact the measurement terminal portion 6, and the resistance element mounting sheet 22 is disposed in accordance with the resistance measurement probe (probe pin) 20.

  Next, as shown in FIG. 4, the stopper of the pressing plate 11 is removed, and the resistance element mounting sheet 22 to be trimmed is pressed by the pressing plate 11. At this time, it is desirable to attach a nut or the like to the spacer guide pin to hold down the holding plate 11 or to have a separate pressurizing mechanism. The jig 24 assembled in this way is mounted at a predetermined position on the XY table 25 and fixed. Next, a so-called trimming process is performed in which a part of the resistance element 2 is removed while monitoring the resistance value of each resistance element 2, the resistance value is increased, and laser processing is stopped when the target resistance value is reached. At this time, the laser 26 is an F-theta lens from the direction opposite to the measurement terminal portion 5 of the conductive pad (conductive circuit) 3 of the target resistive element mounting sheet 22 from the direction in which the resistive element 2 is installed. 31 is used for irradiation. The laser position can be irradiated to a predetermined position at high speed by a galvano mirror 27 provided on the optical path of the XY table 25 and the laser 26. The resistance measurement of each resistance element 2 can be switched at high speed in conjunction with the trimming process.

  By performing trimming using such a configuration, the resistance value of the resistance element 2 can be measured from the opposite surface of the mounting surface of the resistance element 2. Therefore, efficient trimming can be performed without the optical path of the laser 26 being obstructed by the resistance measurement probe 20.

  A second embodiment of the method for producing the resistance element mounting sheet 22 of the present invention will be described. A plurality of resistance elements 2 and two or more conductive pads (conductive circuit) connected to each of the resistance elements 2 on the sheet-like insulating support substrate 1 shown in FIG. A plurality of sets 3 and 4 are formed, and each of the conductive pads (conductive circuit) 3 and 4 connected to the resistance element 2 includes the corresponding measurement terminal portions 5 and 6. 2 is prepared, and is provided with a pre-trimming resistive element mounting sheet 22 that is not provided with openings 7 and 8, and is fixed to a jig shown in FIG. The resistance measurement probe 20 is pushed in from the opposite side of the surface of the conductive support substrate 1 to provide an opening 7 leading to the conductive pad 3 in the sheet-like insulating support substrate 1, and the resistance measurement probe 20 is made conductive through this opening 7. Touch pad 3 Measurement of the resistance value of the resistance element 2, and adjusts the resistance value of the resistance element 2 to the target value.

The 3rd form of the manufacturing method of the resistive element mounting sheet | seat 22 of this invention is demonstrated using FIG. In the third form, the form of the target resistive element mounting sheet 22 is different from that in the first form. That is, in addition to the configuration shown in FIG. 1, conductive lead portions 28 and 29 made of a conductive material are provided at a part of the openings 7 and 8 of the insulating support substrate 1 provided adjacent to the resistance measuring portions 5 and 6. I have. The conductive leads 28 and 29 are electrically connected to the resistance measuring units 5 and 6 of the conductive pad 3. This conductive material preferably has a conductivity of 10 ⁶ S / m or more. Examples of such materials include metals or alloys composed of copper, silver, aluminum, nickel, silver, gold, and the like, and hardened resin containing conductive particles such as silver, or copper plating. There is a conductive material. Trimming can take the same method as in the first embodiment, but the resistance measurement probe 20 is applied to the resistance measurement portions on the surfaces of the conductive leads 28 and 29. By adopting such a configuration, even when the thick sheet-like insulating support substrate 1 is used, the resistance measuring probe 20 can be reliably brought into contact. Further, the strength of the conductive pads 3 and 4 of the measurement terminal portions 5 and 6 is supplemented by the conductive lead portions 28 and 29, and damage such as cracks and pinholes in the wiring portion caused by the resistance measurement probe 20 is measured during resistance measurement. There is also an effect to prevent. The conductive lead portion 28 may be further extended to the surface opposite to the surface of the sheet-like insulating support substrate 1 on which the resistance element 2 is formed. In this case, the resistance value may be measured by placing the resistance measurement probe (probe pin) 20 on the surface of the conductive lead portion 28 on the opposite surface side. In these embodiments, the example in which the resistance element 2 is arranged on one side of the sheet-like insulating support substrate 1 is shown, but it may be arranged on both sides as well. In that case, trimming is performed separately for each side.

EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.
Example 1
As the sheet-like insulating support substrate 1, a polyimide bonding sheet having a thickness of 0.07 mm, in which a polyimide adhesive was applied to both surfaces of the polyimide film, was produced. Further, an opening 7 having a diameter of 0.2 mm for communicating with the conductive pad 3 was formed by laser processing. Next, after bonding a copper foil having a thickness of 0.018 mm (trade name: SLP-18, manufactured by Nippon Electrolytic Co., Ltd.), necessary wirings and conductive pads 3 were formed by a normal etching method. Next, using a resistance paste TU-00-8 (trade name, manufactured by Asahi Chemical Laboratory Co., Ltd.), a sheet-like resistance element 2 was formed by screen printing at a predetermined position so as to be connected to the conductive pad 3. Then, using a conveyor type far-infrared curing furnace (Asahi Chemical Laboratory, trade name: ASAHI TRON FIR-1800), pre-heating temperature 180 ° C., 80 seconds and main heating temperature 250 ° C., 10 seconds, A resistive element mounting sheet 22 before trimming was obtained.

  The resistance element mounting sheet 22 before trimming is subjected to resistance measurement on the conductive pad 3 of the sheet-like insulating support substrate 1 through the opening 7 from the opposite side of the resistance element 2 mounting surface with the laser trimming apparatus having the configuration of FIG. While the resistance value of the resistance element 2 was measured by applying the probe 20, the resistance element 2 was cut by laser irradiation and adjusted to a predetermined resistance value (target value). By moving the XY table and using the galvanometer mirror 27 in the optical path of the laser 26, the laser 26 can be applied to a predetermined position at high speed. In this case, the dimension of the resistance element mounting sheet 22 is 410 mm × 510 mm, the resistance element 2 is 1200 pieces, the predetermined resistance value (target value) is 100Ω, and the time required for the trimming process is 900 seconds. .

  Next, this resistor mounting sheet 22 and a predetermined inner layer substrate, prepreg, and copper foil were laminated and laminated using a hot plate press. Next, through holes and blind via holes were formed at predetermined positions, and an outer layer pattern was formed by a tenting method. A solder resist was formed at a predetermined position by a photolithography method, and a multilayer wiring board with a built-in resistor was produced.

( Reference Example 1 )
As the sheet-like insulating support substrate 1, a polyimide bonding sheet having a thickness of 0.07 mm, in which a polyimide adhesive was applied to both surfaces of the polyimide film, was produced. Further, an opening 7 having a diameter of 0.2 mm for communicating with the conductive pad 3 was formed by laser processing. Next, after bonding a 0.018 mm thick copper foil (trade name: SLP-18 manufactured by Nippon Electrolytic Co., Ltd.), conductive paste MP-200V (manufactured by Hitachi Chemical Co., Ltd., product) Name) was filled and cured at 160 ° C. for 30 minutes to form a conductive lead portion 28 that was electrically connected to the conductive pad 3. Further, necessary wiring and conductive pads 3 were formed on the copper foil by a normal etching method. Next, using a resistance paste TU-00-8 (trade name, manufactured by Asahi Chemical Laboratory Co., Ltd.), a sheet-like resistance element 2 was formed by screen printing at a predetermined position so as to be connected to the conductive pad 3. Then, using a conveyor type far-infrared curing furnace (Asahi Chemical Laboratory, trade name: ASAHI TRON FIR-1800), pre-heating temperature 180 ° C., 80 seconds and main heating temperature 250 ° C., 10 seconds, A resistive element mounting sheet 22 before trimming was obtained.

  A resistance trimming probe 20 is applied to the conductive lead portion 28 formed in the opening 7 from the opposite side of the resistance element 2 mounting surface by using the laser trimming apparatus configured as shown in FIG. While measuring the resistance value of the element 2, the resistance element 2 was cut by laser irradiation and adjusted to a predetermined resistance value (target value). By moving the XY table and using the galvanometer mirror 27 in the optical path of the laser 26, the laser 26 can be applied to a predetermined position at high speed. In this case, the dimension of the resistance element mounting sheet 22 is 410 mm × 510 mm, the resistance element 2 is 1200 pieces, the predetermined resistance value (target value) is 100Ω, and the time required for the trimming process is 900 seconds. .

  Next, this resistor mounting sheet 22 and a predetermined inner layer substrate, prepreg, and copper foil were laminated and laminated using a hot plate press. Next, through holes and blind via holes were formed at predetermined positions, and an outer layer pattern was formed by a tenting method. A solder resist was formed at a predetermined position by a photolithography method, and a multilayer wiring board with a built-in resistor was produced.

(Comparative Example 1)
As the sheet-like insulating support substrate 1, a polyimide bonding sheet having a thickness of 0.07 mm, in which a polyimide adhesive was applied to both surfaces of the polyimide film, was produced. Next, after bonding a copper foil having a thickness of 0.018 mm (trade name: SLP-18, manufactured by Nippon Electrolytic Co., Ltd.), necessary wirings and conductive pads 3 were formed by a normal etching method. Next, using a resistance paste TU-00-8 (trade name, manufactured by Asahi Chemical Laboratory Co., Ltd.), a sheet-like resistance element 2 was formed by screen printing at a predetermined position so as to be connected to the conductive pad 3. Then, using a conveyor type far-infrared curing furnace (Asahi Chemical Laboratory, trade name: ASAHI TRON FIR-1800), pre-heating temperature 180 ° C., 80 seconds and main heating temperature 250 ° C., 10 seconds, A resistive element mounting sheet 22 before trimming was obtained.

In Comparative Example 1, the resistor element mounting sheet 22 before trimming was trimmed using a conventional laser trimming apparatus. 6 and 7 show a plan view of a conventional laser trimming apparatus used in Comparative Example 1 and a cross-sectional view of an appropriate portion thereof. An opening is provided at the center of the probe card 34, and the resistance element mounting sheet 33 and the resistance element 36 disposed in the opening are trimmed. At that time, the resistance value is monitored using a resistance measurement probe 35 attached to the probe card 34 on a set of conductive pads 33 connected to the resistance element 36. As shown in FIG. 7, the resistance measurement probe 35 comes into contact with the mounting surface of the resistance element 36. Since the resistance measurement probe 35 has a structure extending planarly toward the opening of the probe card 34, the number of the resistance measurement probes 35 that can be arranged is smaller than that of the method of the present invention. Also, there is a limit to the size of the probe card, and when processing the resistance element 36 ′ beyond the range of the opening, the resistance measurement probe 35 is once separated from the substrate and then moved by the XY table 41. Again, it is necessary to bring the resistance measurement probe 35 into contact. Also, a resistive element mounting sheet is configured by repeating arrangements of parts having the same pattern (hereinafter referred to as “parts”), and the size of the part is to be trimmed. However, it is necessary to prepare a plurality of probe cards when exceeding the range that can be contacted by one resistance measurement probe 35. In the first comparative example, the resistance element 2 is measured by laser irradiation 40 while measuring the resistance value of the resistance element 36 by applying the resistance measurement probe 35 to the conductive pad 33 of the resistance element mounting sheet 33 from the mounting surface of the resistance element 36. Was adjusted to a predetermined resistance value (target value). In this case, the dimensions of the resistance element mounting sheet 22 and the number and arrangement of the resistance elements 36 are the same as those in the first embodiment and the reference example 1 . In this case, it was necessary to process using three probe cards, and the total time required for the trimming process was 5000 seconds including the replacement and adjustment time of the resistance measurement probe 35.

  Next, this resistor mounting sheet 22 and a predetermined inner layer substrate, prepreg, and copper foil were laminated and laminated using a hot plate press. Next, through holes and blind via holes were formed at predetermined positions, and an outer layer pattern was formed by a tenting method. A solder resist was formed at a predetermined position by a photolithography method, and a multilayer wiring board with a built-in resistor was produced.

In Example 1, Reference Example 1 and Comparative Example 1, while the same number and arrangement of the resistive elements, the time required for the trimming process in Example 1 and Reference Example 1 is both 900 seconds, In Comparative Example 1, the time required for the trimming process was 5000 seconds in total. In Comparative Example 1, it was necessary to prepare a plurality of probes, and time required for their replacement and adjustment was also required. Therefore, it can be seen that the trimming process can be efficiently performed by the present invention.

Sectional drawing of the resistive element mounting sheet | seat of this invention. Sectional drawing of the jig | tool for carrying out laser trimming of the resistance element of a resistance element mounting sheet | seat. Sectional drawing of the jig | tool for laser trimming with a resistive element mounting sheet | seat. Sectional drawing which shows the process of the manufacturing method of the resistive element mounting sheet | seat of this invention. Sectional drawing of the resistive element mounting sheet | seat of this invention. The top view explaining the trimming method of the conventional resistance element. Sectional drawing explaining the trimming method of the conventional resistance element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sheet-like insulating support substrate 2 Resistance element 3 Conductive pad 4 Conductive pad 5 Measurement terminal part 6 Measurement terminal part 7 Opening part 8 Opening part 9 Conductive circuit 10 Probe card 11 Holding plate 12 Guide pin 13 Stopper 14 Support layer DESCRIPTION OF SYMBOLS 15 Cushion layer 16 Opening part 17 Probe board 18 Spacer 19 Support plate 20 Resistance measurement probe 21 Cable 22 Resistance element mounting sheet 24 Jig 25 XY table 26 Laser 27 Galvano mirror 28 Conductive lead part 29 Conductive lead part 31 Ftheta lens 33 Conductive Pad 34 Resistance element mounting sheet 35 Resistance measurement probe 36 Resistance element 37 Probe pad 38 Wiring 39 Connector connection terminal 41 connected to resistance measuring instrument XY table

Claims (7)

Forming a plurality of conductive pads (3) isolated on the surface of the sheet-like insulating support substrate (1) and a sheet-like resistance element (2) connected to the conductive pads (3); A part of the resistance element (2) is removed by laser irradiation while a resistance measurement probe (20) is brought into contact with each of the conductive pads (3) to measure the resistance value of the resistance element (2). In the method of manufacturing a resistive element mounting sheet including a trimming step of adjusting the resistance value of (2) to a target value,
An opening (7) leading to the conductive pad (3) is provided in the sheet-like insulating support substrate (1) from the opposite side of the surface of the sheet-like insulating support substrate (1) on which the resistance element (2) is formed. And the trimming step measures the resistance value of the resistance element (2) by bringing the resistance measurement probe (20) into contact with the conductive pad (3) through the opening (7) to measure the resistance element (2). ) Is adjusted to a target value, and a resistance element mounting sheet manufacturing method is provided.   The method for producing a resistance element mounting sheet according to claim 1, wherein the thickness of the sheet-like insulating support substrate (1) is from 10 micrometers to 500 micrometers.   The manufacturing method of the resistive element mounting sheet according to claim 1 or 2, wherein the sheet-like insulating support substrate (1) is any one of a glass epoxy substrate, a glass polyimide substrate, a polyimide film substrate, and an epoxy film substrate.   From the opposite side of the surface of the sheet-like insulating support substrate (1) on which the resistance element (2) is formed, the resistance measuring probe (20) leads the conductive pad (3) to the sheet-like insulating support substrate (1). Including a step of providing an opening (7), and the trimming step brings the resistance measurement probe (20) into contact with the conductive pad (3) through the opening (7) to thereby determine the resistance value of the resistance element (2). The resistance element mounting sheet manufacturing method according to claim 2 or 3, wherein the resistance value of the resistance element (2) is adjusted to a target value by measurement.   The method of manufacturing a resistance element mounting sheet according to claim 4, wherein the resistance measurement probe (20) is a resistance measurement probe (20) having a sharp tip. Claim 1-5 or resistive element mounting sheet produced by the production method of the resistive element mounting sheet according to. A resistance element mounting sheet (22) according to claim 6 and a manufacturing method of a resistance built-in multilayer wiring board including a lamination step of integrating the inner layer core substrate having a predetermined circuit formed on an insulating layer by a lamination press.

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